JP4259973B2 - Method for manufacturing RF-ID media - Google Patents

Description

  The present invention relates to an RF-ID medium in which an IC chip capable of writing and reading information in a non-contact state is mounted on a base substrate, and a manufacturing method thereof.

  In recent years, with the progress of the information-oriented society, information is recorded on a card, and information management and settlement using the card are performed.

  Cards used for such information management and settlement include IC cards with built-in IC chips and magnetic cards on which information is written by magnetism, and information is written and read using a dedicated device. Is called.

  Further, in the IC card, a contact type IC card that performs writing and reading of information by contacting a dedicated device, and a non-contact type IC that can perform writing and reading of information only by being brought close to the dedicated device. There is a card. These IC cards are higher in security than magnetic cards, have a large amount of writable information, and can use a single card for multiple purposes. Therefore, the popularity of the IC card is increasing. . Among them, in a non-contact type IC card, when writing or reading information, it is not necessary to take out the card and insert it into a dedicated device. A device for reading the received information is rapidly spreading.

  6A and 6B are diagrams showing an example of the structure of a conventional non-contact type IC card. FIG. 6A is a diagram showing an internal structure, and FIG. 6B is a cross-sectional view taken along line A-A 'shown in FIG.

  As shown in FIG. 6, the non-contact type IC card in this conventional example has an IC chip 511 that can write and read information from the outside on a resin sheet 515 and a connection terminal 514 of the IC chip 511. The current is supplied to the IC chip 511 by electromagnetic induction from an information writing / reading device (not shown) provided outside and connected to the IC chip 511, and writing and reading of information to and from the IC chip 511 are not performed. An inlet 510 on which a conductive antenna 512 for performing contact is formed is laminated so as to be sandwiched between core materials 520a and 520b and surface sheets 530a and 530b. Note that the IC chip 511 is bonded to the resin sheet 515 with an adhesive 516 in a state where the IC chip 511 is connected to the antenna 512 with the connection terminal 514.

  In the non-contact type IC card 500 configured as described above, a current flows through the antenna 512 by electromagnetic induction from the information writing / reading device by being brought close to the information writing / reading device provided outside. This current is supplied to the IC chip 511, whereby information is written from the information writing / reading device to the IC chip 511 in a non-contact state, or information written to the IC chip 511 is written / read out. Or read by the device.

  Here, in the non-contact type IC card 500 as described above, since it is mostly carried and used, there is a possibility that an external force is applied in the bending direction or an external force is concentrated on one point. If the external force is applied in the bending direction or the external force is concentrated on the IC chip 511, the IC chip 511 may be destroyed.

  Therefore, a technique has been considered that reduces the possibility that the IC chip is damaged by an external force by attaching a reinforcing plate to the IC chip. In this technology, a reinforcing plate made of metal or the like is pasted on the surface of the IC chip where no connection terminals are provided, thereby reinforcing the strength of the IC chip and breaking the IC chip when an external force is applied. (For example, refer to Patent Documents 1 and 2).

  Further, a technique has been considered in which reinforcing plates are provided on the front and back of the inlet in the area where the IC chip is mounted, thereby reducing the possibility that the IC chip is damaged by an external force.

  FIG. 7 is a view showing another structural example of a conventional non-contact type IC card.

  As shown in FIG. 7, the non-contact type IC card in this conventional example includes an IC chip 611 capable of writing and reading information from the outside on a resin sheet 615, and a connection terminal 614 of the IC chip 611. The current is supplied to the IC chip 611 by electromagnetic induction from an information writing / reading device (not shown) provided outside and connected to the IC chip 611, and writing and reading of information to and from the IC chip 611 are not performed. An inlet 610 in which a conductive antenna 612 for performing contact is formed is laminated so as to be sandwiched between core materials 620a and 620b and surface sheets 630a and 630b. In this conventional example, the IC chip 611 is covered with a sealing resin 616a, and a reinforcing plate 617a is provided on the surface of the sealing resin 616a. Also, on the surface opposite to the resin sheet 615, a region facing the IC chip 611 with the resin sheet 615 interposed therebetween is covered with the sealing resin 616b, and a reinforcing plate 617b is provided on the surface of the sealing resin 616b. (For example, see Patent Document 3).

In the non-contact type IC card 600 configured as described above, when an external force is applied in a direction in which the non-contact type IC card 600 is bent or an external force is applied intensively to the IC chip 611, the reinforcing plate 617a and 617b can reduce the possibility that the IC chip 611 is destroyed.
JP 2003-92303 A JP 2000-137781 A JP 2002-163624 A

  However, in the case where the strength of the IC chip is reinforced by attaching a reinforcing plate to the surface of the IC chip where no connection terminal is provided, an external force is applied to the IC chip from the side where the reinforcing plate is not attached. In other cases, or when an external force is applied in a direction in which the non-contact type IC card is folded so that the side on which the reinforcing plate is attached is inside, there is a problem that the IC chip is damaged.

  Also, in the case where the reinforcing plates are provided on the front and back of the inlet in the area where the IC chip is mounted, the distance between the two reinforcing plates and the IC chip is different from each other, so that the non-contact type IC card is bent. When an external force is applied, the stress neutral axis is displaced from the IC chip, and the IC chip may be damaged.

  FIG. 8 is a view for explaining a stress neutral axis in a state where an external force is applied in a direction in which the non-contact type IC card 600 shown in FIG. 7 is bent.

  As shown in FIG. 8, when an external force is applied in the direction in which the non-contact type IC card 600 shown in FIG. 7 is bent, the stress neutral axis substantially coincides with the center line between the two reinforcing plates 617a and 617b. To do. However, since the center line between the two reinforcing plates 617a and 617b is different from the region where the IC chip 611 is provided, when an external force is applied in the direction in which the non-contact type IC card 600 is bent, its stress neutral axis Is displaced from the IC chip 611, stress is applied to the IC chip 611, and the IC chip 611 may be damaged.

  Further, in the non-contact type IC card using the reinforcing plate as described above, the man-hours in the manufacturing process are such that the reinforcing plate is bonded to the individual IC chip or the individual inlet with an adhesive. Since this work is required, there is a problem that the manufacturing cost is greatly increased.

  The present invention has been made in view of the problems of the conventional technology as described above, and an external force is applied to the RF-ID media such as a non-contact type IC card in a bending direction. An RF-ID medium that can further reduce the possibility of damage to the IC chip when an external force is concentrated on the IC chip, and the manufacturing cost of the RF-ID medium is not significantly increased. An object of the present invention is to provide a method of manufacturing an RF-ID media that can be manufactured in a simple manner.

In order to achieve the above object, the present invention provides:
A conductive pattern is formed on the base substrate, and an IC chip capable of writing and reading information in a non-contact state is electrically connected to the conductive pattern by a connection terminal provided on the IC chip. state has at least an inlet that is configured is mounted on the base substrate, on both sides of the IC chip, the reinforcing so that the connection terminals avoid the area provided plate is directly attached by adhesive An RF-ID media manufacturing method comprising:
A wafer in which a plurality of the IC chips are arranged, and a shape that forms the reinforcing plate by being cut, and the connection terminals are exposed when the wafer is attached to a surface of the wafer where the connection terminals are provided. A first reinforcing sheet having a shape that covers the entire surface of the wafer by forming the reinforcing plate by being cut, and the first reinforcing sheet is disposed on the wafer. Affixing to the surface provided with connection terminals, and affixing each other by affixing the second reinforcing sheet to the surface of the wafer not provided with the connection terminals;
Cutting the bonded wafer and the first and second reinforcing sheets for each IC chip;
Mounting the IC chip with the reinforcing plate on the base substrate;
Connecting the IC chip mounted on the base substrate to the conductive pattern by the connection terminal.

Also, a conductive pattern is formed on the base substrate, and an IC chip capable of writing and reading information in a non-contact state is electrically connected to the conductive pattern by a connection terminal provided on the IC chip. At least an inlet configured to be mounted on the base substrate in a state of being formed, and a reinforcing plate made of metal is attached to both surfaces of the IC chip by an adhesive so as to avoid a region where the connection terminal is provided A reinforcing plate that is directly affixed and is affixed to the surface side on which the connection terminal is provided is a method for manufacturing an RF-ID media that is covered with a non-conductive material ,
The reinforcing plate is configured by being cut, and has a shape such that the connection terminal is exposed when the reinforcing chip is attached to a surface of the wafer on which the plurality of IC chips are arranged. Covering the entire surface of the reinforcing sheet with the non-conductive material;
The wafer, the first reinforcing sheet, the second reinforcing sheet that forms the reinforcing plate by being cut and covers the entire surface of the wafer, and the first reinforcing sheet as the first reinforcing sheet. Affixing to the surface of the wafer provided with the connection terminals, and attaching the second reinforcing sheet to the surface of the wafer not provided with the connection terminals;
Cutting the bonded wafer and the first and second reinforcing sheets for each IC chip;
Mounting the IC chip with the reinforcing plate on the base substrate;
Connecting the IC chip mounted on the base substrate to the conductive pattern by the connection terminal.

In addition, the wafer is provided with instruction information for cutting for each IC chip,
The second reinforcing sheet has an opening that allows at least a part of the instruction information to be visually recognized from the outside in a state of being attached to the wafer.

  In the present invention configured as described above, the reinforcing plates are attached to both sides of the IC chip mounted on the base substrate so as to avoid the area where the connection terminals of the IC chip are provided. -When an external force is applied to the ID medium in a bending direction or when an external force is concentrated on the IC chip, the possibility that the IC module is damaged is reduced. In particular, when an external force is applied in the direction in which the RF-ID media is bent, the stress neutral axis coincides with the IC chip because the reinforcing plates are attached to both sides of the IC chip, and the IC module. Is less likely to break.

  Even when the reinforcing plate is made of metal, the reinforcing plate and the connecting terminal or the resin sheet can be obtained by covering the reinforcing plate attached to the surface provided with the connecting terminal with a non-conductive material. There is no short circuit between the conductive pattern formed above.

  Further, in the above-described RF-ID media manufacturing method, when a reinforcing plate is formed by cutting a wafer in which a plurality of IC chips are arranged, and the wafer is attached to a surface provided with connection terminals of the wafer. A first reinforcing sheet having a shape that exposes the connection terminals, and a second reinforcing sheet that has a shape that forms a reinforcing plate by being cut and covers the entire surface of the wafer. Is attached to the surface of the wafer where the connection terminals are provided, and the second reinforcing sheet is attached to the surface of the wafer where the connection terminals are not provided. If the first and second reinforcing sheets are cut for each IC chip, even if a reinforcing plate is attached to the IC chip, the RF-ID does not increase significantly. It is possible to manufacture the media.

  In addition, when instruction information for cutting each IC chip is provided on the wafer, at least a part of the instruction information can be visually recognized from the outside in a state of being attached to the wafer on the first reinforcing sheet. If the opening is provided, the instruction information provided on the wafer can be visually recognized from the outside even after the first and second reinforcing sheets are pasted on the wafer. Each IC chip can be cut.

  As described above, in the present invention, a conductive pattern is formed on a base substrate, and an IC chip capable of writing and reading information in a non-contact state is provided by a connection terminal provided on the IC chip. In an RF-ID medium having at least an inlet mounted on a base substrate in a state of being electrically connected to a conductive pattern, a region where connection terminals are provided on both sides of the IC chip is avoided. As a result, the IC module is damaged when an external force is applied to the RF-ID media in the bending direction or when an external force is applied intensively to the IC chip. It is possible to reduce the possibility that the In particular, when an external force is applied in the direction in which the RF-ID media is bent, the stress neutral axis coincides with the IC chip because the reinforcing plates are attached to both sides of the IC chip, and the IC module. Can be reduced.

  Further, in the case where the reinforcing plate is made of metal and the reinforcing plate attached to the surface side on which the connection terminal is provided is covered with a non-conductive material, the reinforcing plate and the connection terminal or the resin sheet It is possible to prevent a short circuit with the conductive pattern formed thereon.

  Further, in the above-described RF-ID media manufacturing method, when a reinforcing plate is formed by cutting a wafer in which a plurality of IC chips are arranged, and the wafer is attached to a surface provided with connection terminals of the wafer. A first reinforcing sheet having a shape that exposes the connection terminals, and a second reinforcing sheet that has a shape that forms a reinforcing plate by being cut and covers the entire surface of the wafer. Is attached to the surface of the wafer where the connection terminals are provided, and the second reinforcing sheet is attached to the surface of the wafer where the connection terminals are not provided. If the first and second reinforcing sheets are cut for each IC chip, even if a reinforcing plate is attached to the IC chip, the RF-ID does not increase significantly. It is possible to manufacture the media.

  In addition, when instruction information for cutting each IC chip is provided on the wafer, at least a part of the instruction information can be visually recognized from the outside in a state of being attached to the wafer on the first reinforcing sheet. If the opening is provided, the instruction information provided on the wafer can be visually recognized from the outside even after the first and second reinforcing sheets are pasted on the wafer. Each IC chip can be cut.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a diagram showing an example of a non-contact type IC card which is an embodiment of the RF-ID media of the present invention, (a) is a diagram showing an internal structure, and (b) is shown in (a). FIG. 8C is a cross-sectional view taken along line AA ′, and FIG. 8C is a view showing a positional relationship between the shape of the reinforcing plate 117b shown in FIGS.

  In this embodiment, as shown in FIG. 1, an IC chip 111 capable of writing and reading information from the outside is mounted on a resin sheet 115 as a base substrate, and via a connection terminal 114 of the IC chip 111. The IC chip 111 is connected to the IC chip 111, current is supplied to the IC chip 111 by electromagnetic induction from an information writing / reading device (not shown) provided outside, and information is written to and read from the IC chip 111 in a non-contact state. The inlet 110 formed with the antenna 112, which is a conductive pattern for performing the above, is laminated to be sandwiched between the core materials 120a and 120b and the top sheets 130a and 130b. In this embodiment, the reinforcing plate 117a is affixed to the surface of the IC chip 111 where the connection terminal 114 is not provided, and the connection terminal 114 is connected to the surface of the IC chip 111 where the connection terminal 114 is provided. A reinforcing plate 117b having an opening 118 that is exposed is affixed so that the connection terminal 114 is exposed from the opening 118. The IC chip 111 is bonded to the resin sheet 115 with an adhesive 116 in a state where the IC chip 111 is connected to the antenna 112 through the connection terminal 114.

  In the non-contact type IC card 100 configured as described above, a current flows through the antenna 112 by electromagnetic induction from the information writing / reading device by being brought close to the information writing / reading device provided outside. This current is supplied to the IC chip 111, whereby information is written from the information writing / reading device to the IC chip 111 in a non-contact state, and information written to the IC chip 111 is written / read. Or read by the device.

  Below, the manufacturing method of the non-contact type IC card 100 mentioned above is demonstrated.

  FIG. 2 is a diagram for explaining a method of manufacturing the non-contact type IC card 100 shown in FIG.

  First, the coil-shaped antenna 112 is formed on the resin sheet 115 by etching or printing (FIG. 2A).

  For the IC chip 111, after forming the connection terminals 114 on one surface, the reinforcing plate 117a is attached to the surface where the connection terminals 114 are not formed, and the surface on which the connection terminals 114 of the IC chip 111 are formed. A reinforcing plate 117b is attached so that the connection terminal 114 is exposed from the opening 118 (FIG. 2B).

  Here, the IC chip 111 is configured by cutting a wafer composed of a plurality of IC chips 111. Hereinafter, a process of attaching the reinforcing plates 117a and 117b to the IC chip 111 will be described in detail.

  FIG. 3 is a diagram for explaining a process of attaching the reinforcing plates 117a and 117b to the IC chip 111 in the manufacturing process of the non-contact type IC card 100 shown in FIG. The figure which shows the wafer which becomes, (b) is a figure which shows the reinforcement sheet affixed on the surface in which the connection terminal 114 of the wafer shown to (a) is not provided, (c) is the connection of the wafer shown to (a) The figure which shows the reinforcement sheet affixed on the surface in which the terminal 114 is provided, (d) is the figure which shows the state which affixed the reinforcement sheet shown in (b) on the wafer shown in (a), (e) The figure which shows the state which affixed the reinforcement sheet | seat shown to (c) on the wafer shown to (a), (f) is a figure which shows the state by which the wafer shown to (e) was cut | disconnected for every IC chip 111. .

  In this embodiment, first, as shown in FIG. 3A, connection terminals 114 are formed on a resin sheet, and a wafer 101 composed of a plurality of IC chips 111 is manufactured. Note that the thickness of the wafer 101 is adjusted by polishing the surface of the resin sheet on which the connection terminals 114 are not formed after the connection terminals 114 are formed. Further, a dicing line 102 that is instruction information that becomes a cutting line when the wafer 101 is cut for each IC chip 111 is formed on the resin sheet.

  As shown in FIG. 3B, the second reinforcing sheet 107a constituting the reinforcing plate 117a attached to the surface of the IC chip 111 where the connection terminals 114 are not provided covers the entire surface of the wafer 101. Part of the dancing line 102 formed on the wafer 101 when it is made of a metal such as stainless steel (SUS material) or high carbon material (SK material) and attached to the wafer 101. The opening 103 is formed so as to be visible from the outside.

  Further, as shown in FIG. 3C, the first reinforcing sheet 107b constituting the reinforcing plate 117b attached to the surface of the IC chip 111 where the connection terminals 114 are provided covers the entire surface of the wafer 101. For example, when formed on a metal such as stainless steel (SUS material) or high carbon material (SK material) and affixed to the wafer 101, the connection terminals 114 formed on the wafer 101 are exposed. Such an opening 118 is formed. Further, after forming the opening 118, the entire surface of the reinforcing sheet 107b is covered with a non-conductive material made of, for example, a polyimide film.

  Note that the openings 103 and 118 on the reinforcing sheets 107a and 107b can be formed by etching. In that case, for example, first, a resist layer is laminated on the reinforcing sheets 107a and 107b, masking is performed in accordance with the shapes of the openings 103 and 118, and exposure is performed in this state, so that an unmasked region is formed. The resist layer is removed. Thereafter, the masking is removed and etching is performed, so that the openings 103 and 118 are formed in the region where the resist layer is removed.

  Next, the reinforcing sheet 107a shown in FIG. 3 (b) is affixed to the surface of the wafer 101 shown in FIG. 3 (a) where the connection terminals 114 are not formed, and the wafer shown in FIG. 3 (a). A reinforcing sheet 107b shown in FIG. 3C is affixed to the surface on which the connection terminal 114 of 101 is formed. The wafer 101 and the reinforcing sheets 107a and 107b are bonded using, for example, an epoxy adhesive or a rubber adhesive.

  Then, as shown in FIG. 3D, on the surface side of the wafer 101 where the connection terminals 114 are not formed, the entire surface of the wafer 101 is covered with the reinforcing sheet 107a, and the dicing line 102 formed on the wafer 101 is formed. A part can be visually recognized from the outside through the opening 103 formed in the reinforcing sheet 107a.

  Further, as shown in FIG. 3E, on the surface side of the wafer 101 where the connection terminals 114 are formed, the entire surface of the wafer 101 is covered with the reinforcing sheet 107b and the connection terminals formed on the wafer 101. 114 is exposed from the opening 118 formed in the reinforcing sheet 107b.

  Thereafter, when the wafer 101 to which the reinforcing sheets 107a and 107b are attached is cut for each IC chip 111 with a dicing cutter or the like, the connection terminals 114 are provided on the surface provided with the connection terminals 114 as shown in FIG. As a result, the IC chip 111 to which the reinforcing plate 107b is attached so that is exposed from the opening 118 is completed.

  The IC chip 111 thus manufactured is placed on the resin sheet 115 via the adhesive 116 so that the connection terminal 114 of the IC chip 111 abuts the connection portion of the antenna 112 with the IC chip 111. It is mounted (FIG. 2 (c)).

  Next, when pressure is applied to the IC chip 111 in a heated state, the shape of the connection terminal 114 provided on the back surface of the IC chip 111 is displaced, and the antenna 112 and the IC chip are connected via the connection terminal 114. 111 is electrically connected, and the IC chip 111 and the resin sheet 115 are bonded together by the adhesive 116 to complete the inlet 110 (FIG. 2D). Here, when pressure is applied to the IC chip 111, the distance between the IC chip 111 and the resin sheet 115 is reduced with the displacement of the shape of the connection terminal 114, but the thickness of the reinforcing plate 107b is reduced. If the antenna 112 is thicker than the antenna 112 and thinner than the sum of the thickness of the antenna 112 and the length of the connection terminal 114, the distance between the IC chip 111 and the resin sheet 115 is set to the reinforcing plate 107b. Is controlled by contacting the resin sheet 115, the lower surface of the IC chip 111 is not in contact with the antenna 112, and the connection terminal 114 is connected to the antenna 112.

  Thereafter, the core materials 120a and 120b and the surface sheets 130a and 130b are laminated so as to sandwich the inlet 110, thereby completing the non-contact type IC card 100 (FIG. 2E).

  In the non-contact type IC card 100 as described above, when an external force is applied in a direction in which the non-contact type IC card 100 is bent or an external force is concentrated on the IC chip 111, the reinforcing plates 117a and 117b are used. Therefore, the possibility that the IC chip 111 is destroyed can be reduced.

  FIG. 4 is a diagram for explaining the operation when an external force is applied in the direction in which the non-contact type IC card 100 shown in FIG. 1 is bent.

  As shown in FIG. 4, when an external force is applied in the direction in which the non-contact type IC card 100 shown in FIG. 1 is bent, the stress neutral axis substantially coincides with the center line between the two reinforcing plates 117a and 117b. To do. In this embodiment, since the two reinforcing plates 117a and 117b are attached to the front and back of the IC chip 111, the stress neutral axis when an external force is applied in the direction in which the non-contact type IC card 100 is bent is , Which is almost the same as the IC chip 111. Therefore, when an external force is applied in the direction in which the non-contact type IC card 100 is bent, the possibility that the IC chip 111 is damaged can be reduced. Further, the IC chip 111 can be disposed near the center in the thickness direction of the non-contact type IC card 100. With this, when an external force is applied in the direction in which the non-contact type IC card 100 is bent, the IC chip The possibility that 111 will be damaged can be reduced.

  Further, as described above, after the reinforcing sheets 107a and 107b constituting the reinforcing plates 117a and 117b are attached to the wafer 101 in which a plurality of IC chips 111 are arranged, the wafer 101 and the reinforcing sheets 107a and 107b are attached to the IC chip 111. Since the IC chip 111 to which the reinforcing plates 117a and 117 are attached is manufactured by cutting each time, even when the reinforcing plates 117a and 117b are attached to the IC chip 111, the manufacturing cost is not significantly increased. The non-contact type IC card 100 can be manufactured.

  In this embodiment, the reinforcing plate 117b is provided with an opening 118 that exposes the connection terminal 114 when the reinforcing plate 117b is attached to the IC chip 111. However, the reinforcing plate 117b The shape is such that the connection terminal 114 is exposed when the reinforcing plate 117b is attached to the IC chip 111, and the reinforcing plate 117b is attached to the IC chip 111 so as to avoid the region where the connection terminal 114 is provided. In this case, the opening 118 is not necessarily provided.

  FIG. 5 is a view showing another example of an IC chip used for the RF-ID medium of the present invention, as seen from the surface side on which the connection terminals are formed.

  As shown in FIG. 5, a reinforcing plate 217 having a line shape that is perpendicular to the line connecting the two connection terminals 114 is pasted between the two connection terminals 114 provided on the IC chip 111. It can also be considered.

  In this embodiment, the metal is exemplified as the material constituting the reinforcing plates 117a and 117b. However, the material constituting the reinforcing plates 117a and 117b is limited to metal as long as it has a predetermined strength. It is not a thing. When the reinforcing plates 117a and 117b are made of a nonconductive material, it is not necessary to coat the reinforcing plate 117b with a nonconductive material.

  In this embodiment, a non-contact type IC card has been described as an example of an RF-ID medium capable of writing and reading information in a non-contact state. However, the present invention is not limited to a non-contact type IC card. First, any non-contact type IC label or non-contact type IC tag can be used as long as it includes an inlet in which an IC chip is mounted on a resin sheet.

It is a figure which shows an example of the non-contact-type IC card which is one Embodiment of RF-ID media of this invention, (a) is a figure which shows an internal structure, (b) is AA shown to (a). 'Cross sectional view, (c) is a diagram showing the positional relationship between the shape of the reinforcing plate shown in (a) and (b) and the connection terminals of the IC chip. It is a figure for demonstrating the manufacturing method of the non-contact-type IC card shown in FIG. It is a figure for demonstrating the sticking process of the reinforcement board with respect to IC chip in the manufacturing process of the non-contact-type IC card shown in FIG. 1, (a) is a figure which shows the wafer which consists of several IC chip, (b) is The figure which shows the reinforcement sheet affixed on the surface in which the connection terminal of the wafer shown to (a) is not provided, (c) is affixed on the surface in which the connection terminal of the wafer shown to (a) is provided. The figure which shows a reinforcement sheet, (d) is the figure which shows the state which affixed the reinforcement sheet shown in (b) on the wafer shown in (a), (e) is the wafer shown in (a) in (c) The figure which shows the state which affixed the shown reinforcement sheet, (f) is a figure which shows the state by which the wafer shown to (e) was cut | disconnected for every IC chip. It is a figure for demonstrating an effect | action when external force is added to the direction in which the non-contact-type IC card shown in FIG. 1 bends. It is a figure which shows the other example of the IC chip used for RF-ID media of this invention. It is a figure which shows one structural example of the conventional non-contact-type IC card, (a) is a figure which shows an internal structure, (b) is A-A 'sectional drawing shown to (a). It is a figure which shows the other structural example of the conventional non-contact-type IC card. It is a figure for demonstrating the stress neutral axis in the state in which the external force was added to the direction in which the non-contact-type IC card shown in FIG. 7 is bent.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Non-contact type IC card 101 Wafer 102 Dicing line 103, 118 Opening part 107a, 107b Reinforcement sheet 110 Inlet 111 IC chip 112 Antenna 114 Connection terminal 115 Resin sheet 116 Adhesive 117a, 117b, 217 Reinforcement plate 120a, 120b Core material 130a 130b Surface sheet

Claims (3)

A conductive pattern is formed on the base substrate, and an IC chip capable of writing and reading information in a non-contact state is electrically connected to the conductive pattern by a connection terminal provided on the IC chip. state has at least an inlet that is configured is mounted on the base substrate, on both sides of the IC chip, the reinforcing so that the connection terminals avoid the area provided plate is directly attached by adhesive An RF-ID media manufacturing method comprising:
A wafer in which a plurality of the IC chips are arranged, and a shape that forms the reinforcing plate by being cut, and the connection terminals are exposed when the wafer is attached to a surface of the wafer where the connection terminals are provided. A first reinforcing sheet having a shape that covers the entire surface of the wafer by forming the reinforcing plate by being cut, and the first reinforcing sheet is disposed on the wafer. Affixing to the surface provided with connection terminals, and affixing each other by affixing the second reinforcing sheet to the surface of the wafer not provided with the connection terminals;
Cutting the bonded wafer and the first and second reinforcing sheets for each IC chip;
Mounting the IC chip with the reinforcing plate on the base substrate;
A method of manufacturing an RF-ID medium, comprising: connecting an IC chip mounted on the base substrate to the conductive pattern by the connection terminal. A conductive pattern is formed on the base substrate, and an IC chip capable of writing and reading information in a non-contact state is electrically connected to the conductive pattern by a connection terminal provided on the IC chip. At least an inlet configured to be mounted on the base substrate in a state, and a reinforcing plate made of metal is directly attached to both surfaces of the IC chip with an adhesive so as to avoid the area where the connection terminals are provided is, the reinforcing plate in which the connecting terminal is attached to the surfaces which are made side provided with a method for manufacturing a RF-ID media being covered by non-conductive material,
The reinforcing plate is configured by being cut, and has a shape such that the connection terminal is exposed when the reinforcing chip is attached to a surface of the wafer on which the plurality of IC chips are arranged. Covering the entire surface of the reinforcing sheet with the non-conductive material;
The wafer, the first reinforcing sheet, the second reinforcing sheet that forms the reinforcing plate by being cut and covers the entire surface of the wafer, and the first reinforcing sheet as the first reinforcing sheet. Affixing to the surface of the wafer provided with the connection terminals, and attaching the second reinforcing sheet to the surface of the wafer not provided with the connection terminals;
Cutting the bonded wafer and the first and second reinforcing sheets for each IC chip;
Mounting the IC chip with the reinforcing plate on the base substrate;
A method of manufacturing an RF-ID medium, comprising: connecting an IC chip mounted on the base substrate to the conductive pattern by the connection terminal. In the manufacturing method of RF-ID media of Claim 1 or Claim 2 ,
The wafer is provided with instruction information for cutting for each IC chip,
The method of manufacturing an RF-ID medium, wherein the second reinforcing sheet has an opening that allows at least a part of the instruction information to be visually recognized from the outside in a state of being attached to the wafer.

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