JP2013077249A - Ic module of ic card, ic card with ic module, and ic module manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC module capable of surely preventing a detective IC card and preventing outflow of it to a market, an IC card and an IC card manufacturing method.SOLUTION: The IC module of the IC card comprises: a substrate; multiple external terminals C1 to C8 provided on the substrate for contact communication each having a contract area with which a contact of an external terminal device can contact; multiple through-holes 38 formed on the substrate each of which faces a connection part of each external terminal; and a card control IC 32 mounted on the back face of the substrate and connected to each external terminal through each through-hole by a wiring 40. At least one external terminal has a linkage part 46 which electrically links the contact area and the connection part and which can be cut off by forming an open hole and a separation slit 50 extending from an edge of a side of the external terminal to the linkage part between the contact area and the connection part.

Description

  Embodiments described herein relate generally to an IC module of an IC card, an IC card including the IC module, and a method of manufacturing the IC module.

  Generally, what is called an IC card includes a contact IC card specified by ISO / IEC7816, a contactless card (wireless card) specified by ISO / IEC14443, and a dual interface card having both functions.

  For example, a contact IC card is generally formed by embedding an IC module having an IC inside in a card substrate such as polyvinyl chloride (PVC), polyethylene terephthalate (PET), or paper. The IC module has 6 or 8 terminals for communication with the outside, the IC arranged on the back side of the contact terminal and each terminal are electrically connected by a gold wire or the like, and the IC and the gold wire are thermoset. Sealed with resin or the like. The function of each terminal is defined in ISO7816. In general, an IC module is embedded in a card by placing an IC module with an adhesive tape attached in a counterbore hole provided at a predetermined position on a card base and thermocompression bonding. Adhesion with the card substrate is performed.

  When manufacturing the above-described IC module, a reel-shaped substrate with a terminal provided with a plurality of sets of terminals is usually formed, and an IC for an IC card is mounted on the back side of the substrate. Further, the bonding hole electrically connected to the terminal on the back side of the terminal and the IC pad are electrically connected by a method such as wire bonding, and then the IC is sealed with a mold resin or the like. Is done.

  When the IC module in the reel is defective in the manufacturing process, a through hole is provided at a predetermined position of the reel, and this through hole is used for identifying a defective product in a subsequent process. A contact type IC card is formed by individually punching an IC module formed on a reel and bonding the IC module to a recess provided by cutting on a card substrate. At that time, another through hole is detected by a photoelectric sensor or the like, and a measure is taken so that the defective IC module is not embedded in the card substrate. The IC card in which the IC module is embedded is shipped to the market after information is written in the IC module in the card issuing process.

JP 2010-86260 A

  A plurality of IC modules formed side by side on a reel include defective products, and the defective products are provided with through holes at predetermined positions. In the step of embedding the IC module in the card substrate, the defective IC module is not embedded in the card substrate by detecting this through hole with a photoelectric sensor or the like.

  However, there is a case where a defective product is not detected and is erroneously embedded in the card base material due to a sensor setting error or dust attached to the through hole for defect identification. Some of the defective IC modules are due to poor appearance such as scratches and chips, and may operate normally when embedded in the card substrate. In this case, the IC card may flow out to the market through the inspection process. For this reason, it is desirable that the defective IC module does not operate even after it is erroneously embedded in the card substrate.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and the object thereof is to provide an IC module for an IC card that can reliably detect defective products and prevent the outflow of defective products to the market. An object of the present invention is to provide an IC card and an IC module manufacturing method.

According to the embodiment, an IC module of an IC card includes a substrate, a plurality of external terminals for contact communication provided on the substrate, each having a contact area that can be contacted by a contact of an external terminal, and the substrate. A plurality of through-holes that are formed and opposed to the connection portions of the external terminals, and are mounted on the back surface of the substrate and connected to the external terminals through the through-holes by wiring; and
At least one external terminal electrically connects the contact area and the connection part and forms a through-hole so as to be excised between the contact area and the connection part. A separation slit extending from one side edge of the external terminal to the connecting portion.

FIG. 1 is a plan view showing an IC card according to the first embodiment. FIG. 2 is a cross-sectional view of the IC card taken along line AA in FIG. FIG. 3 is a plan view showing an IC module of the IC card. FIG. 4 is a plan view of the IC module shown through the card control IC and the through hole of the IC module. FIG. 5 is a plan view of the IC module showing a contact area that can contact a contact of an external terminal of the IC module. FIG. 6 is a cross-sectional view of the IC module. FIG. 7 is a plan view showing manufacturing steps of the IC module and the IC card. FIG. 8 is a plan view showing a defective IC module in which a disconnection hole is formed. FIG. 9 is a cross-sectional view of the defective IC module. FIG. 10 is a plan view showing an IC module of an IC card according to a second embodiment.

Hereinafter, various embodiments will be described in detail with reference to the drawings.
(First embodiment)
1 to 6 show a contact type IC card according to the first embodiment. The IC card 10 includes a rectangular plate-shaped card base 12 and an IC module 16 embedded in the card base 12.

  As shown in FIGS. 1 and 2, the card substrate 12 includes a plurality of thin plastic sheets made of materials such as polyethylene terephthalate (PET), PET-G, polyvinyl chloride (PVC), and polycarbonate (PC). It is formed by laminating and bonding with a hot press to form a sheet having a thickness (0.76 ± 0.08 mm) defined in ISO / IEC7810, and then punching the sheet into a card shape of a predetermined size. In addition, the card | curd base material 12 may be injection-molded with a synthetic resin using a card-shaped metal mold | die. A transparent overcoat layer may be further laminated on the outermost surface of the card substrate 12.

  The card base 12 is formed with a stepped recess 20 in which the IC module 16 is mounted, and is open to the surface of the card base 12. The recess 20 has a rectangular large-diameter recess 20a and a rectangular small-diameter recess 20b formed deeper than the large-diameter recess 20a at the center of the large-diameter recess. Are formed in a two-step recess.

  FIG. 3 is a plan view showing an external terminal of the IC module, FIG. 4 is a plan view showing an IC module card control IC and a wiring through hole, and FIG. FIG. 6 is a cross-sectional view of the IC module. As shown in FIGS. 3 to 6, the IC module 16 includes a rectangular substrate 30 formed of an insulating material and an external contact communication formed on the upper surface of the substrate 30 and defined by ISO / IEC7816. Terminals C 1, C 2, C 3, C 4, C 5, C 6, C 7, C 8 and a card control IC 32 mounted on the back surface of the substrate 30 are provided.

  The external terminals C1 to C8 are arranged with a gap 31 of about 0.2 mm from each other and are electrically insulated from each other. The external terminals C1 to C8 have outer edges that form a contour, and the external terminals C1 to C8 as a whole have a rectangular contour. In the embodiment, the C1 terminal located at the corner of the rectangle is used as a power source, for example, and the C5 terminal located at the other corner is used as the ground. The C5 terminal has a central extension 36 extending to the central portion of the external terminal group, and the control IC 32 is mounted on the substrate 30 on the back side of the central extension. Different functions are assigned to the other external terminals C2, C3, C6 to C8.

  As shown in FIGS. 4 and 6, the substrate 30 is formed with a plurality of through holes 38, which are located on the outer periphery of the control IC 32, and are respectively the inner end portions of the external terminals C1 to C8 ( It is opposed to the connecting portion), that is, the end portion on the central extension portion 36 side. The plurality of pads of the control IC 32 mounted on the substrate 30 are electrically connected to corresponding external terminal connection portions through the through holes 38 by, for example, bonding wires 40 made of gold wires or the like using wire bonding. ing. In the present embodiment, the external terminals C1, C2, C3, C5, and C7 are electrically connected to the control IC 32, respectively, and the external terminals C4, C6, and C8 are empty.

  The card control IC 32, the through hole 38, and the bonding wire 40 mounted on the back surface of the substrate 30 are covered and sealed with a sealing material 42 such as a thermosetting resin or a mold resin. The outer contour of the sealing material 42 is formed, for example, in a rectangular shape, is located outside the through hole 38, and is widely separated from the outer edges of the external terminals C1 to C8.

  As shown in FIGS. 5 and 6, each of the external terminals C1 to C8 has contact areas D1 to D8 that can contact the contact 44 on the external terminal side when the IC card 10 is mounted on the external terminal. Yes. The positions of these contact areas D1 to D8 are determined as defined areas by ISO / IEC7816.

  As shown in FIGS. 3 to 5, at least one of the external terminals electrically connected to the control IC, here, the external terminal C1 is a connection between the first region R1 including the contact region D1 and the IC 32. Between the first region R1 and the second region R2 between the first region R1 and the second region R2, which is electrically connected to the second region R2 including the portion and can be excised by forming a through hole (disconnection hole) A separation slit 50 extending from one side edge of the terminal C1 to the connecting portion 46. The separation slit 50 extends from the gap 31 beyond the outer contour of the sealing material 42 to the vicinity of the outer edge of the external terminal C1. As a result, the connecting portion 46 remaining at the tip of the separation slit 50 is positioned away from the sealing material 42, and the width W of the connecting portion 46 is smaller than the diameter of a disconnection hole described later, for example, 2 mm. It is formed to the extent.

  As shown in FIGS. 1 and 2, the IC module 16 configured as described above is embedded in the second recess 20 of the card base 12 and is heat-pressed to the card base 12 with an adhesive 51. The large-diameter recess 20a of the second recess 20 is formed in a size and shape corresponding to the substrate 30, and the substrate 30 and external terminals of the IC module 16 are accommodated in the large-diameter recess 20a. As for the board | substrate 30, the peripheral part of a back surface is adhere | attached on the bottom of the large diameter recess 20a with the adhesive agent 51. FIG. The external terminals C1 to C8 of the IC module 16 are disposed substantially flush with the surface of the card base 12 and are exposed to the outside. The small-diameter recess 20b is formed in a size and depth corresponding to the sealing material 42 of the IC module 16, and the sealing portion is accommodated in the small-diameter recess 20b.

A manufacturing process of the IC card 10 and the IC module 16 configured as described above will be described.
As shown in FIG. 7, a reel 60 having a plurality of sets of external terminals arranged side by side and a substrate 30 attached to the back surface is formed. The card control IC 32 is mounted on the substrate 30 on the back side of the external terminal, and is electrically connected through the through-hole 38 to the IC pad and the connection portion of the external terminal by a method such as wire bonding. Next, the IC 32, the through hole 38, and the bonding wire 40 are sealed with a mold resin or the like. As a result, a plurality of IC modules 16 are formed on the reel 60.

  Subsequently, the outer shape of each IC module 16 is inspected, and whether or not the electrical connection is established by applying an inspection pin to the specified contact position of the external terminal is inspected.

  The IC module 16 determined to be a non-defective product by these inspections is punched from the reel 60 and adhered to the recess 20 provided by cutting on the card substrate 12 with an adhesive. Thereby, an IC card is manufactured. The IC card 10 in which the IC module 16 is embedded is shipped to the market after the card inspection process, information is written in the IC module 16 in the card issuing process.

  On the other hand, when the IC module 16a identified as a defective product is generated in the above-described inspection process of the IC module 16, as shown in FIGS. 7, 8, and 9, the first region R1 and the second region of the C1 terminal A through-hole (disconnection hole 52) is formed in the connecting portion 46 on the extension of the separation slit 50 between R2 and the connecting portion 46 is removed. As a result, the first region R1 and the second region R2 of the C1 terminal are disconnected and are not completely electrically connected. For defective products generated in the IC module manufacturing process, the disconnection hole 52 for identification is detected by a photoelectric sensor or the like, and measures are taken so that the defective IC module 16a is not embedded in the card substrate 12.

Also, if the defective IC module 16a is accidentally punched from the reel 60 and embedded in the card substrate 12, the power is not supplied to the IC 32 even if the inspection pin is applied to the specified contact position of the C1 terminal in the card inspection process. Therefore, it can be easily identified as a defective product. Therefore, it is possible to eliminate the defective IC card and prevent it from being accidentally leaked to the market.
As described above, the disconnection hole 52 may be used as a defect identification hole for determination of a non-defective product / defective product, or the disconnection hole and the defect identification hole may be formed separately.

  According to the IC module, the IC card, and the manufacturing method thereof configured as described above, the connection portion and the separation slit that can be removed by the disconnection hole are provided in the external terminal, and when the defective product occurs, the disconnection hole is opened and the connection portion By removing, the contact area of the external terminal and the connection portion can be electrically separated completely. Thereby, in the step of embedding the IC module in the card substrate, even if the detection of the through hole for defect identification is wrong, the IC module embedded in the card substrate is inoperable, so the card inspection step In this way, defective products can be found easily, and the outflow of defective products can be reliably prevented. In addition, since the connecting portion is formed to have a width smaller than the diameter of the disconnection hole and further provided outside the sealing material, the disconnection hole can be easily opened in the IC module when identified as a defective product. In addition, the connecting portion can be reliably cut off and the external terminal can be disconnected.

  In the present embodiment, the C1 terminal is provided with a structure for disconnecting between the contact region and the connection portion. However, the present invention is not limited thereto, and the above-described disconnection structure may be provided for another terminal connected to the control IC. Good.

(Second Embodiment)
Next, an IC card according to the second embodiment will be described. FIG. 10 shows the IC module 16 of the contact IC card 10 according to the second embodiment. According to the present embodiment, the separation slit 50 and the connecting portion 46 are provided at the C5 terminal electrically connected to the card control IC 32.

  The separation slit 50 passes from one side edge of the C5 terminal defined by the gap 31 between the contact area of the C5 terminal and the connecting portion, and further bends substantially at a right angle, and then near the outer edge of the C5 terminal. It extends to. A connecting portion 46 is formed between the extending end of the separation slit 50 and the outer edge of the C5 terminal. The connecting portion 46 is formed to have a width that can be removed by forming the disconnection hole 52.

The separation slit 50 extends to the outside of the sealing material 42 that covers the card control IC 32, the through hole 38, and the bonding wire 40 on the back surface side of the substrate, and the connecting portion 46 is located away from the sealing material 42. ing.
Other configurations of the IC card and the IC module 16 are the same as those of the first embodiment described above, and the same portions are denoted by the same reference numerals and detailed description thereof is omitted.
Also in the second embodiment configured as described above, the same operational effects as those of the first embodiment described above can be obtained.

The present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.
For example, the IC card according to the present invention is not limited to a contact type IC card, but may be applied to a combination card or a hybrid card further having a wireless communication function.

10 ... IC card, 12 ... card substrate, 16 ... IC module, 20 ... recess,
22 ... wiring, 30 ... substrate, 31 ... gap, 32 ... card control IC, 38 ... through hole,
40 ... bonding wire, 42 ... sealing material, 46 ... connecting portion, 50 ... slit for separation,
52 ... Disconnection hole (through hole), C1 to C8 ... External terminal, R1 ... First region, R2 ... Second region

Claims (8)

An IC module of an IC card,
A substrate, a plurality of external terminals for contact communication provided on the substrate, each having a contact area that can be contacted by a contact of an external terminal, and formed on the substrate, each facing a connection portion of the external terminal A plurality of through holes, and a card control IC mounted on the back surface of the substrate and connected to the external terminals through the through holes by wiring;
At least one external terminal electrically connects the contact area and the connection part and forms a through-hole so as to be excised between the contact area and the connection part. A separation slit extending from one side edge of the external terminal to the connecting portion; A sealing material covering the card control IC and wiring on the back side of the substrate;
2. The IC module according to claim 1, wherein the separation slit extends to the outside of the sealing material, and the connecting portion is positioned away from the sealing material.   The IC module according to claim 1, wherein the plurality of external terminals are arranged side by side with a gap therebetween, and the separation slit extends from the gap to the vicinity of an outer edge of the external terminal.   The IC module according to claim 1, wherein the at least one external terminal is a power supply terminal. A card substrate;
An IC module embedded in the card substrate,
The IC module is formed on the substrate, a plurality of external terminals for contact communication provided on the substrate, each having a contact area that can be contacted by a contact of the external terminal, and each of the external terminals. A plurality of through-holes facing the connecting portion; and a card control IC mounted on the back surface of the substrate and connected to the external terminal through the through-hole by wiring,
At least one external terminal electrically connects the contact area and the connection part and forms a through-hole so as to be excised between the contact area and the connection part. An IC card having a separation slit extending from one side edge of the external terminal to the connecting portion. A sealing material covering the card control IC and wiring on the back side of the substrate;
The IC card according to claim 5, wherein the separation slit extends to the outside of the sealing material, and the connecting portion is located away from the sealing material.   The IC card according to claim 6 or 7, wherein the plurality of external terminals are arranged side by side with a gap therebetween, and the separation slit extends from the gap to the vicinity of an outer edge of the external terminal. A substrate, a plurality of external terminals for contact communication formed on the upper surface of the substrate, each having a contact area that can be contacted by a contact of an external terminal, and formed on the substrate, each connected to a connection portion of the external terminal A plurality of opposing through holes, and a card control IC mounted on the back surface of the substrate and connected to the external terminals through the through holes by wiring;
At least one external terminal electrically connects the contact area and the connection part and forms a through-hole so as to be excised between the contact area and the connection part. A separation slit extending from one side edge of the external terminal to the connecting portion, and a method of manufacturing an IC module,
A plurality of the IC modules are formed side by side on a reel,
Inspecting the formed IC module,
Cut out an IC module that has been made a good product by the inspection from the reel,
A method of manufacturing an IC module, wherein a disconnection hole is formed in a connecting portion of an IC module that has been determined to be defective by the inspection, the connecting portion is cut off, and a contact region and a connecting portion of the external terminal are separated.

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