JPH11328341A - Hybrid ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To maintain the practical operation states of both a contact and a noncontact type transmission mechanism by characterizing the hybrid IC module by that the module has functions applicable to both the systems of a contact type having an external terminal and a noncontact type having a noncontact coupling element and a coil constituting a transformer coupling circuit is provided between the IC module and an antenna element. SOLUTION: The IC module 2, is equipped with an IC chip 6 which has both a contact type transmitting function and a noncontact type transmitting function, a module substrate 9 provided with an external terminal as a contact type transmitting element, and a 1st coupling coil 8 as a part of a noncontact transmitting mechanism. The antenna element for noncontact transmission is equipped with an antenna or coil 4 and a 2nd coupling coil 3 connected thereto and so provided that the 1st coupling coil 8 and 2nd coupling coil 3 can be coupled closely with each other. The IC module 2 and antenna element are coupled electrically in a noncontact state. This 2nd coupling coil 3 is formed by winding a conductor coated with an insulating film.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an IC card,
See Office Automation (OfficeAutomati
on, so-called OA), factory automation (Factory Automation, so-called FA), or an IC card that is frequently used in the field of a system that requires security. An IC card having both functions of a contact type which performs the contact via a contact and a non-contact type which performs the contact in a non-contact state by an electromagnetic coupling method without the use of an electric contact unlike the contact type. In the specification, this is simply referred to as a composite IC card.)

[0002]

2. Description of the Related Art With the advent of an IC card having a built-in semiconductor memory or the like, the storage capacity has been dramatically increased as compared with a conventional magnetic card or the like. By itself having an arithmetic processing function, it has become possible to impart high security to an information medium.

An IC card is an ISO (International Orga)
In general, IC cards have a built-in IC such as a semiconductor memory in a card body made of plastic or the like, and are connected to an external read / write device on the surface of the card. Is provided with a metal conductive terminal, and the IC card is inserted into a card slot of the external read / write device for data communication between the IC card and the external read / write device. This is advantageous in applications requiring certainty and security of communication such as mass data exchange and settlement business, for example, credit and electronic wallet applications.

On the other hand, in application to gate management such as entry and exit, authentication is the main communication content, and the amount of communication data is often small, so simpler processing is desired. A technology devised to solve this problem is a contactless IC card. This is a DC power source that provides a space for vibration energy such as high-frequency electromagnetic fields, ultrasonic waves, and light in space, absorbs and rectifies the energy, and drives an electronic circuit built in the card. The frequency of the component is used as it is or is multiplied or divided to obtain an identification signal, and the identification signal is transmitted to an information processing circuit of a semiconductor element through a coupler such as a coil or a capacitor. still,
In the present specification, the “antenna coil” generally refers to a so-called antenna, a coil, or a coil-shaped antenna.

[0005] In particular, most non-contact IC cards for the purpose of authentication and simple counting data processing include a battery and a CPU (Cent
ral Processing Unit (Central Processing Unit) wireless authentication of hard logic without so-called “Radio Frequency”
IDentification; in this specification, this is simply referred to as RF-ID.
Call. With the advent of this non-contact IC card, the security against forgery and tampering is higher than that of a magnetic card, and at the time of passing through the gate, the card carrier approaches the antenna part of the read / write device attached to the gate device. Alternatively, the user simply has to touch the card carried by the user to the antenna portion of the read / write device, and the complexity of taking out the card from the case and inserting the card into the slot of the read / write device has been reduced.

In recent years, a composite card having a contact-type function having an external terminal and a non-contact-type function of exchanging data by wireless communication has been developed for the purpose of supporting a versatile application with one card. Type IC cards have been devised. It combines the advantages of both high security of contact type CPU processing and convenience of non-contact type CPU processing.

Generally, a complex IC card is mounted as follows. An antenna coil of a metal foil for non-contact transmission formed by etching is sandwiched between a sheet and a base material in which a fitting hole of an IC module is opened, and laminated to produce a card body. At this time, two antenna terminals for connection between the antenna coil and the IC module are exposed inside the fitting hole of the card body.
On one surface of the IC module, a metal terminal electrode for connection to an external device is formed. IC on the other side
Are mounted, and terminals for connection to the antenna are provided. A conductive adhesive is applied to these terminals. After the IC module is installed in the fitting hole of the card body so that the terminal of the IC module having the conductive adhesive applied to the terminal and the antenna terminal of the card are overlapped, heat and pressure are applied to the terminal of the IC module. And the antenna terminal are combined, and the mounting is completed.

Although such a mounting method is relatively simple,
It is difficult to check the state of the connection between the IC module and the antenna, and the connection reliability becomes a problem. In addition, the mechanical stress tends to cause deterioration of the connection portion.
Furthermore, since a conductive adhesive application step and a thermocompression bonding step are required to connect the IC module and the antenna,
It is difficult to use a conventional IC card manufacturing apparatus with external terminals, and a new manufacturing line must be installed.

In addition, many IC cards provided with a non-contact type transmission mechanism cannot be embossed or used in combination with a magnetic stripe due to restrictions on a coil shape or the like in order to secure received power. In order to sufficiently respond to market demands, correspondence to embossing and magnetic stripes must be considered, so that those without embossing and magnetic stripes are restricted in their application range. Among the non-contact type IC cards, a conventional technology corresponding to embossing and a magnetic stripe is disclosed in, for example, Japanese Patent Application Laid-Open No. 8-22747. That is, in order to make the non-contact IC card a card having an outer shape conforming to the ISO7811 standard, and to provide a magnetic stripe and an embossed record on the card, the communication IC module has an IC in an area outside the magnetic stripe area and the embossed area. The mounting part, the power receiving coil, and the data transmitting / receiving coil are formed in a line in the longitudinal direction.

The receiving coil and the communication coil of the communication IC module are composed of a single-layer coil formed by an electroforming method, both of which are embedded in one strip substrate, and at the same time, each of the coils is connected to a pad of an IC chip. A part is formed. An IC chip is mounted on the strip substrate such that the circuit surface of the IC chip faces the strip substrate, and the lead portion is bump-bonded to a pad of the IC.
The voids between the chips are filled with potting resin and fixed. The inner end of the coil and the end of the inner end lead are jumpered by enameled copper wire, the connection is made by instantaneous thermal pressure welding, and the terminal is protected by potting resin.

The method of integrating the communication IC module with the card includes a first sheet covering the upper surface, a second sheet having a rectangular outer shape and having the same thickness as the strip substrate, an escape window for the IC chip and the first sheet. The third sheet with the jumper joint escape window, the fourth sheet with only the IC chip escape window, and the fifth sheet covering the lower surface are made of vinyl chloride, and the communication module is sandwiched between the sheets and communication is performed by heating and pressing. It describes an integrated module with a built-in module. However, there is a disadvantage that the above-mentioned one cannot be applied to a composite IC card with an external terminal.

The positions of the terminals of the card with external terminals are also defined by ISO7816. FIG. 6 shows the ISO
Magnetic stripe area, embossed area,
Then, the external terminal area is shown. In the composite IC card, the IC module is mounted in the external terminal area. In FIG. 6, the part that has been painted is an area where mounting of a non-contact transmission antenna or coil is prohibited. The long side of the external shape defined by ISO7816 is 85.47 to 85.7.
In a region of 2 mm and the short side of 53.29 to 54.03 mm, the magnetic stripe region was 15.82 mm from the upper side,
In addition, the emboss area is 24 mm from the lower side, and 19.
87 mm, and the external terminals are 9.32 mm in length and 9.62 mm in width with 28.55 mm from the upper side to the lower right corner.

[0013] As a conventional technology that enables the magnetic stripe and emboss of a composite IC card, for example, Japanese Patent Laid-Open No.
There is one disclosed in JP-A-239922. According to this, an IC module for an IC card, wherein the IC module is a transmission mechanism for transmitting information and / or energy between an IC chip and an external device electrically connected to the IC chip. And a support for supporting the IC chip and the transmission mechanism, wherein the transmission mechanism includes a non-contact transmission mechanism including a coil or an antenna and a plurality of patterned conductors provided on the surface of the support. And a contact-type transmission mechanism composed of terminal electrodes of the type described above, and a function capable of supporting both the contact type and the non-contact type is modularized, and this IC module is fitted and fixed to the plastic card base. It does not hinder the formation of magnetic stripes or embossing.

Further, an antenna or a coil for non-contact transmission is provided so as to surround the periphery of the terminal electrode, or conversely, the antenna is set at the center and the terminal electrode is provided around the antenna. That is, by storing the antenna or coil for non-contact transmission in the IC module, the connection between the antenna or coil and the IC module in the final step is unnecessary.

However, it is clear that the method of providing an antenna or a coil around the terminal electrode is difficult to realize in view of the standard shown in FIG. Since the maximum distance between the terminal electrode and the embossed region is only 1.45 mm, it is practical to arrange the antenna or coil so as not to overlap the terminal electrode and the same surface so as to surround the terminal electrode for the following reasons. Not a target. That is, when an antenna or a coil is arranged around an external terminal, the maximum outer diameter and the minimum inner diameter of the antenna or the coil are φ12 mm and φ9.3 mm, respectively. When the distance is 0.15 mm and 0.1 mm, respectively, the number of turns and the inductance are approximately 0.4 μH for four turns and 1.0 μH for six turns. (Here, μ
H means so-called microhenry. )

Therefore, when the antenna or the coil is arranged on the outer peripheral portion of the terminal electrode while the embossed area is secured, even if the antenna or the coil is formed by the print pattern, only a few turns are taken, which is sufficient. Inductance cannot be formed. Therefore, there is generally a method of securing power using a resonance capacitor. But,
Depending on the frequency used for power transmission, a decrease in inductance means an increase in the capacity of the capacitor used,
This makes it difficult to mount in a limited area. Even if the inductance required for resonance can be formed, sufficient power cannot be received due to the small area of the antenna or coil, and only tight coupling with a communication distance of several millimeters or less is allowed.

In this case, the effect of adding the non-contact transmission function is small. The effect of adding a non-contact transmission mechanism to a contact-type transmission mechanism can be obtained with a communication distance of several tens of millimeters to more than 100 millimeters.In this area, communication is achieved by "holding" the card over the antenna of the external read / write device. Achievable. To do so, it is necessary to form a sufficient number of turns or increase the antenna or coil area. However, if the number of turns is practical, the embossed area will be applied. In the latter arrangement in which the terminal electrodes are provided around the antenna or the coil, the intrusion into the embossed area is obvious, and the arrangement largely deviates from ISO7816, which is a standard of an IC card with external terminals, and is accepted by the market. Unlikely.

[0018]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and there is no need to connect an IC module to an antenna coil for non-contact transmission. , A composite IC that has a receiving sensitivity that can provide a sufficient communication distance, can support embossing and magnetic stripe formation, and can maintain both contact-type and non-contact-type transmission mechanisms in a practical operating state The task is to provide a card.

[0019]

Means provided by the present invention for solving the above-mentioned problems include, as described in claim 1, a composite having both functions of a contact type and a non-contact type. The composite IC card has an IC module and an antenna element for non-contact transmission having no connection with a conductor between the IC module and the IC module.
The module includes an IC chip having both a contact-type transmission function and a non-contact-type transmission function, a module substrate provided with an external terminal that is a contact-type transmission element, and a module forming a part of a non-contact transmission mechanism. An antenna element for receiving power or transmitting / receiving a signal to / from an external reading device, and a second antenna connected to the antenna or coil by a conductor.
Wherein the first coupling coil and the second coupling coil are disposed so as to be tightly coupled to each other.
The C module and the antenna element are configured to be electrically coupled in a non-contact state by a transformer coupling, and the second coupling coil is formed by winding a conductive wire provided with an insulating film. The second coupling coil and the first coupling coil are nested with each other;
Is a composite IC card characterized by the following.

Here, by forming the second coupling coil as a conducting wire coated with an insulating film, the occupation for insulation between the conductors forming the coil can be reduced as compared with the case where the second coupling coil is formed by a printed pattern. The area can be reduced. Therefore, since the second coupling coil can be arranged in a narrow area, it is very preferable for embossing.

More preferably, as described in claim 2, the composite IC card according to claim 1 has a basic configuration, and in particular, the second coupling coil is substantially the same as the first coupling coil. It is characterized by being in a plane.

According to this, the second coupling coil of the antenna element for non-contact transmission and the IC module are nested in substantially the same plane because the first coupling coil and the second coupling coil It is intended to improve the degree of coupling between the two coils, and is preferable in that the distance between both coils can be reduced, and the coupling coefficient can be increased.

Preferably, as set forth in claim 3, the basic structure of the composite IC card according to claim 1 is a basic configuration. In particular, the composite IC card has an embossed area, and the IC module is one of the cards. The embossed area is provided substantially at the center of the short side, the embossed area is provided along one long side of the card, and the inner contour of the second coupling coil connected to the non-contact transmitting antenna element is The outer diameter of the fitting hole of the IC module is larger than
A first coupling coil disposed on the module is formed on the back side of the module substrate, and a second coupling coil connected to an antenna or a coil of the non-contact transmission antenna element does not interfere with the embossed area. The antenna or coil of the non-contact transmitting antenna element is provided so as not to interfere with either the external terminal area of the IC module or the embossed area.

This configuration is suitable when the number of turns of the antenna or the coil is relatively large.

Preferably, as set forth in claim 4,
The basic structure of the composite IC card according to any one of claims 1 to 3, wherein an antenna or a coil of the non-contact transmitting antenna element is provided on a side opposite to a long side provided with the embossed region. The IC card is provided in an area surrounded by a long side, a boundary inside the card in the embossed area, an internal boundary of the IC module, and a short side opposite to the short side provided with the IC module. Features.

This configuration is particularly useful when the number of turns of the antenna or coil is about several.

Preferably, as set forth in claim 5,
The composite IC card according to any one of claims 1 to 3, wherein the antenna or the coil of the non-contact transmission antenna element includes an embossed region, an external terminal region of the IC module, A composite IC card is provided between the edge of the card and the outer periphery of the card.

Preferably, as set forth in claim 6,
3. A composite IC card having a basic configuration of the composite IC card according to claim 1 and having both a magnetic stripe area and an embossed area, wherein the IC module has one short side of the card. The embossed area is provided along one long side of the card, and the magnetic stripe area is provided along the other long side of the card, and the antenna element for non-contact transmission is provided. The inside contour of the second coupling coil connected to the antenna or the coil is larger than the outside contour of the fitting hole of the IC module, and the first coupling coil disposed on the IC module is located on the back side of the module substrate. A second coupling coil connected to an antenna or a coil of the non-contact transmitting antenna element includes the embossed region and the magnetic stripe. And the antenna or coil of the non-contact transmitting antenna element does not interfere with any of the external terminal area of the IC module, the embossed area, and the magnetic stripe area. It is characterized by being provided as follows.

According to this, similarly to the above-described configuration having no magnetic stripe region, an optimum composite IC card can be realized by selecting the arrangement of the antenna or the coil according to the number of turns required by the antenna or the coil. I do.

More preferably, as set forth in claim 7, the composite IC according to any one of claims 1, 2, and 6
The card has a basic configuration. In particular, an antenna or a coil of the non-contact transmission antenna element is provided along the outer periphery of the embossed area and the external terminal area of the IC module, avoiding the magnetic stripe area. A composite IC card characterized in that:

Preferably, as set forth in claim 8,
7. The composite IC card according to claim 1, wherein said antenna or coil of a non-contact transmitting antenna element is provided between a boundary inside said card in said embossed area and said IC. The IC card is provided in a region surrounded by a boundary inside the card of the module, a boundary inside the magnetic stripe region, and a short side opposite to the short side provided with the IC module. It is a composite IC card.

More preferably, as set forth in claim 9, the composite IC card according to any one of claims 1 to 8 has a basic configuration, and is particularly connected to an antenna or a coil of the non-contact transmission antenna element. A combined IC card, wherein the inside of the formed second coupling coil also serves as a fitting hole of the IC module.

Here, the fact that the inside of the second coupling coil of the antenna or coil of the non-contact transmitting antenna element also serves as the fitting hole of the IC module is the same as that of the conventional IC card with external terminals. The purpose is to use the module fitting hole processing equipment as it is, and it is the same as the shape of the IC module fitting hole of the conventional IC card with external terminals, and if the dimensions are the same or larger. Are particularly preferred.

[0034]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The basic structure and basic principle of a non-contact transmission mechanism according to the present invention will be described with reference to the drawings.

FIG. 7 is an equivalent circuit diagram of a non-contact coupling circuit for explaining the principle of the non-contact transmission mechanism of the present invention. In FIG. 7, a transmission / reception coil 102 which is an electromagnetic coupler for supplying power to the non-contact transmission mechanism of the complex IC card 1 and transmitting / receiving information is connected to the transmission / reception circuit 101 of the non-contact type external reading device 100. .

On the other hand, the non-contact transmission mechanism of the complex IC card 1 includes a coil 4 that is directly electromagnetically coupled to the transmission / reception antenna 102 of the external reading device 100 and participates in power reception and information transmission / reception. A capacitor 15 connected to form a parallel resonance circuit, a composite IC chip 6 mounted on the composite IC module 2, a first coupling coil 8 connected thereto, and a signal received by the first coupling coil 8 by the coil. Coupling coil 3 connected to both ends of the capacitor 15 of the parallel resonance circuit in order to transmit
Consists of At this time, the connection of the capacitor 15 is made in parallel, but it may be omitted by increasing the line capacitance of the coil 4 and the second coupling coil 3. Also,
Connecting in series between the coil 4 and the second coupling coil 3 is also included in the present invention.

Here, a description will be given of the coupling of each coil in the case where power and information are transmitted from the external read / write device 100 to the composite IC card 1. A high-frequency magnetic field is induced in the transmission / reception coil 102 by a high-frequency signal (not shown) generated by the transmission / reception circuit 101 of the external read / write device 100. This high frequency signal is radiated into space as magnetic energy.

At this time, when the composite IC card 1 is located in the high-frequency magnetic field, the parallel resonance formed by the coil 4 and the capacitor 15 of the composite IC card 1 is caused by the high-frequency magnetic field generated by the transmission / reception coil 102 of the external read / write device 100. Apply current to the circuit. At this time, the composite IC chip 6
A first coupling coil 8 directly connected to the
A current due to the high-frequency magnetic field is also induced in the second coupling coil 3 connected to the resonance circuit of the capacitor 15 and transmitting the power to the first coupling coil 8. Because it is smaller than an order of magnitude,
Depends on the characteristics of

The signal received by the resonance circuit of the coil 4 and the capacitor 15 is transmitted to the second coupling coil 3. Thereafter, the second coupling coil 3 and the first coupling coil 8 are arranged in a tightly coupled arrangement showing the maximum transmission efficiency and the second coupling coil 3 and the first coupling coil 8 in the first coupling coil 8.
The signal is transmitted to the composite IC chip 6 by the transformer coupling with the coupling coil 8. The second coupling coil 3 and the first
The maximum transmission efficiency of the transformer coupling with the coupling coil 8 is determined by the selection of the circuit constant. As described above, the improvement of the reception characteristics is achieved.

The second coupling coil 3 is arranged so as to be tightly coupled to the first coupling coil 8 built in the composite IC module 2 so as to surround the external terminal area 21 where the composite IC module 2 is disposed. Here, referring to FIG. 6, the narrowest distance between the embossed region and the external terminal region is directly below FIG. 6, and is below the external terminal region, and its value is 1.45 mm. Therefore, if the second coupling coil is arranged so as to surround the external terminal region shown in FIG. 6 with a pattern width and interval of about 0.1 mm, a coil having 7 turns can be arranged. It is also known that a coil can be formed with a pattern width and interval of about 0.05 mm by using a special manufacturing method. However, such substrates are also generally relatively expensive.

On the other hand, it is possible to form a coil with a conductive wire provided with an insulating film to a diameter of several tens of microns due to advances in magnetic head technology. Paying attention to the technology, the inventors have devised a means for forming a second coupling coil induced by an antenna or a coil of a non-contact transmission antenna element by a conductive wire provided with an insulating film.

By forming the second coupling coil by a conductive wire coated with an insulating film, the area occupied by the conductors forming the coil for insulation is reduced as compared with the case where the second coupling coil is formed by a printed pattern. Can be smaller. Therefore, the second coupling coil can be arranged in a narrow region between the external terminal region and the emboss region as described above, which is very preferable for embossing. Furthermore, an inexpensive base material can be used as a substrate on which an antenna or a coil is provided, and a card can be manufactured at low cost as a whole.

In addition, in the air-core transformer type coupling according to the present invention, a smaller gap between the coils leads to an improvement in transmission efficiency. In order to realize this, the inner diameter of the second coupling coil 3 is made larger than the fitting hole of the composite IC module 2 of the card board (not shown), and the first coupling coil 8 is surrounded by the second coupling coil 3. They were arranged in substantially the same plane. At this time, the inside of the second coupling coil 3 also serves as the fitting hole. In this way, compared to the case where the second coupling coil 3 is arranged below the fitting hole of the composite IC module 2, the accuracy of the depth of the fitting hole processing is not required, and the fitting of the IC card with external terminals is not required. The hole processing equipment can be used as it is.

[0044]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic configuration diagram of a composite IC card according to the present invention. The composite IC card 1 according to the present invention comprises:
The composite IC module 2 according to the present invention includes a card substrate 10 in which an antenna substrate 5 having a second coupling coil 3 and a coil 4 formed of a conductive wire having an insulating film formed on a surface of a sheet-like resin is resin-sealed. .

The composite IC module 2 includes a patterned terminal electrode 7 serving as a contact type transmission section, a composite IC chip 6 having a built-in contact type interface and a non-contact type interface (not shown), and a periphery of the composite IC chip 6, or The module substrate 9 includes a first coupling coil 8 which forms a part of a non-contact transmission mechanism formed by a conductive wire provided with an insulating film around the module substrate 9, and a module substrate 9. Complex I
The C chip 6 is mounted on the surface of the module substrate 9 opposite to the surface on which the terminal electrodes 7 are formed. The composite IC chip 6 and the terminal electrodes 7 of the module substrate 9 are connected by through holes. The composite IC chip 6 is connected to the circuit pattern formed on the module substrate 9 for connecting the terminal electrode 7 and the first coupling coil 8 by heat welding using solder, a conductive adhesive or the like. This connection can also be realized by wire bonding the circuit formation surface of the composite IC chip 6 and the module substrate 9.

After the composite IC chip 6 is mounted on the module substrate 9 and circuit-connected, the composite IC chip 6
As shown in (b), the resin is sealed 16 and then the composite IC
A first coupling coil 8 is formed by winding an insulating film conductor around the chip 6 or the module substrate 9, and thereafter,
Circuit pattern of module substrate 9 and first coupling coil 8
And the composite IC module 2 is completed.
FIG. 1B shows a case where the first coupling coil 8 is formed by winding a coil around the resin sealing 16 of the composite IC chip 6. As preparation for forming the first coupling coil 8, the periphery of the resin seal 16 of the composite IC module 2 manufactured up to the step of resin seal 16 is processed by a cutting means or the like so as to be easily wound. Thereafter, winding is directly performed around the resin sealing 16 of the composite IC module 2 by a winding machine (not shown). After the end of the predetermined number of turns, the insulating film of the connection terminal of the first coupling coil 8 (not shown) is removed, and the module is connected to a predetermined circuit pattern (not shown) of the module substrate 9.

At this time, the cutting of the resin sealing 16 can be omitted by performing resin sealing by using a mold or the like so as to facilitate winding when applying the resin sealing 16. Further, instead of directly winding the winding around the composite IC chip 6, a planar coil is manufactured in a separate process using a coil winding machine and is bonded to the module substrate 9 to form the first coupling coil 8, and thereafter, I
Resin sealing 16 may be used to cover C chip 6 and first coupling coil 8. In the present embodiment, the cross-sectional shape of the manufactured coil is a rectangle with rounded corners, but the shape may be circular.

Subsequently, the composite IC card 1 according to the present invention is manufactured as follows. First, FIG.
As shown in (b), a coil 4 is formed in a printed pattern on a resin substrate, and a film-shaped capacitor 15 and a second wire formed of a conductor provided with an insulating film manufactured in a separate process using a coil winding machine are formed. The second coupling coil 3 is bonded to a predetermined position, the coil 4, the capacitor 15, and the second coupling coil 3 are connected to a predetermined circuit pattern, and the antenna substrate 5 is prepared. As shown in FIG. 1B, the second
The coupling coil 3 is arranged outside the outer shape of the fitting hole 11 of the composite IC module 2 and is finally set to be located on substantially the same plane as the first coil 8 mounted on the composite IC module 2. You. Here, the coil 4 may also be formed by winding a conductive wire coated with insulation.

Although vinyl chloride was used as the resin for the antenna substrate 5, polycarbonate resin, PE
T, polyimide and the like can be applied, and the material is not fixed to one kind. The base material of the antenna substrate 5 has a thickness in the range of 50 to 300 μm. More preferably 100
It is about μm.

In this embodiment, the capacitor 15 is formed by bonding a film capacitor component to the antenna substrate 5. However, the capacitor may be formed by forming electrodes facing each other via the resin of the antenna substrate 5. Alternatively, a capacitor formed similarly using another resin may be bonded to the antenna substrate 5.

Next, the card substrate 10 is molded by enclosing the antenna substrate 5 by injection molding. During molding, the second coupling coil 3 is positioned and arranged so as to overlap the mounting position of the composite IC module 2. After manufacturing the card substrate 10 by injection molding, the fitting hole 1 of the composite IC module 2 is formed.
Form one. Finally, the composite IC module 1 is completed by bonding the composite IC module 2 to the fitting hole 11 of the composite IC module 2 of the card substrate 10. Card board 10
Although vinyl chloride was used as the material, any other material, such as polycarbonate, which can provide sufficient card characteristics can be applied to the present invention. In FIG. 1A,
Although the card substrate 10 is drawn separately on the front surface and the back surface,
1A is modified in order to clearly explain the relationship between the coupling coil and the fitting hole 11 in the antenna substrate 5 sealed in the card substrate.

In the present invention, the card is manufactured by injection molding. However, any method can be applied to the present invention as long as the method maintains the embossing characteristics. For example, a laminating method or an adhesive filling method can be used. Good. Further, the present invention includes that the fitting hole 11 of the IC module is simultaneously processed during card molding. In this case, the inside of the second coupling coil 3 formed on the antenna substrate 5 is hollowed out in advance for fitting the IC module.

<Embodiment 1> FIG. 2 is a plan view of a composite IC card 1 corresponding to embossing, showing a mounting position of a coil 4 inside the composite IC card 1, and arranging the coil 4 all around the card. The following shows the case. In the antenna substrate 5 in this embodiment, a portion of the resin sheet corresponding to the embossed region 20 is cut out. This aims at not affecting the embossing characteristics.

<Embodiment 2> FIG. 3 is a plan view of a composite IC card 1 corresponding to embossing. The schematic shape of the coil 4 in which the embossed area 20 and the external terminal area 21 are not arranged inside the coil 4 is shown. Show.

<Embodiment 3> FIG. 4 is a plan view of the composite IC card 1 corresponding to the magnetic stripe and the embossing method, and shows the mounting position of the coil 4 inside the composite IC card 1. Coil 4 is magnetic stripe area 2
2 shows the arrangement state along the outer periphery of the composite IC card 1 while the other parts do not overlap. Also in this embodiment, a portion of the resin sheet corresponding to the embossed area 20 is cut out from the antenna substrate 5.

<Embodiment 4> FIG. 5 is a plan view of a composite IC card corresponding to a magnetic stripe and embossing method.
The schematic shape of the coil 4 in which the embossed area 20, the external terminal area 21, and the magnetic stripe area 22 are not arranged inside the coil 4 is shown. 2 to 5, the outline of the antenna substrate 5 is indicated by a broken line.

[0058]

As is apparent from the above description, the composite IC module according to the present invention can be either a contact type having external terminals or a non-contact type having a non-contact coupling element such as an antenna or a coil. It has a function that can support the
By providing a coil constituting a transformer coupling circuit between the C module and the antenna element, power reception and signal transmission / reception are performed without electrically connecting the IC module and the antenna element.

Further, by forming the second coupling coil by a conductive wire coated with an insulating film, the occupation area for insulation between the conductors forming the second coupling coil can be reduced, and the external terminals can be reduced. Allowing the second coupling coil to be located in a narrow area between the area and the embossed area,
Further, an antenna or a coil directly and non-contact-coupled to an external reading / writing device is used as a contact type electrode in an external terminal area and at the same time, a fitting portion of an IC module and an embossed area,
Alternatively, they are arranged so as not to cover the magnetic stripe region, and have versatility that can be sufficiently applied to conventional card applications.

In addition, by forming the second coupling coil by a conductive wire coated with an insulating film, an antenna substrate can be realized without using an expensive substrate, and an inexpensive card can be manufactured.

In the composite IC card, the inner diameter of the second coupling coil of the non-contact transmitting antenna element is I
A first coupling coil arranged on the IC module is formed on the back surface of the module substrate so as to be larger than the outer shape of the fitting hole of the C module, and the first coupling coil and the second coupling coil are arranged on the back surface of the module substrate.
By arranging the coupling coils on the same plane, the gap can be reduced, so that the coupling coefficient can be increased.

As a result, the electromagnetic energy received by the antenna or coil is transformer-coupled with a high coupling coefficient and
It can now be transmitted to the C chip. This allows
The advantage of the non-contact transmission function is that the sensitivity characteristic of communication can be further improved by "holding" the card near the antenna of the external read / write device. Furthermore, the increase in the receiving sensitivity of the card can increase the communication distance and / or suppress the transmission output of the external read / write device. This is advantageous for the non-contact transmission function because the transmission output is regulated by the Radio Law.

In addition, the inside of the second coupling coil of the non-contact transmitting antenna element also serves as a fitting hole of the IC module. By doing so, compared to the case where the second coupling coil is arranged below the fitting hole of the composite IC module,
Depth accuracy of the fitting hole processing is no longer necessary, so that the conventional IC module fitting hole processing equipment of an IC card with external terminals can be used as it is, and the connection between the IC module and the antenna circuit built in the card substrate. Is unnecessary, and even if mechanical stress such as bending stress is applied to the card, the IC module and the antenna circuit do not have a connection point, so that the risk of failure due to breakage of a connection terminal or the like is extremely small.

Since the injection molding is used and the base material of the flexible antenna substrate does not exist in the area corresponding to the embossed area, the embossing property is not affected by the bonding of a plurality of sheets, and the card is not affected. A card having a thickness of 0.76 mm and sufficiently satisfying the ISO7816 standard can be obtained.

In summary, there is no need to connect the IC module to the antenna or coil for non-contact transmission, the reception sensitivity is sufficient to obtain a sufficient communication distance, and the contact can be performed with embossing and magnetic stripe formation. IC that can maintain practical operation state of both transmission type and non-contact type transmission mechanism
I was able to offer a card.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a composite IC card according to the present invention.

FIG. 2 is a plan view of the composite IC card corresponding to the emboss according to the first embodiment of the present invention.

FIG. 3 is a plan view of an embossed composite IC card according to a second embodiment of the present invention.

FIG. 4 is a plan view of a composite IC card corresponding to a magnetic stripe and emboss according to a third embodiment of the present invention.

FIG. 5 is a plan view of a composite IC card corresponding to a magnetic stripe and emboss according to a fourth embodiment of the present invention.

FIG. 6 is a magnetic stripe region defined by the ISO standard,
FIG. 3 is a diagram illustrating an embossed area and an external terminal area.

FIG. 7 is an equivalent circuit diagram of a non-contact coupling circuit for explaining the principle of the non-contact transmission mechanism of the present invention.

[Explanation of symbols]

1 ··· Compound IC card 2 ··· IC module 3 ···· Second coupling coil 4 ··· Coil (or antenna) 5 ···· Antenna substrate (in this specification, a coil is provided 6... Composite IC chip 7... Terminal electrode 8... First coupling coil 9... Module board 10... Card board 11 ... Mating hole 15 ... Capacitor 20 ... Emboss area 21 ... External terminal area 22 ... Magnetic stripe area 100 ... External read / write device 101 ... Transceiver circuit 102 ... Transceiver antenna

Claims (9)

[Claims] 1. A composite IC card having functions of both a contact type and a non-contact type, wherein the composite IC card has no conductor connection between the IC module and the IC module. An IC chip having both a contact-type transmission function and a non-contact-type transmission function; and a module having an external terminal that is a contact-type transmission element. A substrate, and a first coupling coil forming a part of a non-contact transmission mechanism, wherein the non-contact transmission antenna element is an antenna or a coil that performs power reception or signal transmission and reception with an external reading device. A second coupling coil connected to the antenna or coil by a conductor, wherein the first coupling coil and the second coupling coil are disposed so as to be tightly coupled to each other, and The antenna element is configured to be electrically coupled in a non-contact state by a transformer coupling. The second coupling coil is formed by winding a conductive wire provided with an insulating film, and Coupling coil and first
Wherein the coupling coils are nested with each other. 2. The composite IC card according to claim 1, wherein said second coupling coil is substantially in the same plane as said first coupling coil. 3. The card according to claim 2, wherein the IC module is provided substantially at the center on one short side of the card, and an embossed area is provided along one long side of the card in accordance with the IC card standard. Has an inner contour larger than an outer contour of a fitting hole into which the IC module is fitted, and the first coupling coil is formed on a side of the module substrate opposite to a side on which external terminals are provided; The second coupling coil is provided so as not to interfere with the embossed region, and the antenna or the coil of the non-contact transmitting antenna element is connected to either the external terminal region of the IC module or the embossed region. 3. The composite IC card according to claim 1, wherein the composite IC card is provided so as not to interfere. 4. The antenna or coil of the non-contact transmitting antenna element has a long side opposite to the long side provided with the embossed area, a boundary with the embossed area in a card plane, the IC module. Internal boundary of the IC and the IC
The composite IC card according to any one of claims 1 to 3, wherein the module is provided in a region surrounded by a short side opposite to the short side on which the module is provided. 5. An antenna or coil of the non-contact transmitting antenna element is provided along the outer periphery of the card between the embossed area, the external terminal area of the IC module, and an edge of the card. 2. The method according to claim 1, wherein
4. The composite IC card according to any one of claims 1 to 3. 6. A composite IC card having both a magnetic stripe area and an embossed area, wherein the IC module is provided substantially at the center on one short side of the card, and the embossed area is provided on one side of the card. The magnetic stripe region is provided along the other long side of the card, the magnetic stripe region is provided along the other long side of the card, and the inside of the second coupling coil connected to the antenna or coil of the non-contact transmitting antenna element The contour is larger than the outer contour of the fitting hole of the IC module;
A first coupling coil disposed on the C module is formed on the back side of the module substrate, and a second coupling coil connected to the antenna or coil of the non-contact transmission antenna element includes the emboss area and the second coupling coil. The antenna or the coil of the antenna element for non-contact transmission is provided so as not to interfere with any of the magnetic stripe regions. The composite I according to claim 1, wherein the composite I is provided so as not to interfere.
C card. 7. An antenna or a coil of the non-contact transmitting antenna element is provided along the outer periphery of the embossed region and the external terminal region of the IC module, avoiding the magnetic stripe region. Claim 1,
7. The composite IC card according to any one of items 2 and 6. 8. An antenna or a coil of an antenna element for non-contact transmission, wherein the antenna or the coil of the antenna element has a boundary inside the card in the embossed area;
The IC module is provided in a region surrounded by a boundary inside the card, a boundary inside the magnetic stripe region, and a short side opposite to the short side provided with the IC module. The composite IC card according to any one of claims 1, 2, and 6. 9. An integrated circuit according to claim 1, wherein said second coupling coil has an inner side.
9. The composite IC card according to claim 1, wherein the composite IC card also serves as a fitting hole of the module.