JP4422494B2 - IC card and SIM - Google Patents

IC card and SIM Download PDF

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JP4422494B2
JP4422494B2 JP2004000774A JP2004000774A JP4422494B2 JP 4422494 B2 JP4422494 B2 JP 4422494B2 JP 2004000774 A JP2004000774 A JP 2004000774A JP 2004000774 A JP2004000774 A JP 2004000774A JP 4422494 B2 JP4422494 B2 JP 4422494B2
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card
contact
sim
module
antenna coil
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JP2004355604A (en
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誠一 西川
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Dai Nippon Printing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)

Description

この発明は、接触と非接触の両用の機能を持つＩＣチップが内蔵されたＩＣカード用ＩThe present invention provides an IC card IC in which an IC chip having both a contact function and a non-contact function is incorporated. Ｃモジュールが実装されたＩＣカードおよびＳＩＭに関し，更に詳しくは、多用途に利用Regarding IC card and SIM with C module mounted, more details できる新規な構造ＩＣカード用ＩＣモジュールとそれを使用したＩＣカード、および，該IC module for new structure IC card that can be used, IC card using the same, and ＩＣカードを利用して形成されるＳＩＭに関するものである。The present invention relates to a SIM formed using an IC card.
したがって、本発明の利用分野は、ＩＣカードまたはＳＩＭの製造や利用の分野に関す  Therefore, the field of use of the present invention relates to the field of manufacture and use of IC cards or SIMs. る。The

接触と非接触の両方のインターフェースを持つＩＣカード用ＩＣチップ（以下、「デュアルインターフェースＩＣチップ」、とも表現する。）が登場している。通常、このＩＣチップを使ったＩＣモジュールは非接触用アンテナとの接続をプリント基板裏面のアンテナコイル接続用端子板を介して行っている。
当該接続用端子板とカード基体内のアンテナとが導電性材料によって接続され、カード表面には６個ないし８個のＩＳＯ７８１６接触方式の端子群が設けられていて接触、非接触の両用となるようにされている。IC cards for IC cards (hereinafter also referred to as “dual interface IC chips”) having both contact and non-contact interfaces have appeared. Normally, an IC module using this IC chip is connected to a non-contact antenna via an antenna coil connection terminal plate on the back surface of the printed board.
The connection terminal plate and the antenna in the card base are connected by a conductive material, and six to eight ISO7816 contact type terminal groups are provided on the card surface so that both contact and non-contact can be used. Has been.

かかる接続方法を記載する先行技術には、特許文献１、特許文献２、等の多数があるが、従来技術の具体的内容を，図面を参照して説明することとする。
図８は、従来の接触型ＩＣカードの平面図、図９は、従来の接触、非接触両用ＩＣカードの平面図、図１０は、従来の小型ＩＣカードであるＳＩＭ（ＵＩＭ）を示す図、図１１は、ＩＣモジュールの端子群を表わす平面図、図１２は、従来の接触、非接触両用のＩＣカード用ＩＣモジュールの裏面ボンディング状態を表わす図、図１３は、ＩＣモジュールをカード基体に装着した接触、非接触両用ＩＣカードの断面図、図１４は、ＳＩＭホルダーを示す図、図１５は、従来のＳＩＭ用ＩＣモジュールの背面を示す図、である。There are many prior arts describing such a connection method, such as Patent Document 1 and Patent Document 2, and the specific contents of the prior art will be described with reference to the drawings.
8 is a plan view of a conventional contact IC card, FIG. 9 is a plan view of a conventional contact / non-contact IC card, and FIG. 10 is a diagram showing a SIM (UIM), which is a conventional small IC card, 11 is a plan view showing a terminal group of an IC module, FIG. 12 is a view showing a back surface bonding state of a conventional IC card IC module for both contact and non-contact, and FIG. 13 is an IC module mounted on a card substrate. FIG. 14 is a view showing a SIM holder, and FIG. 15 is a view showing the back of a conventional SIM IC module.

従来の接触型ＩＣカード１１は、図８のように均一な薄板状のカード基体１１ｂに接触型ＩＣカード用ＩＣモジュール１４を埋設した周知の形態のものである。ＩＳＯの規格に基づき、カード基板のサイズは、５３．９８×８５．６０ｍｍ、厚みは、１．０ｍｍ以下、通常０．７６ｍｍにされている。
接触、非接触両用ＩＣカード１２も同一形状の基体であって、図９のように、カード基体１２ｂ内にアンテナコイル２１を有している。アンテナコイル２１は破線で示しているが、実際にはカード基体内に埋設されているので外観上は、接触型ＩＣカード１１と異なるものではない。
アンテナコイル２１の両端は、接触、非接触両用ＩＣカード用ＩＣモジュール１５のアンテナコイル接続用端子板に接続するようにされている。A conventional contact IC card 11 is of a known form in which a contact IC card IC module 14 is embedded in a uniform thin plate-like card base 11b as shown in FIG. Based on the ISO standard, the size of the card substrate is 53.98 × 85.60 mm, and the thickness is 1.0 mm or less, usually 0.76 mm.
The contact and non-contact IC card 12 is also a base having the same shape, and has an antenna coil 21 in the card base 12b as shown in FIG. Although the antenna coil 21 is indicated by a broken line, it is not different from the contact IC card 11 in appearance because it is actually embedded in the card base.
Both ends of the antenna coil 21 are connected to the antenna coil connection terminal plate of the IC module 15 for both contact and non-contact IC cards.

従来のＳＩＭ（ＵＩＭ）１３は、図１０の形態のものである。
サイズは、１５．０ｍｍ×２５．０ｍｍの薄板状のものであり、基板１３ｂの厚みは接触型ＩＣカード１１と同一にされている。切り欠き部２３を有するのは装着時の表裏間違いを無くすためである。
なお、ＵＩＭ（Ｕｓｅｒ Ｉｄｅｎｔｉｔｙ Ｍｏｄｕｌｅ）とは、携帯電話会社が発行する契約者情報を記録した小型のＩＣカードであって、携帯電話機に組み込んで利用者の識別に使用するセキュリティーＩＤモジュールのことをいう。
これは同様な機能を持つＳＩＭ（Ｓｕｂｓｃｒｉｂｅｒ Ｉｄｅｎｔｉｔｙ Ｍｏｄｕｌｅ）から機能拡張が行われたもので契約者情報以外に電話帳などのプライベート情報やクレジット決済用の個人識別情報などを暗号化して登録することが可能となっている。A conventional SIM (UIM) 13 has the form shown in FIG.
The size is a thin plate of 15.0 mm × 25.0 mm, and the thickness of the substrate 13 b is the same as that of the contact type IC card 11. The reason why the notch portion 23 is provided is to eliminate a front and back mistake at the time of mounting.
UIM (User Identity Module) is a small IC card that records contractor information issued by a mobile phone company and refers to a security ID module that is incorporated into a mobile phone and used for user identification. .
This is an extension of functionality from a SIM (Subscriber Identity Module) that has the same function. In addition to subscriber information, private information such as a telephone directory and personal identification information for credit settlement can be encrypted and registered. It is possible.

ＳＩＭをベースにしていることからＵＳＩＭ（Ｕｎｉｖｅｒｓａｌ ＳＩＭ）と呼ばれることもある。ＳＩＭはＧＳＭ携帯電話サービスの利用を目的とするが、ＵＩＭは、例えば、アメリカのｃｄｍａ２０００携帯電話機に差し込んで国際ローミングサービスを受けるといった使用方法がなされている。
本願明細書では、以降および特許請求の範囲において、ＳＩＭとは、ＵＩＭあるいはＵＳＩＭを含めた小型のＩＣカードを総称して表現するものとする。Since it is based on SIM, it is sometimes called USIM (Universal SIM). The SIM is intended to use the GSM mobile phone service, but the UIM is used, for example, by inserting it into an American cdma2000 mobile phone and receiving an international roaming service.
In the present specification, in the following and claims, SIM is a general term for small IC cards including UIM or USIM.

ＳＩＭやＵＩＭの基体内にアンテナコイルを設けることもできるが、通常は携帯電話機に差し込んで使用することから、携帯電話機の筐体に設けたアンテナに接続したり、アダプタアンテナを利用することが多く、小サイズのＳＩＭやＵＩＭ自体にアンテナを設けることは少ない。  Although an antenna coil can be provided in the base of the SIM or UIM, since it is usually used by being inserted into a mobile phone, it is often connected to an antenna provided in the case of the mobile phone or using an adapter antenna. It is rare to provide an antenna in a small-size SIM or UIM itself.

従来の接触型ＩＣカード用ＩＣモジュール１４の端子群は、図１１のように、ＩＳＯ７８１６の規格によりＣ１〜Ｃ８の８つの端子が規定されている。
Ｃ１はＶＣＣ（供給電圧）、Ｃ２はＲＳＴ（リセット信号）、Ｃ３はＣＬＫ（クロック信号）、Ｃ５はＧＮＤ（接地）端子で、通常、ＩＣモジュール１４の端子板中心部分と電気的につながって形成されている。Ｃ６はＶＰＰ（可変供給電圧；プログラム供給電圧など）、Ｃ７はＩ／Ｏ（データ入出力）である。
Ｃ４とＣ８は、ＲＦＵ（予備端子）であって現在は使用していない。As shown in FIG. 11, the terminal group of the conventional contact IC card IC module 14 has eight terminals C1 to C8 defined by the ISO 7816 standard.
C1 is VCC (supply voltage), C2 is RST (reset signal), C3 is CLK (clock signal), and C5 is a GND (ground) terminal, which is usually electrically connected to the central part of the terminal plate of the IC module 14. Has been. C6 is VPP (variable supply voltage; program supply voltage, etc.), and C7 is I / O (data input / output).
C4 and C8 are RFUs (reserved terminals) and are not currently used.

従来の接触、非接触両用ＩＣカード用ＩＣモジュール１５の裏面のボンディング状態は図１２のようになっている。Ｃ１，Ｃ２，Ｃ３，Ｃ５，Ｃ７端子板背面の絶縁基板には、ワイヤボンディング基板側パッド２６が形成されていて、当該パッドを介して、それぞれＩＣチップ３側の接続端子（パッド）にボンディングワイヤ２７で接続されている。Ｃ４，Ｃ８端子板は予備端子なので基板側パッドは設けられていない。Ｃ６のＶＰＰも使用しない場合が多い。
Ｃ２，Ｃ３端子とＣ６，Ｃ７端子の背面を利用してアンテナコイル接続用端子板２４，２５が設けられ、Ｃ４，Ｃ８端子の背面を通る回路を介して、ＩＣチップ３の非接触インターフェース部Ａ１，Ａ２にボンディングされている。
ＩＣモジュールのＩＣチップ３やボンディングワイヤ２７部分は樹脂モールドされて実装されている。The bonding state on the back surface of the conventional IC module 15 for both contact and non-contact IC cards is as shown in FIG. A wire bonding substrate side pad 26 is formed on the insulating substrate on the back surface of the C1, C2, C3, C5, C7 terminal plate, and bonding wires are respectively connected to connection terminals (pads) on the IC chip 3 side through the pads. 27. Since the C4 and C8 terminal boards are spare terminals, no board-side pads are provided. C6 VPP is often not used.
The antenna coil connection terminal plates 24 and 25 are provided by using the back surfaces of the C2, C3 terminals and the C6, C7 terminals, and the non-contact interface portion A1 of the IC chip 3 through a circuit passing through the back surfaces of the C4, C8 terminals. , A2 are bonded.
The IC chip 3 and the bonding wire 27 portion of the IC module are resin-molded and mounted.

図１３は、ＩＣモジュール１５をカード基体１２ｂに装着した接触、非接触両用ＩＣカードの断面図である。アンテナコイル接続用端子板２４，２５を横切りボンディングワイヤ２７に沿う断面が示されている。
ＩＣモジュール１５は、プリント基板８のカード表面側に接触端子群を有しカード内面側にＩＣチップ３とワイヤボンディング部を有している。
ＩＣモジュールの装着は、まず予めアンテナコイル２１が形成され埋設されているカード基体１２ｂの当該カード基体表面からアンテナコイル両端の接続端子面が現われるようにＩＣモジュール装着用凹部５を掘削する。
次に、装着用凹部５内にＩＣモジュール１５を装填して、接続端子面とＩＣモジュール１５側のアンテナコイル接続用端子板２４，２５間を導電性接着剤６で導通させる。同時に、当該導電性接着剤、あるいは通常の接着剤も併用してＩＣモジュールを装着用凹部５内に固定する。ＩＣモジュール１５の樹脂モールド部７は、一段と深く切削された装着用凹部５の中央部分に嵌合するようにされている。FIG. 13 is a cross-sectional view of a contact / non-contact IC card in which the IC module 15 is mounted on the card base 12b. A cross section along the bonding wire 27 is shown across the antenna coil connection terminal plates 24 and 25.
The IC module 15 has a contact terminal group on the card surface side of the printed circuit board 8 and the IC chip 3 and a wire bonding part on the card inner surface side.
For mounting the IC module, first, the IC module mounting recess 5 is excavated so that the connection terminal surfaces at both ends of the antenna coil appear from the surface of the card base 12b in which the antenna coil 21 is previously formed and embedded.
Next, the IC module 15 is loaded into the mounting recess 5, and the conductive adhesive 6 is used to connect the connection terminal surface and the antenna coil connection terminal plates 24, 25 on the IC module 15 side. At the same time, the IC module is fixed in the mounting recess 5 by using the conductive adhesive or a normal adhesive in combination. The resin mold portion 7 of the IC module 15 is adapted to fit into the central portion of the mounting recess 5 that has been cut deeper.

ところで最近、デュアルインターフェースＩＣチップ搭載のＩＣモジュールをカードではなく、ＧＳＭ／３ＧＰＰ規格のＳＩＭに搭載して使用することが提唱されている（特許文献３、特許文献４、等）。
この場合、ＳＩＭの基体にはアンテナを設けなくても、ＳＩＭを装着するアダプタやＳＩＭホルダー等の機器にアンテナコイルを設けて利用することができる。
そしてこの場合、さらにＣ４，Ｃ８の予備端子をアンテナと接続するための端子として、ＩＣチップ３の非接触インターフェース部とがワイヤボンディングされている。Recently, it has been proposed to use an IC module with a dual interface IC chip mounted on a GSM / 3GPP standard SIM instead of a card (Patent Document 3, Patent Document 4, etc.).
In this case, an antenna coil can be provided in a device such as an adapter or SIM holder to which the SIM is mounted without using an antenna on the SIM base.
In this case, the non-contact interface portion of the IC chip 3 is wire-bonded as the terminals for connecting the spare terminals C4 and C8 to the antenna.

図１４は、ＳＩＭホルダーを示す図、図１５は、従来のＳＩＭ用ＩＣモジュールの背面を示す図である。いずれも特許文献３等に提案されているものである。
図１４の場合、ＳＩＭ２は、ＳＩＭホルダー３１の挿入口３５から挿入されて端子板３２の下側に入って固定される。ＳＩＭホルダー３１内にはアンテナコイル３１ａが形成されていて、その両端部が端子板３２の裏面に突出しているコンタクトピン（不図示）を介してＳＩＭ２のＩＣモジュール１５のＣ４，Ｃ８端子に接続するようにされている。
これにより、ＳＩＭ２がアンテナコイル３１ａに接続するので、ＳＩＭ２自体がアンテナコイルを持たない場合でも非接触通信が可能となる。
ＳＩＭホルダー３１は、上蓋部３８と下側ケース部３９等から形成され、ケーシングの内面等にアンテナコイル３１ａが形成されているものである。FIG. 14 is a view showing a SIM holder, and FIG. 15 is a view showing the back of a conventional SIM IC module. Both are proposed in Patent Document 3 and the like.
In the case of FIG. 14, the SIM 2 is inserted from the insertion port 35 of the SIM holder 31 and is fixed under the terminal board 32. An antenna coil 31a is formed in the SIM holder 31 and both ends thereof are connected to the C4 and C8 terminals of the IC module 15 of the SIM2 via contact pins (not shown) protruding from the back surface of the terminal plate 32. Has been.
Thereby, since the SIM 2 is connected to the antenna coil 31a, non-contact communication is possible even when the SIM 2 itself does not have an antenna coil.
The SIM holder 31 is formed of an upper lid portion 38, a lower case portion 39, and the like, and an antenna coil 31a is formed on the inner surface of the casing.

上記用途の場合、ＳＩＭ用ＩＣモジュール１５の背面は、図１５のように結線される。すなわち、ＩＣモジュール１５のＣ８とＣ４端子は、その背面側においてＩＣチップ３の非接触通信機能部Ａ１，Ａ２にそれぞれ結線されている。
これにより、非接触通信機能部Ａ１，Ａ２がＳＩＭホルダーの端子板３２を介してアンテナコイル３１ａに接続し、ＳＩＭ２と外部機器との非接触通信が可能となる。In the case of the above application, the back surface of the SIM IC module 15 is connected as shown in FIG. That is, the C8 and C4 terminals of the IC module 15 are respectively connected to the non-contact communication function units A1 and A2 of the IC chip 3 on the back side.
Thereby, non-contact communication function part A1, A2 connects to the antenna coil 31a via the terminal board 32 of a SIM holder, and non-contact communication with SIM2 and an external apparatus is attained.

特開平９−１２３６５４号公報JP-A-9-123654 特開平１１−３２８３５５号公報JP 11-328355 A 特願２００２−２４４６１３号Japanese Patent Application No. 2002-244613 特願２００２−３０００７２号Japanese Patent Application No. 2002-300072

上記のように、ＳＩＭ用の接触、非接触両用のＩＣモジュールは、Ｃ４，Ｃ８端子がＩＣチップの非接触インターフェース部に接続しているので、端子板を介してＳＩＭ（ＵＩＭ）ホルダー等のアンテナに接続するためには便利である。
しかし、カード基体内にアンテナコイルが有る場合に、これと接続するには、アンテナコイル接続用端子板を有しないので使用し難い問題がある。
一方、図１２図示のような従来型の接触、非接触両用ＩＣカード用ＩＣモジュール１５では、ＳＩＭホルダーのアンテナとの接続ができない問題がある。
そこで本発明の課題は、これら両用に使用できる接触、非接触両用ＩＣカード用ＩＣモ ジュールの構造を研究して本発明の完成に至ったもので，ＳＩＭ化するための仕上げ加工 がされたＩＣカードであって，ＳＩＭを折り取りする前の状態では、通常の接触・非接触 両用ＩＣカードとして使用でき、ＳＩＭとして利用される箇所を折り取りすれば、単体で は非接触動作しないＳＩＭを形成することのできるＩＣカード及び該ＩＣカードから形成 されるＳＩＭを提供することにある。 As described above, the contact and non-contact IC module for SIM has C4 and C8 terminals connected to the non-contact interface portion of the IC chip, so that an antenna such as a SIM (UIM) holder is provided via the terminal plate. It is convenient to connect to.
However, when there is an antenna coil in the card base, there is a problem that it is difficult to use because there is no antenna coil connection terminal plate to connect to the antenna coil.
On the other hand, the conventional contact / non-contact IC card IC module 15 shown in FIG. 12 has a problem that it cannot be connected to the antenna of the SIM holder.
IC Therefore object of the present invention, the contact that can be used for these dual, studying the structure of the IC module for non-contact dual IC card which was led to completion of the present invention, which is the finishing to SIM of In the state before the SIM is folded, it can be used as a normal contact / non-contact IC card, and if a portion used as a SIM is folded, a SIM that does not operate in a non-contact manner is formed. An IC card that can be used and a SIM formed from the IC card .

上記課題を解決するための本発明の要旨の第１は、基板の一方側面には、接触、非接触 の両方のインターフェースを持つＩＣチップを有し、前記基板の他方側面には、ＩＳＯ７ ８１６が規定する８つの接触端子群を有し，前記ＩＣチップの接触交信に用いる各接続端 子と該接続端子に対応する前記接触端子群の各端子板裏面間が、前記基板の絶縁層に形成 された穴部を通じてワイヤ接続され、ＩＣカード基体内のアンテナコイルと接続するため に前記ＩＣチップの両側に対向して設けられた２つの接続用端子板が，ＩＳＯ７８１６の Ｃ４，Ｃ８端子板裏面間と前記穴部を通じてワイヤ接続され，前記ＩＣチップの非接触交 信に用いる各接続端子が，前記Ｃ４，Ｃ８端子板裏面間と前記穴部を通じてワイヤ接続さ れるか、或いは、前記接続用端子板とワイヤ接続されているＩＣカード用ＩＣモジュール が，前記アンテナコイルが形成された前記ＩＣカード基体に埋設用凹部を掘削して露出さ せた前記アンテナコイルの両端部と，前記ＩＣカード用ＩＣモジュールの前記接続用端子 板が電気的に導通するようにして、前記埋設用凹部内に装着されたＩＣカードにおいて， 前記ＩＣカード基体と連結させる複数のブリッジの部分を残した状態で，前記前記埋設用 凹部を含むようにＳＩＭの外形形状を形成する周縁スリットが設けられ，前記ブリッジの 部分には，前記アンテナコイルを切断しない深さのハーフカット線が設けていることを特 徴とするＩＣカード，にある。 The first of the gist of the present invention for solving the above problems is that an IC chip having both contact and non-contact interfaces is provided on one side surface of the substrate, and ISO7 816 is provided on the other side surface of the substrate. has eight contact terminals defining, between said contact each terminal plate back surface of the terminal groups corresponding to the respective connection pin and said connecting terminal to be used for contact communication with the IC chip is formed on the insulating layer of the substrate Two connection terminal boards, which are wire-connected through the holes and provided opposite to both sides of the IC chip for connection with the antenna coil in the IC card base, are connected between the back surfaces of the C4 and C8 terminal boards of ISO7816. is wired through the hole, or the respective connecting terminals used in the non-contact exchange signal of the IC chip is wired through the hole and between the C4, C8 terminal plate rear surface, or end for the connection An IC module for an IC card, which is wire-connected to a daughter board, has both ends of the antenna coil exposed by excavating a recess for embedding in the IC card substrate on which the antenna coil is formed, and the IC card In the IC card mounted in the embedding recess so that the connection terminal plate of the IC module is electrically conductive, with a plurality of bridge portions to be connected to the IC card base being left, said peripheral slit to form the SIM external shape to include embedding recess is provided in a portion of the bridge, and feature that half-cut line of depth not cutting the antenna coil is provided IC card.

更に，第２の発明は，第１の発明に記載のＩＣカードのＩＣカード基体から，アンテナFurther, the second invention provides an antenna from the IC card base of the IC card according to the first invention. コイルを切断しない深さのハーフカット線が設けられたブリッジの部分を折り取ることでBy breaking the bridge part where the half-cut line is not deep enough to cut the coil 形成されるＳＩＭ，にある。In the SIM to be formed.

本発明のＩＣカードによれば、前記ＩＣカードから形成されるＳＩＭ基体内にアンテナAccording to the IC card of the present invention, the antenna is provided in the SIM base formed from the IC card. コイルを持たない場合であっても，接触・非接触通信機能を利用した検査や発行が行え，Even if you do not have a coil, you can perform inspection and issuance using contact / contactless communication functions, 前記ＩＣカードからＳＩＭを切り取りする際は，ハーフカット線を折ると同時にアンテナWhen cutting the SIM from the IC card, the antenna is broken at the same time as the half-cut line is broken. コイルの接続部を切断することになるから、ＳＩＭ自体は、アンテナコイルを持たないこSince the coil connection is cut off, the SIM itself does not have an antenna coil. とになるが、アンテナコイルを有するＳＩＭホルダーに装着して使用すれば、Ｃ４，Ｃ８However, if it is attached to a SIM holder having an antenna coil, it will be C4, C8. 端子を介して、非接触通信をすることができるようになる。Non-contact communication can be performed through the terminal.

以下、本発明で利用されるＩＣカード用ＩＣモジュール、ＩＣカード、ＳＩＭについて図面を参照して説明する。
図１は、ＩＣカード用ＩＣモジュールの第１実施形態を示す背面図である。
図２は、同非接触インターフェース部の接続状態を示す断面図である。
図３は、ＩＣカード用ＩＣモジュールの第２実施形態を示す背面図である。
図４は、同非接触インターフェース部の接続状態を示す断面図である。
図５は、ＩＣモジュールをカード基体に装着する工程を示す図である。
図６は、ＩＣカード基体からＳＩＭを形成する工程を示す図である。
図７は、アンテナコイルを有するＳＩＭを示す図である。The IC card IC module, IC card, and SIM used in the present invention will be described below with reference to the drawings.
FIG. 1 is a rear view showing a first embodiment of an IC card IC module.
FIG. 2 is a cross-sectional view showing a connection state of the non-contact interface unit.
FIG. 3 is a rear view showing a second embodiment of the IC module for IC card.
FIG. 4 is a cross-sectional view showing a connection state of the non-contact interface unit.
FIG. 5 is a diagram showing a process of mounting the IC module on the card base.
FIG. 6 is a diagram illustrating a process of forming a SIM from an IC card substrate.
FIG. 7 shows a SIM having an antenna coil.

まず、本発明で利用されるＩＣカード用ＩＣモジュールから説明する。 First, the IC card IC module used in the present invention will be described.

本発明で利用されるＩＣカード用ＩＣモジュール４の第１実施形態は、図１、図２のように、Ｃ４，Ｃ８端子の背面にはプリント基板８の絶縁性基材に穴を穿って、ワイヤボンディング基板側パッド（穴部）２６ａ，２６ｂが形成されている。
２つのアンテナコイル接続用端子板２４，２５が、ＩＣチップ３の両側に対向して設けられている。そして、パッド２６ａとアンテナコイル接続用端子板２４との間がワイヤボンディングにより結線され、さらにＩＣチップ３のＡ２パッド（非接触交信に用いる接続端子）にワイヤボンディングされている。一方、パッド２６ｂとアンテナコイル接続用端子板２５との間がワイヤボンディングにより結線され、さらにＩＣチップ３のＡ１パッド（非接触交信に用いる接続端子）にワイヤボンディングされている。In the first embodiment of the IC card IC module 4 used in the present invention , as shown in FIGS. 1 and 2, the back surface of the C4 and C8 terminals has holes in the insulating base material of the printed circuit board 8, Wire bonding substrate side pads (holes) 26a and 26b are formed.
Two antenna coil connection terminal plates 24 and 25 are provided opposite to both sides of the IC chip 3. The pad 26a and the antenna coil connection terminal plate 24 are connected by wire bonding, and are further wire-bonded to the A2 pad (connection terminal used for non-contact communication) of the IC chip 3. On the other hand, the pad 26b and the antenna coil connection terminal plate 25 are connected by wire bonding, and are further wire-bonded to the A1 pad (connection terminal used for non-contact communication) of the IC chip 3.

第２実施形態でも同様であるが、図３、図４のように、Ｃ４，Ｃ８端子の背面にワイヤボンディング基板側パッド（穴部）２６ａ，２６ｂが形成されている。そして、パッド２６ａとアンテナコイル接続用端子板２４との間がワイヤボンディングにより結線され、さらにＩＣチップ３のＡ２パッドとアンテナコイル接続用端子板２４との間がワイヤボンディングされている。一方、パッド２６ｂとアンテナコイル接続用端子板２５との間がワイヤボンディングにより結線され、さらにＩＣチップ３のＡ１パッドとアンテナコイル接続用端子板２５との間がワイヤボンディングされている。
第１実施形態も第２実施形態もワイヤボンディング部やパッド部、ＩＣチップ３は結線後に樹脂モールドされる。 As in the second embodiment, as shown in FIGS. 3 and 4, wire bonding substrate side pads (holes) 26a and 26b are formed on the back surface of the C4 and C8 terminals. The pad 26a and the antenna coil connection terminal plate 24 are connected by wire bonding, and the A2 pad of the IC chip 3 and the antenna coil connection terminal plate 24 are wire bonded. On the other hand, the pad 26b and the antenna coil connection terminal plate 25 are connected by wire bonding, and the A1 pad of the IC chip 3 and the antenna coil connection terminal plate 25 are wire bonded.
In both the first embodiment and the second embodiment, the wire bonding portion, the pad portion, and the IC chip 3 are resin-molded after connection.

このように本発明で利用されるＩＣカード用ＩＣモジュール４は、アンテナコイル接続用端子板２４，２５を有するので、ＩＣカード基体内のアンテナコイルと直接的に接続させることができる。この場合は、接触、非接触両用のＩＣカードとしての使用が可能である。
一方、ＳＩＭ用として携帯電話機やＳＩＭ（ＵＩＭ）ホルダー等のアンテナを使用する場合は、ＳＩＭ自体にアンテナコイルを持たない場合であっても、Ｃ４とＣ８の接触端子板を介してＩＣチップの非接触インターフェース部に接続することができる。
すなわち、デュアルインターフェースＩＣチップをモジュール化した際に一つの形態で多面的に利用できる利点がある。Since the IC card IC module 4 used in the present invention has the antenna coil connection terminal plates 24 and 25 as described above, it can be directly connected to the antenna coil in the IC card substrate. In this case, it can be used as an IC card for both contact and non-contact use.
On the other hand, when an antenna such as a mobile phone or a SIM (UIM) holder is used for the SIM, even if the SIM itself does not have an antenna coil, the IC chip is not connected via the C4 and C8 contact terminal plates. It can be connected to the contact interface section.
In other words, there is an advantage that when the dual interface IC chip is modularized, it can be used in one form.

このようなＩＣモジュールの製造は、まずＩＣモジュール用プリント基板８の準備から行う。これには、基板８の絶縁性基材の基板側パッド２６の各位置に、予め貫通孔（穴部）を形成したものを用いて製造する。絶縁性基材としては、例えば、厚さ７５〜１００μｍ程度のガラスエポキシフィルム、ポリエステルフィルム、ポリイミドフィルム、ビスマレイド−トリアジン樹脂フィルムなどのフィルムと熱硬化性接着シートを接着したものを用いる。  Such an IC module is manufactured by preparing the IC module printed board 8 first. For this purpose, the substrate 8 is manufactured by using through holes (holes) formed in advance at each position of the substrate-side pad 26 of the insulating base material of the substrate 8. As the insulating substrate, for example, a glass epoxy film, a polyester film, a polyimide film, a bismaleide-triazine resin film or the like having a thickness of about 75 to 100 μm and a thermosetting adhesive sheet are used.

所定の位置に貫通孔（穴部）を形成した後、絶縁性基材の両面に銅箔をヒートプレスにより接着して一体化する。これを、通常のフォトエッチング法により表面側端子群（Ｃ１〜Ｃ８）や背面側のアンテナコイル接続用端子板２４，２５を形成することによりパターニングを行う。なお、銅箔層は１８〜３０μｍ程度の厚みにする。
レジスト剥離後、残存する銅箔層を電極として、表面側端子群と背面のアンテナコイル接続用端子板２４，２５に対してニッケルメッキ及び金めっき処理を行う。After a through hole (hole) is formed at a predetermined position, a copper foil is bonded and integrated on both surfaces of the insulating base material by heat press. This is patterned by forming the front side terminal groups (C1 to C8) and the rear side antenna coil connection terminal plates 24 and 25 by a normal photoetching method. The copper foil layer has a thickness of about 18 to 30 μm.
After stripping the resist, nickel plating and gold plating are performed on the front-side terminal group and the rear antenna coil connection terminal plates 24 and 25 using the remaining copper foil layer as an electrode.

デュアルインターフェースＩＣチップ３をエポキシダイ接着剤によりプリント基板８にダイボンディングし、ＩＣチップ３の各接続端子（パッド）と基板側の各パッド（穴部）２６間のワイヤボンディングを行う。
最後に、ＩＣチップ３、ボンディングワイヤ２７部分をトランスファーモールディング法、キャスティング法等により樹脂モールドし、更に必要に応じて裏面側を研磨して厚みを整えて、ＩＣカード用ＩＣモジュール４が完成する。
以上の製造方法に関連する内容は、特許公報第２９０４７８５号にも記載されているところである。The dual interface IC chip 3 is die-bonded to the printed board 8 with an epoxy die adhesive, and wire bonding is performed between each connection terminal (pad) of the IC chip 3 and each pad (hole) 26 on the board side.
Finally, the IC chip 3 and the bonding wire 27 are resin-molded by a transfer molding method, a casting method, or the like, and the back side is polished and the thickness is adjusted as necessary to complete the IC module 4 for the IC card.
The contents related to the above manufacturing method are also described in Japanese Patent Publication No. 2904785.

なお、上記の各実施形態において、各端子に設けたワイヤボンディング基板側パッド（穴部）に代えて、スルーホールで接続することも可能である。ただし、この場合は以下のような問題が生じる。
（１）製造工程が煩雑化し、更に製造コストも増大化する。
（２）スルーホールを有しているので、封止樹脂を充填する際に樹脂が端子面側にしみだし、導通不良を起こし易くなり、歩留りならびに信頼性が低下する。In each of the above embodiments, instead of the wire bonding substrate side pads (holes) provided in each terminal, it is possible to connect through through holes. However, in this case, the following problems occur.
(1) The manufacturing process becomes complicated and the manufacturing cost also increases.
(2) Since the through hole is provided, when the sealing resin is filled, the resin oozes out to the terminal surface side, and it becomes easy to cause a conduction failure, and the yield and reliability are lowered.

次に、本発明のＩＣカードおよびＳＩＭの製造について、図５を参照して説明する。
ＩＣカードの製造は、まず、アンテナシート１０ａの製造を行う。この工程は１のコアシート１０ａの表面にアンテナコイル２１とアンテナコイル接続端部を形成する工程である。通常は、アルミ、銅等の金属箔をラミネートしたコアシートにレジスト膜を形成して必要なパターンをフォトエッチングで形成することが多いが、導電性インキによりプリント配線したり、被覆銅線の被膜を溶解しながら銅線をカード基体に固定する方法であってもよい。Next, the manufacture of the IC card and SIM of the present invention will be described with reference to FIG.
In manufacturing the IC card, first, the antenna sheet 10a is manufactured. This step is a step of forming the antenna coil 21 and the antenna coil connection end portion on the surface of one core sheet 10a. Usually, a resist film is formed on a core sheet laminated with a metal foil such as aluminum or copper, and the required pattern is often formed by photoetching. However, printed wiring with conductive ink or coating of coated copper wire The method of fixing a copper wire to a card | curd base | substrate may be sufficient, melt | dissolving.

次に、ＩＣモジュール搭載前のカード基体１０を製造する。この工程は、アンテナシート１０ａと他のコアシート１０ｂ、およびオーバーシート１０ｃ，１０ｄを積層してから（図５（Ａ））、プレス機に導入し、熱圧をかけて基材を融着または接着して一体化する（図５（Ｂ））。その後、カードサイズへの打ち抜きを行う（図５（Ｃ））。  Next, the card base 10 before the IC module is mounted is manufactured. In this step, the antenna sheet 10a, the other core sheet 10b, and the oversheets 10c and 10d are laminated (FIG. 5A), and then introduced into a press machine to apply heat pressure to fuse the base material. Bond and integrate (FIG. 5B). Thereafter, punching to a card size is performed (FIG. 5C).

次いで、ザグリ機を用いてＩＣモジュール装着用凹部５の掘削を行う。装着用凹部５は、図５（Ｃ）のように、ＩＣモジュール４のプリント基板８部分を懸架する大きさと深さの第１凹部５１と、ＩＣモジュールの樹脂モールド部７を埋設する大きさと深さの第２凹部５２に形成する。第１凹部５１切削の際、アンテナコイル２１の接続端部２１１，２１２を露出させる掘削を同時に行う。
ただし、後述の実施例のように、接続端部２１１，２１２を第１凹部面よりは深い位置とし、第１凹部面からアンテナコイル接続端部に達する小径の導通用凹部を掘削する場合もある。この場合には、アンテナシート１０ａのアンテナコイル２１は、コアシート１０ｂ側に面するように配置してもよい。Next, the IC module mounting recess 5 is excavated using a counterbore machine. As shown in FIG. 5C, the mounting recess 5 has a first recess 51 having a size and a depth for suspending the printed circuit board 8 portion of the IC module 4 and a size and depth for embedding the resin mold portion 7 of the IC module. The second recess 52 is formed. During the cutting of the first recess 51, excavation for exposing the connection end portions 211 and 212 of the antenna coil 21 is simultaneously performed.
However, as in the embodiments described later, the connection end portions 211 and 212 may be positioned deeper than the first recess surface, and a small-diameter conduction recess reaching the antenna coil connection end portion from the first recess surface may be excavated. . In this case, the antenna coil 21 of the antenna sheet 10a may be disposed so as to face the core sheet 10b side.

この露出したアンテナコイル接続端部に導電性接着剤を塗布するか異方導電性接着テープ９を貼着して（図５（Ｄ））、接触、非接触両用ＩＣカード用ＩＣモジュール４を装填する（図５（Ｅ））。
その後、圧着するためのＩＣモジュールシールを行う。モジュールシールは接触端子板１２面をヒーターブロックで熱圧をかけることにより行う。
ＩＣモジュール装着用凹部５に接触、非接触両用ＩＣカード用ＩＣモジュール４を装着した後は、前記の図１３に図示した状態になる。
ＩＣモジュール装着後、ＩＣチップ特性等の検査を行う。次いで、ＩＣカードの用途に応じて、データを書き込みする発行処理工程を行う。以上により、接触、非接触両用ＩＣカードが完成する。Apply conductive adhesive to the exposed end of the antenna coil connection or apply anisotropic conductive adhesive tape 9 (FIG. 5D), and load IC module 4 for both contact and non-contact IC cards. (FIG. 5E).
Thereafter, an IC module seal for pressure bonding is performed. Module sealing is performed by applying hot pressure to the surface of the contact terminal plate 12 with a heater block.
After the IC module mounting IC card 4 is mounted on the IC module mounting recess 5, the state shown in FIG. 13 is obtained.
After mounting the IC module, the IC chip characteristics and the like are inspected. Next, an issuing process step for writing data is performed according to the use of the IC card. As described above, a contact and non-contact IC card is completed.

ＳＩＭを製造する場合は、以下の工程を行う。
完成した接触、非接触両用ＩＣカードについて、図６のように、周縁スリット２ｓやブリッジ２ｂの形成、等の仕上げ加工を行う。周縁スリット２ｓは、ＳＩＭ２の外形形状を形成するものである。また、２〜３の箇所をブリッジ２ｂにより接続してＳＩＭ２が簡単に抜け落ちないようにするが、ブリッジ２ｂの部分にはハーフカット線２ｈを設け、折り取りできるようにされている。ブリッジ２ｂのアンテナコイル接続線が通る部分のハーフカット線２ｈは、当該接続線を切断しない深さにする。
これらの加工には前記のように、ハーフカット加工、ミシン目加工、エンドミルによるザグリ加工、溝打ち抜き加工、およびそれらの組み合わせ加工により行う。
なお、この工程は、ＩＣモジュール装着用凹部５の掘削工程と連続して行うものであってもよい。When manufacturing a SIM, the following steps are performed.
The completed contact / non-contact IC card is subjected to finishing processing such as formation of peripheral slits 2s and bridges 2b as shown in FIG. The peripheral slit 2s forms the outer shape of the SIM2. Further, the SIM2 is not easily detached by connecting the two to three portions by the bridge 2b. However, a half-cut line 2h is provided in the bridge 2b so that it can be broken. The half cut line 2h where the antenna coil connection line of the bridge 2b passes is set to a depth that does not cut the connection line.
As described above, these processes are performed by half cut processing, perforation processing, counterbore processing by an end mill, groove punching processing, and combination processing thereof.
Note that this step may be performed continuously with the excavation step of the IC module mounting recess 5.

ＩＣモジュール装着後、ＩＣチップ特性等の検査を行う。ＳＩＭ基体内にアンテナコイル２１を持たない場合は、通常、非接触通信機能の検査ができないが、上記のように製造するＳＩＭは、この段階でＩＣチップの非接触通信機能の検査ができる利点がある。
次いで、ＳＩＭ２の用途に応じて、データを書き込みする発行処理工程を行う。以上により、接触、非接触両用ＳＩＭが完成する。After mounting the IC module, the IC chip characteristics and the like are inspected. In the case where the antenna coil 21 is not provided in the SIM base, the non-contact communication function cannot normally be inspected. However, the SIM manufactured as described above has an advantage that the non-contact communication function of the IC chip can be inspected at this stage. is there.
Next, an issuance processing step for writing data is performed according to the use of the SIM2. As described above, a contact and non-contact SIM is completed.

図６のＳＩＭ２をカード基体１０から折り取りする際は、ハーフカット線２ｈを折ると同時にアンテナコイル２１の接続部を切断することになるから、ＳＩＭ２自体は、アンテナコイルを持たないことになるが、折り取りする前のＩＣカードの状態で非接触機能を試験できる利点がある。ただし、最初からアンテナコイルを形成しないＳＩＭであっても勿論構わない。  When the SIM2 of FIG. 6 is folded from the card base 10, the connection portion of the antenna coil 21 is cut simultaneously with the half-cut line 2h, so the SIM2 itself does not have an antenna coil. There is an advantage that the non-contact function can be tested in the state of the IC card before folding. However, it is of course possible to use a SIM in which no antenna coil is formed from the beginning.

ＳＩＭ自体は、アンテナコイルを持たない場合であっても、前述のように、アンテナを有するＳＩＭホルダーに装着して使用すれば、Ｃ４，Ｃ８端子を介して、非接触通信をすることができる。
また、図７のように、ＳＩＭカード基体のアンテナコイル２１を、ＳＩＭの外形（１５ｍｍ×２５ｍｍ）内に納まるような形状にして、ＳＩＭ２自体にアンテナコイル２１を持たせても良いことも、勿論のことである。その場合には、ＳＩＭ自体のアンテナコイルと携帯電話機やＳＩＭホルダーのアンテナと双方が、Ｃ４，Ｃ８端子を介して、アンテナとして機能することになる。Even if the SIM itself does not have an antenna coil, as described above, non-contact communication can be performed via the C4 and C8 terminals if the SIM is mounted on a SIM holder having an antenna.
Further, as shown in FIG. 7, the antenna coil 21 of the SIM card base may be shaped so as to fit within the outer shape of the SIM (15 mm × 25 mm), and the SIM 2 itself may have the antenna coil 21 as a matter of course. That is. In that case, both the antenna coil of the SIM itself and the antenna of the mobile phone or SIM holder function as an antenna via the C4 and C8 terminals.

以下、適宜図面を参照して本発明の実施例を説明する。
＜ＩＣカード用ＩＣモジュールの準備＞
あらかじめ、各ワイヤボンディング基板側パッド２６，２６ａ，２６ｂのための貫通孔（穴部）を形成した絶縁性基材（ガラスエポキシ基材、厚み１００μｍ）８の両面に銅箔をヒートプレスにより接着して一体化した。これを、通常のフォトエッチング法により表面側端子群（Ｃ１〜Ｃ８）や背面側のアンテナコイル接続用端子板２４，２５を形成した（図１、図２参照）。
接触・非接触式両用ＩＣチップ３をエポキシダイ接着剤によりプリント基板８にダイボンディングし、ＩＣチップ３の各接続端子（パッド）と基板側の各パッド（穴部）２６間、ＩＣチップ３の非接触インターフェース部Ａ１とパッド２６ｂ間、Ａ２とパッド２６ａ間、および接続用端子板２４，２５とパッド２６ａ，２６ｂ間、を、図１図示のようにワイヤ接続した。Embodiments of the present invention will be described below with reference to the drawings as appropriate.
<Preparation of IC module for IC card>
Copper foil was bonded to both surfaces of an insulating base material (glass epoxy base material, thickness of 100 μm) 8 in which through holes (holes) for the wire bonding substrate side pads 26, 26a, and 26b were previously formed by heat press. Integrated. The front side terminal group (C1 to C8) and the rear side antenna coil connection terminal plates 24 and 25 were formed by a normal photoetching method (see FIGS. 1 and 2).
The contact / non-contact type IC chip 3 is die-bonded to the printed circuit board 8 with an epoxy die adhesive, and between each connection terminal (pad) of the IC chip 3 and each pad (hole) 26 on the board side, Wire connection is made between the non-contact interface portion A1 and the pad 26b, between A2 and the pad 26a, and between the connection terminal plates 24 and 25 and the pads 26a and 26b as shown in FIG.

この接触・非接触式両用ＩＣチップが実装されたＣＯＴ（Ｃｈｉｐ Ｏｎ Ｔａｐｅ；厚み１６０μｍ）のＩＣチップ３やワイヤボンディング部周囲を囲みエポキシ系樹脂を滴下して樹脂モールドした。ただし、２個のアンテナコイル接続用端子板（大きさ２ｍｍ×３ｍｍ）２４，２５は樹脂モールド部から露出するようにした。
ＩＣモジュール基板の大きさは１３．０ｍｍ×１１．８ｍｍとし、樹脂モールド部７は大きさは８．０ｍｍ×８．０ｍｍ、基板厚みを含めない樹脂モールド部７の高さは４４０μｍとなった。A COT (Chip On Tape; thickness 160 μm) IC chip 3 on which the contact / non-contact type IC chip was mounted and a wire bonding portion were surrounded and an epoxy resin was dropped and molded. However, the two antenna coil connection terminal plates (size 2 mm × 3 mm) 24 and 25 were exposed from the resin mold portion.
The size of the IC module substrate was 13.0 mm × 11.8 mm, the resin mold portion 7 was 8.0 mm × 8.0 mm, and the height of the resin mold portion 7 not including the substrate thickness was 440 μm.

このＣＯＴ裏面（端子板の反対面）に、樹脂モールド部７とアンテナコイル接続用端子板２４，２５を除いて第１凹部（ＩＣモジュール装着用凹部内であって接触端子板が載置される部分）に接する部分が被覆されるように、導電性熱反応性接着テープ（ポリエステル樹脂系、厚み５０μｍ）９を打ち抜いてからラミネートした。
プレス条件は、１３０°Ｃ、時間５秒とした。このラミネート時に、接着テープ９は、約１０μｍ圧縮された。On the back surface of the COT (opposite surface of the terminal plate), except for the resin mold portion 7 and the antenna coil connection terminal plates 24 and 25, the first recess (in the IC module mounting recess and the contact terminal plate is placed). The conductive heat-reactive adhesive tape (polyester resin system, thickness 50 μm) 9 was punched out and laminated so that the part in contact with the part) was covered.
The pressing conditions were 130 ° C. and time 5 seconds. During the lamination, the adhesive tape 9 was compressed by about 10 μm.

＜アンテナシートの製造＞
カード基体のアンテナシートとして、厚み３６０μｍの白色硬質塩化ビニールシートに厚み３５μｍのアルミ箔が積層された基材を使用し、フォトエッチングによりアンテナコイル２１とアンテナコイル接続端部２１１，２１２を形成した（図５参照。）。
なお、アンテナコイル２１がＳＩＭ２の外形から抜け出る接続配線部分が、ブリッジ２ｂに位置するような配線パターン形状とした。<Manufacture of antenna sheet>
As a card substrate antenna sheet, a base material in which a 35 μm thick aluminum foil was laminated on a 360 μm thick white hard vinyl chloride sheet was used, and the antenna coil 21 and the antenna coil connecting end portions 211 and 212 were formed by photoetching ( See FIG.
The connection wiring portion where the antenna coil 21 comes out of the outer shape of the SIM 2 has a wiring pattern shape that is located on the bridge 2b.

＜ＩＣカード基体の準備＞
このアンテナシートに対して、厚み３６０μｍの白色硬質塩化ビニールシート１枚を、アンテナコイル２１を内側にして合わせ、この２枚をコアシートとして、さらにその両面に厚み５０μｍの透明塩化ビニールシートの２枚をコアシートの上下面に配置した合計４枚のシートを仮止めした後、熱圧（１５０°Ｃ、０．０３ＭＰａ、時間４０分）をかけて融着し、アンテナシート埋め込み済ＩＣカード１０基体を準備した。
この状態では、アンテナコイル接続端部２１１，２１２は、カード表面から４１０μｍ〜４４５μｍの範囲に存在することになる。<Preparation of IC card base>
A sheet of white hard vinyl chloride sheet with a thickness of 360 μm is combined with this antenna sheet with the antenna coil 21 on the inside, and these two sheets are used as core sheets, and two sheets of transparent vinyl chloride sheet with a thickness of 50 μm on both sides. After temporarily fixing a total of four sheets arranged on the upper and lower surfaces of the core sheet, they are fused by applying hot pressure (150 ° C., 0.03 MPa, time 40 minutes), and the antenna card embedded IC card 10 base Prepared.
In this state, the antenna coil connection end portions 211 and 212 are present in the range of 410 μm to 445 μm from the card surface.

＜ＩＣモジュール装着用凹部の切削＞
ＩＣモジュール装着部の凹部を、ザグリ機のＮＣ切削加工により形成した。
まず、ＩＣモジュール基板（接触端子板）と接着テープ９の厚みの合計厚さに相当する深さに第１凹部５１を切削した。
この段階での第１凹部の大きさは、１３．１×１１．９ｍｍ（角部の曲率半径２．５ｍｍ）、深さは２００μｍとした。このサイズは実際の端子基板サイズよりも各０．１ｍｍ程度大きい開口である。<Cutting of IC module mounting recess>
The concave portion of the IC module mounting portion was formed by NC cutting of a counterbore machine.
First, the first recess 51 was cut to a depth corresponding to the total thickness of the IC module substrate (contact terminal plate) and the adhesive tape 9.
The size of the first recess at this stage was 13.1 × 11.9 mm (corner radius of curvature 2.5 mm), and the depth was 200 μm. This size is an opening about 0.1 mm larger than the actual terminal board size.

さらにＩＣモジュール４の樹脂モールド部７を納める第２凹部（ＩＣモジュール装着用凹部中心の最深部分）５２を、大きさ８．２ｍｍ×８．２ｍｍ、深さをカード表面から６４０μｍ、第１凹部表面からさらに４４０μｍ深くなるように掘削した。
最後に、ＩＣモジュール４のアンテナコイル接続用端子板２４，２５と、カード基体内のアンテナコイル接続端部２１１，２１２とを導通させるための２個の導通用凹部（直径２ｍｍ）を、第１凹部表面から掘削した。深さは、カード表面から４３０μｍ程度になるように掘削した。Further, the second recess 52 (the deepest part at the center of the IC module mounting recess) 52 for accommodating the resin mold portion 7 of the IC module 4 has a size of 8.2 mm × 8.2 mm, a depth of 640 μm from the card surface, and the first recess surface. Then, excavation was further carried out so as to be 440 μm deep.
Finally, two conducting recesses (diameter 2 mm) for conducting the antenna coil connecting terminal plates 24 and 25 of the IC module 4 and the antenna coil connecting end portions 211 and 212 in the card base are provided as the first. Drilled from the surface of the recess. The depth was excavated to be about 430 μm from the card surface.

＜ＩＣモジュールの装着＞
導通用凹部により露出したアンテナコイル接続端部２１１，２１２の上に液状導電性熱硬化性樹脂を塗布した上に、先に準備した導電性熱反応性接着テープ９ラミネート済みのＩＣモジュール４をＣＯＴから打ち抜いて搭載し、熱圧（１５０°Ｃ、時間５秒）をかけて接着テープ９を溶かしてＩＣモジュールを固定した。
これにより、ＩＣモジュールとＩＣカード基体の接着、およびＩＣモジュールとカード 基体内のアンテナコイルとの電気的接続の両方が完成した。 <Installation of IC module>
A liquid conductive thermosetting resin is applied on the antenna coil connection end portions 211 and 212 exposed by the recesses for conduction, and the previously prepared IC module 4 laminated with the conductive thermoreactive adhesive tape 9 is COT. Then, the IC module was fixed by melting the adhesive tape 9 by applying hot pressure (150 ° C., time 5 seconds).
As a result, both the adhesion between the IC module and the IC card substrate and the electrical connection between the IC module and the antenna coil in the card substrate were completed.

＜ＳＩＭ化するための仕上げ加工＞
ＳＩＭ２のサイズが長辺２５ｍｍ、短辺１５ｍｍとなるようにし、１角部に切り欠き部２３を設けるようにして、周縁スリットにより外形形状を形成した。
周縁スリット２ｓは、エンドミルの切削により、幅１．５ｍｍとなるようにし、ブリッジ２ｂを左右の長辺に各１カ所、都合２カ所設け、当該ブリッジ部には、ＩＣカード基体１０の上下面からハーフカット線２ｈを打ち抜き刃により入れ、中心層が０．４ｍｍ程度残るようにした（図６参照）。
ブリッジ２ｂには、アンテナコイルとの接続部を設けて、ハーフカット線２ｈを入れるが、上下から各０．２ｍｍ程度の深さであるので、ハーフカットにより接続線が切断されることはない。ただし、アンテナ接続線は容易に折り取りできる細さのものである。<Finishing for making SIM>
The outer shape was formed by the peripheral slit so that the size of the SIM 2 was 25 mm for the long side and 15 mm for the short side, and the notch 23 was provided at one corner.
The peripheral slit 2s is made to have a width of 1.5 mm by cutting with an end mill, and two bridges 2b are provided on the long left and right sides for convenience, and the bridge portion is provided from the upper and lower surfaces of the IC card base 10. Half-cut wire 2h was inserted with a punching blade so that the center layer remained about 0.4 mm (see FIG. 6).
The bridge 2b is provided with a connection portion with an antenna coil and puts a half cut line 2h. However, since the depth is about 0.2 mm from the top and bottom, the connection line is not cut by the half cut. However, the antenna connection line is thin enough to be easily broken.

以上の工程で完成した、ＩＣカード１は、ＳＩＭ２を周縁スリットやブリッジから折り取りしないで、ＩＣチップの特性検査を従来のＩＣカードの検査装置を使用して行うことができ利便性の高いものであった。
また、ＳＩＭ２を折り取りする前の状態では、通常の接触・非接触両用ＩＣカードとして使用でき、折り取りすれば、携帯電話機用等のＳＩＭとして用いることができた。The IC card 1 completed through the above steps is highly convenient because the IC chip characteristic inspection can be performed by using a conventional IC card inspection apparatus without breaking the SIM 2 from the peripheral slit or bridge. Met.
Further, in the state before the SIM2 is folded, it can be used as a normal contact / non-contact IC card, and if it is folded, it can be used as a SIM for a mobile phone or the like.

ＩＣカード用ＩＣモジュールの第１実施形態を示す背面図である。It is a rear view which shows 1st Embodiment of the IC module for IC cards. 同非接触インターフェース部の接続状態を示す断面図である。It is sectional drawing which shows the connection state of the non-contact interface part. ＩＣカード用ＩＣモジュールの第２実施形態を示す背面図である。It is a rear view which shows 2nd Embodiment of the IC module for IC cards. 同非接触インターフェース部の接続状態を示す断面図である。It is sectional drawing which shows the connection state of the non-contact interface part. ＩＣモジュールをカード基体に装着する工程を示す図である。It is a figure which shows the process of mounting an IC module in a card | curd base | substrate. ＩＣカード基体からＳＩＭを形成する工程を示す図である。It is a figure which shows the process of forming SIM from an IC card base. アンテナコイルを有するＳＩＭを示す図である。It is a figure which shows SIM which has an antenna coil. 従来の接触型ＩＣカードの平面図である。It is a top view of the conventional contact-type IC card. 従来の接触、非接触両用ＩＣカードの平面図である。It is a top view of the conventional contact and non-contact IC card. 従来のＳＩＭ（ＵＩＭ）を示す図である。It is a figure which shows the conventional SIM (UIM). ＩＣモジュールの端子群を表わす平面図である。It is a top view showing the terminal group of an IC module. 従来の接触、非接触両用ＩＣカード用ＩＣモジュールの裏面のボンディン グ状態を表わす図である。It is a figure showing the bonding state of the back surface of the conventional IC module for contact and non-contact IC cards. ＩＣモジュールをカード基体に装着した接触、非接触両用ＩＣカードの断 面図である。FIG. 2 is a cross-sectional view of a contact / non-contact IC card in which an IC module is mounted on a card substrate. ＳＩＭホルダーを示す図である。It is a figure which shows a SIM holder. 従来のＳＩＭ用ＩＣモジュールの背面を示す図である。It is a figure which shows the back surface of the conventional IC module for SIM.

２ ＳＩＭ（ＵＩＭ）
２ｓ 周縁スリット
２ｂ ブリッジ
２ｈ ハーフカット線
３ ＩＣチップ
４ 接触、非接触両用ＩＣカード用ＩＣモジュール
５ ＩＣモジュール装着用凹部
６ 導電性接着剤
７ 樹脂モールド部
８ プリント基板、絶縁性基材
９ 接着テープ
１０ ＩＣカード基体
１１ 接触型ＩＣカード
１２ 接触、非接触両用ＩＣカード
１３ ＳＩＭ（ＵＩＭ）
１４ 接触型ＩＣカード用ＩＣモジュール
１５ 接触、非接触両用ＩＣカード用ＩＣモジュール
２１ アンテナコイル
２３ 切り欠き部
２４，２５ アンテナコイル接続用端子板
２６ ワイヤボンディング基板側パッド
２６ａ，２６ｂ 穴部、ワイヤボンディング基板側パッド
２７ ボンディングワイヤ
３１ ＳＩＭホルダー
３２ 端子板
３５ 挿入口
３８ 上蓋部
３９ 下側ケース部2 SIM (UIM)
2s Peripheral slit 2b Bridge 2h Half cut wire 3 IC chip 4 IC module for IC card for both contact and non-contact 5 IC module mounting recess 6 Conductive adhesive 7 Resin mold part 8 Printed circuit board, insulating base material 9 Adhesive tape 10 IC card base 11 Contact type IC card 12 Contact and non-contact IC card 13 SIM (UIM)
14 IC module for contact type IC card 15 IC module for IC card for both contact and non-contact use 21 Antenna coil 23 Notch part 24, 25 Terminal board for antenna coil connection 26 Wire bonding board side pad 26a, 26b Hole part, wire bonding board Side pad 27 Bonding wire 31 SIM holder
32 Terminal board 35 Insertion slot 38 Upper lid part 39 Lower case part

Claims (2)

基板の一方側面には、接触、非接触の両方のインターフェースを持つＩＣチップを有しOne side of the board has an IC chip with both contact and non-contact interfaces 、前記基板の他方側面には、ＩＳＯ７８１６が規定する８つの接触端子群を有し，前記ＩThe other side surface of the substrate has eight contact terminal groups defined by ISO7816. Ｃチップの接触交信に用いる各接続端子と前記接触端子群の各端子板裏面間が、前記基板Between each connection terminal used for contact communication of the C chip and the back of each terminal plate of the contact terminal group is the substrate. の絶縁層に形成された穴部を通じてワイヤ接続され、ＩＣカード基体内のアンテナコイルThe antenna coil in the IC card substrate is wire-connected through a hole formed in the insulating layer と接続するために前記ＩＣチップの両側に対向して設けられた２つの接続用端子板が，ＩTwo connection terminal boards provided opposite to both sides of the IC chip for connection to the IC chip. ＳＯ７８１６のＣ４，Ｃ８端子板裏面間と前記穴部を通じてワイヤ接続され，前記ＩＣチA wire connection is made between the back surface of the C4 and C8 terminal boards of SO7816 and through the hole, and the IC chip ップの非接触交信に用いる各接続端子が，前記Ｃ４，Ｃ８端子板裏面間と前記穴部を通じEach connection terminal used for non-contact communication between the C4 and C8 terminals is back through the hole and through the hole. てワイヤ接続されるか、或いは、前記接続用端子板とワイヤ接続されているＩＣカード用For IC cards that are wire-connected or wire-connected to the connection terminal board ＩＣモジュールが，前記アンテナコイルが形成された前記ＩＣカード基体に埋設用凹部をThe IC module has a recess for embedding in the IC card base on which the antenna coil is formed. 掘削して露出させた前記アンテナコイルの両端部と，前記ＩＣカード用ＩＣモジュールのBoth ends of the antenna coil exposed by excavation and the IC module for the IC card 前記接続用端子板が電気的に導通するようにして、前記埋設用凹部内に装着されたＩＣカAn IC cover mounted in the recess for embedding such that the connection terminal plate is electrically connected. ードにおいて，In the
前記ＩＣカード基体と連結させる複数のブリッジの部分を残した状態で，前記前記埋設  The embedment is left in a state where a plurality of bridge portions to be connected to the IC card base are left. 用凹部を含むようにＳＩＭの外形形状を形成する周縁スリットが設けられ，前記ブリッジThe bridge is provided with a peripheral slit that forms the outer shape of the SIM so as to include a concave portion for use in the bridge. の部分には，前記アンテナコイルを切断しない深さのハーフカット線が設けていることをIn this part, a half-cut line with a depth that does not cut the antenna coil is provided. 特徴とするＩＣカード。Characteristic IC card. 請求項１に記載のＩＣカードのＩＣカード基体から，アンテナコイルを切断しない深さA depth at which the antenna coil is not cut from the IC card base of the IC card according to claim 1 のハーフカット線が設けられたブリッジの部分を折り取ることで形成されるＳＩＭ。The SIM is formed by breaking the bridge portion provided with the half-cut line.
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JP5011766B2 (en) * 2006-03-16 2012-08-29 大日本印刷株式会社 IC module for IC card
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KR20100054822A (en) * 2007-09-07 2010-05-25 파나소닉 주식회사 Sim card ic module and sim card
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