JP6070447B2 - IC card, laminated sheet, and IC card manufacturing method - Google Patents

Description

  The present invention relates to an IC card incorporating an IC chip, a laminated sheet, and an IC card manufacturing method.

Conventionally, there has been an IC card in which a porous core sheet is laminated to absorb a protruding shape such as an electronic component mounted on an inlet (for example, Patent Document 1).
However, in the conventional IC card, the resin sheet is deformed according to the protruding shape of an electronic component or the like, and the deformation is absorbed by the porous core sheet. For this reason, the conventional IC card cannot sufficiently absorb the protruding shape of the electronic component or the like when the resin sheet cannot be deformed well, and there is a possibility that unevenness or the like is generated on the card surface.
Further, the IC chip of the conventional IC card has been greatly damaged in a hot press process at the time of manufacture.

JP 2010-234654 A

  An object of the present invention is to provide an IC card, a laminated sheet, and a method for manufacturing an IC card that can improve the appearance quality and can reduce damage to the IC chip during processing.

  The present invention solves the problems by the following means. In addition, in order to make an understanding easy, although the code | symbol corresponding to embodiment of this invention is attached | subjected and demonstrated, it is not limited to this. In addition, the configuration described with reference numerals may be improved as appropriate, or at least a part thereof may be replaced with another configuration.

・ The first invention is
An IC card containing an IC chip (41, 541),
A module substrate (40, 540) on which an IC chip is mounted;
A first surface porous layer (30, 330, 430, 530) having an outer shape larger than that of the module substrate and directly laminated on the first surface side which is the mounting surface side of the IC chip of the module substrate;
Second surface non-porous layer (50, 250, 350, 460, 550) having a larger outer shape than the module substrate and directly laminated on the second surface side opposite to the first surface side of the module substrate And
The first surface porous layer and the second surface non-porous layer are bonded by thermal welding in a range (A1) having an outer shape larger than the module substrate,
Is an IC card characterized by
・ The second invention is
In the IC card of the first invention,
A second surface porous layer (252,551) laminated on the second surface side of the second surface non-porous layer (250,550);
Is an IC card characterized by
・ The third invention is
In the IC card of the second invention,
The module substrate (540) includes a protrusion (544) on the second surface side;
Is an IC card characterized by

・ The fourth invention is
A laminated sheet processed into an IC card by laminating other sheet materials,
A module substrate (40, 540) on which an IC chip (41, 541) is mounted;
A first surface porous layer (30, 330, 430, 530) having an outer shape larger than that of the module substrate and directly laminated on the first surface side which is the mounting surface side of the IC chip of the module substrate;
Second surface non-porous layer (50, 250, 350, 460, 550) having a larger outer shape than the module substrate and directly laminated on the second surface side opposite to the first surface side of the module substrate And
The first surface porous layer and the second surface non-porous layer are bonded by thermal welding in a range (A1) having an outer shape larger than the module substrate,
It is the lamination sheet characterized by these.

-The fifth invention is
An IC card manufacturing method according to any one of the first to third inventions,
Directly laminating the second surface non-porous layer (50, 250, 350, 460, 550) on the second surface side of the module substrate (40, 540);
Directly laminating the first surface porous layer (30, 330, 430, 530) on the first surface side of the module substrate;
Laminating a sheet on the first surface side of the first surface porous layer;
A hot pressing step of hot pressing in a state where at least four layers of the sheet on the first surface side, the first surface porous layer, the module substrate, and the second surface non-porous layer are laminated.
An IC card manufacturing method characterized by the above.
-The sixth invention is
An IC card manufacturing method according to any one of the first to third inventions,
Second surface non-porous layer sheet material in which the second surface non-porous layer (50, 250, 350, 460, 550) is multi-faced on the second surface side of the plurality of module substrates (40, 540). Directly stacking (50A);
A step of directly laminating the first surface porous layer sheet material (30A) on which the first surface porous layers (30, 330, 430, 530) are multifaceted on the first surface side of the plurality of module substrates. When,
Laminating a multi-sided sheet material on which a sheet is multi-sided on the first side of the first-side porous layer sheet material;
A plurality of combinations in which at least four layers of the multi-sided sheet material on the first surface side, the first surface porous layer sheet material, the module substrate, and the second surface non-porous layer sheet material were stacked were stacked in combination. A multi-stage hot pressing step for performing multi-stage hot pressing in a state;
An IC card manufacturing method characterized by the above.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the IC card which can improve external appearance quality and can reduce damage to the IC chip at the time of a process, a lamination sheet, and an IC card can be provided.

It is the top view and sectional drawing of the card | curd 1 of 1st Embodiment. It is a perspective view explaining the form of multiple imposition of each layer of a 1st embodiment. It is sectional drawing explaining the hot press process of 1st Embodiment. It is sectional drawing explaining the hot press process of 1st Embodiment. It is sectional drawing in the case of manufacturing the card | curd 1 of 1st Embodiment by multistage hot pressing. It is sectional drawing explaining the laminated constitution of the card | curd 201 of 2nd Embodiment. It is sectional drawing explaining the laminated constitution of the card | curd 301 of 3rd Embodiment. It is sectional drawing explaining the laminated constitution of the card | curd 401 of 4th Embodiment. It is sectional drawing explaining the laminated constitution of the card | curd 501 of 5th Embodiment. It is a perspective view explaining the form of multiple imposition of each layer of lamination sheet 601A of a 6th embodiment. It is sectional drawing explaining the hot press process which manufactures a card | curd from the laminated sheet 601A of 6th Embodiment. It is sectional drawing explaining the laminated constitution of the card | curd 701 of 7th Embodiment.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings and the like.
FIG. 1 is a plan view and a cross-sectional view of a card 1 according to the first embodiment.
FIG. 1A is a plan view of the card 1.
FIG. 1B is a cross-sectional view (a cross-sectional view taken along the line BB in FIG. 1A) illustrating the layer structure of the card 1.
In the embodiment and the drawings, a view of the upper surface of the card 1 viewed from the normal direction (thickness direction) is referred to as a plan view. In the plan view, the longitudinal direction of the card 1 is defined as the left-right direction X, and the lateral direction is defined as the vertical direction Y. The shape in the plan view is appropriately referred to as a planar shape.
Note that in each drawing, the size and the like of the vertical direction Z (thickness direction) and the like are appropriately exaggerated in order to clearly show the figure.
The card 1 is a non-contact type IC card having a built-in IC chip 41 and an overall thickness of about 0.8 mm. The card 1 conforms to a communication standard such as MIFARE (registered trademark) or FeliCa (registered trademark).

The card 1 includes an upper layer 10, an intermediate layer 20, a porous layer 30 (first surface porous layer), a module substrate 40, a base material layer 50 (second surface non-porous) in order from the upper side Z2 to the lower side Z1. Layer) and the lower layer 60 are laminated.
The module substrate 40 and the layers 10, 20, 30, 50, 60 may be configured by stacking a plurality of sheets instead of a single sheet material. However, the porous layer 30 is directly laminated on the upper side Z2 (first surface side) of the module substrate 40, and the base material layer 50 is directly laminated on the lower side Z1 (second surface side) of the module substrate 40.
In the planar shape, the outer shapes of the layers 10, 20, 30, 50, 60 are equal and are slightly larger than the module substrate 40 (for example, about 0.5 to several mm).

An example of the material and thickness of the module substrate 40 and each layer is as follows.
-Upper layer 10: Foamed PET sheet 125 μm
Intermediate layer 20: PVC sheet 50 μm
-Porous layer 30: Porous sheet having a porosity of 65% (foamed sheet or porous sheet mainly composed of polyolefin such as polyethylene or polypropylene, foamed polyvinyl chloride sheet, foamed soft acrylic resin sheet, foamed chlorinated poly (Vinyl chloride sheet, expanded polyvinyl chloride-vinyl acetate copolymer sheet) 254 μm
As the porous layer 30, for example, trade name Teslin (registered trademark of PPG Industries, Inc.), trade name YUPO (registered trademark of YUPO Corporation), and the like can be used.

-Base material of module substrate 40: PET sheet (or PEN sheet) 45 μm
-Base material layer 50: PVC sheet 360 μm
Lower layer 60: Foamed PET sheet 125 μm
The main reason for using a PVC sheet and a PET-G sheet as the intermediate layer 20 and the base material layer 50 is to allow the intermediate layer 20 and the base material layer 50 to be thermally welded to other layers. For this reason, the resin sheet used as the intermediate | middle layer 20 and the base material layer 50 should just be heat-welded with another layer, for example, can be selected from a PVC sheet, a PET-G sheet, and a PC sheet.
In addition, you may provide the printing layer which expresses adhesiveness in the lower surface (or upper surface of the intermediate | middle layer 20) of the upper layer 10 by heating. Thereby, the adhesive strength between the upper layer 10 (foamed PET sheet) and the intermediate | middle layer 20 (PVC sheet etc.) improves.
Similarly, a printed layer exhibiting adhesiveness may be provided on the upper surface of the lower layer 60 (or the lower surface of the base material layer 50). Also in this case, the adhesive strength between the base material layer 50 (PVC sheet or the like) and the lower layer 60 (foamed PET sheet) is improved.
In addition, in order to improve adhesion | attachment between a foaming PET sheet | seat and a PVC sheet | seat etc., the adhesive layer which expresses adhesiveness in this way can be provided suitably. The same applies to each embodiment described later.

The upper layer 10 is laminated on the uppermost layer. On the upper surface of the upper layer 10, the card name of the card 1 is printed.
The intermediate layer 20 is a layer that bonds between the upper layer 10 and the porous layer 30.
The porous layer 30 is a layer for embedding an electrical component such as the module substrate 40 itself or the IC chip 41 mounted on the module substrate 40. The process of embedding these will be described later.

The module substrate 40 includes an electronic component such as an IC chip 41 and an antenna 42.
The IC chip 41 is a semiconductor integrated circuit element. When the card 1 is used as, for example, a prepaid card, the IC chip 41 stores a balance, identification information, and the like.
The IC chip 41 is mounted on the upper surface of the module substrate 40. The height of the IC chip 41 (the height from the upper surface of the module substrate 40 to the tip of the IC chip 41) is about 100 μm.

  The antenna 42 is a loop coil antenna that communicates with an external reader / writer (not shown). The antenna 42 is a conductor formed on the upper surface of the module substrate 40 and is formed by a method such as etching. The antenna 42 supplies electric power to the IC chip 41 by generating a current due to the magnetic field formed by the reader / writer when the card 1 is held over the reader / writer. As a result, the IC chip 41 transmits and receives information to and from the reader / writer in a non-contact manner.

The base material layer 50 is a layer that becomes the base material of the card 1.
As shown by hatching in FIG. 1A, the porous layer 30 and the base material layer 50 are larger than the outer shape of the module substrate 40 and have a welding surface 50a in a range inside the card outer shape 1a (hereinafter referred to as an outer peripheral range A1). Are bonded by thermal welding. As a result, the module substrate 40 is held inside the card 1.
In general, the PET sheet (or PEN sheet) constituting the module substrate 40 is a thermoplastic resin sheet (porous sheet, PVC sheet, PET-G sheet, PET sheet, foamed PET sheet, PEN sheet, etc.). It has the property that it is difficult to heat-weld and sufficient adhesive strength cannot be obtained even if it can be heat-welded. In addition, the porous layers have a property that they are difficult to be thermally welded with the sheet material as described above. Therefore, the card 1 holds the module substrate 40 from the periphery by thermally welding the porous layer 30 and the base material layer 50 (PVC sheet) in the outer peripheral range A1.
The lower layer 60 is laminated on the lowermost layer. On the lower layer 60, the usage method (not shown) of the card 1 is printed.

Next, the manufacturing process of the card 1 will be described.
FIG. 2 is a perspective view illustrating a multi-faceted form of each layer according to the first embodiment.
3 and 4 are cross-sectional views illustrating the hot pressing process of the first embodiment.
As shown in FIG. 2, for manufacturing the card 1, five sheet materials 10 </ b> A to 30 </ b> A, 50, 60 </ b> A in which the upper layer 10, the intermediate layer 20, the porous layer 30, the base material layer 50, and the lower layer 60 are multifaceted. Is used.

The card 1 is manufactured by an operator or a heat press according to the following steps.
(Lamination process)
As shown in FIGS. 2 and 3, the plurality of module substrates 40 are placed in a range corresponding to the card outer shape 1 a on the sheet material 30 </ b> A on which the porous layer 30 is multifaceted. In that state, the sheet material 10A (upper layer 10), the sheet material 20A (intermediate layer 20), the sheet material 30A (porous layer 30), the module substrate 40, and the sheet material 50A (base material) are placed between the hot press plates 81 and 82. Layer 50) and sheet material 60A (lower layer 60) are laminated in this order.
Thereby, the porous layer 30 is directly disposed on the upper side Z <b> 2 of the module substrate 40, and the base material layer 50 is directly disposed on the lower side Z <b> 1 of the module substrate 40.

(Hot press process)
As shown in FIG. 4A, the upper surface of the sheet material 10A and the lower surface of the sheet material 60A are heated and pressed by hot press plates 81 and 82.
At this time, the lower surface of the softened sheet material 30A comes into contact with the tip of the IC chip 41 of the module substrate 40, and the IC chip 41 is directly embedded in the sheet material 30A. The sheet material 30A is sufficiently flexible by heating and is porous and can be easily deformed. For this reason, the pressure applied to the IC chip 41 is small, and the IC chip 41 is prevented from being damaged.

  Therefore, the card 1 does not require a thin spacer or printed layer for adjusting the thickness of the outer peripheral range A1, and does not require processing such as an opening hole for the IC chip 41 to escape from the sheet material 30A. Can be manufactured at low cost.

As heating and pressurization progress, the antenna 42 is also embedded in the sheet material 30A.
As shown in FIG. 4B, the base material itself of the module substrate 40 is also embedded in the sheet material 30A. And the sheet | seat material 30A is mainly compressed and the card | curd 1 is shape | molded by about 0.8 mm. FIG. 4B is a conceptual diagram. Actually, the module substrate 40 is slightly bent and deformed toward the sheet material 50A, and may be slightly embedded in the sheet material 50A.

Similarly, when the base material of the module substrate 40 is embedded, the lower surface of the softened sheet material 30 </ b> A can be easily deformed while being in contact with the upper surface of the module substrate 40. For this reason, the sheet material 30A and the sheet material 50A are in surface contact with each other in the outer peripheral range A1, and the interlayer pressure is sufficiently applied even in the outer peripheral range A1. Thereby, the card | curd 1 can improve the external appearance of the card | curd surface.
That is, unlike the embodiment, when the layer immediately above the module substrate is difficult to deform, the pressure between these layers is reduced due to the gap between the layer directly above and below the module substrate in the outer peripheral range A1. Degraded from form. In this case, the uppermost sheet material 10A and the lowermost sheet material 60A are also less likely to be subjected to pressure from the hot press plate in the outer peripheral range A1. For this reason, dents such as wrinkles may occur on the surfaces of the sheet material 10A and the sheet material 60A in the outer peripheral range A1.

  In the present embodiment, in the outer peripheral range A1, the sheet material 30A and the sheet material 50A are sufficiently pressurized, so the sheet material 10A and the sheet material 60A are also sufficiently pressurized from the hot press plate. Appearance can be suppressed and appearance can be improved.

Here, the porosity of the sheet material 30A is such that the IC chip 41 is embedded without being damaged in the hot pressing process and the pressure between the sheet material 30A and the sheet material 50A in the outer peripheral range A1 can be sufficiently obtained. That's fine. The porosity can be appropriately selected depending on conditions such as the thickness of the IC chip 41 and the thickness of the sheet material 30A.
Each layer has the above-described resin sheet and thickness, and the prototype of the card 1 is actually made with the porosity of the sheet material 30A being 65%, and the appearance is improved without damaging the IC chip 41. It has been confirmed that the card surface can be manufactured smoothly.

In the hot press process shown in FIG. 4, the sheet material 10A and the sheet material 20A are bonded together by the sheet material 20A. Further, since the sheet material 50A and the sheet material 60A are easily heat weldable, they are bonded together.
Thus, the card | curd 1 can be manufactured by adhere | attaching each layer by one hot press process.

(Cooling process, punching process)
After the hot pressing process, the card 1 in a multifaceted state is subjected to a cooling process, and the card outer shape 1a is punched into individual pieces in the punching process.

  It has been confirmed that the card 1 manufactured through the above steps satisfies the durability test (JIS X 6301, JIS X 6305).

FIG. 5 is a cross-sectional view when the card 1 of the first embodiment is manufactured by multistage hot pressing.
Since the porous layer 30 is more flexible and cushioning than the non-porous resin sheet, the pressure applied to the IC chip 41 can be reduced. For this reason, the card | curd 1 can be manufactured by multistage hot pressing.
In this case, a plurality of combinations (layered body in FIG. 2) of each layer of the cards 1 are stacked. Moreover, the hot press board 83 is arrange | positioned also between each combination.
In this case as well, it can be manufactured with multiple impositions.
Thereby, manufacturing efficiency (manufacturing quantity per hour) can be improved.

As described above, the card 1 according to the present embodiment can be manufactured without using a punching process for a sheet material or a spacer for adjusting the thickness of the outer peripheral portion A1. Thereby, manufacturing efficiency can be improved.
Further, the card 1 can reduce damage to electrical components such as the IC chip 41 during manufacturing. Thereby, the card 1 can be manufactured without damaging electrical components such as the IC chip 41.
Furthermore, the card 1 can be manufactured with improved appearance quality.

(Second Embodiment)
Next, a second embodiment of the present invention will be described.
In the following description and drawings of the respective embodiments, portions having the same functions as those of the first embodiment described above are appropriately denoted by the same reference numerals or the same reference numerals at the end (last two digits), and overlapping. Description to be omitted is omitted as appropriate.
FIG. 6 is a cross-sectional view illustrating the layer configuration of the card 201 of the second embodiment.
The thickness of the card 201 is about 0.8 mm, as in the first embodiment.
The card 201 includes a base material layer 250, a porous layer 251 (second surface porous layer), and an intermediate layer 252.
The porous layer 251 is laminated on the lower side Z1 (second surface side) of the base material layer 250 (second surface non-porous layer). The porous layer 251 is a resin sheet made of the same material as the porous layer 30.
Since the porous layer 251 is provided, the thickness of the base material layer 250 is made thinner than that in the first embodiment.
The intermediate layer 252 is a layer that bonds between the porous layer 251 and the lower layer 60. The intermediate layer 252 is a resin sheet made of the same material as the intermediate layer 20.

That is, an example of the thickness of the module substrate 40 and each layer is as follows.
-Upper layer 10: 125 μm
Intermediate layer 20: 50 μm
・ Porous layer 30: 175 μm
-Base material of module substrate 40: 45 μm
-Base material layer 250: 100 μm
-Porous layer 251: 175 μm
Intermediate layer 252: 50 μm
・ Lower layer 60: 125 μm
In addition, between the base material layer 250 (PVC sheet etc.) and the porous layer 251, it has sufficient adhesive strength by heat welding. Moreover, between the porous layer 251 and the intermediate | middle layer 252 (PVC sheet etc.) has sufficient adhesive strength by heat welding.

The card 201 is a portion where the IC chip 41 is mounted along with the hot pressing process, and the porous layer 251 embeds the curved portion A2 even when the module substrate 40 and the base material layer 250 are curved downward Z1. Can be absorbed.
Thereby, the card 201 can embed the IC chip 41 in both the upper side Z <b> 2 and the lower side Z <b> 1 of the module substrate 40, and can absorb the deformation of the module substrate 40.

(Third embodiment)
Next, a third embodiment of the present invention will be described.
FIG. 7 is a cross-sectional view illustrating the layer configuration of the card 301 of the third embodiment.
The thickness of the card 301 is about 0.5 mm.
In the card 301, the thickness of the upper layer 310, the porous layer 330, the base material layer 350, and the lower layer 360 is made thinner than that of the first embodiment, and the overall thickness is made thinner than that of the first embodiment.

That is, an example of the thickness of the module substrate 40 and each layer is as follows.
-Upper layer 310: 100 μm
Intermediate layer 20: 50 μm
-Porous layer 330: 150 μm
-Base material of module substrate 40: 45 μm
-Base material layer 350: 130 μm
-Lower layer 360: 100 μm

  As described above, the card 301 of this embodiment can be made thin.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described.
FIG. 8 is a cross-sectional view illustrating the layer configuration of the card 401 according to the fourth embodiment.
The thickness of the card 401 is about 0.3 mm.
The card 401 has a simpler layer structure than that of the first embodiment, and the thickness of the porous layer 430 is made thinner than that of the first embodiment, so that the overall thickness is made thinner than that of the first embodiment. .

In the card 401, an upper layer 410, a porous layer 430 (first surface porous layer), a module substrate 40, and a lower layer 460 (second surface non-porous layer) are laminated in order from the upper side Z2 to the lower side Z1. Yes.
Card names and the like are printed on the upper surface of the upper layer 410 and the lower surface of the lower layer 460.
The material of the porous layer 430 is the same as that of the first embodiment.
The lower layer 460 is a layer that also serves as a base material layer.

  The upper layer 410 and the lower layer 460 are resin sheet materials that can be thermally welded to the porous layer 430 and can also be thermally welded between the upper layer 410 and the lower layer 460 in the outer peripheral range A1. The upper layer 410 and the lower layer 460 can be selected from, for example, a PVC sheet, a PET-G sheet, and a PC sheet.

An example of the thickness of the module substrate 40 and each layer is as follows.
-Upper layer 410: 70 μm
-Porous layer 430: 125 μm
-Base material of module substrate 40: 45 μm
・ Lower layer 460: 70 μm

  With the above configuration, the card 401 can be made thinner.

(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described.
FIG. 9 is a cross-sectional view illustrating the layer configuration of the card 501 of the fifth embodiment.
FIG. 9A shows a state before the hot press process.
FIG. 9B shows a state after the hot press process.
The card 501 includes an upper constituent layer 501a, a porous layer 530, a module substrate 540, a base material layer 550, a porous layer 551, and a lower constituent layer 501b. As shown by a two-dot chain line in the figure, the layer configuration of the upper component layer 501a and the lower component layer 501b can be selected as appropriate.

The inner layer portion of the card 501 is the same as in the second embodiment.
That is, the porous layer 530 is laminated on the upper side Z <b> 2 of the module substrate 540. In addition, a base material layer 550 and a porous layer 551 are stacked on the lower side Z1 of the module substrate 540.

The IC chip 541 of the module substrate 540 is a type in which reinforcing plates 543 and 544 are provided on the upper surface of the chip body and the lower surface of the module substrate 540.
For this reason, the height of the IC chip 541 including the reinforcing plate 543 is about 250 μm, which is higher than that of the first embodiment. The reinforcing plate 544 is attached so as to protrude about 100 μm from the lower side Z1 of the module substrate 540.
For this reason, the entire thickness of the module substrate 540 is thicker than that of the first embodiment, and also has a protruding portion on the lower side.

An example of the thickness of the module substrate 540 and each layer is as follows.
-Porous layer 530: 254 μm
-Base material of module substrate 540: 40 μm
-Base material layer 550: 100 μm
-Porous layer 551: 254 μm

  At the time of the hot press process in the card manufacturing process, the module substrate 540 and the base material layer 550 are deformed so as to be curved also on the lower side Z1, as shown in the curved portion A2, because the module substrate 540 has the above thickness. There are many. As in the second embodiment, the porous layer 551 can absorb the curvature by embedding it even if the base material layer 550 is curved.

  As described above, the card 501 of the present embodiment suppresses damage to the IC chip 541 and improves the appearance quality even if the module substrate 540 is thick or has a protruding portion on the lower side Z1. As a result, the module substrate 540 can be incorporated.

(Sixth embodiment)
Next, a sixth embodiment of the present invention will be described.
FIG. 10 is a perspective view illustrating a multi-faceted form of each layer of the laminated sheet 601A of the sixth embodiment.
FIG. 11 is a cross-sectional view illustrating a hot press process for manufacturing a card from the laminated sheet 601A of the sixth embodiment.
The laminated sheet 601A is manufactured in a pre-process of the card manufacturing process.
As shown in FIG. 10, the laminated sheet 601A is a sheet material in which a sheet material 30A with a porous layer multifaceted, a plurality of module substrates 40, and a sheet material 50A with a multifaceted base material layer are laminated. The laminated sheet 601A is integrally formed by the same hot press as in the first embodiment in a state where a plurality of module substrates 40 are arranged in a range corresponding to the card outer shape 1a on the sheet material 30A and the sheet material 50A is laminated. Is done. The sheet material 30 </ b> A (porous layer) and the sheet material 50 </ b> A (base material layer) are bonded to each other by thermal welding in a range outside the module substrate 40 (including the outer peripheral range A1).

As shown in FIG. 11, when a card is manufactured from the manufactured laminated sheet 601A, the sheet material for forming each layer may be hot-pressed on the upper side Z1 and the lower side Z2. These sheet materials can be appropriately selected according to the card to be manufactured.
For example, when a card similar to that of the first embodiment is manufactured, the sheet materials 10A and 20A, the laminated sheet 601A, and the sheet material 60A may be laminated and hot pressed.
After the hot pressing process, it is separated into cards through a cooling process and a punching process.
In addition, when manufacturing the card | curd of 2nd-5th embodiment, what is necessary is just to manufacture a laminated sheet by laminating | stacking the sheet material directly on and under each module board | substrate 40. FIG.

  As described above, the laminated sheet 601A of the present embodiment can be manufactured in advance in a pre-process of the card manufacturing process. Thereby, in a subsequent card manufacturing process, if the sheet material is subjected to hot press processing or the like with respect to the laminated sheet 601A, it can be formed into a card, the arrangement of the module substrate 40 is unnecessary, and manufacturing efficiency can be improved.

(Seventh embodiment)
Next, a seventh embodiment of the present invention will be described.
FIG. 12 is a cross-sectional view illustrating the layer configuration of a card 701 according to the seventh embodiment.
FIG. 7A shows a state before the hot press process.
FIG. 7B shows a state after the hot pressing step.
In the card 701, the intermediate layer is deleted from the first embodiment.
As shown in FIG. 7A, a silk print layer 711 was provided between the upper layer 10 and the porous layer 30. The silk print layer 711 may be provided on at least one of the upper layer 10 and the porous layer 30.
As shown in FIG. 7B, the silk print layer 711 expresses adhesiveness by heating and adheres between the upper layer 10 and the porous layer 30 by a hot press process.
In this way, the card 701 can bond the porous layer 30 and other layers without providing an intermediate layer. For this reason, the card 701 can reduce the card thickness and is low in cost.

As shown in FIG. 7A, a silk print layer 751 is also provided between the base material layer 50 and the lower layer 60. The silk print layer 751 may be provided on at least one of the base material layer 50 and the lower layer 60.
As shown in FIG. 7B, also in this case, the silk print layer 751 exhibits adhesiveness by heating in a hot press process. Thereby, the card | curd 701 can improve the adhesive strength between the base material layer 50 and the lower layer 60, as demonstrated in the said 1st Embodiment.

As described above, the card 701 of this embodiment uses the silk print layer 711 to bond the porous layer 30 and other layers, so that the card thickness can be reduced and the cost is low. Further, since the card 701 is provided with the silk print layer 751, the adhesive strength between the layers can be increased.
In addition, you may apply the structure which adhere | attaches a porous layer using a silk printing layer to other embodiment.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications and changes are possible, and these are also within the technical scope of the present invention. In addition, the effects described in the embodiments are merely a list of the most preferable effects resulting from the present invention, and the effects of the present invention are not limited to those described in the embodiments. The above-described embodiments can be used in appropriate combination, but detailed description thereof is omitted.
For example, the multistage heat press of the first embodiment may be applied to the second to sixth embodiments.

1, 201, 301, 401, 501, 701 Card 1a Card outline 10, 310, 410 Upper layer 20, 252 Intermediate layer 10A, 20A, 30A, 50A, 60A Sheet material 30, 251, 330, 430, 530, 551 Porous Layer 40, 540 Module substrate 41, 541 IC chip 50, 250, 350, 550 Base layer 50a Welding surface 60, 360, 460 Lower layer 501a Upper component layer 501b Lower component layer 543, 544 Reinforcement plate 601A Multilayer sheet A1 Outer peripheral range

Claims (6)

An IC card containing an IC chip,
A module substrate on which an IC chip is mounted;
A first surface porous layer having a larger outer shape than the module substrate and directly laminated on the first surface side which is the mounting surface side of the IC chip of the module substrate;
A second surface non-porous layer having a larger outer shape than the module substrate and directly laminated on the second surface side opposite to the first surface side of the module substrate;
The first surface porous layer and the second surface non-porous layer are bonded by thermal welding in a range where the outer shape is larger than the module substrate,
IC card characterized by In the IC card according to claim 1,
Comprising a second surface porous layer laminated on the second surface side of the second surface non-porous layer;
IC card characterized by In the IC card according to claim 2,
The module substrate includes a protrusion on the second surface side;
IC card characterized by A laminated sheet processed into an IC card by laminating other sheet materials,
A module substrate on which an IC chip is mounted;
A first surface porous layer having a larger outer shape than the module substrate and directly laminated on the first surface side which is the mounting surface side of the IC chip of the module substrate;
A second surface non-porous layer having a larger outer shape than the module substrate and directly laminated on the second surface side opposite to the first surface side of the module substrate;
The first surface porous layer and the second surface non-porous layer are bonded by thermal welding in a range where the outer shape is larger than the module substrate,
A laminated sheet characterized by An IC card manufacturing method according to any one of claims 1 to 3,
Directly laminating the second surface non-porous layer on the second surface side of the module substrate;
Directly laminating the first surface porous layer on the first surface side of the module substrate;
Laminating a sheet on the first surface side of the first surface porous layer;
A hot pressing step of hot pressing in a state where at least four layers of the sheet on the first surface side, the first surface porous layer, the module substrate, and the second surface non-porous layer are laminated.
An IC card manufacturing method characterized by the above. An IC card manufacturing method according to any one of claims 1 to 3,
A step of directly laminating a second surface non-porous layer sheet material in which the second surface non-porous layer is multi-faced on the second surface side of the plurality of module substrates;
Directly laminating the first surface porous layer sheet material on which the first surface porous layer is multifaceted on the first surface side of the plurality of module substrates;
Laminating a multi-sided sheet material on which a sheet is multi-sided on the first side of the first-side porous layer sheet material;
A plurality of combinations in which at least four layers of the multi-sided sheet material on the first surface side, the first surface porous layer sheet material, the module substrate, and the second surface non-porous layer sheet material were stacked were stacked in combination. A multi-stage hot pressing step for performing multi-stage hot pressing in a state;
An IC card manufacturing method characterized by the above.

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