RU2378746C1 - Wireless device on integrated circuit and component of wireless device on integrated circuit - Google Patents

Abstract

FIELD: physics.

SUBSTANCE: wireless IC device has a wireless IC chip (5), a power supply circuit board (10) on which the wireless IC chip (5) is mounted, and comprising a power supply circuit (16). The power supply circuit (16) comprises a resonant circuit with a predefined resonance frequency, and an emitting plate (20) attached to the bottom surface of the power supply circuit board (10). The emitting plate (20) emits a transmission signal received from the power supply circuit (16). The emitting plate (20) also receives and transmits the received signal to the power supply circuit (16). The resonant circuit consists of an LC-resonant circuit which comprises an inductance element (L) and capacitance elements (C1) and (C2). The power supply circuit board (10) is a hard multilayer board or a hard single-layer board. The power supply circuit board (10) is connected to the wireless IC chip (5) and the emitting plate (20) through a connection, direct current magnetic coupling or capacitance coupling.

EFFECT: design of a wireless IC device and a component for a wireless IC device with stable frequency characteristics.

32 cl, 60 dwg

Description

FIELD OF THE INVENTION

The present invention relates to a wireless integrated circuit device (IC device) and, in particular, to a wireless IC device used for an RFID (Radio Frequency Identification) system, as well as to a component used for a wireless IC device.

State of the art

In recent years, RFID systems have been developed that act as product distribution management systems. In RFID systems, an IC tag (hereinafter referred to as a “wireless IC device”), which is stored with predefined product information, is attached to the product, and a reader / writer that generates an electromagnetic field communicates with the wireless IC device in a non-contact way, thereby transmitting information. Examples of wireless IC devices used in RFID systems are described in Patent Documents 1 and 2.

The wireless IC device shown in FIG. 59 includes an antenna pattern pattern 301 formed on a plastic film 300, and a wireless IC chip 310 is attached to one end of the antenna pattern pattern 301. The wireless IC device shown in Fig. 60 includes an antenna pattern 321 and a radiation electrode 322 formed on the plastic film 320, and the wireless IC chip 310 is attached to a predetermined portion of the antenna pattern 321.

However, in existing wireless IC devices, the wireless IC chip 310 is connected in constant tone and mounted on an antenna pattern 301 or 320 by using a gold contact pole. Accordingly, the placement of a small wireless IC chip 310 in a large plastic film 300 or 320 is required. However, it is extremely difficult to mount a small wireless IC chip 310 on a large plastic film of 300 or 320 in the right place. If the wireless IC chip 310 is not installed in place, the properties of the resonant frequency of the antenna are unfavorably changed. In addition, the properties of the resonant frequency of the antenna change if the antenna pattern 301 or 321 is rounded or placed between dielectric materials, for example, if the antenna pattern 301 or 321 is inserted into a book.

Patent Document 1. Unexamined Patent Publication (Japan) No. 2005-136528

Patent Document 2. Unexamined Patent Publication (Japan) No. 2005-244778

SUMMARY OF THE INVENTION

Problems Resolved by the Invention

Therefore, the present invention provides a wireless IC device having a stable frequency response and a component appropriately used for a wireless IC device.

Problem Solver

According to a first invention, a wireless IC device includes a wireless IC chip, a power supply circuit board connected to a wireless IC chip, wherein the power supply circuit board includes an energy supply circuit including a resonant circuit having a predetermined resonant frequency, and a radiating plate having a power supply circuit board mounted thereon, or an energy supply circuit board located adjacent to it. The radiating plate emits a transmitted signal supplied from the energy supply circuit, and / or receives and propagates the received signal to the energy supply circuit.

In the wireless IC device according to the first invention, the wireless IC chip and the power supply circuit board can be arranged in parallel on the circuit board or can be connected to each other via a conductor located on the circuit board.

According to a second invention, the wireless IC device includes a wireless IC chip, a power supply circuit board having a wireless IC chip mounted thereon, wherein the power supply circuit board includes a power supply circuit including a resonant circuit having a predetermined a resonant frequency, and a radiating plate having a power supply circuit board mounted on it, or a power supply circuit board located next to it. The radiating plate emits a transmitted signal supplied from the energy supply circuit, and / or receives and propagates the received signal to the energy supply circuit.

In the wireless IC devices according to the first and second inventions, the frequency of the transmitted signal emitted from the radiating plate and the frequency of the received signal supplied to the wireless IC chip are mainly determined based on the resonant frequency of the power supply circuit included in the power supply circuit board. Note that the term “predominantly” means that the frequency may shift slightly in accordance with the positional relationship between the circuit board of the power supply circuit and the radiating plate. Since the frequency of the transmitted and received signals is determined on the basis of the board of the power supply circuit, the frequency response does not vary regardless of the shape, size and mounting position of the radiating plate, for example, even when the wireless IC device is rounded or placed between dielectric materials. Thus, a stable frequency response is achieved.

In the wireless IC device according to the second invention, the wireless IC chip is mounted on the circuit board of the power supply circuit, and the power supply circuit is placed on the radiating plate. Since the area of the circuit board of the power supply circuit is much smaller than the area of the radiating plate, the wireless IC chip can be very accurately placed and mounted on the circuit board of the power supply circuit.

In the wireless IC devices according to the first and second inventions, the radiating plate is arranged on the first and second surfaces of the power supply circuit board. By placing the circuit board of the power supply circuit between two radiating plates, the energy generated from the power supply circuit extends to the radiating plates placed on the first and second surfaces of the circuit board of the power supply circuit. Accordingly, the gain is increased.

The resonant circuit may be a resonant circuit on elements with distributed parameters or a resonant circuit on elements with concentrated parameters, including a capacitor pattern and an induction coil pattern. The resonant circuit with elements on the distributed parameters includes an induction coil formed from strip lines, etc. Therefore, in particular, the construction of the resonant circuit can be simplified when using transmitted / received signals in the high frequency range equal to or greater than 5 GHz.

The resonant circuit on the elements with lumped parameters may be an LC-parallel resonance circuit or an LC-series resonant circuit. Alternatively, a resonant circuit on lumped parameter elements may include a plurality of LC-series resonant circuits or a plurality of LC-parallel resonant circuits. In particular, by configuring the resonant circuit as a resonant circuit on elements with lumped parameters, which may consist of a pattern of capacitors and a pattern of induction coils, the design of the resonant circuit can be simplified when using transmitted / received signals in the low frequency range equal to or less than 5 GHz. In addition, other elements, such as a radiating plate, have a slight effect on the resonance circuit. Moreover, by configuring the resonant circuit as a combination of the plurality of resonant circuits, the plurality of resonant circuits are connected to each other. Thus, transmitted / received signals in a wider frequency band can be used.

When a capacitor pattern is placed at the output of the wireless IC chip and between the wireless IC chip and the pattern of induction coils, the emission resistance increases. Since the surge is a low-frequency electric current equal to or less than 200 MHz, the surge can be suppressed by means of a capacitive element. In this way, the wireless IC chip can be protected against ejection.

In addition, the pattern of capacitors and the pattern of induction coils can be placed parallel to the radiating plate. Those. by placing the pattern of the capacitors and the pattern of the induction coils so that they are aligned in the direction of the radiating plate, and so that the electric field generated by the pattern of the capacitors and the magnetic field formed by the pattern of the induction coils are directly applied to the radiating plate, the magnetic field, formed by the pattern of induction coils, was not blocked due to the pattern of capacitors. Accordingly, the radiation frequency of the pattern of induction coils increases.

In addition, the reflector and / or the wave control unit can be placed in the part where the magnetic field is formed by the pattern of induction coils. Thus, the characteristic of radiation or the directivity of the magnetic field from the energy supply circuit to the radiating plate can be easily controlled, and, therefore, external electromagnetic interference is minimized. As a result, a stable resonance response can be obtained.

The power supply circuit board may be a multilayer board in which a plurality of dielectric layers or a plurality of magnetic layers are arranged in layers. In this case, the pattern of capacitors and the pattern of induction coils are formed on the surface and / or inside the multilayer board. By using a resonant circuit consisting of a multilayer circuit board, an element (for example, an electrode pattern) of the resonant circuit can be formed inside the circuit board as well as on the surface of the circuit board. Accordingly, the size of the board can be reduced. In addition, increases the flexibility of the layout of the elements of the resonant circuit. Thus, the performance of the resonant circuit is increased. The multilayer board may be a polymer multilayer board in which a plurality of polymer layers are layered, or a ceramic multilayer board in which a plurality of ceramic layers are layered. Alternatively, the multi-layer board may be a thin-film multi-layer board formed using thin-film forming technology. In the case of a ceramic multilayer board, it is desirable that the ceramic layers be made of low temperature sintered ceramic material, since silver or copper, which have a low resistance value, can be used as elements of a resonant circuit.

On the other hand, the power supply circuit board may be a dielectric or magnetic single layer board. In this case, the pattern of capacitors and / or the pattern of induction coils are formed on the surface of a single-layer board. The material of a single-layer board may be polymer or ceramic. The capacitance of the capacitor pattern can be formed between the flat electrodes provided on one side of a single-layer board, or it can be formed between electrodes placed almost parallel to each other on one surface of a single-layer board.

It is desirable that the power circuit board is a rigid board. If the board is rigid, the frequency of the transmitted signal can be kept stable even when the wireless IC device is attached to a product of any shape. Moreover, the wireless IC chip can be reliably mounted on a rigid board. On the other hand, it is desirable that the radiating plate be made of a flexible metal film. A flexible radiating plate makes it possible to attach a wireless IC device to any form of product.

Moreover, when the flexible metal film is held in the flexible polymer film, the wireless IC device can be easily controlled. In particular, when all of the wireless IC chip, the power supply circuit board and the radiating plate are coated with a film, these components can be protected from the environment.

It is desirable that the electric length of the radiating plate be an integer multiple of half the wavelength of the resonant frequency, in which case the gain is maximized. However, since the frequency is mainly determined by the resonant circuit, it is not necessary that the electric length of the radiating plate be an integer multiple of half the wavelength of the resonant frequency. This is a significant advantage compared to a wireless IC device in which the radiating plate is an antenna device having a specific resonant frequency.

In addition, many configurations can be used for the connection between the wireless IC chip and the power circuit board. For example, a wireless IC chip can be equipped with an electrode pattern on the side of the chip, the power supply circuit board can be equipped with a first electrode pattern on the side of the circuit board, and the electrode pattern on the chip side can be connected by direct current to the first electrode pattern on the side of the circuit board. In this case, the connection can be performed, for example, by solder, an electrically conductive polymer or a contact pole of gold.

Alternatively, the electrode pattern on the microcircuit side can be connected to the first electrode pattern on the board side by capacitive coupling or magnetic coupling. When the connection is made by capacitive coupling or magnetic coupling, solder or conductive polymer is not necessary, but a bonding agent such as a polymer is used to attach the electrode pattern on the chip side to the first electrode pattern on the board side. In this case, the electrode pattern on the microcircuit side and the first electrode pattern on the circuit board side need not be formed on the surface of the wireless IC chip or the circuit board surface of the power supply circuit. For example, a polymer film may be formed on the surface of the pattern of electrodes on the side of the microcircuit, or a first pattern of electrodes on the side of the board may be formed in the inner layer of the multilayer board.

In the case of using capacitive coupling, it is desirable that the area of the first pattern on the side of the board is larger than the area of the pattern of electrodes on the side of the microcircuit. Even if the placement accuracy during installation of the wireless IC chip on the circuit board of the power supply circuit varies slightly, variations in the capacitance between the two electrode patterns can be significantly reduced. Moreover, it is difficult to form an electrode pattern having a large area on a small wireless IC chip. However, since the power supply circuit is relatively large, an electrode pattern having a large area can be formed without problems.

In the case of using magnetic coupling, the accuracy required when the wireless IC chip is mounted on the circuit board of the power supply circuit is not critical compared to the case of using capacitive coupling, which further simplifies the installation operation. In addition, each of the electrode patterns on the microcircuit side and the first electrode pattern on the board side is a coil pattern of electrodes. In this case, the pattern of the electrodes in the form of a coil, such as a spiral pattern or a helical pattern, simplifies the design. For a high frequency, the meander pattern of the electrodes is preferable.

On the other hand, many types of configurations can be used to connect between the circuit board of the power supply circuit and the radiating plate. For example, the power supply circuit may be equipped with a second electrode pattern on the side of the board, and the second electrode pattern on the side of the board may be connected by direct current to the radiating plate. In this case, the connection can be performed by solder, an electrically conductive polymer or a contact pole of gold.

Alternatively, the second electrode pattern on the side of the board may be connected to the radiating plate via capacitive coupling or magnetic coupling. In the case of capacitive coupling or magnetic coupling, it is not necessary to use solder or conductive polymer. A second pattern on the side of the electrodes can be attached to the radiating plate by a bonding agent such as a polymer. In this case, the second electrode pattern on the side of the board does not have to be formed on the surface of the board of the power supply circuit. For example, a second electrode pattern on the side of the board may be formed in the inner layer of the multilayer board.

In the case of using magnetic coupling, it is desirable that the second pattern of electrodes on the board side is a pattern of electrodes in the form of a coil. A coil-shaped electrode pattern, such as a spiral pattern or a helical pattern, simplifies magnetic flux control, thereby simplifying design. For high frequency, a meander pattern of electrodes can be used. In the case of using magnetic coupling, it is desirable that the change in the magnetic flux that occurs in the second electrode pattern on the side of the board (electrode pattern in the form of a coil) is not interrupted. For example, it is desirable that a hole be provided in the radiating plate. Thus, the frequency of energy transfer of the signal is increased, and the frequency shift due to coupling between the circuit board of the power supply circuit and the radiating plate can be reduced.

When the second electrode pattern on the side of the board is a coil-shaped electrode pattern, its axis of the winding can be placed parallel or perpendicular to the radiating plate. In the latter case, it is desirable that the width of the coil pattern of the electrodes in the form of a coil gradually increase in the direction of the radiating plate.

In the wireless IC devices according to the first and second inventions, if the radiating plate is a radiating plate with two open sides (two open ends), which includes a radiating section for exchanging transmitted / received signals with an external device and an energy transmitting section for exchanging transmitted / received signals with a power supply circuit (resonant circuit), the antenna gain can be increased by means of a radiating section. Thus, even a small drawing of the power supply circuit allows obtaining sufficient amplification, the wireless IC device can operate at a sufficient distance from the reader / writer, and even a frequency band not less than the UHF band may be sufficient for use. In addition, the resonant frequency is mainly determined by drawing a power supply circuit, any shape of the radiating section can be used, the gain can be adjusted by the size of the radiating section, and the center frequency can be precisely adjusted by the shape of the radiating section.

In addition, at least a portion of the energy transfer section of the radiating plate is arranged in a plane of projections of the pattern of the energy supply circuit, and the area of the energy transfer section may be smaller than the area of the projection plane of the pattern of the energy supply circuit. As used herein, the term "projection plane" means the plane surrounded by the outline of the power supply circuit pattern, and the term "energy transfer section area" means the area of the metal section of the emitting plate. If the energy transfer section of the radiating plate is connected to the pattern of the energy supply circuit by the magnetic field, when the area of the energy transfer section is less than the projection plane area of the energy supply circuit, the portion that counteracts the magnetic flux flowing from the power supply circuit drawing is reduced. Consequently, signal transfer efficiency is improved.

In addition, an energy transfer section may be formed so as to intersect the plane of projections of the pattern in the longitudinal direction. For example, a power transfer section may be formed in a straight line. The radiating section of the radiating plate may be provided at both ends of the energy transfer section, or may be provided at one end of the energy transfer section. When the radiating section is provided at both ends of the power transfer section, the capacitive coupling with the pattern of the power supply circuit is increased. By providing the radiating section at only one end of the power transfer section, the magnetic coupling with the pattern of the power supply circuit is strong and, therefore, the gain increases.

Additionally, several patterns of power supply circuits may be formed on the circuit board of the power supply circuit. In this case, it is desirable that the energy transfer section of the radiating plate is located between adjacent pairs of projection planes of several energy transfer patterns.

A longitudinal energy transfer section may be formed so as to intersect the space between adjacent pairs of projection planes of several patterns of energy supply circuits. For example, a longitudinal energy transfer section may be formed in a straight line. By placing the power transfer section between adjacent pairs of projection planes of several power transfer patterns, the amount of electric power supplied between the power transfer section and the pattern of the power transfer sections increases.

The radiating plate may be formed in the x-y plane and may include radiating sections extending in the x-axis direction and in the y-axis direction. Thus, circularly polarized waves can be received and, therefore, the antenna gain increases. In addition, the radiating plate may include radiating sections extending in the x-axis direction, the y-axis direction, and the z-axis direction in the x-y-z space. By providing radiating sections extending in three directions, efficient transmission and reception can be performed in any direction.

Still further, the radiating section of the radiating plate can extend substantially perpendicular to the plane of the drawing of the energy supply circuit. Thus, the energy transfer section can be provided in a plane that is located at the upper end of the radiating section in the form of a needle and substantially perpendicular to the radiating section, and the energy transfer section can be connected to the pattern of the energy supply circuit by means of an electric field or magnetic field. In this way, the wireless IC device can be attached to the product by inserting a needle shaped radiation section into the product.

Additionally, the power transfer section and the drawing of the power supply circuit may be coated with a magnetic element. Thus, the leakage of electromagnetic energy can be prevented, and the connection between the power transmission section and the pattern of the power supply circuit is increased, thereby increasing the antenna gain.

According to a third invention, a component for a wireless IC device includes an IC chip and a power supply circuit board that is connected to a wireless IC chip and which includes a power supply circuit. The power supply circuit includes a resonant circuit having a predetermined resonant frequency.

According to a third invention, a component for a wireless IC device includes an IC chip and a power supply circuit board having a wireless IC chip mounted on it and comprising a power supply circuit. The power supply circuit includes a resonant circuit having a predetermined resonant frequency.

Benefits

According to the first and second inventions, the wireless IC chip can be mounted with high accuracy on a circuit board or circuit board power supply. In addition, the frequency of the transmitted signal and the received signal is determined by the power supply circuit located on the circuit board of the power supply circuit. Therefore, even when the wireless IC device is rounded or inserted between dielectric materials, the frequency characteristics do not vary, and therefore, a stable frequency response can be obtained.

According to the third and fourth inventions, the wireless IC devices according to the first and second inventions can be optimally configured.

Brief Description of the Drawings

Figure 1 is a perspective view of a wireless IC device according to a first embodiment of the present invention.

2 is a cross-sectional view of a wireless IC device according to a first embodiment.

3 is an equivalent circuit diagram of a wireless IC device according to a first embodiment.

4 is a perspective view in parts of a circuit board of a power supply circuit according to a first embodiment.

5 (A) and 5 (B) illustrate a configuration of a connection between a wireless IC chip and a power supply circuit board.

6 is a perspective view of a first modification of a radiating plate.

7 is a perspective view of a second modification of the radiating plate.

Fig. 8 is a plan view of a wireless IC device according to a second embodiment of the present invention.

FIG. 9 (A) and 9 (B) illustrate a wireless IC device according to a third embodiment of the present invention, wherein FIG. 9 (A) is a plan view when a wireless IC device is being developed, and FIG. 9 (B) - a perspective view when a wireless IC device is used.

10 is a perspective view of a wireless IC device according to a fourth embodiment of the present invention.

11 is a perspective view of a wireless IC device according to a fifth embodiment of the present invention.

12 is a cross-sectional view of a wireless IC device according to a sixth embodiment of the present invention.

13 is an equivalent circuit diagram of a wireless IC device according to a seventh embodiment of the present invention.

14 is an equivalent circuit diagram of a wireless IC device according to an eighth embodiment of the present invention.

15 is an equivalent circuit diagram of a wireless IC device according to a ninth embodiment of the present invention.

Fig. 16 is a cross-sectional view of a wireless IC device according to a tenth embodiment of the present invention.

17 is an equivalent circuit diagram of a wireless IC device according to a tenth embodiment of the present invention.

Fig. 18 is a perspective view in parts of a circuit board of a power supply circuit according to a tenth embodiment.

19 is an equivalent circuit diagram of a wireless IC device according to an eleventh embodiment of the present invention.

20 is an equivalent circuit diagram of a wireless IC device according to a twelfth embodiment of the present invention.

21 is a perspective view in parts of a circuit board of an energy supply circuit according to a twelfth embodiment.

FIG. 22 is a perspective view of a wireless IC device according to a thirteenth embodiment of the present invention.

23 is a cross-sectional view of a wireless IC device according to a fourteenth embodiment of the present invention.

24 is a perspective view in parts of a circuit board of a power supply circuit according to a fourteenth embodiment.

25 is an equivalent circuit diagram of a wireless IC device according to a fifteenth embodiment of the present invention.

26 is a perspective view in parts of a circuit board of an energy supply circuit according to a fifteenth embodiment.

27 is an equivalent circuit diagram of a wireless IC device according to a sixteenth embodiment of the present invention.

28 is a perspective view in parts of a circuit board of an energy supply circuit according to a sixteenth embodiment.

29 is an equivalent circuit diagram of a wireless IC device according to a seventeenth embodiment of the present invention.

30 is a perspective view in parts of a circuit board of an energy supply circuit according to a seventeenth embodiment.

Fig. 31 is a graph illustrating a reflection characteristic according to the seventeenth embodiment.

32 is an equivalent circuit diagram of a wireless IC device according to an eighteenth embodiment of the present invention.

33 is a perspective view in parts of a circuit board of an energy supply circuit according to an eighteenth embodiment.

Fig. 34 (A) and 34 (B) illustrate a wireless IC chip of the eighteenth embodiment, wherein Fig. 34 (A) is a bottom view, and Fig. 34 (B) is an enlarged sectional view.

Fig. 35 is an equivalent circuit diagram of a wireless IC device according to a nineteenth embodiment of the present invention.

Fig. 36 is a perspective view in parts of a circuit board of a power supply circuit according to a nineteenth embodiment.

Fig. 37 is a perspective view in parts of a wireless IC device according to a twentieth embodiment of the present invention.

Fig. 38 is a bottom view of a circuit board of a power supply circuit having a wireless IC device mounted thereon according to a twentieth embodiment.

Fig. 39 is a side view of a wireless IC device according to a twentieth embodiment.

40 is a side view of a wireless IC device according to a first modification of a twentieth embodiment.

FIG. 41 is a perspective view of the modification shown in FIG. 40 in a first configuration.

Fig. 42 is a perspective view of the modification shown in Fig. 40 in a second configuration.

43 is a perspective view in parts of a wireless IC device according to a twenty-first embodiment of the present invention.

Fig. 44 is an equivalent circuit diagram of a wireless IC device according to a twenty-first embodiment of the present invention.

Fig. 45 is a perspective view in parts of a circuit board of an energy supply circuit according to a twenty-second embodiment.

Fig. 46 is a perspective view in parts of a circuit board of a power supply circuit of a wireless IC device according to a twenty-third embodiment of the present invention.

Fig. 47 is an equivalent circuit diagram of a wireless IC device according to a twenty-fourth embodiment of the present invention.

Fig. 48 is a perspective view in parts of a circuit board of an energy supply circuit according to a twenty-fourth embodiment.

49 is an equivalent circuit diagram of a wireless IC device according to a twenty-fifth embodiment of the present invention.

Fig. 50 is a perspective view of a circuit board of an energy supply circuit according to a twenty-fifth embodiment.

Fig. 51 is an equivalent circuit diagram of a wireless IC device according to a twenty-sixth embodiment of the present invention.

Fig. 52 is a perspective view of a circuit board of a power supply circuit according to a twenty-sixth embodiment.

Fig. 53 is an equivalent circuit diagram of a wireless IC device according to a twenty-seventh embodiment of the present invention.

54 is a perspective view of a circuit board of an energy supply circuit according to a twenty-seventh embodiment.

55 is a cross-sectional view of a wireless IC device according to a twenty-eighth embodiment of the present invention.

Fig. 56 is a cross-sectional view of a wireless IC device according to a twenty-ninth embodiment of the present invention.

Fig. 57 is a perspective view of a wireless IC device according to a thirtieth embodiment of the present invention.

Fig. 58 is a perspective view of a wireless IC device according to a thirty-first embodiment of the present invention.

Fig. 59 is a plan view of a first example of an existing wireless IC device; and

60 is a plan view of a second example of an existing wireless IC device.

Optimum Mode for Carrying Out the Invention

Embodiments of a wireless IC device and component of a wireless IC device according to the present invention are described below with reference to the accompanying drawings. In the following embodiments, the same reference numbers indicate similar components and parts, and redundant descriptions are omitted.

The first embodiment (see FIGS. 1-7)

According to a first embodiment, the wireless IC device 1a is of the type of asymmetric vibrator. As shown in FIGS. 1 and 2, the wireless IC device 1a includes a wireless IC chip 5, a power supply circuit board 10 having a wireless IC chip 5 mounted on an upper surface, and a radiating plate 20 having a circuit board 10 energy supply attached to it. The wireless IC chip 5 includes a synchronization circuit, a logic circuit and a memory circuit, and stores the required information. The wireless IC chip 5 is electrically connected by direct current to the power supply circuit 16 contained in the circuit board 10 of the power supply circuit.

The power supply circuit 16 supplies a transmitted signal having a predetermined frequency to the radiating plate 20, and / or selects a received signal having a predetermined frequency from the signals received by the radiating plate 20 so as to supply the selected signal to the wireless IC chip 5. The power supply circuit 16 includes a resonant circuit that resonates at the frequency of the transmitted / received signals.

As shown in FIGS. 2 and 3, the power supply circuit board 10 includes an LC-series type power supply circuit 16 on lumped parameter elements having a spiral inductance element L and capacitive elements C1 and C2. More specifically, as shown in FIG. 4, ceramic sheets 11A-11G made of dielectric material are glued, pressed and sintered so as to form a power supply circuit board 10. The ceramic sheet 11A includes connecting electrodes 12 and conductors 13a formed therein through openings. The ceramic sheet 11B includes capacitor electrodes 14a formed therein. The ceramic sheet 11C includes capacitor electrodes 14b and conductive wires 13b formed therein through openings. The ceramic sheet 11D includes conduits 13c formed through the openings formed through it. The ceramic sheet 11E includes conductor patterns 15a and conduits 13d formed therein through openings. The (at least one) ceramic sheet 11F includes conduits 13e formed through the holes formed therein. Ceramic sheet 11G includes conductor patterns 15b formed therein. Each of the ceramic sheets 11A-11G may be made of magnetic ceramic material. The power supply circuit board 10 can simply be manufactured using a known method for producing multilayer boards, such as a sheet bonding method or a thick film printing method.

By bonding the ceramic sheets 11A-11G, an inductive element L and capacitive elements C1 and C2 are formed. The inductive element L follows a spiral path above the axis of the winding, which is parallel to the radiating plate 20. In capacitive elements C1 and C2, capacitor electrodes 14b are connected to one end of the inductive element L. In addition, each of the capacitor electrodes 14a is connected to one of the connecting electrodes 12 by passing through the hole of the conductor 13a. Moreover, the connecting electrode 12, which forms the pattern of the electrodes on the side of the board, is connected by direct current with the pattern of the electrodes (not shown) of the wireless IC chip 5 on the side of the chip by means of a solder contact column 6.

Those. the transmitted signal is supplied from the inductive element L, which is a coil-shaped electrode pattern in the energy supply circuit 16, to the radiating plate 20 by means of a magnetic field. The received signal is supplied from the radiating plate 20 to the inductive element L by means of a magnetic field. Therefore, it is desirable that of the inductive element L and the capacitive elements C1 and C2 that form the resonant circuit, the inductive element L is positioned so as to be closer to the radiating plate 20.

The radiating plate 20 is a long rectangular plate made of a non-magnetic material such as aluminum foil or copper foil. Those. the radiating plate 20 is a metal plate with both ends open. The radiating plate 20 is formed on a flexible insulating polymer film 21, such as PET. The lower surface of the board 10 of the energy supply circuit is attached to the radiating plate 20 using an insulating bonding layer composed of an intermediate bonding agent 18.

For example, the thickness of the wireless IC chip 5 is in the range of 50-100 microns. The thickness of the solder contact posts 6 is approximately 20 μm . The thickness of the board 10 of the energy supply circuit is in the range of 200-500 microns. The thickness of the binding agent 18 is in the range of 0.1-10 μm. The thickness of the radiating plate 20 is in the range of 1-50 μm. The thickness of the film 21 is in the range of 10-100 microns. The size (area) of the wireless IC chip 5 may vary, for example, 0.4 mm (0.4 mm or 0.9 mm (0.8 mm. Size (area) of the board 10 of the power supply circuit may be the same size, as the size of the wireless IC chip 5, up to about 3 mm (3 mm.

Figure 5 illustrates the layout of the connections between the wireless IC chip 5 and the power supply circuit board 10. 5A, a pair of antenna (balanced) contacts 7a and 17a are provided on the bottom surface of the wireless IC chip 5 and the outer surface of the board 10 of the power supply circuit, respectively. In contrast, FIG. 5B illustrates another arrangement of connections. In FIG. 5B, ground contacts 7b and 17b are provided on the lower surface of the wireless IC chip 5 and the upper surface of the board 10 of the power supply circuit, respectively, in addition to the pair of antenna (balanced) contacts 7a and 17a. The ground contact 17b of the power supply circuit board 10 is terminated and is not connected to any of the other elements of the power supply circuit board 10.

In addition, as shown in FIGS. 6 and 7, it is desirable that the radiating plate 20 is thin and the area 20 ′ of the radiating plate 20 to which the board 10 of the power supply circuit is attached is larger than the board 10. Thus, precise positioning is not necessary when the board 10 of the power supply circuit is attached to the radiating plate 20a and stable electrical characteristics can be obtained.

Figure 3 illustrates an equivalent circuit of a wireless IC device 1a. The wireless IC device 1a receives a high frequency signal (for example, a signal in the UHF band) emitted from a reader / writer (not shown) in the emitting plate 20. By resonating the power supply circuit 16 (LC series resonance circuit consisting of the inductive element L and the capacitive elements C1 and C2), which is mainly magnetically coupled to the radiating plate 20, the wireless IC device 1a provides only the received signal to the wireless IC chip 5 in a predetermined frequency band. In this case, the wireless IC device 1a extracts a predetermined energy from the received signal, and by using this energy as an excitation source, the wireless IC device 1a combines the information stored in the wireless IC chip 5 with a predetermined frequency in the power supply circuit 16. The wireless IC device 1a then distributes the transmitted signal from the inductive element L of the power supply circuit 16 to the radiating plate 20 by magnetic coupling. The radiating plate 20 transmits a transmitted signal to a reader / writer.

The coupling of the power supply circuit 16 to the radiating plate 20 is advantageously achieved by a magnetic field. However, in addition to magnetic coupling, there may be a coupling through an electric field (electromagnetic coupling).

According to a first embodiment, in the wireless IC device 1a, the wireless IC chip 5 is connected in direct current to a board 10 of an energy supply circuit that includes a power supply circuit 16. The circuit board 10 of the power supply circuit has almost the same area as the wireless IC chip 5 and is rigid. Accordingly, in comparison with the existing case where the wireless IC chip 5 is mounted on a flexible film having a large area, the wireless IC chip 5 can be precisely placed and mounted on the circuit board 10 of the power supply circuit. In addition, the board 10 of the power supply circuit is made of ceramic material and has excellent resistance to heat, and therefore, the wireless IC chip 5 can be soldered to the board 10 of the power supply circuit. Those. the wireless IC chip 5 can be attached to the board 10 of the power supply circuit without using the expensive ultrasonic fastening method that has traditionally been used. Thus, the cost can be reduced, and there is no danger that the wireless IC chip 5 may be damaged due to the pressure applied during ultrasonic mounting. In addition, the self-alignment effect provided by reflowing the solder can be used.

In the power supply circuit 16, the properties of the resonant frequency are determined by the resonant circuit including the inductive element L and the capacitive elements C1 and C2. The resonant frequency of the signal emitted from the radiating plate 20 is practically the same as the self-resonant frequency of the energy supply circuit 16. The maximum signal gain is advantageously determined by at least one of the size and shape of the power supply circuit 16 and the size and medium between the power supply circuit 16 and the radiating plate 20. More specifically, according to the first embodiment, the electric length of the radiating plate 20 is set to 1 / 2 resonant frequencies λ . However, the electrical length of the radiating plate 20 should not be an integer multiple of λ / 2. Those. according to the present invention, the frequency of a signal emitted from the radiating plate 20 is advantageously determined by the resonant frequency of the resonance circuit (power supply circuit 16). Therefore, the frequency characteristics are largely independent of the electric length of the radiating plate 20. It is desirable that the electric length of the radiating plate 20 is an integer multiple of λ / 2 so as to maximize the gain.

As described above, the resonant frequency characteristics of the power supply circuit 16 are determined by the resonance circuit consisting of the inductive element L and the capacitive elements C1 and C2 contained in the circuit board 10 of the power supply circuit.

Accordingly, even when the wireless IC device is inserted in the book, the characteristics of the resonant frequency do not change. In addition, even when the wireless IC device 1a is rounded to change the shape or size of the radiating plate 20, the characteristics of the resonant frequency do not change. Moreover, since the pattern of the electrodes in the form of a coil, which forms the inductive element L, is arranged so that its axis of the winding is parallel to the radiating plate 20, the center frequency does not predominantly change. Additionally, since the capacitive elements C1 and C2 are located at the output of the wireless IC chip 5, low-frequency emission is prevented by the capacitive elements C1 and C2. Thus, the wireless IC chip 5 can be protected against ejection.

In addition, since the power supply circuit board 10 is a rigid multi-layer card, the wireless IC chip 5 can be easily soldered. Moreover, the radiating plate 20 is formed of a flexible metal film supported by the flexible film 21. Therefore, the radiating plate 20 can be easily attached to a cylindrical element, such as a PET bottle or a soft bag made of plastic film.

According to the present invention, the resonant circuit may also act as a matching circuit for matching the impedance of the wireless IC chip with the impedance of the radiating plate. Alternatively, the board of the power supply circuit may further include a matching circuit that includes an inductive element and a capacitive element and which is provided separately from the resonance circuit. In general, when a resonant circuit includes a matching circuit function, the construction of the resonant circuit is complicated. However, if the matching circuit is provided separately from the resonance circuit, the resonant circuit and the matching circuit can be constructed independently of each other.

Second Embodiment (See FIG. 8)

According to a second embodiment, as shown in FIG. 8, in the wireless IC device 1b, the radiating plate 20 branches into two parts at an angle of 90 °. Those. the radiating plate 20 includes a radiating section 20a that goes in the x-axis direction, and a radiating section 20b that goes in the y-axis direction, on the x-y plane. Additionally, the radiating plate 20 has an extension of the radiating section 20a, which acts as the power transfer section 20d. A power supply circuit board 10 having a wireless IC chip 5 mounted thereon is attached to the power transfer section 20d.

The internal structure of the board 10 of the power supply circuit is similar to the structure of the first embodiment. The operation and advantages of the second embodiment are the same as in the first embodiment. In addition, since the radiating sections 20a and 20b go in the x-axis and y-axis directions, respectively, the radiating plate 20 can receive circularly polarized waves. Accordingly, the antenna gain is increased.

Third Embodiment (See FIG. 9)

According to a third embodiment, as shown in FIGS. 9 (A) and 9 (B), in the wireless IC device 1c, the radiating plate 20 includes radiating sections 20a, 20b and 20c that extend in the x-axis direction, the y-axis direction and the direction of the z axis, respectively, in the space xyz. The power supply circuit board 10 having a wireless IC chip 5 mounted thereon is mounted on the power transmission section 20d, which is an extension of the radiating section 20a.

For example, the wireless IC device 1c may be mounted in a box-shaped corner of the product. Since the radiating sections 20a, 20b and 20c are three-dimensionally positioned, the directivity of the antenna can be eliminated. Thus, in any direction, efficient transmission and reception can be performed. In addition, the operation and advantages of the wireless IC device 1c are the same as in the first embodiment.

Fourth Embodiment (see FIG. 10)

According to a fourth embodiment, as shown in FIG. 10, in the wireless IC device 1d, a radiating plate 20 having a large area and made of aluminum foil is formed on an insulating flexible plastic film 21 having a large area. The power supply circuit board 10 having a wireless IC chip 5 mounted on it is attached to the radiating plate 20 in any position.

Another structure of the wireless IC device 1d, i.e. the internal structure of the board 10 of the power supply circuit is similar to the structure of the first embodiment. Accordingly, the operation and advantages of the fourth embodiment are the same as in the first embodiment. In addition, the fourth embodiment has the advantage that high-precision positioning is not required when the power supply circuit board 10 is attached to the radiating plate 20.

Fifth Embodiment (See FIG. 11)

According to a fifth embodiment, as shown in FIG. 11, in the wireless IC device 1e, a radiating plate 20 having a large area and made of aluminum foil is formed as a grid. The entire radiating plate 20 may be a grid, or alternatively, a portion of the radiating plate 20 may be a grid.

Other structures of the wireless IC device 1e are similar to those of the fourth embodiment. Therefore, high-precision positioning is not necessary when the board 10 of the power supply circuit is attached to the radiating plate 20. In addition, since the magnetic flux of the pattern of electrodes in the form of a coil passes through the holes of the grid, the change (decrease) in the magnetic flux flowing from the board 10 of the power supply circuit is reduced . Thus, more magnetic fluxes can pass through the radiating plate 20, and the signal energy distribution efficiency is increased. In addition, the frequency shift caused by the attachment can be reduced.

Sixth embodiment (see FIG. 12)

According to a sixth embodiment, as shown in FIG. 12, in the wireless IC device 1f, the bonding agent 18 is applied to the entire surface of the film 21 to which the power supply circuit board 10 is attached by the radiating plate 20. The bonding agent 18 allows the wireless IC device 1f be attached to an arbitrary part of the product.

Another structure of the wireless IC device 1f, i.e. the internal structure of the board 10 of the power supply circuit is similar to the structure of the first embodiment. Accordingly, the operation and advantages of the sixth embodiment are the same as in the first embodiment.

Seventh Embodiment (See FIG. 13)

According to a seventh embodiment, as shown by the equivalent circuit in FIG. 13, the wireless IC device 1g has a power supply circuit board 10 containing an inductive element L that acts as an energy supply circuit 16 and which has a coil-shaped electrode pattern. The capacitive element C, which forms an LC-parallel resonant circuit, is provided in the form of a floating electric capacitance (type electric capacitance with distributed parameters) between the conductors of the inductive element L.

Those. when even one coil-shaped electrode pattern has auto-resonance, the coil-shaped electrode pattern can act as an LC-parallel resonance circuit by using the L component of the coil-shaped electrode pattern itself and the C-component formed as a linear floating electric capacitance, and can an energy supply circuit 16 is obtained. Accordingly, the wireless IC device 1g receives a high frequency signal (for example, a signal in the UHF band) emitted from a reader / writer (not shown) in the emitting plate 20. By resonating the power supply circuit 16 (LC series resonance circuit consisting of an inductive element L and a capacitive element C), which is mainly magnetically coupled to the radiating plate 20, the wireless IC device 1g provides only the received signal in the predetermined bands to the wireless IC chip 5 frequencies. In this case, the wireless IC device 1g extracts a predetermined energy from the received signal, and by using this energy as an excitation source, the wireless IC device 1g combines information stored in the wireless IC chip 5 with a predetermined frequency in the power supply circuit 16. Then, the wireless IC device 1g distributes the transmitted signal from the inductive element L of the power supply circuit 16 to the radiating plate 20 by magnetic coupling. The radiating plate 20 transmits a transmitted signal to a reader / writer.

Eighth embodiment (see FIG. 14)

According to an eighth embodiment, as shown by the equivalent circuit in FIG. 14, the wireless IC device 1h includes a symmetrical vibrator type power supply circuit 16 and emitting plates 20. The power supply circuit 16 includes two LC-parallel resonant circuits arranged in the circuit board power supply. The inductive element L1 and the capacitive element C1 are connected to the side of the first port of the wireless IC chip 5. The inductive element L2 and the capacitive element C2 are connected to the side of the second port of the wireless IC chip 5. The inductive element L1 and the capacitive element C1 are located opposite one of the radiating plates 20 The inductive element L2 and the capacitive element C2 are located opposite the other radiating plate 20. The end of the inductive element L1 and the capacitive element C1 is open. Note that the first port and the second port comprise the input / output ports of the differential circuit.

The operation and advantages of the eighth embodiment are essentially the same as the first embodiment. Those. the wireless IC device 1h receives a high frequency signal (for example, a signal in the UHF band) emitted from a reader / writer (not shown) in the emitting plates 20. By resonating the power supply circuit 16 (LC-parallel resonance circuit consisting of the inductive element L1 and the capacitive element C1, and an LC-parallel resonant circuit consisting of the inductive element L2 and the capacitive element C2), which is mainly magnetically coupled to the radiating plates 20, the wireless IC device 1h provides wireless All IC chips 5 receive only in a predefined frequency band. In this case, the wireless IC device 1h extracts a predetermined energy from the received signal, and by using this energy as an excitation source, the wireless IC device 1h combines the information stored in the wireless IC chip 5 with a predetermined frequency in the power supply circuit 16. Then, the wireless IC device 1h distributes the transmitted signal from the inductive elements L1 and L2 of the power supply circuit 16 to the radiating plates 20 by magnetic coupling. The radiating plates 20 transmit a transmitted signal to a reader / writer.

Ninth Embodiment (see FIG. 15)

According to a ninth embodiment, as shown by the equivalent circuit in FIG. 15, the wireless IC device 1i includes a symmetric vibrator type power supply circuit 16 and radiating plates 20. The power supply circuit 16 includes two LC series resonant circuits arranged in the circuit board power supply. The inductive element L1 is located opposite one of the radiating plates 20, and the inductive element L2 is located opposite the other radiating plate 20. Capacitive elements C1 and C2 are grounded.

The operation and advantages of the ninth embodiment are essentially the same as the first embodiment. Those. the wireless IC device 1i receives a high frequency signal (for example, a signal in the UHF band) emitted from a reader / writer (not shown) in the emitting plates 20. By resonating the power supply circuit 16 (LC series resonance circuit consisting of an inductive element L1 and a capacitive element C1, and an LC series resonant circuit consisting of an inductive element L2 and a capacitive element C2), which is mainly magnetically coupled to the radiating plates 20, the wireless IC device 1i provides a wired IC chip 5 is only a received signal in a predetermined frequency band. In this case, the wireless IC device 1i extracts a predetermined energy from the received signal, and by using this energy as an excitation source, the wireless IC device 1i combines information stored in the wireless IC chip 5 with a predetermined frequency in the power supply circuit 16. Then, the wireless IC device 1i distributes the transmitted signal from the inductive elements L1 and L2 of the power supply circuit 16 to the radiating plates 20 by magnetic coupling. The radiating plates 20 transmit a transmitted signal to a reader / writer.

Tenth embodiment (see FIGS. 16-18)

According to a tenth embodiment, as shown in FIG. 16, the wireless IC device 1j is of the type of unbalanced vibrator. The power supply circuit 16 includes an LC series resonant circuit, which consists of an inductive element L and a capacitive element C contained in the circuit board 10 of the power supply circuit. As shown in FIG. 17, the coil-shaped electrode pattern that forms the inductive element L has a winding axis that is perpendicular to the radiating plate 20. The power supply circuit 16 is predominantly magnetically coupled to the radiating plate 20.

More specifically, as shown in FIG. 18, ceramic sheets 31A-31F made of dielectric material are glued, pressed and sintered so as to form a board 10 of the energy supply circuit. The ceramic sheet 31A includes connecting electrodes 32 and conduits 33a formed therein through openings. The ceramic sheet 31B includes a capacitor electrode 34a and a conductor passing through the hole 33b formed therein. The ceramic sheet 31C includes a capacitor electrode 34b passing through an opening of a conductor 33c and passing through an opening of a conductor 33b formed therein. The (at least one) ceramic sheet 31D includes a conductor pattern 35a passing through an opening of a conductor 33d and passing through an opening of a conductor 33b formed therein. The (at least one) ceramic sheet 31E includes a conductor pattern 35b passing through a hole of a conductor 33e and passing through a hole of a conductor 33b formed therein. Ceramic sheet 31F includes a conductor pattern 25c formed therein.

By bonding the ceramic sheets 31A-31F, an energy supply circuit 16 including an LC series resonance circuit can be obtained. In the LC series resonant circuit, the capacitive element C is connected in series with the inductive element L having a spiral axis of the winding that is parallel to the radiating plate 20. The capacitor electrode 34a is connected to one of the connecting electrodes 32 via a conductor 33a passing through the hole. In addition, the capacitive electrode 34a is connected to the wireless IC chip 5 by a solder contact pin 6. One end of the inductive element L is connected to the other connecting electrode 32 by a conductor 33b passing through the hole and further connected to the wireless IC chip 5 by the solder contact pin 6 .

The operation and advantages of the ninth embodiment are essentially the same as the first embodiment. Those. the wireless IC device 1j receives a high frequency signal (for example, a signal in the UHF band) emitted from a reader / writer (not shown) in the emitting plate 20. By resonating the power supply circuit 16 (LC series resonance circuit consisting of the inductive element L and the capacitive element C), which is mainly magnetically coupled to the radiating plate 20, the wireless IC device 1j provides only the received signal to the wireless IC chip 5 in a predetermined frequency band. In this case, the wireless IC device 1j extracts a predetermined energy from the received signal, and by using this energy as an excitation source, the wireless IC device 1j combines information stored in the wireless IC chip 5 with a predetermined frequency in the power supply circuit 16. Then, the wireless IC device 1j distributes the transmitted signal from the inductive element L of the power supply circuit 16 to the radiating plate 20 by magnetic coupling. The radiating plate 20 transmits a transmitted signal to a reader / writer.

In particular, according to the tenth embodiment, since the pattern of the electrodes in the form of a coil has a winding axis perpendicular to the radiating plate 20, the component of the magnetic flux entering the radiating plate 20 increases. Therefore, the energy propagation efficiency of the signal is increased, and the gain is increased.

Eleventh embodiment (see FIG. 19)

According to the eleventh embodiment, as shown by the equivalent circuit in FIG. 19, in the wireless IC device 1k, the winding width (coil diameter) of the electrode pattern in the form of a coil of the inductive element L described in the tenth embodiment is gradually increased in the direction of the radiating plate 20. Another structure is similar to that of the tenth embodiment.

The operation and advantages of the eleventh embodiment are similar to the tenth embodiment. In addition, since the width of the winding (coil diameter) of the pattern of electrodes in the form of a coil of the inductive element L gradually increases in the direction of the radiating plate 20, the signal energy distribution efficiency is increased.

Twelfth Embodiment (see FIGS. 20 and 21)

According to a twelfth embodiment, as shown by the equivalent circuit in FIG. 20, the wireless IC device 1l has a symmetrical vibrator type. The wireless IC device 1l includes an energy supply circuit 16, consisting of two LC-series resonant circuits located on the power supply circuit board 10.

More specifically, as shown in FIG. 21, ceramic sheets 41A-41F made of dielectric material are glued, pressed and sintered so as to form a board 10 of the power supply circuit. The ceramic sheet 41A includes connecting electrodes 42 and conductive wires 43a formed therein through openings. Ceramic sheet 41B includes capacitor electrodes 44a formed therein. Ceramic sheet 41C includes capacitor electrodes 44b and conductive wires 43b formed therein through openings. The (at least one) ceramic sheet 41D includes conductor patterns 45a and conduits 43c formed therein through openings. The (at least one) ceramic sheet 41E includes conductor patterns 45b and conduits 43d formed through holes formed therein. Ceramic sheet 41F includes conductor patterns 45c formed therein.

By bonding the ceramic sheets 41A-41F, an energy supply circuit 16 including an LC series resonance circuit can be obtained. In an LC series resonant circuit, capacitive elements C1 and C2 are connected in series with inductive elements L1 and L2 having helical axis of the winding that are perpendicular to the radiating plate 20, respectively. Capacitor electrodes 44a are connected to the connecting electrodes 42 via conductors 43a passing through the hole. In addition, the capacitor electrodes 44a are connected to the wireless IC chip 5 by means of contact solder posts 6.

The operation and advantages of the twelfth embodiment are essentially the same as the first embodiment. Those. the wireless IC device 1l receives a high frequency signal (for example, a signal in the UHF band) emitted from a reader / writer (not shown) in the emitting plates 20. By resonating the power supply circuit 16 (LC series resonance circuit consisting of the inductive element L1 and the capacitive element C1, and an LC series resonant circuit consisting of the inductive element L2 and the capacitive element C2), which is mainly magnetically coupled to the radiating plates 20, the wireless IC device 1l provides a wired IC chip 5 is only a received signal in a predetermined frequency band. In this case, the wireless IC device 1l extracts a predetermined energy from the received signal and by using this energy as an excitation source, the wireless IC device 1l combines information stored in the wireless IC chip 5 with a predetermined frequency in the power supply circuit 16. Then, the wireless IC device 1l distributes the transmitted signal from the inductive elements L1 and L2 of the power supply circuit 16 to the radiating plates 20 by magnetic coupling. The radiating plates 20 transmit a transmitted signal to a reader / writer.

Moreover, the capacitive elements C1 and C2 are placed at the output of the wireless IC chip 5. The capacitive element C1 is placed between the wireless IC chip 5 and the inductive element L1, and the capacitive element C2 is placed between the wireless IC chip 5 and the inductive element L2. Accordingly, the emission resistance is increased. Since the surge is a low-frequency electric current up to 200 MHz, the surge can be eliminated by capacitive elements C1 and C2. Thus, damage to the wireless IC chip 5 due to ejection is prevented.

Note that according to the twelfth embodiment, the resonance circuit consisting of the capacitive element C1 and the inductive element L1 is not connected to the resonance circuit consisting of the capacitive element C2 and the inductive element L2.

Thirteenth Embodiment (See FIG. 22)

According to a thirteenth embodiment, as shown in FIG. 22, in the wireless IC device 1m, a power supply circuit 56 including a coil-shaped electrode pattern, i.e. a spiral-shaped inductive element is formed on the surface of the board 50 of the energy supply circuit, which is a rigid single-layer board formed of ceramic or heat-resistant polymer. Any end of the power supply circuit 56 is directly connected to the wireless IC chip 5 via a solder contact post. The power supply circuit board 50 is attached to the film 21, which contains the radiating plate 20, by means of a bonding agent. In addition, the conductor pattern 56a is separated from the conductor patterns 56b and 56c that intersect the conductor pattern 56a by means of an insulating film (not shown).

According to a thirteenth embodiment, the power supply circuit 56 forms an LC-parallel resonance circuit in which a floating electric capacitance formed between helically wound patterns of conductors is used as a capacitive component. The power supply circuit board 50 is a single layer board made of dielectric material or magnetic material.

According to a thirteenth embodiment, in the wireless IC device 1m, the power supply circuit 56 is advantageously magnetically coupled to the radiating plate 20. Accordingly, as in the above-described embodiments, the wireless IC device 1m receives a high frequency signal (for example, a signal in the UHF band), emitted from a reader / writer (not shown) in the radiating plate 20. By resonating the power supply circuit 56, the wireless IC device 1m provides only the received signal to the wireless IC chip 5 l in a predetermined frequency band. In this case, the wireless IC device 1m extracts a predetermined energy from the received signal, and by using this energy as an excitation source, the wireless IC device 1m combines information stored in the wireless IC chip 5 with a predetermined frequency in the power supply circuit 56. Then, the wireless IC device 1m distributes the transmitted signal from the inductive element of the power supply circuit 56 to the radiating plate 20 by magnetic coupling. The radiating plate 20 transmits a transmitted signal to a reader / writer.

Similar to the first embodiment, the wireless IC chip 5 is mounted on a rigid board 50 of a power supply circuit having a small area. Accordingly, the wireless IC chip 5 can be precisely positioned and can be connected to the board 50 of the power supply circuit using a solder contact post.

Fourteenth embodiment (see FIGS. 23 and 24)

According to the fourteenth embodiment, as shown in FIG. 23, in the wireless IC device 1n, the power supply circuit 56 includes a coil-shaped electrode pattern contained in the power supply circuit board 50. As shown in FIG. 24, ceramic sheets 51A-51D made of dielectric material are glued, pressed, and sintered so as to form a power supply circuit board 50. The ceramic sheet 51A includes connecting electrodes 52 and conduits 53a formed therein through openings. The ceramic sheet 51B includes conductor patterns 54a and conduits 53b and 53c passing through the openings formed therein. Ceramic sheet 51C includes a conductor pattern 54b formed therein. Each of the plurality of ceramic sheets 51D does not carry components.

By gluing the sheets 51A-51D, a power supply circuit board 50 may be obtained comprising an energy supply circuit 56. The power supply circuit 56 includes a resonant circuit consisting of a spiral wound inductive element and a capacitive element defined by a floating electric capacitance between the lines of the spiral wound electrode pattern. The connecting electrodes 52 located at one end of the power supply circuit 56 are connected to the wireless IC chip 5 by solder contact posts 6. The operation and advantages of the fourteenth embodiment are the same as in the thirteenth embodiment.

Fifteenth embodiment (see FIGS. 25 and 26)

According to the fifteenth embodiment, as shown by the equivalent circuit in FIG. 25, the wireless IC device 1o includes a wireless IC chip 5 and a power supply circuit board 10 that are capacitively coupled to each other, and the power supply circuit board 10 is directly connected with a radiating plate 20. The power supply circuit board 10 includes an energy supply circuit 16 including two LC-series resonant circuits. The winding axes of the inductive elements L1 and L2 are perpendicular to the radiating plate 20. One end of the inductive element L1 and one end of the inductive element L2 are connected to the capacitor electrodes 65a and 65b, which form the capacitive elements C1 and C2 (see Fig. 26), respectively. The other end of the inductive element L1 and the other end of the inductive element L2 are directly connected to each other by means of a connecting electrode 62 located on the upper surface (in FIGS. 25 and 26) of the board 10. In addition, the capacitor electrodes 66a and 66b, which form the capacitive elements C1 and C2 (see FIG. 26), respectively, are located on the upper surface (in FIGS. 25 and 26) of the wireless IC chip 5.

More specifically, as shown in FIG. 26, ceramic sheets 61A-61G made of dielectric material are glued, pressed and sintered so as to form a board 10 of the power supply circuit. The ceramic sheet 61A includes a connecting electrode 62 and conductors 63a formed therein through the openings. Each of the sheets 61B-61F includes conductor patterns 64a and 64b and conduits 63c and 63d passing through the openings formed therein. The sheet 61G includes capacitor electrodes 65a and 65b formed therein.

By gluing ceramic sheets 61A-61G, an energy supply circuit 16 including two LC series resonant circuits can be obtained. In two LC-series resonant circuits, the capacitive elements C1 and C2 are connected in series with the inductive elements L1 and L2, respectively.

Those. the capacitive element C1 is formed between two parallel flat patterns of the electrodes, i.e. between an electrode 66a serving as a pattern of electrodes on the side of the chip, and an electrode 65a acting as a pattern of electrodes on the side of the board. Capacitive element C2 is formed between two parallel flat electrode patterns, i.e. between an electrode 66b serving as an electrode pattern on a chip side and an electrode 65b serving as an electrode pattern on a board side. The wireless IC chip 5 is attached and connected to the circuit board 10 of the power supply circuit using an insulating bonding layer. The circuit board 10 of the energy supply circuit is also directly connected to the radiating plate 20 by means of a connecting electrode 62, which is a second electrode pattern on the circuit board side. The connecting electrode 62 and the radiating plate 20 can be connected to each other by solder, conductive bonding agent, etc.

The operation and advantages of the fifteenth embodiment are the same as in the first embodiment. Those. the wireless IC device 1o receives a high frequency signal (for example, a signal in the UHF band) emitted from a reader / writer (not shown) in the emitting plate 20. By resonating the power supply circuit 16 (LC series resonance circuit consisting from an inductive element L1 and a capacitive element C1, and an LC series resonant circuit consisting of an inductive element L2 and a capacitive element C2), which is directly connected to the radiating plate 20, the wireless IC device 1o provides a wireless IC mic 5 oskhemu only a reception signal in a predetermined frequency band. In this case, the wireless IC device 1o extracts a predetermined energy from the received signal, and by using this energy as an excitation source, the wireless IC device 1o combines the information stored in the wireless IC chip 5 with a predetermined frequency in the power supply circuit 16. The wireless IC device 1o then distributes the transmitted signal to the radiating plate 20, which is directly connected to the power supply circuit 16. The radiating plate 20 transmits a transmitted signal to a reader / writer. The power supply circuit 16 is capacitively coupled to the wireless IC chip 5 by capacitance elements C1 and C2, so that electric power and transmitted / received signals are transmitted between them.

The areas of the capacitor electrodes 65a and 65b formed on the power supply circuit board 10 are larger than the areas of the capacitor electrodes 66a and 66b formed on the wireless IC chip 5, respectively. Therefore, even when the placement accuracy of the wireless IC chip 5 on the power supply circuit board 10 varies to some extent, variations in the capacitance formed between the capacitor electrodes 65a and 66a and between the capacitor electrodes 65b and 66b are reduced. In addition, capacitive elements C1 and C2 are placed at the output of the wireless IC chip 5, which increases the resistance to ejection.

Sixteenth embodiment (see FIGS. 27 and 28)

According to a sixteenth embodiment, as shown by the equivalent circuit in FIG. 27, in the wireless IC device 1p, the power supply circuit board 10 is capacitively coupled to the radiating plates 20. The power supply circuit board 10 includes a power supply circuit 16 including two LCs - sequential resonant circuits. One end of the inductive element L1 and one end of the inductive element L2 are connected to the wireless IC chip 5. The other end of the inductive element L1 and the other end of the inductive element L2 are connected to the capacitor electrodes 72a and 72b, which are located on the upper surface (Figs. 27 and 28 ) boards 10 and which form capacitive elements C1 and C2 (see FIG. 28), respectively. The end portion 20a of one of the radiating plates 20 acts as another capacitor electrode for the capacitive element C1, while the end portion 20b of the other radiating plates 20 acts as another capacitor electrode for the capacitive element C2.

More specifically, as shown in FIG. 28, ceramic sheets 71A-71F made of dielectric material are glued, pressed and sintered so as to form a board 10 of the energy supply circuit. Ceramic sheet 71A includes capacitor electrodes 72a and 72b and conductive wires formed through it through openings 73a and 73b. Each of the sheets 71B-71E includes conductor patterns 74a and 74b and conduits 73c and 63d passing through the openings formed therein. The sheet 71F includes conductor patterns 74a and 74b formed on one surface and connection electrodes 75a and 75b formed on the other surface. The electrode patterns 74a and 74b of the sheet 71F are connected to the connecting electrodes 75a and 75b through conductors passing through the hole 73e and 73f, respectively.

By bonding the ceramic sheets 71A-71F, an energy supply circuit 16 including two LC series resonant circuits can be obtained. In two LC-series resonant circuits, the capacitive elements C1 and C2 are connected in series with the inductive elements L1 and L2, respectively. By bonding the board 10 of the energy supply circuit to the radiating plates 20 by means of a bonding agent, the capacitor electrodes 72a and 72b, which are flat electrode patterns parallel to the radiating plates 20, are located opposite the end portions 20a and 20b of the radiating plates 20, respectively, with an insulating coupling agent between them , and thus the capacitive elements C1 and C2 are defined. In addition, by connecting the connecting electrodes 75a and 75b to the wireless IC chip 5 via soldered contact bars, one end of the conductive element L1 and one end of the conductive element L2 are connected to the wireless IC chip 5, and therefore, the power supply circuit board 10 is directly connected with wireless IC chip 5.

If the bonding agent includes, for example, particles of a dielectric material, the bonding agent layer has a dielectric property, and the electric capacitance of the capacitive elements C1 and C2 increases. In addition, although the sixteenth embodiment is described with reference to the case where the capacitor electrodes 72a and 72b serving as electrode patterns on the board side are arranged on the upper surface (in FIGS. 27 and 28) of the power supply circuit board 10, the capacitor electrodes 72a and 72b may be formed within the board 10 of the power supply circuit (but at a position adjacent to the radiating plates 20). Alternatively, capacitor electrodes 72a and 72b may be formed in the inner layer of the board 10.

The operation and advantages of the sixteenth embodiment are essentially the same as in the first embodiment. Those. the wireless IC device 1p receives a high frequency signal (for example, a signal in the UHF band) emitted from a reader / writer (not shown) in the radiating plate 20. By resonating the power supply circuit 16 (LC series resonance circuit consisting of the inductive element L1 and the capacitive element C1, and the LC-series resonant circuit consisting of the inductive element L2 and the capacitive element C2), which is capacitively coupled to the radiating plates 20, the wireless IC device 1p provides to the wireless AND 5 -mikroskhemu only a reception signal in a predetermined frequency band. In this case, the wireless IC device 1p extracts a predetermined energy from the received signal, and by using this energy as an excitation source, the wireless IC device 1p combines the information stored in the wireless IC chip 5 with a predetermined frequency in the power supply circuit 16. Then, the wireless IC device 1p distributes the transmitted signal to the radiating plates 20 through capacitive coupling provided by the capacitive elements C1 and C2. The radiating plate 20 transmits a transmitted signal to a reader / writer.

Seventeenth embodiment (see FIGS. 29-31)

According to a seventeenth embodiment, as shown by the equivalent circuit in FIG. 29, the wireless IC device 1q includes an energy supply circuit 16 including inductance elements L1 and L2 that are magnetically coupled to each other. The inductive element L1 is connected to the wireless IC chip 5 by capacitive elements C1a and C1b. In addition, the inductive element L1 is connected to the inductive element L2 in parallel by the capacitive elements C2a and C2b. Those. the power supply circuit 16 includes an LC series resonant circuit consisting of an inductance element L1 and capacitive elements C1a and C1b. The power supply circuit 16 includes an LC series resonant circuit consisting of an inductive element L2 and capacitive elements C2a and C2b. Two resonant circuits are connected to each other by magnetic coupling indicated by M in FIG. 29. In addition, two inductive elements L1 and L2 are magnetically coupled to the radiating plate 20.

More specifically, as shown in FIG. 30, ceramic sheets 81A-81H made of dielectric material are glued, pressed, and sintered so as to form a board 10 of an energy supply circuit. Sheet 81A does not have components formed therein. The sheet 81B includes conductor patterns 82a and 82b and conduits 83a, 83b, 84a and 84b formed therein through openings. The sheet 81C includes conductor patterns 82a and 82b and conduits 83c, 84c, 83e, and 34e passing through the openings formed therein. The sheet 81D includes conductor patterns 82a and 82b and conduits 83d, 84d, 83e and 34e passing through the openings formed therein. The sheet 81E includes capacitor electrodes 85a and 85b and a conductor 83e formed through the hole formed therein. The sheet 81F includes capacitor electrodes 86a and 86b formed therein. Sheet 81G has no components formed therein. The sheet 81H includes capacitor electrodes 87a and 87b formed in its lower surface (in FIG. 30).

By gluing sheets 81A-81H, the patterns 82a of the conductors are connected to each other by means of the conductors 83b and 83c passing through the hole so as to form an inductive element L1. In addition, the patterns 82b of the conductors are connected to each other by passing through the hole conductors 84b and 84c so as to form an inductive element L2. Capacitor electrodes 86a and 87a form a capacitive element C1a. The capacitor electrode 86a is connected to one end of the inductance element L1 by a conductor 83e passing through the hole. Capacitor electrodes 86b and 87b form a capacitive element C1b. The capacitor electrode 86b is connected to the other end of the inductance element L1 by a conductor 83d passing through the hole. In addition, the capacitor electrodes 85a and 86a form a capacitive element C2a. The capacitor electrode 85a is connected to one end of the inductance element L2 by a conductor 84e passing through the hole. Capacitor electrodes 85b and 86b form a capacitive element C2b. The capacitor electrode 85b is connected to the other end of the inductance element L2 by a conductor 84d passing through the hole.

The operation and advantages of the seventeenth embodiment are essentially the same as the first embodiment. Those. the wireless IC device 1q receives a high-frequency signal (for example, a signal in the UHF band) emitted from a reader / writer (not shown) in the radiating plate 20. By resonating the power supply circuit 16 (LC series resonance circuit consisting of an inductive element L1 and capacitive elements C1a and C1b, and an LC series resonant circuit consisting of an inductive element L2 and capacitive elements C2a and C2b), which is mainly magnetically coupled to the radiating plate 20, the wireless IC device 1q provides t in the wireless IC chip 5 only the received signal in a predetermined frequency band. In this case, the wireless IC device 1q extracts a predetermined energy from the received signal and by using this energy as an excitation source, the wireless IC device 1q combines the information stored in the wireless IC chip 5 with a predetermined frequency in the power supply circuit 16. Then, the wireless IC device 1q distributes the transmitted signal from the inductive elements L1 and L2 of the power supply circuit 16 to the radiating plate 20 by magnetic coupling. The radiating plate 20 transmits a transmitted signal to a reader / writer.

In particular, according to the seventeenth embodiment, as shown in FIG. 31, the X bandwidth in which a reflection characteristic of -5 dB or less can be obtained is a very wide frequency band, not less than about 150 MHz. This is because the power supply circuit 16 includes a plurality of LC resonance circuits having inductance elements L1 and L2 that are magnetically coupled to each other with a high degree of coupling. In addition, capacitive elements C1a and C1b are placed at the output of the wireless IC chip 5, which increases the resistance to ejection.

Eighteenth Embodiment (See FIGS. 32-34)

According to the eighteenth embodiment, as shown by the equivalent circuit in FIG. 32, the wireless IC device 1r includes an energy supply circuit 16 including inductance elements L1 and L2 that are magnetically coupled to each other with a high degree of coupling. The inductive element L1 is magnetically coupled to the inductive element L5 provided in the wireless IC chip 5. The inductive element L2 and the capacitive element C2 form an LC series resonant circuit. The capacitive element C1 is capacitively coupled to the radiating plate 20. The capacitive element C3 is inserted between the capacitive elements C1 and C2.

More specifically, as shown in FIG. 33, ceramic sheets 91A-91E made of dielectric material are glued, pressed and sintered so as to form a board 10 of the power supply circuit. The sheet 91A includes conductor patterns 92a and 92b and conduits 93a, 93b, 94a and 94b passing through the openings formed therein. The sheet 91B includes a capacitor electrode 95 and conductors formed therein through openings 93c, 93d and 94c. The sheet 91C includes a capacitor electrode 96 and conduits 93c and 93d passing through the openings formed therein. The sheet 91D includes a capacitor electrode 97 and a conductor passing through the hole 93c and 93d formed therein. Sheet 91E includes a capacitor electrode 98.

When the sheets 91A-91E are glued, the conductor pattern 92a forms an inductive element L1. The conductor pattern 92b forms an inductive element L2. Capacitor electrodes 97 and 98 form a capacitive element C1. One end of the inductive element L1 is connected to the capacitor electrode 98 through conductors 93a and 93c passing through the hole. The other end of the inductive element L1 is connected to the capacitor electrode 97 through conductors 93b and 93d passing through the hole. Capacitor electrodes 95 and 96 form a capacitive element C2. One end of the inductance element L2 is connected to the capacitor electrode 96 through conductors 94a and 94c passing through the hole. The other end of the inductance element L2 is connected to the capacitor electrode 95 by a conductor 94b passing through the hole. In addition, the capacitor electrodes 96 and 97 form a capacitive element C3.

Moreover, as shown in FIG. 34, a coil-shaped electrode pattern 99 is placed on the surface of the wireless IC chip 5 as an electrode pattern on the microchip side, and a coil-shaped electrode pattern 99 defines an inductive element L5. A protective film, such as a polymer film, is provided on the surface of the pattern of 99 electrodes in the form of a coil. Thus, the inductance elements L1 defined by the coil-shaped electrode pattern serving as the electrode pattern on the board side are magnetically coupled to the coil-shaped electrode pattern 99.

The operation and advantages of the eighteenth embodiment are essentially the same as the first embodiment. Those. the wireless IC device 1r receives a high-frequency signal (for example, a signal in the UHF band) emitted from a reader / writer (not shown) in the radiating plate 20. By resonating the power supply circuit 16 (LC series resonance circuit consisting of the inductive element L2 and the capacitive element C2), which is capacitively and magnetically coupled to the radiating plate 20, the wireless IC device 1r provides only the received signal in a predetermined frequency band to the wireless IC chip 5. In this case, the wireless IC device 1r extracts a predetermined energy from the received signal, and by using this energy as an excitation source, the wireless IC device 1r combines the information stored in the wireless IC chip 5 with a predetermined frequency in the power supply circuit 16. Then, the wireless IC device 1r distributes the transmitted signal from the inductive elements L1 and L2 of the power supply circuit 16 to the radiating plate 20 by magnetic coupling. The radiating plate 20 transmits a transmitted signal to a reader / writer. The power supply circuit 16 is magnetically coupled to the wireless IC chip 5 by means of inductive elements L1 and L5. In this way, electrical energy and transmitted / received signals are transmitted.

Nineteenth Embodiment (See Figs. 35 and 36)

According to a nineteenth embodiment, as shown by the equivalent circuit in Fig. 35, the wireless IC device 1s includes an energy supply circuit 16 including inductance elements L1, L2 and L3 that are magnetically coupled to each other with a high degree of coupling. The inductive element L1 is magnetically coupled to the inductive element L5 provided in the wireless IC chip 5. The inductive element L2 and the capacitive elements C1a and C1b form an LC series resonant circuit. Inductive element L3 and capacitive elements C2a and C2b form an LC series resonant circuit. Inductive elements L1, L2 and L3 are magnetically coupled to the radiating plate 20.

More specifically, as shown in FIG. 36, ceramic sheets 101A-101E made of dielectric material are glued, pressed and sintered so as to form a board 10 of the energy supply circuit. The ceramic sheet 101A includes a conductor pattern 102a and conduits 103a and 103b passing through the openings formed therein. The sheet 101B includes capacitor electrodes 104a and 104b formed therein. The sheet 101C includes capacitor electrodes 105a and 105b and conduits 103c and 103d passing through the holes formed therein. The sheet 101D includes capacitor electrodes 106a and 106b passing through openings of conductors 103c and 103d and passing through openings of conductors 103e and 103f formed therein. The sheet 101E includes conductor patterns 102b and 102c formed therein. Those. a space is formed between the electrodes 104a, 105a and 106a and the electrodes 104b, 105b and 106b, which define the capacitive elements so that magnetic fluxes flowing from the inductive element L1 reach the inductive elements L2, L3 and the radiating plate 20.

When the sheets 101A-101E are glued, the conductor pattern 102a forms an inductive element L1. The conductor pattern 102b forms an inductive element L2. The conductor pattern 102c forms an inductive element L3. Capacitor electrodes 104a and 105a form a capacitive element C1a. Capacitor electrodes 104b and 105b form a capacitive element C1b. Capacitor electrodes 105a and 106a form a capacitive element C2a. Capacitor electrodes 105b and 106b form a capacitive element C2b.

One end of the inductance element L1 is connected to the capacitor electrode 104a by a conductor 103a passing through the hole. The other end of the inductive element L1 is connected to the capacitor electrode 104b through a conductor 103b passing through the hole. One end of the inductance element L2 is connected to the capacitor electrode 105a by a conductor 103c passing through the hole. The other end of the inductance element L2 is connected to the capacitor electrode 106b by a conductor 103f passing through the hole. One end of the inductive element L3 is connected to the capacitor electrode 106a by means of a conductor 103e passing through the hole. The other end of the inductive element L3 is connected to the capacitor electrode 105b through a conductor 103d passing through the hole.

Moreover, a coil-shaped electrode pattern 99, as shown in FIG. 34, is placed on the surface of the wireless IC chip 5 as an electrode pattern on the chip side, and a coil-shaped electrode pattern 99 defines an inductive element L5. A protective film, such as a polymer film, is provided on the surface of the pattern of 99 electrodes in the form of a coil. Thus, the inductive element L1 defined by the coil-shaped electrode pattern serving as the electrode pattern on the board side is magnetically coupled to the coil-shaped electrode pattern 99.

The operation and advantages of the nineteenth embodiment are essentially the same as the seventeenth embodiment. Those. the wireless IC device 1s receives a high frequency signal (for example, a signal in the UHF band) emitted from a reader / writer (not shown) in the emitting plate 20. By resonating the power supply circuit 16 (LC series resonance circuit consisting of an inductive element L2 and capacitive elements C1a and C1b, and an LC series resonant circuit consisting of an inductive element L3 and capacitive elements C2a and C2b), which is magnetically coupled to the radiating plate 20, the wireless IC device 1s provides to the wireless IC chip 5 is only a received signal in a predetermined frequency band. In this case, the wireless IC device 1s extracts a predetermined energy from the received signal, and by using this energy as an excitation source, the wireless IC device 1s combines the information stored in the wireless IC chip 5 with a predetermined frequency in the power supply circuit 16. The wireless IC device 1s then distributes the transmitted signal from the inductive elements L1, L2, and L3 of the power supply circuit 16 to the radiating plate 20 by magnetic coupling. The radiating plate 20 transmits a transmitted signal to a reader / writer. The power supply circuit 16 is magnetically coupled to the wireless IC chip 5 by the inductance elements L1 and L5, and thus, the electric power and the transmitted / received signals are transmitted.

In particular, according to a nineteenth embodiment, the power supply circuit 16 includes a plurality of LC resonance circuits having inductance elements L2 and L3 that are magnetically coupled to each other. Therefore, similarly to the seventeenth embodiment, the frequency band is increased.

Twentieth Embodiment (See Figs. 37-42)

According to a twentieth embodiment, the wireless IC device 1t includes a single-layer type power circuit board 110. The equivalent circuit of the wireless IC device 1t is similar to that shown in FIG. 3. Those. the power supply circuit 16 includes an LC series resonant circuit in which capacitive elements C1 and C2 are connected to one end of the inductive element L. The power supply circuit board 110 is a ceramic board made of a dielectric material. As shown in FIG. 37, capacitor electrodes 111a and 111b are formed on a first surface of the power supply circuit board 110. Capacitor electrodes 112a and 112b and a conductor pattern 113 are formed on a second surface of the power supply circuit board 110. Capacitor electrodes 111a and 112a form a capacitive element C1. Capacitor electrodes 111b and 112b form a capacitive element C2.

The operation and advantages of the twentieth embodiment are essentially the same as the seventeenth embodiment. Those. the wireless IC device 1t receives a high-frequency signal (for example, a signal in the UHF band) emitted from a reader / writer (not shown) in the radiating plate 20. By resonating the power supply circuit 16 (LC series resonance circuit consisting of the inductive element L and the capacitive elements C1 and C2), which is magnetically coupled to the radiating plate 20, the wireless IC device 1t provides only the received signal to the wireless IC chip 5 in a predetermined frequency band. In this case, the wireless IC device 1t extracts a predetermined energy from the received signal, and by using this energy as an excitation source, the wireless IC device 1t combines the information stored in the wireless IC chip 5 with a predetermined frequency in the power supply circuit 16. The wireless IC device 1t then distributes the transmitted signal from the inductive element L of the power supply circuit 16 to the radiating plate 20 by magnetic coupling. The radiating plate 20 transmits a transmitted signal to a reader / writer.

In particular, according to the twentieth embodiment, as shown in FIGS. 38 and 39, the inductive element L overlaps the wireless IC chip 5 only partially when viewed from above. Accordingly, most of the magnetic flux generated by the inductive element L is not blocked by the wireless IC chip 5. Thus, the magnetic flux increases significantly.

In addition, according to a twentieth embodiment, as shown in FIG. 40, a board 110 of an energy supply circuit having a wireless IC chip 5 mounted thereon can be interposed between the radiating plates 20. Thus, the magnetic coupling efficiency between the supply circuit 16 energy and radiating plates 20 increases, and the gain also increases.

As examples of the placement of two radiating plates 20 on the upper surface and on the lower surface of the circuit board 110 of the energy supply circuit, respectively, the radiating plates 20 can be placed in a line in the x-axis direction, as shown in Fig. 41, and alternatively, can be placed in the x axis direction and the y axis direction, respectively, as shown in FIG. 42.

Twenty-First Embodiment (See FIG. 43)

According to a twenty-first embodiment, the wireless IC device 1u includes an inductive element L formed from a meander pattern of electrodes. The equivalent circuit of the wireless IC device 1u is similar to that shown in FIG. 3. Those. power supply circuit 16 includes an LC series resonant circuit in which capacitive elements C1 and C2 are connected to one end of the inductance element L. The power supply circuit board 110 is a ceramic single layer board made of a dielectric material. As shown in FIG. 43, capacitor electrodes 121a and 121b are formed on a first surface of the power supply circuit board 110. Capacitor electrodes 122a and 122b and a meander pattern 123 of conductors are formed on a second surface of the power supply circuit board 110. Capacitor electrodes 121a and 122a form a capacitive element C1. Capacitor electrodes 121b and 122b form a capacitive element C2.

The operation and advantages of the twenty-first embodiment are essentially the same as the first embodiment. Those. the wireless IC device 1u receives a high frequency signal (for example, a signal in the UHF band) emitted from the reader / writer (not shown) in the radiating plate 20. By resonating the power supply circuit 16 (LC series resonance circuit consisting of the inductive element L and the capacitive elements C1 and C2), which is magnetically coupled to the radiating plate 20, the wireless IC device 1u provides only the received signal in a predetermined frequency band to the wireless IC chip 5. In this case, the wireless IC device 1u extracts a predetermined energy from the received signal, and by using this energy as an excitation source, the wireless IC device 1u combines information stored in the wireless IC chip 5 with a predetermined frequency in the power supply circuit 16. Then, the wireless IC device 1u distributes the transmitted signal from the inductive element L of the power supply circuit 16 to the radiating plate 20 by magnetic coupling. The radiating plate 20 transmits a transmitted signal to a reader / writer.

In particular, according to the twenty-first embodiment, as shown in FIGS. 38 and 39, since the inductive element L consists of a meander pattern 123 of conductors, the wireless IC device 1u can efficiently transmit and receive a high frequency signal.

In the twentieth and twenty-first embodiments, the implementation of the circuit board 110 of the power supply circuit may be a multilayer board.

Twenty-second embodiment (see FIGS. 44 and 45)

According to a twenty-second embodiment, as shown by the equivalent circuit in FIG. 44, the wireless IC device 1v includes an energy supply circuit 16 including inductance elements L1 and L2 that are magnetically coupled to each other (indicated by a reference symbol M ) One end of the inductive element L1 is connected to the wireless IC chip 5 by the capacitive element C1 and the connecting electrode 131a and is additionally connected to one end of the inductive element L2 by the capacitive element C2. The other end of the inductive element L1 and the other end of the inductive element L2 are connected to the wireless IC chip 5 by means of a connecting electrode 131b. Those. the power supply circuit 16 includes an LC series resonant circuit consisting of an inductive element L1 and a capacitive element C1, an LC series resonant circuit consisting of an inductive element L2 and a capacitive element C2. Inductive elements L1 and L2 are magnetically coupled to the radiating plate 20.

The power supply circuit board 10 is configured as shown in FIG. The connecting electrode 131a is connected to the capacitor electrode 133 by a conductor 132a passing through the hole. A capacitor electrode 133 is placed opposite the capacitor electrode 134 so as to form a capacitive element C1. In addition, the capacitor electrode 134 is placed opposite the capacitor electrode 135 so as to form a capacitive element C2. The connecting electrode 131b is connected to the bifurcated patterns 136a and 137a of the conductors by passing through the hole of the conductor 132b. The conductor pattern 136a is connected to the conductor pattern 136b by a conductor 132c passing through the opening. The conductor pattern 136b is connected to the conductor pattern 136c by a conductor 132d passing through the opening. The conductor pattern 136c is connected to the conductor pattern 136d by a conductor 132e passing through the opening. Finally, the conductor pattern 136d is connected to the capacitor electrode 134 by the conductor 132f passing through the hole.

In contrast, the conductor pattern 137a is connected to the conductor pattern 137b by a conductor 132g passing through the opening. The conductor pattern 137b is connected to the conductor pattern 137c by a conductor 132h passing through the opening. A conductor pattern 137c is connected to the capacitor electrode 135 by a conductor 132i passing through the hole. Conductor patterns 136a, 136b, and 136c form an inductive element L1. Conductor patterns 137a, 137b, and 137c form an inductive element L2. Note that in FIG. 45, ceramic sheets made of dielectric material are not shown.

The operation and advantages of the twenty-second embodiment are the same as in the first embodiment. Those. the wireless IC device 1v receives a high-frequency signal (for example, a signal in the UHF band) emitted from a reader / writer (not shown) in the radiating plate 20. By resonating the power supply circuit 16 (LC series resonance circuit consisting of the inductive element L1 and the capacitive element C1, and the LC series resonant circuit consisting of the inductive element L2 and the capacitive element C2), which is magnetically coupled to the radiating plate 20, the wireless IC device 1v provides the wireless IC micro Hem 5 with only a reception signal in a predetermined frequency band. In this case, the wireless IC device 1v extracts a predetermined energy from the received signal, and by using this energy as an excitation source, the wireless IC device 1v combines the information stored in the wireless IC chip 5 with a predetermined frequency in the power supply circuit 16. Then, the wireless IC device 1v distributes the transmitted signal to the radiating plate 20 from the inductive elements L1 and L2 of the power supply circuit 16 to the radiating plate 20 by magnetic coupling. The radiating plate 20 transmits a transmitted signal to a reader / writer.

In particular, according to the twenty-second embodiment, the capacitor electrode 133, 134, and 135, the inductance coil patterns 136a-136c and the inductance coil patterns 137a-137c are arranged so as to be parallel to the radiating plate 20. Accordingly, magnetic fields generated by means of inductance coil conductors figures 136a-136c and inductive coil conductors figures 137a-137c are not blocked by capacitor electrodes 133, 134 and 135. Thus, the radiation properties of figures 136a-136c and inductors with inductance coils 137a-137c are improved.

Twenty-Third Embodiment (See FIG. 46)

According to a twenty-third embodiment, a power supply circuit board 10 including an energy supply circuit 16 including an equivalent circuit as shown in FIG. 44 is used. As shown in FIG. 46, the power supply circuit board 10 has a structure similar to that of the power supply circuit board 10 shown in FIG. However, in addition to the structure shown in FIG. 45, a reflector (reflective pattern) 138 and a wave control unit (pattern of a wave control unit) 139 are provided in a section in which magnetic fields are generated by inductance coil patterns 136a-136c and drawings 137a-137c of conductors with inductive coils. By using the reflector 138 and the wave control unit 139, the radiation characteristic and directional characteristic from the power supply circuit 16 to the radiating plate 20 can be easily controlled. Thus, the external electromagnetic effect can be minimized, thereby stabilizing the resonance characteristics. The operation and advantages of the twenty-third embodiment are essentially the same as the twenty-second embodiment.

Twenty-fourth embodiment (see FIGS. 47 and 48)

According to a twenty-fourth embodiment, the wireless IC device 1w includes an energy supply circuit 150 formed as a resonant circuit on distributed-element cells in an inverted F-antenna configuration. Fig. 47 illustrates an equivalent circuit of a wireless IC device 1w. More specifically, as shown in FIG. 48, the power supply circuit board 140 is a multilayer board made of ceramic sheets. The power supply circuit board 140 includes an upper side electrode 151 located on its first surface 140a, a capacitor electrode 152 inside, and a lower side electrode 153 located on its second surface 140b. The upper side electrode 151 is electrically connected to the radiating plate 20 by magnetic coupling and capacitive coupling. The upper side electrode 151 is further connected to the upper side contact of the wireless IC chip 5 by means of a power supply terminal 154. The lower side electrode 153 is connected to the lower side contact of the wireless IC chip 5. The lower side electrode 153 is further connected to the upper side electrode 151 via a short circuit terminal 155. A capacitor electrode 152 is placed opposite the upper side electrode 151 so as to form an electric capacitance. The capacitor electrode 152 is connected to the low voltage electrode 153 via a short circuit terminal 156.

The wireless IC device 1w receives a high frequency signal emitted from a reader / writer (not shown) in the radiating plate 20. By resonating the power supply circuit 150, which is capacitively and magnetically coupled to the radiating plate 20, the wireless IC device 1w provides in the wireless IC chip 5, only the received signal in a predetermined frequency band. In this case, the wireless IC device 1w extracts a predetermined energy from the received signal, and by using this energy as an excitation source, the wireless IC device 1w combines information stored in the wireless IC chip 5 with a predetermined frequency in the power supply circuit 150. Then, the radiating plate 20 transmits information to the reader / writer.

Twenty-fifth embodiment (see FIGS. 49 and 50)

According to a twenty-fifth embodiment, the wireless IC device 1x includes an energy supply circuit 160 formed as a resonant circuit on elements with distributed parameters in an inverted configuration of an F antenna. 49 illustrates an equivalent circuit diagram of a 1x wireless IC device. More specifically, as shown in FIG. 50, the power supply circuit board 140 is a multilayer board made of ceramic sheets. The power supply circuit board 140 includes an upper side electrode 161 located on its first surface 140a, and a lower side electrode 162 placed on its second surface 140b. The upper side electrode 161 is electrically connected to the radiating plate 20 by magnetic coupling and capacitive coupling. The upper side electrode 161 is further connected to the upper side contact of the wireless IC chip 5 via the power transfer terminal 163. The lower side electrode 162 is connected to the lower side contact of the wireless IC chip 5. The lower side electrode 162 is further connected to the upper side electrode 161 via a short circuit terminal 164.

The 1x wireless IC device receives a high frequency signal emitted from a reader / writer (not shown) in the radiating plate 20. By resonating the power supply circuit 160, which is capacitively and magnetically coupled to the radiating plate 20, the 1x wireless IC device provides in the wireless IC chip 5, only the received signal in a predetermined frequency band. In this case, the wireless IC device 1x extracts a predetermined energy from the received signal, and by using this energy as an excitation source, the wireless IC device 1x combines the information stored in the wireless IC chip 5 with a predetermined frequency in the power supply circuit 160. Then, the radiating plate 20 transmits information to the reader / writer.

Twenty-sixth embodiment (see FIGS. 51 and 52)

According to a twenty-sixth embodiment, the wireless IC device 1y includes an energy supply circuit 170 formed as a resonant circuit on elements with distributed parameters in an inverted L-antenna configuration. Fig. 51 illustrates an equivalent circuit of a wireless IC device 1y. More specifically, as shown in FIG. 52, the power supply circuit board 140 is a multilayer board made of ceramic sheets. The power supply circuit board 140 includes an upper side electrode 171 located on its first surface 140a, and a lower side electrode 172 placed on its second surface 140b. The upper side electrode 171 is electrically connected to the radiating plate 20 by magnetic coupling and capacitive coupling. The upper side electrode 171 is further connected to the upper side contact of the wireless IC chip 5 by means of a power transfer terminal 173. The bottom side electrode 172 is connected to the bottom side contact of the wireless IC chip 5.

The wireless IC device 1y receives a high frequency signal emitted from a reader / writer (not shown) in the radiating plate 20. By resonating the power supply circuit 170, which is capacitively and magnetically coupled to the radiating plate 20, the wireless IC device 1y provides in the wireless IC chip 5, only the received signal in a predetermined frequency band. In this case, the wireless IC device 1y extracts a predetermined energy from the received signal, and by using this energy as an excitation source, the wireless IC device 1y combines the information stored in the wireless IC chip 5 with a predetermined frequency in the power supply circuit 170. Then, the radiating plate 20 transmits information to the reader / writer.

Twenty-seventh embodiment (see FIGS. 53 and 54)

According to a twenty-seventh embodiment, the wireless IC device 1z includes an energy supply circuit 180 formed as a resonant circuit on distributed-element cells in an inverted L-antenna configuration. Fig. 53 illustrates an equivalent circuit of a wireless IC device 1z. More specifically, as shown in FIG. 54, the power supply circuit board 140 is a multilayer board made of ceramic sheets. The power supply circuit board 140 includes an upper side electrode 181 located on its first surface 140a, a capacitor electrode 182 inside, and a lower side electrode 183 located on its second surface 140b. The upper side electrode 181 is electrically connected to the radiating plate 20 by magnetic coupling and capacitive coupling. A capacitor electrode 182 is placed opposite the upper side electrode 181 so as to form an electric capacitance. A capacitor electrode 182 is connected to a contact of the upper side of the wireless IC chip 5 via a power supply terminal 184. The lower side electrode 183 is connected to the lower side contact of the wireless IC chip 5. The lower side electrode 183 is further connected to the upper side electrode 181 via a short circuit terminal 185.

The wireless IC device 1z receives a high-frequency signal emitted from a reader / writer (not shown) in the radiating plate 20. By resonating the power supply circuit 170, which is capacitively and magnetically coupled to the radiating plate 20, the wireless IC device 1z provides in the wireless IC chip 5, only the received signal in a predetermined frequency band. In this case, the wireless IC device 1z extracts a predetermined energy from the received signal, and by using this energy as an excitation source, the wireless IC device 1z combines the information stored in the wireless IC chip 5 with a predetermined frequency in the power supply circuit 180. Then, the radiating plate 20 transmits information to the reader / writer.

Twenty-eighth embodiment (see FIG. 55)

According to a twenty-eighth embodiment, as shown in FIG. 55, the wireless IC device 2a is configured so that the wireless IC chip 5 and the power supply circuit board 10 are mounted on the rigid circuit board 8 so as to be parallel to each other, and the circuit board 10, the power supply circuit is attached to the radiating plate 20 by a bonding agent 18. For example, the circuit board 10 of the power supply circuit includes the power supply circuit 16 shown in FIG. 2. The circuit board 10 of the power supply circuit is electrically connected to the wireless IC chip 5 by means of a plurality of conductors 9 provided on the circuit board 8.

In the wireless IC device 2a, the power supply circuit 16 is advantageously magnetically coupled to the radiating plate 20. Thus, the operation and advantages of the twenty-eighth embodiment are similar to the first embodiment. Thus, the wireless IC device 2a communicates with the reader / writer. The power supply circuit board 10 may be not only a power supply circuit board used in the first embodiment, but also any of the power supply circuit boards used in the above embodiments. This point can also be applied to the following twenty-ninth embodiment.

Twenty-ninth embodiment (see FIG. 56)

According to the twenty-ninth embodiment, as shown in FIG. 56, the wireless IC device 2b is configured such that one or more radiating plates 20 is attached to the circuit board 8 according to the twenty-eighth embodiment, and a pair of radiating plates 20 is placed between the wireless IC chip 5, the power supply circuit board 10 and the circuit board 8. The operation of the wireless IC device 2b is similar to the twenty-eighth embodiment. In particular, the magnetic coupling efficiency between the power supply circuit 16 and the pair of radiating plates 20 is increased.

Thirtieth Embodiment (See FIG. 57)

According to a thirtieth embodiment, as shown in FIG. 57, the wireless IC device 2c is configured so that the emitting plate 22 formed in the double closed loop is placed in a transverse symmetrical manner on the surface of the polymer film 21. The circuit board 10 of the power supply circuit having a wireless IC the microcircuit 5 mounted on it, is located in the Central part of the inner circuit of the radiating plate 22.

According to the present embodiment, the power supply circuit board 10 is placed adjacent to the radiating plate 22 without being attached to the radiating plate 22. Since the radiating plate 22 has a contour shape, the linearly measured length of the radiating plate 22 is small. As in the above-described embodiments, in this configuration, electromagnetic inductive coupling is achieved between the power supply circuit board 10 and the radiating plate 22. Thus, the signal is transmitted between the signal supply circuit board 10 and the radiating plate 22. Thus, the wireless IC device 2c can exchange data with reader / writer. In addition, the board 10 of the power supply circuit may be placed around the central part of the radiating plate 22. Therefore, the exact positioning of the board 10 of the power supply circuit is not necessary.

Thirty-first embodiment (see FIG. 58)

According to the thirty-first embodiment, as shown in FIG. 58, the wireless IC device 2d is configured such that the radiating plate 23 having a combination of a meander shape, a contour shape and a spiral shape is placed in a transverse symmetrical manner on the surface of the polymer film 21. The circuit board 10 power supply having a wireless IC chip 5 mounted on it, is located in the Central part of the inner circuit of the radiating plate 23.

According to the thirty-first embodiment, as in the thirtieth embodiment, the power supply circuit board 10 is placed adjacent to the radiating plate 23 without being attached to the radiating plate 23. Since the radiating plate 23 has a combination of a meander shape, a contour shape and a spiral shape, the linearly measured length of the radiating plate 23 is small. As in the above-described embodiments, in this configuration, electromagnetic inductive coupling is achieved between the power supply circuit board 10 and the radiating plate 23. Thus, the signal is transmitted between the signal supply circuit board 10 and the radiating plate 23. Thus, the wireless IC device 2d can exchange data with a reader / writer. In addition, as in the thirtieth embodiment, the exact positioning of the board 10 of the power supply circuit is optional.

Other options for implementation

Although the wireless device according to the present invention is shown and described with reference to the above embodiments, many changes can be made without departing from the spirit and scope of the invention defined by the attached claims.

For example, the detailed internal structure of the circuit board of the power supply circuit and the detailed shapes of the radiating plate and film can be freely determined. In addition, in order to connect the wireless IC device to the circuit board of the power supply circuit, a method other than the method in which a solder contact column is used can be used. Moreover, the circuit board of the power supply circuit is not necessarily rigid, but the circuit board of the power supply circuit may be a flexible circuit board made of an organic polymeric material (for example, polyamide or a liquid crystal polymer).

Industrial applicability

As indicated above, the present invention can be effectively applied to a wireless IC device. In particular, the present invention has the advantage that wireless IC devices having stable frequency characteristics can be obtained.

Claims (32)

1. A wireless device on an integrated circuit (IC device) containing
wireless integrated circuit (IC chip);
a power supply circuit board connected to the wireless IC chip, wherein the power supply circuit board includes an energy supply circuit including a resonant circuit having a predetermined resonant frequency; and a radiating plate having a power supply circuit board mounted thereon, or an energy supply circuit board located next to it, wherein the radiating plate emits a transmitted signal provided from the energy supply circuit, and / or receives and transmits a received signal to the supply circuit energy. 2. The wireless IC device according to claim 1, wherein the wireless IC chip and the power supply circuit board are arranged parallel to each other on the circuit board and connected to each other by a conductor located on the circuit board. 3. The wireless IC device according to claim 1, wherein the wireless IC chip is mounted on a circuit board of a power supply circuit. 4. The wireless IC device according to claim 1, wherein the radiating plate includes plates located, respectively, on the first surface and on the second surface of the circuit board of the power supply circuit. 5. The wireless IC device according to claim 1, wherein the resonant circuit is a resonant circuit on elements with distributed parameters. 6. The wireless IC device according to claim 1, wherein the resonant circuit is a resonant circuit on elements with lumped parameters, including a capacitor pattern and a pattern of induction coils. 7. The wireless IC device according to claim 6, in which the resonant circuit on the elements with lumped parameters is an LC-series resonant circuit or an LC-parallel resonant circuit. 8. The wireless IC device according to claim 7, in which the resonant circuit on the elements with lumped parameters includes many LC-series resonant circuits or many LC-parallel resonant circuits. 9. The wireless IC device according to claim 6, wherein the capacitor pattern is located at the output of the wireless IC chip and between the wireless IC chip and the pattern of inductive coils. 10. The wireless IC device according to claim 6, in which the pattern of capacitors and the pattern of induction coils are placed parallel to the radiating plate. 11. The wireless IC device of claim 10, in which at least one of the reflector and / or the wave control unit can be placed in the part where the magnetic field is generated by the pattern of induction coils. 12. The wireless IC device of claim 6, wherein the board of the power supply circuit is a multilayer board in which a plurality of dielectric layers or a plurality of magnetic layers are layered; and in which the pattern of capacitors and the pattern of induction coils are formed on the surface and / or inside the multilayer board. 13. The wireless IC device of claim 6, wherein the board of the power supply circuit is a dielectric single layer board or a magnetic single layer board and in which at least one of the pattern of capacitors and the pattern of inductive coils is formed on the surface of the single layer board. 14. The wireless IC device of claim 1, wherein the board of the power supply circuit is a rigid board and in which a radiating plate is formed on a flexible metal film. 15. The wireless IC device of claim 14, wherein the flexible metal film is held in a flexible polymer film. 16. The wireless IC device according to claim 1, wherein the electric length of the radiating plate is an integer multiple of half the wavelength of the resonant frequency. 17. The wireless IC device according to claim 3, in which the wireless IC chip is equipped with an electrode pattern on the microchip side, in which the power supply circuit board is equipped with a first electrode pattern on the board side, and in which the wireless IC chip is connected to the power supply circuit board by DC coupling between the pattern of electrodes on the side of the microcircuit and the first pattern of electrodes on the side of the board. 18. The wireless IC device according to claim 3, in which the wireless IC chip is equipped with an electrode pattern on the microchip side, in which the power supply circuit board is equipped with a first electrode pattern on the board side, and in which the wireless IC chip is connected to the power supply circuit board by capacitive coupling between the pattern of electrodes on the side of the microcircuit and the first pattern of electrodes on the side of the board. 19. The wireless IC device of claim 18, wherein the electrode pattern on the microcircuit side and the first electrode pattern on the board side are parallel flat electrode patterns and in which the wireless IC chip is attached to the circuit board of the power supply circuit using an insulating bonding layer between them . 20. The wireless IC device according to claim 3,
in which the wireless IC chip is equipped with a pattern of electrodes on the side of the chip;
wherein the board of the power supply circuit is equipped with a first electrode pattern on the side of the board; and
in which the wireless IC chip is connected to the circuit board of the power supply by magnetic coupling between the pattern of electrodes on the side of the chip and the first pattern of electrodes on the side of the board. 21. The wireless IC device of claim 20, wherein each of the electrode patterns on the microcircuit side and the first electrode pattern on the board side is a coil-shaped electrode pattern; and
in which the wireless IC chip is attached to the circuit board of the power supply using an insulating bonding layer between them. 22. The wireless IC device of claim 3, wherein the board of the power supply circuit is equipped with a second electrode pattern on the side of the board and in which the board of the power supply circuit is connected to the radiating plate by direct current connection between the second electrode pattern on the side of the board and the radiating plate . 23. The wireless IC device of claim 3, wherein the power supply circuit board is equipped with a second electrode pattern on the side of the circuit board and in which the energy supply circuit board is connected to the radiating plate by capacitive coupling between the second electrode pattern on the circuit side and the radiating plate. 24. The wireless IC device of claim 23, wherein the second electrode pattern on the side of the board is a flat electrode pattern placed parallel to the radiating plate, and in which the circuit board of the power supply circuit is attached to the radiating plate using an insulating bonding layer between them. 25. The wireless IC device of claim 3, wherein the power supply circuit board is equipped with a second electrode pattern on the side of the circuit board and in which the energy supply circuit board is connected to the radiating plate by magnetic coupling between the second electrode pattern on the circuit side and the radiating plate. 26. The wireless IC device of claim 25, wherein the second electrode pattern on the board side is a coil-shaped electrode pattern and in which the power supply circuit board is attached to the radiating plate using an insulating bonding layer between them. 27. The wireless IC device of claim 26, wherein the axis of the coil pattern of the electrodes in the form of a coil is placed parallel to the radiating plate. 28. The wireless IC device of claim 26, wherein the axis of the coil pattern of the electrodes in the form of a coil is placed perpendicular to the radiating plate. 29. The wireless IC device of claim 28, wherein the width of the coil pattern of the electrodes in the form of a coil gradually increases in the direction of the radiating plate. 30. A component for a wireless integrated circuit device (IC device), said component comprising a wireless integrated circuit (IC chip) and a power supply circuit board connected to a wireless IC chip, wherein the power supply circuit board contains an energy supply circuit including a resonant circuit having a predetermined resonant frequency. 31. The component of claim 30, wherein the wireless IC chip is arranged parallel to the circuit board of the power supply circuit on the circuit board and in which the wireless IC chip is connected to the circuit board of the power circuit via a conductor located on the circuit board. 32. A component for a wireless integrated circuit device (IC device), said component comprising a wireless integrated circuit (IC chip) and a power supply circuit board having a wireless IC chip mounted on it, wherein the power supply circuit board contains an energy supply circuit including a resonant circuit having a predetermined resonant frequency.

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