JP2012248154A - Rfid tag and communication device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an RFID tag capable of efficiently suppressing and preventing heat from directly transferring to an RFIC chip when a lead wire is soldered to a lead-out wiring pad, and having small size and high reliability; and a communication device using the RFID tag.SOLUTION: An RFID tag A1 includes: an insulation base material 10; an antenna pattern 14 formed on the insulation base material 10; an RFIC chip 1 mounted at a position close to one end portion of the insulation base material 10; and a lead-out wiring pad 13 connected to the RFIC chip 1, arranged at a position close to the other end portion of the insulation base material 10, and to which a lead-out wiring lead wire 3 is soldered. In the RFID tag A1, a chip type heat-resistant protective element 2 is mounted on a virtual straight line connecting the RFIC chip 1 and the lead-out wiring pad 13. As the chip type heat-resistant protective element 2, a chip type ceramic capacitor arranged in parallel with the antenna pattern 14 and functioning as a synchronization capacitor of resonance frequency is used.

Description

  The present invention relates to an RFID tag and a communication device used in an RFID system, and more specifically, an RFID tag used for wirelessly communicating with a reader / writer in a contactless manner and transmitting information to / from the reader / writer, and the same The present invention relates to a communication device.

2. Description of the Related Art In recent years, RFID systems that perform wireless communication between a reader / writer and an RFID (Radio Frequency Identification) tag in a non-contact manner and transmit information between the reader / writer and the RFID tag have become widespread.
As this RFID system, an HF band RFID system using a 13 MHz band and a UHF band RFID system using a 900 MHz band are generally used.

  As RFID tags used in the HF band RFID system, for example, Patent Document 1 and Patent Document 2 include an RFIC (Radio-Frequency Integrated Circuits) chip for processing high-frequency signals and a coil for transmitting and receiving radio signals. An RFID tag having a rectangular antenna has been proposed.

  By the way, in recent years, in order to write data directly to the RFIC chip or to read data directly from the RFIC chip, an RFID wiring pad may be provided on the RFID tag. That is, by installing an RFID tag inside a communication device and connecting it to another circuit inside the housing, data can be directly written to or read from the RFIC chip. In some cases, the configuration is as follows.

In this case, direct (DC-like) connection with other circuits via the lead wiring pads is typically performed by a method of soldering lead wires.
However, in the case of the method of soldering the lead wire to the lead-out wiring pad provided on the RFID tag, the mounted RFIC chip may be thermally damaged because the RFID tag is exposed to heat at the time of soldering. .
If the RFIC chip is thermally damaged, the operation as the original RFIC chip may become unstable or impossible. In addition, the connection reliability with the antenna may be reduced.

  On the other hand, it is conceivable to cover the RFIC chip with a heat-resistant protective material only in the soldering process so that heat is not transmitted to the RFIC chip during soldering. However, there is a problem that a process for removing it is necessary, the manufacturing process becomes complicated, and the cost increases.

  Further, as a method of connecting without requiring soldering so that the RFIC chip is not thermally damaged, a method of mounting a connector on the RFID tag is conceivable. However, when the connector is mounted, the RFID tag becomes large. There is a problem.

  Furthermore, in the method of providing a connector on an RFID tag, there is a problem in that the electrical characteristics of an antenna (particularly a coil antenna) are adversely affected depending on the position where the connector is disposed.

JP 2002-42083 A JP 2002-175511 A

    The present invention has been made in order to solve the above-described problems, and includes a lead-out wiring pad, and suppresses heat from being directly transferred to the RFIC chip when soldering a lead wire to the pad. An object of the present invention is to provide a small and highly reliable RFID tag configured so as to be able to be prevented, and a communication device using the RFID tag.

In order to achieve the above object, an RFID tag according to the present invention (Claim 1) includes:
An insulating substrate having a main surface;
An antenna pattern formed on the insulating substrate;
An RFIC chip connected to the antenna pattern and mounted at a position near one end on the main surface of the insulating substrate;
A lead-out wiring pad connected to the RFIC chip and disposed at a position near the other end on the main surface of the insulating substrate, to which a lead-out lead wire is soldered;
And a chip-type heat-resistant protection element mounted on a virtual straight line connecting the RFIC chip and the lead-out wiring pad on the main surface.

  In the RFID tag of the present invention, it is preferable that the chip-type heat-resistant protective element has a height equal to or higher than that of the RFIC chip.

In addition, it is preferable that the chip-type heat-resistant protective element is arranged in such a manner that all virtual straight lines passing through a region where the RFIC chip and the lead-out wiring pad face each other are blocked.
In this case, as the chip-type heat-resistant protective element, one chip-type heat-resistant protective element having a width equal to or larger than that of the RFIC chip (a dimension in a direction perpendicular to the virtual line) may be used. By using a single chip-type heat-resistant protective element, the chip-type heat-resistant protective element may be positioned between the RFIC chip and the lead-out wiring pad in the entire region in the width direction (direction perpendicular to the virtual line). Good.

  Moreover, it is preferable that the chip-type heat-resistant protective element is disposed at a position closer to the RFIC chip than the lead-out wiring pad.

  The chip-type heat-resistant protective element is preferably a chip-type ceramic component having a ceramic body.

  The chip-type ceramic component is preferably a chip-type ceramic capacitor that is disposed in parallel with the antenna pattern when viewed from the RFIC chip and functions as a resonance frequency tuning capacitor.

  The insulating substrate has a longitudinal direction when viewed in plan, the RFIC chip is disposed on one end side in the longitudinal direction, and the lead-out wiring pad is disposed on the other end side in the longitudinal direction. It is preferable that they are arranged.

  Moreover, it is preferable that the said insulating base material is a flexible insulating base material.

  The communication device of the present invention is a communication device including an RFID tag connected to another circuit via a lead wiring lead wire, and the present invention (any one of claims 1 to 8) is used as the RFID tag. The invention is characterized in that an RFID tag according to the present invention is used.

An RFID tag according to the present invention (Claim 1) has an RFIC chip mounted at a position near one end on the main surface of an insulating substrate, and a lead wiring pad is disposed at a position near the other end. In addition, since the chip-type heat-resistant protective element is mounted on the virtual straight line connecting the RFIC chip and the lead wiring pad, the lead wiring lead wire (hereinafter simply referred to as “lead wire”) to the lead wiring pad. It is possible to suppress or prevent the heat during soldering) from being directly transferred to the RFIC chip, and a highly reliable RFID tag can be obtained.
As the chip-type heat-resistant protective element, it is preferable to use a chip-type ceramic capacitor or the like used in the circuit constituting the RFID tag as the chip-type heat-resistant protective element, but the lead wire solder to the lead-out wiring pad A chip-type ceramic component (particularly a component that is not a circuit element for configuring the RFID tag) prepared for the purpose of suppressing heat during attachment to the RFIC chip may be mounted.

  In addition, by using a chip-type heat-resistant protective element having a height equal to or higher than that of the RFIC chip as the chip-type heat-resistant protective element, it is possible to effectively suppress the heat during soldering from being transmitted to the RFIC chip. Therefore, the present invention can be made more effective.

  Further, by providing a chip-type heat-resistant protective element in such a manner that all virtual straight lines passing through the region where the RFIC chip and the lead-out wiring pad face each other are shielded, leads to the lead-out wiring pad are provided. It is possible to more effectively suppress and prevent the heat at the time of wire soldering from being transmitted to the RFIC chip, and the present invention can be further effectively realized.

  In addition, by disposing the chip-type heat-resistant protective element closer to the RFIC chip than the lead-out wiring pad, the heat generated when the lead wire is soldered to the lead-out wiring pad flows around the chip-type heat-resistant protective element. Therefore, it is possible to suppress the transmission to the RFIC chip and to provide a more reliable RFID tag. In addition, when the chip-type heat-resistant protective element is disposed in the vicinity of the RFIC chip, particularly when the chip-type heat-resistant protective element is higher than the RFIC chip, other members may drop or approach from above. In this case, the RFIC chip 1 can be prevented from being damaged by them.

  For example, a chip-type ceramic component having a ceramic body such as a multilayer ceramic capacitor is excellent in heat resistance, and can be suitably used as a chip-type heat-resistant protective element.

  In addition, when a chip-type ceramic capacitor that is arranged in parallel with the antenna pattern and functions as a resonance frequency tuning capacitor is used as a chip-type heat-resistant protective element, an RFID without using a chip-type heat-resistant protective element is prepared. With only the components used for the tag, it is possible to effectively suppress the heat transmitted to the RFIC chip when soldering the lead wire to the lead wiring pad, and to obtain a highly reliable RFID tag It becomes possible and is particularly meaningful.

  In addition, an insulating substrate having a longitudinal direction when viewed in plan is used, the RFIC chip is disposed on one end side in the longitudinal direction of the insulating substrate, and the lead-out wiring pad is disposed on the other end side in the longitudinal direction. It is possible to secure a large distance between the RFIC chip and the lead-out wiring pad with respect to the planar area of the entire RFID tag, and when the lead wire is soldered to the lead-out wiring pad. It is possible to more reliably suppress heat from being transmitted to the RFIC chip.

  In addition, by using a flexible insulating base material that can be bent or rounded as the insulating base material, the position can be freely selected, for example, when it is attached to a housing or the like constituting a communication device. It is possible to provide an RFID tag that is highly flexible and easy to handle.

  In addition, by using the RFID tag according to the present invention (the invention according to any one of claims 1 to 8) in a communication device including an RFID tag connected to another circuit via a lead wire for lead wiring, Data can be directly written to and read from the RFIC chip, and a small and highly reliable communication device can be provided.

Configuration of insulating base material constituting RFID tag according to embodiment (first embodiment) of the present invention, that is, insulating base material in which antenna pattern, lead-out wiring pad, component mounting pad, etc. are arranged (A) is a top view, (b) is a front view. FIG. 2 is a view showing an RFID tag according to an embodiment of the present invention in which a resist pattern is formed on the insulating base shown in FIG. 1 and an RFIC chip and a chip-type heat-resistant protective element (chip-type ceramic capacitor) are mounted. (A) is a plan view and (b) is a front view. FIGS. 3A and 3B are diagrams illustrating a state where lead wires for lead-out wiring are soldered to the RFID tag of FIG. 2, wherein (a) is a plan view and (b) is a front view. It is a figure which shows the equivalent circuit of the RFID tag concerning one Example of this invention. It is an exploded top view which shows the structure of the RFID tag concerning the other Example (Example 2) of this invention. It is a perspective view which shows the structure of the RFID tag concerning further another Example (Example 3) of this invention. It is sectional drawing which shows the structure of the communication apparatus concerning the Example (Example 4) of this invention.

  Embodiments of the present invention will be described below to describe the features of the present invention in more detail.

  An RFID tag according to the present invention includes an RFIC chip mounted on an insulating substrate, an antenna pattern formed on the insulating substrate, and a lead-out wiring pad formed on the surface of the insulating substrate. .

  The antenna pattern is connected to the input / output terminals of the RFIC chip, and the lead-out wiring pads are also connected to the input / output terminals of the RFIC chip. The RFIC chip is disposed at a position near one end of the insulating substrate, and the lead-out wiring pad is disposed at a position near the other end of the insulating substrate.

  The RFIC chip is a logic circuit for recording information such as an identification code, and a logic for processing a high-frequency signal sent from a communication partner (reader / writer) and generating a response signal to the communication partner. It has a circuit etc.

  The antenna pattern functions as a radiating element. For example, in the case of a tag for an HF band RFID system, a coiled conductor pattern can be used. In the case of a UHF band RFID system tag, a dipole conductor pattern can be used.

  The lead-out wiring pad is a pad to which a lead-out lead wire or the like is joined with a heat treatment such as soldering, for writing data directly to the RFIC chip or directly from the RFIC chip. It functions as an external connection pad for reading out.

  A chip-type heat-resistant protective element is mounted on a virtual straight line connecting the RFIC chip and the lead wiring pad. This chip-type heat-resistant protective element is an element that has at least higher heat resistance than an RFIC chip, and is particularly an element that is stable against heat generated when soldering a lead wire to a lead-out wiring pad.

  As described above, in an RFID tag having a lead wiring pad to be soldered, a lead type heat protection element is mounted on a virtual straight line connecting the RFIC chip and the lead wiring pad so that the lead wiring can be used during soldering. It is possible to block the heat that is transmitted directly from the pad for use to the RFIC chip by the chip-type heat-resistant protective element. As a result, the RFIC chip is less likely to be damaged (thermal damage) due to heat when soldering the lead wire to the lead-out wiring pad. It becomes possible to obtain without requiring a complicated structure.

  Usually, the RFIC chip is based on a silicon semiconductor, and its heat resistance is about 200 to 300 ° C. The chip-type heat-resistant protective element preferably has higher heat resistance than this, and is particularly preferably a chip-type ceramic component having a ceramic body. Further, the chip-type ceramic component is preferably disposed at a position closer to the RFIC chip than the lead-out wiring pad, and is preferably disposed adjacent to the RFIC chip.

  As this chip-type heat-resistant protective element (chip-type ceramic component), it is possible to use a chip-type ceramic capacitor that is arranged in parallel with the antenna pattern when viewed from the RFIC chip and functions as a resonance frequency tuning capacitor. is there.

  However, the chip-type ceramic component is not limited to the tuning capacitor connected in parallel to the antenna pattern (antenna coil). For example, it is a matching circuit element for matching the impedance between the RFIC chip and the antenna pattern. Also good. That is, one or a plurality of circuit elements for configuring the RFID tag can be arranged as chip-type heat-resistant protection elements (chip-type ceramic parts) on a virtual straight line connecting the RFIC chip and the lead-out wiring pad. However, the present invention provides a chip-type ceramic component (particularly an RFID tag) prepared as a chip-type heat-resistant protective element for the purpose of suppressing the heat transmitted to the RFIC chip when soldering the lead wire to the lead-out wiring pad. It is not excluded to use a component that is not a circuit element for constructing.

  This chip-type heat-resistant protective element is preferably arranged in such a manner that the side surface of the RFIC chip cannot be seen at all from the lead-out wiring pad side. For this purpose, the chip-type heat-resistant protective element preferably has a height and width equal to or greater than those of the RFIC chip.

  In order to prevent the side surface of the RFIC chip from being seen from the lead wiring pad side in the width direction, not only a single chip-type heat-resistant protective element having a large width is used, but also a plurality of chip-type heat-resistant protective elements are used. By arranging them side by side, it is also possible to configure the side surfaces of the RFIC chip not to be seen from the lead-out wiring pad side in all regions in the width direction.

  As described above, it is preferable that the chip-type heat-resistant protective element has a height and width such that the side surface of the RFIC chip cannot be seen at all from the lead-out wiring pad side, or a plurality of chip-type heat-resistant protective elements are provided. The configuration may be such that a part of the side surface of the RFIC chip can be seen. Even when there is a part that is not blocked, it is possible to suppress the radiant heat during soldering from being transmitted to the RFIC chip by the amount blocked by the chip-type heat-resistant protective element.

  In other words, the RFID tag of the present invention only needs to be configured so that the heat transferred to the RFIC chip during soldering is blocked by the chip-type heat-resistant protective element to such an extent that the RFIC chip is not damaged.

  The planar shape of the insulative base material is usually a rectangular shape, but is an astigmatic shape having a major axis and a minor axis when viewed in plan (for example, the planar shape is rectangular). Is preferred. In this case, it is possible to secure a large distance between the RFIC chip and the lead-out wiring pad by arranging the RFIC chip on one end of the long axis and the lead-out wiring pad on the other end of the long axis. Therefore, it is possible to more reliably suppress the heat transmitted to the RFIC chip when soldering the lead wire to the lead-out wiring pad.

  The insulating base material may be a resin base material such as a thermoplastic resin or a thermosetting resin, and is made of a ceramic material such as LTCC that can be sintered at a low temperature (ceramic base material). ).

In particular, when the insulating base material is a flexible insulating base material using a flexible thermoplastic resin, even if external stress is applied to the RFID tag, it deforms and absorbs the stress, and cracks and chips are generated. It can be avoided.
Therefore, it is preferable to use the flexible insulating substrate as described above as the insulating substrate.
The antenna pattern is made of a conductive material whose main component is silver or copper.

  The RFID tag of the present invention is suitable for an HF band RFID system using a 13 MHz band, but is also used for a UHF band RFID system using a 900 MHz band, and further an RFID system using a higher frequency band. be able to.

  The present invention is also directed to a communication device including an RFID tag connected to another circuit via a lead wiring lead wire. In the communication device of the present invention, since the RFID tag of the present invention is used as the RFID tag, it is possible to directly write data to the RFIC chip and to read data from the RFIC chip. A small and highly reliable communication device can be provided.

As a configuration of the communication device, an RFID tag is attached to the inside of the housing constituting the communication device or on the front side, and the lead wire for the lead wiring soldered to the lead wiring pad is placed inside the housing. A configuration in which the circuit is connected to another circuit provided in the housed printed wiring board is exemplified. Examples of such communication devices include communication terminals such as mobile phones.
Hereinafter, the present invention will be described more specifically with reference to examples of the present invention.

  1 (a) and 1 (b) are diagrams showing the configuration of an insulating substrate constituting an RFID tag according to one embodiment (Example 1) of the present invention, and FIGS. 2 (a) and 2 (b) It is a figure which shows the RFID tag concerning one Example of this invention which mounted a RFIC chip and a chip-type heat-resistant protective element (chip-type ceramic capacitor) while forming a resist pattern in an insulating base material.

  The insulating substrate 10 constituting the RFID tag A1 is a flexible insulating substrate (flexible insulating substrate). As shown in FIG. 1, the RFIC chip 1 (FIGS. 2 and 3) is formed on one main surface. ), A pad 12 for mounting a chip-type ceramic capacitor 2 (FIGS. 2 and 3) functioning as a chip-type heat-resistant protective element, and a lead wire 3 for lead-out wiring (FIG. 3) are soldered. A pad (drawing wiring pad) 13 and an antenna pattern (antenna coil) 14. On the other main surface, a bridge wiring 15 for routing one end of an antenna pattern (antenna coil) 14 is provided.

  The pad 12 for mounting the chip-type heat-resistant protective element (chip-type ceramic capacitor) 2 is solder-connected to the pad 11 for mounting the RFIC chip 1 (FIG. 3) and the lead wire 3 for the lead wiring. It is arranged on a virtual straight line connecting the lead wiring pad 13.

  Further, as shown in FIG. 2, a resist pattern 16 is provided on the surface of the insulating substrate 10 so as to cover the antenna pattern 14 and the like. However, the resist pattern 16 is provided with a plurality of openings 16a. The openings 16a are pads 11 for mounting the RFIC chip 1, pads 12 for mounting the chip-type heat-resistant protective element 2, and drawers. The lead wiring pads 13 connected to the wiring lead wires 3 by soldering are formed at predetermined positions so as to be exposed.

  Then, the RFIC chip 1 is mounted on the pad 11 for mounting the RFIC chip 1 via a conductive bonding material such as low-temperature solder, and the pad for mounting the chip-type ceramic capacitor (chip-type heat-resistant protective element) 2. 12 is mounted with a chip-type ceramic capacitor 2 through a conductive bonding material such as low-temperature solder, thereby forming an RFID tag A1 according to an embodiment of the present invention having a structure as shown in FIG. Is done.

  In Example 1, the chip-type ceramic capacitor 2 used as the chip-type heat-resistant protective element has an antenna pattern (coil L1) 14 as viewed from the RFIC chip 1 as shown in the equivalent circuit diagram of FIG. The capacitor C1 functions in parallel with the capacitor C1 and is used as a resonance frequency tuning capacitor.

  In the first embodiment, the chip-type ceramic capacitor 2 is taller and narrower than the RFIC chip 1, and the chip-type ceramic capacitor 2 is shielded from the lead-out wiring pad 13 side. Thus, the RFIC chip 1 is configured not to be seen in the height direction but to be seen a little in the width direction (both ends of the RFIC chip 1 are seen a little).

  3A and 3B show the state in which the lead-out wiring lead wire 3 is soldered to the lead-out wiring pad 13 to the RFID tag A1 in FIG. 2 (specifically, the core wire of the lead-out wiring lead wire 3 ( FIG. 2 is a diagram showing a state in which the copper wire is soldered to the lead-out wiring pad 13 by the solder 18). In this manner, when the lead-out lead wire 3 is soldered to the lead-out wiring pad 13, In the RFID tag A1 of Example 1, as shown in FIGS. 2 and 3, a chip-type ceramic capacitor 2 that functions as a chip-type heat-resistant protective element is disposed on a virtual straight line connecting the RFIC chip 1 and the lead-out wiring pad 13. Therefore, it is possible to efficiently suppress and prevent the heat at the time of soldering of the lead wire 3 for the lead wiring from being transmitted to the RFIC chip 1.

  As a result, there is no need to provide a protective wall or the like between the RFIC chip and the lead-out wiring pad to prevent thermal effects during soldering, and the lead-out lead wire for the lead-out wiring is a simple process. An RFID tag that can be soldered can be obtained.

  FIG. 5 is an exploded plan view showing a configuration of an RFID tag A2 according to another embodiment (Example 2) of the present invention.

As shown in FIG. 5, the RFID tag A2 of Example 2 includes an antenna pattern 14 having a multilayer structure.
That is, as shown in FIG. 5, the first coil (first antenna pattern) 14a connected to the RFIC chip 1 and the lead-out wiring pad 3 is provided on the first insulating base material (flexible base material) 10a. The second layer insulating base material (flexible base material) 10b has a second coil (second antenna pattern) 14b connected and wound so that a current flows in the same direction as the first coil 14a. Is formed. And the 1st coil 14a and the 2nd coil 14b are directly connected via the via conductor 17, and comprise the antenna pattern 14 which has a multilayer structure.

  Other configurations are the same as those of the RFID tag A1 of the first embodiment. In FIG. 5, the parts denoted by the same reference numerals as those in FIGS. 1 to 3 indicate the same or corresponding parts.

In addition, the 1st coil 14a and the 2nd coil 14b may be connected via the capacity | capacitance, and may be directly connected using methods, such as pouching.
In the second embodiment, the RFID tag A2 including the antenna pattern 14 having the two-layer structure is shown. However, the antenna pattern may be configured by stacking three or more layers of coils.

  FIG. 6 is a perspective view schematically showing the configuration of an RFID tag A3 according to still another embodiment (third embodiment) of the present invention.

As shown in FIG. 6, the RFID tag A3 of Example 3 includes a plurality of chip-type ceramic components 2a, 2b, 2c, and 2d that are taller than the RFIC chip 1 as chip-type heat-resistant protective elements. .
In the RFID tag A3 of the present embodiment, as shown in FIG. 6, when the direction of the RFIC chip 1 is viewed from the lead-out wiring pad 13, a plurality of chip-type ceramic components 2a, 2b and 2c are arranged so as to block between the lead wiring pad 13 and the RFIC chip 1. That is, the entire region of the plurality of chip-type ceramic components 2a, 2b, 2c is parallel to the main surface of the insulating substrate 10 and orthogonal to the imaginary straight line connecting the RFIC chip 1 and the lead wiring pad 13 In FIG. 2, the RFIC chip 1 and the lead-out wiring pad 13 are disposed so as to be blocked.

  Further, in the RFID tag A3 according to the third embodiment, as shown in FIG. 6, the region on the opposite side of the RFIC chip 1 (the region where the plurality of chip-type ceramic components 2a, 2b, 2c are disposed) Another chip-type ceramic component 2d that is taller than the RFIC chip 1 is mounted in a region facing the RFIC chip 1 therebetween.

  Other configurations are the same as those of the RFID tag A1 of the first embodiment. In FIG. 5, the parts denoted by the same reference numerals as those in FIGS. 1 to 3 indicate the same or corresponding parts.

  As in the RFID tag A3 of the third embodiment, when the chip-type heat-resistant protective element is configured to include a plurality of chip-type ceramic components 2a, 2b, 2c in the above-described manner, the lead wire is soldered. The heat resistance against the heat at the time can be further improved.

  In addition, in the RFID tag A3 of the third embodiment, as shown in FIG. 6, the region where the plurality of chip-type ceramic components 2a, 2b, 2c are disposed is the region opposite to the region where the RFIC chip 1 is sandwiched. Since the chip-type ceramic component 2d is mounted and the RFIC chip 1 is surrounded by a plurality of chip-type ceramic components 2a, 2b, 2c, and 2d that are taller than the RFIC chip 1, another member is provided from above. Even when the IC drops or approaches, it is possible to prevent the RFIC chip 1 from being damaged by them.

  The chip-type ceramic components 2a, 2b, 2c and 2d constituting the plurality of chip-type heat-resistant protective elements are tuning chip-type ceramic capacitors, part or all of which are connected in parallel to the antenna coil. There may be.

FIG. 7 is a front sectional view showing the communication apparatus B according to the embodiment of the present invention.
In this communication apparatus, as shown in FIG. 7, a circuit board for communication is formed, and a printed circuit board 23 on which a circuit element 21, a battery pack 22 and the like are mounted is accommodated in a housing 24. Yes.

  Then, the RFID tag A according to the embodiment of the present invention (for example, the RFID tag A1 of Embodiments 1 to 3) is attached to a predetermined position inside the housing 24 via the adhesive 25, and the lead-out wiring thereof The lead wire 3 for the lead-out wiring is soldered to the pad 13 so that the circuit wiring of the RFID tag A1 and the printed board 23 is directly connected.

  In the communication device configured in this manner, the RFID tag A (A1) and the circuit wiring of the printed circuit board 23 are connected by the lead wiring 3 that is soldered to the lead wiring pad 13, so that the RFIC It is possible to directly write data to the chip and read data from the RFIC chip.

  Therefore, according to the present invention, it is possible to directly write data to the RFIC chip and read data from the RFIC chip, thereby providing a small and highly reliable communication apparatus.

  The present invention is not limited to the above-described embodiments, and various applications and modifications can be added within the scope of the invention.

1 RFIC chip 2 Chip-type heat-resistant protective element (Chip-type ceramic capacitor for tuning)
2a, 2b, 2c Chip-type heat-resistant protective element (chip-type ceramic component)
2d Chip type ceramic parts arranged in the opposite area 3 Lead wire for lead-out wiring 10 Insulating substrate (flexible substrate)
10a Insulating base material for the first layer (flexible base material)
10b Second layer insulating substrate (flexible substrate)
11 Pads for mounting RFIC chips 12 Pads for mounting chip-type heat-resistant protective elements 13 Pads for lead-out wiring 14 Antenna pattern (antenna coil)
14a First coil (first antenna pattern)
14b Second coil (second antenna pattern)
DESCRIPTION OF SYMBOLS 15 Bridge wiring 16 Resist pattern 16a Resist pattern opening 17 Via conductor 18 Solder 21 Circuit element 22 Battery pack 23 Printed circuit board 24 Case 25 Adhesive A, A1, A2, A3 RFID tag B Communication apparatus

Claims (9)

An insulating substrate having a main surface;
An antenna pattern formed on the insulating substrate;
An RFIC chip connected to the antenna pattern and mounted at a position near one end on the main surface of the insulating substrate;
A lead-out wiring pad connected to the RFIC chip and disposed at a position near the other end on the main surface of the insulating substrate, to which a lead-out lead wire is soldered;
An RFID tag comprising: a chip-type heat-resistant protective element mounted on a virtual straight line connecting the RFIC chip and the lead-out wiring pad on the main surface.   The RFID tag according to claim 1, wherein the chip-type heat-resistant protective element has a height equal to or higher than that of the RFIC chip.   2. The chip-type heat-resistant protective element is arranged in such a manner that all virtual straight lines passing through a region where the RFIC chip and the lead-out wiring pad are opposed to each other are blocked. Or the RFID tag of 2.   The RFID tag according to any one of claims 1 to 3, wherein the chip-type heat-resistant protective element is disposed at a position closer to the RFIC chip than the lead-out wiring pad.   The RFID tag according to any one of claims 1 to 4, wherein the chip-type heat-resistant protective element is a chip-type ceramic component having a ceramic body.   6. The chip-type ceramic capacitor according to claim 5, wherein the chip-type ceramic component is a chip-type ceramic capacitor that is disposed in parallel with the antenna pattern as viewed from the RFIC chip and functions as a resonance frequency tuning capacitor. RFID tag.   The insulating substrate has a longitudinal direction when seen in a plan view, the RFIC chip is disposed on one end side in the longitudinal direction, and the lead-out wiring pad is disposed on the other end side in the longitudinal direction. The RFID tag according to claim 1, wherein   The RFID tag according to claim 1, wherein the insulating base material is a flexible insulating base material. A communication device including an RFID tag connected to another circuit via a lead wire for lead wiring,
An RFID tag according to any one of claims 1 to 8, wherein the RFID tag is used as the RFID tag.

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