JPH11259615A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPH11259615A JPH11259615A JP5629098A JP5629098A JPH11259615A JP H11259615 A JPH11259615 A JP H11259615A JP 5629098 A JP5629098 A JP 5629098A JP 5629098 A JP5629098 A JP 5629098A JP H11259615 A JPH11259615 A JP H11259615A
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- card
- cover film
- pattern
- jumper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013039 cover film Substances 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 11
- 239000002985 plastic film Substances 0.000 claims abstract description 11
- 229920006255 plastic film Polymers 0.000 claims abstract description 11
- 239000012790 adhesive layer Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- -1 for example Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＩＣカードに関す
る。[0001] The present invention relates to an IC card.
【０００２】[0002]
【従来の技術】現在広く用いられているキャッシュカー
ド、クレジットカード等は、プラスチックカードに磁気
ストライプを設け、これに記録された情報を読み取りで
きるようにしたものである。このような磁気記録方式の
ものでは、第三者によって情報が解読され易い、記録可
能な情報量が少ないといった欠点がある。そこで近年、
メモリ、ＣＰＵ等の機能を有するＩＣチップを装備した
ＩＣカードが開発され、実用段階に達しつつある。中で
も、非接触で信号の送受信を行う非接触式ＩＣカードと
して、質問器（リーダ／ライタ）が発した電磁波によ
り、応答器（非接触式ＩＣカード）のアンテナコイルに
誘導電圧を発生させ電源として利用すると共に、データ
の通信を行うものが注目されている。このような非接触
式ＩＣカードの構成としては、その基本的な回路構成を
図２(ａ)に示すように、プラスチックフィルム基材１の
表面にアンテナコイルを含む回路パターン２が形成さ
れ、図２（ｂ）および（ｃ）に示すように、その裏面側
にアンテナコイルの内周側と外周側のパターンをスルー
ホール７を介して接続するジャンパー回路６が形成さ
れ、回路パターン２に異方性導電接着剤層３を介して、
ＩＣチップ４をフェイスダウン式に直接接続し、この表
面に予め電子部品の箇所に穴９を設けたカバーフィルム
８を接着剤１１で貼り合わせ、さらにその両面に表皮材
１０をラミネートしたＩＣカードが、本願出願人によっ
て提案されている。2. Description of the Related Art At present, cash cards, credit cards and the like which are widely used are provided with a magnetic stripe on a plastic card so that information recorded on the magnetic stripe can be read. Such a magnetic recording method has disadvantages that information can be easily read by a third party and the amount of recordable information is small. So in recent years,
An IC card equipped with an IC chip having functions such as a memory and a CPU has been developed and is reaching a practical stage. Above all, as a non-contact type IC card that transmits and receives signals in a non-contact manner, an electromagnetic wave generated by an interrogator (reader / writer) generates an induced voltage in an antenna coil of a transponder (non-contact type IC card) to serve as a power supply Attention is being paid to those that use and communicate data. As a configuration of such a non-contact type IC card, as shown in FIG. 2 (a), a circuit pattern 2 including an antenna coil is formed on the surface of a plastic film substrate 1 as shown in FIG. As shown in FIGS. 2 (b) and 2 (c), a jumper circuit 6 for connecting the inner and outer patterns of the antenna coil through through holes 7 is formed on the back side thereof. Via the conductive adhesive layer 3
An IC card in which an IC chip 4 is directly connected in a face-down manner, a cover film 8 in which holes 9 are provided in advance on electronic components at the surface thereof is bonded with an adhesive 11, and a skin material 10 is further laminated on both surfaces thereof. Proposed by the present applicant.
【０００３】[0003]
【発明が解決しようとする課題】しかし、前記のよう
な、アンテナコイルの内周側と外周側のパターンをスル
ーホール７を介して接続する従来のジャンパー回路６に
よる接続では、電気部品が実装されていない面にジャン
パー回路６を形成するので、ＩＣカードの両面に凹凸が
発生しやすく、これを解消するには、上記のようにさら
に表皮材１０を貼らねばならず、基板の厚みが増し、ま
た、ＩＣカードを製造する上で、歩留まりを低下させる
おそれがあった。However, in the connection by the conventional jumper circuit 6 for connecting the inner and outer patterns of the antenna coil through the through holes 7 as described above, electric components are mounted. Since the jumper circuit 6 is formed on the surface that is not present, irregularities are likely to be generated on both sides of the IC card. To solve this, the skin material 10 must be further attached as described above, and the thickness of the substrate increases. In addition, there is a possibility that the yield may be reduced in manufacturing an IC card.
【０００４】本発明は、薄型化に優れ、かつ歩留まりに
優れたＩＣカードを提供することを目的とする。[0004] It is an object of the present invention to provide an IC card which is excellent in thinning and excellent in yield.
【０００５】[0005]
【課題を解決するための手段】本発明のＩＣカードは、
プラスチックフィルム基材上にアンテナコイルを含む回
路パターンが形成され、電気部品の箇所と、接続を行う
回路パターンの複数の端子部の箇所に穴を設けたカバー
フィルムと、電気部品と回路パターンを接続する異方性
導電接着剤層と、回路パターンの複数の端子部を接続を
するジャンパーパターンとを有することを特徴とする。The IC card according to the present invention comprises:
A circuit pattern including an antenna coil is formed on a plastic film substrate, and a cover film is provided with holes at multiple terminal portions of the circuit pattern to be connected to the electrical component, and the electrical component and the circuit pattern are connected. And a jumper pattern for connecting a plurality of terminals of the circuit pattern.
【０００６】ジャンパーパターンには、導電性ペースト
をカバーフィルムの上から直接に印刷したものを用いる
ことが好ましく、カバーフィルムの上に形成した金属箔
と、端子部の箇所の穴に印刷された導電性ペースト印刷
物からなるものでもよい。As the jumper pattern, a conductive paste directly printed on the cover film is preferably used. A metal foil formed on the cover film and a conductive paste printed on a hole at a terminal portion are preferably used. It may be composed of a printed material of a conductive paste.
【０００７】[0007]
【発明の実施の形態】本発明のプラスチックフィルム基
材としては、異方性導電接着剤層を介してＩＣチップを
実装する点から、耐熱性のある材料が好ましく、例え
ば、ポリエチレンナフタレート、ポリカーボネート、ポ
リスチレン、ガラス繊維含浸エポキシ、ポリイミド等が
好適に用いられる。BEST MODE FOR CARRYING OUT THE INVENTION The plastic film substrate of the present invention is preferably a heat-resistant material from the viewpoint of mounting an IC chip via an anisotropic conductive adhesive layer, for example, polyethylene naphthalate and polycarbonate. , Polystyrene, glass fiber impregnated epoxy, polyimide and the like are preferably used.
【０００８】プラスチックフィルム基材に形成されるア
ンテナ回路を含む回路パターンとしては、銅、アルミ箔
等が、予め上記プラスチックフィルム基材にラミネート
された金属箔張フィルムの不要な箇所をエッチング除去
して形成したものや、上記プラスチックフィルム基材の
表面に直接、銀、銅等の導電性ペーストを印刷して形成
したものが用いられる。As a circuit pattern including an antenna circuit formed on a plastic film substrate, copper, aluminum foil, or the like is obtained by etching unnecessary portions of a metal foil-clad film previously laminated on the plastic film substrate. What was formed and what was formed by printing the conductive paste of silver, copper, etc. directly on the surface of the said plastic film base material are used.
【０００９】異方性導電接着剤層には、エポキシ樹脂等
のバインダーにニッケル、金、銀、銅等の金属粉あるい
はポリマの核体の表面に、導電処理を行ったポリマ導電
粒子が添加されたフィルム状のものが用いられる。To the anisotropic conductive adhesive layer, a binder such as an epoxy resin or the like is added with metal powder such as nickel, gold, silver, copper or the like, or polymer conductive particles obtained by conducting a conductive treatment on the surface of a polymer core. A film-shaped material is used.
【００１０】さらに、絶縁フィルムとしては、耐熱性の
ある材料が好ましく、例えば、ポリエチレンナフタレー
ト、ポリカーボネート、ポリスチレン、ガラス繊維含浸
エポキシ、ポリイミド等が好適に用いられる。Further, as the insulating film, a material having heat resistance is preferable, and for example, polyethylene naphthalate, polycarbonate, polystyrene, glass fiber impregnated epoxy, polyimide and the like are suitably used.
【００１１】[0011]
【実施例】このＩＣカードは、図１（ａ）に示すよう
に、片面に、アンテナコイルとＩＣチップ搭載用の回路
パターン２を導電性ペーストのシルク印刷によって形成
したプラスチックフィルム基材１に、図１（ｂ）および
（ｃ）に示すように、回路パターン２に異方性導電接着
剤層３により、ＩＣチップ４を接続し、ＩＣチップ４の
外形に相当する穴９をあけ、アンテナコイルの内周側と
外周側のパターンを接続するジャンパー回路６を形成し
たカバーフィルム８を接着剤１１で貼り合わせ、ＩＣチ
ップ４がカバーフィルム８の穴９に収まるように搭載し
た。ここで、プラスチックフィルム基材１には、厚さが
１８８μｍで白色のポリエチレンテレフタレートフィル
ムを用い、導電性ペーストには銀ペーストを用い、ＩＣ
チップ４には、厚さが３５０μｍで外形が２ｍｍ×３ｍ
ｍのチップを用い、回路パターン２と接続するための接
続端子には、高さ１５μｍの金めっきを行った接続用の
バンプ５を形成した。異方性導電接着剤層３には、平均
粒径が１０μｍの導電粒子を有する膜厚３５μｍの異方
性導電シートを使用した。カバーフィルム８には、ジャ
ンパー回路６を接続するための接続穴１２をあけ、回路
の接続には、カバーフィルム８を貼り合わせた上から、
導電性ペーストをシルクスクリーン印刷法で形成するこ
とによりジャンパー回路６を形成した。さらに、カバー
フィルム８の表面に、表皮材１０を、接着剤１１によっ
て貼り合わせた。DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in FIG. 1 (a), this IC card has a circuit pattern 2 for mounting an antenna coil and an IC chip on one side of a plastic film base material 1 formed by silk-printing a conductive paste. As shown in FIGS. 1B and 1C, an IC chip 4 is connected to the circuit pattern 2 by an anisotropic conductive adhesive layer 3, and a hole 9 corresponding to the outer shape of the IC chip 4 is formed. A cover film 8 on which a jumper circuit 6 for connecting the inner and outer peripheral side patterns is formed is adhered with an adhesive 11 and mounted so that the IC chip 4 fits into the hole 9 of the cover film 8. Here, a white polyethylene terephthalate film having a thickness of 188 μm is used for the plastic film substrate 1, a silver paste is used for the conductive paste, and an IC is used.
The chip 4 has a thickness of 350 μm and an outer shape of 2 mm × 3 m
A connection bump for connection with the circuit pattern 2 was formed with a 15 μm-high gold-plated connection bump 5 using an m-type chip. As the anisotropic conductive adhesive layer 3, a 35 μm-thick anisotropic conductive sheet having conductive particles having an average particle size of 10 μm was used. A connection hole 12 for connecting the jumper circuit 6 is formed in the cover film 8.
The jumper circuit 6 was formed by forming a conductive paste by a silk screen printing method. Further, a skin material 10 was bonded to the surface of the cover film 8 with an adhesive 11.
【００１２】[0012]
【発明の効果】以上に説明したとおり、本発明によっ
て、薄型化に優れ、かつ歩留まりに優れたＩＣカードを
提供することができる。As described above, according to the present invention, it is possible to provide an IC card which is excellent in thickness reduction and excellent in yield.
【図１】（ａ）は本発明の一実施例を示す平面図であ
り、（ｂ）は（ａ）のＡＡ部断面図であり、（ｃ）は
（ｂ）のＢ部拡大断面図である。1A is a plan view showing an embodiment of the present invention, FIG. 1B is a cross-sectional view of an AA part of FIG. 1A, and FIG. 1C is an enlarged cross-sectional view of a B part of FIG. is there.
【図２】（ａ）は従来例を示すＩＣカードの平面図であ
り、（ｂ）は（ａ）のＡＡ部断面図であり、（ｃ）は
（ｂ）のＢ部拡大断面図である。2A is a plan view of an IC card showing a conventional example, FIG. 2B is a sectional view of an AA part of FIG. 2A, and FIG. 2C is an enlarged sectional view of a B part of FIG. .
１．プラスチックフィルム基材 ２．回路パ
ターン ３．異方性導電接着剤層 ４．ＩＣチ
ップ ５．バンプ ６．ジャン
パー回路 ７．スルーホール ８．カバー
フィルム ９．穴 １０．表皮
材 １１．接着剤 １２．接続
穴1. 1. Plastic film base Circuit pattern 3. 3. Anisotropic conductive adhesive layer IC chip 5. Bump 6. 6. Jumper circuit 7. Through hole 8. cover film Hole 10. Skin material 11. Adhesive 12. Connection hole
Claims (3)
イルを含む回路パターンが形成され、電気部品の箇所
と、接続を行う回路パターンの複数の端子部の箇所に穴
を設けたカバーフィルムと、電気部品と回路パターンを
接続する異方性導電接着剤層と、回路パターンの複数の
端子部を接続をするジャンパーパターンとを有すること
を特徴とするＩＣカード。1. A cover film in which a circuit pattern including an antenna coil is formed on a plastic film base material, and a cover film having holes at a plurality of terminal portions of a circuit pattern to be connected; An IC card, comprising: an anisotropic conductive adhesive layer for connecting a circuit pattern to a terminal; and a jumper pattern for connecting a plurality of terminals of the circuit pattern.
カバーフィルムの上から直接に印刷したものであること
を特徴とする請求項１に記載のＩＣカード。2. The IC card according to claim 1, wherein the jumper pattern is formed by printing a conductive paste directly on the cover film.
上に形成した金属箔と、端子部の箇所の穴に印刷された
導電性ペースト印刷物からなることを特徴とする請求項
１に記載のＩＣカード。3. The IC card according to claim 1, wherein the jumper pattern comprises a metal foil formed on the cover film, and a printed conductive paste printed in a hole at a terminal portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5629098A JPH11259615A (en) | 1998-03-09 | 1998-03-09 | Ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5629098A JPH11259615A (en) | 1998-03-09 | 1998-03-09 | Ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11259615A true JPH11259615A (en) | 1999-09-24 |
Family
ID=13022978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5629098A Pending JPH11259615A (en) | 1998-03-09 | 1998-03-09 | Ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11259615A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001351082A (en) * | 2000-06-08 | 2001-12-21 | Dainippon Printing Co Ltd | Noncontact ic chip, noncontact ic module, and noncontact ic information processing medium |
| EP1262932A1 (en) * | 2001-05-31 | 2002-12-04 | LINTEC Corporation | Flat coil component, characteristic adjusting method of flat coil component, id tag, and characteristic adjusting method of id tag |
| JP2006172425A (en) * | 2004-11-18 | 2006-06-29 | Toppan Forms Co Ltd | Holding body of circuit for communication |
| JP2006209733A (en) * | 2004-12-28 | 2006-08-10 | Toppan Forms Co Ltd | Communication circuit holder |
| JP2006209732A (en) * | 2004-12-28 | 2006-08-10 | Toppan Forms Co Ltd | Communication circuit holder |
-
1998
- 1998-03-09 JP JP5629098A patent/JPH11259615A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001351082A (en) * | 2000-06-08 | 2001-12-21 | Dainippon Printing Co Ltd | Noncontact ic chip, noncontact ic module, and noncontact ic information processing medium |
| JP4620836B2 (en) * | 2000-06-08 | 2011-01-26 | 大日本印刷株式会社 | Wafer manufacturing method |
| EP1262932A1 (en) * | 2001-05-31 | 2002-12-04 | LINTEC Corporation | Flat coil component, characteristic adjusting method of flat coil component, id tag, and characteristic adjusting method of id tag |
| US6853286B2 (en) | 2001-05-31 | 2005-02-08 | Lintec Corporation | Flat coil component, characteristic adjusting method of flat coil component, ID tag, and characteristic adjusting method of ID tag |
| KR100860448B1 (en) * | 2001-05-31 | 2008-09-25 | 린텍 가부시키가이샤 | Flat coil component, characteristic adjusting method of flat coil component, id tag, and characteristic adjusting method of id tag |
| JP2006172425A (en) * | 2004-11-18 | 2006-06-29 | Toppan Forms Co Ltd | Holding body of circuit for communication |
| JP2006209733A (en) * | 2004-12-28 | 2006-08-10 | Toppan Forms Co Ltd | Communication circuit holder |
| JP2006209732A (en) * | 2004-12-28 | 2006-08-10 | Toppan Forms Co Ltd | Communication circuit holder |
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