JP7428958B2 - IC-equipped media - Google Patents

Description

The present disclosure relates to an IC- mounted medium, and more particularly, to an IC- mounted medium including a contact/non-contact dual interface IC card.

The use of IC-equipped media such as IC cards, which have both contact and non-contact communication functions, is expanding. Such IC cards have dual interfaces for both contact and non-contact communication, and can be used as cash cards to connect to bank ATMs and perform transactions such as withdrawals and deposits. It is possible to make payments using a credit card, and by connecting to a store terminal through contactless communication, it is possible to make payments using electronic money loaded on an IC card. Dual-interface IC cards are particularly capable of reading and writing data stored within the same IC chip within the IC card, using both contactless and contact communications, and are capable of reading and writing data stored within the same IC chip within the IC card. It is highly convenient as it can be used for both communications. Such an IC card usually has an external connection terminal for contact communication arranged in a predetermined area on the card surface, and an antenna coil for non-contact communication built inside the card. Here, both the external connection terminal and the antenna coil need to be electrically coupled to the IC chip, regardless of whether or not a conductive wire or the like is physically connected thereto.

The IC chip is manufactured as an IC module mounted on a module base having external connection terminals formed on its surface, and is mounted in a mounting recess formed around the external connection terminal mounting area of the IC card to form an IC card. This is normal. Here, in the IC module, the external connection terminals and the connection terminals of the IC chip are usually physically connected by wiring in a pattern formed by etching a metal film, solidifying a conductive paste, or the like. On the other hand, the antenna coil also needs to be electrically coupled to the same IC chip, but the method that has been widely used in the past is to form the antenna coil with a pattern of conductive paste on the IC card base in the planar direction of the IC card. In this method, vias (holes) are formed in the vertical direction of the IC card and filled with a conductive material to form wiring and physically connect to the IC chip. However, forming vias requires a time-consuming process, and there are problems with workability. Therefore, for electrical connection between the antenna coil and the IC chip, electrical connection by electromagnetic induction, etc., which does not require the formation of vias for physical connection, has come to be used. In the method using electromagnetic induction, an electromagnetic coupling coil connected to the IC chip is formed on the IC module equipped with the IC chip, and an electromagnetic coupling coil connected to the antenna coil is also formed in the mounting recess of the IC card base. By forming these electromagnetic coupling coils to face each other and coupling them by electromagnetic induction, the IC chip and the antenna coil are electrically coupled (Patent Document 1). In such prior art, the diameter of the electromagnetic coupling coil formed on the IC card substrate side is usually larger than the diameter of the electromagnetic coupling coil formed on the IC module side. That is, the electromagnetic coupling coil on the IC card base side is usually arranged in an area slightly outside the external connection terminal mounting area 133. This is mainly to make the electromagnetic coupling between the two electromagnetic coupling coils tighter. For example, in Patent Document 1, the second coupling coil 3 on the card base side is arranged outside the first coupling coil 8 on the IC module side.

On the other hand, the external connection terminal mounting area where the external connection terminals of the IC card are placed is determined by ISO standards, and the IC card identification number (in the case of a credit card, the card number) is printed by embossing etc. The identification number area is also defined by the ISO standard. FIG. 7 shows an IC card viewed from the front, with the surface on which the identification number is printed and the external connection terminals are arranged, in accordance with an example of the standard. Note that the back side of it is called the back side. Moreover, when arranged as shown in FIG. 7, the upward direction in the figure is called the upper side, and the downward direction is called the lower side. FIG. 7 shows the arrangement of the external connection terminal mounting area 133 and the identification number area 131 of the IC loading medium 100 according to the embodiment of the present invention, which is an example of a typical dual interface IC card, as viewed from the surface. There is. The external connection terminal is formed within the external connection terminal mounting area 133. In order to arrange the external connection terminals in this way, typically, a mounting recess for mounting the IC module on the IC card base is provided in an area including the external connection terminal mounting area 133, and the mounting recess is placed in the mounting recess. Attach an IC module with external connection terminals arranged on its surface. The external connection terminals typically have 6 or 8 terminals. FIG. 8 shows the arrangement of external connection terminals in a typical external connection terminal mounting area of an IC card. There, an example of the arrangement position of the external connection terminal 113 defined in the standard is shown. In this way, external connection terminals indicated by symbols C1 to C8 are formed in the external connection terminal mounting area 133. Note that at least a terminal electrode must be formed at the location of the external connection terminal 113 in FIG. It is often designed to extend to. Returning to FIG. 7, an identification number area 131 is defined immediately below and almost adjacent to the external connection terminal mounting area 133, and an identification number of the IC card or the like is printed here by embossing or the like. Further, an additional information area 132 is also defined below the identification number area 131 in which other information can be printed. When printing other information by embossing, the identification number of the IC card is printed in the identification number area 131 as the first line, and other information is printed in the additional information area 132 as the second and subsequent lines.

Japanese Patent Application Publication No. 11-328341

Here, the external connection terminal mounting area 133 and the identification number area 131 are almost adjacent to each other. As described above, in the conventional technology, the electromagnetic coupling coil on the IC card base side is usually provided in a region including the outside of the external connection terminal mounting region 133. In this case, the electromagnetic coupling coil on the IC card base side often invades the identification number area 131. If embossing is performed in such a state, part of the wiring from the electromagnetic coupling coil may be sheared by the embossing and electrically disconnected. As described above, according to the conventional arrangement of the electromagnetic coupling coil on the IC card substrate side, there is a problem in the processability of the IC card. It is possible to reduce the possibility of such disconnection by etching the wiring pattern of the electromagnetic coupling coil on the IC card base side to make it wider, but depending on the degree of embossing, the possibility of disconnection may increase. The possibility cannot be excluded. Furthermore, if the wiring pattern is formed to be wide, the area of the wiring portion becomes large, making it difficult to increase the number of turns of the coil. In particular, compared to the case where a coil is formed by physically winding a conducting wire, it is not possible to increase the density of the coil, and it is also difficult to obtain good electrical characteristics.

The present invention has been made in view of the above problems, and has the following features. That is, the present invention provides an IC mounting medium having an IC module for contact communication and non-contact communication, and a medium base in which the IC module is mounted in a mounting recess. The second coil, which is connected to the antenna coil in the medium base and is formed to face the first coil, is entirely disposed inside the outer peripheral part of the first coil connected to the medium base.

The present invention has a configuration in which a second coil connected to the antenna coil and electromagnetically coupled with the first coil is formed inside the outer circumference of the first coil connected to the IC module when viewed from the vertical direction.・In IC- mounted media such as non-contact dual interface IC cards, the area where the identification number is printed by embossing etc. can be printed up to the edge of the IC module where external connection terminals are placed without causing disconnection. It has the effect of being able to expand. With such a configuration, the present invention has the effect that it is possible to relax the layout constraints of the antenna coil in the IC-mounted medium connected to the contactless communication device, and it is possible to design the antenna coil more flexibly. . The present invention also has the effect of increasing mass production tolerance during mass production of IC-mounted media and improving mass production stability. According to the present invention, a winding of a conducting wire can be used for the second coil, so that the second coil can be made denser to efficiently generate a magnetic field, and the electromagnetic coupling between the first coil and the second coil can be made more efficient. can be kept high.

1 is a schematic plan view of an IC-mounted medium 100. FIG. 2 is a schematic plan view of an IC module 110 included in an IC-mounted medium 100. FIG. FIG. 2 is a schematic plan view of a medium substrate 120 included in an IC-mounted medium 100. FIG. FIG. 2 is a schematic cross-sectional view of the vicinity of an IC module 110 of a conventional IC-mounted medium 100p. 2 is a schematic cross-sectional view of the vicinity of an IC module 110 of an IC-mounted medium 100 according to an embodiment of the present invention, and is a cross-sectional view taken along the line A-A' in FIG. 1. FIG. 1 is a schematic cross-sectional view of an IC-mounted medium 100 according to an embodiment of the present invention, and is a view of the main part of a cross section taken along the line B-B' in FIG. 1. FIG. 2 is a diagram showing a typical arrangement of an identification number area 131, an additional information area 132, and an external connection terminal mounting area 133 of an IC card. FIG. 3 is a diagram showing the arrangement of external connection terminals 113 in a typical external connection terminal mounting area 133 of an IC card. FIG. 3 is a schematic wiring diagram of a media substrate 120. FIG. 2 is a circuit diagram of an IC-mounted medium 100. FIG.

The structure of an IC-mounted medium 100 according to an embodiment of the present invention will now be described with reference to the drawings. First, the components included in the IC-mounted medium 100 will be explained. The IC-mounted medium 100 in this embodiment is in the form of an IC card, which is a typical form. FIG. 1 shows a schematic plan view of an IC-mounted medium 100. FIG. 1 shows the IC loading medium 100 viewed from the surface, and the solid line shows the medium base 120 that defines the outer shape of the IC card and the IC module 110 installed in the mounting recess of the medium base 120. . In FIG. 1, a structure (first coil 114, antenna coil 122, parallel conductor capacitor 124, which will be described later) that is sealed inside and cannot be seen from the surface when viewed in a vertical direction from the surface of the IC mounting medium 100 is shown. is shown with a broken line. Further, a second coil 123, which will be described later, is disposed on the back side of the first coil 114, so its description is omitted. In FIG. 1, the identification number area 131 and the additional information area 132 are indicated by dashed lines.

FIG. 2 shows a schematic plan view of the IC module 110. FIG. 2 shows the IC module 110 viewed from the back side. In FIG. 2, components that are not visible when viewed from the back side of the IC module 110 (external connection terminals 113, bumps 113a) are indicated by broken lines. The IC module 110 includes an IC chip 112, an external connection terminal 113 formed on the surface of the module base 111 and connected to the IC chip 112 for contact communication, and an area including the vicinity of the edge of the module base 111. It includes a first coil 114 connected to the IC chip 112 for non-contact communication.

FIG. 3 shows a schematic plan view of the media substrate 120 viewed from the surface. In FIG. 3, components that are not visible from the surface of the medium substrate 120 (antenna coil 122, second coil 123, parallel conductor capacitor 124) are indicated by broken lines. The medium base 120 includes a planar base 121, an antenna coil 122 wound around the outside of the IC module 110 when viewed from a vertical direction perpendicular to the plane of the IC mounting medium 100, and a first antenna coil 122 connected to the antenna coil 122. A second coil 123 formed opposite to the coil 114 is provided. Further, although not necessarily essential, a parallel conductor capacitor 124 is formed on the base 121, and is connected in series with the antenna coil 122 and the second coil 123. A parallel conductor capacitor 124 is one in which two covered conductors are placed along each other (in close contact) by a predetermined distance without physically coupling their conductor parts. With this configuration, the conductor portions of these two conductive wires are opposed to each other with an insulating coating in between, and a capacitance is formed there. Here, the wiring extending from the lower right position of the second coil 123 to the parallel conductor capacitor 124 passes through an area adjacent to the upper side of the identification number area 131 shown in FIG. It is placed in a position where it will not be affected by the

Next, a detailed explanation of each component of the IC mounting medium 100 will be given with reference to cross-sectional views as appropriate in addition to a plan view. Referring to FIG. 1, a schematic configuration of an IC-mounted medium 100 is shown. The IC loading medium 100 is mainly composed of an IC module 110 and a medium base 120. The medium base 120 is typically a card-shaped medium such as an IC card, and has a mounting recess into which the IC module 110 is mounted. When the IC module 110 is mounted in the mounting recess and adhered, it becomes flush with the surface of the IC mounting medium 100, and together constitute the surface of the IC card on which the external connection terminals 113 are formed.

FIG. 5 shows the configuration of a cross section perpendicular to the surface of the IC mounting medium 100 in the vicinity of the IC module 110 located on the A-A' cross section in FIG. Note that the scale of each component is not necessarily accurate. The module base 111 is typically a rectangular plate-like structure made of resin or the like, and defines the basic structure of the IC module 110. External connection terminals 113 are formed on the front surface of module base 111 by etching or the like, and first coil 114 and IC chip 112 are arranged and fixed on the back surface (lower side in FIG. 5) to form IC module 110. The IC module 110 is a module in which an IC chip 112 is integrally formed with an external connection terminal 113 connected thereto. In order to manufacture an IC card, it is common to manufacture a medium base having a mounting recess for mounting the IC module, and to mount and adhere the IC module to the medium base.

The IC chip 112 has interface circuits for both contact and non-contact communication, and has a CPU for executing functions such as reading and writing data in response to external commands through these interfaces. It is an integrated circuit that includes a memory that stores programs for realizing functions, a nonvolatile memory that stores data, etc. In this example, as shown in FIG. 2, the IC chip 112 is provided with contact communication contacts connected through bumps 113a in order to connect to the six external connection terminals 113. In the case of contact communication, the IC chip 112 receives operating power and a command from an electrical signal sent from the outside through the external connection terminal 113, and returns an electrical signal containing data of a processing result based on the command. In the case of non-contact communication, the IC chip 112 receives operating power and a command from a high frequency signal received from the outside through the antenna coil 122, and returns data as a result of processing based on the command as a reflected wave.

The external connection terminal 113 is an electrode for connecting the IC card to a reader/writer for contact communication, and typically, according to the standard, six or eight electrodes are placed at predetermined positions within the external connection terminal mounting area. They are distributed and arranged. The external connection terminals 113 shown by broken lines in FIG. 2 viewed from the back are formed by etching or the like on the surface of the module base 111, and are connected to the external connection terminal wiring 113b through vias provided in the module base 111. It is connected. Referring to FIG. 5, the external connection terminal wiring 113b is connected to contact communication contacts on the surface of the IC chip 112 via bumps 113a. In FIG. 2, only the external connection terminal wiring 113b and the bump 113a connected to the upper left external connection terminal 113 are labeled with lead lines, but the other external connection terminals 113 are similarly connected. There are external connection terminal wiring 113b and bumps 113a. The external connection terminal 113 and the external connection terminal wiring 113b can be electrically bonded together using a conductive paste or the like instead of being connected by the bumps 113a.

The first coil 114 is a coil that faces the second coil 123 in the medium base 120 and performs electromagnetic induction coupling when the IC module 110 is mounted in the mounting recess of the medium base 120, and both ends thereof are connected to the IC. It is connected to each of two antenna contacts for non-contact communication on the back side of the chip 112. In order to increase the coil cross-sectional area, the first coil 114 extends over a region including the vicinity of the edge of the IC module 110, preferably from a predetermined position on the outside of the IC chip 112 to the edge of the IC module 110. It is formed. The first coil 114 can be formed by physically winding a conducting wire, but it can be formed by a simple process by etching. For example, one inner end of the first coil 114 is connected to an antenna contact for contactless communication of the IC chip 112 via a bump 114a. In FIG. 2, the wiring connecting the other outer end of the first coil 114 and the other antenna contact of the IC chip 112 is not shown, but they can be connected using any wiring. For example, the contact communication contact on the surface of the IC chip 112 connected to the middle external connection terminal 113 on the right side in FIG. It is possible to connect both ends of the first coil 114 to the IC chip 112 by connecting the other outer end of the first coil 114 to the other end of the first coil 114 with appropriate wiring. Although the number of turns of the first coil 114 is 6 turns in FIG. 2, it can be any number of turns, for example, about 10 turns.

The IC chip 112 stores information such as cash cards and credit cards typically used in contact communication, and information such as electronic money typically used in non-contact communication, and executes processing related to the information. It is an integrated circuit chip that can perform functions such as cash card transactions, credit card payments, electronic money charging and payments, etc. by sending commands to it via communication. be. The IC chip 112 has an antenna contact that is an electrical contact with the antenna coil 122 for non-contact communication, and a contact communication contact for contact communication. There are typically two antenna contacts, and in this embodiment, they are electrically coupled to the antenna coil 122 through the second coil 123 and the first coil 114. In this embodiment, there are six contacts for contact communication, but one antenna contact and one contact for contact communication are common contacts.

Referring to FIG. 3, each of the components of media substrate 120 are shown. The base body 121 is typically formed of resin or the like and has a card-like structure, and defines the basic structure of the IC-mounted medium 100. Preferably, the base body 121 is composed of a plurality of layers, and the wiring of coils (antenna coil 122, second coil 123) and parallel conducting capacitor 124 can be accommodated therein. FIG. 6 schematically shows a cross section perpendicular to the surface of the main parts of the IC mounting medium 100 (excluding the external connection terminals 113, bumps 113a, and external connection terminal wiring 113b) located at the BB' cross section in FIG. The configuration is shown. Note that the scale of each component is not necessarily accurate. In the cross sections shown in FIGS. 5 and 6, it is shown that the base body 121 is composed of four layers, and between the two middle layers there are coils such as the antenna coil 122 and the second coil 123, etc. Circuit elements formed by wiring conductors, such as conductor capacitor 124, are sealed. The media base 120 can be composed of any number of layers depending on the manufacturing process, but the coils are formed inside the media base 120, and each layer of the media base 120 is integrated by heating and pressing. It is sealed by oxidation. Usually, after forming a card-like or sheet-like base, a mounting recess for mounting the IC module 110 is formed by cutting or the like.

The antenna coil 122 is a coil antenna for non-contact communication. The antenna coil 122 is an antenna for receiving high frequency waves from a reader/writer for non-contact communication, receiving operating power and commands therefrom, and further transmitting processing results as reflected waves. 1 and 3 show the shape of the antenna coil 122 when viewed from a direction perpendicular to the IC mounting medium 100. The antenna coil 122 is formed outside the IC module 110 or the first coil 114, but is preferably formed near the edge of the medium substrate 120 so that the cross-sectional area of the coil is wide. Although the number of turns of the antenna coil 122 is 1 to 2 turns in FIGS. 3 and 6, it can be any number of turns, for example, about 3 to 4 turns. The antenna coil 122 is preferably formed by winding a single conducting wire together with a second coil 123 and a parallel conducting capacitor 124, which will be described later.

See FIG. 3. The second coil 123 is connected in series to the antenna coil 122 in circuit terms, and in terms of planar arrangement, it is placed at a position opposite to the first coil 114 where it can be electromagnetically coupled, that is, the IC module 110 is mounted. It is formed directly below the mounting recess of the medium base 120. The second coil 123 faces the first coil 114 inside the IC module 110 when the IC module 110 is mounted in the mounting recess of the medium base 120. Further, the second coil 123 is entirely disposed inside the outer peripheral portion of the first coil 114 when viewed from the vertical direction of the IC mounting medium 100. Here, the outer circumferential portion of the first coil 114 is the outermost circumferential portion of the first coil 114 that is close to the outer circumference of the IC mounting medium 100, and is also a portion that defines the outer shape of the first coil 114. In this way, the entire first coil 114 exists inside the outer peripheral portion of the first coil 114. Note that the definition of the outer peripheral portion is the same for other coils such as the second coil 123. The relationship between the arrangement of the first coil 114 and the second coil 123 is such that, when viewed from the vertical direction of the IC mounting medium 100, the entire second coil 123 (or the outer circumference of the second coil 123) is the outer circumference of the first coil 114. It is something that fits inside the section. Preferably, the second coil 123 is wound as densely as possible inside the outer periphery of the first coil 114, but as far outside as possible, so that the second coil 123 has a large cross-sectional area. In this way, the electromagnetic coupling between the second coil 123 and the first coil 114 can be made tight. Furthermore, since the second coil 123 itself receives high frequency waves from the outside similarly to the antenna coil 122, the overall sensitivity of the antenna can be increased.

The cross section shown in FIG. 5 shows that the outer circumference of the second coil 123 is arranged inside the outer circumference of the first coil 114. That is, the entire second coil 123 is disposed inside the outer circumference of the first coil 114. Here, it is preferable that the second coil 123 is disposed inside the outer circumference of the first coil 114 by a predetermined distance or more when viewed in the vertical direction. The predetermined distance can be, for example, an actual value of 0.1 mm. If the distance is 0.1 mm or more, the second coil 123 will surely fit inside the outer circumference of the first coil 114, and if the distance is close to 0.1 mm, the magnetic field between the second coil 123 and the first coil 114 will be It can increase the physical bond. In this way, it is preferable that the second coil 123 be reliably arranged inside the outer circumference of the first coil 114 by actual measurement. In addition, in consideration of errors during manufacturing, the second coil 123 may be placed at least a predetermined distance more than 0.1 mm inward from the outer circumference of the first coil 114 when viewed from the vertical direction. good. In this case, the predetermined distance may be, for example, 0.5 mm. By setting such a value, it is possible to reliably fit the second coil 123 inside the outer circumference of the first coil 114 even when manufacturing errors are taken into account. In this way, by appropriately determining the measured value or design value of the distance so that the second coil 123 has a predetermined distance from the outer circumference of the first coil 114, in the plan view of FIG. The second coil 123 is reliably placed inside the first coil 114. This ensures that the second coil 123 does not enter the identification number area 131, and no disconnection occurs due to printing by embossing within the identification number area 131. Note that the outer periphery of the IC module 110 exists just outside the outer periphery of the first coil 114, and the area where the IC module 110 is mounted is usually outside the identification number area 131. The entire second coil 123 may be arranged inside the outer circumference.

FIG. 4 shows a cross section of a conventional IC-mounted medium 100p near the IC module 110. For the sake of explanation, the IC-mounted medium 100p is different from the IC-mounted medium 100 according to the present embodiment only in the configuration of the second coil 123p. In the IC mounting medium 100p, the second coil 123p is formed by etching, and the second coil 123p is formed in a region that extends to the outside of the first coil 114, and at least a part of the second coil 123p is formed. is arranged outside the first coil 114. That is, the outer circumferential portion of the second coil 123p is arranged outside the outer circumferential portion of the first coil 114. Such an arrangement is considered preferable from the viewpoint of efficient electromagnetic inductive coupling between the first coil 114 and the second coil 123p. However, since the second coil 123p extends to the outside of the mounting recess for mounting the IC module 110 of the IC mounting medium 100p (or to the outside of the first coil 114), the second coil 123p extends to the identification number area 131. , there is a possibility of wire breakage due to embossed printing. Such a problem is particularly likely to occur when the number of turns of the second coil 123p is increased to increase the density. In this embodiment, as shown in FIG. 5, the second coil 123 is arranged inside the outer circumference of the first coil 114, thereby eliminating the possibility of such a disconnection occurring. As described above, by arranging the second coil 123 with high density just inside the outer circumference of the first coil 114, the electromagnetic inductive coupling between the first coil 114 and the second coil 123 is also efficient. can be made into a target.

A parallel conductor capacitor 124 formed within the media substrate 120 is shown in FIG. Further, FIG. 9 schematically shows the wiring positions of the medium substrate 120 shown in FIG. 3. Here, the number of turns in the wiring is arbitrary. Parallel conductor capacitor 124 is preferably formed together with antenna coil 122 and second coil 123 by placing and fixing a single conductor in a wiring pattern. The conducting wire is typically a coated conducting wire such as an enameled wire or a formal wire with a diameter of about 100 μm. In order to form a circuit element by wiring conductive wires inside the medium substrate 120, typically, the conductive wires to be wired are pressed against the substrate 121 and moved along the wiring pattern while being fed out. Wiring is done by fixing the wire. The structure of the parallel conductor capacitor 124 and the like will be explained according to the wiring example of FIG. 9. First, wiring is started from the starting end S in FIG. 9, and the conductor is rotated counterclockwise about 1.5 times to create one pole of the parallel conductor capacitor 124. The conductor is then routed from the top left of the parallel conductor capacitor 124 to the left. Next, the antenna coil 122 is formed by wrapping the conductive wire counterclockwise from the left side of the base body 121 around the periphery for 1 to 1.5 turns. When the antenna coil 122 is disposed near the edge of the medium substrate 120 in this manner, the cross section of the antenna coil 122 can be increased, and its electrical characteristics can be improved. Next, on the left side of the base 121, the second coil 123 is formed by winding the conductive wire counterclockwise for 2 to 2.5 turns. Next, the conductive wire is routed from the lower right of the second coil 123 to the right. The conductive wire in this portion passes above the identification number area 131 in FIG. 1, and will not be disconnected by embossing. The conducting wire from the second coil 123 is made to follow the conducting wire of the parallel conducting capacitor 124 formed by the conducting wire from the starting end S, and is made to turn counterclockwise for 1 to 1.5 turns. is cut. The two conductive wires are parallel lines in the region of the wires wound along each other, and this portion is a portion that generates capacitance as a capacitor. In this way, the antenna coil 122, the second coil 123, and the parallel conducting wire capacitor 124 are formed by one conducting wire. The parallel conductor capacitor 124 is made of conductive wires facing each other at a predetermined distance to form parallel wires, such a structure forms a capacitor, and the conductive wires are coupled by the capacitance of the capacitor. Therefore, although the starting end S and the ending end G are not physically connected, a capacitive component is formed there, and they are electrically coupled. According to this structure, for example, when physically wiring conductors to create a closed circuit including coils, it is possible to make both ends of the conductors parallel lines without physically connecting them. Therefore, it is possible to form a capacitive component and to form a closed circuit by capacitively coupling both ends of the conducting wire to form an operable circuit. According to such a method, the time-consuming process of physically bonding the conductive wires becomes unnecessary, and the electrical characteristics can be improved by increasing the density of the coils and the parallel conductor capacitor 124 without deteriorating the workability. Can be done. Thereby, for example, the electromagnetic induction coupling between the second coil 123 and the first coil 114 can be made efficient. The parallel conductor capacitor 124 is formed into a coil shape and can itself receive high frequencies, so it also functions to increase the overall sensitivity of the antenna. Note that it is also possible to form the coils and the parallel conducting wire capacitor 124 by etching. Furthermore, if a capacitor is not essential in the circuit, a closed circuit may be formed by physically coupling both ends of the conductor forming the second coil 123 and the antenna coil 122 without forming the parallel conductor capacitor 124. It is possible.

FIG. 10 shows a circuit diagram of the IC-mounted medium 100. In terms of circuit, the parallel conducting capacitor 124 is formed to be further connected in series between the antenna coil 122 and the second coil 123 which are connected in series. They form an LC resonant circuit, and if they are made to resonate with the frequency of the high frequency waves being transmitted and received, high frequency signals can be efficiently transmitted and received with an external reader/writer for non-contact communication. The resonance frequency can be set to a desired value by adjusting the capacitance by adjusting the distance between the parallel wire portions of the parallel conductor capacitor 124, and by adjusting the inductance by adjusting the cross-sectional area and number of turns of the antenna coil 122 and the second coil 123. It can be designed to have a value. In FIG. 10, in the IC module 110, a first coil 114 is connected to two contacts for non-contact communication on the IC chip 112, and an external connection terminal 113 is connected to six contacts for contact communication on the IC chip 112. It is also shown that it is connected. Note that although one non-contact communication contact and one contact communication contact share a common contact, they do not necessarily have to share the same contact. In the medium substrate 120, an antenna coil 122, a second coil 123, and a parallel conductor capacitor 124 are connected in series, and the first coil 114 and the second coil 123 are electromagnetically coupled. With such a circuit configuration, regarding contactless communication, a high frequency signal from the antenna coil 122 that receives a high frequency from an external contactless communication reader/writer is sent to the IC chip 112 through the second coil 123 and the first coil 114. The IC chip 112 receives the power for operation and executes processing such as payment using electronic money based on the command contained therein. The IC chip 112 transmits the high-frequency signal resulting from the processing as a reflected wave to the antenna coil 122 via the reverse route, and receives the high-frequency signal by the contactless communication reader/writer, thereby creating a system connected to the contactless communication reader/writer. be transmitted to. Regarding contact communication, an electrical signal from a contact communication reader/writer is transmitted to the IC chip 112 through the external connection terminal 113, and based on the command contained therein, the IC chip 112 is used to process credit card payments, etc. Execute processing. The IC chip 112 transmits the result of the processing to the contact communication reader/writer through the external connection terminal 113 in the reverse path, and transmits the result to the system connected to the contact communication reader/writer. According to the configuration of the embodiment of the present invention, in particular, the second coil 123 is not disconnected due to printing of the IC card identification number by embossing, has high reliability, has a relaxed layout, and has a more relaxed layout. It is possible to design a flexible antenna coil, and it is possible to provide a dual interface IC-mounted medium for both contact and non-contact communication, which has high mass production stability.

The present invention can be suitably applied to an IC-mounted medium such as a dual-interface IC card that has both contact and non-contact communication functions.

100: IC-mounted medium 100p: IC-mounted medium (prior art)
110: IC module 111: Module base 112: IC chip 113: External connection terminal 113a: Bump 113b: External connection terminal wiring 114: First coil 114a: Bump 120: Medium base 121: Base 122: Antenna coil 123: Second Coil 123p: Second coil (prior art)
124: Parallel conductor capacitor 131: Identification number area 132: Additional information area 133: External connection terminal mounting area

Claims (2)

An IC mounting medium comprising an IC module for contact communication and non-contact communication, and a medium base in which the IC module is mounted in a mounting recess,
The IC module includes a planar module base, an IC chip, an external connection terminal formed on the surface of the module base and connected to the IC chip for the contact communication, and a peripheral portion of the module base. a first coil formed in a region including a first coil and connected to the IC chip for the contactless communication,
The medium base includes a planar base, an antenna coil formed on the outside of the IC module when viewed in a vertical direction perpendicular to the plane of the IC mounting medium, and connected to the antenna coil and facing the first coil. and a parallel conductor capacitor,
The entire second coil is arranged inside the outer peripheral part of the first coil when viewed from the vertical direction,
The second coil , the antenna coil , and the parallel conducting wire capacitor are formed by physically winding one conducting wire ,
The parallel conducting wire capacitor is constructed by winding and wiring a predetermined area between a starting end and a terminal end of the one conducting wire so as to face each other with an insulating coating in between;
An IC-equipped medium featuring: The IC-loaded medium according to claim 1 , wherein the IC-loaded medium is in the form of an IC card.

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