JP2004013648A - Ic card manufacturing method and ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card manufacturing method which assures a connection between an IC module and an antenna coil in a card substrate, and to provide an IC card by the manufacturing method. <P>SOLUTION: The manufacturing method for the IC card which has the antenna coil 3 and an antenna connection terminal plate in the card substrate and which establishes connection between antenna connection terminals 13, 14 of the IC module mounted on the surface of the card and the antenna coil connection terminal plate by cutting a recess for conduction 23, the IC card manufacturing method being characterized in that, when cutting the recess for conduction from the surface side of the card to the antenna coil connection terminal plate, the method controls a coutersinking machine in cutting so that the recess for conduction has a step like contact surface part 23S with respect to the face of the antenna coil connection terminal plate. The recess for conduction may have a recess which is split so that the recess for conduction has two or more inclined face parts. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an IC card manufacturing method and an IC card.
More specifically, in an IC card of a contact-type non-contact type or a non-contact type but having a terminal plate, the connection between the antenna coil connection terminal plate embedded in the card base and the IC module (COT) terminal is ensured. About the technology to do.
Therefore, the field of application of the present invention relates to the field of manufacture and use of IC cards.
[0002]
[Prior art]
IC cards are roughly classified into a contact type in which external terminals are exposed on the card surface, a non-contact type in which an IC chip and a communication antenna coil are embedded in the card base and no external terminals, and the functions of both are the same. There are three types, the combination type or the dual interface type, which is performed by the chip of (1).
[0003]
Among them, the combination type, which is connected to antenna connection terminals (usually at two places) on the back side (opposite to the contact terminal surface) of the IC module, is connected to a predetermined pad of the IC chip by an antenna connection. A terminal is provided, and this is connected to an antenna coil connection terminal plate exposed in a conduction concave portion of the card via a conductive paste or a conductive adhesive sheet or the like, thereby having a function as a non-contact card. Become.
[0004]
By the way, the combination IC module is manufactured as a tape-like module (COT = Chip On Tape) similar to a normal contact type IC card, but an antenna coil connection terminal plate is provided on the back surface of the COT (behind the terminal surface). At least two antenna connection terminals are provided for electrical connection with the antenna.
On the card side, an antenna coil is embedded at a predetermined position. When the COT embedding concave portion is formed on the card, the antenna coil connection terminal plate is also exposed, and when the COT is embedded, the corresponding COT is removed. It must be electrically connected to the antenna connection terminal on the side via a conductive paste or the like.
[0005]
Here, the IC module mounting method (conventional method) of the contact type non-contact type IC card will be described just in case.
FIG. 5 is a diagram showing a conventional example of an IC module mounting method.
In recent years, a generally adopted mounting method is to form a concave portion composed of a first concave portion 21 and a second concave portion 22 in the card base 12 as shown in the cross section of the IC module mounting portion in FIG. The first concave portion 21 receives the contact terminal plate (module substrate) 5 of the IC module 10, and the molded resin portion 15 of the IC module is fitted into the second concave portion 22 which is cut deeper.
[0006]
Further, since it is necessary to connect the antenna coil connection terminal plates 33 and 34 in the card base and the IC module side antenna connection terminals 13 and 14, the conduction concave portions 23 and 24 are set to a depth reaching the antenna coil connection terminal plate. After cutting, the concave portions are filled with a conductive material such as a conductive adhesive sheet or a conductive paste to achieve conduction between the terminals.
The heat-reactive (hot-melt type) adhesive tape 8 is melted between the contact terminal plate 5 of the IC module 10 and the first recess 21 to fix the IC module in the recess.
In FIG. 5, the recesses 23 and 24 for conduction look like a vertical hole, but in reality, they have a depth of about 200 to 500 μm with respect to a circular surface of about φ2 to 3 mm or a rectangular surface of about 2 mm × 3 mm. This is a concave portion close to. Although the mold resin portion 15 is also shown in a hemispherical shape, it is actually a thin plate.
[0007]
[Problems to be solved by the invention]
However, the embedded depth of the antenna coil connection terminal plate varies depending on the variation of individual base materials, hot pressing conditions, and the like. Normally, it is not easy to reliably expose the terminal without digging too much of the antenna coil connection terminal plate having a thickness of about 35 μm to destroy the terminal, and various measures have been required.
[0008]
For example, by measuring the depth of the antenna coil embedded in the card for each production lot in advance by destructive inspection and inputting the coil depth information of the production lot product to the counterbore processing machine, a somewhat accurate Response is possible.
However, even in the same lot, the upper, middle, and lower presses have slightly different thermal conditions, and the same large-format sheets (sheets with multiple cards in the process of manufacturing) also vary within the same lot. It is difficult to accurately determine the antenna coil depth of a production lot card. Therefore, there is a high possibility that a card having a large variation becomes a defective product (poor connection between the COT and the antenna).
[0009]
As a solution to this, for example, there is a method in which a device for detecting a change in resistance value when the end portion of the end mill comes into contact with a coil and stopping the counterboring process in the depth direction upon detecting the change is provided on the device side. If the machine is provided with a function of detecting and feeding back coils, the price of the apparatus must be increased.
Even if the detection is successful, it is difficult to stop the operation of the counterboring machine rapidly due to the inertia of the machine, and to stop immediately, it is necessary to perform the counterboring in the depth direction at a considerably slow speed. . If the counterbore processing speed is extremely reduced, there is also a problem that the production efficiency is reduced.
On the other hand, if such control is not performed, there may be many defective connections between the COT and the antenna coil, which may lead to a decrease in the yield, and the conflict between the production efficiency and the yield must be solved. .
[0010]
In view of the above, the present invention has researched a method of reliably exposing and connecting the antenna coil connection terminal plate to such a card base in which the depth position of the antenna coil varies without requiring any special management or control. Thus, the present invention has been completed.
[0011]
[Means for Solving the Problems]
A first gist of the present invention to solve the above-mentioned problem is to have an antenna coil and an antenna coil connection terminal plate in a card base, and to connect between an antenna connection terminal of an IC module mounted on the card surface and the antenna coil connection terminal plate. In the method of manufacturing an IC card in which the conductive recess is cut and connected, when the conductive recess from the card surface side to the antenna coil connection terminal plate is cut, the conductive recess is stepped with respect to the antenna coil connection terminal plate surface. A method for manufacturing an IC card, characterized in that the counterboring machine is controlled so as to cut so as to have a contact surface portion of a shape.
[0012]
In the above manufacturing method, the IC card is generally a contact-type non-contact type IC card, and one step of the step-like contact surface portion has a step of 10 to 30 μm, and a total of 2 steps. It may be cut so as to have more than one step, if the conductive recess for one antenna coil connection terminal plate is divided and cut so as to provide the stepped contact surface portion in each recess, the antenna and Connection between IC modules can be ensured.
[0013]
A second feature of the present invention is that a card base has an antenna coil and an antenna coil connection terminal plate, and a conductive recess is formed between the antenna connection terminal of the IC module mounted on the card surface and the antenna coil connection terminal plate. An IC card, wherein the contact surface between the conductive paste or conductive sheet in the conductive recess and the antenna coil connection terminal plate has a stepped contact surface portion. is there.
[0014]
In the above-mentioned IC card, the IC card is generally a contact-type non-contact type IC card, and one step of the step-like contact surface portion has a step of 10 to 30 μm, and a total of 2 steps. The antenna and the IC module may be provided with more than one step, if the conductive recess for one antenna coil connection terminal plate is divided and each recess has the step-like contact surface portion. The connection between them can be ensured.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
In the method for manufacturing an IC card or the IC card according to the present invention, the area where the antenna coil connection terminal plate is to be exposed is cut from the surface of the card base as in the prior art, and the recess for conduction is formed in the antenna coil contact terminal. There is a feature that the plate is cut so as to have a stepped contact surface portion with respect to the plate surface. Such cutting can be performed by setting and controlling a predetermined program in the counterbore machine.
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0016]
FIG. 1 is a diagram showing an embodiment of an IC card of the present invention. 1A is a plan view, FIG. 1B is a partial cross-sectional view taken along line AA of FIG. 1A, and FIG. 1C is a partial cross-sectional view taken along line BB of FIG. 1A. ing.
FIG. 2 is a diagram showing another embodiment of the IC card of the present invention. FIG. 2A is a plan view, and FIG. 2B is a partial cross-sectional view taken along line AA of FIG. 2A.
FIG. 3 is a diagram showing a positional relationship between the cut-out conductive recess and the antenna coil connection terminal plate in the embodiment of FIG. 1, and FIG. 4 is similarly a cut-out conductive recess and the antenna coil connection in the embodiment of FIG. 2. The positional relationship with the terminal board is shown.
[0017]
As shown in FIG. 1A, an IC card 1 has a contact-type non-contact type IC module 10 and an antenna coil 3 in a card base 12.
The contact terminal plate 5 on the front side of the IC module 10 has a known terminal pattern, but is not shown in FIG. The contact terminal plate 5 also serves as a module substrate. The contact terminal plate 5 has an IC chip in a mold resin portion 15 on the inner surface side of the card base, and antenna connection terminals 13 and 14 are formed on both ends thereof.
These cannot be observed directly from the card surface, and the illustration shows a see-through state. The same applies to the antenna coil 3 shown by the broken line.
[0018]
Although not shown in FIG. 1A, antenna coil connection terminal plates, which are both ends of the antenna coil 3, are formed in portions of the card body facing the antenna connection terminals 13 and 14. This is usually about 3 mm × 4 mm so as to facilitate connection with the IC module side terminal.
The antenna coil connection terminal plate is not necessarily limited to a metal plate, and is arranged in a state in which a thin wire or a bundle of wires is arranged in a comb tooth shape or a spiral shape, or is folded tightly in a zag shape. An area equivalent to 3 mm × 4 mm may be formed.
[0019]
As shown in FIG. 1B, the cross section of the IC card 1 along the line AA is such that the module substrate 5 is fitted in the first concave portion 21, and the IC card 1 extends from the antenna connection terminal portion of the IC module to the inside of the card base. , The recess 23 for conduction is cut.
A feature of the present invention is that the conductive recess 23 has a stepped contact surface portion 23S with respect to the antenna coil connection terminal plate surface.
Although not shown, when cutting the recess 23 for conduction, the antenna coil connection terminal plate is also cut, so that a stepped contact surface portion is similarly formed.
[0020]
The cross section of the IC card 1 along the line BB is as shown in FIG. 1C, but the stepped contact surface portions 23S, 24S are formed in the conductive recesses 23, 24.
The shape shown in FIG. 1B and the shape shown in FIG. 1C do not always satisfy both of them, but any shape may have the stepped contact surface portions 23S and 24S. .
[0021]
In the case of the other embodiment of FIG. 2, the planar state is the same as that of FIG. 1, but the cross section taken along the line AA is as shown in FIG. In this case, the bottom of the conductive concave portion 23 is formed of a plurality of branched concave portions 231 and 232, and each concave portion has a stepped contact surface portion 231S and 232S.
Although only two divided concave portions are shown for the sake of illustration, several concave portions may be formed. Both the connection terminal plate and the recess for conduction have a small area, and the minimum diameter of the end mill to be cut is also about 0.3 mm. Therefore, it is not a division that can form innumerably branched divided recesses. It is possible.
Such a concave portion can also be arbitrarily cut by controlling the counterbore machine.
[0022]
When the stepped contact surface portion is formed as shown in FIG. 1C, the same applies to the case of FIG. 1B, but the positional relationship with the antenna coil connection terminal plate 33 is as shown in FIG.
3A shows a case where the antenna coil connection terminal plate 33 is at a relatively shallow position from the surface of the card base, and FIG. 3B shows a case where it is at a relatively deep position. Since the conductive concave portion 23 has the step-like contact surface portion 23S, even if the position of the antenna coil connection terminal plate 33 changes up and down, any portion of the terminal plate comes into surface contact with the conductive concave portion 23. If the conductive recess 9 is filled with the conductive material 9 such as a conductive paste, the conduction between the antenna connection terminal 13 of the IC module and the antenna coil connection terminal plate 33 can be reliably obtained.
[0023]
Since the antenna coil connection terminal plate 33 has a thickness of only about 35 μm, if the conduction concave portions 23 and 24 penetrate this, only a small contact area can be obtained. However, in the case of the stepped concave portion, a contact surface can be secured in a plane parallel to the antenna coil connection terminal plate. An area is obtained and conduction is ensured.
On the other hand, as is often the case with the conventional method, when the conduction concave portion 23 completely penetrates the terminal plate, the contact area between the conductive material and the antenna coil connection terminal plate 33 becomes small. No continuity is obtained or an unstable state is likely to occur.
[0024]
FIG. 4 similarly shows the positional relationship between the cut-out conductive recess 23 and the antenna coil connection terminal plate 33 in the embodiment of FIG. In this case, the tips of the recesses are formed as a plurality of divided recesses 231 and 232, but the principle is the same as that of FIG. 3, and the stepped contact surface portions 231S and 232S form a connection terminal plate. A secure connection is ensured.
[0025]
If the step of one step of the conductive recess 23 is too large, the step may penetrate the antenna coil connection terminal plate 33 within one step, and a contact area may not be obtained. On the other hand, if the step of one step is too small, the step cannot be increased in the narrow through-hole, so that there is not much difference from the conventional through-hole.
Therefore, considering the size of the normal antenna coil connection terminal plate 33 (about 3 × 5 mm) and the thickness of the terminal plate (about 35 μm), one step has a step of about 10 to 30 μm, and one step has The width (the width of the step) is preferably about 200 μm to 1 mm. With such steps, two or more steps can be formed in one penetration recess.
The same applies to the case of FIG. 4, but since the step-like contact surface portions 231S and 232S are narrower, the width of the step must be narrow even if the step of one step is about 10 to 30 μm.
[0026]
After the conductive recess is cut in this way, the recess is filled with a conductive material 9 such as a conductive paste or a conductive adhesive tape, and an adhesive tape 8 is provided on at least the surface of the IC module 10 which is in contact with the first recess. Then, the IC module can be fixed by fitting the IC module into the concave portion and applying heat pressure from the contact terminal plate surface with the heater block, and at the same time, complete conduction between the antenna coil terminals. Become something.
[0027]
The manufacture of such an IC card is otherwise the same as the conventional example. As shown in FIG. 5, after preparing an antenna sheet 121 having an antenna coil and an antenna coil connection terminal plate formed thereon, a core sheet 122, The sheets 123 and 124 and the oversheets 125 and 126 are laminated and heated and integrated. When the card base material is not heat-fusible unlike vinyl chloride, an adhesive or an adhesive sheet may be used in combination.
These steps are performed in a multi-faced large format process, and mounting of the IC module is performed after punching into individual card sizes.
Hereinafter, description will be made based on specific examples.
[0028]
【Example】
(Example)
An embodiment of the present invention will be described with reference to FIGS.
<Preparation of IC module for IC card>
A COT (glass epoxy base, 160 μm thick) IC chip on which a contact terminal board is formed and a contact-type non-contact type IC chip is mounted. It was resin molded.
The size of the contact terminal plate 5 is 13.0 mm × 11.8 mm, the size of the molded portion is 8.0 mm × 8.0 mm, and the size of the antenna connection terminals 13 and 14 exposed from the molded portion is 2 mm each. × 3 mm.
A heat-reactive adhesive tape (polyester resin, 50 μm thick) 8 is pressed onto the mold resin portion 15 so that the back surface of the COT (the opposite surface of the terminal substrate) is covered except for the antenna connection terminals 13 and 14. Lamination was performed by applying heat and pressure from a press plate provided with a concave portion corresponding to the mold portion so as not to cover. Press conditions were 130 ° C., 10 kgf / cm ² , and 5 seconds.
During this lamination, the adhesive tape 8 is usually compressed by about 10 μm.
[0029]
<Preparation of IC card base>
As a core sheet 121 of a card base, a base material in which a white hard vinyl chloride sheet having a thickness of 180 μm is laminated with a copper foil having a thickness of 35 μm is used, and the antenna coil 3 and a 3 mm × 4 mm Antenna coil connection terminal plates 33 and 34 were formed.
For this antenna sheet, a white hard vinyl chloride sheet (thickness 180 μm) as a core sheet 122 for thickness adjustment, two printed white hard vinyl chloride sheets 123 and 124 (thickness 180 μm), and a transparent chloride sheet 50 μm thick. After two vinyl sheets 125 and 126 are arranged and temporarily fixed on the upper and lower surfaces of the core sheets 121 and 122, they are fused by applying heat and pressure (150 ° C., 20 kgf / cm ² , 30 minutes). An embedded card base 12 was manufactured.
In this state, the antenna connection terminal plate normally exists within a range of 410 μm to 445 μm from the card surface.
The antenna coil 3 had a line width of 500 μm and was wound almost four times around the outer periphery of the card base.
[0030]
<Installation of IC module>
The concave portion of the IC module mounting portion was formed by the NC cutting of a counterbore machine.
First, the first recess 21 was cut to a depth corresponding to the total thickness of the IC module substrate (contact terminal plate) 5 and the adhesive tape 8. At this stage, the size of the first concave portion 21 was 13.1 mm × 11.9 mm (the radius of curvature of the corner portion was 2.5 mm), and the depth was 200 μm. As described above, it is preferable that the openings be larger by about 0.1 mm than the actual terminal board size.
The size of the second concave portion 22 was 8.2 mm × 8.2 mm, and was set to be 450 μm deeper than the first concave portion.
[0031]
The recesses 23 and 24 for conduction have a rectangular shape of 2 mm × 3 mm, the deepest portion is 260 μm deeper than the first recessed portion, and the shallowest portion is 200 μm deeper than the first recessed portion. And had four steps. The width of one step (the width of the step) was set to about 500 μm.
For this purpose, a cutting program for forming the bottom shape of the conductive concave portion is created in advance, and this program is called and executed as a program, thereby cutting into a predetermined shape.
Although an end mill having a cutting width of 0.5 mm was used, a diameter of about 0.3 to 3 mm can be used depending on the diameter of the conductive recess and the program.
[0032]
A liquid conductive thermosetting resin (“DBC230S” manufactured by Kyushu Matsushita Electric Co., Ltd.) is applied on the antenna coil connection terminal plates 33 and 34 exposed from the conduction concave portions 23 and 24, and the adhesive tape previously prepared The IC module 10 on which the laminate No. 8 was laminated was punched out from the COT and mounted, and the adhesive tape was melted by applying heat and pressure to fix the IC module. Thus, both the bonding of the COT to the IC card and the electrical connection between the COT and the antenna coil in the card base were completed.
When mounting the IC module, the heater block is applied to the surface of the IC module, and the adhesive tape 8 is melted by applying a heat pressure (160 ° C., 5 seconds), and at the same time, the liquid conductive resin is heat-cured to form the inside of the recess. It depends on the method of fixing.
[0033]
In the manufacturing method according to the above embodiment, a connection failure between the antenna terminals was less likely to occur, and a completed IC card did not suffer from an antenna connection failure, and the non-contact communication function had high reliability.
[0034]
As described above, in the manufacturing method of the present invention, the management of the depth arrangement of the antenna coils for each manufacturing lot, the management of the press conditions, the set values (depth, set values, etc.) of the counterbore processing machine, the counterbore processing accuracy No special management or control such as management, antenna coil depth detection, feedback, etc. is required. The card can be exposed, and the card can be manufactured stably without lowering the productivity, increasing the cost, and lowering the yield.
[0035]
Although the embodiment of the present invention has been described above, the present invention is not limited to the contact-type non-contact type IC card, but also applies to a non-contact type IC card having a module substrate and mounted on the card surface. Is also applicable.
[0036]
【The invention's effect】
As described above, in the method of manufacturing an IC card according to the present invention, even if there is some variation in the burying depth of the antenna coil connection terminal plate, or even if the cutting depth of the The antenna connection terminal surface on the chip side can be exposed, and the connection can be secured. Thereby, it is possible to improve the manufacturing yield and reduce the failure rate.
In addition, the IC card manufactured by the manufacturing method is less likely to malfunction because the IC chip side and the antenna coil are securely connected.
[Brief description of the drawings]
FIG. 1 is a diagram showing an embodiment of an IC card of the present invention.
FIG. 2 is a diagram showing another embodiment of the IC card of the present invention.
FIG. 3 is a diagram showing a positional relationship between a cut conductive recess and an antenna coil connection terminal plate in the embodiment of FIG. 1;
FIG. 4 is a diagram showing a positional relationship between a cut conductive recess and an antenna coil connection terminal plate in the embodiment of FIG. 2;
FIG. 5 is a view showing a conventional example of an IC module mounting method.
[Explanation of symbols]
1 IC card 3 antenna coil 5 module board (contact terminal board)
Reference Signs List 8 adhesive tape 9 conductive material 10 IC module 11 IC chip 12 card base 13, 14 antenna connection terminal 15 mold resin part 21 first concave part 22 second concave part 23, 24 conductive concave parts 23S, 24S Step-shaped contact surface part 33 , 34 Antenna coil connection terminal plate

Claims (8)

A method of manufacturing an IC card having an antenna coil and an antenna coil connection terminal plate in a card base, and connecting the antenna connection terminal of the IC module mounted on the card surface and the antenna coil connection terminal plate by cutting a conductive recess. In the above, when cutting the recess for conduction from the card surface side to the antenna coil connection terminal plate, the counterbore machine is controlled so that the conduction recess has a stepped contact surface portion with respect to the antenna coil connection terminal plate surface. And manufacturing the IC card. 2. The method for manufacturing an IC card according to claim 1, wherein the IC card is a contact-type non-contact type IC card. 3. The IC according to claim 1, wherein one step of the stepped contact surface portion has a step of 10 to 30 [mu] m and is cut so as to have two or more steps as a whole. Card manufacturing method. 4. The method of manufacturing an IC card according to claim 1, wherein the conductive recess for the antenna coil connection terminal plate is divided and the stepped contact surface portion is provided in each recess. An IC card having an antenna coil and an antenna coil connection terminal plate in a card base, wherein an antenna connection terminal of an IC module mounted on the card surface and the antenna coil connection terminal plate are connected via a conductive recess, An IC card, wherein a contact surface between a conductive paste or a conductive sheet in a conductive recess and an antenna coil connection terminal plate has a step-like contact surface portion. 6. The IC card according to claim 5, wherein the IC card is a contact-type non-contact type IC card. 7. The IC card according to claim 5, wherein one step of the step-shaped contact surface portion has a step of 10 to 30 [mu] m, and has two or more steps as a whole. 8. The IC card according to claim 5, wherein the conductive recess for the one antenna coil connection terminal plate is divided, and each recess has the stepped contact surface portion.

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