JP4930758B2 - Non-contact type data carrier device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a non-contact type data carrier in which a sheet-like base substrate and a small non-contact type data carrier having a square area size of 10 mm × 10 mm or less using a hard and insulating plate-like base material are resin-sealed. More particularly, the present invention relates to a non-contact type data carrier device for a key holder.

In recent years, IC cards are becoming increasingly popular in terms of information confidentiality, and in recent years, contactless IC cards that exchange information without contacting a reader / writer have been proposed. A system in which signal exchange with an apparatus or signal exchange and power supply is performed by electromagnetic waves is being put into practical use.
Under such circumstances, various types of non-contact IC tags in the form of sheets or bills, in which an IC chip carrying data is connected to an antenna coil, have recently been proposed and attached to products, packaging boxes, etc. for shoplifting. It has come to be used for prevention, logistics system, product management, etc.
Of course, a simple resonance tag having no IC is also used to detect the presence of an article.
Thus, in recent years, the use of data carriers such as non-contact type IC cards and IC tags (hereinafter also referred to as data carrier devices) has been increasing in order to improve security and convenience.

Under such circumstances, when used as a key holder, a non-contact type data carrier device excellent in design is disclosed in Japanese Patent Laid-Open No. 2003-162704 (Patent Document 1).
The one described here is manufactured by covering the IC module or antenna placed on one side of the resin sheet as the base substrate with a resin liquid, curing it, and sealing the IC module or antenna. It is.
Recently, a square area of 10 mm × 10 mm provided with an IC chip on a wiring board in which an antenna circuit such as an antenna coil is arranged on a hard, insulating plate-like base material such as glass epoxy or paper phenol. Small-sized non-contact type data carriers (see FIGS. 8 and 9) having a size smaller than that have come to be manufactured, and by using such a small non-contact type data carrier having an IC chip and an antenna, Is sealed with a resin by the above-described potting (also referred to as dispensing) to produce a non-contact type data carrier device such as a key holder. In this case, if the size of the non-contact type data carrier is large, it is possible to make a data carrier built-in key chain without shifting the data carrier, but the size of the non-contact type data carrier is less than the square area size of 10 mm × 10 mm. If it is small, there is a problem that the data carrier is displaced when the resin is hot and cannot be fixed at a predetermined position.

As described above, recently, using a small non-contact type data carrier provided with an IC chip and an antenna, this is resin-sealed by a method of sealing with resin by the above potting (also called dispensing), Although non-contact type data carrier devices such as key holders are being manufactured, if the size of the non-contact type data carrier is smaller than a square area size of 10 mm x 10 mm, it is non-contact during resin hotting There is a problem in that the position of the formula data carrier is shifted and cannot be fixed at a predetermined position, and this countermeasure has been demanded.
The present invention corresponds to this, and specifically, a small non-contact data carrier having a square area size of 10 mm × 10 mm or less using a sheet-like base substrate and a hard, insulating plate-like substrate. And a non-contact type data carrier device in which the non-contact type data carrier is not misaligned.
At the same time, it is intended to provide a method for manufacturing such a non-contact type data carrier device.

The non-contact type data carrier device of the present invention comprises a sheet-like base substrate and a small non-contact type data carrier having a square area size of 10 mm × 10 mm or less using a hard, insulating plate-like substrate. A resin-sealed non-contact type data carrier device, wherein a non-contact type data carrier is arranged on one surface of the base substrate, or in a through hole or a recess of the base substrate, The contact type data carrier is sandwiched between the first resin portion and the second resin portion and sealed with resin, and the first resin portion is a pedestal for fixing the base substrate, The second resin portion is disposed by potting, and a non-contact type data carrier is fixed to the base substrate and the first resin portion at a predetermined position in the surface direction of the base substrate, or Limiting the position of the surface direction Installing a non-contact data carrier is provided with an installation portion, the installation unit, the base substrate, in any one or more of the first resin part, some or all of the non-contact data carrier The non-contact type data carrier is fitted into a fitting part to be fitted, and the fitting part is a through-hole formed in a base substrate having a size larger than that of the non-contact type data carrier. To do .

  Further, in any one of the above non-contact type data carrier devices, the second resin part, or the second resin part and the first resin part, are both two liquids that are cured at room temperature. A resin liquid obtained from a polyurethane of a mold is used as a material and is cured.

Also, any one of the above non-contact type data carrier devices, wherein the base material is printed or printed, and the base substrate is provided with a barcode, a two-dimensional barcode, At least one of UID (Unique Identification) is printed or printed, and further, a heat-resistant pigment is used for the printing or printing. is there.
Also, any one of the above non-contact type data carrier devices is characterized in that an attachment hole for attaching an accessory member such as a strap is provided.
Also, any one of the above non-contact type data carrier devices, wherein an incidental member such as a strap is attached.
Also, any one of the above non-contact type data carrier devices is characterized in that it is for a key holder.

  Here, the hard and insulating plate-like base material is a hard insulating substrate such as glass epoxy or paper phenol, which is rigid and can maintain a planar shape.

The non-contact type data carrier device manufacturing method of the present invention is a small non-contact type data carrier of 10 mm × 10 mm square area size or less using a sheet-like base substrate and a hard, insulating plate-like substrate. Is a non-contact type data carrier device sealed with resin, and a non-contact type data carrier is arranged on one surface of the base substrate or on a through-hole portion or a recess of the base substrate. A non-contact type data carrier device for producing a non-contact type data carrier device in which a material and a non-contact type data carrier are sandwiched between a first resin part and a second resin part and sealed with resin. In this method, in order, (a) a first resin part that is a flat surface is formed in advance, and a base material is formed in a predetermined position on the one surface. And non-contact data carrier A non-contact type data carrier installation step, and (b) a potting step of potting and curing to form the second resin part so as to cover the base substrate and the non-contact type data carrier. In the non-contact type data carrier installation step, the non-contact type data carrier is fixed to the base base material and the first resin portion at a predetermined position in the surface direction of the base base material. The contact type data carrier is installed in a predetermined installation part that restricts the position of the surface direction of the contact type data carrier, and the potting process is performed with the non-contact type data carrier installed in the installation part. It is characterized by this.
And it is a manufacturing method of said non-contact-type data carrier apparatus, Comprising: The said installation part is the surface of the said 2nd resin part side of the said base base material, At least the both surfaces of the size below a non-contact-type data carrier The non-contact type data carrier is fixed and installed in an adhesive layer portion having an adhesive layer on the adhesive layer portion, and the adhesive layer portion is a double-sided tape. Furthermore, the adhesive layer is a thermosetting type or a thermoplastic type.
Further, in the method for manufacturing the non-contact type data carrier device described above, the installation unit may include a part or all of the non-contact type data carrier on any one or more of the base substrate and the first resin unit. The non-contact type data carrier is inserted into a fitting part into which the non-contact type data carrier is fitted, and the fitting part is opened in a base substrate having a size larger than that of the non-contact type data carrier. It is characterized by being a through hole .
Further, in the method for manufacturing a non-contact type data carrier device according to any one of the above, the second resin portion, or the second resin portion and the first resin portion are: Each is characterized by being cured using a resin liquid obtained from a two-component polyurethane that cures at room temperature as a material.

(Function)
The non-contact type data carrier device of the present invention has a square area size of 10 mm × 10 mm or less using a sheet-like base substrate and a hard, insulating plate-like substrate by adopting the form of the invention of claim 1. It is possible to provide a non-contact type data carrier device in which a small non-contact type data carrier is sealed with a resin, and the non-contact type data carrier has no positional deviation.
Specifically, a non-contact type data carrier is arranged on one surface of the base substrate, or in a through-hole portion or a concave portion of the base substrate, and the base substrate and the non-contact data carrier are connected to each other. The first resin part is a base for fixing the base substrate, and the second resin part is arranged by potting. The non-contact type data carrier is fixed to the base substrate and the first resin portion at a predetermined position in the surface direction of the base substrate, or the position in the surface direction is limited. A non-contact type data carrier is provided, and the installation unit includes at least one of the base substrate and the first resin part, and a part or all of the non-contact type data carrier. The non-contact type data is inserted into the fitting portion. Are those fitting the carrier, said fitting portion, the non-contact data or carrier size, by a through hole formed in the base substrate, have achieved this.
That is, the non-contact type data carrier is prevented from being displaced by providing an installation portion that is installed at a predetermined position with respect to the base substrate and the first resin portion that is the base. And the installation part fits the non-contact type data carrier in a fitting part into which a part or all of the non-contact type data carrier is fitted into any one or more of the base substrate and the first resin part. in I form write, before Symbol fitting portion, the non-contact data or carrier size, a through hole formed in the base substrate, and shall without adhesive fixing can be installed in a predetermined position Yes.

The second resin portion, or the second resin portion and the first resin portion are both cured using a resin liquid obtained from a two-component polyurethane that cures at room temperature. According to the second aspect of the invention , specifically, the second resin portion can be formed by potting, and the first resin portion and the second resin portion can be reliably sealed. It is supposed to be.

The base material is printed or printed, so that it can be printed or printed in accordance with the form of the invention according to claim 3 , the non-contact type data carrier device, and further the contact type data carrier Information can be grasped, and decorativeness and the like can be given.
For example, when used as a key ring, from the aspect of decorativeness, the product value can be further added by printing a photograph, for example, a photograph of a pet or the like.
According to the form of the invention of claim 4, at least one of a barcode, a two-dimensional barcode, and a UID (Unique Identification) is printed or printed on the base substrate. When it is broken, it can be associated with data stored in a PC (personal computer) or the like.
And by using the form of the invention of claim 5 in which a heat-resistant pigment is used for the printing or printing, it is possible to prevent the printed characters, images and photographs from bleeding or flying. it can.
The second resin portion is formed by potting. Usually, the resin liquid is at a high temperature when potting is formed.
Also provided are mounting holes for supplementary member mounting straps or the like to the form of the invention of claim 6, thereby enabling attachment of the bearing member of the strap or the like.
Moreover, carrying and attachment are made easy by setting it as the form of invention of Claim 7 to which incidental members, such as a strap, are attached.
In particular, it is effective when used for a key holder.

  The manufacturing method of the non-contact type data carrier device of the present invention has a structure of 10 mm × 10 mm square area or less using a sheet-like base substrate and a hard, insulating plate-like substrate. It is possible to provide a manufacturing method of a non-contact type data carrier device in which a small non-contact type data carrier is sealed with a resin and the non-contact type data carrier is not displaced.

In the present invention, as described above, a sheet-like base substrate and a small non-contact data carrier having a square area size of 10 mm × 10 mm or less using a hard, insulating plate-like substrate are resin-sealed. It is possible to provide a non-contact type data carrier device that is non-contact type data carrier and has no positional deviation of the non-contact type data carrier, and a method for manufacturing such a non-contact type data carrier device.
In particular, it is possible to provide a key ring that is highly decorative and easy to use and a method for manufacturing the same.

Embodiments of the present invention will be described with reference to the drawings.
FIG. 1A is a cross-sectional view of a reference embodiment example 1 of the non-contact type data carrier device of the present invention, FIG. 1B is a cross-sectional view of a modification example of the reference embodiment example 1 , and FIG. FIG. 2A is a cross-sectional view of another modification of Reference Embodiment 1 , and FIG. 2A is a cross-sectional view of the first example of the embodiment of the non-contact type data carrier device of the present invention. in the cross-sectional view of a modification of the first embodiment, FIG. 3 (a) is a sectional view of a reference embodiment 2 of the non-contact type data carrier device of the present invention, FIG. 3 (b) reference embodiment 2 FIG. 4 is a cross-sectional view of a third embodiment of the non-contact type data carrier device of the present invention, and FIG. 5 (a) is a reference embodiment of the non-contact type data carrier device of the present invention. sectional view of an example of a cross-sectional view of an example 4, a modification of FIG. 5 (b) reference example embodiment 4, FIG. 5 (c) of the contactless data carrier device of the present invention In cross-sectional view of a second example of the facilities in the form, FIG. 5 (d) is a modification of the second embodiment, FIG. 5 (e) is the reference embodiment 5 of the non-contact type data carrier device of the present invention 6 (a) to 6 (d) are cross-sectional views showing process steps for producing the non-contact type data carrier device of Reference Embodiment 1 shown in FIG. 1 (a). FIGS. 7A to 7D are process cross-sectional views showing a method of manufacturing a non-contact type data carrier device according to a modification of the first embodiment shown in FIG. 1B, and FIG. 8 shows non-contact data. FIG. 9 is a view showing the IC chip and its connection state seen through from one side of the carrier, and FIG.
8 is a view as seen from the B1 side in FIG.
1 to 9, 10, 10 </ b> A and 10 </ b> B are non-contact type data carrier devices, 11 to 15 are non-contact type data carrier devices, 16, 16 a, 17, 17 a and 18 are non-contact type data carrier devices, and 20 is a non-contact type data carrier device. Non-contact data carrier, 30 is a base substrate, 31 is a through hole, 32 is a recess, 40 and 41 are first resin portions, 40S is a flat surface, 45 and 45A are recesses, and 50 is a second resin portion. , 60 is a double-sided tape (also referred to as an adhesive layer portion), 61 is a base material, 62 to 65 are adhesive layers, 220 is a non-contact data carrier, 241 is an IC chip, 242 is an antenna circuit portion (also referred to as an antenna coil), 243a and 243b are chip terminals, 245 and 245a to 246d are through-hole portions, 246a and 246b are chip connection terminals, 247 is a chip mounting pad, 248 is a bonding wire, 49 sealing resin 250 solder resist 251 is (wiring) of the substrate, 252 the adhesive layer 260 (also referred to simply as wiring base material) laminated wiring substrate.

First , a reference embodiment example 1 of an embodiment of a non-contact type data carrier device of the present invention will be described with reference to FIG.
The non-contact type data carrier device 10 of the reference embodiment 1 is a small non-contact type of 10 mm × 10 mm square area size or less using a sheet-like base substrate 30 and a hard, insulating plate-like substrate. In the non-contact type data carrier device in which the data carrier 20 is resin-sealed, the non-contact type data carrier is arranged on one surface of the base substrate 30 opposite to the first resin portion 40, and the base substrate 30 And the non-contact type data carrier 20 are sandwiched between the first resin portion 40 and the second resin portion 50 and sealed with resin.
The base substrate 30 is entirely resin-sealed by the first resin portion 40 and the second resin portion 50 including the outer side surface portion.
In the first embodiment , the first resin portion 40 is a pedestal for fixing the base substrate 30, and the second resin portion 50 is disposed by potting.
The first resin portion 40 may be formed by potting or other methods. Then, the non-contact type data carrier 20 is fixed to the base substrate 30 with a double-sided tape 60 at a predetermined position in the surface direction on the surface of the base substrate 30 on the second resin portion 50 side. A data carrier 20 is installed.
In the reference embodiment example 1 , a double-sided tape 60 is disposed at a predetermined position of the base substrate 30 and is used as an installation portion.
In the first embodiment , the end surface has an arcuate cross-section, and has a smooth shape at the boundary between the first resin portion 40 and the second resin portion 50 and others. As can be seen, the regions of the first resin portion 40 and the second resin portion 50 are the same.
In addition, by setting it as such a shape, the boundary of the 1st resin part 40 and the 2nd resin part 50 is strong to external force, and has ensured sealing.
As a modification of the reference embodiment example 1 , as shown in FIG. 1 (b), in the reference embodiment example 1 , the first resin portion has a square cross section, or shown in FIG. 1 (c). As described above, in the first embodiment , the first resin portion and the second resin portion are both rectangular in cross section.
1B and 1C, the base substrate 30 includes the outer side surface portion by the first resin portion 40 and the second resin portion 50. The whole is resin-sealed.

Next, each part will be briefly described.
The double-sided tape 60 has thermosetting or thermoplastic adhesive layers 62 and 63 disposed on both sides of a base material 61, respectively.
The second resin part 50 or the second resin part 50 and the first resin part 40 are resin parts formed by potting.
The resin material of the second resin portion 50 is preferably a material that can be potted and effective in sealing, and has good workability. Further, the first resin portion 40 includes a second resin. Although the same as the resin material of the part 50 is preferable, it is not limited to this.
The formation of the second resin portion 50 by potting is performed by dropping a resin liquid using a mold or without using a mold.
A typical resin material for potting is a resin liquid obtained from a two-component polyurethane that cures at room temperature.
This resin liquid is a polyurethane made by reacting a polyol for curing with an isocyanate as a prepolymer produced by reacting a polyol such as diol or triol with an excess of polyisocyanate. An agent may be included.
As the diol, a reaction product of butylene oxide and ethylene oxide, polypropylene glycol, or the like is used.
Examples of the triol include a reaction product of 3-methylol-1,5-dihydroxypentane and propylene oxide, a reaction product of glycerol triglycidyl ether and propylene oxide, and the like.
As the polyisocyanate, isophorone diisocyanate, tolylene diisocyanate, and the like are used, and isophorone diisocyanate is preferable in order to improve physical properties such as strength after the reaction.
Further, a long-chain polyol such as a long-chain diol is used as the curing polyol.
Further, 2-hydroxy-5-methyl-phenylbenzotriazole or the like is used as the ultraviolet protective agent.
In addition, the usage-amount of the polyol for hardening with respect to isocyanate is about a weight part of hardening polyol with respect to an isocyanate weight part.
Other examples of the resin for sealing by potting include epoxy resins.

Examples of the base substrate 30 include a PET (polyethylene terephthalate) film, polycarbonate, and paper.
The double-sided tape 60 is not particularly limited as long as it can be applied practically, and is usually a laminate in which an adhesive layer 62, a substrate 61, and an adhesive layer 63 are laminated in this order as shown in FIG. A structure is used.
As the base material 61, a polyethylene terephthalate film (PET film) or the like is used, and as the adhesive layers 62 and 63, an acrylic adhesive layer, a silicon adhesive layer, or the like is used. An adhesive layer made of a thermoplastic resin is preferred.
In addition, in the non-contact type data carrier device 10 of the first example shown in FIG. 1A, and the non-contact type data carrier devices 10A and 10B of the modified examples shown in FIG. 1B and FIG. The double-sided tape 60 having a structure in which the adhesive layer, the base material, and the adhesive layer are sequentially laminated is used. Instead of the double-sided tape having such a structure, the adhesive layer is configured by only one layer without the base material. A double-sided tape with a structure may be used.

Here, based on FIGS. 7 and 8, the non-contact type data carrier 20 (corresponding to 220 in FIGS. 7 and 8) used in the first embodiment will be briefly described.
As shown in FIG. 8, the non-contact data carrier 220 is simply provided on a laminated wiring substrate 260 in which a substrate in which a part of an antenna circuit portion is formed is laminated on the surface of each substrate 251. Each of the layers is electrically connected through the through-hole 245 to form an antenna circuit unit, an IC chip 241 is mounted on the surface portion of the laminated wiring substrate 260, and the antenna circuit The portion 242 is electrically connected.
Here, the non-contact type data carrier 220 has rigidity as a whole and can maintain a planar shape.
Here, the antenna circuit portion 242 has a four-layer spiral shape in which the number of turns of each layer is about nine.
Examples of the size of the non-contact type data carrier 220 include a 5 mm square and a thickness of about 0.8 mm.
This size is much smaller than 54 mm × 85.6 mm which is a standard size for a card-type RFID tag (IC card).
The IC chip 241, the bonding wire 248, and the antenna circuit portion 242 on the surface are covered and protected by the solder resist 250 and the sealing resin 249.
The antenna coil portion of the antenna circuit portion 242 has a line width of about 80 μm, a line width of about 70 μm, and a line thickness of about 18 μm, and can be formed in such a laminated structure by a known additive method or semi-additive method.
The IC chip 241 mainly includes a ROM, a RAM, a logic circuit, and a CPU.
As the IC chip 241, a chip that is commercially available as a chip for a 13.56 MHz band RFID tag, such as an I-CODESLI chip from Philips or a my-d chip from Infineon Technology, is appropriately used according to the application. .
In this example, the size of the non-contact data carrier 220 is not so large with respect to the size of the IC chip 241 to be mounted.
The shape does not necessarily have to be a square, but is rectangular in order to facilitate the production of multiple pieces.
In addition, by making the laminated wiring substrate 260 laminated into a substantially square shape, it becomes easy to secure the inner area of the antenna while reducing the size, and the inductance value of the coil can be improved.
The laminated wiring substrate 260 has, for example, a hard insulating substrate made of glass epoxy or paper phenol having a thickness of 0.1 mm as a substrate 251, and a copper foil having a thickness of 18 μm laminated on one or both sides. Using the single-sided copper-clad substrate and the double-sided copper-clad substrate, the antenna circuit part 42 having a desired shape is formed by etching using the photoetching method for the outer layer and the inner layer, respectively, and each layer is formed as an insulating adhesive layer. The film is laminated by heating and pressurizing, and further, through holes are formed.
Here, through-holes are used for connection between layers, but it is also possible to apply an interlayer connection method called B2it (registered trademark) that breaks through the interlayer insulation layer with a substantially conical conductor bump. It is.
Thereby, it is possible to reduce the total number of manufacturing steps.

Next, an example of a manufacturing method of the non-contact type data carrier device 10 according to the first embodiment will be briefly described with reference to FIG.
First, the 1st resin part 40 used as a base is prepared beforehand. (Fig. 6 (a))
The first resin portion 40 may be formed by potting in a predetermined mold or without using a mold, but may be formed by resin other than potting.
For example, it may be formed by injection molding or resin punching.
Next, the base substrate 30 is placed on the flat surface 40S of the first resin portion 40 (FIG. 6B). Further, the base substrate 30 is placed at a predetermined position in the surface direction of the base substrate 30 with the double-sided tape 60. A non-contact data carrier 20 is fixed to the material 30. (Fig. 6 (c))
The base substrate 30 is substantially fixed to the first resin portion 40 that is a pedestal.
Next, in this state, potting is performed using a mold (not shown), and the second resin portion 50 is formed by curing. (Fig. 6 (d))
Since the mold is used, the cross-sectional shape of the end portion can be an arc shape.
The manufacturing method of the non-contact type data carrier device of this example is one example, and is not limited to this.

Similarly, the non-contact type data carrier device 10A according to the modification of the first example can be manufactured by the process procedure shown in FIG. 6 as shown in FIGS. 7 (a) to 7 (d).
In this case, the cross-sectional shape of the first resin portion is square, and the formation can be performed by cutting or the like without using a mold.
The non-contact type data carrier device 10B of another modified example of the first example can be basically manufactured in the same manner according to the process procedure shown in FIG.

Next, a first example of the embodiment of the non-contact type data carrier device of the present invention will be described with reference to FIG.
Contactless data carrier device 10A of the first embodiment, similarly as in Reference Embodiment 1, a sheet-like base material 30, a rigid, square area size of 10 mm × 10 mm with insulating plate-shaped substrates A non-contact type data carrier device in which the following small non-contact type data carrier 20 is resin-sealed, and a non-contact type data carrier is arranged on one surface side of the base substrate 30 so as not to contact the base substrate 30. The data carrier 20 is sandwiched between the first resin portion 40 and the second resin portion 50 and sealed with resin. The first resin portion 40 is a pedestal for fixing the base substrate 30. The second resin part 50 is disposed by potting.
The non-contact type data carrier device 11 of the first example restricts the position in the surface direction with respect to the base substrate 30 and the first resin portion 40 at a predetermined position in the surface direction of the base substrate 30. In the installation portion where the non-contact type data carrier is installed, a through-hole portion 31 that fits almost all of the non-contact type data carrier into the base substrate 30 is provided as a fitting portion. The contact type data carrier 20 is fitted.
Here, the non-contact type data carrier 20 is only fitted into the through-hole portion 31 and is sandwiched between the first resin portion 40 and the second resin portion 50.
For each part, the same thing as the reference embodiment example 1 can be applied, and the manufacturing method of the non-contact type data carrier device 10 of the first example can also be applied to manufacture each part. Omit the explanation of the method.
As a modification of the non-contact type data carrier device 11 of the first example, as shown in FIG. 2 (b), the non-contact type data carrier 20 in the first example shown in FIG. The non-contact type data carrier 20 is fitted into the through-hole part 31 instead of the installation form that is fitted into the part 31 and sandwiched between the first resin part 40 and the second resin part 50, and And an adhesive layer 65 that is fixed to the first resin portion 40 and sandwiched between the first resin portion 40 and the second resin portion 50.

Next, a reference embodiment example 2 of the embodiment of the non-contact type data carrier device of the present invention will be described with reference to FIG.
Similarly to the reference embodiment 1 , the non-contact type data carrier device 13 of the reference embodiment 2 is also a 10 mm × 10 mm square region using a sheet-like base substrate 30 and a hard, insulating plate-like substrate. In a non-contact type data carrier device in which a small non-contact type data carrier 20 of a size or less is sealed with a resin, a recess 45 provided on one surface of the first resin part 40 of the base substrate 30 is non-contact type. The data carrier 20 is fitted and disposed, and the base substrate 30 is disposed on the one surface so as to cover the non-contact type data carrier 20, and the first base 40 and the second base 50 are provided. The first resin part 40 is a pedestal for fixing the base substrate 30, and the second resin part 50 is disposed by potting.
For each part, can be applied those similar to Reference Embodiment 1, also, a manufacturing also applicable to manufacturing methods of a non-contact type data carrier device 10 basically Reference Embodiment 1, where each unit And the description of the manufacturing method are omitted.
As a modification of the non-contact type data carrier device 13 of the reference embodiment example 2 , as shown in FIG. 3B, the non-contact type data carrier 20 in the reference embodiment example 2 shown in FIG. Instead of the form simply fitted in the recess 45, a form in which the recess 45A is fitted and fixed to the first resin part 40 by the double-sided tape 60 can be cited.

Next, a reference embodiment example 3 of the non-contact type data carrier device of the present invention will be described with reference to FIG.
Also contactless data carrier device 15 of the reference embodiment 3, similarly to Reference Embodiment 1, a sheet-like base material 30, a hard, 10 mm × 10 mm square region of using an insulating plate-shaped substrates In a non-contact type data carrier device in which a small non-contact type data carrier 20 smaller than the size is resin-sealed, the one surface and the base substrate 30 are formed on one surface of the first resin portion 40 of the base substrate 30. The non-contact type data carrier 20 and the base substrate 30 are arranged so as to surround the non-contact type data carrier 20 with the recess 32, and these are sandwiched between the first resin part 40 and the second resin part 50, and the resin The first resin part 40 is a pedestal for fixing the base substrate 30, and the second resin part 50 is disposed by potting.
For each part, can be applied those similar to Reference Embodiment 1, also, a manufacturing also applicable to manufacturing methods of a non-contact type data carrier device 10 basically Reference Embodiment 1, where each unit And the description of the manufacturing method are omitted.

Next, a reference embodiment example 4 of the embodiment of the non-contact type data carrier device of the present invention will be described with reference to FIG.
Also contactless data carrier device 16 of the referential embodiment Example 4, the same manner as in Reference Embodiment 1, a sheet-like base material 30, a hard, 10 mm × 10 mm square region of using an insulating plate-shaped substrates A non-contact type data carrier 20 in which a small non-contact type data carrier 20 smaller than the size is sealed with a resin, and a non-contact type data carrier is provided on one surface of the base substrate 30 opposite to the first resin portion 40. 20, the base substrate 30 and the non-contact data carrier 20 are sandwiched between the first resin portion 40 and the second resin portion 50 and sealed with resin. In the example, the outer end portion of the base substrate is exposed, the first resin portion 40 is disposed on one side, and the second resin portion 50 is disposed on the other side.
The non-contact type data carrier 20 is fixed to the base substrate 30 with a single adhesive layer 65.
In the reference embodiment example 4 , the first resin portion 40 is a pedestal for fixing the base substrate 30, and the second resin portion 50 is disposed by potting.
Here, the first resin portion 40 is also potted.
For each part, can be applied those similar to Reference Embodiment 1, also, a manufacturing also applicable to manufacturing methods of a non-contact type data carrier device 10 of Reference Embodiment 1, wherein the respective parts of the description, Description of the manufacturing method is omitted.
As a modified example 16a of the non-contact type data carrier device 16 of the reference embodiment example 4 , as shown in FIG. 5B, a single-layer adhesive layer 65 in the reference embodiment example 4 shown in FIG. Is replaced with the double-sided tape 60.

Next, a second example of the embodiment of the non-contact type data carrier device of the present invention will be described with reference to FIG.
Similarly to the reference embodiment 1 , the non-contact type data carrier device 17 of the second example also has a square area size of 10 mm × 10 mm using a sheet-like base substrate 30 and a hard, insulating plate-like substrate. The following non-contact type data carrier 20 is a non-contact type data carrier device in which a resin is sealed, and the non-contact type data carrier 20 is provided on one surface of the base substrate 30 opposite to the first resin portion 40. In the sixth example, the base substrate 30 and the non-contact data carrier 20 are sandwiched between the first resin portion 40 and the second resin portion 50 and sealed with resin. Exposes the outer end portion of the base substrate, and the first resin portion 40 is disposed on one side thereof, and the second resin portion 50 is disposed on the other side thereof.
The second example is a form in which the area of the base substrate 30 is expanded until the outer end of the base substrate is exposed in the first example shown in FIG.
In the second example , the second resin portion 50 is potted with the non-contact data carrier 20 placed in the through hole portion 31.
The non-contact type data carrier 20 is not fixed to the base substrate 30 by the adhesive layer.
Also in the second example , the first resin part 40 is a pedestal for fixing the base substrate 30, and the second resin part 50 is disposed by potting.
Here, the first resin portion 40 is also potted.
For each part, can be applied those similar to Reference Embodiment 1, also, a manufacturing also applicable to manufacturing methods of a non-contact type data carrier device 10 of Reference Embodiment 1, wherein the respective parts of the description, Description of the manufacturing method is omitted.
As a modified example 17a of the non-contact type data carrier device 17 of the second example , as shown in FIG. 5D, in the second example shown in FIG. The data carrier 20 is fixed to the base substrate 30.

Next, a reference embodiment example 5 of the embodiment of the non-contact type data carrier device of the present invention will be described with reference to FIG.
Also contactless data carrier device 17 of the referential embodiment Example 5, the same manner as in Reference Embodiment 1, a sheet-like base material 30, a hard, 10 mm × 10 mm square region of using an insulating plate-shaped substrates A non-contact type data carrier 20 in which a small non-contact type data carrier 20 smaller than the size is sealed with a resin, and a non-contact type data carrier is provided on one surface of the base substrate 30 opposite to the first resin portion 40. 20, the base substrate 30 and the non-contact data carrier 20 are sandwiched between the first resin portion 40 and the second resin portion 50 and sealed with resin. In the third example shown in FIG. 4, the example is a form in which the area of the base substrate 30 is expanded until the outer end portion of the base substrate is exposed.
In the reference embodiment example 5 , the second resin portion 50 is formed by potting in a state where the non-contact type data carrier 20 is placed on the upper surface of the first resin 40 that is the pedestal in the region of the recess 32 of the base substrate. It is.
The non-contact type data carrier 20 is not fixed to the first resin 40 by the adhesive layer.
Here, the first resin portion 40 is also potted.
For each part, can be applied those similar to Reference Embodiment 1, also, a manufacturing also applicable to manufacturing methods of a non-contact type data carrier device 10 of Reference Embodiment 1, wherein the respective parts of the description, Description of the manufacturing method is omitted.

The data carrier device is not limited to the above. For example, although not shown, the non-contact type data carrier is fitted into the concave portion that does not penetrate the through hole portion of the first example. Also mentioned.
Furthermore, the form which fixes a non-contact-type data carrier to this recessed part with a double-sided tape is also mentioned. Also in these cases, the same parts as those in the first embodiment can be applied to the respective parts, and the manufacturing method of the non-contact type data carrier device 10 of the first embodiment can be basically applied to the production thereof. Here, description of each part and description of a manufacturing method are omitted.
In addition, in the case of these forms, when disposing the concave portion on the base substrate by embossing, it is possible to improve the mass productivity.

In the above-described embodiments, modifications, and other embodiments, when the base material is printed or printed, it is effective in information display, information storage, and decorativeness, and a combination thereof. In addition, the product value can be further increased.
For example, when at least one of a bar code, a two-dimensional bar code, and a UID (Unique Identification) is printed or printed on the base substrate, the non-contact type data carrier device is broken. This can be associated with data stored in a PC (personal computer) or the like.
By using a heat-resistant pigment for these prints or prints, it is possible to prevent the printed characters, images and photographs from bleeding or flying.
The second resin portion is formed by potting. Usually, the resin liquid is at a high temperature when potting is formed.
In addition, the attachment member for attaching the accessory member such as the strap is provided, so that the attachment member such as the strap can be attached.
Moreover, carrying and attachment are made easy by setting it as the form to which incidental members, such as a strap, are attached.
In particular, it is effective when used for a key holder.

FIG. 1A is a cross-sectional view of a reference embodiment example 1 of the non-contact type data carrier device of the present invention, FIG. 1B is a cross-sectional view of a modification example of the reference embodiment example 1 , and FIG. These are sectional drawings of another modification of the reference embodiment example 1 . FIG. 2A is a sectional view of a first example of the embodiment of the non-contact type data carrier device of the present invention, and FIG. 2B is a sectional view of a modification of the first example . FIG. 3A is a cross-sectional view of a second embodiment of the non-contact type data carrier device of the present invention, and FIG. 3B is a cross-sectional view of a modification of the second embodiment of the reference embodiment . FIG. 4 is a cross-sectional view of a third embodiment of the non-contact type data carrier device of the present invention. FIG. 5A is a cross-sectional view of an example of the cross-sectional view of the reference embodiment example 4 of the non-contact type data carrier device of the present invention, and FIG. 5B is a modified example of the reference embodiment example 4 , and FIG. c) is a cross-sectional view of the second example of the embodiment of the non-contact type data carrier device of the present invention, FIG. 5 (d) is a modification of the second example, and FIG. 5 (e) is a diagram of the present invention. It is sectional drawing of the reference embodiment example 5 of a non-contact-type data carrier apparatus. 6 (a) to 6 (d) are process cross-sectional views showing a method of manufacturing the non-contact type data carrier device of Reference Embodiment Example 1 shown in FIG. 1 (a). FIG. 7A to FIG. 7D are process cross-sectional views illustrating a method for manufacturing a non-contact type data carrier device according to a modification of the first embodiment shown in FIG. 1B. It is the figure which looked through and showed the IC chip and its connection state from one surface of the non-contact type data carrier. It is the figure which simplified and showed the cross section in A1-A2 of FIG.

Explanation of symbols

10, 10A, 10B Non-contact type data carrier device 11-15 Non-contact type data carrier device 16, 16a, 17, 17a, 18 Non-contact type data carrier device 20 Non-contact type data carrier 30 Base substrate 31 Through hole 32 Recess 40, 41 First resin portion 40S Flat surface 45, 45A Recess 50 Second resin portion 60 Double-sided tape (also referred to as adhesive layer portion)
61 Base material 62 to 65 Adhesive layer 65 Adhesive layer 220 Non-contact data carrier 241 IC chip 242 Antenna circuit part (also referred to as antenna coil)
243a, 243b Chip terminals 245, 245a to 246d Through-hole portions 246a, 246b Chip connection terminals 247 Chip mounting pads 248 Bonding wire 249 Sealing resin 250 Solder resist 251 Base material 252 (for wiring) Adhesive layer 260 Multilayer wiring base Material (also simply called wiring substrate)

Claims (15)

A non-contact type data carrier device in which a sheet-like base substrate and a small non-contact type data carrier having a square area size of 10 mm × 10 mm or less using a hard and insulating plate-like base material are sealed with resin. A non-contact type data carrier is arranged on one surface of the base substrate or on a through hole or a recess of the base substrate, and the base substrate and the non-contact data carrier are connected to the first resin. The first resin part is a pedestal for fixing the base substrate, and the second resin part is disposed by potting. The non-contact type data carrier is fixed to the base substrate and the first resin portion at a predetermined position in the surface direction of the base substrate, or the position in the surface direction is limited to Install a contact data carrier Includes a part, the installation unit, the base substrate, in any one or more of the first resin portion, the fitting portion for fitting a part or all of the non-contact type data carrier, wherein the non-contact A non-contact type data carrier device , wherein a data carrier is fitted, and the fitting part is a through hole having a size larger than that of the non-contact type data carrier and formed in a base substrate . 2. The non-contact type data carrier device according to claim 1 , wherein the second resin part, or the second resin part and the first resin part, are both two liquids that are cured at room temperature. A non-contact type data carrier device, which is obtained by curing a resin liquid obtained from a type of polyurethane as a material. 3. The non-contact type data carrier device according to claim 1 , wherein the base material is printed or printed. 4. The non-contact type data carrier device according to claim 3 , wherein at least one of a barcode, a two-dimensional barcode, and a UID (Unique Identification) is printed or printed on the base substrate. Non-contact data carrier device. 5. The non-contact type data carrier device according to claim 3 , wherein a heat-resistant pigment is used for the printing or printing. 6. The non-contact type data carrier device according to claim 1 , wherein a mounting hole for attaching an accessory member such as a strap is provided. 7. The non-contact type data carrier device according to claim 1 , wherein an auxiliary member such as a strap is attached. 8. The non-contact type data carrier device according to claim 1, wherein the non-contact type data carrier device is used for a key holder.   A non-contact type data carrier device in which a sheet-like base substrate and a small non-contact type data carrier having a square area size of 10 mm × 10 mm or less using a hard and insulating plate-like base material are sealed with resin. In addition, a non-contact type data carrier is arranged on one surface of the base substrate, or on a through-hole portion or a recess of the base substrate, and the base substrate and the non-contact data carrier are connected to the first resin. A non-contact type data carrier device for manufacturing a non-contact type data carrier device sandwiched between a part and a second resin part and sealed with resin, in order: (a) A first resin portion that is flat and becomes a pedestal is formed in advance, and the base surface and the non-contact type data carrier are placed at a predetermined position on the one surface with the one surface facing upward. Formula data carrier installation process, (b) Potting so as to cover the base material and the non-contact type data carrier and curing to form a second resin portion, and the non-contact type data carrier installation step is performed. In a predetermined position in the surface direction of the base substrate, the non-contact type data carrier is fixed to the base substrate and the first resin portion, or the position of the non-contact type data carrier in the surface direction is limited. A method for producing a non-contact type data carrier device, wherein the non-contact type data carrier device is installed in a predetermined installation part, and the potting step is performed while the non-contact type data carrier is installed in the installation part. . 10. The method of manufacturing a non-contact type data carrier device according to claim 9 , wherein the installation part has at least a size not larger than a non-contact type data carrier on the second resin part side surface of the base substrate. A method of manufacturing a non-contact type data carrier device, wherein the non-contact type data carrier is fixedly installed at an adhesive layer portion having an adhesive layer on both surfaces thereof. 11. The method for manufacturing a non-contact type data carrier device according to claim 10 , wherein the adhesive layer portion is a double-sided tape. 12. The method of manufacturing a non-contact type data carrier device according to claim 10 , wherein the adhesive layer is a thermosetting type or a thermoplastic type. Manufacturing method. 10. The method of manufacturing a non-contact type data carrier device according to claim 9 , wherein the installation part is a part of the non-contact type data carrier in any one or more of the base substrate and the first resin part. Alternatively, the non-contact type data carrier device is produced by inserting the non-contact type data carrier into a fitting portion into which the whole is fitted. 14. The method of manufacturing a non-contact type data carrier device according to claim 13 , wherein the fitting portion is a through hole having a size larger than that of the non-contact type data carrier and formed in a base substrate. A method for manufacturing a non-contact type data carrier device. 15. The method of manufacturing a non-contact type data carrier device according to claim 9 , wherein the second resin portion, or the second resin portion and the first resin portion, The method for producing a non-contact type data carrier device is characterized in that both are cured using a resin solution obtained from a two-component polyurethane that cures at room temperature as a material.

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