JP2011096197A - Ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card capable of suppressing the warp of a card substrate produced when integrating the lamination of a resin sheet or produced by heating printing to print characters and images by heating, and capable of easily correcting the produced warp to flatten. <P>SOLUTION: The IC card includes an IC chip 2, an inlet sheet composed of an insulating substrate 1 and an antenna 3, a core sheet section composed of a first resin sheet 4, an over sheet section composed of a second resin sheet 5, and an adhesive sheet 6. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an IC card used for various certificates, electronic settlement systems, door opening and closing systems, and the like.

  In recent years, IC cards are used in various fields as information recording media, and are used for personal identification such as student ID cards, employee ID cards, and licenses. An IC card has an IC chip and an antenna built in a card base, and includes a non-contact type IC card that exchanges information with an external device using radio waves, and an external contact terminal that is electrically connected to the IC chip. An IC module in which an IC chip is sealed with a resin is provided on a card base, and a contact IC card for exchanging information with an external device via an external contact terminal, a non-contact IC card, and a contact IC There is a contact non-contact shared type IC card equipped with both communication means of the card.

  A non-contact type IC card is generally manufactured by stacking and integrating an electrically connected IC chip and an antenna between resin sheets. In general, a contact type IC card is produced by laminating and integrating resin sheets to produce a card base, a recess for inserting the IC module is provided in the card base, and the IC module is inserted into the recess and bonded to the card base. Is produced. A contact non-contact type IC card is generally formed by stacking and integrating an antenna between resin sheets to produce a card base, and a non-contact type IC card and a contact type IC card at a place where the antenna of the card base is embedded. A recess for inserting an IC module having both communication means is provided, an IC module having both communication means is inserted into the recess, and the antenna embedded in the card substrate and the IC module are electrically connected. It is produced by bonding to a card substrate.

  The card substrate that constitutes an IC card is generally produced by laminating and integrating a plurality of resin sheets, occupying most of the thickness of the card substrate, and exhibiting mechanical strength as an IC card such as rigidity of the card substrate. Thickness provided on both sides of the core sheet part to protect the core sheet part that bears and the purpose of protecting the printing applied to the surface of the core sheet part, and to add printability suitable for heating method printing such as sublimation printing And a thin oversheet part.

  Polyvinyl chloride (PVC) sheets have been the mainstream of resin sheets for card substrates, but in recent years, there has been an increasing demand for alternatives to halogen-free materials from the viewpoint of environmental protection. Mainstream has been replaced by resin-based sheets. As a sheet made of polyester resin, it is a copolymerized polyester (PETG) sheet containing 1,4-cyclohexanedimethanol as a copolymerization component from the viewpoint of being amorphous and having processing characteristics close to PVC, or from the viewpoint of versatility Biaxially stretched polyethylene terephthalate (PET) sheets are mainly used.

  The PETG sheet has a heat fusion function, and can be laminated and integrated without using an adhesive by heating and pressurizing a plurality of sheets. On the other hand, PET sheets do not have heat-fusibility, and generally, it is necessary to interpose an adhesive sheet such as hot melt between the PET sheets, heat and pressurize them, and laminate them together.

  The core sheet portion and the oversheet portion may be configured by configuring the core sheet portion with one type of resin sheet and the oversheet portion with one type of resin sheet. The resin sheet may be a different type of resin sheet.

  In general, antennas used for non-contact type IC cards and contact non-contact type IC cards are wound antennas produced by winding a coated conducting wire (for example, enameled wire) on the same surface, and resins such as PET and polyimide. Etching antenna produced by etching a metal foil such as laminated copper foil or aluminum foil on an insulating substrate made of, or a printed antenna formed by printing a conductive paste on an insulating substrate, etc. It is selected according to the frequency of the radio wave used for wireless communication.

  In recent years, with the demand for antenna miniaturization, microwave bands such as 13.56 MHz, 860 to 960 MHz, UHF band, and 2.45 GHz have been used as radio frequency bands. The antennas used in these frequency bands are thin and are generally formed on an insulating substrate in order to maintain the shape of the antenna. For example, an antenna (hereinafter referred to as an inlet sheet) using a resin sheet such as PET or polyimide as an insulating substrate is used.

  The lamination and integration of the inlet sheet and the resin sheet is not easy to obtain adhesion between the insulating sheet of the inlet sheet and the antenna, even when a PETG sheet having heat fusion properties is used for the resin sheet. Adhesion may be incomplete, and it is necessary to laminate and integrate by interposing, heating and pressing an adhesive sheet such as hot melt as in the case of stacking and integrating PET sheets.

  For example, the inlet sheet and the resin sheet are laminated and integrated, for example, a hot melt adhesive sheet is provided between the inlet sheet and the resin sheet, stacked, heated and pressurized, and the temperature of the resin sheet is changed to a hot melt adhesive. Heating is continued until the temperature that allows adhesion between the sheet and the resin sheet (lamination temperature) is reached. After reaching the predetermined temperature, cooling is performed, and the pressure is released when the temperature of the resin sheet reaches about room temperature. Is produced. As this pressure is released, the resin sheets facing each other with the inlet sheet or adhesive sheet as the boundary reveal the shrinkage generated by the heat during lamination, and the difference in shrinkage causes the card base to warp. .

  In order to prevent warping of the card base in the lamination integration of the card base, for example, a resin sheet and an adhesive sheet having the same thickness are provided on both sides of the inlet sheet, and the thickness direction of the card base is provided. It is necessary to place the inlet sheet at the center.

  However, IC chips and IC modules used for non-contact type IC cards and contact non-contact type IC cards are generally centered in the thickness direction of the card substrate in consideration of concealment for the purpose of preventing damage to external force and security. It is arranged near the part. Accordingly, in order to electrically connect the IC chip and the IC module to the IC chip and the IC module, it is necessary to dispose the antenna by the thickness of the IC chip and the IC module from the center in the thickness direction of the card base. There has been a problem that warpage occurs in the card base material manufactured by making it.

  Furthermore, shrinkage due to heat of the resin sheet occurs every time heat is applied, and even for an IC card that suppresses warpage of the card base during card manufacture, a sublimation retransfer printer, a hot melt retransfer printer, etc. When heat is applied to the card substrate, heat is applied to only one surface of the card substrate, causing shrinkage only on one surface of the card substrate and causing warpage of the card substrate.

  For example, Patent Document 1 discloses an IC card that can be restored to its original shape against the warp of the card base of these IC cards.

  In Patent Document 1, since a planar antenna coil formed of a copper-based shape memory alloy is used for an inlet sheet, it has a shape memory property that maintains a planar state, and heat is applied in the post-processing or use state of an IC card. When the card base is warped (curled) due to the influence of the machine, a restoring force that returns the warp from the inside of the card to the original flat state works, so contactlessness that can minimize card warpage Type IC card and contact non-contact shared type IC card are described.

JP 2006-139330 A

  However, for example, as described in Patent Document 1, with the technique of restoring the warp generated in the card base material of the IC card with the correction force of the antenna made of a metal foil made of a copper-based shape memory alloy, the card base material It cannot be applied to a contact type IC card having no antenna. Further, in the non-contact type IC card and the contact non-contact type IC card, in order to obtain a sufficient correction force with the antenna, the thickness of the metal foil constituting the antenna must be increased and the area of the metal foil must be increased. In some cases, the antenna shape is limited, and an arbitrary frequency band cannot be used.

  The present invention solves the above problems and suppresses the warpage of the card base material that occurs when the resin sheets are laminated and integrated, and the warpage of the card base material that occurs during heating-type printing that prints characters and images by heating. An object of the present invention is to provide an IC card that can easily correct and flatten the generated warp.

  In the present invention, a resin sheet made of a shape memory polymer and formed into a flat sheet shape at a temperature equal to or higher than the melting point is used for a core sheet portion constituting a card substrate.

  The shape memory polymer can memorize the shape formed at a temperature equal to or higher than the melting point. Furthermore, in the temperature range above the glass transition temperature (hereinafter referred to as Tg) and below the melting point, the shape memorized at the temperature above the melting point can be transformed into a free shape, and Tg can be maintained while maintaining this deformed state. This deformation can be fixed by cooling to a temperature below. Furthermore, the shape memorized at the temperature above the melting point is restored by heating to a temperature range below Tg and below the melting point in a state where the deformation is fixed by cooling to a temperature below Tg without applying external force. It has the characteristic that it can be.

  Furthermore, the shape memory polymer has a large change in elastic modulus at the boundary of Tg, and in a temperature range from Tg to less than the melting point, it exhibits a rubber-like flexibility (rubber state), and at a temperature below Tg. It will be in a hard and difficult to deform state (glass state).

  In the present invention, the core sheet portion of the card substrate is made of a resin sheet formed of a shape memory polymer having a Tg equal to or higher than the heating temperature of the heating method printing, and formed into a flat sheet shape at a temperature equal to or higher than the melting point. The lamination temperature at the time of formation is set to a Tg of the shape memory polymer or more and less than the melting point, the resin sheet is heated to the lamination temperature while being pressed, and then cooled to a Tg or less of the shape memory polymer in a pressurized state to produce a card substrate. In the core sheet portion of the present invention, the large shrinkage due to heat at the time of stacking and integration is not generated unlike the conventional core sheet portion, and the card substrate of the present invention has an inlet in the center portion of the card substrate. Even if the sheet is not arranged, the occurrence of warpage can be suppressed.

  Furthermore, in the present invention, the Tg of the shape memory polymer constituting the resin sheet of the core sheet portion is set to be equal to or higher than the heating temperature of the heating method printing represented by sublimation type retransfer printing or hot melt type retransfer printing. In the core sheet portion of the present invention, the large shrinkage due to the heat of the heating method printing does not occur unlike the conventional core sheet portion, and the core sheet portion of the present invention can be kept flat and heated. Warpage of the card base during system printing can be suppressed.

  Furthermore, in the present invention, the core of the present invention can be obtained by heating the card substrate to a temperature equal to or higher than Tg and lower than the melting point in an unloaded state even when the card substrate is warped in the storage environment or use environment of the IC card. The sheet portion can be restored to a flat state formed at a temperature equal to or higher than the melting point, and the card substrate can be corrected flat.

  According to the present invention, the core sheet portion constituted by the first resin sheet, the oversheet portion constituted by the second resin sheet sandwiching the core sheet portion, and between the core sheet portion and the oversheet portion. An IC card provided with a card substrate having an adhesive sheet to be interposed and bonded, and an IC chip or an IC module, wherein the first resin sheet has a glass transition temperature equal to or higher than a heating temperature of heating method printing. It is formed of a shape memory polymer, is formed into a flat sheet at a temperature equal to or higher than the melting point of the shape memory polymer, and the card substrate is heated to a lamination temperature not lower than the glass transition temperature and lower than the melting point while being pressurized. Then, the IC card is obtained by cooling and lowering the glass transition temperature or lower in a pressurized state and integrating the layers.

  In addition, according to the present invention, there is obtained the above IC card characterized in that the IC chip and an antenna electrically connected to the IC chip are embedded in the card base.

  According to the present invention, an antenna that is electrically connected to the IC module is embedded in the card base, and the IC module is inserted in the vicinity of the end of the antenna on one surface of the card base. A recess that exposes the end of the antenna, a solder paste that fills the recess that exposes the end of the antenna, and the IC module is inserted into and bonded to the recess into which the IC module is inserted. The above-described IC card is obtained in which the antenna and the IC module are electrically connected via a cable.

  In addition, according to the present invention, there is obtained the above IC card characterized in that a concave portion is provided on one surface of the card substrate, and the IC module is inserted and bonded.

  Further, according to the present invention, there is obtained the above IC card, wherein the oversheet portion is provided with a surface capable of printing characters and images by heating on at least one surface.

  According to the present invention, the core sheet portion of the card base is formed of a shape memory polymer having a Tg equal to or higher than the heating temperature of the heating method printing, and a resin sheet formed into a flat sheet at a temperature equal to or higher than the melting point is used. The lamination temperature at the time of lamination integration is Tg of the shape memory polymer or more and less than the melting point, the resin sheet is heated to the lamination temperature while being pressurized, and then cooled to the Tg of the shape memory polymer or less in the pressurized state. Since the core sheet portion of the present invention does not cause large shrinkage due to heat at the time of stacking and integration unlike the conventional core sheet portion, even if the inlet sheet is not arranged at the center of the card base material Thus, an IC card that can suppress the occurrence of warping of the card substrate is obtained.

  Further, according to the present invention, the core sheet portion of the present invention does not undergo large shrinkage due to the heat of the heating method printing unlike the conventional core sheet portion, so the core sheet portion of the present invention has a flat state. An IC card that can be maintained and can suppress warping of the card base during heating printing is obtained.

  Furthermore, according to the present invention, the core sheet portion of the present invention can be restored to a flat state formed at a temperature equal to or higher than the melting point by heating the card substrate to Tg or higher and lower than the melting point in an unloaded state. Therefore, an IC card can be obtained that can easily correct and flatten the warp generated on the card substrate.

FIG. 1A is a cross-sectional view of an IC card, and FIG. 1B is a cross-sectional view illustrating the configuration of the IC card. FIG. 2A is a cross-sectional view of an IC card, and FIG. 2B is a cross-sectional view of a card substrate for explaining a stacking process, illustrating a second embodiment of the IC card of the present invention. It is a figure explaining the manufacturing process of the card base material which concerns on 2nd Embodiment of the IC card of this invention, FIG. 3 (a) is sectional drawing of the card base material explaining the process of providing the recessed part for IC modules, FIG.3 (b) is sectional drawing of the card | curd base material explaining the process of providing the recessed part for solder paste. FIG. 4A is a cross-sectional view of an IC card, FIG. 4B is a cross-sectional view of a card substrate for explaining a lamination process, and FIG. (C) is sectional drawing of the card | curd base material explaining the process of providing the recessed part for modules.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
In the first embodiment, a non-contact type IC card will be described. FIG. 1 is a diagram for explaining a first embodiment of an IC card according to the present invention, FIG. 1 (a) is a sectional view of the IC card, and FIG. 1 (b) is a diagram for explaining the configuration of the IC card. FIG.

  As shown in FIG. 1A, the IC card according to the first embodiment of the present invention includes an IC chip 2, an inlet sheet composed of an insulating substrate 1 and an antenna 3, and a core composed of a first resin sheet 4. A sheet portion, an oversheet portion made of the second resin sheet 5, and an adhesive sheet 6 are included.

  As shown in FIG. 1B, the IC card according to the first embodiment of the present invention is provided with an adhesive sheet 6 on both surfaces of the first resin sheet 4, and the first resin sheet 4 An inlet sheet made by providing the antenna 3 electrically connected to the chip 2 on one surface of the insulating substrate 1 is sandwiched, and further, the second resin sheet 5 is stacked on the first resin sheet 4 and pressed. Then, it is heated up to the lamination temperature, and then cooled and integrated while being pressurized to produce a card substrate.

  In the IC card according to the first embodiment of the present invention, the first resin sheet 4 that is superimposed on the surface of the inlet sheet on which the IC chip 2 and the antenna 3 are provided, and the adhesive provided on the first resin sheet 4 The agent sheet 6 may be previously provided with a through hole or a recess in a portion where the IC chip 2 is embedded.

  The IC chip 2 only needs to have a non-contact communication function, and may use any frequency. Considering miniaturization and the like, for example, an IC chip having a non-contact communication function using a frequency of 13.56 MHz, 960 MHz, 2.45 GHz, or the like can be used, and it is preferable to select as appropriate.

  The antenna 3 is preferably selected according to the communication frequency and communication characteristics of the IC chip 2. For example, as shown in Fig. 1, an etching antenna produced by etching a metal foil such as copper foil or aluminum foil is good, and a wound antenna produced by winding a conductive wire covered with another, printed conductive paste The printed antenna etc. which were formed in this way can be used. In addition, you may use the conducting wire which consists of a copper-type alloy material with shape memory property in a winding antenna.

  The insulating substrate 1 may be a resin sheet having insulating properties. For example, a resin sheet such as PET or polyimide may be used, and it may be selected as appropriate. In addition, in the lamination and integration, if the shape of the antenna can be maintained, the insulating substrate 1 may not be used, and the antenna 3 may be provided on the surface of the adhesive sheet 6 provided on the first resin sheet 4.

  The first resin sheet 4 is made of a shape memory polymer having a Tg equal to or higher than the heating temperature of heating system printing using a sublimation type retransfer printer, a hot melt type retransfer printer, or the like, and a temperature equal to or higher than the melting point of the shape memory polymer. The shape memory polymer may be, for example, a polynorbornene-based polymer or a polyurethane-based polymer. The Tg of the shape memory polymer can be set to 110 ° C., for example, when the heating temperature of the heating method printing is 100 ° C.

  The second resin sheet 5 may be a resin sheet having a so-called image receiving layer on at least one surface on which characters and images can be printed by heating. For example, a PVC sheet, a PETG sheet, and an image receiving layer are provided. PET sheet or the like can be used.

  The adhesive sheet 6 only needs to have adhesiveness with the first resin sheet 4 and the second resin sheet 5, and considers the material of the first resin sheet 4 and the second resin sheet 5. For example, a polyamide-based, polyurethane-based, polyester-based, EVA-based hot melt sheet or the like can be used. In place of the adhesive sheet, a curable adhesive may be formed on the surface of the first resin sheet 4 or the second resin sheet 5 by silk screen printing or gravure printing.

  When the card base material constituting the IC card of the present invention is laminated and integrated, the lamination temperature is equal to or higher than the Tg of the first resin sheet 4 and a temperature range below the melting point of the first resin sheet 4. It can be selected as appropriate.

  With the configuration as described above, the warpage of the card base that occurs when the resin sheets are laminated and integrated, and the warpage of the card base that occurs in the heating method printing that prints characters and images by heating are suppressed and generated. A non-contact type IC card that can be easily corrected and flattened is obtained.

(Second Embodiment)
In the second embodiment, a contact / contactless IC card will be described. FIG. 2 is a diagram for explaining a second embodiment of the IC card of the present invention, FIG. 2 (a) is a sectional view of the IC card, and FIG. It is sectional drawing of a card | curd base material.

  FIG. 3 is a diagram for explaining a card substrate manufacturing process according to the second embodiment of the IC card of the present invention. FIG. 3A is a cross-sectional view of a card base material for explaining a process of providing a concave portion for an IC module, and milling that provides a concave portion for inserting and bonding an IC module on one surface of the card base material. It is a figure explaining a process. FIG. 3B is a cross-sectional view of the card base material for explaining the step of providing the solder paste recess, and the milling step of providing the recess for filling the solder paste at the antenna end of the IC module recess. FIG.

  As shown in FIG. 2A, the IC card according to the second embodiment of the present invention includes an IC module 8a having a substrate portion 15a having an antenna connection terminal 11a and a mold portion 16a, and an antenna end portion 9a. It comprises an inlet sheet composed of an antenna 3a and an insulating substrate 7a, a core sheet portion composed of a first resin sheet 4a, an oversheet portion composed of a second resin sheet 5a, an adhesive sheet 6a, and a solder paste 10a. .

  As shown in FIG. 2B, the IC card according to the second embodiment of the present invention is provided with an adhesive sheet 6a on both surfaces of the first resin sheet 4a. The inlet sheet produced by providing the antenna 3a having the end portion 9a on one surface of the insulating substrate 7a is sandwiched, and the second resin sheet 5a is further stacked on the first resin sheet 4a, and the lamination temperature is increased while pressing. Heat, then cool with pressure applied, and stack and integrate to produce a card substrate.

  Next, as shown in FIG. 3A, a stepped recess 13a into which the IC module 8a is inserted is provided in the vicinity of the antenna end portion 9a on one surface of the produced card base.

  Next, as shown in FIG. 3B, a recess 14a that exposes the antenna end 9a is provided at a place where the antenna end 9a of the stepped recess 13a is embedded, and the solder paste 10a is provided in the recess 14a. After filling (see FIG. 2A), the IC module 8a is inserted into the stepped recess 13a, and the IC module 8a is heated to apply heat to the solder paste 10a, and the antenna end 9a is connected to the antenna connection terminal. 11a is soldered, and the IC module 8a is thermocompression-bonded to the card base material and bonded. Note that an adhesive sheet may be used for bonding the IC module 8a to the card substrate, for example, an EVA-based hot melt sheet or the like can be used.

  The IC module 8a includes an IC chip having a contact communication function and a non-contact communication function, a mold part 16a in which the IC chip is resin-sealed, and an antenna connection terminal 11a that is electrically connected to an external contact terminal and an antenna. Any IC module including the portion 15a may be used and can be selected as appropriate. In the non-contact communication function, any frequency may be used, and an IC module using frequencies such as 13.56 MHz, 960 MHz, and 2.45 GHz can be used in consideration of downsizing and the like.

  The antenna 3a may be appropriately selected according to the communication frequency and communication characteristics of the IC module 8a. For example, as shown in FIG. 2 and FIG. 3, a wound antenna produced by winding a coated conductor is good. In addition, an etched antenna produced by etching a metal foil such as copper foil or aluminum foil, conductive A printed antenna formed by printing a functional paste can be used. In addition, you may use the conducting wire which consists of a copper-type alloy material with shape memory property in a winding antenna.

  The insulating substrate 7a can be the same as the insulating substrate 1 used in the first embodiment, and is preferably selected as appropriate.

  The first resin sheet 4a can be the same as the first resin sheet 4 used in the first embodiment, and is preferably selected as appropriate.

  The second resin sheet 5a can be the same as the second resin sheet 5 used in the first embodiment, and should be appropriately selected.

  The adhesive sheet 6a can be the same as the adhesive sheet 6 used in the first embodiment, and should be appropriately selected.

  The solder paste 10a is used for electrical connection between the antenna connection terminal 11a and the antenna end portion 9a, and can be soldered at a temperature as low as possible in order to avoid the influence on the card base in which the antenna 3a is embedded. Pastes are preferred and should be selected as appropriate.

  When the card base material constituting the IC card of the present invention is laminated and integrated, the lamination temperature is not less than Tg of the first resin sheet 4a and may be within a temperature range below the melting point of the first resin sheet 4a. It can be selected as appropriate.

  With the configuration as described above, the warpage of the card base that occurs when the resin sheets are laminated and integrated, and the warpage of the card base that occurs in the heating method printing that prints characters and images by heating are suppressed and generated. A contact non-contact shared type IC card that can be easily flattened by warping can be obtained.

(Third embodiment)
In the third embodiment, a contact IC card will be described. FIG. 4 is a diagram for explaining a third embodiment of the IC card of the present invention, FIG. 4 (a) is a cross-sectional view of the IC card, and FIG. 4 (b) explains a stacking process. It is sectional drawing of a card | curd base material. FIG.4 (c) is sectional drawing of the card base material explaining the process of providing the recessed part for Joules, and the milling process which provides the recessed part for inserting and adhering an IC module in one surface of a card base material FIG.

  As shown in FIG. 4A, an IC card according to the third embodiment of the present invention includes an IC module 8b having a substrate portion 15b and a mold portion 16b, and a core sheet portion comprising a first resin sheet 4b. And an oversheet portion made of the second resin sheet 5b, an adhesive sheet 6b, and an adhesive 12b.

  As shown in FIG. 4B, the IC card according to the third embodiment of the present invention sandwiches the first resin sheet 4b serving as the core sheet portion with the adhesive sheet 6b, and the first resin sheet 4b The first resin sheet 4b is superimposed on the adhesive sheet 6b provided on both sides, heated to the lamination temperature while being pressurized, then cooled while being pressurized, and laminated and integrated to produce a card substrate. In addition, the 1st resin sheet 4b may comprise thickness required as a core sheet | seat part by 1 sheet, or may be comprised by multiple sheets.

  Next, as shown in FIG. 4C, a stepped recess 13b into which the IC module 8b is inserted is provided on one surface of the produced card base, and the substrate portion 15b having the bowl shape of the IC module 8b is provided. After the adhesive 12b (see FIG. 4A) is applied, the IC module 8b is bonded to the card base material by being inserted into the stepped recess 13b.

  The IC module 8b may be any IC module including an IC chip having a contact communication function, a mold part 16b in which the IC chip is resin-sealed, and a substrate part 15b having an external contact terminal.

  The same thing as the 1st resin sheet 4 used in 1st Embodiment can be used for the 1st resin sheet 4b, and it is good to select suitably.

  The second resin sheet 5b can be the same as the second resin sheet 5 used in the first embodiment, and may be appropriately selected.

  The adhesive sheet 6b can be the same as the adhesive sheet 6 used in the first embodiment, and should be appropriately selected.

  The adhesive 12b adheres the substrate portion of the IC module 8b and the card base, and the first resin sheet 4b and the second resin sheet 5b constituting the card base and the material of the substrate portion of the IC module 8b. It is good to select considering the material. For example, a thermosetting resin adhesive, a hot melt adhesive, a thermoplastic resin adhesive, or the like can be used.

  When the card base material constituting the IC card of the present invention is laminated and integrated, the lamination temperature is equal to or higher than the Tg of the first resin sheet 4b and within a temperature range lower than the melting point of the first resin sheet 4b. It can be selected as appropriate.

  With the configuration as described above, the warpage of the card base that occurs when the resin sheets are laminated and integrated, and the warpage of the card base that occurs in the heating method printing that prints characters and images by heating are suppressed and generated. A contact type IC card that can be easily flattened by warping can be obtained.

  Embodiments of the present invention will be described below with reference to the drawings.

Example 1
Hereinafter, an IC card according to Embodiment 1 of the present invention will be described. As shown in FIG. 1, the IC card according to Example 1 of the present invention uses an IC chip 2 that can perform wireless communication with radio waves having a frequency of 960 MHz. Next, a PET sheet having a length dimension of 100 mm, a width dimension of 70 mm, and a thickness of 50 μm is used as the insulating substrate 1, and a copper foil having a thickness of 35 μm is bonded to one surface of the insulating substrate 1. Based on the etching technique, after an antenna pattern was printed on the copper foil surface, unnecessary copper foil portions were removed, and an antenna 3 composed of a planar antenna was produced on the insulating substrate 1.

  Next, the antenna 3 and the IC chip 2 were electrically connected, and the IC chip 2 was placed on the insulating substrate 1 to produce an inlet sheet.

  Next, in the heating method printing on the IC card, printing using a sublimation retransfer printer having a heating temperature of 80 ° C. or less is performed, and Tg is 90 ° C. as the resin constituting the first resin sheet 4. Using a polyurethane shape memory polymer with a melting point of 170 ° C., heat the polyurethane shape memory polymer to 180 ° C. with a hot press machine, pressurize at a pressure of 0.5 MPa, and cool to room temperature while maintaining the pressure. A flat sheet having a length dimension of 100 mm, a width dimension of 70 mm, and a thickness of 300 μm, and a flat sheet having a length dimension of 100 mm, a width dimension of 70 mm, and a thickness of 100 μm The first resin sheet 4 was produced.

  Next, the manufactured first resin sheet 4 having a thickness of 300 μm and the first resin sheet 4 having a thickness of 100 μm have a length dimension of 100 mm, a width dimension of 70 mm, and a thickness of 30 μm. The first resin sheet having a thickness of 300 μm sandwiched between the adhesive sheet 6 and the surface of the manufactured inlet sheet on which the antenna 3 and the IC chip 2 are provided. 4 was stacked, and the first resin sheet 4 having a thickness of 100 μm sandwiched between the adhesive sheets 6 was stacked on the surface of the opposite inlet sheet.

  Next, the surface of the adhesive sheet 6 that is not in contact with the inlet sheet of the first resin sheet 4 is provided with sublimation printing suitability, the length dimension is 100 mm, the width dimension is 70 mm, and the thickness is 125 μm. The second resin sheet 5 made of a PETG sheet is stacked, heated while being pressurized at a pressure of 0.6 MPa with a hot press machine, heated to a lamination temperature of 120 ° C., then cooled to room temperature while being pressurized, and laminated and integrated. A card substrate was prepared. The laminating temperature was 120 ° C. because the Tg of the polyurethane-based shape memory polymer constituting the first resin sheet 4 was 90 ° C. and the melting point was 170 ° C.

  Next, using a card punching machine, a non-contact type IC card was manufactured by punching into a card having a length dimension of 85.60 mm and a width dimension of 54.00 mm. According to the JIS standard, the dimensions of the IC card are 85.47 mm to 85.72 mm in the length direction and 53.92 mm to 54.03 mm in the width direction.

(Example 2)
Hereinafter, an IC card according to Embodiment 2 of the present invention will be described. As shown in FIG. 2, the IC card according to the second embodiment of the present invention has a contact communication function on a substrate portion 15 a made of a glass epoxy substrate having an external contact terminal and an antenna connection terminal 11 a electrically connected to the antenna, and An IC chip capable of wireless communication with radio waves having a frequency of 13.56 MHz was installed, and an IC module 8a provided with a mold portion 16a formed by resin-sealing the IC chip was used.

  Next, a PETG sheet having a length dimension of 100 mm, a width dimension of 70 mm, and a thickness of 125 μm is used as an insulating substrate 7a, and a urethane-coated copper wire having a wire diameter of 100 μm is wound in a loop shape to produce an antenna 3a. After heating the antenna 3a to a temperature of 100 ° C., the antenna 3a was pressurized at a pressure of 0.3 MPa and embedded in the insulating substrate 7a to produce an inlet sheet.

  Next, in the heating system printing on the IC card, printing using a sublimation type retransfer printer having a heating temperature of 80 ° C. or less is performed, and Tg is 90 ° C. as a resin constituting the first resin sheet 4a. Using a polyurethane shape memory polymer with a melting point of 170 ° C., heat the polyurethane shape memory polymer to 180 ° C. with a hot press machine, pressurize at a pressure of 0.5 MPa, and cool to room temperature while maintaining the pressure. A flat sheet having a length dimension of 100 mm, a width dimension of 70 mm, and a thickness of 180 μm was produced as the first resin sheet 4a.

  Next, the produced first resin sheet 4a is sandwiched between adhesive sheets 6a made of a polyurethane-based hot melt sheet having a length dimension of 100 mm, a width dimension of 70 mm, and a thickness of 30 μm. The first resin sheet 4a sandwiched between the adhesive sheets 6a was stacked on both surfaces of the sheet.

  Next, the surface of the adhesive sheet 6a not in contact with the inlet sheet of the first resin sheet 4a is provided with sublimation printing suitability, the length dimension is 100 mm, the width dimension is 70 mm, and the thickness is 100 μm. The second resin sheet 5a made of a PETG sheet is stacked, heated while being pressurized at a pressure of 0.6 MPa with a hot press machine, heated to a lamination temperature of 120 ° C., then cooled to room temperature while being pressurized, and laminated and integrated. A card substrate was prepared. The laminating temperature was 120 ° C. because the Tg of the polyurethane-based shape memory polymer constituting the first resin sheet 4a was 90 ° C. and the melting point was 170 ° C.

  Next, a card punching machine was used to punch a card having a lengthwise dimension of 85.60 mm and a widthwise dimension of 54.00 mm. As shown in FIG. In the vicinity of the antenna end portion 9a, a stepped recess 13a into which the IC module 8a is inserted was produced with a milling machine.

  Next, a recess 14a for exposing the antenna end portion 9a was manufactured by a milling machine at a place where the antenna end portion 9a of the manufactured stepped recess 13a was embedded.

  Next, as shown in FIG. 2, a solder paste having a melting temperature of 135 ° C. and containing Sn (tin), Bi (bismuth), and Ag (silver) is used as a solder paste 10a. After the IC is filled, the IC module 8a is inserted into the stepped recess 13a, the solder paste 10a is heated via the substrate portion 15a of the IC module 8a, and the antenna end portion 9a is soldered to the antenna connection terminal 11a. The IC module 8a was thermocompression bonded to the card base material and bonded to produce a contact / contactless shared type IC card.

(Example 3)
Hereinafter, an IC card according to Embodiment 3 of the present invention will be described. As shown in FIG. 4, the IC card according to the third embodiment of the present invention is provided with an IC chip having a contact communication function on a substrate portion 15b made of a glass epoxy substrate having an external contact terminal, and the IC chip is sealed with a resin. The IC module provided with the molded part 16a that was stopped was designated as an IC module 8b.

  Next, in the heating method printing on the IC card, printing using a sublimation type retransfer printer having a heating temperature of 80 ° C. or less is performed, and Tg is 90 ° C. as a resin constituting the first resin sheet 4b. Using a polyurethane shape memory polymer with a melting point of 170 ° C., heat the polyurethane shape memory polymer to 180 ° C. with a hot press machine, pressurize at a pressure of 0.5 MPa, and cool to room temperature while maintaining the pressure. A flat sheet having a length dimension of 100 mm, a width dimension of 70 mm, and a thickness of 500 μm was prepared as a first resin sheet 4b.

  Next, the produced first resin sheet 4b is sandwiched between adhesive sheets 6b made of a polyurethane-based hot melt sheet having a length dimension of 100 mm, a width dimension of 70 mm, and a thickness of 30 μm. The second resin sheet 5b made of a PETG sheet having a sublimation printing suitability, a length dimension of 100 mm, a width dimension of 70 mm, and a thickness of 150 μm is stacked on the agent sheet 6a with a hot press machine. After heating while pressing at a pressure of 0.6 MPa and heating to a lamination temperature of 120 ° C., it was cooled to room temperature while being pressurized, and laminated and integrated to produce a card substrate. The lamination temperature was set to 120 ° C. because the Tg of the polyurethane-based shape memory polymer constituting the first resin sheet 4b was 90 ° C. and the melting point was 170 ° C.

  Next, a card punching machine is used to punch a card having a lengthwise dimension of 85.60 mm and a widthwise dimension of 54.00 mm, and the milling machine inserts the IC module 8b into a stepped recess 13b. Was made.

  Next, after applying an adhesive 12b made of a thermosetting epoxy adhesive to the substrate portion 15b of the IC module 8b, the IC module 8b is inserted into the stepped recess 13b, and the glass epoxy substrate of the IC module 8b is attached. Then, heat was applied to the adhesive 12b, and the IC module 8b was fixed to the card substrate to produce a contact type IC card.

(Comparative example)
Next, as a comparative example, a PETG sheet is used for the core sheet portion of the IC card of Examples 1 to 3 described above, and the conventional non-contact type IC card and contact non-contact are manufactured under the same manufacturing conditions as Examples 1 to 3. A shared IC card and contact IC card were prepared.

(Evaluation of warpage after manufacturing process)
Next, as a result of measuring the warpage of each of the IC cards manufactured in Examples 1 to 3 and the comparative example 10 sheets, a warp of 1 to 2 mm occurred in any of the IC cards of the comparative examples. No warpage occurred in any of the IC cards manufactured in Examples 1 to 3.

(Evaluation of warpage after heating method printing)
Next, after printing at a heating temperature of 80 ° C. using one of the sublimation retransfer printers on one side of the IC cards manufactured in Examples 1 to 3 and the comparative example, each IC card is printed. As a result of measuring card warpage by 10 pieces, warpage of 2 to 3 mm occurred in any of the IC cards of the comparative examples, but no warpage occurred in all of the IC cards manufactured in Examples 1 to 3. It was.

(Evaluation of warpage restoration)
Next, the IC cards produced in the above-described Examples 1 to 3 and the comparative example were heated and bent at 100 ° C., and then cooled to room temperature in a bent state to warp the IC card. Next, after the warped IC card was heated again to 100 ° C., it was allowed to cool to room temperature on the surface plate without applying a load. Next, as a result of measuring 10 warpages of each IC card, the warpage of 1 to 2 mm and distortion of the entire card occurred in any of the IC cards of the comparative examples. All the produced IC cards were restored to flat cards.

  As described above, according to the present invention, the card base generated by the heating method printing that prints characters and images by heating and the warping of the card base that occurs when the resin sheets are laminated and integrated, which has not been conventionally obtained. A non-contact type IC card, a contact non-contact common type IC card, and a contact type IC card that can suppress the warp of the material and can easily correct and flatten the generated warp were obtained.

  Although the embodiments and examples of the present invention have been described with reference to the drawings, the present invention is not limited to these embodiments and examples, and members and configurations are within the scope of the present invention. Any change is included in the present invention. That is, it goes without saying that the present invention also includes various modifications and corrections that would be obvious to those skilled in the art.

DESCRIPTION OF SYMBOLS 1, 7a Insulating substrate 2 IC chip 3, 3a Antenna 4, 4a, 4b 1st resin sheet 5, 5a, 5b 2nd resin sheet 6, 6a, 6b Adhesive sheet 8a, 8b IC module 9a Antenna terminal part 10a Solder paste 11a Antenna connection terminal 12b Adhesives 13a, 13b Stepped recesses 14a Recesses 15a, 15b Substrate portions 16a, 16b Mold portions

Claims (5)

  A core sheet portion constituted by a first resin sheet, an oversheet portion constituted by a second resin sheet sandwiching the core sheet portion, and an adhesive interposed between and bonded to the core sheet portion and the oversheet portion An IC card having a card substrate having a sheet and an IC chip or an IC module, wherein the first resin sheet is made of a shape memory polymer having a glass transition temperature equal to or higher than a heating temperature of heating method printing. The card base material is formed into a flat sheet at a temperature equal to or higher than the melting point of the shape memory polymer, and the card substrate is heated to a lamination temperature not lower than the glass transition temperature and lower than the melting point while being pressurized. An IC card which is cooled to the glass transition temperature or lower and laminated and integrated.   2. The IC card according to claim 1, wherein the IC chip and an antenna electrically connected to the IC chip are embedded in the card base.   An antenna that is electrically connected to the IC module is embedded in the card base, and a recess for inserting the IC module and an end of the antenna are inserted in the vicinity of the end of the antenna on one side of the card base. A recess to be exposed is provided, a solder paste is filled in the recess that exposes the end of the antenna, the IC module is inserted into and bonded to the recess into which the IC module is inserted, and the antenna and the IC are interposed through the solder paste. 2. The IC card according to claim 1, wherein the modules are electrically connected.   The IC card according to claim 1, wherein a concave portion is provided on one surface of the card substrate, and the IC module is inserted and bonded.   5. The IC card according to claim 1, wherein the oversheet portion is provided with a surface capable of printing characters and images by heating on at least one surface.

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