JP4996179B2 - IC card and IC card manufacturing method - Google Patents

IC card and IC card manufacturing method Download PDF

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JP4996179B2
JP4996179B2 JP2006236745A JP2006236745A JP4996179B2 JP 4996179 B2 JP4996179 B2 JP 4996179B2 JP 2006236745 A JP2006236745 A JP 2006236745A JP 2006236745 A JP2006236745 A JP 2006236745A JP 4996179 B2 JP4996179 B2 JP 4996179B2
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antenna
card
terminal
module
connection terminal
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JP2008059370A (en
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勝 室原
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Toshiba Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Description

本発明は、接触、非接触両方式のＩＣカードに用いられるＩＣモジュール、ＩＣカード、及びＩＣカードの製造方法に関する。   The present invention relates to an IC module, an IC card, and an IC card manufacturing method used for both contact and non-contact type IC cards.

ＩＣカードには、接触、非接触の両方式で外部とデータ通信を行うことができるものがある。このＩＣカードは、例えば図１２に示すようなＩＣモジュール１０１を備えている。即ち、ＩＣモジュール１０１は基板１０２を有し、この基板１０２の一面側には図１３及び図１４にも示すようにＬＳＩ１０３、及びアンテナ接続端子１０４が配設されている。ＬＳＩ１０３とアンテナ接続端子１０４は金ワイヤ１０５を介して接続されている。この基板１０２の他面側には複数個（８個）のＩＳＯ接触方式の外部コンタクト端子Ｃ１〜Ｃ８が配設されている。   Some IC cards can perform data communication with the outside by both contact and non-contact methods. This IC card includes an IC module 101 as shown in FIG. 12, for example. That is, the IC module 101 has a substrate 102, and an LSI 103 and an antenna connection terminal 104 are arranged on one surface side of the substrate 102 as shown in FIGS. The LSI 103 and the antenna connection terminal 104 are connected via a gold wire 105. On the other surface side of the substrate 102, a plurality (eight) of ISO contact type external contact terminals C1 to C8 are disposed.

また、基板１０２には、外部コンタクト端子Ｃ１〜Ｃ３、Ｃ５、Ｃ７に対向する複数の貫通孔１０７が穿設され、外部コンタクト端子Ｃ１〜Ｃ３、Ｃ５、Ｃ７とＬＳＩ１０３は貫通孔１０７に挿通される金ワイヤ１０５を介して接続されている。   The substrate 102 has a plurality of through holes 107 facing the external contact terminals C1 to C3, C5, and C7, and the external contact terminals C1 to C3, C5, C7, and the LSI 103 are inserted into the through hole 107. They are connected via a gold wire 105.

このように構成されるＩＣモジュール１０１は、アンテナを内蔵するカード基材の収納用凹部内に収納されてそのＬＳＩ１０３をアンテナ接続端子１０４を介してカード基材のアンテナに接続させてＩＣカードを構成するようになっている。   The IC module 101 configured as described above is housed in a recessed portion for housing a card substrate containing an antenna, and the LSI 103 is connected to the antenna of the card substrate via an antenna connection terminal 104 to form an IC card. It is supposed to be.

このＩＣカードは、カード外部から供給される電波を電力に変換してＬＳＩ１０３を動作させ、残りの電力でレスポンスを返して非接触でデータ通信を行っている。   This IC card converts the radio wave supplied from the outside of the card into electric power, operates the LSI 103, returns a response with the remaining electric power, and performs data communication without contact.

また、接触方式での交信時には、外部コンタクト端子Ｃ１〜Ｃ３、Ｃ５、Ｃ７をリーダ／ライターに接触させてデータ通信を行なう。   Further, at the time of communication by the contact method, data communication is performed by bringing the external contact terminals C1 to C3, C5, and C7 into contact with the reader / writer.

なお、外部コンタクト端子Ｃ４，Ｃ６、Ｃ８は、通常の接触方式では使用されない空（予備用）の端子となっている。   The external contact terminals C4, C6, and C8 are empty (preliminary) terminals that are not used in the normal contact method.

ところで、近時においては、上記した空の外部コンタクト端子Ｃ４，Ｃ６、Ｃ８に外部アンテナを接続することにより非接触方式での通信を可能にしている。   By the way, recently, non-contact communication is enabled by connecting an external antenna to the above-described empty external contact terminals C4, C6, and C8.

この場合には、ＩＣモジュール１０１は図１５に示すように構成される（なお、図１２で示した部分と同一部分については、同一番号を付してその説明を省略する。）。即ち、基板１０２には空の外部コンタクト端子Ｃ４，Ｃ８に対向する貫通孔１０８が穿設され、この貫通孔１０８内に金ワイヤ１０９を挿通させ、この金ワイヤ１０９を介して空の外部コンタクト端子Ｃ４，Ｃ８とＬＳＩ１０３とを接続している（例えば、特許文献１参照。）。
特開２００４−３５５６０４号公報 In this case, the IC module 101 is configured as shown in FIG. 15 (note that the same parts as those shown in FIG. 12 are denoted by the same reference numerals and description thereof is omitted). That is, a through hole 108 facing the empty external contact terminals C4 and C8 is formed in the substrate 102, and a gold wire 109 is inserted into the through hole 108, and the empty external contact terminal is inserted through the gold wire 109. C4 and C8 and the LSI 103 are connected (for example, refer to Patent Document 1).
JP 2004-355604 A

しかしながら、従来においては、ＩＣモジュール１０１の空の外部コンタクト端子Ｃ４，Ｃ８を外部との通信に利用する場合と、利用しない場合とで、ＩＣモジュール１０１の構造を変更しなければならず、製造コストが高くなるという問題があった。   However, conventionally, the structure of the IC module 101 must be changed depending on whether or not the empty external contact terminals C4 and C8 of the IC module 101 are used for communication with the outside, and the manufacturing cost is increased. There was a problem that became high.

本発明は上記事情に着目してなされたもので、その目的とするところは、ＩＣモジュールの予備の接続端子を外部との通信に利用する場合と、外部との通信に利用しない場合とで構造を特別変更することなく対応できるようにしたＩＣモジュール、ＩＣカード及びＩＣカードの製造方法を提供することにある。   The present invention has been made by paying attention to the above circumstances, and the object of the present invention is to structure the case where the spare connection terminal of the IC module is used for communication with the outside and the case where it is not used for communication with the outside. It is an object to provide an IC module, an IC card, and a method for manufacturing an IC card, which can cope with the above without special change.

上記課題を解決するため、請求項１記載のものは、内蔵アンテナを有するカード基材と、このカード基材に形成され、前記内蔵アンテナの端子を露出させる収納用凹部と、基板と、この基板の一面側に配設されるＬＳＩ、及び該ＬＳＩに接続されるアンテナ接続端子と、前記基板の他面側に配設される接触通信用の接続端子、及び予備用の接続端子と、前記基板に穿設され、前記予備用の接続端子に対向する貫通孔と、前記アンテナ接続端子或いは、前記アンテナ接続端子と前記貫通孔に亘って供給される導電性接着部材とを有して構成されるＩＣモジュールとを具備し、前記ＩＣモジュールは、前記カード基材の収納用凹部内に前記基板の一面側から収納されることにより前記内蔵アンテナの端子に対し、前記導電性接着部材を介して前記アンテナ接続端子、或いは、前記予備用の接続端子を電気的に接続させる。 In order to solve the above-mentioned problem, the present invention includes a card base having an internal antenna, a storage recess formed on the card base and exposing a terminal of the internal antenna, a base, and the base LSI disposed on one surface side, an antenna connection terminal connected to the LSI, a contact communication connection terminal disposed on the other surface side of the substrate, a spare connection terminal, and the substrate A through hole facing the spare connection terminal, and the antenna connection terminal or a conductive adhesive member supplied over the antenna connection terminal and the through hole. comprising an IC module, the IC module, to the terminal of the internal antenna by being accommodated from the one surface of the substrate in the receiving recess of the card substrate, the via the conductive adhesive member Antenna connecting terminals, or electrically connecting the connection terminal for the preliminary.

請求項３記載のものは、内蔵アンテナを有するカード基材に収納用凹部を形成することにより、前記内蔵アンテナの端子を露出させる工程と、基板の一面側にＬＳＩ、及び該ＬＳＩに接続されるアンテナ接続端子を配設し、前記基板の他面側に接触通信用の接続端子、及び予備用の接続端子を配設し、前記基板に前記予備用の接続端子に対向する貫通孔を穿設してＩＣモジュールを構成する工程と、前記ＩＣモジュールの前記アンテナ接続端子或いは、前記アンテナ接続端子と前記貫通孔に亘って導電性接着部材を塗布する工程と、前記ＩＣモジュールをその基板の一面側から前記カード基材の収納用凹部内に収納することにより前記内蔵アンテナの端子に対し、前記導電性接着部材を介して前記アンテナ接続端子、或いは、前記予備用の接続端子を電気的に接続する工程とを具備する。 According to a third aspect of the present invention, there is provided a step of exposing a terminal of the built-in antenna by forming a recess for storage in a card substrate having a built-in antenna, and an LSI on one side of the substrate, and the LSI is connected to the LSI An antenna connection terminal is arranged, a contact communication connection terminal and a spare connection terminal are arranged on the other side of the board, and a through-hole facing the spare connection terminal is formed in the board. a step of constituting the IC module and said antenna connection terminal of the IC module or the steps of applying a conductive adhesive member over said through hole and said antenna connection terminal, one side of the substrate to the IC module To the terminal of the built-in antenna, the antenna connection terminal or the spare contact through the conductive adhesive member. And a step of electrically connecting the terminals.

本発明によれば、ＩＣモジュールの予備の接続端子を外部との通信に利用する場合と、外部との通信に利用しない場合とで、その構造を特別変更することなく対応でき、製造コストを低減することができる。   According to the present invention, the spare connection terminal of the IC module is used for communication with the outside and when it is not used for communication with the outside, the structure can be handled without special change, and the manufacturing cost is reduced. can do.

以下、本発明を図面に示す実施の形態を参照して詳細に説明する。
図１は、本発明の一実施の形態である接触、非接触の両方式で外部とデータ通信を行うことができるコンビカードの等価回路を示すものである。 Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings.
FIG. 1 shows an equivalent circuit of a combination card that can perform data communication with the outside by both contact and non-contact methods according to an embodiment of the present invention.

即ち、図中２はＬＳＩで、このＬＳＩ２にはアンテナ端子５を介してカード内蔵アンテナ９が接続されて共振回路が形成されている。この共振回路は、カード外部から供給される電波を電力に変換してＬＳＩ２を動作させ、残りの電力でレスポンスを返して非接触でデータ通信を行なう。また、ＬＳＩ２には複数個の接触通信用の外部コンタクト端子Ｃ３、Ｃ５、Ｃ７が接続され、接触方式での通信時には、外部コンタクト端子Ｃ１〜Ｃ３、Ｃ５、Ｃ７をリーダ／ライターに接触させてデータ通信を行なう。また、この実施例では通常の接触方式では使用しない予備用の端子Ｃ４と端子Ｃ８に外部アンテナ１０を接続し、外部と非接触でデータ通信を行なうことができるようになっている。   That is, reference numeral 2 in the figure is an LSI, and an LSI 9 with a built-in card is connected to the LSI 2 via an antenna terminal 5 to form a resonance circuit. This resonant circuit converts radio waves supplied from the outside of the card into electric power to operate the LSI 2 and returns a response with the remaining electric power to perform data communication without contact. The LSI 2 is connected to a plurality of external contact terminals C3, C5, and C7 for contact communication. When communicating by the contact method, the external contact terminals C1 to C3, C5, and C7 are brought into contact with a reader / writer to perform data. Communicate. In this embodiment, the external antenna 10 is connected to a spare terminal C4 and a terminal C8 that are not used in the normal contact system, so that data communication can be performed without contact with the outside.

なお、端子Ｃ１はＶＣＣ（供給電圧）、Ｃ２はＲＳＴ（リセット信号）、Ｃ３はＣＬＫ（クロック信号）、Ｃ５はＧＮＤ（接地）、Ｃ６はＶＰＰ（可変供給電圧）、Ｃ７はＩ／Ｏ（データ入出力）用の端子である。端子Ｃ４とＣ８はＲＦＵ（予備端子）となっている。   The terminal C1 is VCC (supply voltage), C2 is RST (reset signal), C3 is CLK (clock signal), C5 is GND (ground), C6 is VPP (variable supply voltage), and C7 is I / O (data). Input / output terminal. Terminals C4 and C8 are RFUs (spare terminals).

図２は、コンビカードを示す平面図である。   FIG. 2 is a plan view showing the combination card.

コンビカードは上記アンテナ９を内蔵するカード基材Ｋと、このカード基材Ｋに装着されるＩＣモジュール１とによって構成されている。   The combination card is constituted by a card base K containing the antenna 9 and an IC module 1 mounted on the card base K.

カード基材Ｋには、図３に示すように収納用凹部１７が設けられ、この収納用凹部１７内にＩＣモジュール１が収納されるようになっている。   As shown in FIG. 3, the card substrate K is provided with a storage recess 17, and the IC module 1 is stored in the storage recess 17.

図４は、ＩＣモジュール１を裏面側から示すものである。   FIG. 4 shows the IC module 1 from the back side.

ＩＣモジュール１は、厚さ１００ｐｍのガラスエポキシ製の基板３を備えている。この基板３の表面側（他面側）には8個の外部コンタクト端子Ｃ１〜Ｃ８が配設されている。基板３の裏面側（一面側）には厚さ２５０μｍのＬＳＩ２が配置されている。基板３には外部コンタクト端子Ｃ１〜Ｃ３，Ｃ５，Ｃ７に対向する５個の貫通穴６ａと、外部コンタクト端子Ｃ４，Ｃ８に対向する２個の貫通孔６ｂがそれぞれ穿設されている。   The IC module 1 includes a glass epoxy substrate 3 having a thickness of 100 pm. Eight external contact terminals C <b> 1 to C <b> 8 are disposed on the front surface side (other surface side) of the substrate 3. An LSI 2 having a thickness of 250 μm is disposed on the back side (one side) of the substrate 3. The substrate 3 has five through holes 6a facing the external contact terminals C1 to C3, C5 and C7 and two through holes 6b facing the external contact terminals C4 and C8.

ＬＳＩ２と外部コンタクト端子Ｃ１〜Ｃ３、Ｃ５、Ｃ７とは、図５にも示すように貫通穴６ａに挿通される金ワイヤ７を介してそれぞれ接続されている。第２の外部コンタクト端子Ｃ４、Ｃ６、Ｃ８は、ＬＳＩ２には接続されていない。また、ＬＳＩ２とアンテナ接続端子５とは図６にも示すように金ワイヤ７を介して接続されている。   The LSI 2 and the external contact terminals C1 to C3, C5, and C7 are connected to each other through a gold wire 7 that is inserted through the through hole 6a as shown in FIG. The second external contact terminals C4, C6, C8 are not connected to the LSI 2. The LSI 2 and the antenna connection terminal 5 are connected via a gold wire 7 as shown in FIG.

なお、ＬＳＩ２と外部コンタクト端子Ｃ１〜Ｃ３、Ｃ５、Ｃ７との接続を金ワイヤ７を用いたワイヤーボンディング方式としたが、これに限られることなく、他の接続方式でも構わない。   The connection between the LSI 2 and the external contact terminals C1 to C3, C5, and C7 is a wire bonding method using the gold wire 7, but is not limited to this, and other connection methods may be used.

ＬＳＩ実装部はエポキシ樹脂８でモールドされて保護され、厚さ６３０μｍのＩＣモジュール１が構成される。この時点では、外部コンタクト端子Ｃ４、Ｃ８、Ｃ６は、電気的にはどこにも接続されない状態で、空端子となっている。   The LSI mounting portion is molded and protected with an epoxy resin 8 to form an IC module 1 having a thickness of 630 μm. At this time, the external contact terminals C4, C8, and C6 are empty terminals in a state where they are not electrically connected anywhere.

図７及び図８は、ＩＣカードの製造工程を示すものである。   7 and 8 show the IC card manufacturing process.

まず、図７（ａ）に示すように、アンテナ９を形成するアンテナシート１５の表裏面にＰＥＴシート、或いはＰＶＣ（塩化ビニールシート）１３をそれぞれ重ね合わせて一体化し、カード基材Ｋを構成する。ついで、このカード基材Ｋの所定位置に図７（ｂ）、図７（ｂ）に示すように、ミーリング加工によりＩＣモジュール１を収納するための収納用凹部１７を形成し、この収納用凹部１７の形成によりコイルアンテナ９の両端部９ａを外部に露出させる（露出工程）。こののち、図４に示すように構成されたＩＣモジュール１に、図９に示すように、基板３の裏面側に貫通孔６ｂとアンテナ端子５に亘って導電性の接着剤としての導電ペースト１８を塗布し、その他の部位には絶縁性の接着剤（図示しない）を塗布する（塗布工程）。この塗布後、図７（ｃ）、図８（ｃ）に示すように、ＩＣモジュール１をそのＬＳＩ２側からカード基材Ｋの収納用凹部１７内に挿入して収納する。その後、ＩＣモジュール部とほぼ同じ大きさの加熱ヘッドをＩＣモジュール部へおしつけて、導電ペーストと絶縁性のペーストを同時に硬化させた。ペーストの塗布方法はディスペンス方式を用いた。これにより、導電ペースト１８が図１０に示すように基板３の貫通孔６ｂ内に押し込まれて硬化し、空端子Ｃ４、Ｃ８とアンテナ接続端子５，５とをそれぞれ電気的に接続し（接続工程）、空端子Ｃ４、Ｃ８を非接触方式での外部通信に利用することが可能となる。   First, as shown in FIG. 7 (a), a card base K is formed by superposing and integrating a PET sheet or PVC (vinyl chloride sheet) 13 on the front and back surfaces of the antenna sheet 15 forming the antenna 9, respectively. . Next, as shown in FIGS. 7B and 7B, a storage recess 17 for storing the IC module 1 is formed by milling at a predetermined position of the card base K. By forming 17, both end portions 9 a of the coil antenna 9 are exposed to the outside (exposure process). After that, as shown in FIG. 9, the IC module 1 configured as shown in FIG. 4 has a conductive paste 18 as a conductive adhesive across the through hole 6b and the antenna terminal 5 on the back side of the substrate 3. And an insulating adhesive (not shown) is applied to the other parts (application process). After this application, as shown in FIGS. 7C and 8C, the IC module 1 is inserted and stored in the storing recess 17 of the card base K from the LSI 2 side. Thereafter, a heating head having approximately the same size as that of the IC module portion was applied to the IC module portion, and the conductive paste and the insulating paste were simultaneously cured. The dispensing method was used as the paste application method. As a result, the conductive paste 18 is pushed into the through hole 6b of the substrate 3 and cured as shown in FIG. 10, and the empty terminals C4 and C8 and the antenna connection terminals 5 and 5 are electrically connected to each other (connection process). ), The empty terminals C4 and C8 can be used for external communication in a non-contact manner.

また、空端子Ｃ４、Ｃ８を非接触方式での外部通信に利用しない場合には、上記したように、基板３の貫通孔６ｂとアンテナ端子５に亘って導電性の接着剤としての導電ペースト１８を塗布することなく、アンテナ端子５にのみ導電ペースト１８を塗布してそのまま、ＩＣモジュール１をカード基材Ｋの収納用凹部１７内に収納してカードの製造を終える。 When the empty terminals C4 and C8 are not used for external communication in a non-contact manner, as described above , the conductive paste 18 as a conductive adhesive across the through hole 6b of the substrate 3 and the antenna terminal 5 is used. Without applying the conductive paste 18, the conductive paste 18 is applied only to the antenna terminal 5, and the IC module 1 is stored in the storage recess 17 of the card base K as it is to complete the card manufacturing.

なお、上記した実施の形態では、カード基材Ｋに内蔵されるアンテナ９をＩＣモジュール１のアンテナ接続端子５に接続しているが、アンテナ９を使用しない場合は、ミーリング工程でアンテナ両端子９ａを切断して独立させ、このアンテナ両端子９ａにそれぞれ空端子Ｃ４とＣ８を接続することも出来る。   In the above-described embodiment, the antenna 9 built in the card base K is connected to the antenna connection terminal 5 of the IC module 1. However, when the antenna 9 is not used, both antenna terminals 9a are used in the milling process. Can be made independent by connecting the empty terminals C4 and C8 to the antenna terminals 9a.

また、上記した実施の形態では、ＩＣモジュール１の基板３に空端子Ｃ４、Ｃ８に対向する貫通孔６ｂを２個のみ穿設したが、これに限られることなく、図１１に示すように空端子Ｃ６に対向する貫通孔６ｃをさらに穿設し、この貫通孔６ｃとアンテナ接続端子５に亘って導電ペースト１８を塗布してからＩＣモジュール１をカード基材Ｋの収納用凹部１７内に収納することにより、導電ペースト１８を基板３の貫通孔６ｃ内に押し込み、この導電ペースト１８を介してアンテナ接続端子５と空端子Ｃ６とを電気的に接続して外部通信に利用するようにしても良い。   In the above-described embodiment, only two through holes 6b facing the empty terminals C4 and C8 are formed in the substrate 3 of the IC module 1. However, the present invention is not limited to this, and as shown in FIG. A through hole 6c facing the terminal C6 is further drilled, and the conductive paste 18 is applied over the through hole 6c and the antenna connection terminal 5, and then the IC module 1 is stored in the recess 17 for storing the card base K. Thus, the conductive paste 18 is pushed into the through hole 6c of the substrate 3, and the antenna connection terminal 5 and the empty terminal C6 are electrically connected via the conductive paste 18 to be used for external communication. good.

上記したように、この発明によれば、ＩＣモジュール１をカード基材Ｋの収納用凹部１７内に挿入する際に、基板３に導電ペースト１８を塗布するか否かによって空端子Ｃ４、Ｃ８を外部通信に利用できるか否かを決定できる。従って、従来のように、ＩＣモジュール１の構造を特別に変更することなく、対応することができ、製造コストを低減することができる。   As described above, according to the present invention, when the IC module 1 is inserted into the storage recess 17 of the card base K, the empty terminals C4 and C8 are set depending on whether or not the conductive paste 18 is applied to the substrate 3. It can be determined whether it can be used for external communication. Therefore, it is possible to cope with the structure of the IC module 1 without changing the structure of the IC module 1 as in the prior art, and the manufacturing cost can be reduced.

上記実施例では導電ペーストを使用したが、この導電ペーストの代わりクリームハンダを使用しても良い。この場合は、上記実施例と同様にクリームハンダと絶縁ペーストを所定の位置に別々にディスペンス方式で塗布する。つぎにハンダ部分に相当する形状の加熱ヘッドをＩＣモジュールに押し付けてハンダを先に硬化させ、次にＩＣモジュール部とほぼ同じ大きさの加熱ヘッドをＩＣモジュール部へ押し付けて絶縁性のペーストを硬化させた。また、ハンダと絶縁ペーストの硬化準はどちらが先でもかまわない。   Although the conductive paste is used in the above embodiment, cream solder may be used instead of the conductive paste. In this case, the cream solder and the insulating paste are separately applied at predetermined positions by the dispensing method as in the above embodiment. Next, the heating head having a shape corresponding to the solder part is pressed against the IC module to harden the solder first, and then the heating head having the same size as the IC module part is pressed against the IC module part to cure the insulating paste. I let you. Either the solder or the insulating paste can be cured first.

なお、この発明は、上述した実施の形態そのままに限定されるものではなく、実施段階ではその要旨を逸脱しない範囲で構成要素を変形して具体化できる。また、上述した実施の形態に開示されている複数の構成要素の適宜な組み合わせにより種々の発明を形成できる。例えば、上述した実施の形態に示される全構成要素から幾つかの構成要素を削除しても良い。更に、異なる実施の形態に亘る構成要素を適宜組み合わせても良い。   Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. Various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above-described embodiments. For example, you may delete some components from all the components shown by embodiment mentioned above. Furthermore, you may combine the component covering different embodiment suitably.

本発明の一実施の形態であるＩＣカードを示す等価回路図。The equivalent circuit diagram which shows the IC card which is one embodiment of this invention. 図１のＩＣカードを示す平面図。The top view which shows the IC card of FIG. 図２のＩＣカードを構成するカード基材とＩＣモジュールを示す図。The figure which shows the card | curd base material and IC module which comprise the IC card of FIG. 図３のＩＣモジュールを裏面側から示す図。The figure which shows the IC module of FIG. 3 from the back side. 図４中Ａ−Ａ線に沿って示す断面図。Sectional drawing shown along the AA line in FIG. 図４中Ｂ−Ｂ線に沿って示す断面図。Sectional drawing shown along a BB line in FIG. 図２のＩＣカードの製造工程を示す図。The figure which shows the manufacturing process of the IC card of FIG. 図２のＩＣカードの製造工程を示す図。The figure which shows the manufacturing process of the IC card of FIG. 図４のＩＣモジュールの基板に導電性ペーストを塗布した状態を示す図。The figure which shows the state which apply | coated the electrically conductive paste to the board | substrate of the IC module of FIG. 図９の導電性ペーストが空端子とアンテナ接続端子とを接続した状態を示す図。The figure which shows the state which the electrically conductive paste of FIG. 9 connected the empty terminal and the antenna connection terminal. 本発明の他の実施の形態であるＩＣモジュールを示す図。The figure which shows the IC module which is other embodiment of this invention. 従来のＩＣモジュールを示す図。The figure which shows the conventional IC module. 図１２中Ｃ−Ｃ線に沿って示す断面図。Sectional drawing shown along the CC line in FIG. 図１２中Ｄ−Ｄ線に沿って示す断面図。Sectional drawing shown along the DD line in FIG. 従来のＩＣモジュールを示す図。The figure which shows the conventional IC module.

符号の説明Explanation of symbols

２…ＬＳＩ、３…基板、５…アンテナ接続端子、Ｃ１〜Ｃ３、Ｃ５、Ｃ７…接触通信用の接続端子、Ｃ４，Ｃ８…予備用の接続端子、Ｋ…カード基材、６ｂ…貫通孔、９…アンテナ、１７…収納用凹部、１８…導電ペースト（導電性の接着剤）。   2 ... LSI, 3 ... Substrate, 5 ... Antenna connection terminal, C1-C3, C5, C7 ... Contact terminal for contact communication, C4, C8 ... Preliminary connection terminal, K ... Card base material, 6b ... Through hole, 9 ... antenna, 17 ... recess for storage, 18 ... conductive paste (conductive adhesive).

Claims (4)

内蔵アンテナを有するカード基材と、
このカード基材に形成され、前記内蔵アンテナの端子を露出させる収納用凹部と、
基板と、この基板の一面側に配設されるＬＳＩ、及び該ＬＳＩに接続されるアンテナ接続端子と、前記基板の他面側に配設される接触通信用の接続端子、及び予備用の接続端子と、前記基板に穿設され、前記予備用の接続端子に対向する貫通孔と、前記アンテナ接続端子或いは、前記アンテナ接続端子と前記貫通孔に亘って供給される導電性接着部材とを有して構成されるＩＣモジュールとを具備し、
前記ＩＣモジュールは、前記カード基材の収納用凹部内に前記基板の一面側から収納されることにより前記内蔵アンテナの端子に対し、前記導電性接着部材を介して前記アンテナ接続端子、或いは、前記予備用の接続端子を電気的に接続させることを特徴とするＩＣカード。 A card substrate having a built-in antenna ;
A recess for storage formed on the card base , exposing the terminal of the built-in antenna ,
A board, an LSI arranged on one side of the board, an antenna connection terminal connected to the LSI, a connection terminal for contact communication arranged on the other side of the board, and a spare connection A terminal, a through-hole formed in the substrate and facing the spare connection terminal, and the antenna connection terminal or a conductive adhesive member supplied across the antenna connection terminal and the through-hole. An IC module configured as
The IC module is housed from the one surface side of the substrate in the housing recess of the card base, so that the terminal of the built-in antenna is connected to the antenna connection terminal via the conductive adhesive member, or the An IC card, wherein spare connection terminals are electrically connected . 前記予備用の接続端子は非接触通信に用いられることを特徴とする請求項１記載のＩＣカード。 IC card according to claim 1, wherein the connection terminals for the preliminary is used in a non-contact communication. 内蔵アンテナを有するカード基材に収納用凹部を形成することにより、前記内蔵アンテナの端子を露出させる工程と、
基板の一面側にＬＳＩ、及び該ＬＳＩに接続されるアンテナ接続端子を配設し、前記基板の他面側に接触通信用の接続端子、及び予備用の接続端子を配設し、前記基板に前記予備用の接続端子に対向する貫通孔を穿設してＩＣモジュールを構成する工程と、
前記ＩＣモジュールの前記アンテナ接続端子或いは、前記アンテナ接続端子と前記貫通孔に亘って導電性接着部材を塗布する工程と、
前記ＩＣモジュールをその基板の一面側から前記カード基材の収納用凹部内に収納することにより前記内蔵アンテナの端子に対し、前記導電性接着部材を介して前記アンテナ接続端子、或いは、前記予備用の接続端子を電気的に接続する工程と
を具備することを特徴とするＩＣカードの製造方法。 A step of exposing a terminal of the built-in antenna by forming a recess for storage in a card substrate having the built-in antenna;
An LSI and an antenna connection terminal connected to the LSI are arranged on one side of the board, a contact terminal for contact communication and a spare connection terminal are arranged on the other side of the board, and the board Forming an IC module by drilling a through-hole facing the spare connection terminal; and
The antenna connection terminals of the IC module or the steps of applying a conductive adhesive member over said through hole and said antenna connection terminal,
The IC module is stored in the recess for storing the card base material from one side of the substrate to the terminal of the built-in antenna, or the antenna connection terminal or the spare terminal via the conductive adhesive member. And a step of electrically connecting the connection terminals of the IC card. 前記収納用凹部の形成時に、前記アンテナの両端子を切断することを特徴とする請求項３記載のＩＣカードの製造方法。 4. The method of manufacturing an IC card according to claim 3 , wherein both terminals of the antenna are cut when the storage recess is formed.
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