JP2003067701A - Non-contact communication medium and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact communication medium capable of easily connecting a connecting terminal of an antenna coil and an antenna terminal of an IC module and highly reliably manufactured at low cost and to provide its manufacturing method. SOLUTION: A winding tool 6 completing the winding is aligned on and faced to an inlet sheet 7. The antenna coil 2 and the connecting terminal part 2a are partially embedded therein while a pushing plate 62 of the winding tool 6 is pushed toward the inlet sheet 7. The inlet sheet 7 is clamped between card substrates 1 and 21 so as to be integrated together. A recess part 8 is formed in the surface of the card substrate 1 by cutting. Simultaneously, the connecting terminal part 2a is exposed. After a prescribed amount of conductive paste 9, etc., is applied on the exposed surface of the connecting terminal part 2a in its exposed state, the IC module 4 is faced in a prescribed direction and aligned. Lastly, the IC module 4 is fitted in the recess part 8 to join the connecting terminal part 2a with the antenna terminal 34 together.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contactless communication medium for reading and writing data in a contactless manner and a method for manufacturing the same, and more specifically to a connection terminal portion of a transmitting / receiving antenna coil and a semiconductor integrated circuit. Circuit (hereinafter IC
The present invention relates to a structure related to connection with an antenna terminal (referred to as a module) and a manufacturing method thereof. The non-contact communication medium of the present invention includes a combination communication medium having both contact and non-contact functions.

[0002]

2. Description of the Related Art In recent years, non-contact type communication media for exchanging signals with external devices by using electromagnetic waves, such as IC cards and IC tags, have been used in various fields. These non-contact type communication media basically include an IC module that processes and stores data, and a transmitting and receiving antenna coil that exchanges signals.

Conventionally, as shown in FIG. 5, when connecting the connecting terminal portion of the transmitting / receiving antenna coil and the antenna terminal of the IC module, the connecting terminal portion of the antenna coil 2 embedded in the card base material 1 is connected. After exposing 2a by precision cutting, the antenna terminal 34 of the IC module 4 is arranged so as to face and face the exposed connection terminal portion 2a by a face-down method, and a conductive adhesive is used. The method of joining by using, for example, is common.

However, in the conventional method, especially in the initial stage, since the connecting terminal portion 2a of the antenna coil is constituted by a single wire, the alignment tolerance in the X-axis and Y-axis directions is small and , The Z-axis, that is, the processing tolerance in the thickness direction of the card is very small, and there is a problem that the manufacturing yield is low.

Further, as a measure for improving the above, as shown in FIG. 6, a method has been proposed in which the connection terminal portion 5 terminating the antenna coil has a folded array structure.
Although the tolerance in the axial direction has increased and has been improved to a certain degree, the wire diameter of the antenna coil is about 50 to 150 μm and the variation in the thickness of the card material is 680 to 680.
Since it is as large as 840 μm, there is a problem that the manufacturing tolerance in the Z-axis direction is still small and the manufacturing cost is high.

[0006]

SUMMARY OF THE INVENTION Therefore, the present invention overcomes the above-mentioned problems of the prior art, makes it possible to easily connect the connection terminal portion of the antenna coil and the antenna terminal of the IC module, and at a low cost. It is an object of the present invention to provide a non-contact communication medium that can be manufactured with high reliability and a manufacturing method thereof.

[0007]

According to the present invention, when connecting a connection terminal portion which is a terminal of a transmitting / receiving antenna coil and an antenna terminal portion of an IC module, Z of the connection terminal portion is connected.
The object is to solve the above-mentioned problems by increasing the axial thickness and increasing the machining tolerance in the Z-axis direction.

That is, according to the present invention, a functional circuit including an IC module for processing or storing data is exchanged with an external device, and the winding main body and the antenna terminal of the IC module are connected to form a terminal. In the non-contact communication medium including an antenna coil including a connection terminal portion, the connection terminal portion of the antenna coil is formed thicker than the winding body portion.

Further, the present invention is the above non-contact communication medium, wherein the antenna coil is made of a metal wire.

The present invention is also the above-mentioned non-contact communication medium, wherein the antenna coil is made of a conductive paste.

Further, the present invention is the above non-contact communication medium, wherein the antenna coil is made of a metal foil.

Further, the present invention is the non-contact communication medium as described above, wherein the connection terminal portion is formed by laminating at least two layers.

Further, the present invention is the above-mentioned non-contact communication medium, which is a combination type having both contact and non-contact functions.

Further, according to the present invention, the step of forming the antenna coil, the step of partially embedding the antenna coil in an inlet sheet, the step of integrating the inlet sheet and the antenna coil with a card substrate, Forming a recess on the surface of the card substrate and exposing the connection terminal portion; and fitting the IC module into the recess and joining the connection terminal portion and the antenna terminal of the IC module. It is a manufacturing method of the above-mentioned non-contact communication medium.

Still further, according to the present invention, the step of forming the antenna coil in one layer, the step of partially embedding the antenna coil in an inlet sheet, the step of providing a metal plate on the surface of the connection terminal portion, A step of integrating the inlet sheet and the antenna coil with a card base material; a step of forming a recess on the surface of the card base material and exposing the connection terminal portion; and a step of fitting the IC module into the recess to perform the connection. The method for manufacturing a non-contact communication medium described above includes a step of joining a terminal portion and an antenna terminal of the IC module.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention applied to a combination type IC card will be described in detail below with reference to the drawings.

In this embodiment, the antenna coil is formed by using the metal wire. FIG. 1 is a perspective view showing an outline of a winding jig for forming an antenna coil of a non-contact communication medium of the present invention and a connection terminal portion at its end. As shown in FIG. 1, the antenna coil is started to be wound from one of the joining terminal pins 63 of the antenna coil, wound a predetermined number of turns along the winding pin 61, and finally the other end of the joining terminal pin 63 is wound again. Although returning to the side, the connection terminal portion can be formed to be thick by performing multiple winding along the joining terminal pin at the start and end of winding.
The pressing plate 62 is a plate for pressing the entire winding portion against the inlet sheet after the winding is completed.

FIG. 2 is a sectional view schematically showing a state in which winding is completed by using the winding jig 6 shown in FIG. Since the two portions of the joining terminal pin 63 corresponding to the winding start and the winding end of the wire of the antenna coil 2 are multiply wound, they are formed thick.

FIG. 3 is a sectional view for explaining the outline of the embodiment of the present invention for each manufacturing process. Figure 3 (a) shows PE
On the inlet sheet 7 made of TG, PVC, etc.,
2 shows a state in which the winding jig 6 having completed the winding shown in FIG. 2 is aligned and made to face each other. The inlet sheet 7 is the original size,
Either punched size is acceptable.

FIG. 3B shows the state of FIG. 3A while pressing the pushing plate of the winding jig toward the inlet sheet 7 while pressing the antenna coil 2 and the connection terminal portion 2a by thermocompression bonding means. Shows a partially embedded state.

FIG. 3C shows a state in which the inlet sheet 7 in the state of FIG. 3B is sandwiched between the card base materials 1 and 21 and integrated. The inlet sheet 7 and the card base materials 1 and 21 may be joined by a general method using thermocompression bonding or a resin adhesive.

FIG. 3 (d) shows that from the surface of the card substrate 1,
It shows a state in which a recess 8 for fitting the IC module is formed by cutting using a milling machine or the like, and at the same time, a state in which the connection terminal portion 2a of the antenna coil is exposed. Here, since the connection terminal portion 2a has a structure in which the wall thickness is much thicker than in the conventional case, the precision of the cutting process of the recess 8 does not need to be strict.

FIG. 3E shows a conductive paste 9 on the exposed surface of the connection terminal portion 2a of the antenna coil 2 in the state of FIG. 3D.
After a fixed amount is applied using a dispenser, etc., the IC module 4 is opposed in a predetermined direction and the position is aligned. Here, the antenna terminal 34 of the IC module 4
And the connection terminal portion 2a of the antenna coil are positioned in the X-axis and Y-axis directions so as to overlap with each other with alignment accuracy within the tolerance range.

In FIG. 3 (f), the IC module 4 is fitted in the recess in the state of FIG. 3 (e) and the connection terminal portion 2a and the antenna terminal 34 are joined to complete a non-contact combination type IC card. The state where it was made to show is shown.

FIG. 4 is a sectional view for explaining the outline of another embodiment of the present invention. In this case, the thick metal plate 10 is provided on the surface of the connection terminal portion 2a of the antenna coil 2 immediately after the antenna coil is formed.
The purpose of increasing the thickness of a is exactly the same as that of the above-described embodiment.

The present invention is not limited to IC cards, but I
It is needless to say that the present invention can be applied to all similar non-contact information communication media including C tags. Further, in the above-described embodiment, the winding method using a metal wire is illustrated as an example of forming the antenna, but a printing method using a conductive paste or conductive ink, or a method of forming a metal film and selective etching, etc. It goes without saying that the present invention can be applied to a method of forming an antenna. That is, it is a feature of the present invention that the terminal terminal portion of the antenna coil is made thick to reduce the processing accuracy, the connection terminal portion can be exposed reliably, and the terminals can be joined more reliably.

[0027]

As described above, according to the non-contact communication medium and the method for manufacturing the same of the present invention, the connection terminal portion of the antenna coil can be reliably connected without strictly controlling the machining accuracy in the Z-axis direction. It can be joined to the antenna terminal of the IC module. As a result, the manufacturing is extremely easy, and the manufacturing yield is remarkably improved. As a result, it is possible to provide a low-cost and highly reliable non-contact communication medium.

[Brief description of drawings]

FIG. 1 is a perspective view showing an outline of a winding jig used for forming an antenna coil of the present invention.

FIG. 2 is a sectional view schematically showing a state where the winding of the antenna coil is completed using the winding jig of FIG.

FIG. 3 is a cross-sectional view illustrating the outline of an embodiment of the present invention for each manufacturing process.

FIG. 4 is a sectional view showing the outline of another embodiment of the present invention.

FIG. 5 is a plan view showing an outline of a basic structure of a conventional non-contact communication medium.

FIG. 6 is a plan view showing an outline of a basic structure of a conventional improved non-contact communication medium.

[Explanation of symbols]

1,21 card base material 2 antenna coil 2a, 5 Antenna coil connection terminals 4 IC module 6 winding jig 7 inlet sheet 8 recess 9 Conductive paste 10 metal plate 11 Thermosetting adhesive film 34 Antenna terminal (of IC module) 61 winding pin 62 push plate 63 Joint terminal pin

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01Q 7/00 G06K 19/00 H (72) Inventor Akihiro Takahashi 6-7 Koriyama, Taichiro-ku, Sendai-shi, Miyagi No. 1 Tokin Co., Ltd. F term (reference) 2C005 MA18 PA02 PA14 RA06 RA15 RA26 5B035 AA04 BA05 BB09 CA08 CA23 5J046 AA09 AA19 AB11 PA07

Claims (8)

[Claims] 1. A functional circuit composed of an IC module for processing or storing data, a signal exchange with an external device, a winding main body, and a connection terminal part which is connected to an antenna terminal of the IC module and serves as a terminal. In the non-contact communication medium including an antenna coil, the connection terminal portion of the antenna coil is formed thicker than the winding body portion. 2. The non-contact communication medium according to claim 1, wherein the antenna coil is made of a metal wire. 3. The non-contact communication medium according to claim 1, wherein the antenna coil is made of a conductive paste. 4. The contactless communication medium according to claim 1, wherein the antenna coil is made of metal foil. 5. The non-contact communication medium according to claim 2, wherein the connection terminal portion is formed by laminating at least two layers. 6. The non-contact communication medium according to claim 1, which is a combination type having both contact and non-contact functions. 7. A step of forming the antenna coil,
A step of partially embedding the antenna coil in the inlet sheet, a step of integrating the inlet sheet and the antenna coil with a card base material, and forming a recess on the surface of the card base material and exposing the connection terminal portion. And a step of fitting the IC module into the recess,
The method for manufacturing a non-contact communication medium according to claim 1, comprising a step of joining the connection terminal portion and an antenna terminal of the IC module. 8. A step of forming the antenna coil in a single layer, a step of partially embedding the antenna coil in an inlet sheet, a step of providing a metal plate on the surface of the connection terminal portion, the inlet sheet and the antenna coil. With a card base, a step of forming a recess on the surface of the card base and exposing the connection terminal portion, and fitting the IC module into the recess to connect the connection terminal and the IC. The method for manufacturing a non-contact communication medium according to any one of claims 1 to 4, further comprising a step of joining the antenna terminals of the module.