WO2015178127A1 - Rfid tag and communication device provided with same - Google Patents

Rfid tag and communication device provided with same Download PDF

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Publication number
WO2015178127A1
WO2015178127A1 PCT/JP2015/061356 JP2015061356W WO2015178127A1 WO 2015178127 A1 WO2015178127 A1 WO 2015178127A1 JP 2015061356 W JP2015061356 W JP 2015061356W WO 2015178127 A1 WO2015178127 A1 WO 2015178127A1
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WO
WIPO (PCT)
Prior art keywords
conductor
pad
rfid tag
substrate
coil
Prior art date
Application number
PCT/JP2015/061356
Other languages
French (fr)
Japanese (ja)
Inventor
吉本　義弘
恭平 小垣
Original Assignee
株式会社 村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社 村田製作所 filed Critical 株式会社 村田製作所
Priority to JP2016520997A priority Critical patent/JP6090533B2/en
Priority to CN201590000584.0U priority patent/CN206558694U/en
Publication of WO2015178127A1 publication Critical patent/WO2015178127A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Definitions

  • the present invention relates to an RFID (Radio Frequency Identification) tag, and relates to an RFID tag including a spiral coil antenna and an RFIC (Radio Frequency Integration Circuit) element connected to the coil antenna.
  • the present invention also relates to a communication device including such an RFID tag.
  • RFID systems that perform wireless communication between a reader / writer and an RFID tag in a non-contact manner and transmit information between the two have become widespread.
  • an HF band RFID system using a 13.56 MHz band and a UHF band RFID system using a 900 MHz band are generally used.
  • the HF band RFID system is widely used in ID authentication systems and billing systems because it is a relatively short-range communication mainly using a magnetic field and has high security.
  • the RFID tag in order to directly write data to the RFIC chip or to directly read data from the RFIC chip, the RFID tag has a wiring to an external circuit.
  • a drawer pad is provided. That is, by installing an RFID tag inside a communication device and connecting it to other circuits in the communication device via a lead wire, data can be directly written to the RFIC chip or read from the RFIC chip. There is a case where data can be read.
  • the drawing pad when the drawing pad is provided inside the coil antenna as in Patent Document 1, the drawing pad may interfere with the magnetic field formation of the coil antenna, and the communication distance may be shortened. Further, depending on how the wiring pattern between the RFIC chip and the lead pad is routed, the current of the coil antenna may be hindered by the wiring pattern, and the stability of load modulation may not be ensured.
  • a main object of the present invention is to provide an RFID tag that can secure a communication distance and can stabilize load modulation, and a communication device including the RFID tag.
  • An RFID tag is an RFID tag including a coil antenna having a spiral portion formed by winding a circular pattern a plurality of turns, and an RFIC element having two input / output terminals, and one end and the other end of the coil antenna. Is provided in the outermost annular pattern of the spiral portion, and the two input / output terminals of the RFIC element are connected to one end and the other end, respectively. A pad electrode for bonding is further formed.
  • the spiral portion includes a first coil conductor formed in a spiral shape on one main surface of the substrate, a second coil conductor formed in a spiral shape on the other main surface of the substrate, and one end of the first coil conductor. And a first interlayer connecting conductor that connects one end of the second coil conductor to each other, and a second interlayer connecting conductor that connects the other end of the first coil conductor and the other end of the second coil conductor to each other.
  • the pad electrode includes a first pad conductor and a second pad conductor connected to the first coil conductor.
  • the second pad conductor is provided at a position overlapping the second interlayer connection conductor in plan view.
  • a third interlayer connection conductor penetrating the substrate is further provided in a part of the outermost annular pattern of the spiral portion, and the pad electrode is formed on the other main surface of the substrate and the third interlayer connection conductor is provided. And a third pad conductor connected to the first pad conductor, and a fourth pad conductor formed on the other main surface of the substrate and connected to the second pad conductor via the second connection conductor.
  • a chip capacitor connected in parallel to the coil antenna is further provided in the outermost annular pattern in the spiral portion.
  • the communication device is a communication device including an RFID tag and another communication circuit connected to the RFID tag, and the RFID tag has a coil antenna having a spiral portion formed by winding a circular pattern a plurality of turns. And an RFIC element having two input / output terminals, one end and the other end of the coil antenna are provided in an outermost annular pattern of the spiral portion, and the two input / output terminals of the RFIC element are one end and Connected to the other end, the outermost ring pattern of the coil antenna is further formed with a pad electrode for joining with the lead wire, and other communication circuits are connected to the RFID tag via the lead wire. Is done.
  • the magnetic field formation by the coil antenna is less likely to be hindered by the RFIC element, the pad conductor, and the lead wire. . This ensures a sufficient communication distance. Moreover, it becomes difficult to generate a current in the direction opposite to the direction of the current flowing through the coil antenna. This stabilizes load modulation.
  • FIG. 1 It is a perspective view which shows the basic composition of this invention.
  • A is a top view showing a state when the RFID tag of this embodiment is viewed from above
  • B is a cross-sectional view showing an AA section of the RFID tag of this embodiment
  • C is this It is a bottom view which shows the state which looked at the RFID tag of the Example from the downward direction.
  • A) is an illustration figure which shows the state which looked at the conductor formed in the upper surface of the board
  • (A) is an illustration figure which shows the state which looked at the conductor formed in the upper surface of the board
  • (B) is formed in the lower surface of the board
  • (A) is an illustration figure which shows the state which looked at the conductor formed in the upper surface of the board
  • (B) is the lower surface of the board
  • (A) is a top view which shows the state which looked at the board
  • (B) is a bottom view which shows the state which looked at the board
  • the RFID tag of the present invention is typically an RFID tag having a communication frequency in the HF band.
  • the substrate 1 is insulative and is provided with a coil antenna CIL0 extending in a spiral shape along the upper and lower surfaces thereof. That is, the coil antenna CIL0 has a spiral portion formed by winding an annular pattern a plurality of turns.
  • the coil antenna CIL0 includes a first coil conductor CP0a formed in a spiral shape on the upper surface of the substrate 1, a second coil conductor (not shown) formed in a spiral shape on the lower surface of the substrate 1, and a coil antenna.
  • a linear conductor CP0b formed on the upper surface of the substrate 1 to form a part of the outermost annular pattern of CIL0, and a first layer that connects one end of the first coil conductor CP1a and one end of the second coil conductor to each other It includes a connection conductor TH0a and a second interlayer connection conductor TH0b that connects the other end of the second coil conductor and one end of the linear conductor CP0b to each other.
  • the RFIC element 3 has two input / output terminals (not shown) and is mounted so as to straddle the other end of the first coil conductor CP0a and the other end of the linear conductor CP0b.
  • each of the chip capacitors 4a and 4b is mounted so as to straddle the other end of the first coil conductor CP0a and the other end of the linear conductor CP0b.
  • each of the chip capacitors 4a and 4b is connected in parallel to the coil antenna CIL0 in the outermost annular pattern of the coil antenna CIL0 or the spiral portion.
  • the other end of the first coil conductor CP0a and the other end of the linear conductor CP0b are provided in the outermost annular pattern of the coil antenna CIL0 or the spiral portion, and the two input / output terminals of the RFIC element 3 are the first coil conductor. Connected to the other end of CP0a and the other end of linear conductor CP0b. For this reason, the RFIC element 3 and the chip capacitors 4a and 4b are mounted on the upper surface of the substrate 1 in the outermost annular pattern of the coil antenna CIL0 or the spiral portion.
  • first pad conductor PD0a and the second pad conductor PD0b to which the lead wires 5a and 5b are respectively joined are formed in the outermost annular pattern of the coil antenna CIL0 or the spiral portion.
  • the first pad conductor PD0a is integrally formed with the first coil conductor CP0a
  • the second pad conductor PD0b is integrally formed with the linear conductor CP0b. Note that each of the first pad conductor PD0a and the second pad conductor PD0b forms part of a pad electrode.
  • the RFIC element 3, chip capacitors 4a and 4b are mounted on the substrate 1 in the outermost annular pattern of the coil antenna CIL0 or the spiral portion, and the first pad conductor PD0a and the second pad conductor PD0b are connected to the coil antenna CIL0 or the spiral portion.
  • the RFIC element 3 by forming the outermost ring pattern, the magnetic field formation by the coil antenna CIL0 is hardly hindered by the RFIC element 3, the chip capacitors 4a to 4b, the first pad conductor PD0a, the second pad conductor PD0b, and the lead wires 5a to 5b. Become. This ensures a sufficient communication distance.
  • first pad conductor PD0a and the second pad conductor PD0b are formed in the outermost annular pattern of the coil antenna CIL0 or the spiral part, that is, the wide part (coil A portion having a line width wider than that of the pattern is used as a pad electrode for connecting to another circuit, so that complicated wiring routing is not necessarily required.
  • the current flowing through the coil antenna CIL0 It is difficult to generate a current in the opposite direction (current having the opposite phase). That is, the followability of the high-frequency signal with respect to the change in the magnetic field is improved, and the load modulation is stabilized (the signal intensity of the load modulation can be increased).
  • the RFID tag 10 of this embodiment uses a thermosetting resin such as an epoxy resin as a base material.
  • Insulating and rigid substrate 12 is included.
  • the main surface of the substrate 12 is rectangular.
  • the X axis is assigned along the long side of the rectangle
  • the Y axis is assigned along the short side of the rectangle
  • the Z axis is assigned in the direction orthogonal to the main surface.
  • the main surface facing the positive side in the Z-axis direction is defined as “upper surface”
  • the main surface facing the negative side in the Z-axis direction is defined as “lower surface”.
  • the substrate 12 is provided with a conductive coil antenna CIL1.
  • the coil antenna CIL1 extends in a spiral shape along the main surface of the substrate 12.
  • the coil antenna CIL1 has a spiral portion formed by winding an annular pattern a plurality of turns. More specifically, the first coil conductor CP1a and the second coil conductor CP2 forming the coil antenna CIL1 extend in a spiral shape on the upper surface and the lower surface of the substrate 12.
  • the linear conductor CP1b is formed on the upper surface of the substrate 12 so as to form a part of the outermost annular pattern of the coil antenna CIL1.
  • the one end of the first coil conductor CP1a and the one end of the second coil conductor CP2 are both end portions on the innermost periphery side of the coil antenna CIL1, and overlap each other when viewed from the Z-axis direction.
  • the first interlayer connection conductor TH1a is formed in a through hole penetrating the substrate 12 at this overlapping position. Therefore, one end of the first coil conductor CP1a and one end of the second coil conductor CP2 are connected to each other by the first interlayer connection conductor TH1a.
  • the other end of the second coil conductor CP2 and one end of the linear conductor CP1b are both ends of the outermost annular pattern of the coil antenna CIL1 or the spiral portion, and overlap each other when viewed from the Z-axis direction.
  • the second interlayer connection conductor TH1b is formed in a through hole penetrating the substrate 12 at this overlapping position. Therefore, the other end of the second coil conductor CP2 and one end of the linear conductor CP1b are connected to each other by the second interlayer connection conductor TH1b.
  • lands LD1a to LD4a integrally formed with the first coil conductor CP1a are provided on the upper surface of the substrate 12 in the vicinity of the other end of the first coil conductor CP1a, and the linear conductor CP1b.
  • Lands LD1b to LD4b integrally formed with the linear conductor CP1b are provided in the vicinity of the other end.
  • the first coil conductor CP1a extends in the Y-axis direction near the other end
  • the linear conductor CP1b also extends in the Y-axis direction near the other end.
  • the position where the vicinity of the other end of the first coil conductor CP1a extends is on the positive side in the X-axis direction from the position where the vicinity of the other end of the linear conductor CP1b extends.
  • the vicinity of the other end of the first coil conductor CP1a overlaps with the vicinity of the other end of the linear conductor CP1b.
  • the lands LD1a to LD4a are arranged in the Y-axis direction in the vicinity of the other end of the first coil conductor CP1a and project to the negative side in the X-axis direction.
  • the lands LD1b to LD4b are arranged in the Y-axis direction in the vicinity of the other end of the linear conductor CP1b and project to the positive side in the X-axis direction.
  • the land LD1a overlaps with the land LD1b
  • the land LD2a overlaps with the land LD2b
  • the land LD3a overlaps with the land LD3b
  • the land LD4a overlaps with the land LD4b.
  • RFIC element 16 is mounted on lands LD1a, LD2a, LD1b, and LD2b.
  • the chip capacitor 18a for adjusting the resonance frequency is mounted on the lands LD3a and LD3b
  • the chip capacitor 18b for adjusting the resonance frequency is mounted on the lands LD4a and LD4b. That is, each of the RFIC element 16 and the chip capacitors 18a to 18b is mounted on the substrate 12 so as to straddle the first coil conductor CP1a and the linear conductor CP1b in the outermost annular pattern of the coil antenna CIL1 or the spiral portion.
  • each of the chip capacitors 18a to 18b is connected in parallel to the coil antenna CIL1 in the outermost annular pattern of the coil antenna CIL1 or the spiral portion.
  • the connection between the RFIC element 16 and the coil antenna CIL1 will be described in detail later.
  • first pad conductor PD1a and a second pad conductor PD1b to which lead wires 24a and 24b (see FIG. 6) described later are respectively joined are formed in the outermost annular pattern of the coil antenna CIL1 or the spiral portion.
  • the first pad conductor PD1a is integrally formed with the first coil conductor CP1a
  • the second pad conductor PD1b is integrally formed with the linear conductor CP1b. Note that each of the first pad conductor PD1a and the second pad conductor PD1b forms part of a pad electrode.
  • the coil antenna CIL1, lands LD1a, LD1b, LD2a, LD2b, the first pad conductor PD1a, and the second pad conductor PD1b are formed by patterning a metal film such as a copper foil into a predetermined shape.
  • the first interlayer connection conductor TH1a and the second interlayer connection conductor TH1b are through-hole type conductors formed by drilling and plating. Further, the lead wires 24a and 24b are bonded to the first pad conductor PD1a and the second pad conductor PD1b by a conductive bonding material (not shown) such as a solder paste.
  • the upper surface of the substrate 12 is partially covered with a resist film 14a, and the lower surface of the substrate 12 is entirely covered with a resist film 14b.
  • the upper surface of the substrate 12 will be described in detail.
  • the resist film 14a includes the vicinity of the region where the lands LD1a, LD2a, LD1b, and LD2b are formed, and the vicinity of the region where the first pad conductor PD1a and the second pad conductor PD1b are formed.
  • the upper surface of the substrate 12 is covered.
  • the coil antenna CIL1 is protected by the resist films 14a and 14b thus formed.
  • the RFIC element 16 includes an RFIC chip 16cp for processing an RFID signal and a wiring board 16bs for mounting the RFIC chip 16cp.
  • the wiring board 16bs is formed in a plate shape using ceramic or resin as a material.
  • the RFIC chip 16cp incorporates a memory circuit and a signal processing circuit and is sealed with a sealing resin 16rs.
  • the side surface of the wiring board 16bs is orthogonal to each of the X axis and the Y axis, and the side surface of the sealing resin 16rs is flush with the side surface of the wiring board 16bs.
  • Lower electrodes LE1a, LE2a, LE1b, LE2b are provided at the four corners of the lower surface of the wiring board 16bs, respectively.
  • the lower electrode LE1a is connected to the land LD1a by the conductive bonding material PS1a
  • the lower electrode LE2a is connected to the land LD2a by the conductive bonding material PS2a.
  • the lower electrode LE1b is connected to the land LD1b by the conductive bonding material PS1b
  • the lower electrode LE2b is connected to the land LD2b by the conductive bonding material PS2b.
  • the conductive bonding materials PS1a, PS2a, PS1b, and PS2b are all made of solder paste.
  • Upper electrodes UE1a, UE2a, UE1b, UE2b are provided at the four corners of the upper surface of the wiring board 16bs, respectively.
  • the upper electrode UE1a is connected to the lower electrode LE1a by a wiring conductor CL1a extending along the Z axis
  • the upper electrode UE2a is connected to the lower electrode LE2a by a wiring conductor CL2a extending along the Z axis
  • the upper electrode UE1b is connected to the lower electrode LE1b by a wiring conductor CL1b extending along the Z axis
  • the upper electrode UE2b is connected to the lower electrode LE2b by a wiring conductor CL2b extending along the Z axis.
  • Input / output terminals TM1a, TM2a, TM1b, and TM2b are provided at the four corners of the lower surface of the RFIC chip 16cp.
  • the input / output terminal TM1a is connected to the upper electrode UE1a, and the input / output terminal TM2a is connected to the upper electrode UE2a.
  • the input / output terminal TM1a is connected to the upper electrode UE1a, and the input / output terminal TM1a is connected to the upper electrode UE1a.
  • the equivalent circuit of the RFID tag 10 is shown in FIG.
  • One end of the RFIC element 16 is connected to one end of the capacitor C1 and one end of the inductor L1.
  • the other end of the RFIC element 16 is connected to the other end of the capacitor C1 and the other end of the inductor L1.
  • one end of the inductor L1 is connected to one end of the external circuit by a lead wire 24a
  • the other end of the inductor L1 is connected to the other end of the external circuit by a lead wire 24b.
  • the inductor L1 is an inductor component of the coil antenna CIL1.
  • the capacitor C1 is a capacitance component of the chip capacitors 18a and 18b.
  • the resonance frequency of the inductor L1 and the capacitor C1 is defined by the capacitance of the chip capacitors 18a and 18b.
  • the RFID tag 10 thus configured is housed in a casing CS1 that forms the communication device 20 shown in FIG.
  • the housing CS1 houses a communication circuit 22 that performs short-range wireless communication.
  • the communication circuit 22 includes a substrate 26, and further includes ICs 28a to 28c and passive elements 30a to 30e mounted on the substrate 26.
  • a certain terminal provided in the communication circuit 22 is connected to the first pad conductor PD1a of the RFID tag 10 through a lead wire 24a. Further, another terminal provided in the communication circuit 22 is connected to the second pad conductor PD1b of the RFID tag 10 via the lead wire 24b.
  • the communication circuit 22 implements short-range wireless communication with other communication devices in cooperation with the RFID tag 10.
  • the RFIC element 16 and the chip capacitors 18a to 18b are mounted on the upper surface of the substrate 12 in the vicinity of the negative side end in the X-axis direction. Therefore, the RFID tag 10 has good directivity on the positive side in the X-axis direction. Based on this, the RFID tag 10 is housed in the housing CS1 in a posture in which the positive side end in the X-axis direction is closer to the end of the communication device 20.
  • the substrate 12 on which the RFID tag 10 is formed has an insulating property.
  • the coil antenna CIL1 is provided on the substrate 12 so as to extend spirally along the main surface of the substrate 12. That is, the coil antenna CIL1 has a spiral portion formed by winding an annular pattern a plurality of turns.
  • the RFIC element 16 and the chip capacitors 18a to 18b are provided on the substrate 12 so as to straddle one end and the other end of the coil antenna CIL1.
  • one end and the other end of the coil antenna CIL1 are provided in the outermost annular pattern of the coil antenna CIL1 or the spiral portion.
  • a first pad conductor PD1a and a second pad conductor PD1b for joining to the lead wires 24a and 24b are formed in the outermost annular pattern of the coil antenna CIL1 or the spiral portion.
  • the RFIC element 16 and the chip capacitors 18a to 18b are provided on the substrate 12 in the outermost annular pattern of the coil antenna CIL1 or the spiral part, and the first pad conductor PD1a and the second pad conductor PD1b are provided of the coil antenna CIL1 or the spiral part.
  • the outermost ring pattern By forming the outermost ring pattern, the magnetic field formation by the coil antenna CIL1 is not easily prevented by the RFIC element 16, the chip capacitors 18a to 18b, the first pad conductor PD1a, the second pad conductor PD1b, and the lead wires 24a to 24b. . This ensures a sufficient communication distance.
  • the first pad conductor PD1a ′ and the second pad conductor PD1b ′ are provided inside the coil antenna CIL1 ′, the first pad conductor PD1a ′ and the second pad conductor are provided.
  • PD1b ' may interfere with the magnetic field formation of the coil antenna CIL1', and the communication distance may be reduced.
  • the current of the coil antenna CIL1 ′ may be affected by this wiring pattern. This can interfere with load modulation.
  • the first pad conductor PD1a and the second pad conductor PD1b are formed in an annular pattern on the outermost periphery of the coil antenna CIL1 or the spiral portion.
  • FIG. 7A it becomes difficult to generate a current in the direction opposite to the direction of the current flowing through the coil antenna CIL1, thereby stabilizing the load modulation.
  • the substrate 12 is a hard substrate whose base material is a thermosetting resin such as an epoxy resin.
  • a soft substrate whose base material is a flexible resin such as polyimide resin may be adopted as the substrate 12.
  • the coil antenna CIL1, the lands LD1a, LD1b, LD2a, LD2b, the first pad conductor PD1a, and the second pad conductor PD1b are formed by patterning a metal film such as a copper foil into a predetermined shape.
  • the coil antenna CIL1, the lands LD1a, LD1b, LD2a, LD2b, the first pad conductor PD1a, and the second pad conductor PD1b may be formed by screen printing of a conductive paste.
  • first interlayer connection conductor TH1a and the second interlayer connection conductor TH1b are through-hole type conductors formed by drilling and plating.
  • first interlayer connection conductor TH1a and the second interlayer connection conductor TH1b may be via-hole type conductors formed by a drilling process and a conductive material filling process.
  • the coil antenna CIL1 includes a first interlayer connection between the first coil conductor CP1a and the linear conductor CP1b formed on the upper surface of the substrate 12 and the second coil conductor CP2 formed on the lower surface of the substrate 12.
  • This is a two-layer spiral type coil connected by a conductor TH1a and a second interlayer connection conductor TH1b.
  • a single-layer spiral type or three or more-layer spiral type coil antenna may be provided on the substrate 12.
  • the number of turns of the coil antenna CIL1 is 3, but the number of turns may be 2 turns or 4 turns or more. [Example 2]
  • the land LD5 is additionally formed integrally with the linear conductor CP1b. More specifically, the land LD5 is formed at a slightly negative position in the Y-axis direction from the land LD4b. The other end of the second coil conductor CP2 extends to a position overlapping the land LD5 when viewed from the Z-axis direction.
  • the second interlayer connection conductor TH1b penetrates the substrate 12 at this overlapping position, and the second coil conductor CP2 and the linear conductor CP1b are connected to each other by the second interlayer connection conductor TH1b.
  • the formation positions of the first pad conductor PD1a and the second pad conductor PD1b are between the substrate 12 shown in FIGS. 3A to 3B and the substrate 12 shown in FIGS. 8A to 8B. Match.
  • the second pad conductor PD1b may be connected to the line via the wiring conductor CL11. It can be said that it is connected near the other end of the conductor CP1b.
  • the current flowing into the linear conductor CP1b through the second interlayer connection conductor TH1b branches to the lands LD1b to LD3b side and the second pad conductor PD1b side.
  • This branching may shorten the communication distance and make the load modulation unstable.
  • the second interlayer connection conductor TH1b (or through-hole) is formed at a position away from the second pad conductor PD1b, workability when joining the lead wire 24b to the second pad conductor PD1b. Will improve. [Example 3]
  • FIGS. 9A to 9B show a substrate 12 constituting the RFID tag 10 of another embodiment.
  • a third pad conductor PD2a and a fourth pad conductor PD2b are additionally formed on the lower surface of the substrate 12.
  • the third pad conductor PD2a overlaps the first pad conductor PD1a
  • the fourth pad conductor PD2b overlaps the second pad conductor PD1b.
  • Each of the third pad conductor PD2a and the fourth pad conductor PD2b also forms part of the pad electrode.
  • the third interlayer connection conductor TH2 penetrates the substrate 12 at a position overlapping the third pad conductor PD2a. Therefore, the first pad conductor PD1a and the third pad conductor PD2a are connected to each other by the third interlayer connection conductor TH2.
  • the fourth pad conductor PD2b is connected to the second pad conductor PD1b by the second interlayer connection conductor TH1b.
  • the lead wires 24a and 24b can be bonded to both the upper surface and the lower surface of the substrate 12. This improves the degree of design freedom.
  • the substrate 12 constituting the RFID tag 10 of another embodiment is shown in FIGS. 10 (A) to 10 (B).
  • the first pad conductor PD1a and the second pad conductor PD1b are omitted.
  • the lead wires 24 a and 24 b are bonded to the lower surface of the substrate 12. This makes it difficult for the soldering iron) to hit the RFIC element 16 and the chip capacitors 18a and 18b when the lead wires 24a and 24b are soldered. As a result, workability is improved and positional deviation of the RFIC element 16 and the chip capacitors 18a and 18b is prevented.
  • the third pad conductor PD2a and the fourth pad conductor PD2b may be additionally formed on the substrate 12 shown in FIGS. 8A to 8B.
  • the resist film 14a includes a part of the first coil conductor CP1a (around the first pad conductor PD1a) and a part of the linear conductor CP1b (around the second pad conductor PD1b). Is formed on the upper surface of the substrate 12. However, as shown in FIGS. 11A to 11B, the resist film 14a may be formed over the entire upper surface of the substrate 12 except for the first pad conductor PD1a and the second pad conductor PD1b. Good. Thereby, the second interlayer connection conductor TH1b is covered with the resist film 14a, and the workability when the lead wire 24b is joined to the second pad conductor PD1b is improved.
  • the RFID tag of the present invention may have a card emulation (Card ⁇ Emulation) function, a reader / writer function, and a terminal-to-terminal communication (P2P) function as in an NFC system, for example.
  • Card ⁇ Emulation Card ⁇ Emulation
  • P2P terminal-to-terminal communication

Abstract

　A substrate (12) used to form an RFID tag (10) is insulated. A coiled antenna (CIL1) is provided on the substrate (12) so as to extend in a spiral shape along the main surface of the substrate (12). In other words, the coiled antenna (CIL1) has a spiral portion formed by causing a plurality of circular patterns to be wound in a plurality of turns. An RFIC element (16) and chip capacitors (18a-18b) are provided on the substrate (12) so as to span one end and the other end of the coiled antenna (CIL1). The one end and the other end of the coiled antenna (CIL1) are provided in a circular pattern on the outermost periphery within the spiral portion. In addition, a first pad conductor (PD1a) and a second pad conductor (PD1b) for joining leads (24a, 24b) are formed in a pattern on the outermost periphery.

Description

ＲＦＩＤタグおよびこれを備える通信装置RFID tag and communication device including the same
　この発明は、ＲＦＩＤ(Radio Frequency Identification)タグに関し、スパイラル状のコイルアンテナと、コイルアンテナに接続されたＲＦＩＣ(Radio Frequency Integration Circuit)素子とを備える、ＲＦＩＤタグに関する。この発明はまた、このようなＲＦＩＤタグを備える通信装置に関する。 The present invention relates to an RFID (Radio Frequency Identification) tag, and relates to an RFID tag including a spiral coil antenna and an RFIC (Radio Frequency Integration Circuit) element connected to the coil antenna. The present invention also relates to a communication device including such an RFID tag.
　リーダライタとＲＦＩＤタグとを非接触で無線通信し、両者の間で情報を伝達するＲＦＩＤシステムが普及している。このＲＦＩＤシステムとしては、１３．５６ＭＨｚ帯を利用したＨＦ帯ＲＦＩＤシステム、および９００ＭＨｚ帯を利用したＵＨＦ帯ＲＦＩＤシステムが一般的である。特に、ＨＦ帯ＲＦＩＤシステムは、主に磁界を利用した比較的近距離の通信であって、セキュリティ性が高いことから、ＩＤ認証システムや課金システムに広く利用されている。 RFID systems that perform wireless communication between a reader / writer and an RFID tag in a non-contact manner and transmit information between the two have become widespread. As this RFID system, an HF band RFID system using a 13.56 MHz band and a UHF band RFID system using a 900 MHz band are generally used. In particular, the HF band RFID system is widely used in ID authentication systems and billing systems because it is a relatively short-range communication mainly using a magnetic field and has high security.
　ＨＦ帯ＲＦＩＤシステムにおいて、たとえば特許文献１に開示されているように、ＲＦＩＣチップに直接的にデータを書き込むため、或いはＲＦＩＣチップから直接的にデータを読み出すため、ＲＦＩＤタグに外部回路への配線のための引出し用パッドが設けられる場合がある。すなわち、ＲＦＩＤタグを通信装置の内部に設置し、これを通信装置内の他の回路にリード線を介して接続することにより、直接的に、ＲＦＩＣチップへのデータの書き込みや、ＲＦＩＣチップからのデータの読み出しを行うことができるような構成とする場合がある。 In the HF band RFID system, for example, as disclosed in Patent Document 1, in order to directly write data to the RFIC chip or to directly read data from the RFIC chip, the RFID tag has a wiring to an external circuit. There may be a case where a drawer pad is provided. That is, by installing an RFID tag inside a communication device and connecting it to other circuits in the communication device via a lead wire, data can be directly written to the RFIC chip or read from the RFIC chip. There is a case where data can be read.
特開２０１２－２４８１５４号公報JP 2012-248154 A
　しかし、特許文献１のようにコイルアンテナの内側に引出し用パッドを設けた場合、引出し用パッドがコイルアンテナの磁界形成を妨げてしまい、通信距離が小さくなってしまうことがある。また、ＲＦＩＣチップと引出し用パッドとの配線パターンの引回し方によっては、この配線パターンによってコイルアンテナの電流が妨げられ、負荷変調(Load Modulation)の安定性を確保できないことがある。 However, when the drawing pad is provided inside the coil antenna as in Patent Document 1, the drawing pad may interfere with the magnetic field formation of the coil antenna, and the communication distance may be shortened. Further, depending on how the wiring pattern between the RFIC chip and the lead pad is routed, the current of the coil antenna may be hindered by the wiring pattern, and the stability of load modulation may not be ensured.
　それゆえに、この発明の主たる目的は、通信距離を確保でき、かつ負荷変調を安定させることができるＲＦＩＤタグおよびこれを備える通信装置を提供することである。 Therefore, a main object of the present invention is to provide an RFID tag that can secure a communication distance and can stabilize load modulation, and a communication device including the RFID tag.
　この発明のＲＦＩＤタグは、環状パターンを複数ターン巻回してなるスパイラル部を有するコイルアンテナと、２つの入出力端子を有するＲＦＩＣ素子と、備えるＲＦＩＤタグであって、コイルアンテナの一方端および他方端はスパイラル部のうち最外周の環状パターンに設けられ、ＲＦＩＣ素子の２つの入出力端子は一方端および他方端にそれぞれ接続されており、スパイラル部のうち最外周の環状パターンには、リード線と接合するためのパッド電極がさらに形成されている、ことを特徴とする。 An RFID tag according to the present invention is an RFID tag including a coil antenna having a spiral portion formed by winding a circular pattern a plurality of turns, and an RFIC element having two input / output terminals, and one end and the other end of the coil antenna. Is provided in the outermost annular pattern of the spiral portion, and the two input / output terminals of the RFIC element are connected to one end and the other end, respectively. A pad electrode for bonding is further formed.
　好ましくは、スパイラル部は、基板の一方主面にスパイラル状に形成された第１コイル導体と、基板の他方主面にスパイラル状に形成された第２コイル導体と、第１コイル導体の一方端および第２コイル導体の一方端を互いに接続する第１層間接続導体と、第１コイル導体の他方端および第２コイル導体の他方端を互いに接続する第２層間接続導体とを含む。 Preferably, the spiral portion includes a first coil conductor formed in a spiral shape on one main surface of the substrate, a second coil conductor formed in a spiral shape on the other main surface of the substrate, and one end of the first coil conductor. And a first interlayer connecting conductor that connects one end of the second coil conductor to each other, and a second interlayer connecting conductor that connects the other end of the first coil conductor and the other end of the second coil conductor to each other.
　さらに好ましくは、パッド電極は、第１コイル導体に接続された第１パッド導体および第２パッド導体を含む。 More preferably, the pad electrode includes a first pad conductor and a second pad conductor connected to the first coil conductor.
　或る局面では、第２パッド導体は平面視して第２層間接続導体と重なる位置に設けられる。 In one aspect, the second pad conductor is provided at a position overlapping the second interlayer connection conductor in plan view.
　さらに好ましくは、スパイラル部のうち最外周の環状パターンの一部に基板を貫通する第３層間接続導体がさらに備えられ、パッド電極は、基板の他方主面に形成されかつ第３層間接続導体を介して第１パッド導体と接続された第３パッド導体と、基板の他方主面に形成されかつ第２接続導体を介して第２パッド導体と接続された第４パッド導体とを含む。 More preferably, a third interlayer connection conductor penetrating the substrate is further provided in a part of the outermost annular pattern of the spiral portion, and the pad electrode is formed on the other main surface of the substrate and the third interlayer connection conductor is provided. And a third pad conductor connected to the first pad conductor, and a fourth pad conductor formed on the other main surface of the substrate and connected to the second pad conductor via the second connection conductor.
　好ましくは、スパイラル部のうち最外周の環状パターンにコイルアンテナに並列接続されたチップコンデンサがさらに備えられる。 Preferably, a chip capacitor connected in parallel to the coil antenna is further provided in the outermost annular pattern in the spiral portion.
　この発明の通信装置は、ＲＦＩＤタグと、ＲＦＩＤタグに接続された他の通信回路と、を備える通信装置であって、ＲＦＩＤタグは、環状パターンを複数ターン巻回してなるスパイラル部を有するコイルアンテナと、２つの入出力端子を有するＲＦＩＣ素子と、を備え、コイルアンテナの一方端および他方端はスパイラル部のうち最外周の環状パターンに設けられ、ＲＦＩＣ素子の２つの入出力端子は一方端および他方端にそれぞれ接続されており、コイルアンテナの最外周の環状パターンには、リード線と接合するためのパッド電極がさらに形成されており、他の通信回路はリード線を介してＲＦＩＤタグと接続される。 The communication device according to the present invention is a communication device including an RFID tag and another communication circuit connected to the RFID tag, and the RFID tag has a coil antenna having a spiral portion formed by winding a circular pattern a plurality of turns. And an RFIC element having two input / output terminals, one end and the other end of the coil antenna are provided in an outermost annular pattern of the spiral portion, and the two input / output terminals of the RFIC element are one end and Connected to the other end, the outermost ring pattern of the coil antenna is further formed with a pad electrode for joining with the lead wire, and other communication circuits are connected to the RFID tag via the lead wire. Is done.
　ＲＦＩＣ素子をスパイラル部のうち最外周の環状パターンに設け、かつパッド電極を同じく最外周の環状パターンに形成することで、コイルアンテナによる磁界形成がＲＦＩＣ素子，パッド導体およびリード線によって妨げられにくくなる。これによって、十分な通信距離が確保される。また、コイルアンテナを流れる電流の向きと逆向きの電流が生じにくくなる。これによって、負荷変調の安定化が図られる。 By providing the RFIC element in the outermost annular pattern of the spiral portion and forming the pad electrode in the outermost annular pattern, the magnetic field formation by the coil antenna is less likely to be hindered by the RFIC element, the pad conductor, and the lead wire. . This ensures a sufficient communication distance. Moreover, it becomes difficult to generate a current in the direction opposite to the direction of the current flowing through the coil antenna. This stabilizes load modulation.
　この発明の上述の目的，その他の目的，特徴および利点は、図面を参照して行う以下の実施例の詳細な説明から一層明らかとなろう。 The above object, other objects, features, and advantages of the present invention will become more apparent from the following detailed description of embodiments with reference to the drawings.
この発明の基本的構成を示す斜視図である。It is a perspective view which shows the basic composition of this invention. （Ａ）はこの実施例のＲＦＩＤタグを上方から眺めた状態を示す上面図であり、（Ｂ）はこの実施例のＲＦＩＤタグのＡ－Ａ断面を示す断面図であり、（Ｃ）はこの実施例のＲＦＩＤタグを下方から眺めた状態を示す下面図である。(A) is a top view showing a state when the RFID tag of this embodiment is viewed from above, (B) is a cross-sectional view showing an AA section of the RFID tag of this embodiment, (C) is this It is a bottom view which shows the state which looked at the RFID tag of the Example from the downward direction. （Ａ）はこの実施例に適用される基板の上面に形成された導体を上方から眺めた状態を示す図解図であり、（Ｂ）はこの実施例に適用される基板の下面に形成された導体を上方から眺めた状態を示す図解図である。(A) is an illustration figure which shows the state which looked at the conductor formed in the upper surface of the board | substrate applied to this Example from upper direction, (B) was formed in the lower surface of the board | substrate applied to this Example. It is an illustration figure which shows the state which looked at the conductor from upper direction. この実施例のＲＦＩＤタグを構成するＲＦＩＣチップの或る断面を示す断面図である。It is sectional drawing which shows a certain cross section of the RFIC chip which comprises the RFID tag of this Example. この実施例のＲＦＩＤタグの等価回路図である。It is the equivalent circuit schematic of the RFID tag of this Example. この実施例のＲＦＩＤタグが実装された通信装置の一例を示す図解図である。It is an illustration figure which shows an example of the communication apparatus by which the RFID tag of this Example was mounted. （Ａ）はこの実施例のＲＦＩＤタグを構成するコイルアンテナにおける電流の流れを示す図解図であり、（Ｂ）は従来のＲＦＩＤタグを構成するコイルアンテナにおける電流の流れを示す図解図である。(A) is an illustration figure which shows the flow of the electric current in the coil antenna which comprises the RFID tag of this Example, (B) is an illustration figure which shows the electric current flow in the coil antenna which comprises the conventional RFID tag. （Ａ）は他の実施例に適用される基板の上面に形成された導体を上方から眺めた状態を示す図解図であり、（Ｂ）は他の実施例に適用される基板の下面に形成された導体を上方から眺めた状態を示す図解図である。(A) is an illustration figure which shows the state which looked at the conductor formed in the upper surface of the board | substrate applied to another Example from upper direction, (B) is formed in the lower surface of the board | substrate applied to another Example. It is an illustration figure which shows the state which looked at the made conductor from upper direction. （Ａ）はその他の実施例に適用される基板の上面に形成された導体を上方から眺めた状態を示す図解図であり、（Ｂ）はその他の実施例に適用される基板の下面に形成された導体を上方から眺めた状態を示す図解図である。(A) is an illustration figure which shows the state which looked at the conductor formed in the upper surface of the board | substrate applied to another Example from the upper direction, (B) is formed in the lower surface of the board | substrate applied to another Example. It is an illustration figure which shows the state which looked at the made conductor from upper direction. （Ａ）はさらにその他の実施例に適用される基板の上面に形成された導体を上方から眺めた状態を示す図解図であり、（Ｂ）はさらにその他の実施例に適用される基板の下面に形成された導体を上方から眺めた状態を示す図解図である。(A) is an illustration figure which shows the state which looked at the conductor formed in the upper surface of the board | substrate applied to another Example from the upper direction, (B) is the lower surface of the board | substrate applied to still another Example. It is an illustration figure which shows the state which looked at the conductor formed in from above. （Ａ）は他の実施例に適用される基板を上方から眺めた状態を示す上面図であり、（Ｂ）は他の実施例に適用される基板を下方から眺めた状態を示す下面図である。(A) is a top view which shows the state which looked at the board | substrate applied to another Example from upper direction, (B) is a bottom view which shows the state which looked at the board | substrate applied to another Example from the downward direction. is there.
［基本的構成］
　図１を参照して、この発明のＲＦＩＤタグは、代表的には、ＨＦ帯を通信周波数とするＲＦＩＤタグである。基板１は絶縁性を有し、その上面および下面に沿ってスパイラル状に延びるコイルアンテナＣＩＬ０が設けられる。つまり、コイルアンテナＣＩＬ０は、環状パターンを複数ターン巻回してなるスパイラル部を有する。 [Basic configuration]
Referring to FIG. 1, the RFID tag of the present invention is typically an RFID tag having a communication frequency in the HF band. The substrate 1 is insulative and is provided with a coil antenna CIL0 extending in a spiral shape along the upper and lower surfaces thereof. That is, the coil antenna CIL0 has a spiral portion formed by winding an annular pattern a plurality of turns.
　詳しくは、コイルアンテナＣＩＬ０は、基板１の上面にスパイラル状に形成された第１コイル導体ＣＰ０ａと、基板１の下面にスパイラル状に形成された第２コイル導体（図示せず）と、コイルアンテナＣＩＬ０の最外周の環状パターンの一部をなすべく基板１の上面に形成された線状導体ＣＰ０ｂと、第１コイル導体ＣＰ１ａの一方端および第２コイル導体の一方端を互いに接続する第１層間接続導体ＴＨ０ａと、第２コイル導体の他方端および線状導体ＣＰ０ｂの一方端を互いに接続する第２層間接続導体ＴＨ０ｂとを含む。 Specifically, the coil antenna CIL0 includes a first coil conductor CP0a formed in a spiral shape on the upper surface of the substrate 1, a second coil conductor (not shown) formed in a spiral shape on the lower surface of the substrate 1, and a coil antenna. A linear conductor CP0b formed on the upper surface of the substrate 1 to form a part of the outermost annular pattern of CIL0, and a first layer that connects one end of the first coil conductor CP1a and one end of the second coil conductor to each other It includes a connection conductor TH0a and a second interlayer connection conductor TH0b that connects the other end of the second coil conductor and one end of the linear conductor CP0b to each other.
　ＲＦＩＣ素子３は、図示しない２つの入出力端子を有し、第１コイル導体ＣＰ０ａの他方端および線状導体ＣＰ０ｂの他方端を跨ぐように実装される。同様に、チップコンデンサ４ａおよび４ｂの各々も、第１コイル導体ＣＰ０ａの他方端および線状導体ＣＰ０ｂの他方端を跨ぐように実装される。換言すれば、チップコンデンサ４ａおよび４ｂの各々は、コイルアンテナＣＩＬ０またはスパイラル部のうちの最外周の環状パターンにおいてコイルアンテナＣＩＬ０に並列接続される。 The RFIC element 3 has two input / output terminals (not shown) and is mounted so as to straddle the other end of the first coil conductor CP0a and the other end of the linear conductor CP0b. Similarly, each of the chip capacitors 4a and 4b is mounted so as to straddle the other end of the first coil conductor CP0a and the other end of the linear conductor CP0b. In other words, each of the chip capacitors 4a and 4b is connected in parallel to the coil antenna CIL0 in the outermost annular pattern of the coil antenna CIL0 or the spiral portion.
　第１コイル導体ＣＰ０ａの他方端および線状導体ＣＰ０ｂの他方端は、コイルアンテナＣＩＬ０またはスパイラル部のうち最外周の環状パターンに設けられ、ＲＦＩＣ素子３の２つの入出力端子は、第１コイル導体ＣＰ０ａの他方端および線状導体ＣＰ０ｂの他方端にそれぞれ接続される。このため、ＲＦＩＣ素子３，チップコンデンサ４ａおよび４ｂは、コイルアンテナＣＩＬ０またはスパイラル部のうち最外周の環状パターンにおいて基板１の上面に実装される。 The other end of the first coil conductor CP0a and the other end of the linear conductor CP0b are provided in the outermost annular pattern of the coil antenna CIL0 or the spiral portion, and the two input / output terminals of the RFIC element 3 are the first coil conductor. Connected to the other end of CP0a and the other end of linear conductor CP0b. For this reason, the RFIC element 3 and the chip capacitors 4a and 4b are mounted on the upper surface of the substrate 1 in the outermost annular pattern of the coil antenna CIL0 or the spiral portion.
　また、コイルアンテナＣＩＬ０またはスパイラル部のうち最外周の環状パターンには、リード線５ａおよび５ｂがそれぞれ接合される第１パッド導体ＰＤ０ａおよび第２パッド導体ＰＤ０ｂが形成される。第１パッド導体ＰＤ０ａは第１コイル導体ＣＰ０ａと一体形成され、第２パッド導体ＰＤ０ｂは線状導体ＣＰ０ｂと一体形成される。なお、第１パッド導体ＰＤ０ａおよび第２パッド導体ＰＤ０ｂの各々は、パッド電極の一部をなす。 Further, the first pad conductor PD0a and the second pad conductor PD0b to which the lead wires 5a and 5b are respectively joined are formed in the outermost annular pattern of the coil antenna CIL0 or the spiral portion. The first pad conductor PD0a is integrally formed with the first coil conductor CP0a, and the second pad conductor PD0b is integrally formed with the linear conductor CP0b. Note that each of the first pad conductor PD0a and the second pad conductor PD0b forms part of a pad electrode.
　ＲＦＩＣ素子３，チップコンデンサ４ａおよび４ｂをコイルアンテナＣＩＬ０またはスパイラル部のうち最外周の環状パターンにおいて基板１に実装し、かつ第１パッド導体ＰＤ０ａおよび第２パッド導体ＰＤ０ｂをコイルアンテナＣＩＬ０またはスパイラル部のうち最外周の環状パターンに形成することで、コイルアンテナＣＩＬ０による磁界形成がＲＦＩＣ素子３，チップコンデンサ４ａ～４ｂ，第１パッド導体ＰＤ０ａ，第２パッド導体ＰＤ０ｂ，リード線５ａ～５ｂによって妨げられにくくなる。これによって、十分な通信距離が確保される。 The RFIC element 3, chip capacitors 4a and 4b are mounted on the substrate 1 in the outermost annular pattern of the coil antenna CIL0 or the spiral portion, and the first pad conductor PD0a and the second pad conductor PD0b are connected to the coil antenna CIL0 or the spiral portion. Among them, by forming the outermost ring pattern, the magnetic field formation by the coil antenna CIL0 is hardly hindered by the RFIC element 3, the chip capacitors 4a to 4b, the first pad conductor PD0a, the second pad conductor PD0b, and the lead wires 5a to 5b. Become. This ensures a sufficient communication distance.
　また、第１パッド導体ＰＤ０ａおよび第２パッド導体ＰＤ０ｂをコイルアンテナＣＩＬ０またはスパイラル部のうち最外周の環状パターンに形成することで、つまり、コイルアンテナの最外周ターンの一部に、幅広部（コイルパターンよりも線幅の広い部分）を形成し、これを他の回路に接続するためのパッド電極として利用することにより、複雑な配線引き回しを必ずしも必要とせず、その結果、コイルアンテナＣＩＬ０を流れる電流の向きと逆向きの電流（逆位相の電流）が生じにくくなる。すなわち、磁界の変化に対する高周波信号の追従性が向上し、負荷変調(Load Modulation)の安定化が図られる（負荷変調の信号強度を大きくすることができる）。
［実施例１］ Further, the first pad conductor PD0a and the second pad conductor PD0b are formed in the outermost annular pattern of the coil antenna CIL0 or the spiral part, that is, the wide part (coil A portion having a line width wider than that of the pattern is used as a pad electrode for connecting to another circuit, so that complicated wiring routing is not necessarily required. As a result, the current flowing through the coil antenna CIL0 It is difficult to generate a current in the opposite direction (current having the opposite phase). That is, the followability of the high-frequency signal with respect to the change in the magnetic field is improved, and the load modulation is stabilized (the signal intensity of the load modulation can be increased).
[Example 1]
　図２（Ａ）～図２（Ｃ）および図３（Ａ）～図３（Ｂ）を参照して、この実施例のＲＦＩＤタグ１０は、エポキシ樹脂などの熱硬化性樹脂を母材とする絶縁性でかつ硬質の基板１２を含む。基板１２の主面は、長方形をなす。この実施例では、長方形の長辺に沿ってＸ軸を割り当て、長方形の短辺に沿ってＹ軸を割り当て、主面に直交する方向にＺ軸を割り当てる。また、Ｚ軸方向の正側を向く主面を“上面”と定義し、Ｚ軸方向の負側を向く主面を“下面”と定義する。 Referring to FIGS. 2A to 2C and FIGS. 3A to 3B, the RFID tag 10 of this embodiment uses a thermosetting resin such as an epoxy resin as a base material. Insulating and rigid substrate 12 is included. The main surface of the substrate 12 is rectangular. In this embodiment, the X axis is assigned along the long side of the rectangle, the Y axis is assigned along the short side of the rectangle, and the Z axis is assigned in the direction orthogonal to the main surface. Further, the main surface facing the positive side in the Z-axis direction is defined as “upper surface”, and the main surface facing the negative side in the Z-axis direction is defined as “lower surface”.
　基板１２には、導電性のコイルアンテナＣＩＬ１が設けられる。コイルアンテナＣＩＬ１は、基板１２の主面に沿ってスパイラル状に延びる。換言すれば、コイルアンテナＣＩＬ１は、環状パターンを複数ターン巻回してなるスパイラル部を有する。より詳しくは、コイルアンテナＣＩＬ１をなす第１コイル導体ＣＰ１ａおよび第２コイル導体ＣＰ２は、基板１２の上面および下面をスパイラル状に延びる。また、線状導体ＣＰ１ｂは、コイルアンテナＣＩＬ１の最外周の環状パターンの一部をなすべく基板１２の上面に形成される。 The substrate 12 is provided with a conductive coil antenna CIL1. The coil antenna CIL1 extends in a spiral shape along the main surface of the substrate 12. In other words, the coil antenna CIL1 has a spiral portion formed by winding an annular pattern a plurality of turns. More specifically, the first coil conductor CP1a and the second coil conductor CP2 forming the coil antenna CIL1 extend in a spiral shape on the upper surface and the lower surface of the substrate 12. The linear conductor CP1b is formed on the upper surface of the substrate 12 so as to form a part of the outermost annular pattern of the coil antenna CIL1.
　第１コイル導体ＣＰ１ａの一方端および第２コイル導体ＣＰ２の一方端は、いずれもコイルアンテナＣＩＬ１の最内周側の端部であり、Ｚ軸方向から眺めて互いに重なる。第１層間接続導体ＴＨ１ａは、この重複位置において基板１２を貫通するスルーホールに形成される。したがって、第１コイル導体ＣＰ１ａの一方端および第２コイル導体ＣＰ２の一方端は、第１層間接続導体ＴＨ１ａによって互いに接続される。 The one end of the first coil conductor CP1a and the one end of the second coil conductor CP2 are both end portions on the innermost periphery side of the coil antenna CIL1, and overlap each other when viewed from the Z-axis direction. The first interlayer connection conductor TH1a is formed in a through hole penetrating the substrate 12 at this overlapping position. Therefore, one end of the first coil conductor CP1a and one end of the second coil conductor CP2 are connected to each other by the first interlayer connection conductor TH1a.
　第２コイル導体ＣＰ２の他方端および線状導体ＣＰ１ｂの一方端は、いずれもコイルアンテナＣＩＬ１またはスパイラル部のうち最外周の環状パターンの端部であり、Ｚ軸方向から眺めて互いに重なる。第２層間接続導体ＴＨ１ｂは、この重複位置において基板１２を貫通するスルーホールに形成される。したがって、第２コイル導体ＣＰ２の他方端および線状導体ＣＰ１ｂの一方端は、第２層間接続導体ＴＨ１ｂによって互いに接続される。 The other end of the second coil conductor CP2 and one end of the linear conductor CP1b are both ends of the outermost annular pattern of the coil antenna CIL1 or the spiral portion, and overlap each other when viewed from the Z-axis direction. The second interlayer connection conductor TH1b is formed in a through hole penetrating the substrate 12 at this overlapping position. Therefore, the other end of the second coil conductor CP2 and one end of the linear conductor CP1b are connected to each other by the second interlayer connection conductor TH1b.
　図３（Ａ）に示すように、基板１２の上面には、第１コイル導体ＣＰ１ａの他方端近傍で第１コイル導体ＣＰ１ａと一体形成されたランドＬＤ１ａ～ＬＤ４ａが設けられ、さらに線状導体ＣＰ１ｂの他方端近傍で線状導体ＣＰ１ｂと一体形成されたランドＬＤ１ｂ～ＬＤ４ｂが設けられる。 As shown in FIG. 3A, lands LD1a to LD4a integrally formed with the first coil conductor CP1a are provided on the upper surface of the substrate 12 in the vicinity of the other end of the first coil conductor CP1a, and the linear conductor CP1b. Lands LD1b to LD4b integrally formed with the linear conductor CP1b are provided in the vicinity of the other end.
　より詳しくは、第１コイル導体ＣＰ１ａは他方端の近傍においてＹ軸方向に延び、線状導体ＣＰ１ｂも他方端の近傍においてＹ軸方向に延びる。ここで、第１コイル導体ＣＰ１ａの他方端近傍が延びる位置は、線状導体ＣＰ１ｂの他方端近傍が延びる位置よりもＸ軸方向の正側である。また、Ｘ軸方向から眺めたとき、第１コイル導体ＣＰ１ａの他方端近傍は線状導体ＣＰ１ｂの他方端近傍と重なる。 More specifically, the first coil conductor CP1a extends in the Y-axis direction near the other end, and the linear conductor CP1b also extends in the Y-axis direction near the other end. Here, the position where the vicinity of the other end of the first coil conductor CP1a extends is on the positive side in the X-axis direction from the position where the vicinity of the other end of the linear conductor CP1b extends. Further, when viewed from the X-axis direction, the vicinity of the other end of the first coil conductor CP1a overlaps with the vicinity of the other end of the linear conductor CP1b.
　ランドＬＤ１ａ～ＬＤ４ａは、第１コイル導体ＣＰ１ａの他方端近傍においてＹ軸方向に並び、かつＸ軸方向の負側に突出する。これに対して、ランドＬＤ１ｂ～ＬＤ４ｂは、線状導体ＣＰ１ｂの他方端近傍においてＹ軸方向に並び、かつＸ軸方向の正側に突出する。Ｘ軸方向から眺めたとき、ランドＬＤ１ａはランドＬＤ１ｂと重なり、ランドＬＤ２ａはランドＬＤ２ｂと重なり、ランドＬＤ３ａはランドＬＤ３ｂと重なり、そしてランドＬＤ４ａはランドＬＤ４ｂと重なる。 The lands LD1a to LD4a are arranged in the Y-axis direction in the vicinity of the other end of the first coil conductor CP1a and project to the negative side in the X-axis direction. On the other hand, the lands LD1b to LD4b are arranged in the Y-axis direction in the vicinity of the other end of the linear conductor CP1b and project to the positive side in the X-axis direction. When viewed from the X-axis direction, the land LD1a overlaps with the land LD1b, the land LD2a overlaps with the land LD2b, the land LD3a overlaps with the land LD3b, and the land LD4a overlaps with the land LD4b.
　図２（Ａ）および図３（Ａ）を参照して、ＲＦＩＣ素子１６は、ランドＬＤ１ａ，ＬＤ２ａ，ＬＤ１ｂ，ＬＤ２ｂに実装される。また、共振周波数調整用のチップコンデンサ１８ａはランドＬＤ３ａおよびＬＤ３ｂに実装され、同じく共振周波数調整用のチップコンデンサ１８ｂはランドＬＤ４ａおよびＬＤ４ｂに実装される。つまり、ＲＦＩＣ素子１６，チップコンデンサ１８ａ～１８ｂの各々は、コイルアンテナＣＩＬ１またはスパイラル部のうち最外周の環状パターンにおいて、第１コイル導体ＣＰ１ａおよび線状導体ＣＰ１ｂを跨ぐように、基板１２に実装される。特に、チップコンデンサ１８ａ～１８ｂの各々は、コイルアンテナＣＩＬ１またはスパイラル部のうち最外周の環状パターンにおいてコイルアンテナＣＩＬ１に並列接続される。なお、ＲＦＩＣ素子１６とコイルアンテナＣＩＬ１との接続については、後段で詳述する。 2A and 3A, RFIC element 16 is mounted on lands LD1a, LD2a, LD1b, and LD2b. The chip capacitor 18a for adjusting the resonance frequency is mounted on the lands LD3a and LD3b, and the chip capacitor 18b for adjusting the resonance frequency is mounted on the lands LD4a and LD4b. That is, each of the RFIC element 16 and the chip capacitors 18a to 18b is mounted on the substrate 12 so as to straddle the first coil conductor CP1a and the linear conductor CP1b in the outermost annular pattern of the coil antenna CIL1 or the spiral portion. The In particular, each of the chip capacitors 18a to 18b is connected in parallel to the coil antenna CIL1 in the outermost annular pattern of the coil antenna CIL1 or the spiral portion. The connection between the RFIC element 16 and the coil antenna CIL1 will be described in detail later.
　また、コイルアンテナＣＩＬ１またはスパイラル部のうち最外周の環状パターンには、後述するリード線２４ａおよび２４ｂ（図６参照）がそれぞれ接合される第１パッド導体ＰＤ１ａおよび第２パッド導体ＰＤ１ｂが形成される。第１パッド導体ＰＤ１ａは第１コイル導体ＣＰ１ａと一体形成され、第２パッド導体ＰＤ１ｂは線状導体ＣＰ１ｂと一体形成される。なお、第１パッド導体ＰＤ１ａおよび第２パッド導体ＰＤ１ｂの各々は、パッド電極の一部をなす。 In addition, a first pad conductor PD1a and a second pad conductor PD1b to which lead wires 24a and 24b (see FIG. 6) described later are respectively joined are formed in the outermost annular pattern of the coil antenna CIL1 or the spiral portion. . The first pad conductor PD1a is integrally formed with the first coil conductor CP1a, and the second pad conductor PD1b is integrally formed with the linear conductor CP1b. Note that each of the first pad conductor PD1a and the second pad conductor PD1b forms part of a pad electrode.
　なお、コイルアンテナＣＩＬ１，ランドＬＤ１ａ，ＬＤ１ｂ，ＬＤ２ａ，ＬＤ２ｂ，第１パッド導体ＰＤ１ａ，第２パッド導体ＰＤ１ｂは、銅箔などの金属膜を所定形状にパターニングすることで形成される。また、第１層間接続導体ＴＨ１ａおよび第２層間接続導体ＴＨ１ｂは、穴あけ処理およびメッキ処理によって形成されるスルーホール型の導体である。さらに、リード線２４ａおよび２４ｂは、半田ペーストなどの導電性接合材（図示せず）によって第１パッド導体ＰＤ１ａおよび第２パッド導体ＰＤ１ｂに接合される。 The coil antenna CIL1, lands LD1a, LD1b, LD2a, LD2b, the first pad conductor PD1a, and the second pad conductor PD1b are formed by patterning a metal film such as a copper foil into a predetermined shape. The first interlayer connection conductor TH1a and the second interlayer connection conductor TH1b are through-hole type conductors formed by drilling and plating. Further, the lead wires 24a and 24b are bonded to the first pad conductor PD1a and the second pad conductor PD1b by a conductive bonding material (not shown) such as a solder paste.
　基板１２の上面はレジスト膜１４ａによって部分的に覆われ、基板１２の下面はレジスト膜１４ｂによって全面的に覆われる。基板１２の上面について詳しく説明すると、レジスト膜１４ａは、ランドＬＤ１ａ，ＬＤ２ａ，ＬＤ１ｂ，ＬＤ２ｂが形成された領域の近傍と、第１パッド導体ＰＤ１ａおよび第２パッド導体ＰＤ１ｂが形成された領域の近傍とを除いて、基板１２の上面を覆う。コイルアンテナＣＩＬ１は、こうして形成されたレジスト膜１４ａおよび１４ｂによって保護される。 The upper surface of the substrate 12 is partially covered with a resist film 14a, and the lower surface of the substrate 12 is entirely covered with a resist film 14b. The upper surface of the substrate 12 will be described in detail. The resist film 14a includes the vicinity of the region where the lands LD1a, LD2a, LD1b, and LD2b are formed, and the vicinity of the region where the first pad conductor PD1a and the second pad conductor PD1b are formed. The upper surface of the substrate 12 is covered. The coil antenna CIL1 is protected by the resist films 14a and 14b thus formed.
　図４を参照して、ＲＦＩＣ素子１６は、ＲＦＩＤ信号を処理するＲＦＩＣチップ１６ｃｐとこれを実装する配線基板１６ｂｓとを含んで構成される。配線基板１６ｂｓは、セラミックまたは樹脂を材料として板状に形成される。ＲＦＩＣチップ１６ｃｐは、メモリ回路や信号処理回路を内蔵し、かつ封止樹脂１６ｒｓによって封止される。配線基板１６ｂｓの側面はＸ軸およびＹ軸の各々に直交し、封止樹脂１６ｒｓの側面は配線基板１６ｂｓの側面と面一となる。 Referring to FIG. 4, the RFIC element 16 includes an RFIC chip 16cp for processing an RFID signal and a wiring board 16bs for mounting the RFIC chip 16cp. The wiring board 16bs is formed in a plate shape using ceramic or resin as a material. The RFIC chip 16cp incorporates a memory circuit and a signal processing circuit and is sealed with a sealing resin 16rs. The side surface of the wiring board 16bs is orthogonal to each of the X axis and the Y axis, and the side surface of the sealing resin 16rs is flush with the side surface of the wiring board 16bs.
　配線基板１６ｂｓの下面の四隅には、下部電極ＬＥ１ａ，ＬＥ２ａ，ＬＥ１ｂ，ＬＥ２ｂがそれぞれ設けられる。下部電極ＬＥ１ａは導電性接合材ＰＳ１ａによってランドＬＤ１ａに接続され、下部電極ＬＥ２ａは導電性接合材ＰＳ２ａによってランドＬＤ２ａに接続される。また、下部電極ＬＥ１ｂは導電性接合材ＰＳ１ｂによってランドＬＤ１ｂに接続され、下部電極ＬＥ２ｂは導電性接合材ＰＳ２ｂによってランドＬＤ２ｂに接続される。なお、導電性接合材ＰＳ１ａ，ＰＳ２ａ，ＰＳ１ｂ，ＰＳ２ｂはいずれも、半田ペーストを材料とする。 Lower electrodes LE1a, LE2a, LE1b, LE2b are provided at the four corners of the lower surface of the wiring board 16bs, respectively. The lower electrode LE1a is connected to the land LD1a by the conductive bonding material PS1a, and the lower electrode LE2a is connected to the land LD2a by the conductive bonding material PS2a. The lower electrode LE1b is connected to the land LD1b by the conductive bonding material PS1b, and the lower electrode LE2b is connected to the land LD2b by the conductive bonding material PS2b. The conductive bonding materials PS1a, PS2a, PS1b, and PS2b are all made of solder paste.
　配線基板１６ｂｓの上面の四隅には、上部電極ＵＥ１ａ，ＵＥ２ａ，ＵＥ１ｂ，ＵＥ２ｂがそれぞれ設けられる。上部電極ＵＥ１ａはＺ軸に沿って延びる配線導体ＣＬ１ａによって下部電極ＬＥ１ａと接続され、上部電極ＵＥ２ａはＺ軸に沿って延びる配線導体ＣＬ２ａによって下部電極ＬＥ２ａと接続される。また、上部電極ＵＥ１ｂはＺ軸に沿って延びる配線導体ＣＬ１ｂによって下部電極ＬＥ１ｂと接続され、上部電極ＵＥ２ｂはＺ軸に沿って延びる配線導体ＣＬ２ｂによって下部電極ＬＥ２ｂと接続される。 Upper electrodes UE1a, UE2a, UE1b, UE2b are provided at the four corners of the upper surface of the wiring board 16bs, respectively. The upper electrode UE1a is connected to the lower electrode LE1a by a wiring conductor CL1a extending along the Z axis, and the upper electrode UE2a is connected to the lower electrode LE2a by a wiring conductor CL2a extending along the Z axis. The upper electrode UE1b is connected to the lower electrode LE1b by a wiring conductor CL1b extending along the Z axis, and the upper electrode UE2b is connected to the lower electrode LE2b by a wiring conductor CL2b extending along the Z axis.
　ＲＦＩＣチップ１６ｃｐの下面の四隅には、入出力端子ＴＭ１ａ，ＴＭ２ａ，ＴＭ１ｂ，ＴＭ２ｂがそれぞれ設けられる。入出力端子ＴＭ１ａは上部電極ＵＥ１ａと接続され、入出力端子ＴＭ２ａは上部電極ＵＥ２ａと接続される。また、入出力端子ＴＭ１ａは上部電極ＵＥ１ａと接続され、入出力端子ＴＭ１ａは上部電極ＵＥ１ａと接続される。 Input / output terminals TM1a, TM2a, TM1b, and TM2b are provided at the four corners of the lower surface of the RFIC chip 16cp. The input / output terminal TM1a is connected to the upper electrode UE1a, and the input / output terminal TM2a is connected to the upper electrode UE2a. The input / output terminal TM1a is connected to the upper electrode UE1a, and the input / output terminal TM1a is connected to the upper electrode UE1a.
　ＲＦＩＤタグ１０の等価回路を図５に示す。ＲＦＩＣ素子１６の一方端は、コンデンサＣ１の一方端およびインダクタＬ１の一方端と接続される。また、ＲＦＩＣ素子１６の他方端は、コンデンサＣ１の他方端およびインダクタＬ１の他方端と接続される。なお、インダクタＬ１の一方端はリード線２４ａによって外部回路の一方端と接続され、インダクタＬ１の他方端はリード線２４ｂによって外部回路の他方端と接続される。なお、インダクタＬ１は、コイルアンテナＣＩＬ１のインダクタ成分である。また、コンデンサＣ１は、チップコンデンサ１８ａおよび１８ｂの容量成分である。インダクタＬ１およびコンデンサＣ１の共振周波数は、チップコンデンサ１８ａおよび１８ｂの容量によって規定される。 The equivalent circuit of the RFID tag 10 is shown in FIG. One end of the RFIC element 16 is connected to one end of the capacitor C1 and one end of the inductor L1. The other end of the RFIC element 16 is connected to the other end of the capacitor C1 and the other end of the inductor L1. Note that one end of the inductor L1 is connected to one end of the external circuit by a lead wire 24a, and the other end of the inductor L1 is connected to the other end of the external circuit by a lead wire 24b. The inductor L1 is an inductor component of the coil antenna CIL1. The capacitor C1 is a capacitance component of the chip capacitors 18a and 18b. The resonance frequency of the inductor L1 and the capacitor C1 is defined by the capacitance of the chip capacitors 18a and 18b.
　こうして構成されたＲＦＩＤタグ１０は、図６に示す通信装置２０をなす筐体ＣＳ１に収められる。筐体ＣＳ１には、ＲＦＩＤタグ１０の他に、近距離無線通信を行う通信回路２２が収められる。通信回路２２は、基板２６を有し、さらに基板２６に実装されたＩＣ２８ａ～２８ｃおよび受動素子３０ａ～３０ｅを有する。通信回路２２に設けられた或る端子は、リード線２４ａを介してＲＦＩＤタグ１０の第１パッド導体ＰＤ１ａと接続される。また、通信回路２２に設けられた別の端子は、リード線２４ｂを介してＲＦＩＤタグ１０の第２パッド導体ＰＤ１ｂと接続される。通信回路２２は、ＲＦＩＤタグ１０と協働して、他の通信装置との近距離無線通信を実現する。 The RFID tag 10 thus configured is housed in a casing CS1 that forms the communication device 20 shown in FIG. In addition to the RFID tag 10, the housing CS1 houses a communication circuit 22 that performs short-range wireless communication. The communication circuit 22 includes a substrate 26, and further includes ICs 28a to 28c and passive elements 30a to 30e mounted on the substrate 26. A certain terminal provided in the communication circuit 22 is connected to the first pad conductor PD1a of the RFID tag 10 through a lead wire 24a. Further, another terminal provided in the communication circuit 22 is connected to the second pad conductor PD1b of the RFID tag 10 via the lead wire 24b. The communication circuit 22 implements short-range wireless communication with other communication devices in cooperation with the RFID tag 10.
　なお、図２（Ａ）から分かるように、ＲＦＩＣ素子１６，チップコンデンサ１８ａ～１８ｂは、Ｘ軸方向の負側端部の近傍で基板１２の上面に実装される。したがって、ＲＦＩＤタグ１０は、Ｘ軸方向の正側において良好な指向性が得られる。これを踏まえて、ＲＦＩＤタグ１０は、Ｘ軸方向の正側端部が通信装置２０の端部により近づく姿勢で筐体ＣＳ１に収められる。 As can be seen from FIG. 2A, the RFIC element 16 and the chip capacitors 18a to 18b are mounted on the upper surface of the substrate 12 in the vicinity of the negative side end in the X-axis direction. Therefore, the RFID tag 10 has good directivity on the positive side in the X-axis direction. Based on this, the RFID tag 10 is housed in the housing CS1 in a posture in which the positive side end in the X-axis direction is closer to the end of the communication device 20.
　以上の説明から分かるように、ＲＦＩＤタグ１０を形成する基板１２は、絶縁性を有する。コイルアンテナＣＩＬ１は、基板１２の主面に沿ってスパイラル状に延びるように基板１２に設けられる。つまり、コイルアンテナＣＩＬ１は、環状パターンを複数ターン巻回してなるスパイラル部を有する。ＲＦＩＣ素子１６，チップコンデンサ１８ａ～１８ｂは、コイルアンテナＣＩＬ１の一方端および他方端を跨ぐように基板１２に設けられる。ここで、コイルアンテナＣＩＬ１の一方端および他方端は、コイルアンテナＣＩＬ１またはスパイラル部のうち最外周の環状パターンに設けられる。また、コイルアンテナＣＩＬ１またはスパイラル部のうち最外周の環状パターンには、リード線２４ａおよび２４ｂと接合するための第１パッド導体ＰＤ１ａおよび第２パッド導体ＰＤ１ｂが形成される。 As can be seen from the above description, the substrate 12 on which the RFID tag 10 is formed has an insulating property. The coil antenna CIL1 is provided on the substrate 12 so as to extend spirally along the main surface of the substrate 12. That is, the coil antenna CIL1 has a spiral portion formed by winding an annular pattern a plurality of turns. The RFIC element 16 and the chip capacitors 18a to 18b are provided on the substrate 12 so as to straddle one end and the other end of the coil antenna CIL1. Here, one end and the other end of the coil antenna CIL1 are provided in the outermost annular pattern of the coil antenna CIL1 or the spiral portion. In addition, a first pad conductor PD1a and a second pad conductor PD1b for joining to the lead wires 24a and 24b are formed in the outermost annular pattern of the coil antenna CIL1 or the spiral portion.
　ＲＦＩＣ素子１６，チップコンデンサ１８ａ～１８ｂをコイルアンテナＣＩＬ１またはスパイラル部のうち最外周の環状パターンにおいて基板１２に設け、かつ第１パッド導体ＰＤ１ａおよび第２パッド導体ＰＤ１ｂをコイルアンテナＣＩＬ１またはスパイラル部のうち最外周の環状パターンに形成することで、コイルアンテナＣＩＬ１による磁界形成がＲＦＩＣ素子１６，チップコンデンサ１８ａ～１８ｂ，第１パッド導体ＰＤ１ａ，第２パッド導体ＰＤ１ｂ，リード線２４ａ～２４ｂによって妨げられにくくなる。これによって、十分な通信距離が確保される。 The RFIC element 16 and the chip capacitors 18a to 18b are provided on the substrate 12 in the outermost annular pattern of the coil antenna CIL1 or the spiral part, and the first pad conductor PD1a and the second pad conductor PD1b are provided of the coil antenna CIL1 or the spiral part. By forming the outermost ring pattern, the magnetic field formation by the coil antenna CIL1 is not easily prevented by the RFIC element 16, the chip capacitors 18a to 18b, the first pad conductor PD1a, the second pad conductor PD1b, and the lead wires 24a to 24b. . This ensures a sufficient communication distance.
　また、図７（Ｂ）に示すようにコイルアンテナＣＩＬ１´の内側に引出し用の第１パッド導体ＰＤ１ａ´および第２パッド導体ＰＤ１ｂ´を設けた場合、第１パッド導体ＰＤ１ａ´および第２パッド導体ＰＤ１ｂ´がコイルアンテナＣＩＬ１´の磁界形成を妨げてしまい、通信距離が小さくなってしまうことがある。さらに、ＲＦＩＣ素子１６´，チップコンデンサ１８ａ´～１８ｂ´と第１パッド導体ＰＤ１ａ´および第２パッド導体ＰＤ１ｂ´との配線パターンの引回し方によっては、この配線パターンによってコイルアンテナＣＩＬ１´の電流が妨げられ、負荷変調が不安定となる可能性がある。 As shown in FIG. 7B, when the first pad conductor PD1a ′ and the second pad conductor PD1b ′ are provided inside the coil antenna CIL1 ′, the first pad conductor PD1a ′ and the second pad conductor are provided. PD1b 'may interfere with the magnetic field formation of the coil antenna CIL1', and the communication distance may be reduced. Furthermore, depending on how the wiring pattern of the RFIC element 16 ′, the chip capacitors 18a ′ to 18b ′ and the first pad conductor PD1a ′ and the second pad conductor PD1b ′ is routed, the current of the coil antenna CIL1 ′ may be affected by this wiring pattern. This can interfere with load modulation.
　これに対して、この実施例では、第１パッド導体ＰＤ１ａおよび第２パッド導体ＰＤ１ｂがコイルアンテナＣＩＬ１またはスパイラル部のうち最外周の環状パターンに形成される。これによって、図７（Ａ）に示すように、コイルアンテナＣＩＬ１を流れる電流の向きと逆向きの電流が生じにくくなり、負荷変調の安定化が図られる。 On the other hand, in this embodiment, the first pad conductor PD1a and the second pad conductor PD1b are formed in an annular pattern on the outermost periphery of the coil antenna CIL1 or the spiral portion. As a result, as shown in FIG. 7A, it becomes difficult to generate a current in the direction opposite to the direction of the current flowing through the coil antenna CIL1, thereby stabilizing the load modulation.
　なお、この実施例では、基板１２は、エポキシ樹脂などの熱硬化性樹脂を母材とする硬質の基板である。しかし、ポリイミド樹脂などの可撓性樹脂を母材とする軟質の基板を基板１２として採用するようにしてもよい。 In this embodiment, the substrate 12 is a hard substrate whose base material is a thermosetting resin such as an epoxy resin. However, a soft substrate whose base material is a flexible resin such as polyimide resin may be adopted as the substrate 12.
　また、この実施例では、コイルアンテナＣＩＬ１，ランドＬＤ１ａ，ＬＤ１ｂ，ＬＤ２ａ，ＬＤ２ｂ，第１パッド導体ＰＤ１ａ，第２パッド導体ＰＤ１ｂは、銅箔などの金属膜を所定形状にパターニングすることで形成される。しかし、コイルアンテナＣＩＬ１，ランドＬＤ１ａ，ＬＤ１ｂ，ＬＤ２ａ，ＬＤ２ｂ，第１パッド導体ＰＤ１ａ，第２パッド導体ＰＤ１ｂは、導電性ペーストのスクリーン印刷などによって形成するようにしてもよい。 In this embodiment, the coil antenna CIL1, the lands LD1a, LD1b, LD2a, LD2b, the first pad conductor PD1a, and the second pad conductor PD1b are formed by patterning a metal film such as a copper foil into a predetermined shape. . However, the coil antenna CIL1, the lands LD1a, LD1b, LD2a, LD2b, the first pad conductor PD1a, and the second pad conductor PD1b may be formed by screen printing of a conductive paste.
　さらに、この実施例では、第１層間接続導体ＴＨ１ａおよび第２層間接続導体ＴＨ１ｂは、穴あけ処理およびメッキ処理によるスルーホール型の導体である。しかし、第１層間接続導体ＴＨ１ａおよび第２層間接続導体ＴＨ１ｂは、穴あけ処理および導電材充填処理によるビアホール型の導体であってもよい。 Furthermore, in this embodiment, the first interlayer connection conductor TH1a and the second interlayer connection conductor TH1b are through-hole type conductors formed by drilling and plating. However, the first interlayer connection conductor TH1a and the second interlayer connection conductor TH1b may be via-hole type conductors formed by a drilling process and a conductive material filling process.
　また、この実施例では、コイルアンテナＣＩＬ１は、基板１２の上面に形成された第１コイル導体ＣＰ１ａ，線状導体ＣＰ１ｂと基板１２の下面に形成された第２コイル導体ＣＰ２とを第１層間接続導体ＴＨ１ａ，第２層間接続導体ＴＨ１ｂによって接続してなる２層スパイラル型のコイルである。しかし、これに代えて、１層スパイラル型または３層以上のスパイラル型のコイルアンテナを基板１２に設けるようにしてもよい。さらに、この実施例では、コイルアンテナＣＩＬ１のターン数は３ターンであるが、ターン数は２ターンや４ターン以上であってもよい。
［実施例２］ In this embodiment, the coil antenna CIL1 includes a first interlayer connection between the first coil conductor CP1a and the linear conductor CP1b formed on the upper surface of the substrate 12 and the second coil conductor CP2 formed on the lower surface of the substrate 12. This is a two-layer spiral type coil connected by a conductor TH1a and a second interlayer connection conductor TH1b. However, instead of this, a single-layer spiral type or three or more-layer spiral type coil antenna may be provided on the substrate 12. Furthermore, in this embodiment, the number of turns of the coil antenna CIL1 is 3, but the number of turns may be 2 turns or 4 turns or more.
[Example 2]
　他の実施例のＲＦＩＤタグ１０を構成する基板１２を図８（Ａ）～図８（Ｂ）に示す。図３（Ａ）～図３（Ｂ）と対比すれば分かるように、ランドＬＤ５が線状導体ＣＰ１ｂに追加的に一体形成される。より詳しくは、ランドＬＤ５は、ランドＬＤ４ｂよりもＹ軸方向のやや負側の位置に形成される。また、第２コイル導体ＣＰ２の他方端は、Ｚ軸方向から眺めてランドＬＤ５と重なる位置にまで延びる。第２層間接続導体ＴＨ１ｂはこの重複位置において基板１２を貫通し、第２コイル導体ＣＰ２および線状導体ＣＰ１ｂは第２層間接続導体ＴＨ１ｂによって互いに接続される。第１パッド導体ＰＤ１ａおよび第２パッド導体ＰＤ１ｂの形成位置は、図３（Ａ）～図３（Ｂ）に示す基板１２と図８（Ａ）～図８（Ｂ）に示す基板１２との間で一致する。 8A to 8B show a substrate 12 constituting an RFID tag 10 of another embodiment. As can be seen from comparison with FIGS. 3A to 3B, the land LD5 is additionally formed integrally with the linear conductor CP1b. More specifically, the land LD5 is formed at a slightly negative position in the Y-axis direction from the land LD4b. The other end of the second coil conductor CP2 extends to a position overlapping the land LD5 when viewed from the Z-axis direction. The second interlayer connection conductor TH1b penetrates the substrate 12 at this overlapping position, and the second coil conductor CP2 and the linear conductor CP1b are connected to each other by the second interlayer connection conductor TH1b. The formation positions of the first pad conductor PD1a and the second pad conductor PD1b are between the substrate 12 shown in FIGS. 3A to 3B and the substrate 12 shown in FIGS. 8A to 8B. Match.
　ランドＬＤ５がランドＬＤ４ｂと第２パッド導体ＰＤ１ｂとの間に設けられ、第２層間接続導体ＴＨ１ｂがランドＬＤ５に設けられることから、見方によっては、第２パッド導体ＰＤ１ｂが配線導体ＣＬ１１を介して線状導体ＣＰ１ｂの他方端近傍に接続されていると言える。 Since the land LD5 is provided between the land LD4b and the second pad conductor PD1b and the second interlayer connection conductor TH1b is provided on the land LD5, the second pad conductor PD1b may be connected to the line via the wiring conductor CL11. It can be said that it is connected near the other end of the conductor CP1b.
　この結果、第２層間接続導体ＴＨ１ｂを経て線状導体ＣＰ１ｂに流入した電流は、ランドＬＤ１ｂ～ＬＤ３ｂ側と第２パッド導体ＰＤ１ｂ側とに分岐する。この分岐は、通信距離を短くし、かつ負荷変調を不安定とする可能性がある。しかし、この実施例では、第２パッド導体ＰＤ１ｂから離れた位置に第２層間接続導体ＴＨ１ｂ（またはスルーホール）が形成されるため、リード線２４ｂを第２パッド導体ＰＤ１ｂに接合する際の作業性が向上する。
［実施例３］ As a result, the current flowing into the linear conductor CP1b through the second interlayer connection conductor TH1b branches to the lands LD1b to LD3b side and the second pad conductor PD1b side. This branching may shorten the communication distance and make the load modulation unstable. However, in this embodiment, since the second interlayer connection conductor TH1b (or through-hole) is formed at a position away from the second pad conductor PD1b, workability when joining the lead wire 24b to the second pad conductor PD1b. Will improve.
[Example 3]
　その他の実施例のＲＦＩＤタグ１０を構成する基板１２を図９（Ａ）～図９（Ｂ）に示す。図３（Ａ）～図３（Ｂ）と対比すれば分かるように、第３パッド導体ＰＤ２ａおよび第４パッド導体ＰＤ２ｂが、基板１２の下面に追加的に形成される。Ｚ軸方向から眺めたとき、第３パッド導体ＰＤ２ａは第１パッド導体ＰＤ１ａと重なり、第４パッド導体ＰＤ２ｂは第２パッド導体ＰＤ１ｂと重なる。なお、第３パッド導体ＰＤ２ａおよび第４パッド導体ＰＤ２ｂの各々もまた、パッド電極の一部をなす。 9A to 9B show a substrate 12 constituting the RFID tag 10 of another embodiment. As can be seen from comparison with FIGS. 3A to 3B, a third pad conductor PD2a and a fourth pad conductor PD2b are additionally formed on the lower surface of the substrate 12. When viewed from the Z-axis direction, the third pad conductor PD2a overlaps the first pad conductor PD1a, and the fourth pad conductor PD2b overlaps the second pad conductor PD1b. Each of the third pad conductor PD2a and the fourth pad conductor PD2b also forms part of the pad electrode.
　第３層間接続導体ＴＨ２は、第３パッド導体ＰＤ２ａと重なる位置で基板１２を貫通する。したがって、第１パッド導体ＰＤ１ａおよび第３パッド導体ＰＤ２ａは、第３層間接続導体ＴＨ２によって互いに接続される。なお、第４パッド導体ＰＤ２ｂは、第２層間接続導体ＴＨ１ｂによって第２パッド導体ＰＤ１ｂと接続される。 The third interlayer connection conductor TH2 penetrates the substrate 12 at a position overlapping the third pad conductor PD2a. Therefore, the first pad conductor PD1a and the third pad conductor PD2a are connected to each other by the third interlayer connection conductor TH2. The fourth pad conductor PD2b is connected to the second pad conductor PD1b by the second interlayer connection conductor TH1b.
　こうして第３パッド導体ＰＤ２ａおよび第４パッド導体ＰＤ２ｂを追加的に形成することで、リード線２４ａおよび２４ｂは、基板１２の上面および下面のいずれにも接合することができる。これによって、設計の自由度が向上する。
［実施例４］ By additionally forming the third pad conductor PD2a and the fourth pad conductor PD2b in this manner, the lead wires 24a and 24b can be bonded to both the upper surface and the lower surface of the substrate 12. This improves the degree of design freedom.
[Example 4]
　さらにその他の実施例のＲＦＩＤタグ１０を構成する基板１２を図１０（Ａ）～図１０（Ｂ）に示す。図９（Ａ）～図９（Ｂ）と対比すれば分かるように、第１パッド導体ＰＤ１ａおよび第２パッド導体ＰＤ１ｂが省略される。リード線２４ａおよび２４ｂは、基板１２の下面に接合されることとなる。これによって、リード線２４ａおよび２４ｂを半田付けする際に、半田ゴテ）がＲＦＩＣ素子１６，チップコンデンサ１８ａ，１８ｂに当たりにくくなる。この結果、作業性が向上するとともに、ＲＦＩＣ素子１６，チップコンデンサ１８ａ，１８ｂの位置ずれが防止される。 Further, the substrate 12 constituting the RFID tag 10 of another embodiment is shown in FIGS. 10 (A) to 10 (B). As can be seen from comparison with FIGS. 9A to 9B, the first pad conductor PD1a and the second pad conductor PD1b are omitted. The lead wires 24 a and 24 b are bonded to the lower surface of the substrate 12. This makes it difficult for the soldering iron) to hit the RFIC element 16 and the chip capacitors 18a and 18b when the lead wires 24a and 24b are soldered. As a result, workability is improved and positional deviation of the RFIC element 16 and the chip capacitors 18a and 18b is prevented.
　なお、第３パッド導体ＰＤ２ａおよび第４パッド導体ＰＤ２ｂは、図８（Ａ）～図８（Ｂ）に示す基板１２に追加的に形成するようにしてもよい。 The third pad conductor PD2a and the fourth pad conductor PD2b may be additionally formed on the substrate 12 shown in FIGS. 8A to 8B.
　また、図２に示すＲＦＩＤタグ１０では、レジスト膜１４ａは、第１コイル導体ＣＰ１ａの一部（第１パッド導体ＰＤ１ａの周辺）および線状導体ＣＰ１ｂの一部（第２パッド導体ＰＤ１ｂの周辺）をも回避するように、基板１２の上面に形成される。しかし、図１１（Ａ）～図１１（Ｂ）に示すように、第１パッド導体ＰＤ１ａおよび第２パッド導体ＰＤ１ｂを除いて、基板１２の上面の全域にレジスト膜１４ａを形成するようにしてもよい。これによって、第２層間接続導体ＴＨ１ｂがレジスト膜１４ａによって覆われ、リード線２４ｂを第２パッド導体ＰＤ１ｂに接合する際の作業性が向上する。 In the RFID tag 10 shown in FIG. 2, the resist film 14a includes a part of the first coil conductor CP1a (around the first pad conductor PD1a) and a part of the linear conductor CP1b (around the second pad conductor PD1b). Is formed on the upper surface of the substrate 12. However, as shown in FIGS. 11A to 11B, the resist film 14a may be formed over the entire upper surface of the substrate 12 except for the first pad conductor PD1a and the second pad conductor PD1b. Good. Thereby, the second interlayer connection conductor TH1b is covered with the resist film 14a, and the workability when the lead wire 24b is joined to the second pad conductor PD1b is improved.
　また、本発明のＲＦＩＤタグは、例えばＮＦＣシステムのように、カードエミュレーション（Card Emulation）機能、リーダライタ（Reader/Writer）機能、端末間通信（Ｐ２Ｐ）機能を有していてもよい。 Also, the RFID tag of the present invention may have a card emulation (Card 、 Emulation) function, a reader / writer function, and a terminal-to-terminal communication (P2P) function as in an NFC system, for example.
　１０　…ＲＦＩＤタグ
　１，１２　…基板
　ＣＩＬ０，ＣＩＬ１　…コイルアンテナ
　３，１６　…ＲＦＩＣ素子
　５ａ，５ｂ，２４ａ，２４ｂ　…リード線
　ＣＰ０ａ，ＣＰ１ａ　…第１コイル導体
　ＣＰ２　…第２コイル導体
　ＣＰ０ｂ，ＣＰ１ｂ　…線状導体
　ＴＨ０ａ，ＴＨ１ａ　…第１層間接続導体
　ＴＨ０ｂ，ＴＨ１ｂ　…第２層間接続導体
　ＴＨ２　…第３層間接続導体
　ＰＤ０ａ，ＰＤ１ａ　…第１パッド導体（パッド電極の一部）
　ＰＤ０ｂ，ＰＤ１ｂ　…第２パッド導体（パッド電極の一部）
　ＰＤ２ａ　…第３パッド導体（パッド電極の一部）
　ＰＤ２ｂ　…第４パッド導体（パッド電極の一部）
　ＣＬ１１　…配線導体
　４ａ，４ｂ，１８ａ，１８ｂ　…チップコンデンサ
　２０　…通信装置
　２２　…通信回路 DESCRIPTION OF SYMBOLS 10 ... RFID tag 1,12 ... Board | substrate CIL0, CIL1 ... Coil antenna 3,16 ... RFIC element 5a, 5b, 24a, 24b ... Lead wire CP0a, CP1a ... 1st coil conductor CP2 ... 2nd coil conductor CP0b, CP1b ... line -Shaped conductors TH0a, TH1a ... 1st interlayer connection conductor TH0b, TH1b ... 2nd interlayer connection conductor TH2 ... 3rd interlayer connection conductor PD0a, PD1a ... 1st pad conductor (a part of pad electrode)
PD0b, PD1b ... 2nd pad conductor (a part of pad electrode)
PD2a Third pad conductor (part of pad electrode)
PD2b 4th pad conductor (part of pad electrode)
CL11: Wiring conductors 4a, 4b, 18a, 18b ... Chip capacitor 20 ... Communication device 22 ... Communication circuit

Claims (7)

  1. 　環状パターンを複数ターン巻回してなるスパイラル部を有するコイルアンテナと、
    　２つの入出力端子を有するＲＦＩＣ素子と、
    を備えるＲＦＩＤタグであって、
    　前記コイルアンテナの前記一方端および前記他方端は前記スパイラル部のうち最外周の環状パターンに設けられ、前記ＲＦＩＣ素子の前記２つの入出力端子は前記一方端および前記他方端にそれぞれ接続されており、
    　前記スパイラル部のうち前記最外周の環状パターンには、リード線と接合するためのパッド電極がさらに形成されている、
    ことを特徴とするＲＦＩＤタグ。     A coil antenna having a spiral portion formed by winding a circular pattern a plurality of turns;
    An RFIC element having two input / output terminals;
    An RFID tag comprising:
    The one end and the other end of the coil antenna are provided in an outermost annular pattern in the spiral portion, and the two input / output terminals of the RFIC element are connected to the one end and the other end, respectively. ,
    A pad electrode for joining to a lead wire is further formed in the outermost annular pattern of the spiral portion.
    An RFID tag characterized by the above.
  2. 　前記スパイラル部は、基板の一方主面にスパイラル状に形成された第１コイル導体と、前記基板の他方主面にスパイラル状に形成された第２コイル導体と、前記第１コイル導体の一方端および前記第２コイル導体の一方端を互いに接続する第１層間接続導体と、前記第１コイル導体の他方端および前記第２コイル導体の他方端を互いに接続する第２層間接続導体とを含む、請求項１記載のＲＦＩＤタグ。 The spiral portion includes a first coil conductor formed in a spiral shape on one main surface of the substrate, a second coil conductor formed in a spiral shape on the other main surface of the substrate, and one end of the first coil conductor. And a first interlayer connection conductor that connects one end of the second coil conductor to each other, and a second interlayer connection conductor that connects the other end of the first coil conductor and the other end of the second coil conductor to each other, The RFID tag according to claim 1.
  3. 　前記パッド電極は、前記第１コイル導体に接続された第１パッド導体および第２パッド導体を含む、請求項２記載のＲＦＩＤタグ。 The RFID tag according to claim 2, wherein the pad electrode includes a first pad conductor and a second pad conductor connected to the first coil conductor.
  4. 　前記第２パッド導体は平面視して前記第２層間接続導体と重なる位置に設けられる、請求項３記載のＲＦＩＤタグ。 The RFID tag according to claim 3, wherein the second pad conductor is provided at a position overlapping the second interlayer connection conductor in plan view.
  5. 　前記スパイラル部のうち前記最外周の環状パターンの一部に前記基板を貫通する第３層間接続導体をさらに備え、
    　前記パッド電極は、前記基板の他方主面に形成されかつ前記第３層間接続導体を介して前記第１パッド導体と接続された第３パッド導体と、前記基板の他方主面に形成されかつ前記第２接続導体を介して前記第２パッド導体と接続された第４パッド導体とを含む、請求項２ないし４のいずれかに記載のＲＦＩＤタグ。     A third interlayer connection conductor penetrating the substrate in a part of the outermost annular pattern of the spiral portion;
    The pad electrode is formed on the other main surface of the substrate, and is formed on the other main surface of the substrate, and a third pad conductor formed on the other main surface of the substrate and connected to the first pad conductor via the third interlayer connection conductor. The RFID tag according to claim 2, further comprising a fourth pad conductor connected to the second pad conductor via a second connection conductor.
  6. 　前記スパイラル部のうち前記最外周の環状パターンに前記コイルアンテナに並列接続されたチップコンデンサをさらに備える、請求項１ないし５のいずれかに記載のＲＦＩＤタグ。 The RFID tag according to any one of claims 1 to 5, further comprising a chip capacitor connected in parallel to the coil antenna on the outermost annular pattern in the spiral portion.
  7. 　ＲＦＩＤタグと、前記ＲＦＩＤタグに接続された他の通信回路と、を備える通信装置であって、
    　前記ＲＦＩＤタグは、環状パターンを複数ターン巻回してなるスパイラル部を有するコイルアンテナと、２つの入出力端子を有するＲＦＩＣ素子と、を備え、
    　前記コイルアンテナの前記一方端および前記他方端は前記スパイラル部のうち最外周の環状パターンに設けられ、前記ＲＦＩＣ素子の前記２つの入出力端子は前記一方端および前記他方端にそれぞれ接続されており、
    　前記コイルアンテナの前記最外周の環状パターンには、リード線と接合するためのパッド電極がさらに形成されており、
    　前記他の通信回路は前記リード線を介して前記ＲＦＩＤタグと接続される、通信装置。     A communication device comprising an RFID tag and another communication circuit connected to the RFID tag,
    The RFID tag includes a coil antenna having a spiral portion formed by winding a circular pattern a plurality of turns, and an RFIC element having two input / output terminals,
    The one end and the other end of the coil antenna are provided in an outermost annular pattern in the spiral portion, and the two input / output terminals of the RFIC element are connected to the one end and the other end, respectively. ,
    The outermost annular pattern of the coil antenna is further formed with a pad electrode for joining with a lead wire,
    The communication device, wherein the other communication circuit is connected to the RFID tag via the lead wire.
PCT/JP2015/061356 2014-05-21 2015-04-13 Rfid tag and communication device provided with same WO2015178127A1 (en)

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JP2017102028A (en) * 2015-12-02 2017-06-08 株式会社村田製作所 Moisture detection rfid tag and diaper
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