JP4872713B2 - Non-contact data carrier device - Google Patents

Non-contact data carrier device Download PDF

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Publication number
JP4872713B2
JP4872713B2 JP2007046949A JP2007046949A JP4872713B2 JP 4872713 B2 JP4872713 B2 JP 4872713B2 JP 2007046949 A JP2007046949 A JP 2007046949A JP 2007046949 A JP2007046949 A JP 2007046949A JP 4872713 B2 JP4872713 B2 JP 4872713B2
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antenna
pattern
non
data carrier
substrate
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JP2008211572A (en
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樋口  拓也
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大日本印刷株式会社
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The present invention relates to data held in a readable non-contact data carrier equipment in a non-contact, in particular, the main non-contact data carrier IC chip on a wiring board is mounted with an antenna pattern to the wiring layer It relates to the non-contact data carrier equipment having as a component.

  A non-contact type data carrier having a configuration in which an IC chip capable of storing data and a wiring board on which the IC chip is mounted is provided, and a wiring layer having an antenna pattern formed on the wiring board has been used in recent years. Used as a carrier. In such a configuration, the antenna pattern can be formed small by using a technique for miniaturizing the wiring pattern, and the overall size can be reduced.

  On the other hand, in applications where a longer communication distance is required, it is effective to make the antenna aperture larger, but in this case, it is also a great factor to enable manufacture at a lower cost. Therefore, a configuration in which the small non-contact data carrier is used as a main component and combined with a substrate having an antenna pattern with a large opening area (hereinafter also referred to as a booster antenna substrate) can be considered. The booster antenna board adopts a cheaper configuration according to the required function, and is combined with a small non-contact type data carrier that has been manufactured in large quantities and reduced in cost.

Patent Document 1 listed below discloses a “non-contact IC tag device” having a booster antenna substrate. The booster antenna substrate having this configuration has a large-diameter antenna coil for communication with the reader / writer side, and a small-diameter antenna coil for electromagnetic coupling with the IC-side antenna pattern. A small-diameter antenna coil can ensure good electromagnetic coupling with the antenna pattern on the IC side, but it is necessary to form a fine pattern on the booster antenna substrate, which increases the cost.
JP 2002-183690 A

The present invention Oite the retained data in a readable non-contact data carrier equipment in a non-contact, intended to provide a non-contact data carrier equipment to accommodate a longer communication distance with an inexpensive configuration And

In order to solve the above problems, a non-contact data carrier device according to the present invention includes an IC chip capable of storing data, and a wiring having the IC chip mounted thereon and an antenna pattern connected to the IC chip. A non-contact data carrier having a spiral shape in which the antenna pattern includes at least two linear portions parallel to each other in two directions substantially orthogonal to each other, and an outermost shape of the antenna pattern. A multi- turn single coil pattern having an insulating substrate on which a planar shape is larger and an antenna is patterned, and the antenna includes a plurality of linear patterns parallel to each other at least in two directions substantially orthogonal to each other comprising a booster antenna substrate is, and the wiring including the one of the linear portion of the antenna pattern Ri said insulating having an overlap with the region in the substrate and one and is substantially parallel to the name of one and the straight line patterns of straight line partial region including the one of the linear pattern of the antenna in the plate, the straight line of the antenna pattern A region in the wiring board including the other of the portions overlaps with a region of the insulating substrate including the other of the linear patterns of the antenna, and the other of the linear portions and the other of the linear patterns are substantially parallel to each other. Further, the non-contact data carrier is located in an overlapping position with respect to the booster antenna substrate, and includes a region in the insulating substrate including a pattern of corners in two directions substantially orthogonal to the linear pattern of the antenna. In a portion of the non-contact data carrier that overlaps the area of the wiring board including the antenna pattern. In the insulating substrate including the antenna of the booster antenna substrate, the corner pattern is a region in the wiring substrate including the antenna pattern of the corner in two directions substantially orthogonal to each other of the linear portion of the antenna pattern. It has a roundness equivalent to the antenna pattern at the corner in the portion overlapping the region .

  That is, this apparatus includes a non-contact type data carrier and a booster antenna substrate, and the non-contact type data carrier includes an IC chip for storing data and a wiring substrate including a wiring layer having an antenna pattern. ing. On the other hand, a booster antenna substrate having a planar shape larger than the wiring substrate includes an insulating substrate, and the antenna is patterned on the insulating substrate. Both the antenna pattern of the non-contact type data carrier and the antenna of the booster antenna board are provided with a plurality of linear patterns parallel to each other, the substrate areas including these are overlapped, and the plurality of linear patterns are substantially parallel to each other. Thus, the non-contact type data carrier and the booster antenna substrate are located. Here, the antenna of the booster antenna substrate is a single coil pattern of a plurality of turns.

  Therefore, the antenna on the booster antenna substrate does not require a particularly fine pattern and is inexpensive. That is, the antenna of the booster antenna substrate is a single coil pattern and can be formed in a large diameter for communication with the reader / writer side. Here, the electromagnetic coupling is favorably maintained by setting the position and shape of the antenna as predetermined as described above as the relationship with the position and shape of the antenna pattern of the non-contact data carrier. In order to perform this electromagnetic coupling, an antenna different from the antenna for securing the communication distance with the reader / writer side is not required.

According to the present invention, Oite the retained data to the non-contact data carrier equipment is readable in a non-contact, it corresponds to a longer communication distance with an inexpensive configuration.

As an embodiment of the present invention, the non-contact type data carrier is connected to the booster antenna so that the antenna pattern of the non-contact type data carrier does not protrude outside the outermost outer shape of the antenna of the booster antenna substrate. It can be said that it is located overlapping with the substrate. By comprising in this way, the planar magnitude | size as the whole non-contact-type data carrier apparatus can be made smaller.

  Here, the linear pattern of the antenna overlaps the region on the insulating substrate that includes a pattern of corners in two directions substantially orthogonal to each other, and the region on the insulating substrate includes the antenna pattern of the non-contact data carrier. The corner pattern in the non-conforming portion is a region in the insulating substrate including a pattern of corners in two directions substantially orthogonal to the linear pattern of the antenna, and includes the antenna pattern of the non-contact data carrier. It can be said that it has the same roundness as the pattern of the corners in the portion overlapping the region in the insulating substrate.

  In this way, since the corner patterns formed by the two-way linear patterns on the booster antenna substrate are all rounded, a pattern can be formed without wide and narrow intervals, and the occurrence of defects can be reduced.

  Further, as an embodiment, the linear portion of the antenna pattern of the non-contact type data carrier is provided with at least a “U” shape, and is positioned overlapping the non-contact type data carrier. The linear pattern of the booster antenna substrate is provided in a local `` U '' shape so as to overlap at least the `` U '' shape of the antenna pattern of the non-contact data carrier, It can be.

  In this way, the local “U” -shaped part of the antenna's linear pattern extends the distance facing the antenna pattern of the non-contact type data carrier, enabling closer electromagnetic coupling. It is. Therefore, it can contribute to further extending the communication distance.

  Here, the antenna of the booster antenna substrate has a continuous pattern of circulation from the outer periphery to the inner periphery, and all the patterns on the inner periphery side in the region where the outermost pattern changes direction is the continuous pattern of the periphery. Is a pattern that changes direction while maintaining substantially the same distance as the outermost peripheral pattern.

  In this way, the inner pattern changes direction along the outermost pattern that defines the antenna outer shape of the booster antenna board, so that the substantial aperture of the antenna is hardly reduced and the communication distance is reduced. There is little impact on securing.

  Here, in the pattern part where the antenna of the booster antenna substrate goes out from the end portion of the “U” shape, it is 90 degrees with respect to the direction to the end portion of the “U” shape. It is possible to go out in a direction of less than 180 degrees. With such an antenna pattern shape, the substantial aperture reduction of the antenna due to the provision of the “U” shape can be further reduced. Therefore, it is preferable for securing a communication distance.

  As an embodiment, the booster antenna substrate may include an alignment mark that guides a position where the non-contact data carrier should overlap. By providing such an alignment mark, it is possible to contribute to improvement of productivity and improvement of positional accuracy of assembly. The alignment mark may be provided on the surface opposite to the side where the antenna is provided. In this case, it is suitable for the configuration in which the non-contact type data carrier is positioned on the surface of the booster antenna substrate where the antenna is not patterned. If the non-contact type data carrier is placed on the surface where the antenna is not patterned, it can be positioned without being affected by the step due to the presence of the antenna. Therefore, a more preferable positional relationship between the non-contact data carrier and the booster antenna can be obtained in the vertical direction.

  Further, as an embodiment, the insulating substrate of the booster antenna substrate includes two lands that are patterned and face each other, and the antenna of the insulating substrate is connected to the two lands that face each other, and It may be discontinuous as a pattern through the two lands located opposite to each other, and may further include a conductive member mounted on the two lands located opposite to each other. By providing such two lands, this booster antenna substrate can be provided as a substrate for a product on which an IC is directly mounted.

  Further, as an embodiment, an adhesive resin layer provided between the non-contact type data carrier and the booster antenna substrate can be further provided. It is one aspect for fixing a non-contact type data carrier on a booster antenna substrate.

  Further, as an embodiment, the material of the insulating substrate of the booster antenna substrate is PET (polyethylene terephthalate), the material of the antenna patterned on the insulating substrate is aluminum, and the booster antenna substrate is An electrode pattern as a capacitor may be further provided on both surfaces so that a partial region of the insulating substrate is a dielectric, and the electrode pattern is electrically connected to the antenna. This is a specific example for reducing the cost of the booster antenna substrate. According to this, both the material and the components are inexpensive.

  Based on the above, embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view and a cross-sectional view schematically showing the configuration of a non-contact data carrier device according to an embodiment of the present invention. More specifically, the cross-sections at the A-Aa position, B-Ba position, and C-Ca position shown in the plan view shown in FIG. 1A are respectively shown in FIGS. 1B, 1C, and 1D. ). This non-contact type data carrier device has a booster antenna substrate including an antenna 12 patterned on an insulating substrate 11 and a small non-contact type data carrier 15 as a schematic configuration. Hereinafter, the small non-contact data carrier 15 is also referred to as a small tag.

  In addition to the antenna 12, the booster antenna substrate is provided with a capacitor 13 and a through conductive connection 14. The insulating substrate 11 of the booster antenna substrate is made of, for example, PET or polyimide having a thickness of several tens of μm (in addition, FR-4 or a glass epoxy substrate can also be used). The area is, for example, about half of the size of a general card, and by setting it to such a size, a sufficient opening area of the antenna 12 is taken to secure a sufficient communication distance with the reader / writer side.

  The antenna 12 is formed of a conductive material (for example, aluminum) so as to form a single coil pattern of a plurality of turns, and the outer periphery thereof is electrically connected to the back surface through the through conductive connection portion 14. The pattern on the back side is electrically connected to the capacitor electrode pattern 13b. The inner peripheral side of the antenna 12 is electrically connected to the capacitor electrode pattern 13a. The through conductive connection portion 14 is a conductive member having a filling structure that is provided through the insulating substrate 11 and electrically conducts between the patterns on both sides.

  The capacitor electrode pattern 13b and the capacitor electrode pattern 13a are opposed to each other with the insulating substrate 11 in between, and the capacitance of the capacitor 13 is set to a predetermined value due to the opposed area. As the dielectric of the capacitor 13, the insulating substrate 11 positioned between the capacitor electrode pattern 13b and the capacitor electrode pattern 13a is used as it is. The antenna 12 and the capacitor 13 constitute a resonance circuit, and the resonance frequency substantially matches the frequency used for communication with the reader / writer. Such a configuration using the insulating substrate 12, the antenna 13, the capacitor 14, and the through-conductive connecting portion 14 has an advantage that the number of elements is small and fine processing is not required, and the cost can be reduced even if these materials are considered.

  The antenna 12 has a shape having a plurality of linear patterns parallel to each other, and the small tag 15 is positioned so as to overlap a part of the linear pattern. Here, in order to fix the small tag 15 on the insulating substrate 11, an adhesive resin layer 16 (for example, a thermosetting epoxy resin) is provided therebetween. The position of the small tag 15 and the internal configuration thereof will be described again. In general, the linear portion of the antenna pattern provided in the small tag 15 is positioned so as to overlap the linear pattern of the antenna 12 in parallel. . With this positional relationship, reliable electromagnetic coupling between the antenna 12 and the antenna pattern in the small tag 15 is achieved. This electromagnetic coupling enables communication between the reader / writer and the small tag 15 via the booster antenna substrate.

  This non-contact type data carrier device is shown in an easy-to-understand structure, and the actual usage situation is such that a laminate material is laminated on both sides or finished in a card-like form. Thus, a form with increased protection can be considered.

  FIG. 2 is a plan view schematically showing the configuration of the non-contact data carrier 15 (small tag) shown in FIG. The small tag 15 has a size of, for example, about 5 mm square, and can be mass-produced in a small size and at a low cost by applying a recent pattern miniaturization technique or a fine vertical conductive technique as a wiring board. As shown in the figure, the small tag 15 has a wiring board 151, an antenna pattern 152, a data carrier IC chip 153, a bonding wire 154, and a mold resin 155.

  The data carrier IC chip 153 includes a communication circuit unit (not shown) and a memory unit (not shown) as main internal components. The communication circuit unit is connected to the antenna pattern 152 via the bonding wire 154, receives a data read command signal from the outside via the antenna pattern 152, and outputs the data stored in the memory unit in response thereto. Intermediary. The data carrier IC chip 153 is mounted substantially at the center of the wiring substrate 151 and is sealed with a mold resin 155 for protection from the outside air.

  The antenna pattern 152 has a spiral shape, and the outer peripheral end shown in the drawing is a longitudinal conductor land 152b. The land 152b is electrically connected to a vertical conductor located below the land 152b, and the vertical conductor is electrically connected to an outer peripheral end of an antenna pattern (not shown) provided on the back surface. ing. The back surface antenna pattern (not shown) is formed in a spiral shape in the same direction as the antenna pattern 152, and the inner peripheral end thereof is electrically connected to the vertical conductor land 152a via the vertical conductor. As described above, the antenna pattern 152 and the back surface antenna pattern form a round antenna pattern as viewed from the IC chip 153.

  In addition, a multilayer wiring board is employ | adopted as the wiring board 151, and such a round antenna pattern can also be comprised by connecting each antenna pattern provided in each wiring layer in series. By employing such a multilayer wiring board, the degree of electromagnetic coupling with the outside of the antenna pattern can be increased, which contributes to communication with increased reliability.

  The spiral antenna pattern 152 has at least linear portions parallel to each other. The positional relationship between the small tag 15 and the booster antenna substrate is set so that the linear portion of the antenna pattern 152 overlaps and is parallel to the linear pattern of the antenna 12 provided on the booster antenna substrate. Since the antenna pattern 152 has a spiral shape, the antenna pattern 152 inevitably has a portion in which the direction of the electromotive force induced is opposite to that of the linear portion. The small tag 15 is preferably positioned so as not to overlap the linear pattern of the antenna 12 on the booster antenna substrate. This is because such an overlap results in cancellation of electromagnetic induction from the antenna 12 to the antenna pattern 152 (or in the opposite direction).

  Further, as shown in FIG. 1, the small tag 15 is positioned with respect to the booster antenna substrate so that the antenna pattern 152 of the small tag 15 does not protrude outside the outermost outer shape of the antenna 12 of the booster antenna substrate. Is more preferable. This is because the planar size of the non-contact data carrier device as a whole can be further reduced.

  The small tag 15 is not limited to the one shown in FIG. For example, in addition to using the multilayer wiring board as described above, the mounting of the data carrier IC chip 153 is flip chip mounting, and the resin layer formed on the entire surface of the wiring board 151 instead of the mold resin 155 In other words, the data carrier IC chip 153 is embedded in the wiring substrate 151, the antenna pattern 152 is not a rectangular shape, but a polygon more than that, or a curved pattern is introduced into a part thereof. , Etc. can be employed as appropriate.

  Next, another embodiment of the present invention will be described with reference to FIG. FIG. 3 is a plan view schematically showing a configuration of a non-contact type data carrier device according to another embodiment of the present invention. In FIG. 3, the same components as those shown in the already described drawings are denoted by the same reference numerals, and the description thereof is omitted.

  In this embodiment, it is intended to increase the facing distance between the antenna pattern 152 of the booster antenna substrate and the antenna pattern 152 of the small tag 15 that generates electromagnetic coupling, thereby further extending the communication distance. Therefore, the linear portion of the antenna pattern 152 of the small tag 15 is provided at least in two directions substantially orthogonal to each other, and the linear pattern of the antenna 12 of the booster antenna substrate is provided at least in two directions substantially orthogonal to each other. These are arranged as follows using the form which is present.

  That is, as shown in the drawing, first, an area in the wiring substrate 151 including one of the linear portions of the antenna pattern 152 overlaps with an area in the insulating substrate 11 including one of the linear patterns of the antenna 12, and one of the linear portions is included. And the small tag 15 are positioned so as to overlap with the booster antenna substrate so that one of the linear patterns is substantially parallel to the one of the linear patterns. Further, the region of the wiring substrate 151 including the other of the straight portions of the antenna pattern 152 overlaps with the region of the insulating substrate 12 including the other of the linear patterns of the antenna 12, and the other of the straight portions and the other of the straight patterns. Are positioned so as to overlap the booster antenna substrate so that they are substantially parallel to each other.

  In other words, in the illustrated case, the two sides of the rectangular antenna pattern 152 in the small tag 15 overlap with the antenna 12 of the booster antenna substrate to receive electromagnetic induction. Due to such a positional relationship, the degree of electromagnetic coupling between patterns is nearly double that of the embodiment shown in FIG. Therefore, the communication distance is extended from the embodiment shown in FIG.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 4 is a plan view schematically showing the configuration of the booster antenna substrate according to the embodiment of the present invention. In FIG. 4, the same components as those shown in the already described drawings are denoted by the same reference numerals, and the description thereof is omitted. In FIG. 4, the small tag 15 is indicated by a virtual line.

  In this embodiment, the antenna 12a of the booster antenna substrate has a pattern in which roundness is further eliminated at the corner portion overlapping the small tag 15 as shown in the figure. For example, the roundness in this portion can be as round as the corner pattern of the antenna pattern 152 in the small tag 15. According to such an antenna 12a, the antenna 12a of the insulating substrate 11 and the antenna pattern 152 of the wiring substrate 151 have overlapping corner patterns, including their roundness, so that denser electromagnetic coupling can be obtained. . Therefore, it can contribute to further extending the communication distance.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 5 is a plan view schematically showing a configuration of a booster antenna substrate according to another embodiment of the present invention. In FIG. 5, the same components as those shown in the already described drawings are denoted by the same reference numerals, and the description thereof is omitted. In FIG. 5, the small tag 15 is indicated by a virtual line.

  In this embodiment, the antenna 12b of the booster antenna substrate has a pattern in which all roundness is eliminated in the corner portion including the corner portion overlapping the small tag 15 as shown in the figure. For example, the roundness in this portion can be as round as the corner pattern of the antenna pattern 152 in the small tag 15. In this way, since the corner patterns by the two-way linear patterns on the booster antenna substrate are all rounded, it is possible to form a pattern with no wide and narrow intervals, and to reduce the occurrence of defects during manufacturing. .

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 6 is a plan view schematically showing a configuration of a booster antenna substrate according to still another embodiment of the present invention. In FIG. 6, the same components as those shown in the already described drawings are denoted by the same reference numerals, and the description thereof is omitted. In FIG. 6, the small tag 15 is indicated by a virtual line.

  This embodiment is used on the assumption that the linear portion of the antenna pattern 152 of the small tag 15 is at least in the form of a “U” shape. Specifically, as illustrated, the linear pattern of the antenna 12c of the booster antenna substrate positioned so as to overlap the small tag 15 is locally overlapped with the “U” shape of the antenna pattern 152 of the small tag 15. It is provided in the shape of a typical “U”.

  According to this, since the local “U” -shaped portion of the linear pattern of the antenna 12 c extends the distance facing the antenna pattern 152 of the small tag 15, closer electromagnetic coupling is possible. is there. Therefore, it can contribute to further extending the communication distance.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 7 is a plan view schematically showing a configuration of a booster antenna substrate according to still another embodiment of the present invention. In FIG. 7, the same components as those shown in the already described drawings are denoted by the same reference numerals, and the description thereof is omitted. In FIG. 7, the small tag 15 is indicated by a virtual line.

  This embodiment is the same as that described in FIG. 6 in the portion of the “U” shape, but the antenna 12d of the booster antenna substrate has a continuous pattern of circulation from the outer periphery to the inner periphery, The circular continuous pattern is different in that the pattern on the inner peripheral side is a pattern in which the direction of the outermost peripheral pattern changes direction while maintaining almost the same distance as the outermost peripheral pattern. In the example shown in FIG. 6, not all of the patterns on the inner peripheral side maintain the same distance as the pattern on the outermost periphery at the position where the antenna 12 c is turned to the upper left.

  By configuring the antenna 12d in a pattern as shown in FIG. 7, the inner pattern changes direction along the outermost peripheral pattern that defines the outermost shape of the antenna 12d. The communication distance is not reduced without being narrowed.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 8 is a plan view schematically showing a configuration of a booster antenna substrate according to still another embodiment of the present invention. In FIG. 8, the same components as those shown in the already described figures are designated by the same reference numerals, and the description thereof is omitted. In FIG. 8, the small tag 15 is indicated by a virtual line.

  This embodiment is also the same as that described in FIG. 6 in the portion of the “U” shape, but the pattern portion where the antenna 12e of the booster antenna board goes out from the end portion of the “U” shape. However, it is different in that it goes out in the direction of more than 90 degrees and less than 180 degrees with respect to the direction to the end of the “U” shape.

  By configuring the antenna 12e in such a pattern, a substantial decrease in the aperture due to the provision of the “U” shape can be further reduced. Therefore, it is preferable for securing a communication distance.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 9 is a plan view schematically showing a configuration of a booster antenna substrate according to still another embodiment of the present invention. In FIG. 9, the same components as those shown in the already described drawings are denoted by the same reference numerals and description thereof is omitted. In FIG. 9, the small tag 15 is indicated by a virtual line.

  In this embodiment, an alignment mark 17 is provided on the insulating substrate 11 of the booster antenna substrate to guide the arrangement position of the small tag 15. The alignment mark 17 can be formed at the same time, for example, in an aluminum layer etching process for patterning the antenna 12b. By providing the alignment mark 17, it is possible to contribute to improvement of productivity and improvement of positional accuracy of assembly. For example, it can also be used during the assembly process using machine vision or when assembling visually.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 10 is a plan view and a cross-sectional view schematically showing the configuration of a non-contact data carrier device according to still another embodiment of the present invention. More specifically, FIG. 10B shows a cross section at the D-Da position shown in the plan view shown in FIG. In FIG. 10, the same components as those shown in the already described drawings are denoted by the same reference numerals, and the description thereof is omitted.

  In this embodiment, the small tag 15 is arranged on the surface of the insulating substrate 11 opposite to the surface on which the antenna 12 is formed. Note that alignment marks 17a and 17b for guiding the position of the small tag 15 are also provided on the opposite surface. If the small tag 15 is positioned on the opposite surface in this way, the small tag 15 can be positioned without being affected by a step due to the presence of the antenna 12 and being tilted. Therefore, it is possible to obtain a more preferable positional relationship in which variation between the small tag 15 and the booster antenna substrate is small in the vertical direction.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 11 is a plan view schematically showing a configuration of a non-contact type data carrier device according to still another embodiment of the present invention. In FIG. 11, the same components as those shown in the already described drawings are denoted by the same reference numerals, and the description thereof is omitted.

  In this embodiment, the insulating substrate 11 of the booster antenna substrate is provided with two lands 32a and 32b which are formed in a pattern and face each other, and the antenna 22 of the insulating substrate 11 is connected to the two lands 32a and 32b. Further, the antenna 22 of the insulating substrate 11 is discontinuous as a pattern via the two lands 32a and 32b, and a conductive dummy element 32 (conductive member) is mounted on the two lands 32a and 32b.

  In this embodiment, the antenna 22 is a copper pattern, for example. An appropriate plating layer may be disposed on the lands 32a and 32b, but at least the layer portion of the bare metal is, for example, copper. Similarly, the capacitor electrode patterns 23a and 23b constituting the capacitor 23 are also copper patterns, for example. Further, a through conductive connection portion 25 is provided in connection with the pattern on the back surface of the insulating substrate 11, and the front side pattern connected to the through conductive connection portion 25 is opposed to the inner peripheral side of the antenna 22 via the lands 33a and 33b. positioned. In this non-contact type data carrier device, nothing is mounted on the lands 33a and 33b.

  The form shown in FIG. 11 is electrically the same as the embodiment shown in FIG. Therefore, it has the same operation and effect as described in FIG. In addition, such a booster antenna substrate is provided with lands 32a, 32b, 33a, 33b, so that the data carrier IC chip is electrically mounted directly on the insulating substrate 11 (without using the small tag 15). Can be used as a substrate. That is, in such an application, a data carrier IC chip is mounted on the lands 32a and 32b instead of the conductive dummy element 32 (for example, flip mounting), and a conductive dummy element is mounted on the lands 33a and 33b. 23 is not allowed to function electrically. By making this booster antenna substrate usable in this way, common parts can be made between products, which can contribute to cost reduction.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 12 is a plan view schematically showing a configuration of a booster antenna substrate according to still another embodiment of the present invention. In FIG. 12, the same components as those shown in the already described drawings are denoted by the same reference numerals, and the description thereof is omitted. In FIG. 12, the small tag 15 is indicated by a virtual line.

  In this embodiment, as shown in FIG. 11 as the booster antenna substrate, the type in which the small tag 15 is mounted and the type in which the data carrier IC chip is directly mounted without mounting the small tag 15 are used. An antenna substrate that can be used. FIG. 12A illustrates the case of a product on which the small tag 15 is mounted, and FIG. 12B illustrates the case of a product on which the data carrier IC chip is directly mounted without mounting the small tag 15.

  It is the same as that of embodiment shown in FIG.6, FIG.7, FIG.8 that the antenna 42 has a local "U" -shaped part. Further, the outer peripheral end of the antenna 42 is electrically connected to the back surface through the through conductive connecting portion 44, and is further electrically connected to one terminal of the capacitor 43 by the pattern on the back surface side. Further, a through conductive connection 45 is provided in connection with the pattern on the back side of the insulating substrate 41, and the front pattern connected to the through conductive connection 45 is opposed to the inner peripheral side of the antenna 42 via the land. is doing.

  In the case of a product on which the small tag 15 is mounted, as shown in FIG. 12A, by mounting a conductive dummy element 32, the other terminal of the capacitor 43 is connected to the inner periphery of the antenna 42. . Thereby, the electrical connection relationship between the antenna 42 and the capacitor 43 is the same as that of the embodiment shown in FIG.

  On the other hand, in the case of a product in which the data carrier IC chip is directly mounted without mounting the small tag 15, as shown in FIG. 12 (b), the front side pattern connected to the through conductive connection portion 45 and the inner periphery of the antenna 42 A data carrier IC chip 52 is mounted (for example, flip mounted) between the two. As a result, the capacitor 43 does not function electrically, and the antenna 42 is connected between both terminals of the IC chip 52.

The top view and sectional view which show typically the composition of the non-contact type data carrier device concerning one embodiment of the present invention. The top view which shows typically the structure of the non-contact-type data carrier shown in FIG. The top view which shows typically the structure of the non-contact-type data carrier apparatus which concerns on another embodiment of this invention. The top view which shows typically the structure of the booster antenna board | substrate which concerns on one Embodiment of this invention. The top view which shows typically the structure of the booster antenna board | substrate which concerns on another embodiment of this invention. The top view which shows typically the structure of the booster antenna board | substrate which concerns on another embodiment of this invention. The top view which shows typically the structure of the booster antenna board | substrate which concerns on another embodiment of this invention. The top view which shows typically the structure of the booster antenna board | substrate which concerns on another embodiment of this invention. The top view which shows typically the structure of the booster antenna board | substrate which concerns on another embodiment of this invention. The top view and sectional view which show typically the composition of the non-contact type data carrier device concerning another embodiment of the present invention. The top view which shows typically the structure of the non-contact-type data carrier apparatus which concerns on another embodiment of this invention. The top view which shows typically the structure of the booster antenna board | substrate which concerns on another embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 ... Insulating board | substrate, 12, 12a, 12b, 12c, 12d, 12e ... Antenna, 13 ... Capacitor, 13a, 13b ... Capacitor electrode pattern, 14 ... Through-conductive connection part, 15 ... Non-contact-type data carrier (small tag), DESCRIPTION OF SYMBOLS 16 ... Adhesive resin layer, 17, 17a, 17b ... Alignment mark, 22 ... Antenna, 23 ... Capacitor, 23a, 23b ... Capacitor electrode pattern, 24 ... Through-conductive connection part, 25 ... Through-conductive connection part, 32 ... Conductive dummy element 32a, 32b ... land, 33a, 33b ... land, 41 ... insulating substrate, 42 ... antenna, 43 ... capacitor, 44 ... feed through connection, 45 ... feed through connection, 52 ... data carrier IC chip, 151 ... wiring Substrate, 152 ... antenna pattern, 152a, 152b ... vertical conductor land, 153 ... data Carrier IC chip, 154 ... bonding wire, 155 ... molding resin.

Claims (11)

  1. An IC chip capable of storing data; and a wiring board including the wiring layer having the antenna pattern mounted on the IC chip and connected to the IC chip, wherein the antenna pattern includes linear portions parallel to each other. A non-contact data carrier having a spiral shape provided at least in two directions substantially orthogonal to each other ;
    A plurality of windings each having a planar shape larger than the outermost shape of the antenna pattern and including an insulating substrate on which the antenna is patterned, wherein the antenna includes a plurality of linear patterns parallel to each other in at least two directions substantially orthogonal to each other. anda booster antenna substrate is a single coil pattern,
    One of a one and a straight line pattern of said have regions with overlapping in the insulating substrate and the linearly partial area in the wiring board includes one of said linear pattern of said antenna including one of the linear portion of the antenna pattern Ri but substantially parallel name, the other of said straight portion the insulating substrate region and having an overlap and the straight line portion area in the wiring board including the other of the linear pattern of the antenna including the other of said antenna pattern And the non-contact data carrier is positioned so as to overlap with the booster antenna substrate so that the other of the linear patterns is substantially parallel ,
    The region in the insulating substrate that includes the pattern of corners in two directions that are substantially orthogonal to each other of the linear pattern of the antenna, and the portion that overlaps the region in the wiring substrate that includes the antenna pattern of the non-contact data carrier A corner pattern is a region in the wiring board that includes the antenna pattern of the corners in two directions that are substantially orthogonal to each other of the linear portion of the antenna pattern, and a region in the insulating substrate that includes the antenna of the booster antenna substrate. A non-contact type data carrier device having roundness equivalent to the antenna pattern of the corner in the overlapping portion .
  2. The non-contact data carrier overlaps the booster antenna substrate so that the antenna pattern of the non-contact data carrier does not protrude outside the outermost shape of the antenna of the booster antenna substrate. and that non-contact data carrier device according to claim 1 Symbol mounting characterized.
  3. In a region of the insulating substrate that includes the pattern of corners in two directions substantially perpendicular to each other of the linear pattern of the antenna, and in a portion that does not overlap the region of the insulating substrate that includes the antenna pattern of the non-contact data carrier In the insulating substrate including the antenna pattern of the non-contact type data carrier, the corner pattern being a region in the insulating substrate including a pattern of corners in two directions substantially orthogonal to the linear pattern of the antenna. 2. The non-contact type data carrier device according to claim 1 , wherein the non-contact type data carrier device has a roundness equivalent to the corner pattern in a portion overlapping the region.
  4. The linear portion of the antenna pattern of the non-contact data carrier is provided at least in the shape of a “U”;
    The linear pattern of the booster antenna substrate positioned overlapping the non-contact type data carrier is at least locally overlapped with the “U” shape of the antenna pattern of the non-contact type data carrier. The non-contact type data carrier device according to claim 1, wherein the non-contact type data carrier device is provided in a “U” shape.
  5. The antenna of the booster antenna substrate has a continuous pattern of circulation from the outer periphery to the inner periphery, and all the patterns on the inner periphery side are the outermost pattern at the site where the outermost pattern changes direction. 5. The non-contact type data carrier device according to claim 4 , wherein the pattern changes direction while maintaining substantially the same distance as the outer peripheral pattern.
  6. In the pattern portion where the antenna of the booster antenna substrate goes out from the end portion of the “U” shape, more than 90 degrees and 180 degrees with respect to the direction to the end portion of the “U” shape 6. The non-contact type data carrier device according to claim 5 , wherein the non-contact type data carrier device goes out in a direction of less than.
  7.   2. The non-contact type data carrier device according to claim 1, wherein the booster antenna substrate has an alignment mark for guiding a position where the non-contact type data carrier should be overlapped.
  8. The insulating substrate of the booster antenna substrate includes two lands that are patterned and face each other,
    The antenna of the insulating substrate is connected to the two lands facing each other and is discontinuous as a pattern through the two lands facing each other.
    The non-contact type data carrier device according to claim 1, further comprising a conductive member mounted on the two lands facing each other.
  9. 8. The non-contact type data carrier device according to claim 7 , wherein the alignment mark is on a surface of the booster antenna substrate opposite to the surface of the insulating substrate on which the antenna is patterned.
  10.   2. The non-contact type data carrier device according to claim 1, further comprising an adhesive resin layer provided between the non-contact type data carrier and the booster antenna substrate.
  11. The material of the insulating substrate of the booster antenna substrate is PET,
    The material of the antenna patterned on the insulating substrate is aluminum,
    The booster antenna substrate further includes an electrode pattern as a capacitor on both sides so that a partial region of the insulating substrate is a dielectric, and the electrode pattern is electrically connected to the antenna. The non-contact type data carrier device according to claim 1.
JP2007046949A 2007-02-27 2007-02-27 Non-contact data carrier device Expired - Fee Related JP4872713B2 (en)

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