JPH07239922A - Ic module for ic card - Google Patents

Ic module for ic card

Info

Publication number
JPH07239922A
JPH07239922A JP6052767A JP5276794A JPH07239922A JP H07239922 A JPH07239922 A JP H07239922A JP 6052767 A JP6052767 A JP 6052767A JP 5276794 A JP5276794 A JP 5276794A JP H07239922 A JPH07239922 A JP H07239922A
Authority
JP
Japan
Prior art keywords
card
contact type
module
coil
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6052767A
Other languages
Japanese (ja)
Inventor
Masahiro Hayashi
昌弘 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP6052767A priority Critical patent/JPH07239922A/en
Publication of JPH07239922A publication Critical patent/JPH07239922A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

PURPOSE:To obtain an IC card capable of dealing with both of contact and noncontact systems by providing a noncontact transmission device comprising a coil or an antenna and a contact transmission device comprising plural terminal electrodes using patterned conductors provided on the surface of a support based to the module. CONSTITUTION:The IC module 10 forms a pattern equivalent to a coil or an antenna 13 comprising conductors to one side of a support base 11 and a pattern equivalent to a terminal electrode 12. The coil or antenna 13 transmits information between the IC card and an external device by the noncontact system. Furthermore, the terminal electrode 12 transmits information between the IC card and the external device by the contact system and consists of a set of 6 rectangular electrodes. Thus, the IC card capable of dealing with both of contact and noncontact systems can be obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、外部機器とＩＣカード
の間でデータや信号等の情報の伝達またはＩＣチップそ
のたの電気回路を駆動するためのエネルギーの伝達を行
い得るＩＣカードまたはＩＣモジュールであって、接触
方式及び非接触方式の両方方式に対応しうる、多目的な
用途に供するＩＣカードまたはＩＣモジュールに関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card or IC capable of transmitting information such as data and signals between an external device and an IC card or transmitting energy for driving an IC chip and other electric circuits. The present invention relates to an IC card or an IC module for a versatile application, which is compatible with both contact and contactless methods.

【０００２】[0002]

【従来の技術】従来の非接触型ＩＣカードは、図３に示
されるようなコイルまたはアンテナと送受信部等を組み
込んだ非接触ＩＣコンポーネント（２２）をカード基体
（２０）と（２１）により上下から挟み込んだ構成のも
のが知られている。2. Description of the Related Art In a conventional non-contact type IC card, a non-contact IC component (22) incorporating a coil or an antenna and a transmitting / receiving section as shown in FIG. 3 is vertically moved by a card substrate (20) and (21). It is known to have a structure sandwiched between.

【０００３】また、従来の接触型ＩＣカードは、図４に
示されるようなカード基体（２３）の嵌合穴（２４）に
ＩＣモジュール（２８）を嵌合し接着剤等で固定した構
造のものが知られている。図４に示す様に通常の接触型
ＩＣカードは、塩化ビニル樹脂などのプラスチックから
なるカード基体（２３）にＩＣモジュール（２８）を埋
設し、さらに、磁気ストライプ（２５）、及び、特定の
コード番号（２６）や氏名（２７）等のエンボス（カー
ド基体に凹凸で文字数字を形成したもの）が施されてい
る。これは、従来の磁気プラスチックカードが未だ市場
に流通しており、単に接触型ＩＣカードとしての機能の
みでは、各種カードの用途には供しえないからである。A conventional contact type IC card has a structure in which an IC module (28) is fitted in a fitting hole (24) of a card base (23) as shown in FIG. 4 and fixed with an adhesive or the like. Things are known. As shown in FIG. 4, in a normal contact type IC card, an IC module (28) is embedded in a card substrate (23) made of plastic such as vinyl chloride resin, and further, a magnetic stripe (25) and a specific code. Embossing such as a number (26) and a name (27) (a card base on which uneven characters are formed) is provided. This is because the conventional magnetic plastic card is still on the market and cannot be used for various types of cards only by the function as a contact type IC card.

【０００４】なお、非接触型ＩＣカードの機能と接触型
ＩＣカードの機能の両方の機能を兼ね備えたものとして
は、例えば特開昭６０−１７９８９１号公報が挙げられ
る。同公報には、外部機器と接触して応答するための電
気的接点機構と非接触で応答するためのアンテナ機構と
を併設した構成が見られるが、送受信部およびアンテナ
機構は、前述の従来の非接触ＩＣカードと同様にカード
基体により挟み込まれる構成が開示されているのみであ
る。An example of a device having both the function of a non-contact type IC card and the function of a contact type IC card is disclosed in JP-A-60-179891. In the publication, there is seen a configuration in which an electric contact mechanism for contacting and responding to an external device and an antenna mechanism for responding in a non-contact manner are provided together. Only the structure in which it is sandwiched between card bases like the non-contact IC card is disclosed.

【０００５】[0005]

【発明が解決しようとする課題】以上のような状況を鑑
みると、接触型ＩＣカードをさらに発展させて非接触型
ＩＣカードを市場に展開する場合、接触型ＩＣカードの
機能と非接触型ＩＣカードの両方の機能を単純に組み合
わせるのみでは、広く市場に受け入れられることはな
い。それは前述のように未だ従来の磁気プラスチックカ
ードの影響が強いからである。In view of the above situation, when the contact type IC card is further developed and the non-contact type IC card is put on the market, the function of the contact type IC card and the non-contact type IC card. Simply combining both features of the card is not widely accepted by the market. This is because the conventional magnetic plastic card still has a strong influence as described above.

【０００６】従って、非接触型ＩＣカードと接触型ＩＣ
カードの両方の機能を兼ね備えたカードを市場に普及さ
せるためには、従来の磁気プラスチックカード用の環境
においても対応する可能なことが望ましい。しかしなが
ら、従来の接触型ＩＣカードと非接触型ＩＣカードのの
両方の機能を兼ね備えたＩＣカードは、例えば図３に示
すようにカード基体（２０）（２１）を上下から挟み込
む構造をベースにして、これに接触端子を設けた構造に
なっているために、磁気ストライプやエンボスをカード
に形成し難いこと、また、厚みが従来のプラスチックカ
ードの厚み（通常は０．７６ミリメートル）に比べて厚
くなってしまうという課題がある。Therefore, a non-contact type IC card and a contact type IC
In order to popularize a card having both the functions of the card into the market, it is desirable that the card can be used even in the environment for the conventional magnetic plastic card. However, an IC card having both the functions of a conventional contact type IC card and a non-contact type IC card is based on, for example, a structure in which card bases (20) and (21) are sandwiched from above and below as shown in FIG. , It is difficult to form a magnetic stripe or emboss on the card because it has a contact terminal, and the thickness is thicker than the conventional plastic card (usually 0.76 mm). There is a problem that it will become.

【０００７】[0007]

【課題を解決するための手段】そこで、本発明は、ＩＣ
カード用ＩＣモジュールにおいて、該ＩＣモジュール
は、ＩＣチップと、該ＩＣチップと電気的に接続され外
部機器との間で情報及び／またはエネルギーの伝達を行
う伝達機構と、該ＩＣチップ及び該伝達機構とを支持す
る支持体とからなり、前記伝達機構が、前記支持体表面
に設けられた導体をパターン化した複数の端子電極から
なる接触型伝達機構と、コイルまたはアンテナからなる
非接触型伝達機構とを備えた構成により、上記課題を解
決した。Therefore, the present invention provides an IC
In a card IC module, the IC module includes an IC chip, a transmission mechanism that is electrically connected to the IC chip and transmits information and / or energy between an external device, the IC chip, and the transmission mechanism. And a non-contact transmission mechanism including a coil or an antenna, and the transmission mechanism includes a plurality of terminal electrodes formed by patterning conductors provided on the surface of the support. The above-described problems have been solved by the configuration including the.

【０００８】また、上記非接触型伝達機構が上記支持体
表面に設けられた導体をパターン化してなるコイルまた
はアンテナとしてもよい。また、上記コイルまたはアン
テナは、接触型伝達機構の外側に設けるようにしてもよ
い。Further, the non-contact type transmission mechanism may be a coil or an antenna formed by patterning a conductor provided on the surface of the support. Further, the coil or antenna may be provided outside the contact type transmission mechanism.

【０００９】[0009]

【作用】ＩＣチップと、該ＩＣチップと電気的に接続さ
れ外部機器との間で情報及び／またはエネルギーの伝達
を行う接触型伝達機構と、コイルまたはアンテナからな
る非接触型伝達機構とを共通の支持体からなるＩＣモジ
ュールとすることにより、該ＩＣモジュールを、これと
嵌合するＩＣカード基体に嵌合させることにより、接触
型と非接触型の両方の方式に対応可能なＩＣカードが得
られる。The IC chip, the contact type transmission mechanism that is electrically connected to the IC chip and transmits information and / or energy to and from an external device, and the non-contact type transmission mechanism including a coil or an antenna are common. By using the IC module composed of the support of (1), the IC module is fitted to the IC card base body to be fitted to the IC module, and an IC card compatible with both contact type and non-contact type is obtained. To be

【００１０】また、上記支持体表面に設けられた導体を
端子電極となるようにパターン化した接触型伝達機構
と、上記支持体表面に設けられた導体をコイルまたはア
ンテナとなるようにパターン化した非接触型伝達機構と
を備えたＩＣモジュールとすることもでき、このような
場合は、接触型伝達機構と非接触型伝達機構の両方が支
持体表面の導体により形成される。Further, the contact type transmission mechanism in which the conductor provided on the surface of the support is patterned to be a terminal electrode, and the conductor provided on the surface of the support is patterned to be a coil or an antenna. An IC module having a non-contact type transmission mechanism may be used, and in such a case, both the contact type transmission mechanism and the non-contact type transmission mechanism are formed by conductors on the surface of the support.

【００１１】[0011]

【効果】本発明によれば、接触型と非接触型の両方の方
式に対応可能な機能をＩＣモジュール化し、このＩＣモ
ジュールをプラスチックカード基体に嵌合固定する形態
で使用するため、予め磁気ストライプやその他の印刷等
を施したプラスチックカードをカード基体として用いる
ことができる。According to the present invention, the function capable of supporting both the contact type and the non-contact type is formed into an IC module, and the IC module is used by being fitted and fixed to the plastic card base. It is possible to use a plastic card that has been printed with or other printing as a card substrate.

【００１２】また、従来の塩化ビニル樹脂等を基材とす
る磁気カードと互換性のあるカード基材を用いて接触型
と非接触型の両方の方式に対応可能なＩＣカードを得る
ことができる。An IC card compatible with both contact type and non-contact type can be obtained by using a card base material compatible with a conventional magnetic card based on vinyl chloride resin or the like. .

【００１３】カード基材に対してエンボスを形成するこ
ともできる。エンボスを形成する場合は、予めエンボス
を施したプラスチックカードを用いてもよいし、ＩＣモ
ジュールを嵌め込んでからエンボスを施してもいずれで
もよいので、ＩＣカードの使い方、またはＩＣカード発
行手順の自由度が大きくなる。It is also possible to form an emboss on the card substrate. When forming an emboss, either a plastic card that has been embossed in advance may be used, or it may be embossed after the IC module is inserted. Therefore, the usage of the IC card or the IC card issuing procedure is free. The degree increases.

【００１４】上記プラスチックカードを従来の磁気カー
ドや接触型ＩＣカードの規格に合わせておけば、本発明
のＩＣモジュールを具備するＩＣカードを従来の磁気カ
ードまたは接触型ＩＣカード用のリーダーライタで使用
することもできる。殊に、コイルまたはアンテナを接触
型伝達機構の外側に設けることにより、該接触型伝達機
構を構成する複数の端子電極を一つの領域に配置できる
ので、従来の接触型ＩＣカードの端子電極と互換性のあ
る端子電極パターンにできる。If the above plastic card is made to meet the standards of conventional magnetic cards and contact type IC cards, the IC card equipped with the IC module of the present invention can be used as a reader / writer for conventional magnetic cards or contact type IC cards. You can also do it. In particular, by disposing the coil or the antenna outside the contact type transmission mechanism, a plurality of terminal electrodes constituting the contact type transmission mechanism can be arranged in one area, which is compatible with the terminal electrodes of the conventional contact type IC card. It is possible to form a terminal electrode pattern having good properties.

【００１５】[0015]

【実施例】図面に基づいて、本発明の実施例を説明す
る。図１は、本発明のＩＣカード用ＩＣモジュールから
なるＩＣカードの上面図である。また、図２は、図１の
Ａ−Ａ矢印拡大断面図であって、本発明のＩＣモジュー
ルの構造を示している。図中、（１）はＩＣカード、
（２）はカード基体、（３）は磁気ストライプ、（４）
はコード番号を示すエンボスパターン、（５）は氏名を
示すエンボスパターン、（６）はカード基体に設けられ
たＩＣモジュール嵌合穴、（１０）はＩＣモジュール、
（１１）は支持体、（１２）は接触型情報伝達機構であ
る端子電極、（１３）は非接触型情報伝達機構であるコ
イルまたはアンテナ、（１４）（１５）はスルーホー
ル、（１６）はＩＣチップ、（１７）はボンディングワ
イヤ、（１８）は樹脂封止、である。Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a top view of an IC card including the IC module for an IC card of the present invention. Further, FIG. 2 is an enlarged sectional view taken along the line AA of FIG. 1 and shows the structure of the IC module of the present invention. In the figure, (1) is an IC card,
(2) is a card substrate, (3) is a magnetic stripe, (4)
Is an embossed pattern showing a code number, (5) is an embossed pattern showing a name, (6) is an IC module fitting hole provided in the card base, (10) is an IC module,
(11) is a support, (12) is a terminal electrode which is a contact type information transmission mechanism, (13) is a coil or antenna which is a non-contact type information transmission mechanism, (14) and (15) are through holes, (16) Is an IC chip, (17) is a bonding wire, and (18) is a resin seal.

【００１６】図に示すように、本発明のＩＣモジュール
（１０）は、カード基体（２）に設けられた嵌合穴
（６）に嵌め込まれ、接着材（図示せず）によりカード
基体（２）に接着固定される。カード基体の材質として
は、塩化ビニル樹脂やこれと物性の類似するプラスチッ
ク材料が用いられる。塩化ビニル樹脂を用いる理由とし
ては、エンボス適性に優れている点、カードに加工し易
い点、適度な強度や柔軟性があること等が挙げられる。As shown in the figure, the IC module (10) of the present invention is fitted into a fitting hole (6) provided in the card base (2) and is bonded to the card base (2) with an adhesive (not shown). ) Adhesively fixed to. As a material for the card base, vinyl chloride resin or a plastic material having physical properties similar to this is used. The reason for using the vinyl chloride resin is that it has excellent embossing suitability, that it is easy to process into a card, and that it has appropriate strength and flexibility.

【００１７】図２を参照してＩＣモジュール（１０）に
ついて詳細に説明する。ＩＣモジュール（１０）は、支
持体（１１）の一方の面に導体からなるコイルまたはア
ンテナ（１３）に相当するパターンと、端子電極（１
２）に相当するパターンが形成されている。コイルまた
はアンテナ（１３）は、非接触方式でＩＣカードと外部
機器との間で情報伝達を行うためもので、電磁的エネル
ギーを空間に放出したり、あるいは外部機器からの電磁
的エネルギーを受けるための機構である。The IC module (10) will be described in detail with reference to FIG. The IC module (10) has a pattern corresponding to a coil or an antenna (13) made of a conductor on one surface of the support (11), and a terminal electrode (1).
A pattern corresponding to 2) is formed. The coil or antenna (13) is for transmitting information between the IC card and the external device in a non-contact manner, and for emitting electromagnetic energy to the space or receiving electromagnetic energy from the external device. Mechanism.

【００１８】端子電極（１２）は、接触方式でＩＣカー
ドと外部機器との間で情報伝達を行うためのもので、複
数の電極から構成されている。本実施例では、６個の矩
形電極の集合からなるものを示しているが、電極数は、
これに制限されるものではない。また電極の形状や配置
もこれに制限されるものではない。The terminal electrode (12) is used for transmitting information between the IC card and an external device by a contact method, and is composed of a plurality of electrodes. In this embodiment, a set of six rectangular electrodes is shown, but the number of electrodes is
It is not limited to this. The shape and arrangement of the electrodes are not limited to this.

【００１９】さらに、本実施例では、支持体（１１）の
中央部に端子電極（１２）を設け、その周辺を囲む様に
螺旋形状のコイルまたはアンテナ（１３）を設けてい
る。このような配置とすることにより、端子電極（１
２）を中央部に集合させることができ、この場合は、従
来の接触型ＩＣカードで用いている電極パターンと互換
性のある端子電極とすることができる。Further, in this embodiment, the terminal electrode (12) is provided at the center of the support (11), and the spiral coil or antenna (13) is provided so as to surround the periphery thereof. With such an arrangement, the terminal electrode (1
2) can be gathered in the central portion, and in this case, the terminal electrode can be compatible with the electrode pattern used in the conventional contact type IC card.

【００２０】しかしながら、従来の接触型ＩＣカードの
電極パターンとの互換性を気にしないのであれば、例え
ば、コイルまたはアンテナ（１３）を中央部に設け、そ
の周辺に端子電極を配置するようにしてもよい。However, if the compatibility with the electrode pattern of the conventional contact type IC card is not taken into consideration, for example, the coil or the antenna (13) is provided in the central portion and the terminal electrodes are arranged in the periphery thereof. May be.

【００２１】またコイルまたはアンテナ（１３）は螺旋
形状のものを示したが、空間に電磁的エネルギーを空間
に放出したり、あるいは空間からの電磁的エネルギーを
受けることができれば、必ずしも螺旋形状である必要は
ない。The coil or antenna (13) has a spiral shape, but it is necessarily in a spiral shape as long as it can emit electromagnetic energy into the space or receive electromagnetic energy from the space. No need.

【００２２】また、支持体（１１）の他方の面には、Ｉ
Ｃチップ（１６）が接着固定されている。このＩＣチッ
プ（１６）と上記の端子電極（１２）及びコイルまたは
アンテナ（１３）を電気的に接続するために、支持体表
面と裏面を貫通するスルホールが設けられている。本実
施例では、端子電極（１２）はスルーホール（１４）に
より支持体表面から裏面にリードされ、そこからボンデ
ィングワイヤ１７を介してＩＣチップ（１６）上の所定
位置のパッドと接続されている。端子電極は複数（本実
施例では６個）あるので、夫々の端子電極について同様
な接続が行われる。On the other surface of the support (11), I
The C chip (16) is adhesively fixed. In order to electrically connect this IC chip (16) to the above-mentioned terminal electrode (12) and coil or antenna (13), a through hole penetrating the front and back surfaces of the support is provided. In this embodiment, the terminal electrode (12) is lead from the front surface to the back surface of the support through the through hole (14) and is connected to the pad at a predetermined position on the IC chip (16) through the bonding wire 17 from the lead. . Since there are a plurality of (six in this embodiment) terminal electrodes, similar connection is made for each terminal electrode.

【００２３】コイルまたはアンテナ（１３）についても
同様に行える。本実施例の螺旋形状のコイルまたはアン
テナ（１３）で説明すると、コイルまたはアンテナ（１
３）は螺旋の始め（７）と終わり（８）にスルーホール
（１５）をそれぞれ設け、それぞれのスルーホールで支
持体裏面に電気的リードを取り、ボンディングワイヤ１
７を介してＩＣチップ（１６）上の所定のパットに接続
される。The same can be done for the coil or antenna (13). Explaining the spiral coil or antenna (13) of this embodiment, the coil or antenna (1
In 3), through holes (15) are provided at the beginning (7) and the end (8) of the spiral, and electrical leads are taken on the back surface of the support through the respective through holes, and the bonding wire 1
It is connected to a predetermined pad on the IC chip (16) via 7.

【００２４】なお、本実施例ではＩＣチップが一つの場
合について示したが、複数の場合もある。例えば、接触
方式のＩＣカード用のＩＣチップと、非接触方式に対応
するための送受信機能を具備したＩＣチップとを別々に
してもよい。In this embodiment, the case where there is one IC chip is shown, but there may be a plurality of IC chips. For example, an IC chip for a contact type IC card and an IC chip having a transmission / reception function for supporting a non-contact type may be separately provided.

【００２５】また、データの記憶や演算などのデータ処
理については、非接触方式と接触方式に共通するので共
通する処理機能に対応するＩＣチップと、外部機器との
インターフェイスなど共通化できない処理機能について
は、別々のＩＣチップにしてもよい。Regarding data processing such as data storage and calculation, since it is common to the non-contact method and the contact method, the IC chip corresponding to the common processing function and the non-common processing function such as an interface with an external device May be separate IC chips.

【００２６】また必要に応じてＩＣチップ以外のディス
クリート部品と上記のＩＣチップとを組み合わせてもよ
い。If desired, discrete components other than IC chips may be combined with the above IC chips.

【００２７】以上のように構成された支持体（１１）の
裏面には、ＩＣチップやボンディングワイヤを覆うよう
に樹脂により樹脂封止（１８）が施される。On the back surface of the support (11) constructed as described above, a resin seal (18) is applied with a resin so as to cover the IC chip and the bonding wires.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明のＩＣカードの正面図である。FIG. 1 is a front view of an IC card of the present invention.

【図２】図１の本発明のＩＣカードのＡ−Ａ矢印拡大断
面図である。FIG. 2 is an enlarged sectional view of the IC card of the present invention in FIG. 1 taken along the line AA.

【図３】従来の非接触型ＩＣカードを示す斜視図であ
る。FIG. 3 is a perspective view showing a conventional non-contact type IC card.

【図４】従来の接触型ＩＣカードを示す斜視図である。FIG. 4 is a perspective view showing a conventional contact type IC card.

【符号の説明】[Explanation of symbols]

１ ＩＣカード ２，２０，２１，２３ カード基体 ３，２５ 磁気ストライプ ４，２６ コード番号 ５，２７ 氏名 ６，２４ 嵌合穴 １０，２８ ＩＣモジュール １１ 支持体 １２ 端子電極 １３ コイルまたはアンテナ １４，１５ スルーホール １６ ＩＣチップ １７ ボンディングワイヤ １８ 樹脂封止 ２２ 非接触ＩＣコンポーネント 1 IC Card 2,20,21,23 Card Base 3,25 Magnetic Stripe 4,26 Code Number 5,27 Name 6,24 Fitting Hole 10,28 IC Module 11 Support 12 Terminal Electrode 13 Coil or Antenna 14,15 Through hole 16 IC chip 17 Bonding wire 18 Resin encapsulation 22 Non-contact IC component

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】ＩＣカード用ＩＣモジュールであって、該
ＩＣモジュールは、ＩＣチップと、該ＩＣチップと電気
的に接続され外部機器との間で情報及び／またはエネル
ギーの伝達を行う伝達機構と、該ＩＣチップ及び該伝達
機構とを支持する支持体とからなり、 前記伝達機構が、コイルまたはアンテナからなる非接触
型伝達機構と、前記支持体表面に設けられた導体をパタ
ーン化した複数の端子電極からなる接触型伝達機構と、
を備えたことを特徴とするＩＣカード用ＩＣモジュー
ル。1. An IC module for an IC card, the IC module comprising: an IC chip; and a transmission mechanism electrically connected to the IC chip for transmitting information and / or energy to an external device. A non-contact type transmission mechanism including a coil or an antenna, and a plurality of conductors provided on the surface of the support, which are patterned. A contact type transmission mechanism consisting of terminal electrodes,
An IC module for an IC card, comprising: 【請求項２】請求項１記載の非接触型伝達機構が上記支
持体表面に設けられた導体をパターン化してなるコイル
またはアンテナであることを特徴とするＩＣカード用Ｉ
Ｃモジュール。2. The IC card I according to claim 1, wherein the non-contact type transmission mechanism is a coil or an antenna formed by patterning a conductor provided on the surface of the support.
C module. 【請求項３】請求項２記載のコイルまたはアンテナを接
触型伝達機構の外側に設けたことを特徴とするＩＣカー
ド用ＩＣモジュール。3. An IC module for an IC card, wherein the coil or antenna according to claim 2 is provided outside a contact type transmission mechanism.
JP6052767A 1994-02-25 1994-02-25 Ic module for ic card Pending JPH07239922A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6052767A JPH07239922A (en) 1994-02-25 1994-02-25 Ic module for ic card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6052767A JPH07239922A (en) 1994-02-25 1994-02-25 Ic module for ic card

Publications (1)

Publication Number Publication Date
JPH07239922A true JPH07239922A (en) 1995-09-12

Family

ID=12924028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6052767A Pending JPH07239922A (en) 1994-02-25 1994-02-25 Ic module for ic card

Country Status (1)

Country Link
JP (1) JPH07239922A (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2741191A1 (en) * 1995-11-14 1997-05-16 Sgs Thomson Microelectronics PROCESS FOR MANUFACTURING A MICROMODULE, PARTICULARLY FOR CHIP CARDS
WO1998007191A1 (en) * 1996-08-08 1998-02-19 Siemens Aktiengesellschaft Combination chip module and process for production of a combination chip module
WO1998053423A1 (en) * 1997-05-19 1998-11-26 Rohm Co., Ltd. Response device in ac card communication system
FR2765010A1 (en) * 1997-06-20 1998-12-24 Inside Technologies ELECTRONIC MICROMODULE, ESPECIALLY FOR CHIP CARDS
WO1999026195A1 (en) * 1997-11-14 1999-05-27 Toppan Printing Co., Ltd. Composite ic module and composite ic card
WO2000013139A1 (en) * 1998-08-31 2000-03-09 C. Media Co., Ltd. Noncontact ic medium and system using the same
JP2002230506A (en) * 2001-02-06 2002-08-16 Dainippon Printing Co Ltd Contact-cum-non-contact type ic module and its manufacturing method
JP2002288614A (en) * 2001-03-28 2002-10-04 Dainippon Printing Co Ltd Ic module and manufacturing method therefor
JP2002298114A (en) * 2001-03-29 2002-10-11 Dainippon Printing Co Ltd Ic module and manufacturing method thereof
WO2002086812A1 (en) * 2001-04-17 2002-10-31 Smart Card Co., Ltd. Ic chip module and ic card
JP2002334312A (en) * 2001-05-11 2002-11-22 Dainippon Printing Co Ltd Contact/non-contact combination type ic module and its manufacturing method
KR100437286B1 (en) * 2001-07-13 2004-06-25 주식회사 아이엔에이 A discern device of data processing status for ic card terminal from outside
KR100435210B1 (en) * 1997-09-01 2004-07-16 삼성전자주식회사 Chip on board package with external connectin terminal and substrate bonding pad as one piece and non-contact type chip card
JP2008532365A (en) * 2005-07-29 2008-08-14 北京握奇数据系統有限公司 Antenna for plug-in dual interface IC card
JP2009518740A (en) * 2005-12-08 2009-05-07 ホー・チュン−シン Smart card
US20120157015A1 (en) * 2010-12-21 2012-06-21 Jun-Gi Choi Semiconductor device and semiconductor control system including the same

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0774779A1 (en) * 1995-11-14 1997-05-21 STMicroelectronics S.A. Method of fabricating a micromodule, particularly for chip cards
US5898216A (en) * 1995-11-14 1999-04-27 Sgs-Thomson Microelectronics S.A. Micromodule with protection barriers and a method for manufacturing the same
FR2741191A1 (en) * 1995-11-14 1997-05-16 Sgs Thomson Microelectronics PROCESS FOR MANUFACTURING A MICROMODULE, PARTICULARLY FOR CHIP CARDS
WO1998007191A1 (en) * 1996-08-08 1998-02-19 Siemens Aktiengesellschaft Combination chip module and process for production of a combination chip module
AU757389B2 (en) * 1997-05-19 2003-02-20 Rohm Co., Ltd. Response device in IC card communication system
WO1998053423A1 (en) * 1997-05-19 1998-11-26 Rohm Co., Ltd. Response device in ac card communication system
US6601770B1 (en) 1997-05-19 2003-08-05 Rohm Co., Ltd. Response device in contact/contactless IC card communication system
FR2765010A1 (en) * 1997-06-20 1998-12-24 Inside Technologies ELECTRONIC MICROMODULE, ESPECIALLY FOR CHIP CARDS
WO1998059319A1 (en) * 1997-06-20 1998-12-30 Inside Technologies Electronic micromodule, in particular for smart card
KR100435210B1 (en) * 1997-09-01 2004-07-16 삼성전자주식회사 Chip on board package with external connectin terminal and substrate bonding pad as one piece and non-contact type chip card
US6378774B1 (en) 1997-11-14 2002-04-30 Toppan Printing Co., Ltd. IC module and smart card
WO1999026195A1 (en) * 1997-11-14 1999-05-27 Toppan Printing Co., Ltd. Composite ic module and composite ic card
US7051933B1 (en) 1998-08-31 2006-05-30 C.Media Co., Ltd. Noncontact IC medium and system using the same
WO2000013139A1 (en) * 1998-08-31 2000-03-09 C. Media Co., Ltd. Noncontact ic medium and system using the same
JP4684430B2 (en) * 2001-02-06 2011-05-18 大日本印刷株式会社 Contact / non-contact IC module and manufacturing method thereof
JP2002230506A (en) * 2001-02-06 2002-08-16 Dainippon Printing Co Ltd Contact-cum-non-contact type ic module and its manufacturing method
JP2002288614A (en) * 2001-03-28 2002-10-04 Dainippon Printing Co Ltd Ic module and manufacturing method therefor
JP2002298114A (en) * 2001-03-29 2002-10-11 Dainippon Printing Co Ltd Ic module and manufacturing method thereof
JP4734742B2 (en) * 2001-03-29 2011-07-27 大日本印刷株式会社 IC module and manufacturing method thereof
WO2002086812A1 (en) * 2001-04-17 2002-10-31 Smart Card Co., Ltd. Ic chip module and ic card
JP2002334312A (en) * 2001-05-11 2002-11-22 Dainippon Printing Co Ltd Contact/non-contact combination type ic module and its manufacturing method
KR100437286B1 (en) * 2001-07-13 2004-06-25 주식회사 아이엔에이 A discern device of data processing status for ic card terminal from outside
JP2008532365A (en) * 2005-07-29 2008-08-14 北京握奇数据系統有限公司 Antenna for plug-in dual interface IC card
JP4907559B2 (en) * 2005-07-29 2012-03-28 北京握奇数据系統有限公司 Antenna for plug-in dual interface IC card
JP2009518740A (en) * 2005-12-08 2009-05-07 ホー・チュン−シン Smart card
US20120157015A1 (en) * 2010-12-21 2012-06-21 Jun-Gi Choi Semiconductor device and semiconductor control system including the same

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