JP2001056850A - Ic module with noncontact communication function and contact and noncontact type common-use ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC module with a noncontact communication function and a contact and noncontact type common-use IC card. SOLUTION: This IC module 10 with the noncontact communication function has a connection terminal for making a connection with an external device and an antenna coil 15 for noncontact communication formed on one surface of an insulating substrate while surrounding its outer periphery and an IC chip 12 with both a contact type and a noncontact type function on the other surface of the insulating substrate, and the respective connection terminal and IC chip, and the antenna coil and IC chip are electrically connected together through a through hole 17. The contact and noncontact type common-use IC card has an IC module like this mounted on its card base body and is equipped with a magnetic stripe.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC module having both a contact type and a non-contact type function and having a function of communicating with an external device by an antenna coil provided on a terminal board, and a contact type non-contact type using the same. It relates to a shared IC card.
That is, an IC provided with a substrate on which an antenna coil for a non-contact IC card is arranged on the outer periphery of a connection terminal surface of a contact IC module and provided with an interface for a contact IC card and an interface for a non-contact IC card on one wafer An IC module to which a chip is connected, and a contact-type non-contact type common I in which the IC module is mounted on a card substrate
Regarding C card.

[0002]

2. Description of the Related Art In the field of payment systems such as credit cards, contact-type IC cards are expected to become more widespread in the future, giving priority to the reliability of communication with external devices. In the field of railway ticket gates and public telephones, non-contact type IC cards are expected to become widespread, taking advantage of the feature that convenience and a mechanism for a reader / writer can be reduced, thereby making it possible to reduce maintenance. In the future, demand for railway ticket and public telephone services with credit cards is expected to increase, and a contact-type contactless IC card that incorporates the functions of a contact-type IC card into a contact-type IC card is needed. It is thought that the property becomes high. The present invention relates to an IC module with a non-contact communication function and a contact-type non-contact common IC card that can be suitably used for such applications.

Conventionally, various proposals have been made for IC cards having both functions of a contact type and a non-contact type, and it is considered that some IC cards have been used for experimental use. But,
As described below, the manufacture of such cards has many problems. On the other hand, there is a technology disclosed in JP-A-7-146922 as a non-contact type IC module having an antenna coil and capable of communication. The publication proposes an IC module in which an antenna coil is provided on one surface of an insulating substrate, an IC circuit is provided on the other surface, and the antenna and the IC circuit are electrically connected to each other through through holes. I have. However, the publication does not aim to provide a contact-type function at the same time.

[0004] I which has both contact and non-contact functions
The main methods conventionally known as a method for manufacturing a C card are as follows. I. IC module post-fitting method In this method, the sheet serving as the center core of the card base material has a three-layer structure, a pattern is printed on the surface of the upper first layer, and a printed coil or a photo-etching antenna coil is formed on the second layer. A pattern is formed, a pattern printed on the back surface of the third layer is overlaid in this order, and a transparent oversheet is overlaid on both sides to perform press lamination. After lamination, the sheet is cut into individual card sizes, and holes for inserting the IC module are processed. At this time, a part of the antenna coil pattern of the second layer is exposed as an IC module connection part. Apply the conductive paste to the IC module connection,
By inserting an IC module having a connection portion with an antenna coil on the back surface into the hole, electrical continuity is obtained by mounting the IC module.
Complete the card.

II. Injection molding method An antenna coil pattern forming sheet is inserted into an injection molding mold. At this time, the portion is pressed by a mold clamping member or the like so that the resin does not enter the IC module connection portion. After molding on the card substrate, a conductive paste is applied to the connection portion, and the IC module is fitted into a preformed IC module hole to complete the card.

However, I. In the IC module post-fitting method, since the metal layer of the IC module connection part is a thin layer, it is necessary to perform high-precision cutting of the card base material surface and end milling so that it is correctly exposed. Is bad. In addition, it is difficult to position the connection terminals in the fitting holes, and it is also difficult to increase the reliability of the connection with the IC module using only the conductive paste. Also, II. Injection molding method has a problem that it is impossible to use magnetic tape processing to provide international credit card specifications having a magnetic recording section.

[0007]

SUMMARY OF THE INVENTION Accordingly, the present invention has been made by studying an IC module which can solve the above-mentioned manufacturing problem in a contact type and non-contact type IC card. That is, according to the IC module of the present invention, the step of burying the antenna coil and the capacitor for communication is not required, and the reliability of the connection between the antenna coil and the IC module can be remarkably improved. An applicable contact-type non-contact type common IC card can be manufactured.

[0008]

According to a first aspect of the present invention, there is provided an insulating substrate comprising:
A connection terminal for obtaining connection with an external device and an antenna coil for non-contact communication surrounding the outer periphery thereof are formed, and a contact type and a non-contact type are formed on the other surface of the insulating substrate. A non-contact communication function in which an IC chip having both functions is mounted, and each connection terminal is electrically connected to the IC chip, and an antenna coil and the IC chip are electrically connected to each other through through holes. With IC
In the module. Because it is such an IC module,
It can be used for highly reliable IC cards.

[0009] The present invention for solving the above-mentioned problems.
According to the invention of the first aspect, in the IC module with the non-contact communication function according to the first aspect, the antenna coil is formed in a three-dimensional shape. With this configuration, the characteristics of the antenna coil can be made highly efficient.

[0010] The present invention for solving the above-mentioned problems.
According to a third aspect of the present invention, in the IC module with the non-contact communication function according to the first or second aspect, the connection between the IC chip and the connection terminal or between the IC chip and the antenna coil is performed via a bonding wire and a wiring pattern layer. The invention according to claim 4 is characterized in that the connection is made via an anisotropic conductive adhesive sheet and a wiring pattern layer. With such an IC module, the connection between the IC chip and each connection terminal or the antenna coil can be ensured.

[0011] The present invention for solving the above-mentioned problems.
According to the present invention, in the IC module with the non-contact communication function according to the first or second aspect, a capacitor is mounted on an IC chip mounting surface side of the insulating substrate. This eliminates the need to provide a capacitor in the card base even when a capacitor is required.

According to the present invention, there is provided a method for solving the above problems.
The present invention resides in a contact-type non-contact type shared IC card, wherein the IC module with a non-contact communication function according to any one of claims 1 to 5 is mounted on a card base and provided with a magnetic stripe. Since the contact type non-contact type shared IC card is used, high performance and high reliability can be obtained.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION An IC with a non-contact communication function of the present invention
An embodiment of a module will be described with reference to the drawings. FIG. 1 is a diagram showing an embodiment of an IC module with a non-contact communication function according to the present invention. FIG. 1A is a front view of the connection terminal side, and FIG. 1B is a rear view of the IC chip side, which shows a state seen through the mold resin. FIG.
(C) shows a cross section along the bonding wire 18 of the C ₂ and C ₆ terminals. As shown in FIG. 1A, the IC module 10 with a non-contact communication function of the present invention includes eight connection terminals (C _{1 to} C ₈ ) based on the ISO standard on the surface side, An antenna coil 15 is provided.

Of the eight terminals on the connection terminal side surface,
The C ₄ and C ₈ terminals are for future use and are not actually used at present. Therefore, the terminal board on the front side may be six terminals. Each connection terminal is separated by a separation groove 13g. Terminals on the IC chip 12 side for connection to the antenna coil 15 are usually formed and connected to terminals C ₉ and C ₁₀ provided separately from C _{1 to} C ₈ . FIG.
Here, the antenna coil 15 is shown to be wound twice around the outer periphery of the substrate. However, it is obvious that the antenna coil 15 can be formed into a thin wire and formed into a large number of windings for convenience of illustration. Substrate 1
For 1, a high-strength insulating substrate such as a glass epoxy resin is used, and in many cases, a material having both surfaces attached to a copper foil is used.

As shown in FIG. 1B, a wiring pattern layer 14 is provided for each terminal on the IC chip 12 side, and is connected to each connection terminal on the front side via a through hole 17. The wiring pattern layer is formed by photoetching the copper foil layer of the copper foil-bonded substrate in the same manner as the front-side connection terminals. The wiring pattern layer and the pads of the IC chip 12 are connected by bonding wires 18. As shown in FIG.
The connection between the chip and the bonding wire 18 and the connection between the bonding wire and the wiring pattern layer 14 are covered and protected by the mold resin 16.

A small and highly efficient antenna coil 15 is arranged around the connection terminal. Actually, when forming a photo-etched film on a copper foil-laminated substrate, 0.2 mm
Sufficient communication capability can be obtained by forming a wire having a line width of 1.0 mm and winding two to ten turns. The outer shape of the terminal board is about 10.0 mm in length × 20.0 mm in width, and the shape of the antenna coil is inevitably reduced as compared with the case where it is formed on the card base. Although this leads to shortening of communication distance, a high-efficiency antenna can exhibit sufficient functions for use in railway ticket gates and public telephones.

Such a connection terminal board can be manufactured in the same process as the conventional process for manufacturing a terminal board of a contact IC module simply by changing the photomask pattern shape to be used. That is, it is necessary to provide a winding coil-shaped pattern around the front side connection terminal and to provide a wiring pattern layer for the antenna coil connection terminal on the back side of the photomask pattern.

Further, this antenna can be formed as a three-dimensional (3D) antenna coil pattern if necessary.
FIG. 2 is a diagram illustrating a stacked state when a three-dimensional antenna coil is used. Connection terminal shapes and wiring pattern layers other than the antenna coil are omitted. For example, when the antenna coil, the connection terminal, and the wiring pattern layer are formed on a three-layer printed board, the antenna coil 15a and each connection terminal are formed on the surface of the printed board first layer 11a, and the printed board second layer 11b is formed. , An antenna coil 15b is formed on the upper surface and 15c is formed on the lower surface. Through holes t ₆ formed on the printed circuit board second layer 11b is an antenna coil 15b of the front and back surfaces, is intended to achieve 15c conduction. IC chip 1
2 is connected directly to the C9 terminal through the through holes t ₁ , t ₂ , and t ₃ , and the other conductor is connected to the through hole t ₄ , the contact t ₅ , the antenna coil 15b, and the through hole. t _6, the antenna coil 15c, through the through hole t _7, t ₈ are connected to C10 terminal of the IC chip. In the case of FIG. 2, the antenna coil is formed on the front and back surfaces of the second layer of the printed circuit board. However, the antenna coil of the back surface of the second layer may be formed on the upper surface of the third layer only on one of the surfaces. . Printed circuit board third layer 1
On the IC chip side of 1c, a wiring pattern layer 14 is formed as in FIG.

FIG. 3 is a diagram showing one embodiment of a non-contact IC module when a three-dimensional antenna coil is used. The state before laminating the first layer 11a, the second layer 11b, and the third layer 11c of the printed circuit board is shown.
m, 11n, and the lowermost layer is an IC chip 1
2 shows that the substrate provided with the wiring pattern layer to be mounted is laminated. The through hole t ₆ is
Although it does not actually appear in the cross section along the bonding wires of the C ₂ and C ₆ terminals, it is shown for reference. By thus forming the antenna in a three-dimensional (3D) antenna coil pattern, a highly efficient antenna can be formed in a small-sized terminal board.

FIG. 4 is a diagram showing a case where an IC chip and a wiring pattern layer are connected by an anisotropic conductive adhesive sheet.
FIG. 5 is a diagram showing an IC chip mounting method in this case. Each of the wiring pattern layers 14 is
4 (see FIG. 4).
(A)), IC chip 1 via anisotropic conductive adhesive sheet
2 will be mounted (FIG. 4B). A convex bump 12b is formed on the IC chip corresponding to each connection pad, and is pressed against an anisotropic conductive adhesive sheet 9 having substantially the same size as the IC chip placed on the wiring pattern layer. As a result, conduction can be obtained only to the pressurized portion of the anisotropic conductive adhesive sheet (FIG. 5).

In FIG. 4, a capacitor 19 is provided between the antenna coil connection terminals C ₉ and C ₁₀ . This forms a strong vibration circuit by providing a capacitance element in parallel with the antenna coil in the IC chip 12, and can adjust the communication frequency characteristic with respect to the external device. Although not shown, the same can be applied to the IC module shown in FIG. In a conventional non-contact IC card, such a capacitor is usually provided in the card base, but such provision on the terminal substrate obviates the necessity. As the capacitor, a ceramic capacitor, a capacitor formed via a dielectric layer, or the like can be used.

Next, an embodiment of a contact type non-contact type shared IC card of the present invention will be described. FIG. 6 is a perspective view illustrating the configuration of the shared IC card 1 of the present invention. As shown in FIG. 6, in the shared IC card according to the present embodiment, the IC module 10 having the non-contact communication function having the antenna coil and the shared IC chip is attached to the card base 2 having the IC module mounting recess 4 with an adhesive. It is a structure fixed by such as. The dimensions of the IC card are, for example,
m, 86 mm in width, and 0.76 mm in thickness.

FIG. 7 is a sectional view taken along section line AA in FIG. Shows the state after mounting the IC module,
The thickness is shown thicker than it actually is for the sake of illustration. As shown in FIG. 7, the contact-type non-contact type common IC of the present embodiment
In the card, the card base 2 has a multilayer structure, for example, a transparent oversheet 22, a white core sheet 21,
The transparent oversheet 23 may have a three-layer structure. The transparent oversheets 22 and 23 are often made of hard vinyl chloride resin, and the white core sheet 21 is often made of hard vinyl chloride resin containing a filler such as white pigment. The print 8 can be applied to the front and back of the white core 21. Various materials other than the above-mentioned vinyl chloride resin can be used for the card base material. For example, polyethylene terephthalate resin, PET-G, polypropylene resin, polycarbonate resin, acrylic resin, polystyrene resin, ABS resin, polyamide resin, polyacetal Resins. In general, vinyl chloride resin has a self-heat-fusing property, so it can be made into an integrated card substrate by hot-pressing without using an adhesive.However, in the case of other materials, the adhesive or adhesive sheet is used. Lamination through.

As described above, in the contact type non-contact type common IC card of the present embodiment, the antenna coil 15 is fixedly provided on the printed board 11 made of glass epoxy resin or the like having a higher strength than the card base 2. Even when bending stress is applied to the IC card 1, the printed circuit board 1 having high strength
1 and the IC module 10 are not easily deformed, and the bending stress which causes plastic deformation applied to the antenna coil 15 is also reduced. As a result, it is possible to reduce the influence on the IC card characteristics due to the application of bending stress to the contact-type non-contact type common IC card 1. In addition, since the IC module 10 with a non-contact communication function has a structure similar to that of the contact IC module, many technologies related to the contact IC card can be used in the manufacturing process. In addition,
In the contact-type non-contact type IC card of the present embodiment, since the antenna coil 15 is exposed on the surface, high energy efficiency can be obtained in electromagnetic induction performed with an external data processing device.

FIG. 8 is a diagram for explaining transmission and reception to and from an external data processing device when the IC card is used as a non-contact IC card. In this case, for example, the data processing device 5
A magnetic field corresponding to the communication signal from the coil L1 is generated in the coil L1 via the amplifier 51, and the magnetic field from the coil L1
2 (antenna coil 15), a magnetic field is induced in a non-contact manner. The current caused by the electromotive force generated by the magnetic field induced in L2 is rectified by the rectifier circuit 20 via the capacitor C1, and is transmitted to the IC chip 12 via the capacitor C2 and the resistor R to transmit a communication signal from the data processing device. A corresponding voltage is generated, and the IC chip 12 detects a communication signal from the data processing device based on the voltage. IC chip 1
2 to output a communication signal to the data processing device,
A signal is propagated in a flow opposite to the flow described above.

In the IC module 10 according to the present embodiment, the antenna 15 receives the electromagnetic wave radiated from the external data processing device 5 and generates an electromotive force at the terminal of the antenna 15. It is supplied to the IC chip 12 via the unit and the rectifier circuit. The electromagnetic wave generated between the external data processing device 5 and the non-contact IC card includes (1) supply of power for moving the LSI by electromagnetic induction, and (2) data communication using the carrier for adjusting the phase change and the amplitude. It serves two purposes. At this time,
There is a case where one electromagnetic wave has both of these properties and a case where a plurality of electromagnetic waves share respective roles.
The same applies to communication from the IC card side. However, since the shared IC card of the present invention has both functions, power may be supplied only through the contact terminals.

The dimensions of the IC module 10 with a non-contact communication function described above are, for example, that the edge thickness of the antenna coil 15 is 30 μm, and the total of the printed board 11 and the mold resin 16 is about 0.5 to 0.6 mm. Become. Therefore, when the IC module 10 is mounted in the concave portion 4 formed on the surface of the IC card, the thickness of the card base material is 0.76 m.
m, the distance between the mold resin 16 of the IC module and the back surface of the card substrate is about 0.26 to 0.16 mm, but if the thickness of the transparent oversheet 23 is 0.1 mm, the mold resin portion 16 Is not seen through the back of the card, so that the appearance is not impaired.

Next, a method for manufacturing a non-contact IC card according to the present invention will be described with reference to FIGS. 1, 6, 7 and 9. The necessary printing 8 is applied to the white core sheet 21, the transparent oversheets 22 and 23 are applied to both sides thereof, and the magnetic stripe is transferred simultaneously with the hot press lamination to manufacture the card base 2. This card base is, for example,
The card is cut into a card size of 4 mm, 86 mm in width, and 0.76 mm in thickness, and is cut by an NC cutting process, a milling machine, or the like, thereby forming the concave portion 4 in which the IC module 10 is mounted. The concave portion 4 is a first concave portion in which the printed circuit board 11 of the module is embedded and a substantially central portion thereof, and the mold resin 16
The portion is formed in a second concave portion having a size and depth that can be embedded.
Next, an adhesive is applied to the printed circuit board base around the mold resin 16 of the IC module 10 and is mounted in the concave portion 4 of the card base and pressed until the adhesive is hardened. Stick. In addition, a method of fixing the IC module by pressing the IC module with a heater block via an adhesive sheet laid in the concave portion of the card base can be adopted.

As described above, in the method of manufacturing the IC card 1 according to the present invention, the antenna coil is provided between the front base sheet and the back base sheet as in the conventional non-contact IC card manufacturing method. Work that requires relatively high accuracy, such as forming a card base, then forming an IC module mounting recess and aligning and connecting both terminals of the antenna coil in the card base and both terminals of the IC module. Is performed, the IC module in which the antenna coil is already formed can be mounted in the concave portion 4 and bonded, so that a high yield can be obtained with less damage in the manufacturing process. Further, in the above-mentioned conventional method, there is a problem that it is difficult to secure sufficient strength for connecting the antenna coil connection terminal and the IC module connection terminal in the card base. No disconnection or the like occurs due to resin molding.

FIG. 9 shows a contact type non-contact type common IC according to the present invention.
It is a top view of a card. As shown in FIG.
Since the C card 1 does not include an antenna coil or a capacitor in the card base, the magnetic stripe 6 and the embossed area 7 can be provided freely as in a normal contact type IC card. Further, it becomes possible to provide a face photograph, a sign panel, a hologram foil transfer, a thermal rewritable layer, and the like on the back surface.

[0031]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an IC module with a non-contact communication function and a contact-type non-contact type common IC card according to the present invention will be described below with reference to FIGS. The reference numerals in the embodiments correspond to the reference numerals in the drawings referred to. (Example) <Manufacturing process of IC module> On the front side of a glass epoxy printed circuit board material with a double-sided copper foil (glass epoxy 0.15 mm, copper foil layer each 0.30 mm thick), an antenna coil pattern for a non-contact interface and a contact interface Connection terminals were formed by photoetching. On the back side, I corresponding to the connection of each interface
The wiring pattern layer 14 for connection to the C chip 12 was formed at the same time by a photoetching method. The antenna coil pattern 15 has a terminal board (outer diameter 13 m) having a line width of 0.05 mm.
(m × 11.8 mm). A wiring pattern layer 14 is formed on the IC chip side of the substrate, nickel and gold plating are applied to terminal portions, and a one-chip IC chip having both a contact type and a non-contact type function is provided on the back surface of the printed circuit board 11. 12 was mounted by a die bonder, the respective wiring pattern layers and the IC chip pads were bonded by gold wires by a wire bonder, and then the sealing resin was potted and cured to complete the IC module 10. The total thickness of the IC module was 0.6 mm.

<IC Card Manufacturing Process> Core Sheet 21
As printed white rigid vinyl chloride sheet 21 having a thickness of 560 μm, and thicknesses as oversheets 22 and 23.
Two 100 μm transparent vinyl chloride sheets are applied to the top and bottom of the core sheet by heat and pressure (150 ° C., 20 kgf /
cm ² for 15 minutes) to produce an integrated card base 2. The transfer of the magnetic stripe was performed at the same time. After the hot pressing, punching was performed for each card size based on the hitting rule provided in advance.

Next, the IC module mounting portion of the card base 2 is subjected to NC cutting to first external device connection terminals of the IC module and a depth corresponding to the thickness of the adhesive sheet.
The recess was cut. At this stage, the size of the first recess is 13 m.
m × 11.8 mm (the radius of curvature of the corners was 2.5 mm) and the depth was 150 μm. Subsequently, the central portion of the first concave portion was cut so as to have a size of approximately 8 mm × 8 mm and a depth of 500 μm, so that the second concave portion had a size and a depth capable of embedding the mold resin 16 of the IC module.

A hot-melt type heat sealant is applied to the surface of the first concave portion which comes into contact with the IC module terminal substrate, and the IC module is inserted into the concave portion, and only the portion is heated and pressurized, thereby mounting the IC module. It was mounted in the recess. As a result, a high-performance IC card having a magnetic recording unit as a contact-type non-contact type common IC card with a non-contact communication function was obtained. After the IC module was mounted, a predetermined embossing was performed on the embossed area of the card base, but no influence was seen on the communication function of the card.

[0035]

According to the IC module with the non-contact communication function of the present invention, since the antenna coil is formed on the outer peripheral portion of the connection terminal of the terminal board, the antenna coil is embedded in the card base in the manufacture of the non-contact IC card. No need to do. In the contact / contactless shared IC card of the present invention,
As described above, in addition to being easy to manufacture, there is no poor connection between the antenna coil and the IC module, and highly efficient communication can be performed since the antenna coil is formed directly on the card surface. Furthermore, since there is no antenna coil in the card base, a card conforming to the international credit card standard can be manufactured by providing a magnetic stripe or an embossed area. Further, since additional functions such as a face photograph, a sign panel, and a hologram foil transfer can be freely provided, there is an effect that the present invention can be applied to an optical card, an eye Messe card and the like.

[Brief description of the drawings]

FIG. 1 is a diagram showing one embodiment of an IC module with a non-contact communication function of the present invention.

FIG. 2 is a diagram showing a stacked state when a three-dimensional antenna coil is used.

FIG. 3 Non-contact IC when a three-dimensional antenna coil is used
FIG. 3 illustrates an embodiment of a module.

FIG. 4 is a diagram showing a case where an IC chip and a wiring pattern layer are connected by an anisotropic conductive adhesive sheet.

FIG. 5 is a diagram showing an IC chip mounting method in the case of FIG. 4;

FIG. 6 is a perspective view illustrating the configuration of a contact-type non-contact type shared IC card of the present invention.

FIG. 7 is a view showing a cross section taken along line AA in FIG. 4;

FIG. 8 is a diagram illustrating transmission and reception with an external data processing device when the IC card is used as a non-contact IC card.

FIG. 9 is a plan view of a contact-type non-contact type shared IC card of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC card 2 Card base 3 Terminal board 4 Depression 5 Data processing device 6 Magnetic stripe 7 Emboss area 8 Printing 9 Anisotropic conductive adhesive sheet 10 IC module 11 Printed circuit board 11 m, 11n Adhesive layer 12 IC chip 13 External connection terminal 14 Wiring pattern layer 15 Antenna coil 16 Mold resin 17 Through hole 18 Bonding wire 19 Capacitor 20 Rectifier circuit 21 White core sheet 22, 23 Transparent over sheet

Claims (6)

[Claims] A connection terminal for obtaining connection with an external device and an antenna coil for contactlessly communicating so as to surround the outer periphery of the connection terminal are formed on one surface of the insulating substrate. An IC chip having both functions of a contact type and a non-contact type is mounted on the other surface of the device. Each connection terminal and the IC chip, and the antenna coil and the IC chip are connected to each other through through holes. An IC module with a non-contact communication function, which is electrically connected. 2. The IC module according to claim 1, wherein the antenna coil is formed in a three-dimensional shape. 3. The non-contact communication function according to claim 1, wherein the connection between the IC chip and the connection terminal or between the IC chip and the antenna coil is made via a bonding wire and a wiring pattern layer. With IC module. 4. The connection between the IC chip and the connection terminal or between the IC chip and the antenna coil is connected via an anisotropic conductive adhesive sheet and a wiring pattern layer. IC with non-contact communication function
module. 5. The antenna according to claim 1, wherein a capacitor for forming a resonance circuit with the antenna coil is mounted on the IC chip mounting surface side of the insulating substrate.
An IC module with a non-contact communication function as described in the above. 6. A contact-type non-contact common IC card, wherein the IC module with a non-contact communication function according to claim 1 is mounted on a card base and provided with a magnetic stripe.