JP2002334312A - Contact/non-contact combination type ic module and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a contact/non-contact combination type IC module which, of simple and reliable structure, facilitates its manufacturing process, and is reducible in thickness and its manufacturing method. SOLUTION: This module is equipped with a substrate 111 made of sealing resin, a contact/non-contact combination type IC chip 112 which is embedded in one surface of the substrate 111 and arranged so that a connection terminal 112a is outside, an external contact terminal 119 which is connected to the connection terminal 112a and formed on one surface of the substrate 111, and an antenna 118 for non-contact communication which is formed on one surface of the substrate 111 and has the same layer structure with the external contact terminal 119.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card, an SI
The present invention relates to a contact / non-contact type IC module used for M, IC tags and the like, and a method of manufacturing the same.

[0002]

2. Description of the Related Art A contact / non-contact type IC card has a contact type function of transmitting and receiving data by bringing an external terminal of the card into contact with a terminal of an external processing device, and an antenna for transmitting and receiving data by electromagnetic waves. I for coil and data processing
A card that has a built-in C circuit, performs reading and writing with an external processing device by a so-called wireless system, and is supplied with driving power of an IC circuit by electromagnetic induction and has a non-contact system function that does not include a battery. It is what we have.

Japanese Patent Application Laid-Open No. 7-239922 discloses an IC module for an IC card in which a conductor pattern of an antenna and a conductor pattern of a terminal electrode are provided on the surface, respectively, and these conductor patterns are provided through through holes. An invention for electrically connecting to an internal IC chip is disclosed.

[0004]

However, when each conductor pattern is connected to the IC chip by wire binding, pressure is applied to the IC chip. Therefore, the IC chip has a thickness enough to withstand the pressure. It was needed and was an obstacle to thinning. In addition, there are problems that the structure and the process are complicated and the number of working steps is large, so that reliability is low and manufacturing cost is high.

SUMMARY OF THE INVENTION An object of the present invention is to provide a contact / non-contact type IC module which has a simple structure, has high reliability, can simplify a manufacturing process and can be thin, and a method of manufacturing the same.

[0006]

The present invention solves the above-mentioned problems by the following means. In addition, in order to make it easy to understand, description is given with reference numerals corresponding to the embodiment of the present invention, but the present invention is not limited to this. That is, the invention of claim 1 provides a substrate (11) made of a sealing resin.
1) a contact / non-contact type IC chip (112) embedded in one surface of the substrate and arranged so that the connection terminal portion (112a) is on the outside, and connected to the connection terminal portion; An external contact terminal (119, 119A) formed on one surface of the substrate; and a non-contact communication antenna (118) formed on one surface of the substrate and having the same layer structure as the external contact terminal. And a contact / non-contact type IC module (110, 110-2).

According to a second aspect of the present invention, in the contact / non-contact type IC module according to the first aspect, the connection terminal portion (118a) of the external contact terminal and / or the non-contact communication antenna includes the contact terminal portion (118a). A contact / non-contact type IC module (110) characterized by being formed in contact with a connection terminal portion of a contact / non-contact type IC chip.

According to a third aspect of the present invention, in the contact / non-contact type IC module according to the first aspect, the insulating layer (116) covering at least the contact / non-contact type IC chip on one surface of the substrate. And a through-hole (116a) provided in the insulating layer and communicating with a connection terminal of the contact / non-contact type IC chip; and a through-hole integrally formed with the external contact terminal;・ Non-contact type I
A contact / non-contact type IC module (110-2) characterized by comprising a connection part (119B) for connecting a connection terminal part of a C chip and the external contact terminal.

[0009] The invention of claim 4 is the invention of claims 1 to 3.
The contact / non-contact type IC module according to any one of the above, wherein the non-contact communication antenna is arranged by shifting the external contact terminal with respect to the antenna inner area (B). A contact / non-contact type IC module (110, 110-2) characterized in that an effective antenna area (C) that does not interfere with the external contact terminal is secured.

According to a fifth aspect of the present invention, a contact / non-contact type IC chip (11) is provided on one surface of a substrate (111) made of a sealing resin such that the connection terminal (112a) is on the outside.
2) IC chip embedding process (# 11, # 2)
1) and an antenna / external contact terminal forming step (# 12, # 2) of simultaneously forming a non-contact communication antenna (118) and an external contact terminal (119) on one surface of the substrate.
3) A method for manufacturing a contact / non-contact type IC module (110, 110-2) comprising:

According to a sixth aspect of the present invention, there is provided the method for manufacturing a contact / non-contact type IC module according to the fifth aspect, wherein the contact / non-contact type IC chip is cut and / or thinned by cutting. A method for manufacturing a contact / non-contact type IC module (110, 110-2) characterized by comprising steps (# 11, # 21).

According to a seventh aspect of the present invention, in the method of manufacturing a contact / non-contact type IC module according to the sixth aspect, the cutting step includes the step of cutting the contact / non-contact type embedded in the substrate in the IC chip embedding step. A method for manufacturing a contact / non-contact type IC module (110, 110-2), characterized by cutting and / or shaving a contact / type IC chip.

[0013] The invention of claim 8 is the invention of claims 5 to 7.
The method for manufacturing a contact / non-contact type IC module according to any one of the above, wherein the contact / non-contact type IC module is manufactured by multi-face mounting in which a plurality of IC modules are manufactured on the same surface. Contact / non-contact type I
This is a method for manufacturing the C module (110, 110-2).

According to a ninth aspect of the present invention, there is provided an image processing apparatus comprising:
In the method for manufacturing a contact / non-contact type IC module according to any one of the above, the step of forming the antenna / external contact terminal includes forming the external contact terminal so as to be in contact with the connection terminal portion. A method for manufacturing a contact / non-contact type IC module (110) characterized by the following features.

According to a tenth aspect of the present invention, there is provided a contact / non-contact type IC according to any one of the fifth to eighth aspects.
In the method for manufacturing a module, the step of forming the antenna / external contact terminal includes the step of forming a connection portion (119B) connecting the connection terminal portion and the external contact terminal integrally with the external contact terminal to the external contact terminal Forming an insulating layer on at least one of the surfaces of the substrate, the insulating layer covering at least the contact / non-contact type IC chip (# 21); A through-hole forming step (# 22) of forming a through-hole communicating with the non-contact type IC chip.
This is a method for manufacturing a non-contact type IC module (110-2).

According to an eleventh aspect of the present invention, there is provided the contact / non-contact type I according to any one of the fifth to tenth aspects.
In the method for manufacturing a C module, the antenna / external contact terminal forming step includes forming the non-contact communication antenna and the external contact terminal by etching and / or plating. Type IC
This is a method for manufacturing the module (110, 110-2).

According to a twelfth aspect of the present invention, in the method for manufacturing a contact / non-contact type IC module according to the tenth aspect, the step of forming the antenna / external contact terminal is performed by etching and / or plating. A method for manufacturing a contact / non-contact type IC module (110-2), comprising forming an antenna, an external contact terminal, and a connection portion.

According to a thirteenth aspect of the present invention, the contact / non-contact type I according to any one of the fifth to twelfth aspects is provided.
In the method for manufacturing a C module, the antenna / external contact terminal forming step includes disposing the external contact terminal with respect to the antenna inner region so that an antenna effective area that does not interfere with the external contact terminal is formed. And a contact / non-contact type IC module (110, 110-2).

[0019]

Embodiments of the present invention will be described below in more detail with reference to the drawings. 1 and 2 are views showing a first embodiment of a contact / non-contact type IC module and a method of manufacturing the same according to the present invention.

As shown in FIGS. 2 (g) and 2 (h), the contact / non-contact type IC module 110 of the first embodiment
A substrate 111 made of a sealing resin having a size of IM;
11, a contact / non-contact type IC chip 112 having a connection terminal portion 112a, a non-contact communication antenna 118 formed on the upper surface of the substrate 111 and having a connection terminal 118a, and an external contact terminal 119. And

The substrate 111 is a small Plug-in-SIM (Subscribe) defined by the GSM standard.
r Identification Module: a subscriber identification element) size sealing resin was used. Plug
The -in-SIM is, for example, an IC module in which a number unique to a subscriber is stored, and is used for the purpose of specifying the number of a mobile communication device. The external contact terminal 119 is brought into contact with an external reader / writer (hereinafter, referred to as R / W) to form a contact / non-contact type IC.
A terminal that mediates input and output of information between the chip 112 and the R / W. The external contact terminal 119 and the connection terminal 118a of the non-contact communication antenna 118 are arranged so as to be in contact with the connection terminal 112a of the contact / non-contact type IC chip 112, and are electrically connected to the connection terminal 112a.

The method of manufacturing a contact / non-contact type IC module according to this embodiment is, as shown in FIGS.
Chip embedding step # 11 and pattern forming step # 12
And the like. In FIGS. 1 and 2, one IC
Although only the module is illustrated, in practice, the module is cut after manufacturing by multi-face mounting in which a plurality of modules are manufactured at the same time.

In the IC chip embedding step # 11, the contact / non-contact type I
This is a step of embedding the C chip 112. A contact / non-contact type IC chip 112 is pressed against an epoxy prepreg (carbon fiber reinforced plastic) [FIG. 1A] serving as a substrate 111 in a heated state, and embedded with the surface of the connection terminal 112a upward [FIG. (B)]. The embedding method is
Instead, for example, a terminal may be placed on a temporary support with the terminal surface facing down, and a sealing material may be formed from above. The sealing resin may be in the form of a film, liquid, or semi-solid. If the resin is softened by heating, polyester such as PET may be used in addition to the epoxy resin described above. The thickness may be adjusted by shaving the contact / non-contact type IC chip 112 before embedding it in the substrate 111. Further, the thickness may be adjusted by shaving with the substrate 111 after embedding.

In the pattern forming step # 12, the pattern of the non-contact communication antenna 118 and the pattern of the external contact terminal 119 are simultaneously formed on the upper surface of the substrate 111, and the non-contact communication antenna 118 is contact / non-contact type IC chip 112. This is a step of connecting to the connection terminal 112a. First, the substrate 111
A copper layer 113 is formed thereon by sputtering [FIG.
(C)]. Then, the photosensitive dry film resist 11
4 is laminated, exposed and developed to produce an opening pattern 114a for plating [FIG. 1 (d)]. Copper plating, nickel plating, and gold plating steps are interposed between the opening pattern 114a and the water washing step, and continuous plating is performed to form a plating layer 115 (FIG. 2E). Further, the photosensitive dry film resist 114 is peeled off, and the copper layer 113 is removed by a soft etching process, so that the patterns of the non-contact communication antenna 118 and the external contact terminal 119 are formed at the same time [FIGS. g)].

As described above, according to the present embodiment, the following effects can be obtained. (1) Since the antenna 118 and the external contact terminal 119 are directly plated and wired, there is no fear that the antenna 118 and the external contact terminal 119 are peeled off due to a temperature change, a time-dependent change, a stress, or the like, and the connection stability and reliability are extremely high. In addition, the resistance is lower than that formed by conventional solder balls and gold bumps.

(2) Since the contact / non-contact type IC chip 112 is embedded in the sealing resin to be the substrate 111, it is not necessary to mount the contact / non-contact type IC chip 112 one by one. The contact / non-contact type IC chip 112 may be placed in the resin sheet, and the subsequent steps can be processed in units of the sealing resin sheet.

That is, conventionally, the connection terminal of the IC chip is connected to the non-contact communication antenna or the external contact terminal by wire bonding or directly by flip chip mounting (by attaching a solder ball or a gold bump). Put it on the wiring). At this time, the IC chips are individually mounted,
Regardless of whether the wire bonding or the solder ball is performed individually, there is a large amount of time lost. However, in the present embodiment, even if a plurality of IC chips are arranged,
It can be made in batches with multiple impositions. In addition, plating and etching can all be formed by a collective process.

(3) The contact / non-contact type IC chip 112 is placed on the sealing resin to be the substrate 111, and the non-contact communication antenna 118 and the external contact terminal 119 are simultaneously formed on one side thereof. The structure is simple and the process can be simplified.

(4) The non-contact antenna 118 and the external contact terminal 119 are formed by a chemical treatment such as plating and etching, and the contact / non-contact type IC chip 1 is formed.
Since the strength of the contact 12 itself is not required, a thin contact / non-contact type IC chip 112 is used, and the external contact terminal 119 is directly connected to the contact / non-contact type IC chip 112. The module 110 can be made thin. For example, contact / non-contact type I
When the thickness of the C chip 112 is reduced to 100 to 150 μm, the substrate 111 is set to 200 to 250 μm, the non-contact antenna 118 and the external contact terminal 119 are set to 10 μm.
The thickness of the IC module 1
10 can have a thickness of 210 to 280 μm.

(Second Embodiment) FIGS. 3 and 4 are views showing a second embodiment of a contact / non-contact type IC module according to the present invention and a method of manufacturing the same. Note that the same reference numerals are given to portions that perform the same functions as those in the above-described embodiment, and redundant description will be omitted as appropriate. The contact / non-contact type IC module 110-2 of the second embodiment is shown in FIG.
As shown in (g), a substrate 111, a contact / non-contact type IC chip 112, formed on the upper surface of the substrate 111,
Non-contact communication antenna 118 having connection terminal 118a
An insulating layer 116 covering at least the contact / non-contact type IC chip 112 on the upper surface of the substrate 111;
And a through-hole 116a communicating with the connection terminal 112a of the contact / non-contact type IC chip 112;
The external contact terminal 119A and the external contact terminal 119A are formed integrally on the IC chip 112, and the connection terminal portion of the contact / non-contact type IC chip 112, the non-contact communication antenna 118, and the external contact terminal 119A And a connection section 119B for connecting the connection terminal section to the connection terminal section.

The method of manufacturing the contact / non-contact type IC module of this embodiment is, as shown in FIGS.
Chip embedding step # 21 and through-hole forming step # 22
And a pattern forming step # 23 and the like. In addition,
Although only one IC module is shown in FIGS. 3 and 4, in actuality, a plurality of IC modules are manufactured at the same time, and then cut after manufacturing.

In the IC chip embedding step # 21, the substrate 1
This is a step of embedding a contact / non-contact type IC chip 112 in FIG. First, the copper layer 113 is formed on the insulating resin (polyimide film) serving as the insulating layer 116 by sputtering.
Is formed to have a thickness of 0.25 to 1.00 μm,
The contact / non-contact type IC chip 112 is placed on the support so that the terminal surface faces down and comes into contact with the insulating layer 116 (FIG. 3A). A substrate 111 made of a sealing resin is formed thereon.
And a contact / non-contact type IC chip 112 is buried at the same time [FIG. 3B].

In the through-hole forming step # 22, a contact / non-contact type IC chip 112 is formed on the copper layer 113 and the insulating layer 116.
This is a step of forming a through hole 116a communicating with the connection terminal 112a. The substrate 111 in which the contact / non-contact type IC chip 112 is embedded is turned upside down, the copper layer 113 is soft-etched, and the insulating layer 116 is etched with an organic alkali etchant dedicated to polyimide.
A through hole 116a is formed in the copper layer 113 and the insulating layer 116 (FIG. 3C). The through holes 116a may be formed collectively by laser.

In the pattern forming step # 23, a pattern of the non-contact communication antenna 118 and the external contact terminal 119A is simultaneously formed on the upper surface of the substrate 111, and the non-contact communication antenna 118 and the external contact terminal 119A are brought into contact with each other. This is a step of connecting to a connection terminal of the contact-type IC chip 112. A photosensitive dry film resist 114 is laminated, exposed and developed to form an opening pattern 114a for plating [FIG. 3 (d)]. A copper plating, nickel plating, and gold plating processes are interposed between the opening pattern 114a and the water washing process, and continuous plating is performed to form the plating layer 11a.
5 (FIG. 3E). Further, the photosensitive dry film resist 114 is peeled off, the copper layer 113 is removed by soft etching, and the non-contact communication antenna 1 is removed.
18 and the pattern of the external contact terminal 119A. At the same time, a connection portion 119B is formed, and the connection terminal 118a of the non-contact communication antenna 118 and the external contact terminal 11
9A is connected to the connection terminal 112a of the contact / non-contact type IC chip 112 [FIGS. 3 (f) and 3 (g)].

As described above, according to this embodiment, the same effect as that of the first embodiment can be obtained even when the contact / non-contact type IC chip 112 is sealed with the insulating layer 116 and the substrate 111. It is.

In each of the above embodiments, FIG.
(H), as shown in FIG.
9 and 119A are shifted to the left with respect to the inner area B of the non-contact communication antenna 118, so that an antenna effective area C that does not interfere with the external contact terminals 119 and 119A is secured. Therefore, the antenna effective area C with less interference can be secured, and the non-contact communication antenna 118 can be easily connected to the contact / non-contact type IC chip 112.

In the non-contact IC module, in order to stably secure a large communication distance, the larger the area of the non-contact antenna 118 is, the better. However, if the size of the contactless communication antenna 118 is large, the manufacturing cost, including the material cost, increases in proportion to the area, so that the minimum size required for communication is sufficient. As a result of examining the coil area and communication characteristics of the non-contact communication antenna 118, assuming that the ISO14443 Type A and Type B methods are used, the minimum required coil size differs depending on the shape and pitch of the coil.
It was found that at least ² was the minimum required, and 400 mm ² was sufficient.

Further, the size of the card or module,
When the shape is determined by the standard, especially when the size of a small module is limited to about 2 cm square or less due to the restriction of the device, the contactless communication antenna 118 is naturally used.
Is required to be used on the entire surface of the IC modules 110 and 110-2, and the contactless communication antenna 118 is required to be formed on the entire outer periphery of the IC modules 110 and 110-2. . From this restriction, as a design rule of the non-contact communication antenna 118, the outer circumference is as large as possible, and it is better to arrange the antenna with a narrow pitch. The pitch is 100 μm or less, most preferably 50 μm or less. Further, when the pitch is 20 μm or less, it is difficult to stably manufacture. Also,
When face down type flip chip mounting is performed, IC
The thickness of the modules 110 and 110-2 can be reduced, which is desirable. In the present embodiment, the external contact terminals 119, 119
It is necessary to install so that the coil wiring passes between A,
Also in this case, if the pitch is set to 100 μm or less, most preferably 50 μm or less, the degree of freedom in design can be ensured, and the area inside the non-contact communication antenna 118 can be increased.

The thickness of the non-contact communication antenna 118 is preferably 5 μm or more, most preferably, because the resistance increases as the design rule decreases.
10 μm or more. When the thickness of the non-contact communication antenna 118 is increased, it is difficult to manufacture the antenna 118 stably. Therefore, the thickness is desirably 30 μm or less. In order to satisfy these design rules, the method of manufacturing the non-contact communication antenna 118 is either the etching method or the semi-additive method by plating. Limited to the semi-additive method.

In the contact / non-contact IC modules 110 and 110-2, the external contact terminals 119 are provided.
And the contactless communication antenna 118 must be formed in the same module. Generally, non-contact communication antenna 1
The metal part placed inside 18 has an effect of shielding electromagnetic waves, and becomes an obstacle to communication. Therefore, in the design of the IC card, the external contact terminals 119 and 119A made of metal are used.
In order to avoid the effect of shielding electromagnetic waves due to
It is necessary to displace the center of the non-contact communication antenna 118 from 9, 119A. In this case, the antenna effective area C is determined by the IC modules 110 and 110−
The new fact that 0.5 to 0.9 times is desirable for the area of 2 has been obtained.

(Modifications) Various modifications and changes are possible without being limited to the above-described embodiment, and these are also within the equivalent scope of the present invention. (1) In this embodiment, the SI used for a mobile phone or the like is used.
Although M has been described as an example, a normal IC card or an IC tag whose substrate shape is not specified may be used. (2) If the required communication distance cannot be secured by a small IC module alone, a booster coil can be separately manufactured outside and a resonance circuit can be formed in close proximity to the IC module to secure the communication distance. . This booster coil may be installed and used in a case for accommodating an IC module, for example, a regular case.

(3) In the method of the present invention, an external contact terminal and a non-contact antenna are provided. In some cases, only the external contact terminal and the non-contact antenna connection terminal 118a are connected to the IC module. And an antenna coil may be separately manufactured. This antenna coil is an IC
The module may be installed in a case for accommodating the module, for example, a regular case, and may function by inserting an IC module.

[0043]

As described above in detail, according to the first or fifth aspect of the present invention, the external contact terminal and the non-contact communication antenna are formed on the same surface as the contact / non-contact IC chip. Since they have the same layer structure, the structure is simple and the manufacturing process can be simplified.

According to the second aspect of the present invention, in addition to the effect of the first aspect, since the external contact terminal is directly connected to the connection terminal portion of the contact / non-contact type IC chip, the connection is stabilized. Extremely high reliability and reliability.

According to the third aspect of the invention, the same effect as the second aspect of the invention can be obtained even when the contact / non-contact type IC chip is sealed with the insulating layer and the substrate.

According to the fourth aspect of the present invention, in addition to the effects of the first aspect of the present invention, communication stability can be improved by securing an effective antenna area. it can.

According to the invention of claim 6, in addition to the effect of the invention of claim 5, a cutting step for cutting and / or shaving the contact / non-contact type IC chip to reduce the thickness is provided. -It is possible to manufacture a non-contact type IC module thinly.

According to the seventh aspect of the present invention, in addition to the effects of the sixth aspect, since the contact / non-contact type IC chip embedded in the substrate is cut, the manufacturing process can be simplified.

According to the eighth aspect of the present invention, in addition to the effects of any one of the fifth to seventh aspects of the present invention, further manufacturing is further simplified and manufactured by manufacturing by another imposition. Cost can be reduced.

According to the ninth aspect of the present invention, in addition to the effect of any one of the fifth to eighth aspects, the contact and
Since the external contact terminal is directly connected to the connection terminal portion of the non-contact type IC chip, the stability and reliability of the connection are extremely high.

According to the tenth aspect, the same effect as that of the ninth aspect can be obtained even when the contact / non-contact type IC chip is sealed with the insulating layer and the substrate.

According to the eleventh or twelfth aspect of the present invention, in addition to the effects of any one of the fifth to tenth aspects, in particular, the etching and / or plating, which is a scientific treatment, is performed. Since an antenna for non-contact communication and a terminal for external contact are formed, external force such as pressure is hardly applied to the contact / non-contact IC chip, and the contact / non-contact IC chip can be set thinner. it can.

According to the thirteenth aspect of the present invention, in addition to the effects of any one of the fifth to twelfth aspects, the non-contact communication antenna is easily connected to the contact / non-contact type IC chip. The communication stability can be improved by securing the antenna effective area.

[Brief description of the drawings]

FIG. 1 is a diagram (part 1) showing a first embodiment of a contact / non-contact type IC module and a method of manufacturing the same according to the present invention.

FIG. 2 is a diagram (part 2) showing a first embodiment of a contact / non-contact type IC module and a method of manufacturing the same according to the present invention.

FIG. 3 is a diagram (part 1) illustrating a contact / non-contact type IC module and a method of manufacturing the same according to a second embodiment of the present invention;

FIG. 4 is a diagram (part 2) illustrating a contact / non-contact type IC module according to a second embodiment of the present invention and a method for manufacturing the same.

[Explanation of symbols]

 110 Contact / non-contact type IC module 111 Substrate 112 Contact / non-contact type IC chip 112a Connection terminal 116 Insulating layer 116a Through hole 118 Non-contact communication antenna 119, 119A External contact terminal 119B Connection part # 11, # 21 IC chip embedding process # 12, # 23 Pattern formation process # 22 Through-hole formation process

Claims (13)

[Claims] A substrate made of a sealing resin; a contact / non-contact type IC chip embedded on one surface of the substrate and arranged so that a connection terminal portion is located outside; An external contact terminal connected to and formed on one surface of the substrate; and a non-contact communication antenna formed on one surface of the substrate and having the same layer structure as the external contact terminal. Contact / non-contact type IC module. 2. The contact / non-contact type I according to claim 1.
In the C module, the external contact terminal and / or the connection terminal portion of the non-contact communication antenna are formed in contact with the connection terminal portion of the contact / non-contact type IC chip. Contact / non-contact type IC module. 3. The contact / non-contact type I according to claim 1.
In the C module, an insulating layer that covers at least the contact / non-contact type IC chip on one surface of the substrate, and is provided on the insulating layer and communicates with a connection terminal portion of the contact / non-contact type IC chip. A through hole, integral with the external contact terminal, formed in the through hole,
A contact / non-contact type IC module, comprising: a connection portion for connecting the contact / non-contact type IC chip to the external contact terminal. 4. One of claims 1 to 3
The contact / non-contact type IC module according to Item, wherein the non-contact communication antenna is arranged such that the external contact terminal is displaced with respect to an antenna inner area,
A contact / non-contact type IC module, wherein an effective antenna area that does not interfere with the external contact terminal is secured. 5. An IC chip embedding step of embedding a contact / non-contact type IC chip on one surface of a substrate made of a sealing resin so that a connection terminal portion is on the outside, and a non-contact IC chip on one surface of the substrate. An antenna / external contact terminal forming step of simultaneously forming a contact communication antenna and an external contact terminal,
A method for producing a contact / non-contact type IC module comprising: 6. The contact / non-contact type I according to claim 5.
A method for manufacturing a contact / non-contact type IC module, comprising a cutting step of cutting and / or shaving the contact / non-contact type IC chip to reduce the thickness. 7. The contact / non-contact type I according to claim 6.
In the method for manufacturing a C module, the cutting step cuts and / or cuts the contact / non-contact type IC chip embedded in the substrate in the IC chip embedding step. A method for manufacturing a dual-purpose IC module. 8. One of claims 5 to 7
3. The method for manufacturing a contact / non-contact type IC module according to the item [2], wherein the contact / non-contact type IC module is manufactured by multi-face mounting in which a plurality of IC modules are manufactured on the same surface. A method for manufacturing a dual-purpose IC module. 9. Any one of claims 5 to 8
The method for manufacturing a contact / non-contact type IC module according to Item, wherein the step of forming the antenna / external contact terminal forms the external contact terminal so as to be in contact with the connection terminal portion. A method for manufacturing a contact / non-contact type IC module. 10. The method for manufacturing a contact / non-contact type IC module according to any one of claims 5 to 8, wherein the antenna / external contact terminal forming step includes the external contact terminal. Forming a connection part for connecting the connection terminal part and the external contact terminal integrally and simultaneously with the external contact terminal; and forming at least the contact / non-contact type IC chip on one surface of the substrate An insulating layer forming step of forming an insulating layer covering the semiconductor chip; and a through hole forming step of forming a through hole communicating with the contact / non-contact type IC chip in the insulating layer. A method for manufacturing a non-contact type IC module. 11. The method for manufacturing a contact / non-contact type IC module according to any one of claims 5 to 10, wherein the antenna / external contact terminal forming step includes etching and / or plating. Forming the contactless communication antenna and the external contact terminal according to the following method. 12. The method for manufacturing a contact / non-contact type IC module according to claim 10, wherein the step of forming the antenna / external contact terminals comprises etching and / or plating for a non-contact communication antenna and an external contact. A method of manufacturing a contact / non-contact type IC module, comprising forming terminals and connection portions. 13. The method for manufacturing a contact / non-contact type IC module according to any one of claims 5 to 12, wherein the step of forming an antenna / external contact terminal comprises: Wherein the external contact terminals are shifted to form an effective antenna area which does not interfere with the external contact terminals. .