JP4163579B2 - Non-contact IC label - Google Patents

Description

  The present invention relates to a non-contact type IC label capable of writing and reading information in a non-contact state.

  In recent years, with the progress of the information-oriented society, information is recorded on a card, and information management and settlement using the card are performed. In addition, information is recorded on a label attached to a product or the like, and the product or the like is managed using the label.

  In information management using such a card or label, a non-contact type IC card or a non-contact type in which an IC chip capable of writing and reading information in a non-contact state on the card or label is mounted. Type IC labels are rapidly spreading due to their excellent convenience.

  5A and 5B are diagrams showing a configuration example of a conventional non-contact type IC label. FIG. 5A is a diagram showing an internal structure, and FIG. 5B is a cross-sectional view taken along line A-A ′ shown in FIG.

  In this conventional example, as shown in FIG. 5, an antenna 512 made of a coiled conductive material and a contact 513 made of a conductive material are formed on one surface of a base substrate 514 made of a resin sheet or the like. An IC chip 511 capable of writing and reading information from the outside in a non-contact state via the antenna 512 is mounted, and a bridge 517 made of a conductive material is formed on the other surface of the base substrate 514. The inlet 510 is laminated and configured to be sandwiched between a release sheet 540 and a surface sheet 530 on which information is printed on the surface while protecting the inlet 510 via the adhesive layers 520a and 520b. Yes. Note that one end of the antenna 512 is connected to the IC chip 511 via a contact 513, and the other end of the antenna 512 is front-to-back conductive formed by mechanically caulking the base substrate 514 from the front and back. The other end of the bridge 517 is connected to the contact point 513 via the front and back conductive part 516 formed in the same manner on the base substrate 514. Thus, a circuit including the antenna 512, the contact 513, the bridge 517, and the IC chip 511 is formed.

  In the non-contact type IC label 500 configured as described above, the release paper 540 is peeled off and attached to an article or the like by the adhesive layer 520b, and is attached to an information writing / reading device (not shown) provided outside. By bringing them close to each other, a current flows through the antenna 512 due to electromagnetic induction from the information writing / reading device, and this current is supplied to the IC chip 511 via the contact 513. Information is written to the IC chip 511 from the reading device, or information written to the IC chip 511 is read by the information writing / reading device.

  The non-contact type IC label 500 as described above needs to be prevented from being illegally reused after being attached to an article or the like and used.

  Here, in a label composed of two layers, the adhesive force of the adhesive layer for adhering the two layers is assumed to be weaker than that of the adhesive layer adhered to the article etc., and the label is affixed to the article etc. After that, when the label is peeled off from the article or the like, two layers are peeled off, and a technique for preventing the reuse of the label is considered (for example, see Patent Document 1).

  Further, a technique is considered in which an adhesive layer to be bonded to an article or the like is configured to foam by heating, thereby leaving a trace when the label attached to the article or the like is peeled off by heating (for example, , See Patent Document 2).

By using such technology, it is possible to prevent the non-contact type IC label affixed to the article etc. from being used by being peeled off from the article etc. and affixed to other articles etc. Can do.
JP-A-8-99377 JP 2003-147297 A

  However, in the case where the technique for preventing the reuse of the label as described above is applied to the non-contact type IC label 500 shown in FIG. 5, the non-contact type IC label attached to the article or the like is used. However, since only the top sheet 530 is peeled off from the article or the like, it is possible to prevent the non-contact type IC label 500 from being reused in a state of being stuck on the article or the like. Since the information can be written to and read from the IC chip 511, the IC chip can be used after the surface sheet 530 is peeled off from the article or after the inlet 510 is peeled off from the article or the like. There is a possibility that information written in 511 may be read.

  Further, with respect to the non-contact type IC label 500 shown in FIG. 5, one layer of the base material is provided between the base base material 514 and the release paper 540, and the adhesive force between the base material and the base base material 514 is provided. Is weaker than the adhesive strength between the base material and the release paper 540, the surface sheet 530 and the non-contact type IC label 500 used by being attached to the article etc. Since the inlet 510 is peeled off from the article or the like, the non-contact type IC label composed of the top sheet 530 and the inlet 510 cannot be reused as a label, but information is written to and read from the non-contact type IC label. Is in a state where it can be performed, so that information written on a non-contact type IC label peeled off from an article or the like can be read or this non-contact type IC label By or perform writing and reading of information for, there is a possibility that the non-contact type IC label peeled from the article or the like from being used illegally.

  The present invention has been made in view of the problems of the conventional techniques as described above, and it is easy to write and read information when it is peeled off from an article after being used by being attached to the article. It is an object of the present invention to provide a non-contact type IC label that can be eliminated.

In order to achieve the above object, the present invention provides:
The first conductive pattern on one surface of the base material, with the second conductive pattern on the other surface are formed on the surface of the first conductive pattern is formed of the base material An inlet on which an IC chip capable of writing and reading information in a non-contact state via the first conductive pattern is mounted; two adhesive layers stacked on both sides of the inlet; and the two It has at least a surface sheet bonded to the inlet via one adhesive layer among the adhesive layers, and the first conductive pattern and the second conductive pattern are formed on the base substrate. by being connected through the front and back conductive part provided, the IC chip contactless writing and reading of data in a non-contact state is enabled via the first conductive pattern to the I In the label,
The base substrate has a two-layer structure in which the base substrates are pseudo-bonded so as to be peeled from each other.

The first conductive pattern and the second conductive pattern each have a conductive region formed so as to face each other with the base substrate interposed therebetween.

  In the present invention configured as described above, when an attempt is made to peel off an article or the like after being affixed to the article or the like, the two-layer base substrates that are pseudo-bonded to each other are peeled from each other. Here, a conductive pattern is formed on the front and back surfaces of the base substrate, and an IC chip capable of writing and reading information in a non-contact state via the conductive pattern is mounted on one surface. The conductive patterns formed on the front and back surfaces of the base substrate are connected via the front and back conductive portions provided on the base substrate, so that the conductive patterns and IC formed on the front and back surfaces of the base substrate are connected. Since the circuit composed of the chip is formed, when the two-layer base substrate is peeled off from each other, the front and back conductive layers are cut, thereby forming the conductive pattern and IC formed on the front and back of the base substrate. A circuit comprising the chip is not formed, and information cannot be written or read.

  As described above, after the non-contact type IC label is peeled off from the article or the like after being affixed to the article or the like, information cannot be written to or read from the non-contact type IC label.

  In addition, conductive regions are provided on the conductive patterns formed on the front and back surfaces of the base substrate so as to face each other through the base substrate, and the resonance frequency of the non-contact type IC label is adjusted by the conductive regions. If configured, the two-layer base substrates are peeled from each other, and the conductive regions formed on the front and back surfaces of the base substrate are not opposed to each other, or the distance between the conductive regions changes. The resonant frequency of the type IC label changes, and information cannot be written or read.

  As described above, in the present invention, when a base material that is attached to an article or the like and then peeled off from the article or the like is peeled off from each other, the base substrates pseudo-bonded to each other are peeled from each other. Since the circuit composed of the conductive pattern formed on the substrate and the IC chip mounted on the base substrate is in a disconnected state, the non-contact type IC label is removed from the article after being used by being attached to the article. It is possible to make it impossible to write and read information with respect to the non-contact type IC label only by peeling.

  Also, conductive regions are provided on the conductive patterns formed on the front and back surfaces of the base substrate so as to face each other through the base substrate, and the resonance frequency of the non-contact type IC label is adjusted by the conductive regions. In the configuration, the two-layer base substrates are separated from each other, and the conductive regions formed on the front and back surfaces of the base substrate are not opposed to each other, or the distance between the conductive regions is changed without contact. The resonant frequency of the type IC label changes, and information writing and reading can be disabled.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
1A and 1B are diagrams showing a first embodiment of a non-contact type IC label according to the present invention. FIG. 1A is a diagram showing an internal structure, and FIG. 1B is a cross-sectional view taken along line AA ′ shown in FIG. FIG.

In this embodiment, as shown in FIG. 1, a coil-shaped first conductive material is formed on one surface of a base material 114a, 114b having a two-layer structure which is made of a pseudo-adhesive film or the like and is pseudo-adhered to each other. An antenna 112 and a contact point 113 to be a pattern are formed, and an IC chip 111 capable of writing and reading information from the outside in a non-contact state is mounted via the antenna 112, and base substrates 114a and 114b are mounted. The inlet sheet 110 on which the bridge 117 serving as the second conductive pattern is formed on the other surface of the sheet protects the inlet 110 via the adhesive layers 120a and 120b and the surface sheet on which information is printed. 130 and the release paper 140 are laminated so as to be sandwiched. Note that one end of the antenna 112 is connected to the IC chip 111 via the contact 113, and the other end of the antenna 112 is front-back conduction formed by mechanically caulking the base substrate 114 from the front and back. The other end of the bridge 117 is connected to the contact 113 via the front and back conducting portion 116 that is similarly formed on the base substrate 114. Thus, a circuit including the antenna 112, the contact 113, the bridge 117, and the IC chip 111 is formed. The base substrates 114a and 114b are made of, for example, materials having different melting points (for example, a communication sheet material described in JP-A-3-173695) and are heated and pressurized at a temperature due to the lower melting point. By doing so, they are bonded in a pseudo manner, whereby they are bonded in a peelable manner without providing an adhesive layer.

  Below, the usage method of the non-contact type IC label 100 comprised as mentioned above is demonstrated.

  In the non-contact type IC label 100 configured as described above, the release paper 140 is peeled off and affixed to an article or the like by the adhesive layer 120b, and is attached to an information writing / reading device (not shown) provided outside. By bringing them close to each other, a current flows through the antenna 112 by electromagnetic induction from the information writing / reading device, and this current is supplied to the IC chip 111 via the contact 113, so that in the non-contact state, the information writing / reading Information is written from the reading device to the IC chip 111, or information written to the IC chip 111 is read by the information writing / reading device.

  After the non-contact type IC label 100 is attached to an article or the like in this way, when the non-contact type IC label 100 is to be peeled off from the article or the like, the two-layer base substrates 114a and 114b are peeled from each other. Will be.

  FIG. 2 is a diagram showing a state where the non-contact type IC label 100 shown in FIG. 1 is peeled off from a state where it is stuck on an article or the like.

  When the non-contact type IC label 100 affixed to the article 150 is to be peeled off, the base materials 114a and 114b are peeled from each other because the two-layer base materials 114a and 114b are pseudo-bonded to each other. Beginning (FIG. 2 (a)), and thereafter, the base base materials 114a and 114b are peeled from each other, whereby the front and back conductive portions 116 formed on the base base materials 114a and 114b are cut (FIG. 2 (b)). As a result, the antenna 112 and the contact 113 formed on one surface of the base substrates 114a and 114b and the bridge 117 formed on the other surface of the base substrates 114a and 114b are electrically disconnected. A circuit including the antenna 112, the contact 113, the bridge 117, and the IC chip 111 is disconnected.

  In this state, information cannot be written to or read from the IC chip 111. Therefore, after the non-contact type IC label 100 attached to the article 150 is peeled off from the article 150, information is not sent to the IC chip 111. Writing and reading cannot be performed, and unauthorized use of the non-contact type IC label 100 is prevented. Even if the peeled base base material 114a and the base base material 114b are attached to each other, the pseudo-bonded portion between the base base material 114a and the base base material 114b does not return to the state before the peeling, and thus the peeled trace can be easily obtained. Can be confirmed.

  In addition, if the adhesive layer 120b is foamed by heating as described in Patent Document 2, a trace can be left when the adhesive layer 120b is peeled off by heating.

(Second Embodiment)
FIGS. 3A and 3B are diagrams showing a second embodiment of the non-contact type IC label of the present invention, wherein FIG. 3A is a diagram showing an internal structure, and FIG. 3B is a cross-sectional view taken along line AA ′ shown in FIG. (C) is a view of the inlet 210 as viewed from the top sheet 230 side, and (d) is a view of the inlet 210 as viewed from the release paper 240 side.

In this embodiment, as shown in FIG. 3, a coil-shaped first conductive material is formed on one surface of a base material 214a, 214b having a two-layer structure which is made of a pseudo-adhesive film or the like and is pseudo-adhered to each other. An antenna 212 and a contact point 213 to be a pattern are formed, and an IC chip 211 capable of writing and reading information from the outside in a non-contact state is mounted via the antenna 212, and base substrates 214a and 214b are mounted. A top sheet on which the inlet 210 having the bridge 217 serving as the second conductive pattern is formed on the other side of the cover protects the inlet 210 through the adhesive layers 220a and 220b and information is printed on the surface. 230 and the release paper 240 are laminated so as to be sandwiched. Note that one end of the antenna 212 is connected to the IC chip 211 via the contact point 213, and the other end of the antenna 212 is formed by mechanically caulking the base substrate 214 from the front and back. The other end of the bridge 217 is connected to the contact point 213 via the front and back conducting portion 216 formed in the base substrate 214 in the same manner. Thus, a circuit including the antenna 212, the contact point 213, the bridge 217, and the IC chip 211 is formed. In addition, the base substrates 214a and 214b are made of materials having different melting points, for example, and are pseudo-bonded by being heated and pressurized at a temperature based on the lower melting point, thereby providing an adhesive layer. They are bonded to each other without being peeled off. Furthermore, in this embodiment, a capacitance adjustment pattern that is a plurality of conductive regions that are connected to the contact point 213 on the surface on which the antenna 212 is formed and is made of a conductive material for adjusting the resonance frequency of the non-contact type IC label 200. A capacitor adjustment pattern 218a that is a plurality of conductive regions connected to the bridge 217 is formed on the surface on which the bridge 217 is formed so as to face the capacitor adjustment pattern 218b.

  Here, the capacity adjustment patterns 218a and 218b will be described.

  The resonance frequency f of the non-contact type IC label 200 is determined by the inductance L of the antenna 212 and the capacitance C of the antenna 212 (f = 1 / 2π√LC), but it is necessary to adjust this resonance frequency f in the manufacturing process. There is. Therefore, a plurality of capacitance adjustment patterns 218a and 218b are provided so as to face each other via the base substrates 214a and 214b, and a capacitor is formed by the capacitance adjustment pattern 218a and the capacitance adjustment pattern 218b. Of the patterns 218a and 218b, the number of capacity adjustment patterns 218a and 218b connected to the contact 213 or the bridge 217 is limited by cutting the capacity patterns 218a and 218b. As a result, the number of capacity adjustment patterns 218a and 218b forming a capacitor in a state where it is connected to the contact 213 or the bridge 217 is arbitrarily set, and the capacity C of the antenna 212 is adjusted. Note that the capacitance adjustment patterns 218a and 218b, which are conductive regions, do not necessarily include a plurality of patterns, and the capacitance C of the antenna 212 is adjusted by the capacitance adjustment patterns 218a and 218b so as to correspond to the resonance frequency f. What is necessary is just to be comprised.

  Below, the usage method of the non-contact-type IC label 200 comprised as mentioned above is demonstrated.

  In the non-contact type IC label 200 configured as described above, the release paper 240 is peeled off and affixed to an article or the like by the adhesive layer 220b, and is attached to an information writing / reading device (not shown) provided outside. By bringing them close to each other, a current flows through the antenna 212 due to electromagnetic induction from the information writing / reading device, and this current is supplied to the IC chip 211 via the contact 213. Information is written from the reading device to the IC chip 211, and information written to the IC chip 211 is read by the information writing / reading device.

  After the non-contact type IC label 200 is attached to an article or the like in this way, when the non-contact type IC label 200 is to be peeled off from the article or the like, the base materials 214a and 214b having a two-layer structure are peeled from each other. Will be.

  FIG. 4 is a diagram showing a state where the non-contact type IC label 200 shown in FIG. 3 is peeled off from a state where it is stuck on an article or the like.

  When the non-contact type IC label 200 affixed to the article 250 is to be peeled off, the base materials 214a and 214b are peeled from each other because the two-layer base materials 214a and 214b are pseudo-bonded to each other. Beginning (FIG. 4 (a)), and thereafter, the base base materials 214a and 214b are peeled from each other, whereby the front and back conductive portions 216 formed on the base base materials 214a and 214b are cut (FIG. 4 (b)). As a result, the antenna 212 and the contact 213 formed on one surface of the base substrates 214a and 214b and the bridge 217 formed on the other surface of the base substrates 214a and 214b are electrically disconnected. A circuit including the antenna 212, the contact point 213, the bridge 217, and the IC chip 211 is disconnected.

  In this state, information cannot be written to or read from the IC chip 211. Therefore, after the non-contact type IC label 200 attached to the article 250 is peeled off from the article 250, information is not sent to the IC chip 211. Writing and reading cannot be performed, and unauthorized use of the non-contact type IC label 200 is prevented.

  Further, in this embodiment, the non-contact type IC label 200 is peeled off from the article 250 (FIG. 4C), and the base substrates 214a and 214b are peeled from each other even in the region where the capacity adjustment patterns 218a and 218b are formed. Then, the capacity adjustment pattern 218a and the capacity adjustment 218b do not face each other. Here, as described above, the resonance frequency of the non-contact type IC label 200 is such that the capacitance adjustment pattern 218a and the capacitance adjustment pattern 218b are the distance (thickness) when the base substrates 214a and 214b are pseudo-bonded to each other. Therefore, when the capacitance adjustment pattern 218a and the capacitance adjustment 218b are not opposed to each other, the capacitance C of the antenna 212 is different, and accordingly, the non-contact type IC label 200 The resonance frequency changes, and communication with an information writing / reading device provided outside becomes impossible. Therefore, in a state where the base substrate 214a and the base substrate 214b are separated from each other, the two front and back conductive portions 216 exposed on the adhesive surface of the base substrate 214b with the base substrate 214a are connected by some means. Even when a circuit composed of the antenna 212, the contact 213, and the IC chip 211 is formed, the resonance frequency is different, and thus information cannot be written to and read from the non-contact type IC label 200.

  Further, when the base base material 214a and the base base material 214b are brought into contact again after the base base material 214a and the base base material 214b are separated from each other, the base base materials 214a and 214b are detachably bonded to each other. Between the capacity adjustment pattern 218a and the capacity adjustment pattern 218b when the base material 214a and the base material 214b come into contact again after the base material 214a and the base material 214b are separated from each other. The interval is small but different. Here, as described above, the resonance frequency of the non-contact type IC label 200 is the distance (thickness) in the state where the base substrates 214a and 214b are pseudo-bonded to each other, and the capacitance adjustment pattern 218a and the capacitance adjustment pattern 218b. Therefore, when the interval between the capacity adjustment pattern 218a and the capacity adjustment pattern 218b is small, the capacity adjustment pattern 218a and the capacity adjustment pattern 218b are configured. The capacitance C of the capacitor is different, the resonance frequency of the non-contact type IC label 200 is changed, and communication with an information writing / reading device provided outside becomes impossible. Therefore, even when the base substrate 214a and the base substrate 214b are brought into contact again after the base substrate 214a and the base substrate 214b are separated from each other, writing of information to the non-contact type IC label 200 and Reading is impossible. Further, the same effect can be obtained by providing a pattern for adjusting the capacity of sharpness (Q value) on the base base material 214a and the base base material 214b instead of the pattern for adjusting the capacity C.

  Further, if the adhesive layer 220b is foamed by heating as described in Patent Document 2, a trace can be left when the adhesive layer 220b is peeled off by heating.

It is a figure which shows 1st Embodiment of the non-contact-type IC label of this invention, (a) is a figure which shows an internal structure, (b) is A-A 'sectional drawing shown to (a). It is a figure which shows a state in case the non-contact type IC label shown in FIG. 1 is peeled off from the state affixed on articles | goods etc. It is a figure which shows 2nd Embodiment of the non-contact-type IC label of this invention, (a) is a figure which shows an internal structure, (b) is AA 'sectional drawing shown to (a), (c ) Is a view of the inlet as viewed from the top sheet side, and (d) is a view of the inlet as viewed from the release paper side. It is a figure which shows a state in case the non-contact type IC label shown in FIG. 3 is peeled off from the state affixed on articles | goods etc. It is a figure which shows one structural example of the conventional non-contact-type IC label, (a) is a figure which shows an internal structure, (b) is A-A 'sectional drawing shown to (a).

Explanation of symbols

100, 200 Non-contact type IC label 110, 210 Inlet 111, 211 IC chip 112, 212 Antenna 113, 213 Contact 114a, 114b, 214a, 214b Base substrate 116, 216 Front / back conductive part 117, 217 Bridge 120a, 120b, 220a 220b Adhesive layer 130, 230 Top sheet 140, 240 Release paper 150, 250 Article 218a, 218b Capacity adjustment pattern

Claims (2)

The first conductive pattern on one surface of the base material, with the second conductive pattern on the other surface are formed on the surface of the first conductive pattern is formed of the base material An inlet on which an IC chip capable of writing and reading information in a non-contact state via the first conductive pattern is mounted; two adhesive layers stacked on both sides of the inlet; and the two It has at least a surface sheet bonded to the inlet via one adhesive layer among the adhesive layers, and the first conductive pattern and the second conductive pattern are formed on the base substrate. by being connected through the front and back conductive part provided, the IC chip contactless writing and reading of data in a non-contact state is enabled via the first conductive pattern to the I In the label,
The non-contact type IC label, wherein the base substrate has a two-layer structure in which the base substrates are pseudo-bonded so as to be peeled from each other. The non-contact type IC label according to claim 1,
The non-contact type IC label, wherein each of the first conductive pattern and the second conductive pattern has a conductive region formed so as to face each other through the base substrate.

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