JP5307054B2 - Non-contact IC card manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing a non-contact type IC card having an IC module having a non-contact type communication function and a transmission / reception antenna.

  In recent years, there has been a growing trend toward emphasizing information processing efficiency and security such as personal information, and contactless IC cards with contactless IC modules and transmitting / receiving antennas embedded in card bases have communication contact terminals. Compared to the contact type IC card exposed on the card surface, it is not easy to make electrical contact with the IC module.

  Conventional non-contact type IC cards are generally heat-pressed by sandwiching both sides of the core sheet with a non-contact type IC module with a transmitting / receiving antenna having a flat coil pattern on the core sheet base material. It is manufactured by laminating by heating and pressurizing processes. In this case, usually, an adhesive layer such as a thermoplastic resin or a thermosetting resin is provided on the entire surface as an intermediate layer between the core sheet and the oversheet. Further, as a material for the core sheet base material or the oversheet, a resin such as PET (polyethylene phthalate), polyvinyl chloride, epoxy resin, PET-G (amorphous polyethylene phthalate copolymer) is used.

  However, in the above non-contact type IC card manufacturing method, when the core sheet and the oversheet are laminated by a vacuum hot press or the like, the core sheet substrate on which the transmitting / receiving antenna and the non-contact type IC module are mounted is a vacuum hot press. Due to heat melting and expansion by heat and pressure, the pattern shape of the planar coil of the transmitting / receiving antenna mounted on the core sheet substrate is deformed and the pitch between windings of the planar coil is changed. This not only causes a shift in the resonant frequency of the transmission / reception antenna and a change in the communication distance, but also causes deformation of the pattern shape of the transmission / reception antenna when the laminated sheet is punched into individual card shapes after vacuum hot pressing. There was a problem that problems such as disconnection of the antenna coil occurred. In addition, deformation of the IC card shape due to laminating treatment, surface irregularities, warpage, and the like are also problematic.

  As means for avoiding the above problem, for example, in Patent Document 1, a groove having the same shape as the pattern of the transmitting / receiving antenna is provided on the core sheet base material on which the transmitting / receiving antenna and the non-contact type IC module are mounted, or on the core sheet There is shown a method for storing a transmitting / receiving antenna therein by providing a storing portion into which the transmitting / receiving antenna is inserted by another resin sheet or an adhesive sheet disposed in the housing. Patent Document 2 uses a base material having a high thermal deformation temperature as a core sheet base material, that is, a base material having a high melting point or a heat resistance, and has a low thermal deformation temperature as a base material for an oversheet. The manufacturing method which prevents a deformation | transformation is set by using the different base material and setting the thickness of an upper and lower oversheet to each different thickness.

JP 2002-269522 A JP 2003-67706 A

  However, in the method described in Patent Document 1, an extra man-hour and cost are required for the molding process for forming the antenna-shaped grooves and frames on the core sheet base material and other sheets, so that the manufacturing cost increases. Is a problem. In addition, as in Patent Document 2, when using a sheet base material having a different thermal deformation temperature, when laminated by a vacuum hot press or the like, an IC module mounted on a core sheet using a base material having a high thermal deformation temperature or Since unevenness due to the shape of the transmission / reception antenna tends to occur on the card surface, the appearance after the card is formed is impaired, and further, the image created by the secondary printing or printing after the card is formed may be impaired.

  Accordingly, an object of the present invention is a non-contact type IC card that can suppress deformation of a transmitting / receiving antenna due to a heating and pressurizing process, reduce unevenness on the card surface, and has a small increase in manufacturing cost as compared with the prior art. It is in providing the manufacturing method of.

  To achieve the above object, a non-contact type IC card manufacturing method according to the present invention comprises a core sheet base material made of a resin and an IC module and a transmitting / receiving antenna having a planar coil-shaped pattern. In the method of manufacturing a non-contact type IC card, wherein the oversheet made of resin is superposed and heated and pressed to integrate the core sheet and the oversheet. A pattern of an adhesive layer made of a thermosetting resin is formed by printing or coating, and after the adhesive layer pattern is cured, the IC module and the transmitting / receiving antenna are placed on the core sheet substrate, and then the over A method of manufacturing a non-contact type IC card in which sheets are heated and pressed by superimposing sheets, wherein the adhesive layer pattern is Characterized in that it is constituted by a linear or band-shaped patterns are arranged along the serial planar coil pattern.

  Here, the adhesive layer pattern is disposed along the winding at a position between the windings of the planar coil pattern of the transmission / reception antenna when the transmission / reception antenna is installed on the core sheet substrate. Or a linear portion arranged along the outermost winding outside the outermost winding of the planar coil pattern, or an inner side of the innermost winding of the planar coil pattern It is desirable to have at least one linear portion among the linear portions arranged along the innermost winding, and it is preferable that the thickness of the adhesive layer is 3 to 50 μm.

  As described above, in the method for manufacturing a non-contact type IC card of the present invention, before installing the IC module and the transmission / reception antenna on the core sheet substrate, the coil pattern of the transmission / reception antenna is made of a thermosetting resin. Print / apply a pattern of adhesive layer with a linear or strip-like pattern located on the inside, outside of the coiled pattern, or between the coil pitches, or with a pattern of a similar shape on the surface of the core sheet substrate After the adhesive layer is sufficiently cured, an IC module and a transmission / reception antenna are installed on the core sheet base material, and the core sheet and the oversheet are laminated by vacuum heat press or the like, so that the vacuum heat It is possible to reduce the expansion and contraction of the core sheet base material due to heat melting due to heat and pressure during pressing. It is possible to prevent deformation of the use antenna.

  In addition, since an adhesive layer pattern made of a thermosetting resin can be formed by printing by offset printing or silk printing, a pattern having a similar shape to the coil pattern of the transmitting / receiving antenna, or the inside or outside of the antenna coil pattern or Further, it is possible to easily cope with complicated shapes such as a linear pattern arranged between the pitches, and it is possible to manufacture at a low cost. Further, by making the coating thickness of the adhesive layer pattern as thin as 3 to 50 μm, there is little occurrence of irregularities on the card surface after card molding, and there is no possibility of impairing the card appearance.

  As described above, according to the present invention, it is possible to suppress the deformation of the transmitting and receiving antennas by the heating and pressurizing processes, reduce the irregularities on the card surface, and the non-contact type IC with less increase in manufacturing cost compared to the conventional case. A card manufacturing method is obtained.

The typical sectional view in the middle of manufacture of the non-contact type IC card in the first embodiment of the present invention. The top view of the core sheet used for non-contact-type IC card embodiment in 1st implementation of this invention. FIG. 3 is a perspective view when the core sheet and the oversheet of the non-contact type IC card according to the first embodiment of the present invention are overlaid. The top view of the core sheet | seat used for the non-contact-type IC card in 2nd embodiment of this invention.

BEST MODE FOR CARRYING OUT THE INVENTION

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  1, 2 and 3 are views for explaining a first embodiment of a method for manufacturing a non-contact type IC card according to the present invention, and FIG. 1 is in the process of manufacturing the non-contact type IC card. FIG. 2 is a schematic sectional view, FIG. 2 is a plan view of a core sheet used in the present embodiment, and FIG. 3 is a perspective view when the core sheet and the oversheet are overlapped. As shown in FIG. 1, the manufacturing method of the non-contact type IC card according to the present embodiment has an IC module 5 having a non-contact type communication function on a core sheet substrate 1 made of resin and a planar coil pattern. The core sheet 10 configured by installing the transmitting / receiving antenna 6 is heated and pressurized by superimposing the oversheets 2 and 3 made of resin from above and below, and the core sheet 10 and the oversheets 2 and 3 are integrated. This is a method for manufacturing a non-contact type IC card manufactured by the above method. In the present embodiment, the adhesive layer pattern 4 made of a thermosetting resin is formed on the surface of the core sheet substrate 1 by printing or coating, and after the adhesive layer pattern 4 is cured, the IC module 5 and the transmission / reception antenna 6 are placed on the core sheet substrate 1, and then the oversheets 2 and 3 are superposed and heated and pressurized. In addition, as shown in FIG. 3, it arrange | positions so that many cards can be produced from one core sheet by batch processing, and it stamps and produces to an individual card shape after integration.

  Further, as shown in FIG. 2, the adhesive layer pattern 4 is configured by a linear pattern arranged along the planar coil pattern of the transmitting / receiving antenna 6. A linear portion arranged along the winding at a position between the windings of the planar coil pattern, and arranged along the winding outside the outermost winding of the planar coil pattern It consists of the linear part and the linear part arrange | positioned along the winding inside the innermost winding of a planar coil-like pattern.

  In the present embodiment, the adhesive layer pattern 4 has a film thickness of about 30 μm, and can be formed by printing a thermosetting resin on the surface of the core sheet substrate 1 by silk printing.

  Next, a specific example of the manufacturing method of the non-contact type IC card of the present embodiment will be described. The core sheet substrate 1 is made of, for example, polyethylene phthalate, polyvinyl chloride, epoxy resin, PET-G, or the like. An IC module 5 and a transmission / reception antenna 6 are installed on the core sheet base material to form a core sheet 10. As shown in FIG. 3, the core sheet 10 is made of, for example, polyethylene phthalate, polyvinyl chloride, epoxy resin, PET -Sandwiched between oversheets 2 and 3 made of G or the like, and laminated by vacuum hot pressing or the like. The thicknesses of the core sheet substrate 1 are 300 μm, the IC module 5 is 400 μm, the transmission / reception antenna 6 is 140 μm, that is, a diameter of 140 μmφ copper wire, and the oversheets 2 and 3 are 240 μm. The total thickness of the card formed by laminating and laminating these three sheets is 780 μm.

  Here, before the IC module 5 and the transmission / reception antenna 6 are installed on the core sheet substrate 1, the adhesive layer pattern 4 of a thermosetting resin is printed on the surface of the core sheet substrate 1 by silk printing. The cured resin is dried until it is sufficiently cured, and after curing, the linear portions corresponding to the space between the windings of the adhesive layer pattern 4, the outermost winding, and the innermost winding are respectively formed on the transmitting / receiving antenna 6. The transmitting / receiving antenna 6 and the IC module 5 are installed on the core sheet substrate 1 so as to match the pattern.

  In addition, by setting the film thickness of the thermosetting resin to about 30 μm, it is possible to reduce irregularities on the card surface after card molding and reduce the influence of irregularities on the pattern in secondary printing and press printing. Can be made.

  In the present embodiment, even if the core sheet 10 and the oversheets 2 and 3 are laminated by vacuum hot pressing, the adhesive layer pattern 4 made of a thermosetting resin on the surface of the core sheet 10 on which the transmitting / receiving antenna 6 is installed. Therefore, the influence of the thermal melting and expansion / contraction of the core sheet base material due to the heat and pressure of the vacuum hot press can be reduced. As a result, deformation of the shape of the transmitting / receiving antenna 6 can be reduced, and the resulting shift in the resonant frequency of the antenna after card molding and the change in communication distance, and further, when punching into the individual card shape from the laminate sheet after vacuum hot pressing Disconnection of the transmission / reception antenna can be prevented.

  If the thickness of the adhesive layer pattern 4 is too thick, the purpose of reducing the irregularities on the card surface is not achieved, and if it is too thin, the purpose of reducing the effects of thermal melting and expansion / contraction of the core sheet substrate is not achieved. 3 to 50 μm is optimal.

  FIG. 4 is a view for explaining a second embodiment of the method for manufacturing a non-contact type IC card according to the present invention, and is a plan view of a core sheet used in the present embodiment. In the manufacturing method of the present embodiment, the adhesive layer pattern 7 is disposed on the outer side of the outermost winding of the planar coil-shaped pattern of the transmitting / receiving antenna 6 so as to be along the winding, and the planar coil-shaped pattern This is the same as the first embodiment except that the innermost winding is composed of a band-shaped portion arranged along the winding. Also in the present embodiment, the influence of thermal melting and expansion / contraction of the core sheet base material can be reduced, and deformation of the shape of the transmitting / receiving antenna 6 can be reduced.

  As described above, according to the present invention, it is possible to prevent deformation of the shape of the transmission / reception antenna without damaging the surface state, pattern, or pattern of the card after molding the card, and to reduce variations in the electrical characteristics of the transmission / reception antenna, and A non-contact type IC card manufacturing method capable of improving yield and quality by preventing disconnection during card shape processing is obtained.

  Needless to say, the present invention is not limited to the above embodiment, and the design can be changed according to the structure and shape of the IC card to be manufactured. For example, the adhesive layer pattern may be a linear portion arranged along the winding at a position between the windings of the antenna coil, or a linear portion arranged along the winding outside the outermost winding. The line width or band width of the adhesive layer pattern may be composed of any one or two of the portion or the linear portion arranged along the winding inside the innermost winding. The value can be designed so as to obtain the effect of the present invention according to the structure such as the shape and the thickness of the sheet.

DESCRIPTION OF SYMBOLS 1 Core sheet base material 2, 3 Oversheet 4, 7 Adhesive layer pattern 5 IC module 6 Transmission / reception antenna 10 Core sheet

Claims (3)

  A core sheet composed of a resin core sheet and an IC module and a transmission / reception antenna having a planar coil-like pattern installed thereon is overlaid with a resin oversheet, heated and pressurized, and the core sheet In the method for producing a non-contact type IC card produced by integrating the oversheet, an adhesive layer pattern made of a thermosetting resin is formed on the surface of the core sheet substrate by printing or coating, and the adhesive layer A method of manufacturing a non-contact type IC card in which after the pattern is cured, the IC module and the transmitting / receiving antenna are placed on the core sheet substrate, and then the oversheet is overlaid and heated and pressed. The adhesive layer pattern is a linear or belt-like pattern arranged along the planar coil pattern. Non-contact type IC card manufacturing method, characterized in that it is composed of over emissions.   The adhesive layer pattern is a linear shape arranged along the winding at a position between the windings of the planar coil pattern of the transmitting / receiving antenna when the transmitting / receiving antenna is installed on the core sheet base material. A linear portion arranged along the outermost winding outside the outermost winding of the portion or the planar coiled pattern, or the innermost winding inside the innermost winding of the planar coiled pattern 2. The method of manufacturing a non-contact type IC card according to claim 1, further comprising at least one linear portion among linear portions arranged along the inner winding.   3. The method of manufacturing a non-contact type IC card according to claim 1, wherein the adhesive layer pattern has a thickness of 3 to 50 [mu] m.

Images