JP2002207982A - Ic module for both contact and non-contact and ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC module for both contact and non-contact which is easily manufactured and can be manufactured at low cost and whose communication characteristic is satisfactory and to provide an IC card. SOLUTION: An IC chip 13 and a capacitor 14 connected parallelly to an antenna 12 are provided on an IC chip mounting board 11 where a wiring pattern including the antenna 12 whose size is almost equal to or below that of a contact terminal 11T is formed on a face opposite from a face on which the contact terminal 11T is formed, the communication characteristic of the IC module 15 for both contact and non-contact is maintained to be satisfactory, and a communicable distance is made to be long.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contactless and non-contact type IC capable of performing both a contact type in which communication is performed via a contact terminal and a non-contact type in which communication is performed without using a contact terminal. The present invention relates to a module and an IC card.

[0002]

2. Description of the Related Art FIG. 7 is a view showing a conventional contactless and non-contact type IC card 100. As shown in FIG. FIG. 7A is a front perspective view of the IC card 100, and FIG. 7B is a cross-sectional view of a main part. Conventional contactless non-contact IC card 100
Has an antenna 102 about the same size as a card. When manufacturing the IC card 100, first, after manufacturing a card body in which the antenna 102 is built, a cutting step of exposing the antenna terminals 102a at both ends of the antenna 102 is performed. After that, the antenna terminal 102a exposed in the cutting process and the IC
The IC card 100 is completed by connecting the C chip mounting board 101 via the conductive adhesive 106.

[0003] Japanese Patent Application Laid-Open No. 07-239922 discloses an I / O device having an IC chip 203 mounted thereon as shown in FIG.
Antenna 2 including contact terminals on C chip mounting board 201
02 is formed, and an IC card 200 in which the IC module 205 is embedded is proposed.

[0004]

However, in the embodiment shown in the above-mentioned IC card 100 (FIG. 7), a process of manufacturing a card body incorporating the antenna 102, a cutting process of exposing the antenna terminal 102a, an antenna terminal 102a
There is a problem that many complicated steps such as a connection step of connecting the IC chip mounting board 101 to the IC chip mounting board 101 are required. Particularly, in the cutting step, it is necessary to surely expose the antenna 102 built in the card body and not to cut off the antenna 102, which requires very high-precision processing, and the cutting device is expensive and In addition, since the cutting itself is difficult and the reliability is low, the yield is further reduced and the obtained I
There is a problem that the unit price of the C card 100 becomes high.

Further, in the IC module 205 and the IC card 200 described in JP-A-07-239922, there is a problem that the communicable distance is short because the shape of the antenna 202 is small.

SUMMARY OF THE INVENTION An object of the present invention is to provide a contactless non-contact dual-purpose IC which is easy to manufacture, can be manufactured at low cost, and has good communication characteristics.
To provide a C module and an IC card.

[0007]

The present invention solves the above-mentioned problems by the following means. In addition, in order to make it easy to understand, description is given with reference numerals corresponding to the embodiment of the present invention, but the present invention is not limited to this. That is, the invention of claim 1 provides a wiring pattern including a first surface on which a contact terminal (11T) is formed and an antenna (12) on the opposite side of the first surface and having a size equal to or smaller than the contact terminal. A substrate (11) having a second surface on which is formed;
A contact / contactless IC module (15) including an IC chip (13) mounted on the second surface side and a capacitor (14) on the second surface side and connected to the antenna. is there.

According to a second aspect of the present invention, in the contactless IC module of the first aspect, the capacitor (14) is connected to the wiring pattern by a conductive adhesive (16). It is a contactless noncontact dual-purpose IC module.

According to a third aspect of the present invention, in the contactless non-contact type IC module according to the first aspect, the capacitor is connected to the wiring pattern by an anisotropic conductive material. This is a contact IC module.

[0010] The invention of claim 4 is the first to third aspects of the present invention.
The contactless non-contact type IC module according to any one of the above, wherein the capacitor (14) is a ceramic capacitor.
It is a C module.

[0011] The invention of claim 5 is the invention according to claims 1 to 3.
The contact / contactless IC module according to any one of the above, wherein the capacitor is a bendable sheet-like capacitor (24, 34).

According to a sixth aspect of the present invention, in the contactless non-contact type IC module according to the fifth aspect, the capacitor (24) is formed directly on the substrate (21). This is a contact IC module.

[0013] The invention of claim 7 is the invention of claim 5 or claim 6.
3. The contactless and non-contact type IC module according to claim 1, wherein the capacitor is provided at a position between the substrate and the IC chip.

According to an eighth aspect of the present invention, in the contactless non-contact type IC module according to the fifth aspect, the IC chip (13) includes the substrate (21) and the capacitor (3).
4) A contact / non-contact dual-purpose IC module, wherein the IC module is provided at a position between the contact and the non-contact.

According to a ninth aspect of the present invention, in the contactless non-contact type IC module according to the eighth aspect, a chip / capacitor connecting portion for connecting the IC chip (13) and the capacitor (34), and the antenna ( 12) An IC for contact and non-contact use, comprising: an antenna / capacitor connection portion for connecting the capacitor (34) to the antenna.
Module.

According to a tenth aspect of the present invention, in the contact / non-contact dual-purpose IC module according to the eighth aspect, a chip for connecting the IC chip (13) and the antenna (12) is provided.
A contact / non-contact dual use IC module, comprising: an antenna connection portion; and an antenna / capacitor connection portion for connecting the antenna (12) and the capacitor (34).

According to an eleventh aspect of the present invention, in the contact / non-contact dual-purpose IC module according to any one of the first to tenth aspects, the IC chip (13) is provided at a connection portion with the wiring pattern. And a gold wire (17).

According to a twelfth aspect of the present invention, in the contact / non-contact dual-purpose IC module according to any one of the first to eleventh aspects, the IC chip (13) is provided at a connection portion with the wiring pattern. And an anisotropic conductive material.

According to a thirteenth aspect of the present invention, there is provided an IC comprising: a card base; and the contact / non-contact dual-purpose IC module according to any one of the first to twelfth aspects embedded in the card base. Card.

[0020]

Embodiments of the present invention will be described below in more detail with reference to the drawings. (First Embodiment) FIG. 1 is a simplified view of a first embodiment of an IC module 15 according to the present invention. FIG. 2 is a diagram showing the first embodiment in more detail than FIG. The IC module 15 in the present embodiment includes a contact terminal 11T for performing contact communication, an antenna 12 for performing non-contact communication, an IC chip 13 having both a contact function and a non-contact function, and a parallel connection to the antenna 12. The capacitor 14 is provided on the IC chip mounting substrate 11.

The IC chip mounting substrate 11 has a thickness of 70 μm.
A terminal pattern of the contact terminal 11T on one surface (first surface) and the other surface (second surface).
Surface) is provided with a wiring pattern such as the antenna 12 and the antenna terminal 12a. Contact terminal 11T and antenna 12
Is formed on both surfaces of the IC chip mounting substrate 11 by the thickness 18.
This was performed by attaching a copper foil of μm and etching.

The contact terminals 11T are connected to the IC chip mounting board 1
It is provided on almost the entirety of the first surface, and has a plurality of terminals that are in electrical contact with contact terminals of a contact type reader / writer (not shown). The IC chip mounting board 11 has through holes 11 corresponding to the respective terminals of the contact terminals 11T.
a so that an electrical connection can be made from the second surface side to the back surface of the contact terminal 11T.

The antenna 12 is mounted on the IC chip mounting board 11
Antenna coil wound several times along the outer circumference of
In the present embodiment, the outer dimensions are 10 × 10 mm, 5 turns (in FIGS. 1 and 2, three turns are shown for simplicity). The antenna 12 has an antenna terminal 12a at both ends, and at least the antenna terminal 12a.
The portion a is plated with Ni or gold.

The IC chip 13 is an IC chip having both a contact communication function and a non-contact communication function, and is bonded to the second surface of the IC chip mounting board 11 with an insulating paste (not shown). The IC chip 13 has a plurality of connection pads 13a, and a gold wire 17 is used at a connection portion between the connection pads 13a, the antenna terminals 12a, and the contact terminals 11T.

The capacitor 14 is a ceramic capacitor having a thickness of 300 μm, and is connected to the antenna terminal 12a by a conductive paste such as a silver paste. Therefore, the capacitor 14 is electrically connected in parallel to the antenna 12 (FIG. 1).

The IC module 15 is sealed with a sealing resin 18 such as an epoxy resin so as to cover at least the IC chip 13, and the protection of the IC chip 13 and the wiring is protected.

The IC module 15 has an embedded portion formed by cutting or the like in an IC card main body (not shown), and is embedded in the embedded portion using an adhesive or the like.
Used as C card. Here, IC module 1
When the IC card 5 is embedded in the main body of the IC card, there is no portion for electrical connection, and therefore, the processing of the embedded section does not require high-precision processing as described in the related art.

When performing non-contact communication, it is desirable that the communicable distance is long, and it is advantageous that the antenna is large. However, the IC module 15 in the present embodiment
And Japanese Patent Application Laid-Open No. 07-23992 described in the prior art.
In the IC module 205 and the like described in Japanese Unexamined Patent Application Publication No. 2000-205, the size of the antenna cannot be increased.

In the LC resonance circuit, the resonance frequency f is L:
The self-inductance of the antenna coil, C, is given by the following equation as the capacitance of the capacitor. f = 1 / (2π√ (LC)) (Equation 1) To increase the non-contact communication distance with the reader / writer, IC
It is necessary to make the resonance frequency of the card close to the communication frequency between the IC card and the reader / writer, but when reducing the size of the antenna, if the number of turns of the coil is the same,
The value of L becomes smaller. In this case, to obtain a resonance frequency equivalent to that before reducing the antenna size, from Equation 1,
It is sufficient to increase the number of turns of the coil or increase the capacitance C.

Here, considering the case where the number of turns of the coil is increased, it is difficult to increase the number of turns of the antenna in a limited space. In addition, when the number of turns of the antenna is increased, the electric resistance is increased, and accordingly, it works in the direction of shortening the communicable distance. Therefore, in the present embodiment, the capacitance C is increased by adding the capacitor 14 so that the communicable distance is increased even with a small antenna.

(Comparison between the present embodiment and the comparative example) In order to confirm that the communicable distance of the IC module 15 according to the present embodiment is long, a comparative example in which the number of turns of the antenna and the external capacitor are changed. Was compared. As an IC module to be compared, one having the same antenna outer shape as the IC module 15 and having no external capacitor and having 20 turns (Comparative Example 1) and one having 5 turns (Comparative Example 2)
Were prepared, and communicable distances were compared using the same reader / writer. Table 1 shows the results of this comparison.
Shown in

[0032]

[Table 1]

As shown in Table 1, in Comparative Example 2, no communication could be performed at all, and even in Comparative Example 1 in which the number of turns of the antenna was large, the communicable distance was 5 mm. In the form, it was confirmed that the length was increased to 15 mm.

According to this embodiment, since the capacitor 14 is added, a long communication distance can be secured even if the antenna 12 is small.

(Second Embodiment) FIG. 3 is a cross-sectional view of an IC module 25 according to a second embodiment of the present invention, which is cut in the vicinity of a sheet capacitor 24. FIG. 4 is a diagram of the IC module 25 viewed from the second surface side. The IC module 25 according to the second embodiment is the same as the IC module 25 according to the first embodiment.
The only difference is that the material of the IC chip mounting substrate 11 of the C module 15 is changed to the IC chip mounting substrate 21 and the capacitor 14 is a sheet capacitor 24 in which the ceramic capacitor is connected. Therefore, the other common parts are denoted by the same reference numerals as in the first embodiment, and the duplicate description will be omitted.

The IC chip mounting board 21 has a thickness of 70 μm.
It has the same form as the IC chip mounting substrate 11 in the first embodiment except that the substrate is made of polyimide.

The sheet capacitor 24 is a thin bendable sheet-like capacitor directly formed on the IC chip mounting board 21. The sheet capacitor 24 was formed by alternately depositing aluminum as an electrode and polyurea as a dielectric layer on the antenna terminal 12a by vapor deposition.

According to the present embodiment, since the sheet capacitor 24 is formed as a capacitor by vapor deposition, the connection between the IC chip mounting substrate 21 and the sheet capacitor 24 is unnecessary, and the base substrate for forming the sheet capacitor 24 is not required. IC with a substrate for forming an antenna
They can be put together by the chip mounting board 21. Therefore, the IC module 25 can be made thin. In addition, since a capacitor formed by vapor deposition (sheet capacitor 24) has higher strength against bending and local pressure application than a ceramic capacitor, a highly reliable IC module can be manufactured. it can.

(Modifications) Various modifications and changes are possible without being limited to the embodiment described above, and they are also within the equivalent scope of the present invention. For example, in the second embodiment, the capacitor (the sheet capacitor 24) is formed directly on the IC chip mounting board 21, but as shown in FIG. 5, the sheet capacitor 34 is previously formed by vapor deposition on an insulating substrate 39 made of polyimide or the like. After that, it may be connected to the IC chip mounting board 21 using a conductive adhesive, an anisotropic conductive adhesive or the like.

As shown in FIG. 6, after the sheet capacitor 34 is formed on the insulating substrate 39 in advance by vapor deposition, the sheet capacitor 34 may be connected to the IC chip 13 using a conductive adhesive, an anisotropic conductive adhesive or the like. .

In the example shown in FIG. 6, the chip / capacitor connecting portion for connecting the IC chip 13 and the sheet capacitor 34 uses a conductive adhesive 36 to connect the antenna 12 and the sheet capacitor 34 to each other. The capacitor connecting portion uses a gold wire 17, which is a chip / antenna connecting portion connecting the IC chip 13 and the antenna 12 and an antenna / capacitor connecting portion connecting the antenna 12 and the sheet capacitor 34. It is good also as a form which provides a part.

[0042]

As described above in detail, according to the present invention, since the antenna having the same size or less as the contact terminal and the capacitor connected in parallel to the antenna are provided.
It is easy to manufacture IC cards,
The C card can be provided at a low price, and the communicable distance can be increased. In addition, if the sheet capacitor is formed directly on the substrate, the IC module can be made thinner, and since the IC module has excellent strength against bending and local pressure application, reliability is improved. Can be.

[Brief description of the drawings]

FIG. 1 is a simplified diagram showing a first embodiment of an IC module 15 according to the present invention.

FIG. 2 is a diagram showing the first embodiment in more detail than FIG. 1;

FIG. 3 is a cross-sectional view of an IC module 25 according to a second embodiment of the present invention, cut in the vicinity of a sheet capacitor 24;

FIG. 4 is a view of the IC module 25 viewed from a second surface side.

FIG. 5 shows a method of depositing a sheet capacitor on an insulating substrate 39 by evaporation
FIG. 7 is a view for explaining a modified embodiment in which the semiconductor device is formed on the IC chip mounting board 21.

FIG. 6 shows a method of forming a sheet capacitor into an insulating substrate 39 by vapor deposition
FIG. 9 is a diagram illustrating a modified embodiment in which the IC chip 13 is formed and connected to the IC chip 13.

FIG. 7 is a diagram showing a conventional contactless non-contact IC card 100.

FIG. 8 shows the I shown in JP-A-07-239922.
FIG. 2 is a diagram illustrating a C module 205 and an IC card 200 in which the IC module 205 is embedded.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 IC chip mounting board 12 Antenna 12a Antenna terminal 13 IC chip 14 Capacitor 15 IC module 16 Conductive adhesive 17 Gold wire 18 Sealing resin

Claims (13)

[Claims] 1. A substrate having a first surface on which a contact terminal is formed and a second surface on a side opposite to the first surface on which a wiring pattern including an antenna having a size equal to or smaller than the contact terminal is formed. A contactless non-contact IC module, comprising: an IC chip mounted on the second surface side; and a capacitor connected to the antenna on the second surface side. 2. The contactless and noncontact IC module according to claim 1, wherein the capacitor is connected to the wiring pattern by a conductive adhesive. 3. The contact / non-contact IC module according to claim 1, wherein the capacitor is connected to the wiring pattern by an anisotropic conductive material. 4. One of claims 1 to 3
The contact / non-contact IC module according to claim 7, wherein the capacitor is a ceramic capacitor. 5. The method according to claim 1, wherein:
The contact / non-contact dual-purpose IC module according to claim 1, wherein the capacitor is a bendable sheet-like capacitor. 6. The contact / noncontact IC module according to claim 5, wherein the capacitor is formed directly on the substrate. 7. The contactless non-contact IC module according to claim 5, wherein the capacitor is provided at a position sandwiched between the substrate and the IC chip. Non-contact dual-purpose IC module. 8. The contactless noncontact IC module according to claim 5, wherein the IC chip is provided at a position sandwiched between the substrate and the capacitor. module. 9. The contactless and non-contact type IC module according to claim 8, wherein a chip for connecting the IC chip and the capacitor.
A capacitor connecting portion, an antenna for connecting the antenna and the capacitor,
A contactless and non-contact type IC module, comprising: a capacitor connecting portion; 10. The contact / non-contact dual-purpose IC according to claim 8.
In the module, a chip / antenna connecting portion for connecting the IC chip and the antenna, and an antenna / connector for connecting the antenna and the capacitor.
A contactless and non-contact type IC module, comprising: a capacitor connecting portion; 11. The contactless and non-contact type IC module according to claim 1, wherein the IC chip has a gold wire at a connection portion with the wiring pattern. A contactless and non-contact dual-purpose IC module. 12. The contactless and non-contact type IC module according to claim 1, wherein the IC chip has an anisotropic conductive material at a connection portion with the wiring pattern. A contactless and non-contact type IC module characterized by the above-mentioned. 13. An IC card comprising: a card substrate; and the contact / non-contact dual-purpose IC module according to claim 1 embedded in the card substrate.