CN216647390U - Contactless communication module and smart card - Google Patents

Abstract

The application provides a non-contact communication module and a smart card, wherein the non-contact communication module comprises a circuit board, a chip assembly and a coil assembly, wherein the circuit board comprises a central area and an edge area surrounding the central area; the chip assembly is arranged in the central area of the circuit board and is electrically connected with the circuit board; the coil assembly is arranged at the marginal area of the circuit board and is electrically connected with the chip assembly through the circuit board. The non-contact communication module greatly improves the universality and the adaptability of the non-contact communication module, and simplifies the production flow of subsequent card bodies.

Description

Contactless communication module and smart card

Technical Field

The application relates to the technical field of financial payment and transportation transaction cards, in particular to a non-contact communication module and an intelligent card.

Background

Existing contactless cards generally include a card body and a chip module disposed in the card body. In order to realize non-contact communication, two ends of a card body coil need to be connected to contacts on a chip module by picking up wires in a card body, and then the communication is carried out through the coupling of the card body coil and a card reader coil. Aiming at the special-shaped card bodies with different shapes or different wearable devices, the card body coils with different shapes need to be configured, and the card body coils can be used commercially after being tested, so that the coil adaptability is low.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a non-contact communication module and a smart card, so that the adaptability of the non-contact communication module is improved.

The embodiment of the application provides a non-contact communication module, including:

a circuit board including a central region and an edge region surrounding the central region;

the chip assembly is arranged in the central area of the circuit board and is electrically connected with the circuit board;

and the coil assembly is arranged at the edge area of the circuit board and is electrically connected with the chip assembly through the circuit board.

In some embodiments, the coil assembly includes a first coil, the chip assembly includes a first chip, the first coil includes a first winding portion disposed around the central region and a first electrical connection terminal extending from the first winding portion to the central region, the first electrical connection terminal is electrically connected to the first chip through the circuit board.

In some embodiments, the coil assembly further includes a second coil, the chip assembly further includes a second chip, the circuit board includes a first surface and a second surface opposite to each other, the first coil and the first chip are disposed on the first surface, the second coil and the second chip are disposed on the second surface, the second chip is located in the central area, the second coil includes a second winding portion disposed around the central area and a second electrical connection terminal extending from the second winding portion to the central area, the second electrical connection terminal is electrically connected to the second chip through the circuit board, wherein the first coil and the second coil are disposed in an insulated manner.

In some embodiments, the first chip is an identification chip and the second chip is a light control chip.

In some embodiments, the coil further comprises a wave-absorbing material layer, and the wave-absorbing material layer is respectively arranged between the first coil and the circuit board and between the second coil and the circuit board.

In some embodiments, the first coil and the second coil are disposed to be staggered in a thickness direction of the circuit board.

In some embodiments, the first coil includes a first sub-coil and a second sub-coil, the circuit board includes a first surface and a second surface opposite to each other, the first sub-coil and the first chip are disposed on the first surface, the second sub-coil is disposed in the edge region of the second surface, and the first sub-coil and the second sub-coil are connected in series and electrically connected to the first chip through the circuit board.

In some embodiments, the circuit board is provided with a first through hole penetrating the first surface and the second surface, and one end of the first sub-coil penetrates the first through hole and is electrically connected with one end of the second sub-coil; or the circuit board is provided with a second through hole penetrating through the first surface and the second surface, a conductor is arranged in the second through hole, and the first sub-coil and the second sub-coil are electrically connected through the conductor.

In some embodiments, the chip module further comprises a first capacitor and a second capacitor arranged on the circuit board, wherein the first capacitor is connected in series with the chip module, and the second capacitor is connected in parallel with the chip module.

The embodiment of the application also provides a smart card which comprises the non-contact communication module.

The non-contact communication module that this application embodiment provided is through setting up coil pack on the circuit board, and then is connected with the chip subassembly, so, in follow-up manufacture process, can directly arrange non-contact communication module in various types of card bodies, and be located the card body optional position all can, perhaps the disect insertion card cover uses, has improved non-contact communication module's commonality and suitability greatly, has simplified the production procedure of follow-up card body. In addition, the step of connecting the coil take-up to the circuit board contact is omitted, so that the manufacturing process is further simplified, and the production efficiency is improved.

Drawings

Features, advantages and technical effects of exemplary embodiments of the present application will be described below by referring to the accompanying drawings.

Fig. 1 is a schematic structural diagram of a contactless communication module according to an embodiment of the present application;

fig. 2 is a top view of the contactless communication module shown in fig. 1;

fig. 3 is another schematic structural diagram of a contactless communication module according to an embodiment of the present application;

fig. 4 is a schematic structural diagram of a contactless communication module according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of a contactless communication module according to an embodiment of the present application.

Reference numerals:

1. a circuit board;

11. a central region; 12. an edge region; 13. a first surface; 14. a second surface; 15. a second through hole; 16. a conductor;

2. a chip assembly;

21. a first chip; 22. a second chip;

3. a coil assembly;

31. a first coil; 311. a first winding portion; 312. a first electrical connection terminal; 313. a first sub-coil; 314. a first conductive point; 315. a second sub-coil; 316. a second conductive point; 32. a second coil.

Detailed Description

Embodiments of the present application will be described in further detail below with reference to the drawings and examples. The following detailed description of the embodiments and the accompanying drawings are provided to illustrate the principles of the application and are not intended to limit the scope of the application, i.e., the application is not limited to the described embodiments.

In the description of the present application, it is to be noted that, unless otherwise specified, "a plurality" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," and the like, indicate an orientation or positional relationship that is merely for convenience in describing the application and to simplify the description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the application. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

The following description is given with the directional terms as they are used in the drawings and not intended to limit the specific structure of the present application. In the description of the present application, it is also to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present application can be understood as appropriate by one of ordinary skill in the art.

For a better understanding of the present application, embodiments of the present application are described below with reference to fig. 1 to 5.

Fig. 1 is a schematic structural diagram of a contactless communication module according to an embodiment of the present application, and fig. 2 is a top view of the contactless communication module shown in fig. 1.

Referring to fig. 1 and 2, a contactless communication module according to an embodiment of the present disclosure includes a circuit board 1, a chip assembly 2, and a coil assembly 3. The circuit board 1 comprises a central area 11 and an edge area 12 surrounding the central area 11. The chip assembly 2 is disposed in the central region 11 of the circuit board 1 and electrically connected to the circuit board 1. The coil assembly 3 is disposed at the edge region 12 of the circuit board 1, and the coil assembly 3 is electrically connected to the chip assembly 2 through the circuit board 1.

Specifically, the coil assembly 3 is electrically connected to the chip assembly 2 through contacts on the circuit board 1. The chip assembly 2 may be flip-chip bonded to the circuit board 1, or bonded and then encapsulated, which is not limited herein. The chip assembly 2 is disposed on at least one surface of the circuit board 1. The coil block 3 is disposed on at least one surface of the circuit board 1.

The circuit board 1 is made of an electrically insulating substrate, such as resin, PVC, polyimide, or PET.

Wherein the coil assembly 3 is fixed on the circuit board 1 by printing, etching, winding, etc.

Optionally, the size of the contactless communication module is less than or equal to 3cm x 3 cm.

The non-contact communication module of the embodiment of the application is matched with an external reader-writer to work. When the reader-writer performs reading and writing operations on the non-contact communication module, a signal sent by the reader-writer is formed by superposing two parts, wherein one part is a power supply signal, and the signal is received by the non-contact communication module and then resonates with the coil assembly 3 to generate instant energy to supply the chip assembly 2 to work. The other part is to combine the data signal to command the chip component 2 to complete data modification, storage and the like, and return the data to the reader-writer. The non-contact communication module and the external reader-writer respond to identify and judge whether the non-contact communication module is in a payment state or a state related to the payment state. The state related to the payment state is, for example, a state of entering a subway and swiping a card.

The non-contact communication module provided by the embodiment of the application is connected with the chip component 2 by arranging the coil component 3 on the circuit board 1, so that the non-contact communication module can be directly arranged in various types of card bodies in the subsequent manufacturing process, and can be positioned at any position of the card body, or can be directly inserted into a card sleeve for use, the universality and the adaptability of the non-contact communication module are greatly improved, and the production flow of the subsequent card body is simplified. In addition, the step of connecting the coil take-up to the circuit board contact is omitted, so that the manufacturing process is further simplified, and the production efficiency is improved.

Fig. 3 is another schematic structural diagram of a contactless communication module according to an embodiment of the present application.

Referring to fig. 1 to 3, in some alternative embodiments, the coil component 3 includes a first coil 31, the chip component 2 includes a first chip 21, the first coil 31 includes a first winding portion 311 disposed around the central region 11 and a first electrical connection end 312 extending from the first winding portion 311 to the central region 11, and the first electrical connection end 312 is electrically connected to the first chip 21 through the circuit board 1.

Optionally, the first chip 21 is a dual interface chip. Of course, other types of chips, such as a single interface chip, may also be used, and the present application is not limited thereto.

Optionally, the number of the first electrical connection terminals 312 is two, and the first coil 31 and the first chip 21 form a loop through the two first electrical connection terminals 312.

As shown in fig. 1 and 2, optionally, the first coil 31 and the first chip 21 are disposed on the same side of the circuit board 1. Of course, as shown in fig. 3, the first chip 21 and the first coil 31 may be disposed on both sides of the circuit board 1 in the thickness direction.

The first winding portion 311 is located in the edge region 12, and the shape of the first winding portion surrounded by the edge region is not limited, and may be, for example, a square shape, a circular shape, an oval shape, or another shape. The number of turns of the first winding portion 311 is not limited, and may be one or more turns, for example, according to the specific application.

Fig. 4 is a schematic structural diagram of a contactless communication module according to an embodiment of the present application.

Referring to fig. 4, in some optional embodiments, the coil assembly 3 further includes a second coil 32, the chip assembly 2 further includes a second chip 22, the circuit board 1 includes a first surface 13 and a second surface 14 opposite to each other, the first coil 31 and the first chip 21 are disposed on the first surface 13, the second coil 32 and the second chip 22 are disposed on the second surface 14, the second chip 22 is located in the central region 11, the second coil 32 includes a second winding portion disposed around the central region 11 and a second electrical connection end extending from the second winding portion to the central region 11, the second electrical connection end and the second chip 22 are electrically connected through the circuit board 1, wherein the first coil 31 and the second coil 32 are disposed in an insulating manner.

Optionally, the first chip 21 is an identification chip, and the second chip 22 is a light control chip. Of course, the second chip 22 may also be a chip with other functions, such as a sound control chip, and the application is not limited herein.

Optionally, the circuit board 1 is a double-sided circuit board 1.

Optionally, the number of the second electrical connection terminals is two, and the second coil 32 forms a loop with the second chip 22 through the two second electrical connection terminals.

The second winding portion is located in the edge region 12, and the shape of the second winding portion is not limited, and may be, for example, a square shape, a circular shape, an oval shape, or another shape. The number of turns of the second winding portion is not limited, and may be, for example, one or more turns, depending on the specific application. The number of turns of the first coil 31 and the second coil 32 may be the same or different, depending on the specific application. The first coil 31 and the second coil 32 may or may not have the same shape, depending on the specific use.

The chip assembly 2 includes a first chip 21 and a second chip 22, and a first coil 31 and a second coil 32 are respectively connected and matched with the first chip 21 and the second chip 22. Thus, the non-contact communication module can realize two functions, the first is an identity recognition function, and the second can be selected according to the actual requirements of the user, for example, when the second chip 22 is a light control chip, the non-contact communication module further includes a controlled light source, and the light control chip is electrically connected with the controlled light source. When the contactless communication module is close to an external reader/writer, the first coil 31 and the second coil 32 are simultaneously induced and respectively transmit electric energy to the first chip 21 and the second chip 22, so that the first chip 21 and the second chip 22 almost work simultaneously, and the second chip 22 controls the controlled light source to light up while the first chip 21 and the external reader/writer respond. That is, by observing whether the controlled light source emits light, it is possible to determine whether the first chip 21 has responded to the external card reader. When the card user is in a payment or other use scene needing identity recognition, the second chip 22 can give a prompt to remind the user whether the identity recognition is successful or whether the payment is carried out, so that the user can know the use state of the non-contact communication module conveniently, the user is prevented from carrying out payment or repeated payment under the condition of being unaware, and the method is favorable for reducing property loss and guaranteeing property safety. When the second chip 22 is a sound control chip, the non-contact communication module includes a speaker, the speaker is electrically connected to the second chip 22, and the specific working process of the non-contact communication module is similar to that of the light control chip, which is not described herein again.

Optionally, the non-contact communication module further includes a wave-absorbing material layer, and the wave-absorbing material layers are respectively disposed between the first coil 31 and the circuit board 1 and between the second coil 32 and the circuit board 1. Furthermore, the material of the wave-absorbing material layer is ferrite. The wave-absorbing material layer enables the first coil 31 and the second coil 32 to be mutually insulated and work independently, and the communication distance is increased.

In other alternative embodiments, the matrix material of the circuit board is made of wave-absorbing material, so that the two can work independently.

In an alternative embodiment, the first coil 31 and the second coil 32 are arranged in a staggered manner in the thickness direction of the circuit board 1. By such arrangement, signal interference when two cards are stacked is avoided.

Fig. 5 is a schematic structural diagram of a contactless communication module according to an embodiment of the present application.

Referring to fig. 5, in some alternative embodiments, the coil assembly 3 includes a first sub-coil 313 and a second sub-coil 315, the circuit board 1 includes a first surface 13 and a second surface 14 opposite to each other, the first sub-coil 313 and the first chip 21 are disposed on the first surface 13, the second sub-coil 315 is disposed in the edge region 12 of the second surface 14, and the first sub-coil 313 and the second sub-coil 315 are connected in series and electrically connected to the first chip 21 through the circuit board 1.

The first sub-coil 313 is located in the edge region 12, and the shape of the first sub-coil is not limited, and may be, for example, a square shape, a circular shape, an oval shape, or other shapes. The number of turns of the first sub-coil 313 is not limited, and may be one or more turns, for example, according to the specific application.

The second sub-coil 315 is located in the edge region 12, and the shape of the second sub-coil is not limited, and may be, for example, a square, a circle, an ellipse, or other shapes. The number of turns of the second sub-coil 315 is not limited, and may be one or more turns, for example, according to the specific application scenario.

The first sub-coil 313 and the second sub-coil 315 may be vertically aligned with each other or may be vertically staggered. The number of winding turns of the first sub-coil 313 and the second sub-coil 315 may be the same or different, depending on the specific application. The first sub-coil 313 and the second sub-coil 315 may or may not have the same shape, depending on the specific use.

By arranging the second sub-coil 315 on the second surface 14 of the circuit board 1, the second sub-coil 315 is connected in series with the first sub-coil 313, and both are connected to the first chip 21, so that, when in application, the non-contact communication module is placed in a magnetic field, and under the condition that the magnetic flux density is equal, because the coil assembly 3 is a structure in which two layers of the first sub-coil 313 and the second sub-coil 315 are overlapped, the effective area of the coil assembly 3 surrounding the magnetic field is increased, the induced magnetic flux is increased, so that a larger induced electromotive force is obtained, power supply and information interaction are provided for the chip assembly 2, the read-write distance (i.e. the communication distance) of the coil assembly 3 is increased, and the size of the corresponding coil assembly 3 is reduced.

In some alternative embodiments, the circuit board 1 is provided with a first through hole penetrating the first surface 13 and the second surface 14, and one end of the first sub-coil 313 passes through the first through hole and is electrically connected with one end of the second sub-coil 315.

Specifically, the two taps of the first and second sub-coils 313 and 315, which are respectively wound or etched, are connected through the first through hole to realize the feeding connection. And the rest tap of the first sub-coil 313 and the rest tap of the second sub-coil 315 are used as pins of the coil assembly 3, and the lead-out contact is connected with the chip assembly 2. The two taps can be located on the first surface 13 and the second surface 14, respectively, but the two taps can be located on the first surface 13 or the second surface 14 simultaneously by connecting through holes according to the use requirement.

With continued reference to fig. 5, in other alternative embodiments, the circuit board 1 is provided with a second through hole 15 penetrating through the first surface 13 and the second surface 14, a conductor 16 is disposed in the second through hole 15, and the first sub-coil 313 and the second sub-coil 315 are electrically connected through the conductor 16.

Specifically, the first sub-coil 313 has a first conductive point 314, the second sub-coil 315 has a second conductive point 316, and the first conductive point 314 and the second conductive point 316 are electrically connected by the conductor 16.

Of course, the first sub-coil 313 and the second sub-coil 315 may also be connected in series, for example, a tap of the first sub-coil 313 is wound or etched through the circuit board 1 to form the second sub-coil 315, so as to implement the feeding connection, which is not limited herein.

In some alternative embodiments, the contactless communication module further comprises a first capacitor and a second capacitor disposed on the circuit board 1, the first capacitor being connected in series with the chip assembly 2, and the second capacitor being connected in parallel with the chip assembly 2.

Optionally, the first capacitor and the second capacitor are printed parallel plate capacitors. Printing the parallel plate capacitor does not increase the size of the contactless communication module. Of course, the first capacitor and the second capacitor may be soldered directly on the circuit board 1.

By tuning the first capacitor and the second capacitor, the coil assembly 3 can reach the optimal resonant frequency, the optimal quality factor is obtained, the coupling efficiency is maximized, and the communication distance is increased, so that the larger communication distance is realized under the condition that the surrounding area of the coil assembly 3 is smaller.

The embodiment of the application also provides a smart card which comprises the non-contact communication module.

While the present application has been described with reference to preferred embodiments, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the present application, and in particular, features shown in the various embodiments may be combined in any manner as long as there is no structural conflict. The present application is not intended to be limited to the particular embodiments disclosed herein, but rather to cover all embodiments falling within the scope of the appended claims.

Claims (10)

1. A contactless communication module, comprising:

a circuit board including a central region and an edge region surrounding the central region;

the chip assembly is arranged in the central area of the circuit board and is electrically connected with the circuit board;

and the coil assembly is arranged at the edge area of the circuit board and is electrically connected with the chip assembly through the circuit board.

2. The contactless communication module of claim 1, wherein the coil assembly includes a first coil, the chip assembly including a first chip, the first coil including a first winding portion disposed around the central region and a first electrical connection terminal extending from the first winding portion to the central region, the first electrical connection terminal being electrically connected to the first chip through the circuit board.

3. The contactless communications module of claim 2, wherein the coil assembly further comprises a second coil, the chip assembly further comprises a second chip, the circuit board comprises opposing first and second surfaces, the first coil and the first chip are disposed on the first surface, the second coil and the second chip are disposed on the second surface,

the second chip is located in the central area, the second coil includes a second winding portion disposed around the central area and a second electrical connection end extending from the second winding portion to the central area, the second electrical connection end is electrically connected to the second chip through the circuit board, and the first coil and the second coil are disposed in an insulated manner.

4. The contactless communication module of claim 3, wherein the first chip is an identification chip and the second chip is a light control chip.

5. The contactless communication module of claim 3, further comprising a wave-absorbing material layer, the wave-absorbing material layer being disposed between the first coil and the circuit board and between the second coil and the circuit board, respectively.

6. The contactless communication module according to claim 3, wherein the first coil and the second coil are disposed to be shifted in a thickness direction of the circuit board.

7. The contactless communications module of claim 2, wherein the first coil includes a first sub-coil and a second sub-coil, the circuit board includes opposing first and second surfaces,

the first sub-coil and the first chip are arranged on the first surface, the second sub-coil is arranged on the edge area of the second surface, and the first sub-coil and the second sub-coil are connected in series and are electrically connected with the first chip through the circuit board.

8. The contactless communication module of claim 7,

the circuit board is provided with a first through hole penetrating through the first surface and the second surface, and one end of the first sub-coil penetrates through the first through hole and is electrically connected with one end of the second sub-coil;

or the circuit board is provided with a second through hole penetrating through the first surface and the second surface, a conductor is arranged in the second through hole, and the first sub-coil and the second sub-coil are electrically connected through the conductor.

9. The contactless communication module according to any one of claims 1 to 8, further comprising a first capacitor and a second capacitor provided to the circuit board, the first capacitor being connected in series with the chip component, and the second capacitor being connected in parallel with the chip component.

10. A smart card, characterized in that it comprises a contactless communication module according to any of the preceding claims 1-9.

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