JP3800765B2 - Compound IC card - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an information recording medium, and more particularly to an IC card used in the field of office automation (of-fice automation, so-called OA), factory automation (so-called FA), or security. A representative information recording medium, in particular, a contact type in which electric power is received and signals are transmitted / received via electrical contacts, and an electric power is received and signals are transmitted / received to an IC card by an electromagnetic coupling method. The present invention relates to an IC card having both functions of a non-contact type performed in a non-contact state without providing a contact, that is, a composite IC card.
[0002]
[Prior art]
The advent of IC cards with built-in semiconductor memory, etc., dramatically increases the storage capacity compared to conventional magnetic cards, etc., and the IC card itself has an arithmetic processing function by incorporating a semiconductor integrated circuit device such as a microcomputer. It has become possible to give high security to information media.
[0003]
IC cards are internationally standardized by ISO (International Organization for Standardization). Generally, IC cards have ICs such as semiconductor memory built in the card body, which is made of plastic, etc., and externally on the card surface. A metal conductive terminal is provided for connection with the read / write device, and the IC card is inserted into the card slot of the external read / write device for data communication between the IC card and the external read / write device. It is.
This is advantageous for applications that require certainty and security of communication such as large-volume data exchange and settlement operations, such as credit and electronic wallet applications.
[0004]
On the other hand, when applying to gate management such as entrance / exit, etc., authentication is the main communication content, the amount of communication data is often small, and a simpler process is desired. A technique devised to solve this problem is a so-called contactless (type) IC card.
This is a field of vibration energy such as high-frequency electromagnetic fields, ultrasonic waves, and light in a space, which absorbs and rectifies the energy to drive the electronic circuit built in the card. The frequency of the component is used as it is, or multiplied or divided to obtain an identification signal, and this identification signal is transmitted to an information processing circuit of a semiconductor element via a coupler such as an antenna coil or a capacitor.
[0005]
In particular, many of the non-contact IC cards for the purpose of authentication and simple counting data processing are hard logic wireless authentication (Radio Frequency IDentification; which is not equipped with a battery and CPU (Central Processing Unit)). With the advent of this non-contact IC card, safety against counterfeiting and tampering is enhanced as compared to conventional magnetic cards, and the card holder can pass through the gate device when passing through the gate. Data that you just need to approach the antenna part of the attached read / write device, or just touch the antenna part of the read / write device with your card, and take the card out of the case, bag or pocket and insert it into the slot of the read / write device The complexity of communication has been reduced.
[0006]
In recent years, the contact type function with external terminals like the former and the non-contact type function that communicates data by wireless communication like the latter for the purpose of dealing with multipurpose applications with a single card. A composite type IC card having both of the above has been devised. It combines the advantages of both high security of contact-type CPU processing and non-contact-type convenience.
In the present specification, such IC cards in general are particularly referred to as composite IC cards.
[0007]
Generally, a composite IC card is manufactured as follows.
A metal foil antenna coil for non-contact transmission formed by etching is sandwiched between a sheet having a fitting hole of an IC module and a base material, and laminated to produce a card body.
At this time, the two antenna terminals for connecting the antenna coil and the IC module are exposed inside the fitting hole of the card body. On one surface of the IC module, a metal terminal electrode for connection with an external device is formed.
An IC is mounted on the other surface, and a terminal for connection with the antenna is provided. A conductive adhesive is applied to the terminals. After the IC module is installed in the fitting hole of the card body so that the terminal of the IC module with the conductive adhesive applied to the terminal and the antenna terminal of the card overlap, the terminal of the IC module is applied with heat and pressure. And the antenna terminal are combined to complete the mounting.
[0008]
Although such a mounting method is relatively simple, it is difficult to confirm the state of the connection between the IC module and the antenna, and if bending stress or the like is applied to the card, As a result, the connection part is often broken, and the connection reliability becomes a problem.
In addition, the connection portion is likely to deteriorate due to mechanical stress.
In addition, a conductive adhesive coating process and thermocompression bonding process are required to connect the IC module and antenna, making it difficult to use conventional IC card manufacturing equipment with external terminals and installing a new manufacturing line. There must be.
[0009]
Japanese Unexamined Patent Publication No. 7-239922 discloses an example of a conventional technology that eliminates the need for connection between an IC module and an antenna in a card manufacturing process of a composite IC card.
According to this, an IC module for an IC card is prepared. The IC module supports an IC chip, a transmission mechanism that is electrically connected to the IC chip and transmits information and / or energy to / from an external device, and supports the IC chip and the transmission mechanism. It consists of a support. Further, the transmission mechanism includes both a non-contact type transmission mechanism composed of either a coil or an antenna, and a contact type transmission mechanism composed of a plurality of terminal electrodes patterned on the conductor provided on the surface of the support. It has a configuration. Then, a function capable of dealing with both the contact type and the non-contact type is modularized, and the IC module is fitted and fixed to the plastic card base.
Further, as the means for realizing the above, either an antenna or a coil for non-contact transmission is provided so as to surround the terminal electrode around the terminal electrode, or conversely, the antenna or the coil is placed around the antenna or coil. A terminal electrode is provided around the coil.
[0010]
In other words, by storing the antenna for non-contact transmission in the IC module, the connection between the antenna coil and the IC module is unnecessary in the process of mounting the IC module on the card substrate, which is the final process. It is what.
[0011]
However, according to the method in which the antenna for non-contact transmission is accommodated in the IC module, a sufficient antenna area cannot be obtained, and only a so-called tight coupling form with a communication distance of several millimeters or less is allowed. In this case, the benefits that can be enjoyed by adding the non-contact transmission function are extremely small. The effect of adding a non-contact transmission mechanism to a contact-type transmission mechanism should be obtained by realizing communication at a distance of several tens of millimeters to a hundred millimeters or even more than that distance. In this area, communication can be achieved by simply “holding” the card over the antenna unit of the external read / write device. To do so, for example, it is necessary to increase the area of the coil or increase the number of turns.
[0012]
More specifically, in the case where the antenna coil is provided by a printed pattern around the terminal electrode of the IC module substrate, the area of the standard IC module is about 12 mm × 12 mm. It is not allowed to exceed.
Therefore, when a coil is arranged on the outer periphery of the terminal electrode in the IC module, even if a printed coil is formed, only a few turns can be taken. Cannot receive. In addition, if the number of turns is practical with the conductor pattern, it will be applied to the embossed region.
[0013]
On the other hand, in the case of the arrangement in which the terminal electrode is provided around the antenna, the invasion into the embossed area is obvious, which is a significant departure from ISO 7816, which is the standard for IC cards with external terminals. Is very unlikely to be accepted.
[0014]
[Problems to be solved by the invention]
The present invention has been made paying attention to the problems of the conventional techniques as described above, and is sufficient even though the connection between the IC module and the antenna coil for non-contact transmission is not necessary. Non-contact transmission antenna element and IC of a composite IC card having a reception sensitivity capable of obtaining a long communication distance and maintaining both a contact type and a non-contact type transmission mechanism in a practical operating state It is an object to provide a module.
[0015]
[Means for Solving the Problems]
The means provided by the present invention to solve the above problems are as follows:
A composite IC card having both contact and non-contact functions,
The composite IC card has an IC module and an antenna element for non-contact transmission that does not have a conductor connection between the IC module,
The IC module includes an IC chip having both a contact-type transmission function and a non-contact-type transmission function, a module substrate on which an external terminal as a contact-type transmission element is formed, and a first coupling of a non-contact transmission mechanism A coil and
The non-contact transmission antenna element includes an antenna that receives power and transmits / receives a signal to / from an external reader, and a second coupling coil connected to the antenna,
In the composite IC card in which the first coupling coil and the second coupling coil are arranged so as to be tightly coupled to each other, and the IC module and the antenna can be coupled in a non-contact manner by transformer coupling.
In the composite IC card, the second coupling coil of the non-contact transmission antenna element and the first coupling coil of the IC module are arranged in a nested manner in substantially the same plane. .
[0016]
Here, the fact that the inner contour of the second coupling coil is larger than the outer contour of the fitting hole of the IC module is that the minute electric power generated in the first coil is more effective for the second coil. When the signal is transmitted from the card side to the external reader, the IC chip must be driven by the weak power received by the card and the signal must be transmitted. Since it becomes a signal, the second coupling coil is preferably as large as possible.
[0017]
According to the first aspect of the present invention, the first coupling coil is formed on the same surface as the IC chip of the module substrate, so that the first coil and the second coupling coil of the antenna element embedded in the card substrate are provided. Since it is possible to improve the transmission efficiency of both of the coupling coils, the first coupling coil can be formed in a region smaller than the external dimension of the external terminal. Very preferred.
[0018]
More preferably, as shown in claim 2, the composite IC card according to claim 1 is a basic configuration, and in particular, the inner contour of the second coupling coil is the outer contour of the fitting hole of the IC module. And a first coupling coil disposed in the IC module is formed on the back surface of the module substrate.
[0019]
Here, the fact that the second coupling coil of the antenna element for non-contact transmission and the first coupling coil of the composite IC module are nested in substantially the same plane means that the first coupling coil An object of the present invention is to improve the degree of coupling with the second coupling coil, wherein the first coupling coil arranged in the IC module according to claim 1 is flush with the IC chip of the module substrate. By forming the first coupling coil and the second coupling coil in the same plane, it is possible to reduce the gap between the two coils by arranging the first coupling coil and the second coupling coil in substantially the same plane.
[0020]
Preferably, as shown in claim 3, the composite IC card according to claim 1 is a basic configuration, and in particular, the inner side of the second coupling coil of the non-contact transmission antenna element is the IC module. It is a composite IC card characterized by also serving as a fitting hole.
[0021]
Here, the inside of the second coupling coil of the antenna element for non-contact transmission also serves as a fitting hole for the IC module. It is intended to be used, and it is particularly suitable if it is similar to the shape of the IC module fitting hole of the conventional IC card with external terminals, and the dimensions are the same or larger.
[0022]
  Also preferably,The present inventionAs shown in claim 4,Any one of the above claims 1 to 3.And the second coupling coil of the non-contact transmission antenna element is located outside the loop of the antenna.Is providedThis is a composite IC card characterized by the above.
[0023]
Here, the provision of the second coupling coil of the non-contact transmission antenna element outside the loop of the antenna is intended for embossing, and the outer contour of the second coupling coil and the antenna The outer contour is arranged so as to avoid the embossed area.
[0024]
According to this, by providing the second coupling coil of the antenna element for non-contact transmission outside the loop of the antenna, the antenna coil is not wound around the outer periphery of the second coil, and the outer shape of the second coil is reduced. The protrusion of the antenna coil to the embossed area can be suppressed by merely preventing it from entering the embossed area.
[0025]
  Also,The present inventionAs shown in claim 5,The method according to any one of claims 1 to 4.
Compound IC cardIs the basic configuration, especiallyA first coupling coil of the IC module;It consists of a winding coil and is also used as a reinforcing material for the IC module by being wound around the IC chip on the back surface of the module substrate.Compound IC cardIt is.
[0026]
According to this, the strength of the IC module is improved against mechanical stress by winding the first coil of the composite IC module around the sealing material of the IC chip and using it as a reinforcing material for the IC module.
[0027]
Here, the first coupling coil of the IC module is formed of a winding coil and is wound around the IC chip on the surface opposite to the external terminal forming surface of the module substrate. It is particularly preferable if the winding coil is firmly hardened by impregnation with an adhesive or the like.
[0028]
  Also,The present inventionAs shown in claim 6,The composite IC card according to any one of claims 1 to 4.Is the basic configuration, especiallyThe first coupling coil of the IC module is connected to the back surface of the module substrate.It is formed by being wound in a toroidal shape by a winding coil near the IC chip.Compound IC cardIt is.
[0029]
Here, the winding of the first coupling coil in the vicinity of the IC chip in a toroidal shape by the winding coil is intended to suppress the protrusion of the second coil to the embossed region. The coil is preferably mounted at a position opposite to the embossed area.
[0030]
  Also,The present inventionAs shown in claim 7,5. The composite IC card according to claim 1, wherein the first coupling coil of the IC module is provided on a back surface of the module substrate.It is formed by a conductor patterned in the vicinity of the IC chipCompound IC cardIt is.
[0031]
Here, the formation of the first coupling coil of the IC module by the conductor patterned in the vicinity of the IC chip suppresses the protrusion of the second coil to the embossed region and reduces the mounting cost of the first coil. It is particularly suitable if it is formed on substantially the same plane as the second coil.
[0032]
  In addition, the present invention provides, as shown in claim 8,The composite IC card according to any one of claims 1 to 7, wherein the IC moduleThe IC chip mounting surface is resin-sealed together with the IC chip and the first coupling coil.Compound IC cardIt is.
[0033]
The fact that the IC chip mounting surface of the IC module is resin-sealed together with the IC chip and the first coupling coil solves the problem of resin molding by attaching the first coupling coil after resin sealing and improves the strength. The entire first coil is preferably sealed.
[0034]
According to this, since the IC chip mounting surface of the IC module is resin-sealed together with the IC chip and the first coupling coil, the reliability can be improved by preventing the coupling coil from being exposed.
[0035]
DETAILED DESCRIPTION OF THE INVENTION
The basic configuration and basic principle of the non-contact transmission mechanism in the present invention will be described below with reference to the drawings.
[0036]
  FIG. 4 is an equivalent circuit diagram of a non-contact coupling circuit for explaining the principle of the non-contact transmission mechanism of the present invention. In FIG. 4, a non-contact typeExternal read / write deviceA transmission / reception coil 102, which is an electromagnetic coupler for supplying power to the non-contact transmission mechanism of the composite IC card 1 and transferring information, is connected to the transmission / reception circuit 101.
[0037]
  On the other hand, the non-contact transmission mechanism of the composite IC card 1 isExternal read / write deviceThe antenna coil 4 that is directly electromagnetically coupled to the 100 transmitting / receiving antennas 102 and that is involved in power reception and information exchange, the capacitor 15 that is connected to both ends of the antenna coil 4 to form a parallel resonance circuit, and the composite IC module 2 The composite IC chip 6 mounted, the first coupling coil 8 connected thereto, and both ends of the capacitor 15 of the parallel resonance circuit for transmitting the signal received by the antenna coil to the first coupling coil 8 with maximum efficiency. It consists of the 2nd coupling coil 3 connected to. At this time, the capacitor 15 is connected in parallel, but may be omitted by increasing the line capacitance of the antenna coil 4 and the second coupling coil 3. Further, the present invention includes connecting in series between the antenna coil 4 and the second coupling coil 3.
[0038]
Here, in the case where power and information are transmitted from the external read / write device 100 to the composite IC card 1, the coupling of the coils will be described below.
A high frequency magnetic field is induced in the transmission / reception coil 102 by a high frequency signal (not shown) generated in the transmission / reception circuit 101 of the external read / write device 100. This high frequency signal is radiated into space as magnetic energy.
[0039]
At this time, when the composite IC card 1 is located in the high frequency magnetic field, the parallel resonant circuit formed by the antenna coil 4 and the capacitor 15 of the composite IC card 1 is generated by the high frequency magnetic field generated by the transmission / reception coil 102 of the external read / write device 100. Apply current. At this time, the first coupling coil 8 directly connected to the composite IC chip 6 and the second coupling coil 3 connected to the resonance circuit of the antenna coil 4 and the capacitor 15 to transmit power to the first coupling coil 8 Although a current due to a high-frequency magnetic field is induced, the reception sensitivity greatly depends on the characteristics of the antenna coil 4 because it is one digit or more smaller than the amount induced in the antenna coil 4.
[0040]
A signal received by the resonance circuit of the antenna coil 4 and the capacitor 15 is transmitted to the second coupling coil 3. Thereafter, the second coupling coil 3 and the first coupling coil 8 are in a tightly coupled arrangement in which the maximum transmission efficiency is shown, and the second coupling coil 3 and the first coupling coil 8 are coupled to each other by the transformer coupling between the second coupling coil 3 and the first coupling coil 8. A signal is transmitted. The maximum transmission efficiency of transformer coupling between the second coupling coil 3 and the first coupling coil 8 is determined by the selection of circuit constants.
As described above, the reception characteristics are improved.
[0041]
Furthermore, by increasing the number of turns of the first coupling coil 8, the coupling coefficient with the second coupling coil 3 is increased, and the energy transmitted to the composite IC chip 6 is further increased.
However, the current printed wiring board manufacturing technology has a limit of a pattern width of 0.1 mm, and it is difficult for the printed coil to wind several tens of turns on the module base surface of the IC card.
On the other hand, it is possible to form a coil with a conductive wire having an insulating film up to a diameter of several tens of microns due to the advancement of magnetic head technology.
Focusing on this technology, the inventors have devised means for forming a coupling coil between the composite IC module of the present invention and an antenna by a conducting wire having an insulating film.
[0042]
In addition, in the air-core transformer type coupling as in the present invention, reducing the gap between the coils brings about an improvement in transmission efficiency. For this purpose, the inner diameter of the second coupling coil 3 is made larger than the fitting hole of the composite IC module 2 on the card board (not shown), and the second coupling coil 3 surrounds the first coupling coil 8, It was arranged in almost the same plane. At this time, the inside of the second coupling coil 3 also serves as the fitting hole.
By doing so, compared to the case where the second coupling coil 3 is disposed under the fitting hole of the composite IC module 2, the depth accuracy of the fitting hole processing is not required, and the fitting of the IC card with the external terminal can be performed. The hole-drilling equipment can be used as it is.
[0043]
【Example】
Embodiments of the present invention will be described below with reference to the drawings.
[0044]
FIG. 1 is a schematic configuration diagram of a composite IC card according to the present invention.
A composite IC card 1 according to the present invention is a resin-sealed antenna substrate 5 having a composite IC module 2 of the present invention, a second coupling coil 3 formed of a printed coil on the surface of a sheet-like resin, and an antenna coil 4. Card board 10.
[0045]
The composite IC module 2 includes a terminal electrode 7 with a pattern as a contact type transmission unit, a composite IC chip 6 incorporating a contact type interface and a non-contact type interface (not shown), and the periphery of the composite IC chip 6 or a module substrate 9. The first coupling coil 8 of the non-contact type transmission part formed by a conductive wire having an insulating film around the periphery, and a module substrate 9.
The composite IC chip 6 is mounted on the surface of the module substrate 9 opposite to the surface on which the terminal electrodes 7 are formed. The composite IC chip 6 and the terminal electrode 7 of the module substrate 9 are connected through a through hole. The circuit pattern formed on the module substrate 9 that connects the composite IC chip 6 to the terminal electrode 7 and the first coupling coil 8 is connected by heat welding using solder, conductive adhesive, or the like. This connection can also be realized by wire bonding the circuit forming surface of the composite IC chip 6 and the module substrate 9.
[0046]
After the composite IC chip 6 is mounted on the module substrate 9 and connected to the circuit, the composite IC chip 6 is resin-sealed 16 as shown in FIG. 1B, and then around the composite IC chip 6 or the module substrate 9. A first coupling coil 8 is formed by winding an insulating film conductor around the substrate, and then the circuit pattern of the module substrate 9 and the terminals of the first coupling coil 8 are connected to complete the composite IC module 2.
FIG. 1B shows the case where the first coupling coil 8 is formed with a winding coil around the resin seal 16 of the composite IC chip 6. As preparation for forming the first coupling coil 8, the periphery of the resin seal 16 of the composite IC module 2 manufactured up to the process of the resin seal 16 is processed so as to be easily wound by a cutting means or the like. Thereafter, the winding is performed directly around the resin seal 16 of the composite IC module 2 by a winding machine (not shown).
After the predetermined number of turns, the insulating film on the connection terminals of the first coupling coil 8 (not shown) is removed and connected to a predetermined circuit pattern (not shown) on the module substrate 9.
[0047]
At this time, when the resin sealing 16 is applied, the resin sealing 16 can be cut by using a mold or the like so as to facilitate winding. Further, without winding the winding directly around the composite IC chip 6, a planar coil is manufactured in a separate process using a coil winding machine and bonded to the module substrate 9 to form the first coupling coil 8. The present invention also includes resin sealing 16 so as to cover the IC chip 6 and the first coupling coil 8.
In the present embodiment, the cross-sectional shape of the manufactured coil is a rounded rectangle, but there is no limitation on the shape that may be a circle.
[0048]
Subsequently, the composite IC card 1 according to the present invention is manufactured as follows. First, as shown in FIGS. 1A and 1B, an antenna substrate 5 is prepared in which a second coupling coil 3, an antenna coil 4, and a capacitor 15 are formed in separate regions on a resin substrate by a printed coil.
As shown in FIG. 1B, the second coupling coil 3 of the antenna substrate 5 is formed outside the outer shape of the fitting hole 11 of the composite IC module 2, and finally mounted on the composite IC module 2. The first coil 8 is set so as to be substantially in the same plane. Here, the second coupling coil 3 and the antenna coil 4 may be formed by winding a conductive wire with insulation coating.
[0049]
Vinyl chloride is used as the resin for the antenna substrate 5, but polycarbonate, PET, polyimide, and the like can also be applied, and the material is not fixed to one kind. The thickness of the base material of the antenna substrate 5 is in the range of 50 μm to 300 μm. More preferably, it is about 100 μm.
[0050]
Next, the antenna substrate 5 is sealed by injection molding to mold the card substrate 10. At the time of molding, the second coupling coil 3 is positioned and arranged so as to overlap the mounting position of the composite IC module 2. After the production of the card substrate 10 by injection molding, the fitting hole 11 of the composite IC module 2 is formed. Finally, the composite IC card 1 is completed by bonding the composite IC module 2 to the fitting hole 11 of the composite IC module 2 of the card substrate 10. Vinyl chloride is used as the material for the card substrate 10, but any other material that can provide sufficient card characteristics such as polycarbonate can be applied to the present invention. In FIG. 1A, the card substrate 10 is drawn separately on the front surface and the back surface. However, the card substrate 10 is originally an integral one, and in FIG. 1A, the coupling coil in the antenna substrate 5 sealed in the card substrate. And the fitting hole 11 are modified in order to clearly explain the relationship.
[0051]
In the present invention, the card is manufactured by injection molding, but any method that maintains card characteristics can be applied to the present invention. For example, a laminate method or an adhesive filling method may be used. Moreover, it is also included in this invention that the fitting hole 11 of an IC module is processed simultaneously at the time of card | curd molding. In this case, the inside of the second coupling coil 3 formed on the antenna substrate 5 is cut out in advance for fitting the IC module.
[0052]
FIG. 2 shows an embodiment in which the first coupling coil 8 is wound around the composite IC chip 6. In this example, the composite IC chip 6 is mounted eccentrically from the center of the module substrate 9 to one end. A first coupling coil 8 manufactured by a winding machine (not shown) is separately bonded to the module substrate 9 to the composite IC module 2 in which the steps up to the resin sealing 16 have been completed, and a connection terminal (not shown) of the first coupling coil 8 is obtained. Are connected to a predetermined circuit pattern (not shown) of the module substrate 9 to complete the composite IC module 2. By doing so, the process of processing the periphery of the resin sealing portion for mounting the first coil 8 becomes unnecessary. Although the cross-sectional shape of the first coil 8 is a rounded rectangle, it may be a circle or an ellipse and is not particular about the shape.
[0053]
FIG. 3 shows an embodiment in which the first coupling coil 8 is formed on the mounting surface of the composite IC chip 6 on the module substrate 9 with a printed pattern of conductors so as to be disposed in the vicinity of the composite IC chip 6.
In the first coupling coil 8, the external terminals on the front surface of the module substrate 9 and the composite IC chip 6 on the back surface are formed simultaneously with the connection pattern, so that the connection between the module substrate 9 and the first coil 8 is simplified. Although the cross-sectional shape of the first coupling coil 8 in the present embodiment is a rounded rectangular shape, it may be circular or elliptical and is not particular about the shape.
[0054]
【The invention's effect】
As is clear from the above description, the composite IC module according to the present invention has a function capable of supporting both a contact type with an external terminal and a non-contact type having a non-contact coupling element such as an antenna coil. In addition, by providing a transformer coupling circuit element between the IC module and the antenna coil, power is received and signals are transmitted and received without electrically connecting the IC module and the antenna coil.
In this composite IC card, the first coupling coil arranged in the IC module is configured such that the inner diameter of the second coupling coil of the antenna element for non-contact transmission is larger than the outer shape of the fitting hole of the IC module. Since the gap can be reduced by forming the first coupling coil and the second coupling coil on substantially the same plane, the coupling coefficient can be increased.
[0055]
As a result, the electromagnetic energy received by the antenna coil can be transcoupled with a high coupling coefficient and transmitted to the IC chip.
As a result, there is an effect that communication sensitivity characteristics can be further improved by “holding” the card near the antenna of the external read / write device, which is an advantage of the non-contact transmission function.
Furthermore, an increase in the reception sensitivity of the card can increase the communication distance and / or suppress the transmission output of the external read / write device. This is convenient for the non-contact transmission function because the transmission output is regulated by the Radio Law.
[0056]
In addition, the inside of the second coupling coil of the antenna element for non-contact transmission also serves as a fitting hole of the IC module. By doing so, compared to the case where the second coupling coil is arranged under the fitting hole of the composite IC module, the depth accuracy of the fitting hole processing is not required, and the conventional IC card with external terminals is not required. The IC module fitting hole processing equipment can be used as it is, and there is no need to connect the IC module to the antenna circuit built in the card board. Even if mechanical stress such as bending stress is applied to the card, the IC Since the module and the antenna circuit do not have connection points, there is very little risk of failure due to breakage of the connection terminals.
[0057]
Further, by providing the second coupling coil of the antenna element for non-contact transmission outside the antenna loop, the protrusion of the antenna coil to the embossed region was suppressed.
Furthermore, the strength of the IC module can be improved against mechanical stress by winding the first coil of the composite IC module in a toroidal shape around the sealing material of the IC chip and using it as a reinforcing material for the IC module. ing.
[0058]
As a whole, although there is no need for connection between the IC module and the antenna coil for non-contact transmission, there is a reception sensitivity capable of obtaining a sufficient communication distance, and contact type and non-contact type. It was possible to provide a composite IC card that can maintain both transmission mechanisms in a practical operating state and a composite IC module that can be suitably used for the composite IC card.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of a first embodiment of a composite IC card according to the present invention.
FIG. 2 is an explanatory diagram of mounting of a coupling coil of an IC module according to a second embodiment of the present invention.
FIG. 3 is an explanatory diagram of mounting of a coupling coil of an IC module according to a third embodiment of the present invention.
FIG. 4 is an equivalent circuit diagram of a non-contact coupling circuit for explaining the principle of the non-contact transmission mechanism of the present invention.
[Explanation of symbols]
1 ... Compound IC card
2 ... IC module
3. Second coupling coil
4 ... Antenna coil
5 ... Antenna substrate
6 ... Composite IC chip
7 ... Terminal electrode
8: First coupling coil
9 ... Module board
10: Card board
11 ... Fitting hole
15 ... Capacitor
16 ... Resin sealing
100: External read / write device
101 ... Transmission / reception circuit
102: Transmitting and receiving antenna

Claims (8)

A composite IC card having both a contact type and a non-contact type function,
The composite IC card has an IC module and an antenna element for non-contact transmission that does not have a conductor connection between the IC module,
The IC module includes an IC chip having both a contact-type transmission function and a non-contact-type transmission function, a module substrate on which an external terminal as a contact-type transmission element is formed, and a first coupling of a non-contact transmission mechanism A coil and
The non-contact transmission antenna element includes an antenna that receives power and transmits / receives a signal to / from an external read / write device, and a second coupling coil connected to the antenna,
In the composite IC card in which the first coupling coil and the second coupling coil are arranged so as to be tightly coupled to each other, and the IC module and the antenna can be coupled in a non-contact manner by transformer coupling.
2. A composite IC card, wherein the second coupling coil of the non-contact transmission antenna element and the first coupling coil of the IC module are nested in substantially the same plane. The inner contour of the second coupling coil is larger than the outer contour of the fitting hole of the IC module, and the first coupling coil disposed in the IC module is formed on the back surface of the module substrate. The composite IC card according to claim 1. 2. The composite IC card according to claim 1, wherein an inner side of the second coupling coil of the non-contact transmission antenna element also serves as a fitting hole of the IC module. 4. The composite IC card according to claim 1 , wherein the second coupling coil of the non-contact transmission antenna element is provided outside the loop of the antenna. 5. 5. The composite IC card according to claim 1, wherein the first coupling coil of the IC module is formed of a winding coil and is wound around the IC chip on the back surface of the module substrate. A composite IC card that also serves as a reinforcing material for the IC module . 5. The composite IC card according to claim 1, wherein the first coupling coil of the IC module is formed in a toroidal shape by a winding coil in the vicinity of the IC chip on the back surface of the module substrate. A composite IC card characterized by being wound and formed . 5. The composite IC card according to claim 1, wherein the first coupling coil of the IC module is formed by a conductor patterned in the vicinity of the IC chip on the back surface of the module substrate. A composite IC card characterized by A composite IC card according to any one of claims 1 to 7, a composite IC card, characterized in that the IC chip mounting surface of the IC module is sealed with resin together with the IC chip and the first coupling coil .

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