JP2012253699A - Wireless communication device, its manufacturing method, and metal article with wireless communication device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it easy to attach a radiation conductor and a ground conductor to improve connection reliability between the conductors.SOLUTION: A wireless communication device includes: radiation conductors 11a and 21a provided on a first main surface of a dielectric block 31; ground conductors 11b and 21b provided on a second main surface; feed conductors 11c and 11d for connecting a wireless IC element 50 processing a high-frequency signal with the radiation conductor 11a and the ground conductor 11b; and a short circuit conductor 21c for connecting the radiation conductor 21a and the ground conductor 21b. The dielectric block 31 is wound with metal conductors 11 and 21. The feed conductors 11c and 11d are formed with the metal conductor 11. The short circuit conductor 21c is formed with the metal conductor 21. The radiation conductors 11a and 21a and ground conductors 11b and 21b are formed with the metal conductor 11 and the metal conductor 21. The radiation conductors and the ground conductors may be formed with at least any one of the metal conductor 1 and the metal conductor 21.

Description

  The present invention relates to a wireless communication device, in particular, a wireless communication device used in an RFID (Radio Frequency Identification) system, a manufacturing method thereof, and a metal article with the wireless communication device.

  2. Description of the Related Art In recent years, RFID information systems that communicate predetermined information by communicating a reader / writer and an RFID tag (also referred to as a wireless communication device) attached to an article in a non-contact manner have been put to practical use as article information management systems. . As this RFID system, an HF band using a high frequency of 13 MHz band and a UHF band using a high frequency of 900 MHz band are generally used. In general, a coiled antenna is used in a wireless IC tag used in the HF band, and various antennas such as a dipole antenna, a loop antenna, and an inverted F antenna are used in a wireless IC tag used in the UHF band. It has been.

  As an inverted F type antenna used in the UHF band, for example, as disclosed in Patent Documents 1 to 4, a flat radiation conductor is provided on the surface of the dielectric substrate, and a flat ground conductor is provided on the back surface. The provided structure is common. Such an inverted F-type antenna is provided with a ground conductor on the back surface of the substrate. Therefore, the inverted F-type antenna can be operated even if the article to be attached to the tag is a metal object, and the radiating conductor has a predetermined gap with respect to the ground conductor. Thus, the antenna can be made smaller and thinner.

  Incidentally, in the inverted F-type antennas disclosed in Patent Documents 1 to 4, the feed conductor for connecting the radiation conductor and the feed circuit, and the short-circuit conductor for connecting the radiation conductor and the ground conductor are dielectric substrates. It is comprised by the through-hole conductor and via-hole conductor formed in this.

  However, the through-hole conductors and via-hole conductors generally require processes such as formation of through holes in the dielectric substrate, formation of plating films in the through holes and filling with conductive paste, and the processes are complicated. In addition, it is difficult to maintain reliability in electrical connection between a through-hole conductor or via-hole conductor and a planar conductor such as a radiation conductor or a ground conductor. Furthermore, since the through-hole conductor or via-hole conductor and the planar conductor are made of different materials, the resistance at the connection portion tends to increase. In addition, the article to which the tag is attached has various shapes, and in particular, when the tag is attached to a curved surface such as a gas cylinder, the tag is required to be flexible, but follows the bending or bending of the dielectric substrate. It is not easy to form a through-hole conductor or via-hole conductor that can be formed.

JP 2003-133847 A JP 2006-319496 A JP 2008-084308 A JP 2009-065318 A

  Accordingly, an object of the present invention is to provide a wireless communication device that is easy to attach a radiation conductor or a ground conductor and excellent in connection reliability between conductors, a manufacturing method thereof, and a metal article with a wireless communication device.

The wireless communication device according to the first aspect of the present invention is:
A dielectric block having a first main surface and a second main surface facing the first main surface, a radiation conductor provided on the first main surface of the dielectric block, and a second main surface of the dielectric block Including a ground conductor provided in the antenna, a wireless IC element that processes a high-frequency signal, a power supply conductor that connects the radiation conductor and the ground conductor, and a short-circuit conductor that connects the radiation conductor and the ground conductor. A wireless communication device having an inverted F-type antenna,
A first metal conductor and a second metal conductor formed separately from each other are wound around the dielectric block,
The feeding conductor is constituted by the first metal conductor or the second metal conductor, and the short-circuit conductor is constituted by the second metal conductor or the first metal conductor;
The radiation conductor and the ground conductor are formed of at least one of the first metal conductor and the second metal conductor;
It is characterized by.

A method for manufacturing a wireless communication device according to the second aspect of the present invention includes:
A dielectric block having a first main surface and a second main surface facing the first main surface, a radiation conductor provided on the first main surface of the dielectric block, and a second main surface of the dielectric block Including a ground conductor provided in the antenna, a wireless IC element that processes a high-frequency signal, a power supply conductor that connects the radiation conductor and the ground conductor, and a short-circuit conductor that connects the radiation conductor and the ground conductor. A method of manufacturing a wireless communication device having an inverted F-type antenna,
By winding the first metal conductor and the second metal conductor formed separately from each other around the dielectric block, the power supply conductor is constituted by the first metal conductor or the second metal conductor. The short-circuit conductor is constituted by a metal conductor or the first metal conductor,
Constituting the radiation conductor and the ground conductor at least one of the first metal conductor and the second metal conductor;
It is characterized by.

The metal article with a wireless communication device according to the third aspect of the present invention is:
A dielectric block having a first main surface and a second main surface facing the first main surface, a radiation conductor provided on the first main surface of the dielectric block, and a second main surface of the dielectric block Including a ground conductor provided in the antenna, a wireless IC element that processes a high-frequency signal, a power supply conductor that connects the radiation conductor and the ground conductor, and a short-circuit conductor that connects the radiation conductor and the ground conductor. A metal article with a wireless communication device provided with an inverted F-type antenna,
A first metal conductor and a second metal conductor formed separately from each other are wound around the dielectric block,
The feeding conductor is constituted by the first metal conductor or the second metal conductor, and the short-circuit conductor is constituted by the second metal conductor or the first metal conductor;
The radiation conductor and the ground conductor are formed of at least one of the first metal conductor and the second metal conductor;
It is characterized by.

  In the wireless communication device, the radiation conductor and the ground conductor are configured by at least one of the first metal conductor and the second metal conductor, the feeding conductor is configured by the first metal conductor or the second metal conductor, and the short-circuit conductor is Since the first metal conductor and the second metal conductor are respectively wound around the dielectric block, in other words, it is necessary to form a through-hole conductor or a via-hole conductor. Therefore, manufacturing is easy and connection reliability between conductors is improved.

  ADVANTAGE OF THE INVENTION According to this invention, the attachment of a radiation | emission conductor and a ground conductor is easy, and the wireless communication device excellent in the connection reliability between conductors and the metal article with a wireless communication device can be obtained.

It is a perspective view which shows schematic structure of the radio | wireless communication device which is 1st Example. 1 is an equivalent circuit diagram of a wireless communication device according to a first embodiment. It is explanatory drawing which shows the manufacturing process of the radio | wireless communication device which is 1st Example. It is a perspective view which shows the use condition of the radio | wireless communication device which is 1st Example. It is a vertical sectional view showing another use state of the wireless communication device of the first embodiment. It is a perspective view which shows schematic structure of the radio | wireless communication device which is 2nd Example. It is an equivalent circuit diagram of the wireless communication device that is the second embodiment. It is a perspective view which shows schematic structure of the radio | wireless communication device which is 3rd Example. It is the equivalent circuit schematic of the radio | wireless communication device which is 3rd Example. It is explanatory drawing which shows the manufacturing process of the radio | wireless communication device which is 4th Example. It is a horizontal sectional view which shows the radio | wireless communication device which is 5th Example. It is a horizontal sectional view which shows the radio | wireless communication device which is 6th Example. It is a perspective view which shows schematic structure of the radio | wireless communication device which is 7th Example. It is explanatory drawing which shows the manufacturing process of the radio | wireless communication device which is 7th Example. It is a perspective view which shows schematic structure of the radio | wireless communication device which is 8th Example. It is explanatory drawing which shows the manufacturing process of the radio | wireless communication device which is 8th Example.

  Embodiments of a wireless communication device, a manufacturing method thereof, and a metal article with a wireless communication device according to the present invention will be described below with reference to the accompanying drawings. In each figure, common parts and portions are denoted by the same reference numerals, and redundant description is omitted.

(Overview of wireless communication device)
First, the outline of the wireless communication device according to the present invention will be described. The wireless communication device includes an inverted F antenna attached to a dielectric block. The inverted-F antenna is an antenna in which impedance matching is achieved by bending a radiation conductor, which is a monopole antenna, at 90 ° and further providing a short-circuit conductor in the vicinity of the feeding point. The monopole antenna or loop antenna Compared to, it can be made smaller and thinner.

  The inverted F-type antenna includes a radiating conductor that mainly functions as a radiating element, a ground conductor that is disposed opposite to the radiating conductor, a wireless communication element that processes a high-frequency signal, and a feeding conductor that connects the radiating conductor and the ground conductor. And a short-circuit conductor connecting the radiation conductor and the ground conductor. The radiation conductor is provided on the first main surface of the dielectric block, and the ground conductor is provided on the second main surface of the dielectric block.

  The dielectric block can be made of ceramic, resin, paper, or the like. In particular, in the case of a wireless communication device attached to a curved surface such as a gas cylinder, it is preferable to have flexibility. As the dielectric block having flexibility, for example, an elastic material (elastomer) such as a silicon resin or a urethane resin can be used. Note that in the case of a wireless communication device attached to a flat surface, it is not always necessary to have flexibility, and a hard material such as ceramic or epoxy resin can be used. The dielectric block preferably has a rectangular parallelepiped shape having a first main surface and a second main surface, but is not limited thereto. An elliptical shape or a circular shape in a plan view, or a shape having a constriction at the center may be used. The entire dielectric block does not need to be formed of a uniform material, and may be a combination of dielectrics having various dielectric constants and may have a cavity inside.

  In the inverted F-type antenna, the radiation conductor, the ground conductor, the feeding conductor, and the short-circuit conductor are configured by winding the first metal conductor and the second metal conductor, which are formed separately from each other, around the dielectric block, respectively. For example, the feeding conductor is constituted by a first metal conductor, the short-circuit conductor is constituted by a second metal conductor, and the radiation conductor and the ground conductor are constituted by at least one of the first metal conductor and the second metal conductor.

  The first and second metal conductors are preferably thin metal plates that can be bent so that they can be wound around a dielectric block. The metal thin plate may be hard, but in particular, in the case of a wireless communication device attached to a curved surface such as a gas cylinder, it is preferable to have flexibility. In addition, a thin metal plate such as a metal hoop material may be used alone as the first and second metal conductors, but a metal film (copper foil or aluminum foil) laminated on a base film such as PET, conductive A thin film formed of a conductive thin film may be used. As the metal material, a material having a small specific resistance mainly composed of copper or silver can be suitably used.

  According to the wireless communication device, the radiating conductor, the ground conductor, the feeding conductor, and the short-circuit conductor constituting the inverted F-type antenna are configured by winding the first metal conductor and the second metal conductor around the dielectric block. That is, since these conductors are formed by bending a metal conductor, a through-hole is formed in the dielectric block like a through-hole conductor or a via-hole conductor, and a plating film is formed on the through-hole. There is no need to use complicated processes such as filling the conductive paste. In addition, the electrical resistance value of the connection part between the through-hole conductor or via-hole conductor and the planar metal conductor increases, but this is eliminated and the connection reliability of the planar radiation conductor and ground conductor is facilitated. Can keep. Furthermore, although the article that is the object to which the wireless communication device is attached has various shapes, even when it is attached to a curved surface, the connection reliability of each conductor is impaired. Absent.

  In a wireless communication device, a wireless IC element is mounted. This wireless IC element has a signal processing circuit, a memory circuit, and the like, and is preferably basically configured as a semiconductor integrated circuit chip. The wireless IC element may be a bare chip or may be configured as a package IC. The wireless IC element may be connected to the power supply conductor and mounted directly on the power supply conductor (that is, mounted on the first metal conductor), or may be connected to the power supply conductor via a high-frequency line. . That is, the wireless IC element may be attached to the dielectric block, or may be provided on another substrate. The wireless IC element may be a semiconductor integrated circuit chip mounted on a feeder circuit board having a matching circuit and a resonance circuit.

  The radiation conductor and the ground conductor can be composed of both a first metal conductor and a second metal conductor. In particular, when the radiation conductor is composed of both the first metal conductor and the second metal conductor, the radiation conductor composed of the first metal conductor and the radiation conductor composed of the second metal conductor are mutually connected via a capacitance. Are preferably combined. If both are coupled via a capacitor, the characteristics will not change even if both are curved. This coupling capacitance is preferably a capacitance that is electrically directly coupled at the operating frequency. Similarly, when the ground conductor is composed of both the first metal conductor and the second metal conductor, the ground conductor composed of the first metal conductor and the ground conductor composed of the second metal conductor have a mutual capacity. It is preferable that it couple | bonds through. If both are coupled via a capacitor, the characteristics will not change even if both are curved. This coupling capacitance is preferably a capacitance that is electrically directly coupled at the operating frequency.

  The first metal conductor and the second metal conductor are capacitively coupled on the radiation conductor side and may be connected in a direct current manner on the ground conductor side, or may be connected in a direct current manner on the radiation conductor side. Capacitive coupling may be performed on the conductor side. Alternatively, they may be connected in a direct current manner on both the radiation conductor side and the ground conductor side.

  The first metal conductor is preferably wound around the dielectric block so that the wireless IC element is on the inside, and the dielectric block is preferably provided with a cavity for accommodating the wireless IC element. Thus, the dielectric block functions as a protective material for the wireless IC element.

  The dielectric block may be composed of a first block and a second block arranged adjacent to each other. In this case, the first metal conductor is wound around the first main surface of the first block, the side surface thereof, and the second main surface thereof, and the second metal conductor is formed of the first main surface of the first block and the second block. It is wound around the first main surface, its side surface, its second main surface, and the second main surface of the first block.

  The dielectric block may be composed of a single block. In this case, the dielectric block is provided with a through hole penetrating the first main surface and the second main surface, and the first metal conductor is the first main surface of the dielectric block, the through hole and the second hole. The second metal conductor is wound around the first main surface, the side surface, and the second main surface of the dielectric block.

  On the other hand, the first metal conductor is wound around the first main surface, the first side surface, and the second main surface of the dielectric block, and the second metal conductor is the first main surface of the dielectric block and the second main surface thereof. It may be wound around the side surface and its second main surface.

  The manufacturing method of the wireless communication device includes a dielectric block having a first main surface and a second main surface opposite to the first main surface, a radiation conductor provided on the first main surface of the dielectric block, and a dielectric A ground conductor provided on the second main surface of the body block, a power supply conductor connecting the radio IC element for processing a high-frequency signal, the radiation conductor and the ground conductor, and a short-circuit conductor connecting the radiation conductor and the ground conductor. A method of manufacturing a wireless communication device including an inverted F-type antenna including a first metal conductor and a second metal conductor formed separately from each other around a dielectric block, A power supply conductor is constituted by one metal conductor, a short-circuit conductor is constituted by a second metal conductor, and a radiation conductor and a ground conductor are constituted by at least one of the first metal conductor and the second metal conductor.

  The wireless communication device is mainly used in a UHF band RFID system, but can be used in an HF band or a lower frequency band RFID system depending on the size or the like, or a band on a higher frequency side than the UHF band. It can also be used for the RFID system used.

  By the way, especially the said wireless communication device can be comprised as a metal article with a wireless communication device by sticking to a metal article. By sticking the wireless communication device with the ground conductor facing the metal surface via an adhesive or the like, the ground conductor and the metal article are coupled via the capacitance. This capacity may be any capacity that is electrically connected directly at the operating frequency. The ground conductor and the metal article may be directly electrically connected.

(Refer 1st Example and FIGS. 1-5)
The wireless communication device 1A according to the first embodiment includes a first metal conductor 11, a second metal conductor 21, and a wireless IC element 50 as shown in FIG. The first metal conductor 11 includes a radiating conductor 11a positioned horizontally in the upper stage and a ground conductor 11b positioned horizontally in the lower stage, and further, an end portion of the radiating conductor 11a is bent to form a feeding conductor 11c. An end portion of the conductor 11b is bent to form a power supply conductor 11d. The second metal conductor 21 includes a radiation conductor 21a positioned parallel to the radiation conductor 11a and a ground conductor 21b positioned parallel to the radiation conductor 11b, and the ends of the radiation conductor 21a and the ground conductor 21b are bent. Thus, a short-circuit conductor 21c is configured.

  The wireless IC element 50 processes an RF signal and is joined to the feed conductors 11c and 11d. Specifically, as shown as an enlarged portion in FIG. 3A, the power supply conductors 11c and 11d are divided by a crank-shaped gap 12, and a pair of input / output electrodes (not shown) of the wireless IC element 50 is provided. Are joined to the opposing portions 12a and 12b of the feed conductors 11c and 11d. This joining is electrical direct coupling (DC connection) using solder bumps or the like, but it may be electromagnetic coupling.

  Here, the configuration of the wireless communication device 1A will be described together with its manufacturing method. First, the first metal conductor 11 provided on the surfaces of the dielectric block 31 and the support film 15 shown in FIG. 3A, and the surfaces of the other dielectric block 35 and the support film 25 shown in FIG. 3D. The second metal conductor 21 provided in is prepared. The wireless IC element 50 is already bonded to the power supply conductors 11 c and 11 d of the first metal conductor 11. The above-mentioned materials are used for these members.

  As the first step, as shown in FIG. 3B, the support film 15 holding the first metal conductor 11 is bonded from the upper surface of the dielectric block 31 to the side surface and the lower surface thereof. At this time, the feed conductors 11 c and 11 d are located on the side surface of the dielectric block 31. Next, as a second step, as shown in FIGS. 3C and 3D, the second metal conductor 21 is formed with the other dielectric block 35 adjacent to the side surface of the dielectric block 31. The held support film 25 is bonded to the upper surface of the dielectric block 31, the upper surface of the dielectric block 35, the side surfaces thereof, and the lower surface thereof. At this time, the short-circuit conductor 21 c is located on the side surface of the dielectric block 35. The adhesive is applied to the back surfaces of the support films 15 and 25, but may be applied to the surfaces of the dielectric blocks 31 and 35, or a double-sided adhesive tape may be used. Note that the adhesive is not necessarily required as long as the first and second metal conductors 11 and 21 are formed of a material that can maintain the bent shape. Further, the dielectric blocks 31 and 35 may be bonded together.

  The wireless communication device 1A manufactured as described above has the appearance shown in FIG. The wireless IC element 50 is bonded to the outside of the first metal conductor 11 and is disposed on the side surface of the block 31 when the first metal conductor 11 is wound around the dielectric block 31. On the other hand, a cavity 36 is formed in the dielectric block 35, and the wireless IC element 50 is accommodated in the cavity 36.

  In the wireless communication device 1A, as shown in FIG. 2A, the radiation conductors 11a and 21a overlapped at the upper stage are coupled to each other via a capacitor C1, and the ground is overlapped at the lower stage. The conductors 11b and 21b are coupled to each other via a capacitor C2. Since these capacitors C1 and C2 are capacitors that are directly connected at the operating frequency, they function as inverted F-type antennas shown in the equivalent circuit of FIG. Here, a loop current path i is formed by a part of the radiation conductor 21a composed of the power supply conductors 11c and 11d, the short-circuit conductor 21c, and the second metal conductor 21 and a part of the ground conductor 21b. The effective length of the inverted F antenna is L.

  The loop current path i contributes to impedance matching between the wireless IC element 50 and the radiation conductors 11a and 21a. The width and length of the radiation conductors 11a and 21a, the connection positions of the power supply conductors 11c and 11d and the short-circuit conductor 21c, the width dimension and length of the power-supply conductors 11c and 11d and the short-circuit conductor 21c, and the radiation conductors 11a and 21a and the ground Antenna characteristics such as a resonance frequency, a resonance resistance, and an operating band are defined by the distance between the conductors 11b and 21b.

  As shown in FIG. 4, the wireless communication device 1A is used by being attached to the surface of a metal article 61 (also referred to as a metal article with a wireless communication device). In this case, the ground conductor 21b composed of the second metal conductor 21 is directly electrically connected to the metal article 61, and the radiation characteristic has directivity in the normal direction of the metal article 61, and the RFID system Communication with other reader / writers is possible.

  Further, as shown in FIG. 5, the wireless communication device 1 </ b> A may be attached to the surface of the metal article 61 through an adhesive 62 in a state of being accommodated in a resin protective case 60 (metal with wireless communication device). Also referred to as an article). In this case, the ground conductors 11 b and 21 b are capacitively coupled to the metal article 61 via the bottom 60 a of the protective case 60 and the adhesive 62. This capacity is preferably a capacity that is electrically connected directly at the operating frequency.

  In this metal article with a wireless communication device, by using the protective case 60, the environment resistance of the wireless communication device 1A becomes good. 4 and 5 show a form in which the metal article 61 is used as an auxiliary radiating element of the wireless communication device 1A. However, the wireless communication device 1A is not combined with metal and can be used alone. Communication with the writer is possible at a relatively short distance.

(Refer to the second embodiment, FIGS. 6 and 7)
As shown in FIG. 6, the wireless communication device 1 </ b> B according to the second embodiment is a device in which the arrangement of the feeding conductor and the short-circuit conductor is switched. That is, the end portions of the radiation conductor 11a and the ground conductor 11b formed by the first metal conductor 11 are bent to form the short-circuit conductor 11e. The end portion of the radiation conductor 21a configured by the second metal conductor 21 is bent to form the power supply conductor 21d, and the end portion of the ground conductor 21b is bent to configure the power supply conductor 21e. Other configurations are the same as those of the first embodiment.

  Even in the wireless communication device 1B, as shown in FIG. 7A, the radiation conductors 11a and 21a overlapped in the upper stage are coupled to each other via the capacitor C1, and the ground overlapped in the lower stage. The conductors 11b and 21b are coupled to each other via a capacitor C2. Since these capacitors C1 and C2 are capacitors that are directly connected at the operating frequency, they function as inverted F-type antennas shown in the equivalent circuit of FIG. 7B. Here, a loop current path i is formed by a part of the radiation conductor 21a composed of the power supply conductors 21d and 21e, the short-circuit conductor 11e, and the second metal conductor 21 and a part of the ground conductor 21b. The effective length of the inverted F antenna is L.

(Refer to the third embodiment, FIGS. 8 and 9)
As shown in FIG. 8, the wireless communication device 1C according to the third embodiment shortens the lengths of the radiation conductor 21a and the ground conductor 21b formed of the second metal conductor 21, and the radiation conductor 21a and the ground conductor 21b. Are connected to the radiation conductor 11a composed of the first metal conductor 11 and the ground conductor 11b (DC connection), and the other configurations are the same as in the first embodiment. The equivalent circuit of the third embodiment is as shown in FIG. 9, and is the same as the equivalent circuit of the first embodiment shown in FIG.

(Refer to the fourth embodiment, FIG. 10)
As shown in FIG. 10, the wireless communication device 1D according to the fourth embodiment uses a single dielectric block 40, and the dielectric block 40 has through holes 41 penetrating the upper and lower surfaces. . This wireless communication device 1D is provided on the surface of the dielectric block 40 and the first metal conductor 11 provided on the surface of the support film 15 shown in FIG. 10A, and on the surface of the support film 25 shown in FIG. 10D. A second metal conductor 21 is prepared. The wireless IC element 50 is already bonded to the power supply conductors 11 c and 11 d of the first metal conductor 11.

  As the first step, as shown in FIGS. 10B and 10C, the radiation conductor 11a of the first metal conductor 11 is overlaid on the upper surface of the dielectric block 40, and the power supply conductors 11c and 11d are passed through holes. 41, and the ground conductor 11b is superposed on the lower surface of the dielectric block 40 and bonded so as to be wound around the dielectric block 40. Next, as a second step, as shown in FIGS. 10D and 10E, the second metal conductor 21 is bonded so as to be wound around the upper surface, the side surface, and the lower surface of the dielectric block 40. The fourth embodiment is different from the first embodiment in that a single dielectric block 40 having a through hole 41 is used, and the other configuration is the same as that of the first embodiment.

(Refer to the fifth embodiment, FIG. 11)
As shown in FIG. 11 which is a horizontal sectional view, the wireless communication device 1E according to the fifth embodiment has a wireless IC element 50 joined to the inside of the first metal conductor 11, and the first metal conductor 11 is a dielectric. In a state of being wound around the block 31, the wireless IC element 50 is accommodated in a cavity 32 formed on the side surface of the dielectric block 31. Other configurations are the same as those of the first embodiment.

(See the sixth embodiment, FIG. 12)
As shown in FIG. 12 which is a horizontal sectional view, the wireless communication device 1F according to the sixth embodiment has a wireless IC element 50 joined to the inner side of the second metal conductor 21, and the second metal conductor 21 is a dielectric. The wireless IC element 50 is housed in a cavity 37 formed on the side surface of the dielectric block 35 in a state of being wound around the block 35. Other configurations are the same as those of the second embodiment.

(Refer to the seventh embodiment, FIG. 13 and FIG. 14)
As shown in FIG. 13, the wireless communication device 1G according to the seventh embodiment includes power supply conductors 11f and 11g on the side of the first metal conductor 11, and a wireless IC element 50 is joined to the power supply conductors 11f and 11g. It is a thing.

  Specifically, the first metal conductor 11 provided on the surface of the single dielectric block 40 and the support film 15 shown in FIG. 14A, and the first metal conductor 11 provided on the surface of the support film 25 shown in FIG. Two metal conductors 21 are prepared. The wireless IC element 50 is already joined to the power supply conductors 11 f and 11 g of the first metal conductor 11.

  As a first step, as shown in FIG. 14B, the radiation conductor 11a of the first metal conductor 11 is overlaid on the upper surface of the dielectric block 40, and the feed conductors 11f and 11g are placed in front of the dielectric block 40. The ground conductor 11b is superimposed on the lower surface of the dielectric block 40 and is bonded to the dielectric block 40 so as to be wound around the side block. Next, as a second step, as shown in FIGS. 14C and 14D, the second metal conductor 21 is bonded so as to be wound around the upper surface, the side surface, and the lower surface of the dielectric block 40.

(Refer to the eighth embodiment, FIGS. 15 and 16)
As shown in FIG. 15, the wireless communication device 1 </ b> H according to the eighth embodiment has the first metal conductor 11 arranged outside the second metal conductor 21. That is, as a first step, as shown in FIG. 16A, the second metal conductor 21 is bonded so as to be wound around a single dielectric block 40. Next, as shown in FIGS. 16B and 16C, as a second step, the radiation conductor 11 a of the first metal conductor 11 is overlaid on the radiation conductor 21 a of the second metal conductor 21, and the feed conductor 11f and 11g are superposed on the front side surface of the dielectric block 40, and the ground conductor 11b is superposed on the ground conductor 21b of the second metal conductor 21 and bonded so as to be wound around the dielectric block 40.

(Other examples)
In addition, the radio | wireless communication device which concerns on this invention, its manufacturing method, and the metal article with a radio | wireless communication device are not limited to the said Example, Of course, it can change variously within the range of the summary.

  As described above, the present invention is useful for a wireless communication device, a method for manufacturing the same, and a metal article with a wireless communication device. In particular, the radiation conductor and the ground conductor can be easily attached and the connection reliability between the conductors can be improved. Is excellent.

DESCRIPTION OF SYMBOLS 1A-1H ... Wireless communication device 11 ... 1st metal conductor 11a ... Radiation conductor 11b ... Ground conductor 11c, 11d ... Feeding conductor 11e ... Short-circuiting conductor 11f, 11g ... Feeding conductor 21 ... 2nd metal conductor 21a ... Radiation conductor 21b ... Ground Conductor 21c ... Short-circuit conductor 21d, 21e ... Feeding conductor 31, 35, 40 ... Dielectric block 32, 36, 37 ... Cavity 41 ... Through hole 50 ... Wireless IC element 60 ... Protective case 61 ... Metal article 62 ... Adhesive

Claims (14)

A dielectric block having a first main surface and a second main surface facing the first main surface, a radiation conductor provided on the first main surface of the dielectric block, and a second main surface of the dielectric block Including a ground conductor provided in the antenna, a wireless IC element that processes a high-frequency signal, a power supply conductor that connects the radiation conductor and the ground conductor, and a short-circuit conductor that connects the radiation conductor and the ground conductor. A wireless communication device having an inverted F-type antenna,
A first metal conductor and a second metal conductor formed separately from each other are wound around the dielectric block,
The feeding conductor is constituted by the first metal conductor or the second metal conductor, and the short-circuit conductor is constituted by the second metal conductor or the first metal conductor;
The radiation conductor and the ground conductor are formed of at least one of the first metal conductor and the second metal conductor;
A wireless communication device. The wireless IC element is mounted on the first metal conductor,
The radiation conductor and the ground conductor are composed of the second metal conductor;
The wireless communication device according to claim 1.   The wireless communication device according to claim 2, wherein the radiation conductor and the ground conductor are also constituted by the first metal conductor.   The radiating conductor constituted by the first metal conductor and the radiating conductor constituted by the second metal conductor are coupled to each other via a capacitance. Wireless communication device.   4. The ground conductor constituted by the first metal conductor and the ground conductor constituted by the second metal conductor are coupled to each other via a capacitor. 5. A wireless communication device according to 4.   6. The wireless communication device according to claim 1, wherein the dielectric block is made of a flexible material. The first metal conductor is wound around the dielectric block so that the wireless IC element is inside,
The dielectric block is provided with a cavity for accommodating the wireless IC element;
The wireless communication device according to claim 1, wherein: The dielectric block includes a first block and a second block arranged adjacent to each other,
The first metal conductor is wound around the first main surface, the side surface, and the second main surface of the first block;
The second metal conductor is wound around a first main surface of the first block, a first main surface of the second block, a side surface thereof, a second main surface thereof, and a second main surface of the first block. thing,
The wireless communication device according to claim 1, wherein: The dielectric block is composed of a single block body, and the dielectric block is provided with a through-hole penetrating the first main surface and the second main surface,
The first metal conductor is wound around the first main surface of the dielectric block, the through hole, and the second main surface thereof,
The second metal conductor is wound around the first main surface, the side surface and the second main surface of the dielectric block;
The wireless communication device according to claim 1, wherein: The first metal conductor is wound around the first main surface, the first side surface and the second main surface of the dielectric block;
The second metal conductor is wound around the first main surface, the second side surface and the second main surface of the dielectric block;
The wireless communication device according to claim 1, wherein: A dielectric block having a first main surface and a second main surface facing the first main surface, a radiation conductor provided on the first main surface of the dielectric block, and a second main surface of the dielectric block Including a ground conductor provided in the antenna, a wireless IC element that processes a high-frequency signal, a power supply conductor that connects the radiation conductor and the ground conductor, and a short-circuit conductor that connects the radiation conductor and the ground conductor. A method of manufacturing a wireless communication device having an inverted F-type antenna,
By winding the first metal conductor and the second metal conductor formed separately from each other around the dielectric block, the power supply conductor is constituted by the first metal conductor or the second metal conductor. The short-circuit conductor is constituted by a metal conductor or the first metal conductor,
Constituting the radiation conductor and the ground conductor at least one of the first metal conductor and the second metal conductor;
A method of manufacturing a wireless communication device. A dielectric block having a first main surface and a second main surface facing the first main surface, a radiation conductor provided on the first main surface of the dielectric block, and a second main surface of the dielectric block Including a ground conductor provided in the antenna, a wireless IC element that processes a high-frequency signal, a power supply conductor that connects the radiation conductor and the ground conductor, and a short-circuit conductor that connects the radiation conductor and the ground conductor. A metal article with a wireless communication device provided with an inverted F-type antenna,
A first metal conductor and a second metal conductor formed separately from each other are wound around the dielectric block,
The feeding conductor is constituted by the first metal conductor or the second metal conductor, and the short-circuit conductor is constituted by the second metal conductor or the first metal conductor;
The radiation conductor and the ground conductor are formed of at least one of the first metal conductor and the second metal conductor;
A metal article with a wireless communication device.   The metal article with a wireless communication device according to claim 12, wherein the metal article and the ground conductor are directly electrically connected.   The metal article with a wireless communication device according to claim 12, wherein the metal article and the ground conductor are coupled via a capacitor.

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