WO2018079718A1 - Antenna-mounted communication ic unit and antenna-mounted communication ic unit equipped with conductor - Google Patents

Antenna-mounted communication ic unit and antenna-mounted communication ic unit equipped with conductor Download PDF

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Publication number
WO2018079718A1
WO2018079718A1 PCT/JP2017/038927 JP2017038927W WO2018079718A1 WO 2018079718 A1 WO2018079718 A1 WO 2018079718A1 JP 2017038927 W JP2017038927 W JP 2017038927W WO 2018079718 A1 WO2018079718 A1 WO 2018079718A1
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Prior art keywords
antenna
unit
conductor
coil
sub
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PCT/JP2017/038927
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French (fr)
Japanese (ja)
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久夫 金岡
詩朗 杉村
達次 庭田
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株式会社フェニックスソリューション
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Priority to JP2018547787A priority Critical patent/JPWO2018079718A1/en
Publication of WO2018079718A1 publication Critical patent/WO2018079718A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H04B5/48—

Definitions

  • An object of the present invention is to provide an antenna-mounted communication IC unit and a conductor-mounted antenna-mounted communication IC unit that exhibit high communication performance when attached to a conductor.
  • RFID Radio Frequency Identification
  • the RF tag used in the RFID system contains an antenna and an IC chip.
  • the carrier wave transmitted from the reader / writer antenna is received by the RF tag antenna and the identification data recorded on the IC chip is reflected. It communicates in a non-contact manner by returning it to the reader / writer on the wave.
  • the prior art has the following problems. That is, since the communication distance is short, it is necessary to bring the reader / writer close to the vicinity of the IC unit. In addition, if the IC unit is brought closer to a conductor (metal object, etc.), the resonance frequency will shift and this will interfere with communication, or communication will not be possible if radio waves are irradiated on the back side of the surface where the IC unit is attached. There's a problem.
  • the present invention provides an antenna-mounted communication IC unit that exhibits high communication performance when mounted on a conductor and a conductor-mounted antenna-mounted communication IC unit.
  • An antenna-mounted communication IC unit is an antenna-mounted communication IC unit including at least an antenna portion formed by stacking substrates on which coils are formed, and an IC chip connected to the antenna portion.
  • the antenna unit includes a main element in which a plurality of coils are connected in series so that the generation directions of magnetic flux coincide with each other, and a sub-element including a coil of less than one turn having an open portion.
  • the element is electromagnetically coupled.
  • the sub-element is installed on the conductor. Further, the planar outer dimension of the substrate is 5 mm ⁇ 5 mm or less.
  • the antenna-mounted communication IC unit of the present invention further includes a conductor in the antenna-mounted communication IC unit, the conductor has a cutout portion, and the cutout portion is open.
  • the main element and the sub-element are electromagnetically connected so that the generation direction of the magnetic flux of the main element and the generation direction of the sub-element coincide with each other.
  • the step of combining is provided. Further, in the invention of the antenna-mounted communication IC unit, it is preferable that the center of the magnetic flux of the main element and the center of the magnetic flux of the sub-element are formed so as to coincide with each other.
  • the main element preferably includes a plurality of substrates made of an insulator and a plurality of coils.
  • the open portion of the sub element preferably forms an equivalent capacity.
  • the planar outer dimension of the substrate is preferably 5 mm ⁇ 5 mm or less.
  • the antenna-mounted communication IC unit includes at least an antenna portion and an IC chip connected to the antenna portion, and the antenna portion includes an insulating substrate and a coil having one or more turns formed on the insulating substrate.
  • the antenna unit includes at least an antenna unit formed by stacking substrates on which coils are formed, an IC chip connected to the antenna unit, and a conductor.
  • the open portion of the sub-element is overlapped with the notch portion formed in the conductor.
  • the cutout width of the cutout portion of the conductor is preferably equal to or larger than the width of the open portion of the sub-element.
  • the antenna unit includes at least an antenna unit formed by stacking a plurality of substrates on which coils are formed, an IC chip connected to the antenna unit, and a conductor. Includes a main element in which a plurality of coils are connected in series so that magnetic flux generation directions coincide with each other, and the conductor includes a circular hole and an open portion communicating with the circular hole, and the coil of the main element and the circular hole It is preferable that the coil formed by the surrounding conductors is electromagnetically coupled.
  • both the main element and the sub-element constituting the antenna unit are constituted by coils, and the coil shape of the sub-element installed on the conductor is less than one turn. Then, by connecting the main element and the sub-element so that the magnetic flux generation directions of the two elements coincide with each other, the entire conductor functions as an antenna.
  • the carrier wave of the reader / writer is transmitted from a position away from the IC unit, the carrier wave may not reach the IC unit.
  • the conductor functions as an antenna in the present invention, as long as the carrier wave reaches a part of the conductor, the carrier wave propagates through the conductor to the sub-element and the main element, the power supply voltage is generated in the IC chip, the communication circuit, etc.
  • the antenna-mounted communication IC unit of the present invention can exhibit high communication performance when attached to a conductor.
  • the term “conductor” is “generic name for substances having a relatively large electrical conductivity” (Kojien), as well as the general meaning. For example, metal, carbon fiber, human body, animal body, vegetation, Although water, the ground, etc. are mentioned, it is not necessarily limited to these.
  • the conductor there is a conductor used for a portable article such as a small portable communication terminal or a non-contact type IC card.
  • the conductor includes a metal plate.
  • the main element is constituted by connecting a plurality of coils in series, it is possible to reduce the size, and it is also possible to manufacture a small IC unit having a planar external dimension of 5 mm ⁇ 5 mm or less.
  • FIG. 3 is an equivalent circuit diagram of an antenna-mounted communication IC unit. It is a perspective view which shows the modification of an IC mounting unit for antenna mounting. It is a perspective view which shows the structure of the conductor which is an IC chip and the main element of an antenna part, and a subelement among communication IC units of an antenna mounting type.
  • the antenna-mounted communication IC unit 1 includes at least an IC chip 10 and an antenna unit 20.
  • the IC chip 10 is disposed on the upper surface of the uppermost substrate 31.
  • the IC chip 10 rectifies a part of the carrier wave transmitted from the reader / writer and generates a power supply voltage necessary for operation.
  • a memory in which a control logic circuit or the like in the IC chip 10 is stored and a communication circuit or the like for transmitting / receiving data to / from the reader / writer are operated by the generated power supply voltage.
  • Two lines 11 are drawn from the side surface of the IC chip 10.
  • the surface of the uppermost substrate 31 and the IC chip 10 may be covered with a protective layer.
  • the antenna unit 20 includes a main element 30 and a sub element 40.
  • the main element 30 is configured by laminating a plurality of substrates 31.
  • the number of stacked substrates 31 can be adjusted as appropriate. For example, two or more substrates 31 can be used, and three or four or more substrates can be used. In the present embodiment, three sheets are used.
  • a coil 32 is formed on the back surface (lower surface) of each substrate 31.
  • the substrate 31 in the present embodiment is configured by laminating the intermediate layer substrate 31 and the lowermost layer substrate 31 on the uppermost layer substrate 31 described above.
  • the substrate 31 can be laminated by a known method such as a method using an adhesive or a fusion of a resin contained in the substrate 31.
  • the uppermost first coil 32 is formed between the intermediate substrate 31 and the uppermost substrate 31, and the intermediate layer first coil 32 is formed between the intermediate substrate 31 and the lowermost substrate 31.
  • Two coils 32 are formed.
  • an insulating plate such as ceramics, mica and glass, an insulating film, an insulating sheet, an insulating film, etc. are used in addition to any generally used insulating plastic resin including epoxy resin and polyimide resin. be able to. Ceramics are suitable from the viewpoints of insulation, miniaturization, and high temperature resistance.
  • substrate 31 are not specifically limited.
  • the shape of the substrate 31 can be a rectangular shape such as a square or a rectangle, a circle, an ellipse, or the like.
  • the dimension of one side (or the maximum outer shape) of the substrate 31 can be 0.5 mm or more, and preferably 1 mm or more.
  • the dimension of one side (or the maximum outer shape) of the substrate 31 can be 8 mm or less, preferably 6 mm or less, more preferably 5 mm or less, and most preferably 3 mm or less.
  • the planar outer dimensions are 5 mm ⁇ 5 mm or less.
  • an insulating film may be disposed between the substrates 31 as necessary.
  • the coil 32 is a so-called planar coil that is spiral in a plane.
  • the outermost end of the uppermost coil 32 is connected to one line 11 of the IC chip 10 through one of the connection points 33 (through holes) of the uppermost substrate 31. From the outer peripheral end, it turns counterclockwise in a spiral shape, and the inner peripheral end is connected to the inner peripheral end of the intermediate layer coil 32 via a connection point of the intermediate layer substrate 31.
  • the coil 32 of the intermediate layer is spirally counterclockwise from the inner peripheral end thereof, and the outer peripheral end is connected to the other line 11 via the other of the connection points 33 of the intermediate layer and the uppermost substrate 31.
  • the coils 32 are connected in series so that the magnetic flux generated by a common current is generated in the same direction.
  • the number, formation area, and number of turns of each coil 32 can be arbitrarily set according to the required inductance of the IC unit 1.
  • the number of turns of the coil 32 of the uppermost layer and the intermediate layer is preferably 2 or more, and can be 3 or 4 or more.
  • the winding direction and connection form of each coil 32 may be any form other than that shown in the drawing as long as the magnetic field generation direction from each coil 32 is the same direction.
  • the coil 32 is formed on the back surface (lower surface) of the substrate 31, but may be formed on the front surface (upper surface) of the substrate 31.
  • the coil 32 is made of any conductive material including metal, and can be formed on the substrate 31 by a technique such as plating, printing, etching, or vapor deposition.
  • the sub element 40 is installed on the conductor 50 and is constituted by a coil 41 having less than one turn.
  • the coil 41 having less than one turn has an open portion 42 that forms between one end and the other end. That is, by forming the open portion 42, the coil 41 having less than one turn is formed.
  • the interval between the open portions 42 is set so that an equivalent capacity described later can be set to a desired value.
  • the coil 41 of less than one turn includes a thin plate-shaped coil main body, a circular hole formed at substantially the center of the coil main body, and a rectangular opening 42 communicating with the hole. Have. As shown in FIG.
  • a notch 51 is provided in a part of the metal plate, and the notch 51 and the open portion 42 of the coil 41 of less than one turn are vertically moved.
  • the conductor 50 and the sub element 40 are brought into electrical contact connection by being superimposed on each other.
  • a hole and a notch 51 communicating with the hole are also formed in the conductor 50 as in the case of the coil 41 having an I turn of less.
  • the coil 41 having less than one turn may be attached to a position that is electrically connected to the wiring of the printed board.
  • the coil 41 having less than one turn is made of any conductive material including metal.
  • the formation method of the coil 41 of less than one turn can be variously selected according to the type of the conductor 50. For example, when the conductor 50 is a metal plate or a printed board, plating, printing, etching, vapor deposition, etc. are performed on these. May be formed. Alternatively, a coil 41 having less than one turn may be formed by cutting out a thin metal plate.
  • both elements are electromagnetically coupled so that the magnetic flux generation directions of the main element 30 and the sub-element 40 coincide as shown in FIG. Since the coil 41 constituting the sub-element 40 is configured with less than one turn, the cutout portion 51 with less than one turn is provided in the portion of the conductor 50 that faces the coil 41 with less than one turn. That is, the notch 51 having the same shape and the same size as the opening 42 is provided at the edge portion of the conductor 50 so that the opening 42 formed in the coil 41 having less than one turn and the notch 51 are matched. .
  • the notch width of the notch 51 of the conductor 50 is preferably equal to the width of the open part 42 of the sub element 40 or larger than the width of the open part 42.
  • the cutout portion 51 includes a rectangular cutout, and may have a width larger than the width of the opening portion 42. And what is necessary is just to fix the subelement 40 to the conductor 50 in the state which match
  • the fixing method for example, a known fixing method such as a method using a conductive adhesive or fixing by soldering can be employed.
  • the conductor 50 whole can be utilized as an antenna by connecting the main element 30 and the subelement 40 so that both magnetic flux generation directions may coincide.
  • Examples of the conductor 50 include, but are not limited to, conductors used for portable articles such as small portable communication terminals and non-contact type IC cards.
  • FIG. 4 is an equivalent circuit diagram of the IC unit 1 of the present embodiment.
  • the main element 30 and the sub element 40 constitute a resonance circuit with the equivalent capacitor 100 in the IC chip 10 and the equivalent capacitor 101 including the gap of the open portion 42 of the coil 41 of less than one turn.
  • a capacitor may be separately provided outside the IC chip 10 as necessary.
  • the inductance is proportional to the number of turns of the coil. Under the condition that the total number of turns of the coil 32 constituting the main element 30 is n (where n >> 1), the change in inductance is very much before and after the main element 30 and the sub-element 40 are electromagnetically joined. There are few.
  • the present invention is not limited to this, and as shown in FIG.
  • both the coil 32 and the coil 41 of less than one turn or Either one may be attached to the alignment member 60.
  • the plate-like (or belt-like) alignment member 60 is attached to both ends of the lowermost substrate 31 in a leg shape, and the lower end portion of the alignment member is one turn.
  • the lowermost substrate 31 may be fixed to the conductor 50 so as to match the outer edge of the lower coil 41.
  • the plate-like alignment member 60 is fixed to the upper surface of the coil 41 of less than one turn, and the lowermost substrate 31 is placed so that the outer edge of the lowermost substrate 31 matches the periphery of the alignment member 60. It may be fixed to the conductor 50.
  • These alignment members 60 are made of an electrically insulating material.
  • FIG. 6 is a perspective view showing a structure of a conductor which is an IC chip and a main element and a sub-element of the antenna portion of the antenna-mounted communication IC unit.
  • the coil 41 with less than one turn in which the open portion 42 is formed is overlapped and fixed on the conductor 50 in which the cutout portion 51 is formed, but the coil 41 with less than one turn is omitted.
  • the conductor 50 in which the notch 51 is formed may be used. That is, as shown in FIG. 6, the role of the coil 41 of less than one turn of the sub element 40 may be formed by the conductor 50 and the cutout portion 51 of the conductor 50.
  • a hole and a notch 51 communicating with the hole are formed in the conductor 50 in the same manner as the coil 41 with less than I turn.
  • the main element 30 which comprises the antenna part 20 is piled up on this conductor 50.
  • the coil 32 of the main element 30 and the coil formed by the portion of the conductor 50 existing around the circular hole are electromagnetically coupled.
  • an equivalent capacitance is generated by the notch 51 formed in the conductor 50.
  • the open portion 42 of the sub element 40 has the same shape as the cutout portion 51 of the conductor 50, but the cutout portion 51 formed in the conductor 50 may be formed wider than the open portion 42. .
  • the present invention is an antenna-mounted communication IC unit that exhibits high communication performance when mounted on a conductor and a conductor-mounted antenna-mounted communication IC unit, and has industrial applicability.
  • the conductor include a conductor used for a small portable communication terminal or a non-contact type IC card.

Abstract

[Problem] To provide an antenna-mounted communication IC unit which exhibits high communication performance when attached to a conductor, and an antenna-mounted communication IC unit equipped with a conductor. [Solution] Provided is an antenna-mounted communication IC chip 1 is equipped with at least an antenna unit 20 formed by stacking substrates 31 on which coils 32 are formed, and an IC chip 10 connected to the antenna unit, wherein the antenna unit is equipped with a main element 30 formed by connecting multiple coils in series such that the directions in which they generate magnetic flux coincide, and an auxiliary element comprising a coil 41 having an open section 42 and having less than one turn, and the main element and the auxiliary element are electromagnetically coupled. By connecting the main element and the auxiliary element such that the directions in which they generate magnetic flux coincide, the entire conductor 50 can be made to function as an antenna.

Description

アンテナ搭載形の通信用ＩＣユニット及び導体付きアンテナ搭載形の通信用ＩＣユニットCommunication IC unit with antenna and communication IC unit with conductor and antenna
　本発明は、導体に取り付けた場合に、高い通信性能を発揮するアンテナ搭載形の通信用ＩＣユニット及び導体付きアンテナ搭載形の通信用ＩＣユニットを提供することを目的とする。 An object of the present invention is to provide an antenna-mounted communication IC unit and a conductor-mounted antenna-mounted communication IC unit that exhibit high communication performance when attached to a conductor.
　近年、ＲＦＩＤ（Ｒａｄｉｏ　Ｆｒｅｑｕｅｎｃｙ　Ｉｄｅｎｔｉｆｉｃａｔｉｏｎ）が利用されている。
　ＲＦＩＤシステムで使用するＲＦタグにはアンテナ及びＩＣチップが格納されており、リーダ・ライタのアンテナから送信された搬送波をＲＦタグのアンテナで受信し、ＩＣチップに記録されている識別データ等を反射波に乗せてリーダ・ライタへ返送することで非接触で交信する仕組みになっている。 In recent years, RFID (Radio Frequency Identification) has been used.
The RF tag used in the RFID system contains an antenna and an IC chip. The carrier wave transmitted from the reader / writer antenna is received by the RF tag antenna and the identification data recorded on the IC chip is reflected. It communicates in a non-contact manner by returning it to the reader / writer on the wave.
　従来のＲＦタグ用のアンテナとして例えば二次元の一層の渦巻状のタイプが知られている。しかし、パターンサイズを小さくして高インダクタンスを実現することが難しいため、回路設計が難しいという問題や、ＩＣチップに搭載して小型化するのが難しいという問題があった。
　そこで、本願発明者は、コイルを形成した基板を積層すると共に磁界の発生方向が同一方向になるように各コイルを直列接続したアンテナ搭載形の通信用ＩＣユニットを開発した（特許文献１及び２）。
　このＩＣユニットによれば、積層した複数のコイルを一体的に作動させることができるので、高インダクタンスを実現でき、回路設計及び小型化が容易になる。 As a conventional antenna for an RF tag, for example, a two-dimensional one-layer spiral type is known. However, since it is difficult to realize a high inductance by reducing the pattern size, there are problems that it is difficult to design a circuit and that it is difficult to downsize by mounting on an IC chip.
Accordingly, the inventor of the present application has developed an antenna-mounted communication IC unit in which the coils are stacked and the coils are connected in series so that the magnetic field is generated in the same direction (Patent Documents 1 and 2). ).
According to this IC unit, a plurality of stacked coils can be operated integrally, so that high inductance can be realized, and circuit design and miniaturization are facilitated.
特許第４７１３６２１号公報Japanese Patent No. 4713621 特許第４１０６６７３号公報Japanese Patent No. 4166673
　ところが、上記従来技術では以下のような問題がある。
　すなわち、通信距離が短いためリーダ・ライタをＩＣユニットの近傍まで近づける必要があるという問題がある。
　また、ＩＣユニットを導体（金属物等）に近づけると共振周波数がずれてしまい通信に支障が出るという問題または、ＩＣユニットを取り付けた面の裏側の面に電波を照射した場合には通信できないという問題がある。 However, the prior art has the following problems.
That is, since the communication distance is short, it is necessary to bring the reader / writer close to the vicinity of the IC unit.
In addition, if the IC unit is brought closer to a conductor (metal object, etc.), the resonance frequency will shift and this will interfere with communication, or communication will not be possible if radio waves are irradiated on the back side of the surface where the IC unit is attached. There's a problem.
　本発明は、このような問題を考慮して、導体に取り付けた場合に高い通信性能を発揮するアンテナ搭載形の通信用ＩＣユニット及び導体付きアンテナ搭載形の通信用ＩＣユニットを提供することを目的とする。 SUMMARY OF THE INVENTION In consideration of such problems, the present invention provides an antenna-mounted communication IC unit that exhibits high communication performance when mounted on a conductor and a conductor-mounted antenna-mounted communication IC unit. And
　本発明のアンテナ搭載形の通信用ＩＣユニットは、コイルが形成された基板を積層して成るアンテナ部と、当該アンテナ部と接続されるＩＣチップとを少なくとも備えるアンテナ搭載形の通信用ＩＣユニットにおいて、アンテナ部は、磁束の発生方向が一致するように複数のコイルが直列接続されて成る主エレメントと、開放部を有する１ターン未満のコイルから成る副エレメントとを備えており、主エレメントと副エレメントとが電磁結合されることを特徴とする。
　また、副エレメントが導体に設置されることを特徴とする。
　また、基板の平面外形寸法が５ｍｍ×５ｍｍ以下であることを特徴とする。
　本発明の導体付きアンテナ搭載形の通信用ＩＣユニットは、上記アンテナ搭載形の通信用ＩＣユニットに、さらに導体を有し、当該導体が切り欠き部を有しており、当該切り欠き部と開放部とを重ね合わせることで、導体と副エレメントとを電気的に接触接続するステップと、主エレメントの磁束の発生方向と副エレメントの磁束の発生方向が一致するように主エレメントと副エレメントを電磁結合するステップを備えることを特徴とする。
　さらに、アンテナ搭載形の通信用ＩＣユニットの発明において、主エレメントの磁束の中心と、副エレメントの磁束の中心とが、一致するよう形成されたことが好ましい。なお、主エレメントの磁束と、副エレメントの磁束とが、互いに影響し合うずれであれば、問題ないが、磁束の中心が一致することが望ましい。
　主エレメントは、絶縁体からなる複数の基板と、複数のコイルとを含むことが好ましい。
　副エレメントの開放部は、等価容量を形成することが好ましい。
　基板の平面外形寸法が５ｍｍ×５ｍｍ以下であることが好ましい。
　さらに、アンテナ搭載形の通信用ＩＣユニットにおいて、アンテナ部と、アンテナ部と接続されるＩＣチップと、を少なくとも含み、アンテナ部は、絶縁基板と、絶縁基板に形成された１ターン以上のコイルと、を含む主エレメントと、開放部が形成された１ターン未満のコイルを含む副エレメントと、を含み、主エレメントは、副エレメントと電磁結合し、副エレメントは、開放部によって構成されるコンデンサと１ターン未満のコイルとにより共振回路を形成するのが好ましい。
　また、導体付きアンテナ搭載形の通信用ＩＣユニットにおいて、コイルが形成された基板を積層して成るアンテナ部と、当該アンテナ部と接続されるＩＣチップと、導体と、を少なくとも含み、アンテナ部は、磁束の発生方向が一致するように複数のコイルが直列接続されて成る主エレメントと、開放部を有する１ターン未満のコイルから成る副エレメントと、を含み、主エレメントと副エレメントとが電磁結合され、導体に形成された切り欠き部に、副エレメントの開放部が重ねられたことが好ましい。
　導体の切り欠き部の切り欠き幅は、副エレメントの開放部の幅と等しいか、または開放部の幅よりも大きいことが好ましい。
　さらに、導体付きアンテナ搭載形の通信用ＩＣユニットにおいて、コイルが形成された基板を複数積層して成るアンテナ部と、当該アンテナ部と接続されるＩＣチップと、導体と、を少なくとも含み、アンテナ部は、磁束の発生方向が一致するように複数のコイルが直列接続されて成る主エレメントを含み、導体は、円孔と円孔に連通する開放部と、を含み、主エレメントのコイルと円孔の周囲の導体によって形成されるコイルとが電磁結合されたことが好ましい。 An antenna-mounted communication IC unit according to the present invention is an antenna-mounted communication IC unit including at least an antenna portion formed by stacking substrates on which coils are formed, and an IC chip connected to the antenna portion. The antenna unit includes a main element in which a plurality of coils are connected in series so that the generation directions of magnetic flux coincide with each other, and a sub-element including a coil of less than one turn having an open portion. The element is electromagnetically coupled.
Further, the sub-element is installed on the conductor.
Further, the planar outer dimension of the substrate is 5 mm × 5 mm or less.
The antenna-mounted communication IC unit of the present invention further includes a conductor in the antenna-mounted communication IC unit, the conductor has a cutout portion, and the cutout portion is open. The main element and the sub-element are electromagnetically connected so that the generation direction of the magnetic flux of the main element and the generation direction of the sub-element coincide with each other. The step of combining is provided.
Further, in the invention of the antenna-mounted communication IC unit, it is preferable that the center of the magnetic flux of the main element and the center of the magnetic flux of the sub-element are formed so as to coincide with each other. Note that there is no problem as long as the magnetic flux of the main element and the magnetic flux of the sub-element affect each other, but it is desirable that the centers of the magnetic fluxes coincide.
The main element preferably includes a plurality of substrates made of an insulator and a plurality of coils.
The open portion of the sub element preferably forms an equivalent capacity.
The planar outer dimension of the substrate is preferably 5 mm × 5 mm or less.
Further, the antenna-mounted communication IC unit includes at least an antenna portion and an IC chip connected to the antenna portion, and the antenna portion includes an insulating substrate and a coil having one or more turns formed on the insulating substrate. And a sub-element including a coil of less than one turn in which an opening is formed, the main element is electromagnetically coupled to the sub-element, and the sub-element is a capacitor constituted by the opening A resonant circuit is preferably formed with a coil of less than one turn.
Further, in the communication IC unit with a conductor-mounted antenna, the antenna unit includes at least an antenna unit formed by stacking substrates on which coils are formed, an IC chip connected to the antenna unit, and a conductor. , Including a main element in which a plurality of coils are connected in series so that the magnetic flux generation directions coincide with each other, and a sub-element including a coil of less than one turn having an open portion, and the main element and the sub-element are electromagnetically coupled In addition, it is preferable that the open portion of the sub-element is overlapped with the notch portion formed in the conductor.
The cutout width of the cutout portion of the conductor is preferably equal to or larger than the width of the open portion of the sub-element.
Further, in the communication IC unit having a conductor-mounted antenna, the antenna unit includes at least an antenna unit formed by stacking a plurality of substrates on which coils are formed, an IC chip connected to the antenna unit, and a conductor. Includes a main element in which a plurality of coils are connected in series so that magnetic flux generation directions coincide with each other, and the conductor includes a circular hole and an open portion communicating with the circular hole, and the coil of the main element and the circular hole It is preferable that the coil formed by the surrounding conductors is electromagnetically coupled.
　本発明ではアンテナ部を構成する主エレメントと副エレメントを共にコイルで構成し、導体に設置する副エレメントのコイル形状を１ターン未満とする。そして、主エレメントと副エレメントを両者の磁束の発生方向が一致するように接続することで導体全体をアンテナとして機能させる。
　ＩＣユニットから離れた位置からリーダ・ライタの搬送波を送信した場合、搬送波がＩＣユニットまで届かない場合がある。しかし、本発明では導体がアンテナとして機能するため、搬送波が導体の一部まで届きさえすれば、搬送波は導体を伝わり副エレメント及び主エレメントまで至り、ＩＣチップにおいて電源電圧が生成され、通信回路等を動作させることができる。
　また、本発明ではＩＣユニットを取り付けた面の裏側の面に電波を照射した場合にも、表側の面に電波を照射した場合とほぼ同品質で通信できる。
　このように、本発明のアンテナ搭載形の通信用ＩＣユニットは導体に取り付けた場合に高い通信性能を発揮することができる。
　なお、本発明において「導体」とは一般的な意味と同様に「電気の伝導率が比較的大きな物質の総称」（広辞苑）であり、例えば金属、炭素繊維、人体、動物の体、草木、水、地面などが挙げられるが、必ずしもこれらに限定されない。
　導体の一例としては、小形の携帯用通信端末、非接触形のＩＣカード等の携帯用物品に使用される導体がある。また、その他、導体として、金属板等がある。
　また、本発明では複数のコイルを直列接続することで主エレメントを構成するので小型化が可能になり、基板の平面外形寸法が５ｍｍ×５ｍｍ以下の小型のＩＣユニットを製造することもできる。 In the present invention, both the main element and the sub-element constituting the antenna unit are constituted by coils, and the coil shape of the sub-element installed on the conductor is less than one turn. Then, by connecting the main element and the sub-element so that the magnetic flux generation directions of the two elements coincide with each other, the entire conductor functions as an antenna.
When the carrier wave of the reader / writer is transmitted from a position away from the IC unit, the carrier wave may not reach the IC unit. However, since the conductor functions as an antenna in the present invention, as long as the carrier wave reaches a part of the conductor, the carrier wave propagates through the conductor to the sub-element and the main element, the power supply voltage is generated in the IC chip, the communication circuit, etc. Can be operated.
Further, in the present invention, even when a radio wave is irradiated on the back surface of the surface where the IC unit is attached, communication can be performed with substantially the same quality as when a radio wave is irradiated on the front surface.
Thus, the antenna-mounted communication IC unit of the present invention can exhibit high communication performance when attached to a conductor.
In the present invention, the term “conductor” is “generic name for substances having a relatively large electrical conductivity” (Kojien), as well as the general meaning. For example, metal, carbon fiber, human body, animal body, vegetation, Although water, the ground, etc. are mentioned, it is not necessarily limited to these.
As an example of the conductor, there is a conductor used for a portable article such as a small portable communication terminal or a non-contact type IC card. In addition, the conductor includes a metal plate.
In the present invention, since the main element is constituted by connecting a plurality of coils in series, it is possible to reduce the size, and it is also possible to manufacture a small IC unit having a planar external dimension of 5 mm × 5 mm or less.
アンテナ搭載形の通信用ＩＣユニットのうちＩＣチップとアンテナ部の主エレメント及び副エレメントの構造を示す斜視図である。It is a perspective view which shows the structure of the main element and subelement of an IC chip and an antenna part among antenna-mounted communication IC units. アンテナ部の副エレメントの１ターン未満のコイルを導体に設置した状態を示す斜視図である。It is a perspective view which shows the state which installed in the conductor the coil of less than 1 turn of the subelement of an antenna part. 主エレメント及び副エレメントを分解した状態で金属（導体）に設置する態様を示す図（ａ）、及び主エレメントと副エレメントとを一体化したＩＣユニットを金属に設置した状態を示す図（ｂ）である。The figure (a) which shows the aspect installed in the metal (conductor) in the state which decomposed | disassembled the main element and the subelement, and the figure (b) which shows the state which installed the IC unit which integrated the main element and the subelement in the metal It is. アンテナ搭載形の通信用ＩＣユニットの等価回路図である。FIG. 3 is an equivalent circuit diagram of an antenna-mounted communication IC unit. アンテナ搭載形の通信用ＩＣユニットの変形例を示す斜視図である。It is a perspective view which shows the modification of an IC mounting unit for antenna mounting. アンテナ搭載形の通信用ＩＣユニットのうちＩＣチップとアンテナ部の主エレメント及び副エレメントである導体の構造を示す斜視図である。It is a perspective view which shows the structure of the conductor which is an IC chip and the main element of an antenna part, and a subelement among communication IC units of an antenna mounting type.
　本発明のアンテナ搭載形の通信用ＩＣユニット１（以下、単に「ＩＣユニット」と表記する場合がある）の実施の形態について図面を用いて説明する。
　図１から図３に示すように、アンテナ搭載形の通信用ＩＣユニット１はＩＣチップ１０とアンテナ部２０とを少なくとも含む。
　ＩＣチップ１０を最上層の基板３１の上面に配置している。ＩＣチップ１０はリーダ・ライタから送信される搬送波の一部を整流し、動作するために必要な電源電圧を生成する。そして、生成した電源電圧によってＩＣチップ１０内の制御用の論理回路等が格納されたメモリ、及びリーダ・ライタとのデータの送受信を行うための通信回路等を動作させる。
　ＩＣチップ１０の側面から２本のライン１１を引き出している。なお、最上層の基板３１の表面及びＩＣチップ１０を保護層で覆うことにしてもよい。 An embodiment of an antenna-mounted communication IC unit 1 according to the present invention (hereinafter sometimes simply referred to as “IC unit”) will be described with reference to the drawings.
As shown in FIGS. 1 to 3, the antenna-mounted communication IC unit 1 includes at least an IC chip 10 and an antenna unit 20.
The IC chip 10 is disposed on the upper surface of the uppermost substrate 31. The IC chip 10 rectifies a part of the carrier wave transmitted from the reader / writer and generates a power supply voltage necessary for operation. Then, a memory in which a control logic circuit or the like in the IC chip 10 is stored and a communication circuit or the like for transmitting / receiving data to / from the reader / writer are operated by the generated power supply voltage.
Two lines 11 are drawn from the side surface of the IC chip 10. The surface of the uppermost substrate 31 and the IC chip 10 may be covered with a protective layer.
　アンテナ部２０は主エレメント３０と副エレメント４０を含む。
　主エレメント３０は基板３１を複数積層して構成される。基板３１の積層枚数は適宜調節可能である。例えば、基板３１は２枚以上を使用することができ、３枚あるいは４枚以上を使用することもできる。本実施の形態では３枚使用している。各基板３１の裏面（下面）にコイル３２を形成している。
　本実施の形態における基板３１は、上述した最上層の基板３１に、中間層の基板３１、最下層の基板３１を積層して構成される。基板３１を積層するには、接着剤を用いる方法、基板３１に含まれる樹脂の融着など公知の方法によって行うことができる。
　中間層の基板３１と最上層の基板３１との間には、最上層の第１のコイル３２が形成され、中間層の基板３１と最下層の基板３１との間には、中間層の第２のコイル３２が形成される。
　基板３１としては一般的に使用される例えばエポキシ樹脂、ポリイミド樹脂を含む任意の絶縁性のプラスチック樹脂の他、セラミックス、マイカ、ガラスなどの絶縁板、絶縁フィルム、絶縁シート、絶縁膜等を使用することができる。絶縁性、小型化、耐高温性の観点ではセラミックスが適している。
　なお、基板３１の寸法及び形状は特に限定されない。例えば、基板３１の形状は正方形、長方形などの矩形状、円形、楕円形などとすることができる。基板３１の一辺（または最大外形）の寸法は０．５ｍｍ以上とすることができ、１ｍｍ以上が好ましい。また、基板３１の一辺（または最大外形）の寸法は８ｍｍ以下とすることができ、６ｍｍ以下が好ましく、５ｍｍ以下がより好ましく、３ｍｍ以下が最も好ましい。本実施の形態では平面外形寸法が５ｍｍ×５ｍｍ以下とする。また、各基板３１の間に必要に応じて絶縁膜を配置してもよい。 The antenna unit 20 includes a main element 30 and a sub element 40.
The main element 30 is configured by laminating a plurality of substrates 31. The number of stacked substrates 31 can be adjusted as appropriate. For example, two or more substrates 31 can be used, and three or four or more substrates can be used. In the present embodiment, three sheets are used. A coil 32 is formed on the back surface (lower surface) of each substrate 31.
The substrate 31 in the present embodiment is configured by laminating the intermediate layer substrate 31 and the lowermost layer substrate 31 on the uppermost layer substrate 31 described above. The substrate 31 can be laminated by a known method such as a method using an adhesive or a fusion of a resin contained in the substrate 31.
The uppermost first coil 32 is formed between the intermediate substrate 31 and the uppermost substrate 31, and the intermediate layer first coil 32 is formed between the intermediate substrate 31 and the lowermost substrate 31. Two coils 32 are formed.
As the substrate 31, an insulating plate such as ceramics, mica and glass, an insulating film, an insulating sheet, an insulating film, etc. are used in addition to any generally used insulating plastic resin including epoxy resin and polyimide resin. be able to. Ceramics are suitable from the viewpoints of insulation, miniaturization, and high temperature resistance.
In addition, the dimension and shape of the board | substrate 31 are not specifically limited. For example, the shape of the substrate 31 can be a rectangular shape such as a square or a rectangle, a circle, an ellipse, or the like. The dimension of one side (or the maximum outer shape) of the substrate 31 can be 0.5 mm or more, and preferably 1 mm or more. The dimension of one side (or the maximum outer shape) of the substrate 31 can be 8 mm or less, preferably 6 mm or less, more preferably 5 mm or less, and most preferably 3 mm or less. In this embodiment, the planar outer dimensions are 5 mm × 5 mm or less. Further, an insulating film may be disposed between the substrates 31 as necessary.
　コイル３２は平面内で渦巻状のいわゆる平面コイルである。
　最上層のコイル３２は、その外周端が最上層の基板３１の接続点３３（貫通穴）の一方を介してＩＣチップ１０の一方のライン１１に接続される。当該外周端から渦巻状に反時計回りとなり、内周端が中間層の基板３１の接続点を介して中間層のコイル３２の内周端に接続される。
　中間層のコイル３２は、その内周端から渦巻状に反時計回りとなり、外周端が中間層及び最上層の基板３１の接続点３３の他方を介して他方のライン１１に接続される。 The coil 32 is a so-called planar coil that is spiral in a plane.
The outermost end of the uppermost coil 32 is connected to one line 11 of the IC chip 10 through one of the connection points 33 (through holes) of the uppermost substrate 31. From the outer peripheral end, it turns counterclockwise in a spiral shape, and the inner peripheral end is connected to the inner peripheral end of the intermediate layer coil 32 via a connection point of the intermediate layer substrate 31.
The coil 32 of the intermediate layer is spirally counterclockwise from the inner peripheral end thereof, and the outer peripheral end is connected to the other line 11 via the other of the connection points 33 of the intermediate layer and the uppermost substrate 31.
　各コイル３２は共通の電流による磁束の発生方向が同一方向となるように直列接続されている。なお、各コイル３２の数、形成面積、ターン数は、ＩＣユニット１の所要インダクタンスに応じて任意に設定することができる。例えば、最上層および中間層のコイル３２の巻き数は２以上とするのがよく、３あるいは４以上とすることができる。
　また、各コイル３２の巻き方向及び接続形態は、各コイル３２からの磁界の発生方向が同一方向である限り、図示以外の任意の形態であってもよい。また、本実施の形態ではコイル３２を基板３１の裏面（下面）に形成するものとしたが、基板３１の表面（上面）に形成してもよい。
　コイル３２は金属を含む任意の導電性材料から成り、基板３１に対してメッキ、印刷、エッチング、蒸着等の手法によって形成することができる。 The coils 32 are connected in series so that the magnetic flux generated by a common current is generated in the same direction. Note that the number, formation area, and number of turns of each coil 32 can be arbitrarily set according to the required inductance of the IC unit 1. For example, the number of turns of the coil 32 of the uppermost layer and the intermediate layer is preferably 2 or more, and can be 3 or 4 or more.
The winding direction and connection form of each coil 32 may be any form other than that shown in the drawing as long as the magnetic field generation direction from each coil 32 is the same direction. In the present embodiment, the coil 32 is formed on the back surface (lower surface) of the substrate 31, but may be formed on the front surface (upper surface) of the substrate 31.
The coil 32 is made of any conductive material including metal, and can be formed on the substrate 31 by a technique such as plating, printing, etching, or vapor deposition.
　副エレメント４０は導体５０に設置されるものであり、１ターン未満のコイル４１で構成される。
　１ターン未満のコイル４１はその一方の端部と他方の端部との間を形成する開放部４２を有している。すなわち、開放部４２を形成することにより、１ターン未満のコイル４１を形成している。この開放部４２の間隔は、後述する等価容量を所望の値にできるように設定される。
　本実施の形態では、１ターン未満のコイル４１は、薄板状のコイル本体と、コイル本体のほぼ中心部に形成された円形の孔部と、その孔部に連通する矩形状の開放部４２と、を有する。
　図２に示すように、例えば導体５０が金属板の場合、金属板の一部に切り欠き部５１を設けておき、当該切り欠き部５１と１ターン未満のコイル４１の開放部４２とを上下に重ね合わせることで導体５０と副エレメント４０とを電気的に接触接続させる。この場合、導体５０にも、Ｉターン未満のコイル４１と同様に、孔部とその孔部に連通する切り欠き部５１とが形成される。
　また、導体５０がプリント基板の場合、当該プリント基板の配線と電気的に接続される位置に１ターン未満のコイル４１を貼り付ければよい。
　１ターン未満のコイル４１は金属を含む任意の導電性材料から成る。１ターン未満のコイル４１の形成方法は導体５０の種類に応じて種々選択可能であり、例えば導体５０が金属板またはプリント基板の場合、これらに対してメッキ、印刷、エッチング、蒸着等を施すことで形成すればよい。あるいは、金属の薄板を切り抜いて１ターン未満のコイル４１を形成してもよい。 The sub element 40 is installed on the conductor 50 and is constituted by a coil 41 having less than one turn.
The coil 41 having less than one turn has an open portion 42 that forms between one end and the other end. That is, by forming the open portion 42, the coil 41 having less than one turn is formed. The interval between the open portions 42 is set so that an equivalent capacity described later can be set to a desired value.
In the present embodiment, the coil 41 of less than one turn includes a thin plate-shaped coil main body, a circular hole formed at substantially the center of the coil main body, and a rectangular opening 42 communicating with the hole. Have.
As shown in FIG. 2, for example, when the conductor 50 is a metal plate, a notch 51 is provided in a part of the metal plate, and the notch 51 and the open portion 42 of the coil 41 of less than one turn are vertically moved. The conductor 50 and the sub element 40 are brought into electrical contact connection by being superimposed on each other. In this case, a hole and a notch 51 communicating with the hole are also formed in the conductor 50 as in the case of the coil 41 having an I turn of less.
Further, when the conductor 50 is a printed board, the coil 41 having less than one turn may be attached to a position that is electrically connected to the wiring of the printed board.
The coil 41 having less than one turn is made of any conductive material including metal. The formation method of the coil 41 of less than one turn can be variously selected according to the type of the conductor 50. For example, when the conductor 50 is a metal plate or a printed board, plating, printing, etching, vapor deposition, etc. are performed on these. May be formed. Alternatively, a coil 41 having less than one turn may be formed by cutting out a thin metal plate.
　ＩＣユニット１を使用する際には、図３に示すように主エレメント３０と副エレメント４０の磁束の発生方向が一致するように両エレメントを電磁結合させる。
　副エレメント４０を構成するコイル４１が１ターン未満で構成されるので、１ターン未満のコイル４１に対向する導体５０の部分に同じく１ターン未満の切り欠き部５１を設ける。つまり、１ターン未満のコイル４１に形成された開放部４２と切り欠き部５１とが合致するように、開放部４２と同形状および同寸法の切り欠き部５１を導体５０の端縁部分に設ける。なお、導体５０の切り欠き部５１の切り欠き幅は、副エレメント４０の開放部４２の幅と等しくするか、または開放部４２の幅よりも大きくするのがよい。
　具体的に、切り欠き部５１は、矩形状の切り欠きからなり、開放部４２の幅よりも大きい幅であってもよい。
　そして、開放部４２と切り欠き部５１とが一致するように向きを合わせて接触させた状態で副エレメント４０を導体５０に固定すればよい。その固定方法には、例えば、導電性接着剤を用いる方法、半田付けによる固定など公知の固定方法を採用することができる。
　このように主エレメント３０と副エレメント４０とを両者の磁束の発生方向が一致するように接続することで導体５０全体をアンテナとして利用することができる。
　導体５０としては、限定されないが、例えば、小形の携帯用通信端末や、非接触形のＩＣカード等の携帯用物品に使用される導体がある。 When the IC unit 1 is used, both elements are electromagnetically coupled so that the magnetic flux generation directions of the main element 30 and the sub-element 40 coincide as shown in FIG.
Since the coil 41 constituting the sub-element 40 is configured with less than one turn, the cutout portion 51 with less than one turn is provided in the portion of the conductor 50 that faces the coil 41 with less than one turn. That is, the notch 51 having the same shape and the same size as the opening 42 is provided at the edge portion of the conductor 50 so that the opening 42 formed in the coil 41 having less than one turn and the notch 51 are matched. . The notch width of the notch 51 of the conductor 50 is preferably equal to the width of the open part 42 of the sub element 40 or larger than the width of the open part 42.
Specifically, the cutout portion 51 includes a rectangular cutout, and may have a width larger than the width of the opening portion 42.
And what is necessary is just to fix the subelement 40 to the conductor 50 in the state which match | combined direction and contacted so that the open part 42 and the notch part 51 might correspond. As the fixing method, for example, a known fixing method such as a method using a conductive adhesive or fixing by soldering can be employed.
Thus, the conductor 50 whole can be utilized as an antenna by connecting the main element 30 and the subelement 40 so that both magnetic flux generation directions may coincide.
Examples of the conductor 50 include, but are not limited to, conductors used for portable articles such as small portable communication terminals and non-contact type IC cards.
　図４は本実施の形態のＩＣユニット１の等価回路図である。
　主エレメント３０と副エレメント４０とは、ＩＣチップ１０内の等価容量１００及び１ターン未満のコイル４１の開放部４２の間隙を含む等価容量１０１とで共振回路を構成している。
　なお、必要に応じてコンデンサをＩＣチップ１０外部に別途設けることにしてもよい。
　ここで、インダクタンスはコイルの巻数に比例する。主エレメント３０を構成するコイル３２の総巻数をｎ（但し、ｎ≫１）とした条件下では、主エレメント３０と副エレメント４０とを電磁的に接合させる前と後とでインダクタンスの変化はごく僅かである。
　つまり、主エレメントｎターンから見た副エレメント１ターン未満は、１ターン未満／ｎターンとなるため導体５０に取り付けた場合のインピーダンスの変化を少なくすることができ、また、１ターン未満からｎターン側を見れば導体５０から変換電磁界はｎ倍されるため効率よく電磁波を取り込むことができる。
　したがって、ＩＣチップ１０と主エレメント３０との間で共役整合を取っておけば、主エレメント３０と副エレメント４０とを電磁的に接合した後でも充分な通信性能を維持できる。
　なお、本実施の形態ではコイル３２と１ターン未満のコイル４１とを一体化して金属に設置したが、これに限らず図５に示すように、コイル３２および１ターン未満のコイル４１の両者又はいずれか一方を位置合わせ部材６０に取り付けてもよい。
　位置合わせ部材６０を最下層の基板３１に取り付ける場合、板状（または帯状）の位置合わせ部材６０を最下層の基板３１の両端部に脚状に取り付け、この位置合わせ部材の下端部が１ターン未満のコイル４１の外縁に合致するように、最下層の基板３１を導体５０に固定してもよい。また、板状の位置合わせ部材６０を１ターン未満のコイル４１の上面に固定しておき、最下層の基板３１の外縁が位置合わせ部材６０の周囲に合致するように、最下層の基板３１を導体５０に固定してもよい。
　これらの位置合わせ部材６０は、電気絶縁性材料から構成される。 FIG. 4 is an equivalent circuit diagram of the IC unit 1 of the present embodiment.
The main element 30 and the sub element 40 constitute a resonance circuit with the equivalent capacitor 100 in the IC chip 10 and the equivalent capacitor 101 including the gap of the open portion 42 of the coil 41 of less than one turn.
Note that a capacitor may be separately provided outside the IC chip 10 as necessary.
Here, the inductance is proportional to the number of turns of the coil. Under the condition that the total number of turns of the coil 32 constituting the main element 30 is n (where n >> 1), the change in inductance is very much before and after the main element 30 and the sub-element 40 are electromagnetically joined. There are few.
That is, less than one turn of the sub-element as viewed from the n turn of the main element is less than 1 turn / n turn, so that the change in impedance when attached to the conductor 50 can be reduced, and from less than 1 turn to n turns When viewed from the side, the converted electromagnetic field is multiplied by n from the conductor 50, so that electromagnetic waves can be taken in efficiently.
Therefore, if conjugate matching is maintained between the IC chip 10 and the main element 30, sufficient communication performance can be maintained even after the main element 30 and the sub element 40 are electromagnetically joined.
In the present embodiment, the coil 32 and the coil 41 of less than one turn are integrated and installed on the metal. However, the present invention is not limited to this, and as shown in FIG. 5, both the coil 32 and the coil 41 of less than one turn or Either one may be attached to the alignment member 60.
When the alignment member 60 is attached to the lowermost substrate 31, the plate-like (or belt-like) alignment member 60 is attached to both ends of the lowermost substrate 31 in a leg shape, and the lower end portion of the alignment member is one turn. The lowermost substrate 31 may be fixed to the conductor 50 so as to match the outer edge of the lower coil 41. Further, the plate-like alignment member 60 is fixed to the upper surface of the coil 41 of less than one turn, and the lowermost substrate 31 is placed so that the outer edge of the lowermost substrate 31 matches the periphery of the alignment member 60. It may be fixed to the conductor 50.
These alignment members 60 are made of an electrically insulating material.
（他の実施形態）
　図６は、アンテナ搭載形の通信用ＩＣユニットのうちＩＣチップとアンテナ部の主エレメント及び副エレメントである導体の構造を示す斜視図である。
　上記の実施形態では、開放部４２が形成された１ターン未満のコイル４１を、切り欠き部５１が形成された導体５０上に重ね固定するようにしたが、１ターン未満のコイル４１を省略して、切り欠き部５１が形成された導体５０のみを用いるようにしてもよい。
　すなわち、図６に示すように、副エレメント４０の１ターン未満のコイル４１の役割を、導体５０および導体５０の切り欠き部５１により形成してもよい。 (Other embodiments)
FIG. 6 is a perspective view showing a structure of a conductor which is an IC chip and a main element and a sub-element of the antenna portion of the antenna-mounted communication IC unit.
In the above embodiment, the coil 41 with less than one turn in which the open portion 42 is formed is overlapped and fixed on the conductor 50 in which the cutout portion 51 is formed, but the coil 41 with less than one turn is omitted. Thus, only the conductor 50 in which the notch 51 is formed may be used.
That is, as shown in FIG. 6, the role of the coil 41 of less than one turn of the sub element 40 may be formed by the conductor 50 and the cutout portion 51 of the conductor 50.
　この実施形態では、導体５０に、Ｉターン未満のコイル４１と同様に、孔部とその孔部に連通する切り欠き部５１が形成される。そして、この導体５０上にアンテナ部２０を構成する主エレメント３０が重ね合わせられる。そのことによって、主エレメント３０のコイル３２と円孔の周囲に存在する導体５０の部分によって形成されるコイルとが電磁結合する。また、導体５０に形成された切り欠き部５１によって等価容量が生成する。
　なお、上記実施形態では、副エレメント４０の開放部４２を導体５０の切り欠き部５１と同じ形状としたが、導体５０に形成した切り欠き部５１は開放部４２よりも広く形成してもよい。 In this embodiment, a hole and a notch 51 communicating with the hole are formed in the conductor 50 in the same manner as the coil 41 with less than I turn. And the main element 30 which comprises the antenna part 20 is piled up on this conductor 50. FIG. As a result, the coil 32 of the main element 30 and the coil formed by the portion of the conductor 50 existing around the circular hole are electromagnetically coupled. In addition, an equivalent capacitance is generated by the notch 51 formed in the conductor 50.
In the above embodiment, the open portion 42 of the sub element 40 has the same shape as the cutout portion 51 of the conductor 50, but the cutout portion 51 formed in the conductor 50 may be formed wider than the open portion 42. .
　本発明は、導体に取り付けた場合に、高い通信性能を発揮するアンテナ搭載形の通信用ＩＣユニット及び導体付きアンテナ搭載形の通信用ＩＣユニットであり、産業上の利用可能性を有する。導体としては、例えば、小形の携帯用通信端末または、非接触形のＩＣカード等に使用される導体がある。 The present invention is an antenna-mounted communication IC unit that exhibits high communication performance when mounted on a conductor and a conductor-mounted antenna-mounted communication IC unit, and has industrial applicability. Examples of the conductor include a conductor used for a small portable communication terminal or a non-contact type IC card.
１　アンテナ搭載形の通信用ＩＣユニット
１０　ＩＣチップ
１１　ライン
２０　アンテナ部
３０　主エレメント
３１　基板
３２　コイル
３３　接続点
４０　副エレメント
４１　１ターン未満のコイル
４２　開放部
５０　導体
５１　切り欠き部
６０　位置合わせ部材
１００　等価容量
１０１　等価容量
 
  DESCRIPTION OF SYMBOLS 1 Antenna-mounted communication IC unit 10 IC chip 11 Line 20 Antenna part 30 Main element 31 Substrate 32 Coil 33 Connection point 40 Sub element 41 Coil 42 less than one turn 42 Open part 50 Conductor 51 Notch part 60 Positioning member 100 Equivalent capacity 101 Equivalent capacity

Claims (9)

  1. 　アンテナ搭載形の通信用ＩＣユニットにおいて、
    　コイルが形成された基板を積層して成るアンテナ部と、
    　当該アンテナ部と接続されるＩＣチップと、を少なくとも含み、
    　前記アンテナ部は、
    　磁束の発生方向が一致するように複数のコイルが直列接続されて成る主エレメントと、
    　開放部を有する１ターン未満のコイルから成る副エレメントと、を含み、
    　前記主エレメントと前記副エレメントとが電磁結合される、アンテナ搭載形の通信用ＩＣユニット。     In communication IC unit with antenna,
    An antenna unit formed by stacking substrates on which coils are formed;
    Including at least an IC chip connected to the antenna unit,
    The antenna unit is
    A main element in which a plurality of coils are connected in series so that the direction of magnetic flux generation coincides;
    A sub-element consisting of a coil of less than one turn with an opening,
    An antenna-mounted communication IC unit in which the main element and the sub-element are electromagnetically coupled.
  2. 　前記主エレメントの磁束の中心と、前記副エレメントの磁束の中心とが、一致するよう形成された、請求項１記載のアンテナ搭載形の通信用ＩＣユニット。 The antenna-mounted communication IC unit according to claim 1, wherein the center of the magnetic flux of the main element and the center of the magnetic flux of the sub-element coincide with each other.
  3. 　前記主エレメントは、絶縁体からなる複数の基板と、前記複数の基板に形成された複数のコイルとを含む、請求項１または２に記載のアンテナ搭載形の通信用ＩＣユニット。 3. The antenna-mounted communication IC unit according to claim 1, wherein the main element includes a plurality of substrates made of an insulator and a plurality of coils formed on the plurality of substrates.
  4. 　前記副エレメントの開放部は、等価容量を形成する、請求項１から３のいずれか１項に記載のアンテナ搭載型の通信用ＩＣユニット。 The antenna-mounted communication IC unit according to any one of claims 1 to 3, wherein the open part of the sub-element forms an equivalent capacity.
  5. 　前記基板の平面外形寸法が５ｍｍ×５ｍｍ以下である、請求項１から４のいずれか１項に記載のアンテナ搭載形の通信用ＩＣユニット。 The antenna-mounted communication IC unit according to any one of claims 1 to 4, wherein a planar external dimension of the substrate is 5 mm x 5 mm or less.
  6. 　アンテナ搭載形の通信用ＩＣユニットにおいて、
    　アンテナ部と、
    　前記アンテナ部と接続されるＩＣチップと、を少なくとも含み、
    　前記アンテナ部は、
    　絶縁基板と、前記絶縁基板に形成された１ターン以上のコイルと、を含む主エレメントと、
    　開放部が形成された１ターン未満のコイルを含む副エレメントと、を含み、
    　前記主エレメントは、前記副エレメントと電磁結合し、
    　前記開放部によって構成されるコンデンサと前記１ターン未満のコイルとにより共振回路が形成される、アンテナ搭載形の通信用ＩＣユニット。     In communication IC unit with antenna,
    An antenna section;
    Including at least an IC chip connected to the antenna unit,
    The antenna unit is
    A main element including an insulating substrate and a coil having one or more turns formed on the insulating substrate;
    A sub-element including a coil of less than one turn formed with an opening,
    The main element is electromagnetically coupled to the sub-element;
    An antenna-mounted communication IC unit in which a resonance circuit is formed by the capacitor constituted by the open portion and the coil of less than one turn.
  7. 　導体付きアンテナ搭載形の通信用ＩＣユニットにおいて、
    　コイルが形成された基板を積層して成るアンテナ部と、
    　当該アンテナ部と接続されるＩＣチップと、
    　導体と、を少なくとも含み、
    　前記アンテナ部は、
    　磁束の発生方向が一致するように複数のコイルが直列接続されて成る主エレメントと、
    　開放部を有する１ターン未満のコイルから成る副エレメントと、を含み、
    　前記主エレメントと前記副エレメントとが電磁結合され、
    　前記導体に形成された切り欠き部に、前記副エレメントの開放部が重ねられた、導体付きアンテナ搭載形の通信用ＩＣユニット。     In a communication IC unit with a conductor-mounted antenna,
    An antenna unit formed by stacking substrates on which coils are formed;
    An IC chip connected to the antenna unit;
    And at least a conductor,
    The antenna unit is
    A main element in which a plurality of coils are connected in series so that the direction of magnetic flux generation coincides;
    A sub-element consisting of a coil of less than one turn with an opening,
    The main element and the sub element are electromagnetically coupled,
    A conductor-mounted antenna-mounted communication IC unit in which an open portion of the sub-element is overlapped with a notch portion formed in the conductor.
  8. 　前記導体の切り欠き部の切り欠き幅は、前記副エレメントの開放部の幅と等しいか、または開放部の幅よりも大きい、請求項７記載の導体付きアンテナ搭載形の通信用ＩＣユニット。 The conductor-equipped antenna-mounted communication IC unit according to claim 7, wherein the notch width of the notch portion of the conductor is equal to or larger than the width of the open portion of the sub-element.
  9. 　導体付きアンテナ搭載形の通信用ＩＣユニットにおいて、
    　コイルが形成された基板を複数積層して成るアンテナ部と、
    　当該アンテナ部と接続されるＩＣチップと、
    　導体と、を少なくとも含み、
    　前記アンテナ部は、
    　磁束の発生方向が一致するように複数のコイルが直列接続されて成る主エレメントを含み、
    　前記導体は、円孔と前記円孔に連通する開放部と、を含み、
    　前記主エレメントのコイルと前記円孔の周囲の前記導体によって形成されるコイルとが電磁結合された、導体付きアンテナ搭載形の通信用ＩＣユニット。     In a communication IC unit with a conductor-mounted antenna,
    An antenna unit formed by laminating a plurality of substrates on which coils are formed;
    An IC chip connected to the antenna unit;
    And at least a conductor,
    The antenna unit is
    Including a main element in which a plurality of coils are connected in series so that the generation directions of magnetic fluxes coincide with each other;
    The conductor includes a circular hole and an open portion communicating with the circular hole,
    A conductor-mounted antenna-mounted communication IC unit in which a coil of the main element and a coil formed by the conductor around the circular hole are electromagnetically coupled.
PCT/JP2017/038927 2016-10-29 2017-10-27 Antenna-mounted communication ic unit and antenna-mounted communication ic unit equipped with conductor WO2018079718A1 (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019004439A1 (en) * 2017-06-30 2019-01-03 株式会社村田製作所 Rfic chip-equipped product
JP2019097168A (en) * 2017-11-21 2019-06-20 台湾東電化股▲ふん▼有限公司 Wireless system and wireless device
JPWO2021100315A1 (en) * 2019-11-21 2021-12-09 株式会社フェニックスソリューション Heat resistant IC tag
US11714989B2 (en) 2020-05-15 2023-08-01 Murata Manufacturing Co., Ltd. RFIC module, RFID tag, and article
JP7463858B2 (en) 2020-06-08 2024-04-09 Ｔｏｐｐａｎホールディングス株式会社 Dual IC Card

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009142114A1 (en) * 2008-05-21 2009-11-26 株式会社村田製作所 Wireless ic device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009142114A1 (en) * 2008-05-21 2009-11-26 株式会社村田製作所 Wireless ic device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019004439A1 (en) * 2017-06-30 2019-01-03 株式会社村田製作所 Rfic chip-equipped product
JP6508441B1 (en) * 2017-06-30 2019-05-08 株式会社村田製作所 Article with RFIC chip
JP2019097168A (en) * 2017-11-21 2019-06-20 台湾東電化股▲ふん▼有限公司 Wireless system and wireless device
JP7169172B2 (en) 2017-11-21 2022-11-10 台湾東電化股▲ふん▼有限公司 Radio system and radio equipment
JPWO2021100315A1 (en) * 2019-11-21 2021-12-09 株式会社フェニックスソリューション Heat resistant IC tag
US11714989B2 (en) 2020-05-15 2023-08-01 Murata Manufacturing Co., Ltd. RFIC module, RFID tag, and article
JP7463858B2 (en) 2020-06-08 2024-04-09 Ｔｏｐｐａｎホールディングス株式会社 Dual IC Card

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