JP2003288568A - Contactless ic label - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To protect an IC module while suppressing a rise in cost without making a part where the IC module is mounted thicker even when external force is applied while the IC module is stuck on an article. <P>SOLUTION: An adhesive layer 150 is laminated on the surface of an inlet 110 where the IC module 111 is mounted and the surface is stuck on an article; and a reinforcing member 113 for protecting the IC module 111 is mounted on the surface of the inlet 110 where the adhesive layer 150 is laminated so that the IC module 111 is put in a hole formed inside. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC label which is mounted with an IC module capable of writing and reading information in a non-contact state and can be attached to an article or the like.

[0002]

2. Description of the Related Art In recent years, with the development of an information-oriented society, information is recorded on a card, and information management and payment using the card are performed. In addition, information is recorded on a label attached to a product or the like, and management of the product or the like is performed using this label.

In information management using such a card or label, a non-contact type IC card equipped with an IC capable of writing and reading information in a non-contact state with the card or label, The non-contact type IC label is rapidly spreading due to its excellent convenience.

FIG. 8 is a diagram showing an example of the structure of a conventional non-contact type IC label, FIG. 8 (a) is a view showing the internal structure,
(B) is a cross-sectional view taken along the line AA ′ shown in (a).

As shown in FIG. 8, the non-contact type IC label in this conventional example is an IC module 61 capable of writing and reading information from the outside on a resin sheet 615.
1 is mounted and is connected to the IC module 611 via the contact 614, and information writing / writing provided externally
An inlet 6 formed with a conductive antenna 612 for supplying current to the IC module 611 by electromagnetic induction from a reading device (not shown) to write and read information to and from the IC module 611 in a non-contact state.
10, and a surface sheet 630 which is laminated on the surface of the inlet 610 on which the IC module 611 is mounted via an adhesive layer 640 to protect the IC module 611 and the antenna 612, and on which information is printed.
The pressure-sensitive adhesive layer 650 is formed by laminating a release paper 620 on the surface of the inlet 610 on which the IC module 611 is not mounted.

In the non-contact type IC label 600 configured as described above, the antenna 612 is moved from the antenna 612 by electromagnetic induction from the information writing / reading device when it is brought close to the information writing / reading device provided outside. IC module 6
11 is supplied with a current, so that in the non-contact state, the information writing / reading device writes information to the IC module 611 and the information writing / reading device reads the information written in the IC module 611. To do.

In such a non-contact type IC label 600, the release paper 620 is peeled from the adhesive layer 650,
Although it is attached to a product or the like via the adhesive layer 650, if pressure is applied to the non-contact type IC label 600 from the surface sheet 630 side in a state of being attached to the product or the like, the IC module 611 may be destroyed. The IC module 611 and the antenna 612 may be disconnected at the contact 614.

Therefore, the IC module 611 is covered with a reinforcing member, whereby the IC module 611 is destroyed when pressure is applied to the non-contact type IC label 600 from the surface sheet 630 side in a state of being attached to a product or the like. It is considered to reduce the possibility that the IC module 611 and the antenna 612 will be disconnected at the contact 614.

FIG. 9 is a view showing another example of the structure of a conventional non-contact type IC label, FIG. 9 (a) is a view showing the internal structure,
(B) is a cross-sectional view taken along the line AA ′ shown in (a).

As shown in FIG. 9, the non-contact type IC label in this conventional example is an IC module 71 capable of writing and reading information from the outside on a resin sheet 715.
1 is mounted and is connected to the IC module 711 via a contact 714, and is used for writing / writing information externally provided.
An inlet 7 formed with a conductive antenna 712 for supplying current to the IC module 711 by electromagnetic induction from a reading device (not shown) to write and read information to and from the IC module 711 in a non-contact state.
10, and a surface sheet 730 laminated on the surface of the inlet 710 on which the IC module 711 is mounted via an adhesive layer 740 to protect the IC module 711 and the antenna 712 and to print information on the surface thereof.
The pressure-sensitive adhesive layer 750 is formed by laminating a release paper 720 on the surface of the inlet 710 on which the IC module 711 is not mounted. Furthermore, I
The C module 711 is covered with the sealing resin 716 on the upper surface and the periphery thereof.
A disk-shaped reinforcing member 713 made of metal is mounted on the top.

In the non-contact type IC label 700 configured as described above, the upper surface and the periphery of the IC module 711 are covered with the sealing resin 716, and the sealing resin 716 has a disk shape. By providing the reinforcing member 713, when pressure is applied from the surface sheet 730 side in a state where the non-contact type IC label 700 is attached to a product or the like, the IC module 711
The possibility that the IC module 711 and the antenna 712 will be broken at the contact point 714 will be reduced.

[0012]

In the conventional non-contact type IC label as described above, since the reinforcing member is mounted on the IC module via the sealing resin, the reinforcing member is mounted. The thickness of a part becomes thicker than the thickness of other parts, air bubbles are mixed between layers in the lamination process, the flatness on the surface sheet is impaired, and the printability on the surface sheet is reduced. There is a problem of being chilled.

Further, since the reinforcing member is mounted on the IC module, there is a problem that the pressure control must be precisely performed so that the IC module is not damaged by the pressure when mounting the reinforcing member. .

Further, in the encapsulating resin for mounting the reinforcing member on the IC module, a thermosetting resin having a small heat shrinkage after curing is usually used in order to protect the IC module from an external force. However, such a sealing resin having a small heat shrinkage is expensive, and if stress is applied after curing, the mounted portion of the IC module may peel off. In addition, expensive equipment for accurately dropping the sealing resin onto the IC module is required.

The present invention has been made in view of the problems of the above-mentioned conventional techniques, and is a portion on which an IC module is mounted when an external force is applied in a state of being attached to an article. It is an object of the present invention to provide a non-contact type IC label that can protect an IC module without increasing the thickness of the IC module while suppressing an increase in cost.

[0016]

In order to achieve the above object, the present invention provides an IC capable of writing and reading information.
A pressure-sensitive adhesive layer is laminated on a base material on which a module is mounted and which is connected to the IC module and on which an antenna for writing and reading information to and from the IC module is formed in a non-contact state is laminated. In a non-contact type IC label configured to be attached to an article by an agent layer, the adhesive layer is laminated on a surface of the base substrate on which the IC module is mounted,
A C module having a shape adjacent to at least two sides of the C module, the shape being mounted on the base substrate so as to be adjacent to at least two sides of the IC module;
It has a reinforcing member adhered to the base material by the adhesive layer.

Further, the reinforcing member is shaped so as to be adjacent to four sides of the IC module.

Further, the antenna is characterized in that it is formed so as to include an outer peripheral shape of the reinforcing member in a region where the reinforcing member is mounted.

Further, the reinforcing member has a shape such that it is not mounted in a region where the antenna is formed in a region adjacent to the IC module.

The height of the reinforcing member with respect to the base substrate when mounted on the base substrate is the height of the IC module when the IC module is mounted on the base substrate. It is characterized by having a thickness that is higher than the height.

(Operation) In the present invention configured as described above, the surface of the base material on which the IC module is mounted becomes the surface on which the adhesive layer is laminated and adhered to the article, and A reinforcing member having a shape adjacent to at least two sides of the IC module is mounted on the surface of the base material on which the adhesive layer is laminated so as to be adjacent to at least two sides of the IC module. Since it is adhered to the base material, even if an external force is applied to the non-contact type IC label with the non-contact type IC label attached to the article, the IC module of the base material is mounted. The external side does not apply external force, which may damage the IC module or disconnect the IC module and the antenna at the contact point. Potential is reduced. Here, in the present invention, since the reinforcing member is mounted on the base substrate so as to be adjacent to at least two sides of the IC module,
Even when the reinforcing member for protecting the IC module is mounted on the base material, the thickness of the portion where the IC module is mounted does not become thicker than other portions,
The flatness of the surface is improved, and it is not necessary to precisely control the pressure when mounting the reinforcing member on the base material.

Further, if the reinforcing member is shaped so as to be adjacent to the four sides of the IC module, then the I
The C module can be protected.

Further, by forming the antenna so as to include the outer peripheral shape of the reinforcing member in the region where the reinforcing member is mounted, the possibility that the antenna will be disconnected due to the reinforcing member can be reduced.

If the reinforcing member is shaped so as not to be mounted in the area where the antenna is formed in the area adjacent to the IC module, the reinforcing member will not damage the antenna.

In addition, the thickness of the reinforcing member is the height of the reinforcing member with respect to the base substrate when the reinforcing member is mounted on the base substrate, and the height of the IC module when the IC module is mounted on the base substrate. If the height of the module is higher than that of the module, the non-contact type I attached to the article
When pressure is applied to the entire surface of the C label, the IC module can be more surely protected.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIG. 1 is a view showing a first embodiment of a non-contact type IC label of the present invention.
(A) is a diagram showing the internal structure, (b) is the A shown in (a)
It is sectional drawing in a -A 'part.

In this embodiment, as shown in FIG. 1, a resin sheet 1
An IC module 111 capable of writing and reading information from the outside is mounted on 15 via an adhesive 116, and the IC module 1 via a contact 114.
11 is connected to the IC module 111 by electromagnetic induction from an information writing / reading device (not shown) provided outside.
An electric current is supplied to the IC module 111 to perform writing and reading of information to and from the IC module 111 in a non-contact state. The inlet 110 is a base member on which a conductive antenna 112 is formed, and the IC module 1 of the inlet 110.
The pressure sensitive adhesive layer 150 is laminated on the surface on which the release paper 11 is mounted with the release paper 120 attached. Further, in the area where the IC module 111 is mounted, a disc-shaped reinforcing member 113 having holes formed by the sides that are adjacent to the four sides of the IC module 111, and the IC module 111 is inserted into the holes. Is mounted on the resin sheet 115 and is adhered to the resin sheet 115 by the adhesive layer 150. In this reinforcing member 113, a metal having a large plastic deformation force having a spring characteristic represented by stainless steel, stainless spring steel, phosphor bronze plate, quenched ribbon steel, spring steel, or the like, a brass plate, a brass plate, or a copper plate is used. , An iron plate, duralumin, or other metal plate such as an alloy, and in terms of its thickness, the height with respect to the resin sheet 115 when mounted on the resin sheet 115 is the resin sheet 115.
IC module 1 mounted on top of which via adhesive 116
It is preferable that the height is higher than 11.

In the non-contact type IC label 100 configured as described above, the antenna 112 is moved from the antenna 112 by electromagnetic induction from the information writing / reading device when it is brought close to the information writing / reading device provided outside. IC module 1
11 is supplied with current, so that in the non-contact state, the information writing / reading device writes information to the IC module 111, and the information written in the IC module 111 is read by the information writing / reading device. To do.

The method of manufacturing the non-contact type IC label 100 as described above will be described below.

FIG. 2 is a diagram for explaining a method of manufacturing the non-contact type IC label 100 shown in FIG.

First, the coil-shaped antenna 112 is formed on the resin sheet 115 by etching or the like (FIG. 2A).

Next, the IC module 111 is mounted on the resin sheet 115 via the conductive adhesive 116 so that the IC module 111 is mounted on the antenna 112, and a predetermined pressure is applied to the IC module 111. As a result, the IC module 111 and the resin sheet 115 are adhered to each other with the adhesive 116, and the antenna 112 and the IC are attached at the contact points 114 provided on the back surface of the IC module 111.
The module 111 is electrically connected to the inlet 11
0 is completed (FIG. 2 (b)).

Next, the reinforcing member 113 is mounted on the resin sheet 115 so that the IC module 111 enters the hole provided inside (FIG. 2 (c)). Here, in the reinforcing member 113, as shown in FIG. 1A, holes formed by the sides adjacent to the four sides of the IC module 111 are formed, and the IC module 111 is formed in the holes. It is mounted on the resin sheet 115 so as to enter. Further, in order to prevent the resin sheet 115 and the antenna 112 from being damaged by the reinforcing member 113 when the reinforcing member 113 is mounted on the resin sheet 115, the edge portion of the reinforcing member 113 should be slightly rounded. Can also be considered.

Thereafter, the pressure-sensitive adhesive layer 150 to which the release paper 120 is attached is laminated on the surface of the inlet 110 on which the IC module 111 is mounted, and the reinforcing member 130 is bonded to the resin sheet 115 by the pressure-sensitive adhesive layer 150. The non-contact type IC label 100 is completed (FIG. 2 (d)).

In the non-contact type IC label 100 manufactured by the above process, the reinforcing member 113 for protecting the IC module 111 is provided with the inlet 1 so that the IC module 111 may be inserted into the hole formed inside.
Since it is mounted on the IC chip 10, even when the reinforcing member 113 for protecting the IC module 111 is provided, the flatness of the surface of the non-contact type IC label 100 can be ensured.

In this embodiment, the reinforcing member 113 is used.
A metal is used as a material for forming polyvinyl chloride, polypropylene, polyethylene, polycarbonate, acrylonitrile styrene, acrylonitrile butadiene styrene, nylon or polyamide, thermoplastic resin such as polyimide, epoxy resin, glass epoxy. It is also conceivable that the reinforcing member 113 is made of thermosetting plastic such as resin, paper phenol, or other insulating material such as a non-metal plate. In that case, the reinforcing member 113 is stronger than the reinforcing member 113 made of metal. However, the reinforcing member 113 eliminates the possibility that the antenna 112 is electrically short-circuited. Further, such a material can be supplied in the form of a sheet, and then the reinforcing member 113 can be easily shaped by punching or the like.

The method of using the non-contact type IC label 100 as described above will be described below.

FIG. 3 is a diagram for explaining a method of using the non-contact type IC label 100 shown in FIG.

When the non-contact type IC label 100 shown in FIG. 1 is attached to the article 160, the release paper 120 is peeled from the adhesive layer 150 as shown in FIG.
0 is the article 160 on which the IC module 111 is mounted.
The non-contact type IC by the pressure-sensitive adhesive layer 150 so as to be on the side.
The label 100 is attached to the article 160.

As described above, the non-contact type IC in this embodiment
In the label 100, the surface of the inlet 110 on which the IC module 111 is mounted is the surface to which the article 160 is attached, and the IC module 111 is the reinforcing member 11.
Since the non-contact type IC label 100 is attached to the article 160, even if an external force is applied, the side of the inlet 110 on which the IC module 111 is mounted is inserted. No external force is applied to the IC module 111,
The possibility that the IC module 111 is damaged or the IC module 111 and the antenna 112 are disconnected at the contact 114 is reduced.

In the shape of the reinforcing member 113,
As shown in FIG. 1, the inside is not limited to a cylindrical shape that is hollow along the shape of the IC module 111.

Regarding the shape of the hole and the shape of the outer peripheral portion of the reinforcing member 113, in addition to the shape shown in FIG. 1, the shape of the hole is circular, and the shape of the outer peripheral portion is a polygon such as a quadrangle. It is also possible that

(Second Embodiment) FIG. 4 is a view showing a second embodiment of the non-contact type IC label of the present invention.
(A) is a diagram showing the internal structure, (b) is the A shown in (a)
It is sectional drawing in a -A 'part.

In this embodiment, as shown in FIG. 4, the resin sheet 2
An IC module 211 capable of writing and reading information from the outside is mounted on 15 via an adhesive 216, and the IC module 2 via a contact 214.
11 is connected to the IC module 211 by electromagnetic induction from an information writing / reading device (not shown) provided outside.
To the IC module 211 of the inlet 210, which is a base member on which a conductive antenna 212 for supplying and reading information to and from the IC module 211 in a non-contact state is supplied.
The pressure sensitive adhesive layer 250 is formed by laminating the release paper 220 on the surface on which 11 is mounted. Further, in the area where the IC module 211 is mounted, holes are formed by the sides that are respectively adjacent to the four sides of the IC module 211, and the resin sheet 215 is formed.
A disk-shaped reinforcing member 213 formed by removing the portion where the antenna 212 is formed is mounted on the resin sheet 215 so that the IC module 111 enters the hole, and the adhesive layer 250 forms the resin sheet. It is glued to 215.

The non-contact type IC label 200 having the above-mentioned structure also has a release paper 2 when it is attached to an article.
20 is peeled off from the pressure-sensitive adhesive layer 250, and the pressure-sensitive adhesive layer 250 is attached to the article so that the surface of the inlet 210 on which the IC module 211 is mounted is on the article side, and the periphery of the IC module 211. To the reinforcing member 2
Since 13 is provided, the same effect as that described in the first embodiment is obtained, and in addition to the antenna described in the first embodiment, the antenna is provided on the resin sheet 215. The reinforcing member 2 is provided in the region where the 212 is formed.
Since the reinforcing member 213 does not exist, the antenna 212 is not damaged by the reinforcing member 213, and even when a metal is used for the reinforcing member 213, the reinforcing member 21
3 eliminates the possibility that the antenna 212 is electrically short-circuited.

By narrowing the width of the antenna 212 as much as possible between the region having the coil shape and the region connected to the IC module 211, the removed portion of the reinforcing member 213 can be made small. It is possible to suppress the decrease in strength of the reinforcing member 213 as much as possible.

(Third Embodiment) FIG. 5 is a view showing a third embodiment of the non-contact type IC label of the present invention.
(A) is a diagram showing the internal structure, (b) is the A shown in (a)
FIG. 7C is a cross-sectional view taken along the line -A ′, and FIG. 9C is a perspective view of the reinforcing member 313 shown in FIGS.

In this embodiment, as shown in FIG. 5, the resin sheet 3 is used.
An IC module 311 capable of writing and reading information from the outside is mounted on 15 via an adhesive 316, and the IC module 311 via a contact 314.
11 is connected to the IC module 311 by electromagnetic induction from an external information writing / reading device (not shown).
An electric current is supplied to the IC module 311 to perform writing and reading of information to and from the IC module 311 in a non-contact state. The inlet 310 is a base material on which a conductive antenna 312 is formed, and the IC module 3 of the inlet 310.
The pressure sensitive adhesive layer 350 is laminated on the surface on which the release paper 11 is mounted with the release paper 320 attached. Further, in the area where the IC module 311 is mounted, there are holes formed by the sides that are respectively adjacent to the four sides of the IC module 311, and the antenna 312 when mounted on the resin sheet 315. The disc-shaped reinforcing member 313 having the groove 318 formed in the opposing region is
The IC module 311 is mounted on the resin sheet 315 so as to enter the hole, and is adhered to the resin sheet 315 by the adhesive layer 350.

When the reinforcing member 313 is made of metal, the groove 318 is formed by a processing method such as half etching, cutting, or groove formation by embossing, or by the reinforcing member 3.
When 13 is made of resin, the reinforcing member 313 is processed by a processing method such as groove pressing by hot pressing, cutting, injection molding or the like.
Is formed. Further, the number of the grooves 318 is not limited to one, and two or more grooves may be formed depending on the shape of the antenna 312.

Even in the non-contact type IC label 300 having the above-mentioned structure, when it is attached to an article, the release paper 3
20 is peeled off from the pressure-sensitive adhesive layer 350, and the pressure-sensitive adhesive layer 350 is applied to the article so that the surface of the inlet 310 on which the IC module 311 is mounted faces the article, and the periphery of the IC module 311 To the reinforcing member 3
Since 13 is provided, the same effect as that described in the first embodiment is achieved, and further, in addition to the one described in the first embodiment, a reinforcing member is provided on the resin sheet 315. Even when 313 is mounted, the antenna 312 and the reinforcing member 313 formed on the resin sheet 315 are formed.
Since and do not come into contact with each other, the same effect as that shown in the second embodiment is obtained. Further, in contrast to the one described in the second embodiment, the reinforcing member 313 has no deleted portion, and therefore has excellent strength.

(Fourth Embodiment) FIG. 6 is a diagram showing a fourth embodiment of the non-contact type IC label of the present invention.
(A) is a diagram showing the internal structure, (b) is the A shown in (a)
It is sectional drawing in a -A 'part.

In this embodiment, as shown in FIG. 6, the resin sheet 4
An IC module 411 capable of writing and reading information from the outside is mounted on 15 via an adhesive 416, and the IC module 4 via a contact 414.
11 is connected to the IC module 411 by electromagnetic induction from an information writing / reading device (not shown) provided outside.
An electric current is supplied to the IC module 411 to perform writing and reading of information to and from the IC module 411 in a non-contact state. The inlet 410 is a base material on which a conductive antenna 412 is formed, and the IC module 4 of the inlet 410.
The pressure sensitive adhesive layer 450 is laminated on the surface on which the release paper 11 is mounted with the release paper 420 attached thereto. Further, in the area where the IC module 411 is mounted, a disk-shaped reinforcing member 413 having holes formed by the sides that respectively adjoin the four sides of the IC module 411, and the IC module 411 is inserted into these holes. Mounted on the resin sheet 415 and adhered to the resin sheet 415 by the adhesive layer 450. Further, in the antenna 412, the region where the reinforcing member 413 is mounted is the land portions 419a and 419b having a shape sufficient to include the outer peripheral shape of the reinforcing member 413.

In the non-contact type IC label constructed as described above, the reinforcing member 413 of the antenna 412 is used.
The land portions 419a and 419b having a shape sufficient to include the outer peripheral shape of the reinforcing member 413.
Therefore, the antenna 4 is
The possibility that 12 will be disconnected is reduced.

In the above-described embodiment, a reinforcing member having a hole into which the IC module is inserted is used, and the reinforcing member is mounted on the inlet so that the IC module is inserted into the hole. As described above, if the reinforcing member is arranged so as to be adjacent to at least two sides of the IC module, the IC module can be used when pressure is applied from the outside when the non-contact type IC label is attached to the article. The possibility that the IC module is damaged or the IC module and the antenna are disconnected at the contact is reduced.

(Fifth Embodiment) FIG. 7 is a view showing a non-contact type IC label according to a fifth embodiment of the present invention.
(A) is a diagram showing the internal structure, (b) is the A shown in (a)
It is sectional drawing in a -A 'part.

In this embodiment, as shown in FIG. 7, the resin sheet 5 is used.
An IC module 511 capable of writing and reading information from the outside is mounted on 15 via an adhesive 516, and the IC module 5 via a contact 514.
11 is connected to the IC module 511 by electromagnetic induction from an information writing / reading device (not shown) provided outside.
An electric current is supplied to the IC module 511 to write and read information to and from the IC module 511 in a non-contact state. The inlet 510 is a base material on which a conductive antenna 512 is formed, and the IC module 5 of the inlet 510.
The pressure sensitive adhesive layer 550 is laminated with the release paper 520 attached to the surface on which 11 is mounted. Further, in a region where the IC module 511 is mounted, a reinforcing member 513 having a shape adjacent to two sides of the IC module 511 is provided on the IC module 511.
It is mounted on the resin sheet 515 so as to be adjacent to the side and adhered to the resin sheet 515 by the adhesive layer 550.

In the non-contact type IC label 500 constructed as described above, the release paper 5 is attached when it is attached to an article.
20 is peeled off from the pressure-sensitive adhesive layer 550, and the pressure-sensitive adhesive layer 550 is attached to the article so that the surface of the inlet 510 on which the IC module 511 is mounted is the article side, and the IC module 511 is mounted. The reinforcing member 513 having a shape that is adjacent to two sides of the IC module 511 in the filled area is the IC module 511.
Since the non-contact type IC label 500 is mounted so as to be adjacent to the two sides of the inlet 510 even when an external force is applied in a state where the non-contact type IC label 500 is attached to the article, from the side where the IC module 511 of the inlet 510 is mounted. Does not apply an external force, which may damage the IC module 511, or the IC module 511 and the antenna 512.
The possibility that the and will be disconnected at the contact point 514 is reduced.

Needless to say, the present invention also includes a non-contact type IC label formed by combining the above-described embodiments.

[0060]

As described above, in the present invention,
An IC module capable of writing and reading information is mounted and connected to the IC module.
A non-contact type IC label configured such that an adhesive layer is laminated on a base substrate having an antenna for writing and reading information to and from a C module in a non-contact state, and the adhesive layer can be applied to an article. In, the pressure-sensitive adhesive layer is laminated on the surface of the base material on which the IC module is mounted, and has a shape that is adjacent to at least two sides of the IC module. Since the reinforcing member is mounted on the base material so as to be adjacent to the base material and is adhered to the base material by the adhesive layer, the non-contact type IC label can be used as a non-contact type IC label in a state of being attached to an article. When an external force is applied, the IC module does not have to be thickened in the portion where the IC module is mounted, and the cost increase can be suppressed, while the IC module It is possible to protect the.

Further, in the case where the shape of the reinforcing member is adjacent to the four sides of the IC module, the IC module can be protected more reliably.

Further, in the case where the antenna is formed so as to include the outer peripheral shape of the reinforcing member in the region where the reinforcing member is mounted, the possibility that the antenna will be disconnected due to the reinforcing member can be reduced. it can.

Further, in the case where the shape of the reinforcing member is such that it is not mounted in the area adjacent to the IC module where the antenna is formed, the reinforcing member will not damage the antenna.

The thickness of the reinforcing member is the height of the reinforcing member with respect to the base substrate when the reinforcing member is mounted on the base substrate, and the height of the IC module when the IC module is mounted on the base substrate. If the height of the module is higher than the height of the module, the IC module can be more reliably protected when pressure is applied to the entire surface of the non-contact type IC label attached to the article.

[Brief description of drawings]

FIG. 1 is a diagram showing a first embodiment of a non-contact type IC label of the present invention, (a) showing an internal structure, and (b).
[Fig. 4] is a cross-sectional view taken along the line A-A 'shown in (a).

FIG. 2 is a diagram for explaining a manufacturing method of the non-contact type IC label shown in FIG.

FIG. 3 is a diagram for explaining a method of using the non-contact type IC label shown in FIG.

FIG. 4 is a diagram showing a second embodiment of a non-contact type IC label of the present invention, (a) showing an internal structure, and (b).
[Fig. 4] is a cross-sectional view taken along the line A-A 'shown in (a).

FIG. 5 is a diagram showing a third embodiment of the non-contact type IC label of the present invention, (a) showing an internal structure, and (b).
Is a cross-sectional view taken along the line AA ′ shown in (a), (c)
[Fig. 4] is a perspective view of the reinforcing member 313 shown in (a) and (b) as seen from the surface side mounted on the resin sheet 315.

FIG. 6 is a diagram showing a fourth embodiment of a non-contact type IC label of the present invention, (a) showing an internal structure, and (b).
[Fig. 4] is a cross-sectional view taken along the line A-A 'shown in (a).

FIG. 7 is a diagram showing a fifth embodiment of a non-contact type IC label of the present invention, (a) showing an internal structure, and (b).
[Fig. 4] is a cross-sectional view taken along the line A-A 'shown in (a).

FIG. 8 is a diagram showing an example of the structure of a conventional non-contact type IC label, (a) showing the internal structure, and (b) showing (a).
3 is a cross-sectional view taken along the line AA ′ shown in FIG.

9A and 9B are diagrams showing another example of the structure of a conventional non-contact type IC label, wherein FIG. 9A is a diagram showing an internal structure, and FIG. 9B is a cross section taken along the line AA ′ shown in FIG. 9A. It is a figure.

[Explanation of symbols]

100, 200, 300, 400, 500 Non-contact type IC label 110, 210, 310, 410, 510 Inlet 111, 211, 311, 411, 511 IC module 112, 212, 312, 412, 512 Antenna 113, 213, 313 , 413, 513 Reinforcing members 114, 214, 314, 414, 514 Contact points 115, 215, 315, 415, 515 Resin sheet 116, 216, 316, 416, 516 Adhesive agent 120, 220, 320, 420, 520 Release paper 150 , 250, 350, 450, 550 Adhesive layer 160 Article 318 Grooves 619a, 619b Land portion

Claims (5)

[Claims] 1. An I capable of writing and reading information
A C module is mounted, and an adhesive layer is laminated on a base substrate that is connected to the IC module and has an antenna for writing and reading information to and from the IC module in a non-contact state. Non-contact type IC configured to be attached to an article by an adhesive layer
In the label, the pressure-sensitive adhesive layer is laminated on a surface of the base substrate on which the IC module is mounted, and has a shape that is adjacent to at least two sides of the IC module. A non-contact type IC label having a reinforcing member which is mounted on the base substrate so as to be adjacent to at least two sides thereof and which is adhered to the base substrate by the adhesive layer. 2. The non-contact type IC label according to claim 1, wherein the reinforcing member has a shape adjacent to four sides of the IC module. 3. The non-contact type IC label according to claim 1, wherein the antenna is formed so as to include an outer peripheral shape of the reinforcing member in a region where the reinforcing member is mounted. A non-contact type IC label characterized by the following. 4. The non-contact type IC label according to claim 1, wherein the reinforcing member has a shape that is not mounted in a region in which the antenna is formed in a region adjacent to the IC module. Non-contact type IC label. 5. The non-contact type IC label according to claim 1, wherein the reinforcing member has a height with respect to the base substrate when mounted on the base substrate. A non-contact type IC label having a thickness that is higher than a height of the IC module when the IC module is mounted on the base substrate.