WO2019004439A1 - Rfic chip-equipped product - Google Patents

Rfic chip-equipped product Download PDF

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Publication number
WO2019004439A1
WO2019004439A1 PCT/JP2018/024848 JP2018024848W WO2019004439A1 WO 2019004439 A1 WO2019004439 A1 WO 2019004439A1 JP 2018024848 W JP2018024848 W JP 2018024848W WO 2019004439 A1 WO2019004439 A1 WO 2019004439A1
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WO
WIPO (PCT)
Prior art keywords
coil conductor
rfic
electrode
ground electrode
metal surface
Prior art date
Application number
PCT/JP2018/024848
Other languages
French (fr)
Japanese (ja)
Inventor
加藤　登
哲平 三浦
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2018562272A priority Critical patent/JP6508441B1/en
Publication of WO2019004439A1 publication Critical patent/WO2019004439A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Definitions

  • the present invention relates to an article provided with an RFIC chip in which an RFIC (Radio-Frequency Integrated Circuit) chip is provided on an article at least a part of which is made of a metal, and the metal surface of the article is used as an antenna.
  • RFIC Radio-Frequency Integrated Circuit
  • a wireless communication tag provided with an RFIC chip storing various information related to the article is attached to the article or a container (package) of the article, etc.
  • an RFID system Radio Frequency Identification System
  • Patent Documents 1 to 3 As an article management system using an RFID system using a metal surface of an article as an antenna, for example, there are configurations disclosed in Patent Documents 1 to 3.
  • a feeding circuit substrate provided with a wireless IC chip and incorporating a resonant circuit is electromagnetically coupled to a metal object, and the metal surface of the metal object is an antenna (radiation plate) It functions as
  • the printed circuit board with the wireless IC chip of Patent Document 3 has a configuration in which the resonant circuit of the feeding circuit board on which the wireless IC chip is mounted and the loop electrode are electrically connected by electromagnetic field coupling, power (energy Also in terms of the transmission efficiency of), it was not sufficient.
  • FIG. 17 is a perspective view schematically showing a configuration of a coil conductor and the like on a feed circuit substrate of the RFIC module in the fourth embodiment.
  • a perspective view showing an enlarged part of a printed circuit board with an RFIC chip of a modification of the fourth embodiment The figure which shows the state in which the RFIC module was mounted in the grand electrode in the modification of Embodiment 4.
  • FIG. 17 is a perspective view schematically showing a configuration of a coil conductor and the like on a feed circuit board of the RFIC module according to a seventh embodiment of the present invention
  • An article with an RFIC chip according to the first aspect of the present invention is An article having a metal surface; A coil conductor having a loop surface facing the metal surface; An RFIC chip having first and second input / output terminals respectively connected to one end and the other end of the coil conductor; and one point in the middle of the coil conductor and one point near the edge of the metal surface are DC
  • a magnetic flux passing portion through which the magnetic flux from the coil conductor passes is disposed in a region overlapping with the loop surface of the coil conductor in plan view.
  • the RFIC chip attached article according to the second aspect of the present invention is characterized in that one point in the middle of the coil conductor electrically connected directly to the metal surface in the first aspect is approximately the electrical length of the coil conductor. The position of the middle point may be used.
  • the RFIC chip attached article according to the third aspect of the present invention is characterized in that one point of the metal surface electrically connected directly to the coil conductor of the first or second aspect is the surface of the coil conductor in plan view. It may be located directly below.
  • the article with an RFIC chip according to the seventh aspect of the present invention may be made of a material through which magnetic flux passes, in the magnetic flux passing portion according to any one of the first to fifth aspects.
  • the RFIC chip attached article according to an eighth aspect of the present invention is the article according to any one of the first to seventh aspects, wherein the coil conductor includes a plurality of points including the middle point of the coil conductor.
  • the plurality of points near the edge of the metal surface, including one point near the edge of the metal surface, may be DC connected.
  • the coil conductor and the RFIC chip may be modularized as an RFIC module,
  • the RFIC module may include an electrode interposed between the coil conductor and the metal surface, and connecting the coil conductor and the metal surface in a direct current manner.
  • the article with an RFIC chip according to a tenth aspect of the present invention is configured such that the metal surface is an antenna and the UHF band is a communication frequency in any one of the first to ninth aspects. It is also good.
  • FIG. 1 is an enlarged perspective view showing a part (ground electrode portion) of a printed wiring board 100 which is an article with an RFIC chip according to a first embodiment of the present invention.
  • FIG. 2 is an equivalent circuit diagram of the RFIC module 10 in the printed wiring board 100 with an RFIC chip of the first embodiment.
  • FIG. 1 shows that the RFIC module 10 including the RFIC chip 1 is mounted on the ground electrode 3.
  • the ground electrode 3 is a metal and serves as an antenna.
  • the RFIC module 10 is an RFID device for performing wireless communication (transmission and reception) with the UHF band as a communication frequency (carrier frequency), and a feeding circuit board 2 having an RFIC chip 1 for processing RFID signals and a coil conductor 4 (see FIG. 2). And.
  • the feeder circuit board 2 is configured by laminating a plurality of sheets formed of dielectrics, and a conductor pattern is formed on each sheet.
  • the conductor patterns formed on the respective sheets are connected by via hole conductors penetrating the respective sheets, whereby a coil conductor 4 to be an inductor element is formed inside the feeder circuit board 2.
  • One end and the other end of the coil conductor 4 are connected to the first input / output terminal 1a and the second input / output terminal 1b provided in the RFIC chip 1, respectively.
  • the RFIC module 10 is provided at the edge of the metal surface (surface) 3 a of the ground electrode 3.
  • a slit 3 b and an opening 3 c connected to the slit 3 b are formed at the edge of the ground electrode 3 provided with the RFIC module 10.
  • the RFIC module 10 is disposed to cover the slit 3 b and the opening 3 c of the ground electrode 3.
  • a direct current connection is made to the ground electrode 3 at one point in the middle of the coil conductor 4 of the feed circuit board 2.
  • One point (connection point) of the coil conductor 4 connected to the ground electrode 3 in a direct current manner is a middle point of the coil conductor 4 (a point between these except for one end and the other end).
  • the middle one point of the coil conductor 4 is closer to the middle point of the electrical length of the coil conductor 4 which is the current maximum point in the coil conductor 4 than the one end and the other end of the coil conductor.
  • the middle point of the coil conductor 4 is preferably the middle point of the electrical length of the coil conductor 4 which is the maximum current point in the coil conductor 4.
  • the direct-current connection state refers to a connection state in which direct current can actually flow without connection via electrostatic capacitance or connection by electromagnetic field coupling.
  • electrically connected state includes not only direct current connection but also connection via electrostatic capacitance, and connection by electromagnetic field coupling.
  • the ground electrode 3 is connected to the coil conductor 4 in a direct current manner (DC connection)
  • one point near the edge of the ground electrode 3 is preferable. This is because the high frequency current has the property of flowing along the surface near the edge of the ground electrode 3. That is, in the vicinity of the edge of the ground electrode 3, in the ground electrode 3 functioning as an antenna by the RFIC module 10, a region in which a high frequency current substantially flows is provided.
  • FIG. 3A is an exploded perspective view showing the configuration of the RFIC module 10 in the first embodiment
  • FIG. 3B is a perspective view schematically showing the configuration of the coil conductor 4 and the like in the feed circuit board 2.
  • the RFIC chip 1 mounted on the feeder circuit substrate 2 has a structure in which various elements are incorporated in a semiconductor substrate made of a semiconductor such as silicon.
  • the RFIC chip 1 includes a clock circuit, a logic circuit, a memory circuit, etc., and necessary information is recorded, and a first input / output terminal provided on the back surface (the surface facing the feeding circuit board 2 in FIG. 3A) Signals indicating various information are input and output by 1a and the second input / output terminal 1b.
  • the feeder circuit board 2 on which the RFIC chip 1 is mounted is formed by laminating, pressing, and firing a plurality of sheets formed of dielectric materials.
  • a predetermined electrode pattern and a via hole conductor are formed on each sheet constituting the feeder circuit board 2, and the feeder circuit board 2 includes the front electrodes 8a and 8b, the coil conductor 4 serving as an inductor element, and the back electrodes 9a and 9b. , 9c, 9d.
  • a pair of front surface electrodes 8a and 8b are provided on the upper surface (a surface facing the RFIC chip 1) of the feeding circuit substrate 2, and the pair of first input / output of the RFIC chip 1 described above.
  • the terminal 1a and the second input / output terminal 1b are connected in a direct current manner (DC connection).
  • the coil conductor 4 is formed in the inside of the feeder circuit board 2 of multilayer structure.
  • the coil conductor 4 is an inductor element constituted by the first loop electrode 4a, the second loop electrode 4b and the third loop electrode 4c formed in each layer, and the via hole conductors 6a, 6b, 6c, 6d connected to these. .
  • One end (end of the via hole conductor 6a) of the coil conductor 4 is connected to one surface electrode 8a, and the other end (end of the via hole conductor 6d) is connected to the other surface electrode 8b.
  • Each of the loop electrodes 4a, 4b and 4c constituting the coil conductor 4 has a substantially square frame shape in a plan view, and has a substantially square loop surface.
  • the term "loop surface” as used herein refers to a plane that includes the loop electrode itself and an opening (loop opening) substantially surrounded by the loop electrode.
  • a planar view means the case where it sees from the upper direction in the direction orthogonal to the layer surface in the feeder circuit board 2 of the multilayer structure shown to FIG. 3B. Therefore, the loop shape of each of the loop electrodes 4a, 4b, and 4c is a substantially square frame shape in plan view, and the loop surfaces of the loop electrodes overlap in plan view.
  • surface electrodes 8a and 8b, loop electrodes 4a, 4b and 4c, and via hole conductors 6a, 6b, 6c and 6d are connected to first via hole conductor 6a from first surface electrode 8a.
  • the first loop electrode 4a, the second via hole conductor 6b, the second loop electrode 4b, the third via hole conductor 6c, the third loop electrode 4c, the fourth via hole conductor 6d, and the second surface electrode 8b are connected in this order.
  • the coil conductor 4 serving as an inductor element configured as described above is connected to the pair of surface electrodes 8a and 8b.
  • back surface electrodes 9a, 9b, 9c, and 9d are provided on the lower surface (back surface) of the feed circuit substrate 2.
  • the back surface electrodes 9a, 9b, 9c and 9d are formed independently at four corners of the feeder circuit board 2 which is a square in plan view.
  • the back surface electrodes 9a, 9b, 9c, 9d are disposed in regions immediately below the four corners of the coil conductor 4 having a square frame shape in a plan view, and the shape has an L-shape bent substantially at a right angle ing.
  • Each of back surface electrodes 9a, 9b, 9c, and 9d in the first embodiment is arranged symmetrically with respect to the center point of the back surface of feed circuit board 2. For this reason, when the RFIC module 10 is mounted on the ground electrode 3 of the printed wiring board, it is possible to ease the positional restriction on the direction (direction) of the RFIC module 10 with respect to the ground electrode 3.
  • back surface electrodes (9a, 9b, 9c, 9d) are provided. However, only one back surface electrode (9a) is connected to coil conductor 4 in a direct current manner. Because of this, the remaining three back electrodes (9b, 9c, 9d) are dummy electrodes. Therefore, in the configuration of the first embodiment, at least one back electrode (9a) may be provided.
  • the first back surface electrode 9 a is electrically connected to the position of the substantially middle point of the electrical length in the coil conductor 4 in a direct current manner.
  • FIGS. 4A to 4C are diagrams showing the positional relationship between the ground electrode 3 of the printed wiring board 100 on which the RFIC module 10 is mounted and the RFIC module 10.
  • FIG. 4A shows the slit 3 b and the opening 3 c in the ground electrode 3 on which the RFIC module 10 is mounted.
  • FIG. 4B shows the positional relationship between the coil conductor 4 and the back surface electrodes 9a to 9d in the RFIC module 10.
  • FIG. 4C shows a state in which the RFIC module 10 is mounted on the ground electrode 3.
  • the coil conductor 4 and the back surface electrodes 9a to 9d of the feeding circuit substrate 2 in the RFIC module 10 are shown, and the illustration of the RFIC chip 1 is omitted.
  • the slit part 3b and the opening part 3c are formed in the position where the RFIC module 10 of the metal surface 3a in the ground electrode 3 which is a metal surface of articles
  • the slit portion 3 b is a gap extending inward from the edge of the ground electrode 3, and an opening 3 c is formed at a tip portion inside the gap.
  • the opening 3 c has a shape disposed inside the coil conductor 4 of the feed circuit board 2, and is formed at a position through which a magnetic field (magnetic flux) generated by the excited coil conductor 4 passes. That is, the slit portion 3 b and the opening 3 c in the ground electrode 3 are magnetic flux passing portions which are non-metal portions.
  • a resist pattern 7 is formed on the metal surface 3a of the ground electrode 3, and the resist openings 7a, 7b, 7c are removed only at positions facing the back surface electrodes 9a to 9d of the feed circuit substrate 2. 7d is formed. That is, the back surface electrodes 9a to 9d of the feeder circuit board 2 are connected to the ground electrode 3 in a direct current manner reliably through the resist openings 7a, 7b, 7c, 7d.
  • the RFIC module 10 is disposed such that the edge portion thereof is in contact with the edge of the ground electrode 3, and the slit portion 3 b and the opening 3 c of the ground electrode 3 are feed circuit boards of the RFIC module 10. It is almost covered by 2. That is, a magnetic flux passing portion (3b, 3c) through which a magnetic field (magnetic flux) generated by the excited coil conductor 4 passes is disposed in a region overlapping the loop surface of the coil conductor 4 of the feed circuit board 2 in plan view.
  • the resist openings 7a, 7b, 7c, 7d formed in the metal surface 3a of the ground electrode 3 are surely provided to the back surface electrodes 9a to 9d disposed immediately below the coil conductor 4 of the feed circuit board 2 in plan view. It is in the state of being positioned. Therefore, the magnetic field (magnetic flux) generated by the coil conductor 4 passes through the opening 3 c which is a magnetic flux passing portion disposed inside the coil conductor 4. In the metal surface 3a of the ground electrode 3, since the edge of the opening 3c is divided by the slit 3b, the generation of the loop current around the opening 3c is suppressed.
  • the magnetic flux passing portion of the slit portion 3b and the opening 3c formed in the ground electrode 3 is described as the opening portion, but as described above, the magnetic flux passing portion has a configuration in which the magnetic field (magnetic flux) passes through.
  • the magnetic flux passing portion (slit portion 3b and the opening 3c) may be made of a material (for example, a resin material) through which a magnetic field (magnetic flux) passes.
  • the first back surface electrode 9 a of the feeder circuit substrate 2 of the RFIC module 10 is connected through the connection line 5 at one point of the second loop electrode 4 b located in the middle of the coil conductor 4.
  • the first back surface electrode 9a is connected to the metal surface 3a of the ground electrode 3 exposed through one resist opening (first resist opening 7a) in a direct current manner via a conductive paste.
  • the middle point of the coil conductor 4 in the feeder circuit board 2 of the RFIC module 10 is located directly below the coil conductor 4 in the ground electrode 3 via the first back electrode 9a.
  • the position directly below the coil conductor in the ground electrode 3 means immediately below the loop electrode of the coil conductor and immediately below the loop opening. That is, the middle point of the coil conductor 4 in the feed circuit board 2 is connected in a direct current manner in a region near the edge of the ground electrode 3.
  • the area in the vicinity of the edge of the ground electrode 3 means the module mounting surface area in which the RFIC module is disposed in the ground electrode 3 or the ground in the state where the RFIC module 10 is mounted on the edge portion of the ground electrode 3 This refers to the area from the edge of the electrode 3 to the module mounting surface area.
  • the RFIC module 10 can receive signals by the high frequency current flowing through the edge thereof.
  • the coil conductor 4 of the feeder circuit board 2 in the first embodiment includes one coil-shaped portion, and the central axis of the coil is disposed in the vertical direction (vertical direction in FIG. 3B).
  • the coil conductor according to the embodiment of the present invention is not limited to such a configuration.
  • FIG. 5 is a schematic diagram which shows the modification of the coil conductor (40) in a feed circuit board (20).
  • the coil conductor 40 of the feed circuit board 20 is composed of two coiled parts 4A and 4B.
  • the two coiled parts 4A, 4B are juxtaposed and electrically connected in series.
  • the coil central axes of the two coiled parts 4A and 4B are parallel to each other and extend in the longitudinal direction.
  • the series connection position where the two coil-shaped portions 4A and 4B are connected in series with each other is DC-connected to the back surface electrode 9a via the connection wire 5, that is, the coil The middle point of the conductor 40 and the back electrode 9a are connected.
  • the other coiled part is formed in one coiled part so that the respective coil central axes overlap. It may be arranged. That is, in the configuration of the present invention, as the configuration of the coil conductor (4, 40) in the feed circuit substrate (2, 20), the coil conductor (4, 40) in the feed circuit substrate (2, 20) of the laminated structure It is sufficient if it has a configuration in which the substantially midpoint of the electrical length and the back surface electrode (9a) can be connected in a direct current manner via the connection line (5).
  • the approximate midpoint of the coil conductor (more preferably, the midpoint of the electrical length) of the coil conductor of the feeding circuit board 2 of the RFIC module 10 is used as an antenna.
  • Direct current connection (DC connection) is made at a specific position (one point) of the ground electrode 3 to be the radiation plate).
  • the printed wiring board 100 according to the first embodiment is configured to have a high degree of freedom of attachment and a high power transfer efficiency, and can be configured to be further reduced in size, weight and cost.
  • the printed wiring board which is an article with an RFIC chip of Embodiment 2 concerning the present invention is explained.
  • the printed wiring board of the second embodiment will be described focusing on differences from the printed wiring board 100 of the first embodiment.
  • elements having the same configurations, operations and functions as the first embodiment described above are denoted by the same reference numerals, and the description may be omitted to avoid redundant description.
  • the difference between the printed wiring board with the RFIC chip of the second embodiment and the printed wiring board 100 of the first embodiment is that the RFIC module (10A) including the RFIC chip 1 with respect to the ground electrode (3A) of the printed wiring board. It is a setting position.
  • the RFIC module (10A) in the second embodiment has substantially the same configuration as the RFIC module 10 in the first embodiment, the back electrode (19A) formed on the back surface of the feeder circuit board (12) is It is different in that it is one and its shape is quadrangular (substantially square).
  • the printed wiring board of the second embodiment is a radio frequency signal having a communication frequency (carrier frequency) in the UHF band by the RFIC module (10A) using the ground electrode (3A) as an antenna. It is configured to communicate, and configured to be capable of wireless communication in a wide frequency band.
  • FIG. 6 is a perspective view showing a mounting position of an RFIC module 10A mounted on the ground electrode 3A by enlarging a part of the printed wiring board with the RFIC chip of the second embodiment.
  • the article is a printed wiring board, and the metal in the article is the ground electrode 3A.
  • the RFIC module 10A is mounted on the edge of the metal surface 3Aa of the flat ground electrode 3A.
  • FIG. 7 is a plan view showing a state in which the RFIC module 10A is mounted on the edge of the metal surface 3Aa of the ground electrode 3A.
  • the coil conductor 4 and the back surface electrode 19A of the feeder circuit substrate 12 in the RFIC module 10A are shown, and the illustration of the RFIC chip 1 is omitted.
  • the coil conductor 4 of the feed circuit board 12 is disposed so as to protrude from the edge of the ground electrode 3A. In other words, a part of the coil conductor 4 of the feed circuit board 12 is disposed on the ground electrode 3A, and the remaining part of the coil conductor 4 is disposed at a position deviated from the ground electrode 3A.
  • the magnetic field (magnetic flux) generated by the excited coil conductor 4 passes through the region out of the metal surface 3Aa of the ground electrode 3A. That is, the loop surface of the coil conductor 4 is disposed so as to overlap the edge of the metal surface 3Aa in plan view, and a part of the loop surface of the coil conductor 4 overlaps the magnetic flux passing portion in plan view.
  • the remaining portion of the coil conductor 4 disposed at a position deviated from the ground electrode 3A may be configured to protrude from the ground electrode 3A, but a material (for example, a resin material) through which a magnetic field (magnetic flux) passes.
  • the remaining portion of the coil conductor 4 may be supported by a member made of a material through which a magnetic field (magnetic flux) passes, provided so as to be flush with 3A.
  • the back surface electrode formed on the back surface of feed circuit board 12 may be provided at the four corners of the back surface of feed circuit board 12 as in the configuration of the first embodiment described above.
  • the portion through which the magnetic field (magnetic flux) of the excited coil conductor 4 passes is the magnetic flux passing portion which is a nonmetal portion.
  • the approximate midpoint of the coil conductor 4 of the feed circuit board 12 (more preferably, the midpoint of the electrical length) is DC near the edge of the ground electrode 3A. Connected. For this reason, the high frequency current from the excited coil conductor 4 flows along the edge of the ground electrode 3A, and the ground electrode 3A functions as a transmission antenna. On the contrary, in the ground electrode 3A functioning as a receiving antenna, the RFIC module 10A can receive signals by the high frequency current flowing through the edge of the metal surface 3Aa.
  • connection line 5 In the configuration of coil conductor 4 of feed circuit substrate 12 in the second embodiment, two coil-shaped portions juxtaposed as shown in FIG. 5 described above are connected in series, and the serial connection point and back surface electrode 9A May be connected in a direct current manner by the connection line 5.
  • the approximate midpoint (more preferably, the midpoint of the electrical length) of the coil conductor 4 of the feeding circuit board 2 of the RFIC module 10A is used as an antenna It is a structure connected in a direct-current manner (DC connection) at one place near the edge of the ground electrode 3A to be a radiation plate).
  • the printed wiring board of the second embodiment has a configuration with high degree of freedom of attachment and power transfer efficiency, and can achieve further downsizing, weight reduction and cost reduction.
  • the printed wiring board with RFIC chip of the third embodiment differs from the printed wiring board of the first embodiment in the shape of the ground electrode (3B) of the printed wiring board and the RFIC chip 1 corresponding to the ground electrode (3B). It is an arrangement position of the RFIC module (10A) provided.
  • the RFIC module (10A) in the third embodiment has substantially the same configuration as the RFIC module 10A in the second embodiment.
  • the printed wiring board of the third embodiment has the communication frequency (carrier frequency) in the UHF band by the RFIC module (10A) using the ground electrode (3B) as an antenna, as in the configurations of the first embodiment and the second embodiment. It is configured to perform wireless communication with a high frequency signal that it has, and is configured to enable wireless communication in a wide frequency band.
  • FIG. 8 is a perspective view showing a mounting position of an RFIC module 10A mounted on a ground electrode 3B by enlarging a part of the printed wiring board with an RFIC chip of the third embodiment.
  • the article is a printed wiring board, and the metal in the article is the ground electrode 3B.
  • the RFIC module 10A is mounted on the edge of the metal surface 3Ba of the flat ground electrode 3B.
  • a slit portion 3Bb as a magnetic flux passing portion is formed on the metal surface 3Ba of the ground electrode 3B on which the RFIC module 10A is mounted.
  • the slit portion 3Bb has a gap shape extending inward from the edge of the ground electrode 3B, and the RFIC module 10A is mounted so as to straddle the slit portion 3Bb.
  • FIG. 9 is a plan view showing a state in which the RFIC module 10A is mounted on the edge of the metal surface 3Ba of the ground electrode 3B.
  • the coil conductor 4 and the back surface electrode 19A of the feeder circuit substrate 12 in the RFIC module 10A are shown, and the illustration of the RFIC chip 1 is omitted.
  • the coil conductor 4 of the feed circuit board 12 is disposed so as to protrude from the edge of the ground electrode 3B.
  • a part of the coil conductor 4 of the feeding circuit board 12 is disposed on the ground electrode 3B, and the remaining part of the coil conductor 4 is disposed at a position deviated from the ground electrode 3B.
  • the magnetic field (magnetic flux) generated by the excited coil conductor 4 passes through the region out of the metal surface 3Ba of the ground electrode 3B. That is, the loop surface of the coil conductor 4 is disposed so as to overlap the edge of the metal surface 3Ba in plan view, and a part of the loop surface of the coil conductor 4 overlaps the magnetic flux passing portion in plan view.
  • the feeder circuit board 12 of the RFIC module 10A is disposed so as to straddle the slit portion 3Bb formed on the metal surface 3Ba of the ground electrode 3B. That is, a part of the slit including the edge portion of the slit portion 3Bb extended from the edge of the ground electrode 3B intersects with the coil conductor 4 of the feed circuit substrate 12 in a plan view. Therefore, the region of the tip portion (inner portion) of the slit portion 3Bb extended from the edge of the ground electrode 3B is a region out of the module mounting surface region of the RFIC module 10A.
  • connection point connected in a direct current manner to the approximate midpoint of coil conductor 4 of feed circuit board 12 via connection line 5 and back surface electrode 19A is slit portion 3Bb at ground electrode 3B. It is near the edge of the area of one side divided by. That is, the substantially middle point of the coil conductor 4 is connected in a direct current manner via the connection line 5 and the back surface electrode 19A in the module mounting surface area near the edge of the ground electrode 3B.
  • the magnetic field (magnetic flux) generated by the excited coil conductor 4 in the feed circuit board 12 passes through the region out of the metal surface 3Ba of the ground electrode 3B in plan view. Since the slit portion 3Bb is formed in the module mounting surface area of the RFIC module 10A in the ground electrode 3B, the flow of current that degrades the power transfer efficiency in the module mounting surface area is suppressed.
  • the substantially middle point of the coil conductor 4 of the feeding circuit board 12 is DC connected near the edge of the ground electrode 3B and is connected to the ground electrode 3B. It has the structure which provided slit part 3Bb. Therefore, the high frequency current from the excited coil conductor 4 flows along the edge of the ground electrode 3B, and the ground electrode 3B functions as a transmitting antenna. On the contrary, in the ground electrode 3B functioning as a receiving antenna, the RFIC module 10A can receive signals by the high frequency current flowing through the edge portion of the metal surface 3Ba.
  • substantially the middle point of the coil conductor 4 of the feeding circuit board 12 of the RFIC module 10A (more preferably, middle point of electrical length) Are connected in a direct current manner (DC connection) at one place near the edge of the ground electrode 3B to be an antenna (radiation plate).
  • the printed wiring board of the third embodiment has a high degree of freedom of attachment, and has a configuration with higher power transfer efficiency, and can achieve downsizing, weight reduction, and cost reduction.
  • a metal is described as a ground electrode using a printed wiring board as an article with an RFIC chip, but a metal is used as an antenna as an article with an RFIC chip of the present invention. It is possible to apply to various articles which can
  • FIG. 10 shows an example of application of the article with an RFIC chip according to the present invention, which is an example used for the forceps 100 which is a metallic surgical tool which is a small accessory made of steel as the article.
  • a mounting surface 100a on which the RFIC module 101 is mounted is provided on one of the handles of the forceps 100 in which finger holes are formed.
  • the mounting surface 100a which becomes a metal surface provided in the insulator 100 is flat-plate circular [planar view], and the slit part 100b is formed in the part.
  • FIG. 10 shows a part of the forceps 100 and is a plan view showing a state in which the RFIC module 101 is mounted on the forceps 100. Further, FIG. 10 shows a state in which the RFIC module 101 having a circular plan view is mounted on the mounting surface 100 a of the forceps 100.
  • a dotted circle P indicates that the middle point of the coil conductor 102 provided in the RFIC module 101 is connected to the mounting surface 100a in a direct current manner.
  • the mounting position of the mounting surface 100a to which the middle point of the coil conductor 102 is connected in a direct current manner is directly below the module mounting surface area of the coil conductor 102 in plan view and near the outer edge of the mounting surface 100a. Position of the
  • the coil conductor 102 in the RFIC module 101 is disposed to intersect the slit portion 100 b which is a magnetic flux passing portion in plan view. As a result, the magnetic field (magnetic flux) generated by the excited coil conductor 102 passes through the slit portion 100 b.
  • a circular RFIC module 101 having a diameter smaller than that of the mounting surface 100a is concentrically mounted on the circular mounting surface 100a.
  • the configuration described in 3 is also applicable. That is, as described in the first embodiment, in addition to the slit portion (3b), the opening portion (3c) is formed, and the coil conductor (102) is disposed to surround the opening portion in plan view. (See FIG. 1). Further, as described in the second embodiment, as a configuration in which a part of the mounting surface (100a) is a metal surface, a magnetic field (magnetic flux) generated in the excited coil conductor (102) passes through the mounting surface (100a) (See FIG. 7). Furthermore, as described in the third embodiment, a part of the attachment surface (100a) may be formed of a metal surface, and a slit portion (3Bb) may be provided on the metal surface (see FIG. 9).
  • the magnetic flux passing portion formed on the ground electrode in the printed wiring board and through which the magnetic flux generated from the coil conductor of the RFIC module passes may be in a form other than the magnetic flux passing portion in the first to third embodiments described above.
  • FIG. 11 is an enlarged perspective view of a part of the printed wiring board with an RFIC chip of the fourth embodiment and a mounting position of the RFIC module mounted on the ground electrode.
  • FIG. 12 is a diagram showing the RFIC module mounted on the ground electrode.
  • FIG. 13 is a perspective view schematically showing the configuration of a coil conductor and the like on the feed circuit board of the RFIC module.
  • the ground electrode 3C in the printed wiring board is recessed inwardly from an end face 3Cb of the ground electrode 3C as a magnetic flux passing portion, and has a V-shaped notch 3Cc in plan view. Further, an L-shaped resist opening 17 provided along the notch 3Cc is formed in the ground electrode 3C.
  • the RFIC module 10B is mounted on the metal surface 3Ca (a resist pattern on the metal surface 3Ca) of the ground electrode 3C so that a part of the RFIC module 10B covers the notch 3Cc.
  • the feeder circuit board 22 of the RFIC module 10B is provided with a back electrode 29 different from the above-described first to third embodiments.
  • the feeder circuit board 22 includes two L-shaped back surface electrodes 29a and 29b having different sizes.
  • the back surface electrode 29 a has a size larger than that of the back surface electrode 29 b, and is connected to a substantially middle point of the coil conductor 4 via the connection line 5.
  • the smaller back electrode 29b is a dummy electrode.
  • the back surface electrodes 29a and 29b face each other in the diagonal direction of the feed circuit board 22 in plan view.
  • the back surface electrode 29a of the feeding circuit substrate 22 is connected to the metal surface 3Ca of the ground electrode 3C exposed through the resist opening 17 in a direct current manner via a conductive paste.
  • Such an RFIC module 10B can also be mounted on a ground electrode different from the ground electrode 3C provided with the V-shaped notch 3Cc.
  • FIG. 14 is an enlarged perspective view showing a part of a printed wiring board with an RFIC chip of a modification of the fourth embodiment.
  • FIG. 15 is a diagram showing the RFIC module mounted on the ground electrode.
  • the ground electrode 3D of the printed wiring board is provided with a slit portion 3Db and an opening 3Dc in the same manner as the ground electrode 3 of the first embodiment described above.
  • Two L-shaped resist openings 27a and 27b having different sizes are formed to face each other with the opening 3Dc interposed therebetween.
  • the back surface electrode 29a of the feeder circuit board 22 of the RFIC module 10B is connected to the metal surface 3Da of the ground electrode 3D exposed through the larger resist opening 27a in a direct current manner via the conductive paste.
  • one back surface electrode connected to the coil conductor of the feeding circuit substrate of the RFIC module is DC connected to the metal surface of the ground electrode exposed through one resist opening Being connected to the ground electrode at one point.
  • the embodiment of the present invention is not limited to this.
  • FIG. 16 is a perspective view showing a mounting position of an RFIC module mounted on a ground electrode by enlarging a part of a printed wiring board with an RFIC chip of the fifth embodiment.
  • the RFIC module is the RFIC module 10B of the fourth embodiment described above, and the ground electrode is the ground of the first embodiment described above. It is an electrode 3.
  • the larger back electrode 29a (see FIG. 13) of the feeding circuit substrate 22 of the RFIC module 10B is formed on the metal surface 3a of the ground electrode 3 exposed through the three resist openings 7a, 7c and 7d. It is connected in direct current. That is, the back surface electrode 29 a is connected to the coil conductor 4 at one point, and is connected to the ground electrode 3 at three points.
  • the back surface electrode 29a is connected to the ground electrode 3 at multiple points, a larger current can flow more reliably between the ground electrode 3 and the back surface electrode 29a as compared with the case where the connection is made at one point.
  • the contact resistance is increased due to manufacturing variations, the current flowing between the ground electrode 3 and the back electrode 29a decreases. That is, as the variation in contact resistance increases, the variation in current also increases.
  • the ground electrode 3 and the back surface electrode 29a are connected at many points, even if the contact resistance at some points is increased, the current is not changed through the remaining points. It can flow. Therefore, even if the variation in the contact resistance at some points becomes large, the variation in the current flowing between the ground electrode 3 and the back surface electrode 29a is small.
  • FIG. 17 is a perspective view showing a part of the printed circuit board with an RFIC chip of the modification of the fifth embodiment in an enlarged manner.
  • the ground electrode 3E has a V-shaped notch, like the ground electrode 3C of the fourth embodiment shown in FIG. A unit 3Ec is provided.
  • the ground electrode 3E is formed with three resist openings 27a, 27b and 27c provided along the notch 3Ec.
  • the resist opening 27a is provided in the vicinity of the top of the V-shaped notch 3Ec.
  • the remaining resist openings 27b and 27c are provided between the end face 3Eb of the notch 3Ec.
  • the larger back electrode 29a (see FIG. 13) of the feeder circuit substrate 22 of the RFIC module 10B is connected in a direct current manner to the metal surface 3Ea of the ground electrode 3E exposed through the three resist openings 27a, 27b and 27c. That is, the back surface electrode 29a is connected to the coil conductor 4 at one point, and is connected to the ground electrode 3E at three points.
  • the coil conductor of the feed circuit substrate of the RFIC module is DC-connected to the ground electrode through the back surface electrode at its substantially middle point (preferably the middle point of the electrical length). It is connected.
  • the embodiment of the present invention is not limited to this.
  • FIG. 20 is a perspective view schematically showing a configuration of a coil conductor and the like on a feeder circuit board of the RFIC module according to a modification of the seventh embodiment. This is also a modification of the above-described first embodiment shown in FIG.
  • the bracket-shaped back surface electrode 49 is connected in a direct current manner to the metal surface 3Fa of the ground electrode 3F exposed through the bracket-shaped resist opening 37.
  • the resist opening 37 is formed so as to partially surround the opening 3Fc.
  • the coil conductor of the feed circuit substrate of the RFIC module is connected to the ground electrode through one back surface electrode. It is connected in direct current.
  • the embodiment of the present invention is not limited to this.
  • FIG. 22 is a perspective view schematically showing a configuration of a coil conductor and the like on a feeder circuit board of the RFIC module according to the eighth embodiment.
  • the loop electrode 14c of the coil conductor 14 is connected to the back surface electrode 59a via the connecting wire 45a and via the connecting wire 45b. Is connected to the back electrode 59b. That is, each of the plurality of points (connection points) of the coil conductor 14 is connected to different back surface electrodes 59a and 59b.
  • connection points are one end and the other end of the coil conductor 14 in consideration of the power transfer efficiency. It is preferable to be provided at a position separated by a distance equal to or more than a quarter of the electrical length, ie, a position near the midpoint.
  • FIG. 23 is a perspective view showing a part of the printed wiring board with an RFIC chip of the eighth embodiment in an enlarged manner.
  • one back electrode 59a is connected to metal surface 3Ga of ground electrode 3G exposed through one resist opening 47a in a direct current manner.
  • the other back surface electrode 59b is connected in a direct current manner to the metal surface 3Ga exposed through the other resist opening 47b.
  • the resist openings 47a and 47b are formed to face each other across the opening 3Gc.
  • the printed wiring boards according to the above-described fourth to eighth embodiments and their variations are also configured to have high degree of freedom of installation and power transfer efficiency. Further, the configuration can be achieved to achieve miniaturization, weight reduction and cost reduction.
  • the RFIC chip-attached article of the present invention is simple in various articles which can use a metal surface such as a printed wiring board or a metal tool as an antenna as described in each embodiment. It is possible to construct an RFID system with the configuration.
  • the communication device has a high degree of freedom of attachment to an article, a simple configuration and high power transfer efficiency, and can achieve miniaturization, weight reduction, and cost reduction. .
  • the present invention can be applied to a variety of articles having a metal surface as an article with an RFIC chip, and therefore, the configuration is useful in expanding an article management system using an RFID system.
  • RFIC chip 1 RFIC chip 2 Feed circuit board 3 Ground electrode (metal) 3a Metal surface 3b Slit portion (flux passing portion) 3c opening (magnetic flux passing part) 3d resist opening 4 coil conductor (inductor element) 4a 1st loop electrode 4b 2nd loop electrode 4c 3rd loop electrode 5 connecting wire 6 via conductor 7 resist pattern 7a 1st resist opening 7b 2nd resist opening 7c 3rd resist opening 7d 4th resist opening 8 front surface electrode 8a 1st Surface electrode 8b Second surface electrode 9 Back surface electrode 9a First back surface electrode 9b Second back surface electrode 9c Third back surface electrode 9d Fourth back surface electrode 10 RFIC module 100 Article (printed wiring board, insulator) 101 RFIC module 102 coil conductor

Abstract

An RFIC chip-equipped product which is equipped with a product (100) having a metal surface, a coil conductor (4) having a loop surface that faces the metal surface, and an RFIC chip (1) having first and second input/output terminals which are respectively connected to one end and the other end of the coil conductor, wherein an intermediate point along the coil conductor is DC-connected to a point near the edge of the metal surface, and a magnetic flux passage section through which magnetic flux from the coil conductor passes is positioned in a region which overlaps the loop surface of the coil conductor when seen in a planar view.

Description

ＲＦＩＣチップ付き物品Article with RFIC chip
　本発明は、少なくとも一部が金属物で構成された物品にＲＦＩＣ(Radio-Frequency Integrated Circuit)チップを設けて、当該物品における金属面をアンテナとして用いるＲＦＩＣチップ付き物品に関する。 The present invention relates to an article provided with an RFIC chip in which an RFIC (Radio-Frequency Integrated Circuit) chip is provided on an article at least a part of which is made of a metal, and the metal surface of the article is used as an antenna.
　物品の管理システムにおいては、物品やその物品の容器（包装体）などに対して、当該物品に関する各種情報を記憶したＲＦＩＣチップを備えた無線通信タグを付し、ＲＦＩＣチップに対して非接触方式で通信を行うことにより、当該物品に関する各種情報を入手するＲＦＩＤシステム(Radio Frequency Identification System)を利用した構成が提案されている。 In the article management system, a wireless communication tag provided with an RFIC chip storing various information related to the article is attached to the article or a container (package) of the article, etc. There has been proposed a configuration using an RFID system (Radio Frequency Identification System) for acquiring various information related to the article by performing communication.
　物品における金属面をアンテナとしてＲＦＩＤシステムを利用した物品管理システムとしては、例えば特許文献１～３に開示された構成がある。特許文献１および特許文献２に開示された構成においては、無線ＩＣチップを備え共振回路を内蔵する給電回路基板が、金属物と電磁界結合し、当該金属物の金属面をアンテナ（放射板）として機能させている。 As an article management system using an RFID system using a metal surface of an article as an antenna, for example, there are configurations disclosed in Patent Documents 1 to 3. In the configurations disclosed in Patent Document 1 and Patent Document 2, a feeding circuit substrate provided with a wireless IC chip and incorporating a resonant circuit is electromagnetically coupled to a metal object, and the metal surface of the metal object is an antenna (radiation plate) It functions as
　また、特許文献３に開示された無線ＩＣチップ付きプリント配線基板は、プリント配線基板の表面に設けたグランド電極の一側部に大きな切欠き部分を設けて、グランド電極の一部分にループ状電極を形成した構成である。特許文献３のプリント配線基板は、そのループ状電極に無線ＩＣチップの端子電極を電気的に接続して、このループ状電極と一体的に形成されたグランド電極をアンテナとして機能させる構成である（特許文献３の図５参照）。また、特許文献３には、無線ＩＣチップが搭載された給電回路基板をグランド電極の一部分に形成されたループ状電極に対して電気的に接続する構成が開示されている。この給電回路基板に内蔵された共振回路が、接続用電極を介してループ状電極と電磁界結合される構成である（特許文献３の図８参照）。この構成においても、ループ状電極と一体的に形成されたグランド電極がアンテナとして機能している。 Further, in the printed circuit board with a wireless IC chip disclosed in Patent Document 3, a large notch is provided on one side of the ground electrode provided on the surface of the printed circuit board, and a loop electrode is provided on a part of the ground electrode. It is the formed structure. The printed wiring board of Patent Document 3 has a configuration in which the loop electrode is electrically connected to the terminal electrode of the wireless IC chip, and the ground electrode integrally formed with the loop electrode functions as an antenna ( Refer FIG. 5 of patent document 3). Further, Patent Document 3 discloses a configuration in which a feeding circuit substrate on which a wireless IC chip is mounted is electrically connected to a loop electrode formed on a part of a ground electrode. The resonance circuit incorporated in the feed circuit substrate is configured to be electromagnetically coupled to the loop electrode through the connection electrode (see FIG. 8 of Patent Document 3). Also in this configuration, the ground electrode formed integrally with the loop electrode functions as an antenna.
特許第５７９４３６１号公報Patent No. 5794361 特開２０１３－１３１３０号公報JP, 2013-13130, A 特許第５７６９６３７号公報Patent No. 5769637
　上記のように構成された特許文献１および特許文献２の構成においては、給電回路基板の共振回路が、金属物と電磁界結合により電気的に接続する構成であるため、金属物に対する給電回路基板の取付けは容易なものとなるが、電力（エネルギー）の伝達効率が悪く、無線通信による情報伝達としては十分なものではなかった。 In the configurations of Patent Document 1 and Patent Document 2 configured as described above, the resonant circuit of the feeder circuit substrate is configured to be electrically connected to the metal by electromagnetic field coupling, so the feeder circuit substrate for the metal is Although it is easy to install, the transmission efficiency of power (energy) is poor, and it is not sufficient as information transmission by wireless communication.
　また、特許文献３の無線ＩＣチップ付きプリント配線基板においては、グランド電極の一側部に大きな切欠き部分を設けてループ状電極を形成して整合回路を構成し、無線ＩＣチップとグランド電極とのインピーダンスの整合を図る構成である。このため、特許文献３のプリント配線基板は、整合回路を構成するループ状電極をグランド電極に形成する必要があり、ループ状電極を形成するためのスペースが必要となる。当分野においては、小型化、軽量化、および低コスト化は重要な課題であり、例えばグランド電極にループ状電極のような構成を設けることは、小型化、軽量化、および低コスト化に逆行するものである。さらに、特許文献３の無線ＩＣチップ付きプリント配線基板は、無線ＩＣチップを搭載した給電回路基板の共振回路とループ状電極が電磁界結合により電気的に接続される構成であるため、電力（エネルギー）の伝達効率の点においても、十分なものではなかった。 In the printed circuit board with a wireless IC chip disclosed in Patent Document 3, a large notch is provided on one side of the ground electrode to form a loop electrode to form a matching circuit, and a wireless IC chip and a ground electrode are formed. To match the impedance of the For this reason, in the printed wiring board of Patent Document 3, it is necessary to form the loop electrode forming the matching circuit on the ground electrode, and a space for forming the loop electrode is required. In the field, miniaturization, weight reduction, and cost reduction are important issues. For example, providing a configuration such as a loop electrode on the ground electrode is contrary to miniaturization, weight reduction, and cost reduction. It is Furthermore, since the printed circuit board with the wireless IC chip of Patent Document 3 has a configuration in which the resonant circuit of the feeding circuit board on which the wireless IC chip is mounted and the loop electrode are electrically connected by electromagnetic field coupling, power (energy Also in terms of the transmission efficiency of), it was not sufficient.
　本発明は、小型化、軽量化、および低コスト化を達成することができ、電力伝達効率が高く、物品に対する取付けの自由度が高い構成を有するＲＦＩＣチップ付き物品を提供することである。 An object of the present invention is to provide an article with an RFIC chip having a configuration that can achieve miniaturization, weight reduction, and cost reduction, has a high power transfer efficiency, and has a high degree of freedom of attachment to the article.
　本発明の一態様のＲＦＩＣチップ付き物品は、
　金属面を有する物品と、
　前記金属面に対向するループ面を有するコイル導体と、
　前記コイル導体の一端および他端にそれぞれ接続された第１および第２の入出力端子を有するＲＦＩＣチップと、を備え
　前記コイル導体の中間の一点と前記金属面の縁近傍の一点とが直流的に接続し、前記コイル導体のループ面と平面視で重なる領域に前記コイル導体による磁束が通る磁束通過部が配設されている。 An article with an RFIC chip according to one aspect of the present invention is
An article having a metal surface;
A coil conductor having a loop surface facing the metal surface;
An RFIC chip having first and second input / output terminals respectively connected to one end and the other end of the coil conductor; and one point in the middle of the coil conductor and one point near the edge of the metal surface are DC A magnetic flux passing portion through which the magnetic flux from the coil conductor passes is disposed in a region overlapping with the loop surface of the coil conductor in plan view.
　本発明によれば、小型化、軽量化、および低コスト化を達成することができ、電力伝達効率が高く、物品に対する取付けの自由度が高い構成を有するＲＦＩＣチップ付き物品を提供することができる。 According to the present invention, it is possible to achieve size reduction, weight reduction and cost reduction, and provide an article with an RFIC chip having a configuration with high power transfer efficiency and high degree of freedom of attachment to the article. .
本発明に係る実施の形態１のＲＦＩＣチップ付き物品であるプリント配線基板の一部を拡大して示した斜視図The perspective view which expanded and showed a part of printed wiring board which is an article with an RFIC chip of Embodiment 1 concerning the present invention 実施の形態１のＲＦＩＣチップ付き物品におけるＲＦＩＣモジュールの等価回路図Equivalent Circuit Diagram of RFIC Module in Article with RFIC Chip of Embodiment 1 実施の形態１におけるＲＦＩＣモジュールの構成を示す分解斜視図An exploded perspective view showing a configuration of the RFIC module in the first embodiment ＲＦＩＣモジュールの給電回路基板におけるコイル導体などの構成を模式的に示す斜視図The perspective view which shows typically the structure of a coil conductor etc. in the electric power feeding circuit board of RFIC module ＲＦＩＣモジュールが搭載されるプリント配線基板のグランド電極におけるスリット部および開口部を示す図The figure which shows the slit part and opening part in the ground electrode of the printed wiring board by which an RFIC module is mounted ＲＦＩＣモジュールにおけるコイル導体と裏面電極との位置関係を示す図Diagram showing the positional relationship between coil conductor and back electrode in RFIC module グランド電極にＲＦＩＣモジュールが搭載された状態を示す図Diagram showing the RFIC module mounted on the ground electrode ＲＦＩＣモジュールの給電回路基板におけるコイル導体の変形例を示す模式図A schematic view showing a modification of the coil conductor on the feeding circuit board of the RFIC module 本発明に係る実施の形態２のＲＦＩＣチップ付きプリント配線基板における一部を拡大して示す斜視図The perspective view which expands and shows a part in the printed wiring board with a RFIC chip of Embodiment 2 concerning the present invention 実施の形態２のＲＦＩＣチップ付きプリント配線基板において、ＲＦＩＣモジュールがグランド電極の金属面の縁上に搭載された状態を示す平面図In the printed wiring board with an RFIC chip of the second embodiment, a plan view showing a state in which the RFIC module is mounted on the edge of the metal surface of the ground electrode 本発明に係る実施の形態３のＲＦＩＣチップ付きプリント配線基板における一部を拡大して示す斜視図The perspective view which expands and shows a part in the printed wiring board with a RFIC chip of Embodiment 3 concerning the present invention 実施の形態３のＲＦＩＣチップ付きプリント配線基板において、ＲＦＩＣモジュールがグランド電極の金属面の縁上に搭載された状態を示す平面図In the printed wiring board with RFIC chip of the third embodiment, a plan view showing a state in which the RFIC module is mounted on the edge of the metal surface of the ground electrode 本発明のＲＦＩＣチップ付き物品の応用例の一例を示す図The figure which shows an example of the application example of the articles | goods with a RFIC chip | tip of this invention. 本発明に係る実施の形態４のＲＦＩＣチップ付きプリント配線基板における一部を拡大して示す斜視図The perspective view which expands and shows a part in the printed wiring board with a RFIC chip of Embodiment 4 concerning the present invention 実施の形態４における、のグランド電極にＲＦＩＣモジュールが搭載された状態を示す図A diagram showing a state in which the RFIC module is mounted on the ground electrode of the fourth embodiment. 実施の形態４における、ＲＦＩＣモジュールの給電回路基板におけるコイル導体などの構成を模式的に示す斜視図FIG. 17 is a perspective view schematically showing a configuration of a coil conductor and the like on a feed circuit substrate of the RFIC module in the fourth embodiment. 実施の形態４の変形例のＲＦＩＣチップ付きプリント配線基板における一部を拡大して示す斜視図A perspective view showing an enlarged part of a printed circuit board with an RFIC chip of a modification of the fourth embodiment 実施の形態４の変形例における、グランド電極にＲＦＩＣモジュールが搭載された状態を示す図The figure which shows the state in which the RFIC module was mounted in the grand electrode in the modification of Embodiment 4. 本発明に係る実施の形態５のＲＦＩＣチップ付きプリント配線基板における一部を拡大して示す斜視図The perspective view which expands and shows a part in the printed wiring board with a RFIC chip of Embodiment 5 concerning the present invention 実施の形態５の変形例のＲＦＩＣチップ付きプリント配線基板における一部を拡大して示す斜視図The perspective view which expands and shows a part in the printed wiring board with a RFIC chip of the modification of Embodiment 5 本発明に係る実施の形態６における、ＲＦＩＣモジュールの給電回路基板におけるコイル導体などの構成を模式的に示す斜視図The perspective view which shows typically the structure of a coil conductor etc. in the electric power feeding circuit board of a RFIC module in Embodiment 6 which concerns on this invention 本発明に係る実施の形態７における、ＲＦＩＣモジュールの給電回路基板におけるコイル導体などの構成を模式的に示す斜視図FIG. 17 is a perspective view schematically showing a configuration of a coil conductor and the like on a feed circuit board of the RFIC module according to a seventh embodiment of the present invention 実施の形態７の変形例における、ＲＦＩＣモジュールの給電回路基板におけるコイル導体などの構成を模式的に示す斜視図FIG. 17 is a perspective view schematically showing a configuration of a coil conductor and the like on a feed circuit substrate of the RFIC module according to a modification of the seventh embodiment. 実施の形態７の変形例のＲＦＩＣチップ付きプリント配線基板における一部を拡大して示す斜視図A perspective view showing an enlarged part of a printed circuit board with an RFIC chip of a modification of the seventh embodiment 本発明に係る実施の形態８における、ＲＦＩＣモジュールの給電回路基板におけるコイル導体などの構成を模式的に示す斜視図FIG. 18 is a perspective view schematically showing a configuration of a coil conductor and the like on a feed circuit board of the RFIC module according to an eighth embodiment of the present invention 実施の形態８のＲＦＩＣチップ付きプリント配線基板における一部を拡大して示す斜視図A perspective view showing a part of the printed circuit board with an RFIC chip of the eighth embodiment in an enlarged manner
　先ず始めに、本発明に係るＲＦＩＣチップ付き物品における各種態様の構成について記載する。 First of all, the configurations of various aspects of the article with an RFIC chip according to the present invention will be described.
　本発明に係る第１の態様のＲＦＩＣチップ付き物品は、
　金属面を有する物品と、
　前記金属面に対向するループ面を有するコイル導体と、
　前記コイル導体の一端および他端にそれぞれ接続された第１および第２の入出力端子を有するＲＦＩＣチップと、を備え
　前記コイル導体の中間の一点と前記金属面の縁近傍の一点とが直流的に接続し、前記コイル導体のループ面と平面視で重なる領域に前記コイル導体による磁束が通る磁束通過部が配設されている。 An article with an RFIC chip according to the first aspect of the present invention is
An article having a metal surface;
A coil conductor having a loop surface facing the metal surface;
An RFIC chip having first and second input / output terminals respectively connected to one end and the other end of the coil conductor; and one point in the middle of the coil conductor and one point near the edge of the metal surface are DC A magnetic flux passing portion through which the magnetic flux from the coil conductor passes is disposed in a region overlapping with the loop surface of the coil conductor in plan view.
　上記のように構成された第１の態様のＲＦＩＣチップ付き物品は、小型化、軽量化、および低コスト化を達成することができ、電力伝達効率が高く、物品に対する取付けの自由度が高い構成を有するＲＦＩＣチップ付き物品を提供することができる。 The article with an RFIC chip according to the first aspect configured as described above can achieve downsizing, weight reduction, and cost reduction, has a high power transfer efficiency, and has a high degree of freedom of attachment to the article. An article with an RFIC chip can be provided.
　本発明に係る第２の態様のＲＦＩＣチップ付き物品は、前記の第１の態様における前記金属面に電気的に直接接続される前記コイル導体の中間の一点が、前記コイル導体における電気長の略中点の位置としてもよい。 The RFIC chip attached article according to the second aspect of the present invention is characterized in that one point in the middle of the coil conductor electrically connected directly to the metal surface in the first aspect is approximately the electrical length of the coil conductor. The position of the middle point may be used.
　本発明に係る第３の態様のＲＦＩＣチップ付き物品は、前記の第１または第２の態様の前記コイル導体に電気的に直接接続される前記金属面の一点が、平面視で前記コイル導体の直下に位置してもよい。 The RFIC chip attached article according to the third aspect of the present invention is characterized in that one point of the metal surface electrically connected directly to the coil conductor of the first or second aspect is the surface of the coil conductor in plan view. It may be located directly below.
　本発明に係る第４の態様のＲＦＩＣチップ付き物品は、前記の第１から第３の態様のいずれか一つの態様において、前記磁束通過部が前記金属面に形成され、前記コイル導体のループ面の一部を平面視で前記磁束通過部と重なるように構成してもよい。 In the RFIC chip-attached article according to the fourth aspect of the present invention, in the aspect according to any one of the first to third aspects, the magnetic flux passing portion is formed on the metal surface, and the loop surface of the coil conductor The magnetic flux passing portion may be partially overlapped with the magnetic flux passing portion in a plan view.
　本発明に係る第５の態様のＲＦＩＣチップ付き物品は、前記の第１から第４の態様のいずれか一つの態様において、前記コイル導体のループ面を平面視で前記金属面の縁と重なるように構成してもよい。 In the RFIC chip-attached article according to the fifth aspect of the present invention, in any one of the first to fourth aspects, the loop surface of the coil conductor overlaps the edge of the metal surface in plan view. You may configure it.
　本発明に係る第６の態様のＲＦＩＣチップ付き物品は、前記の第１から第５の態様のいずれか一つの態様において、前記磁束通過部が開口で構成されてもよい。 In the RFIC chip-attached article according to the sixth aspect of the present invention, in the aspect according to any one of the first to fifth aspects, the magnetic flux passing portion may be an opening.
　本発明に係る第７の態様のＲＦＩＣチップ付き物品は、前記の第１から第５の態様のいずれか一つの態様において、前記磁束通過部を磁束が通過する材料で構成してもよい。 The article with an RFIC chip according to the seventh aspect of the present invention may be made of a material through which magnetic flux passes, in the magnetic flux passing portion according to any one of the first to fifth aspects.
　本発明に係る第８の態様のＲＦＩＣチップ付き物品は、前記の第１から第７の態様のいずれか１つの態様において、前記コイル導体が、前記コイル導体の中間の一点を含む複数の点で、前記金属面の縁近傍の一点を含む前記金属面の縁近傍における複数の点に直流的に接続されてもよい。 The RFIC chip attached article according to an eighth aspect of the present invention is the article according to any one of the first to seventh aspects, wherein the coil conductor includes a plurality of points including the middle point of the coil conductor. The plurality of points near the edge of the metal surface, including one point near the edge of the metal surface, may be DC connected.
　本発明に係る第９の態様のＲＦＩＣチップ付き物品は、前記第１から第８の態様のいずれか１つの態様において、前記コイル導体と前記ＲＦＩＣチップとがＲＦＩＣモジュールとしてモジュール化されてもよく、その場合には、前記ＲＦＩＣモジュールが、前記コイル導体と前記金属面との間に介在し、前記コイル導体と前記金属面とを直流的に接続する電極を備えてもよい。 In the RFIC chip-attached article according to the ninth aspect of the present invention, in any one of the first to eighth aspects, the coil conductor and the RFIC chip may be modularized as an RFIC module, In that case, the RFIC module may include an electrode interposed between the coil conductor and the metal surface, and connecting the coil conductor and the metal surface in a direct current manner.
　本発明に係る第１０の態様のＲＦＩＣチップ付き物品は、前記の第１から第９の態様のいずれか一つの態様において、前記金属面をアンテナとして、ＵＨＦ帯を通信周波数とするよう構成してもよい。 The article with an RFIC chip according to a tenth aspect of the present invention is configured such that the metal surface is an antenna and the UHF band is a communication frequency in any one of the first to ninth aspects. It is also good.
　以下、本発明に係るＲＦＩＣチップ付き物品の具体的な例示としての実施の形態について、添付の図面を参照しつつ説明する。なお、以下の実施の形態のＲＦＩＣチップ付き物品の具体例として、プリント配線基板に適用した例ついて説明するが、本発明に係るＲＦＩＣチップ付き物品としては、少なくとも一部が金属物で構成されており、金属面がアンテナとして機能できる物品の全てが対象となる。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a specific exemplary embodiment of an article with an RFIC chip according to the present invention will be described with reference to the attached drawings. In addition, although the example applied to a printed wiring board is demonstrated as a specific example of the articles | goods with a RFIC chip of the following embodiment, At least one part is comprised with a metal thing as an article with a RFIC chip concerning this invention. All of the articles in which the metal surface can function as an antenna are targeted.
　《実施の形態１》
　図１は、本発明に係る実施の形態１のＲＦＩＣチップ付き物品であるプリント配線基板１００の一部（グランド電極部分）を拡大して示した斜視図である。図２は、実施の形態１のＲＦＩＣチップ付きプリント配線基板１００におけるＲＦＩＣモジュール１０の等価回路図である。 Embodiment 1
FIG. 1 is an enlarged perspective view showing a part (ground electrode portion) of a printed wiring board 100 which is an article with an RFIC chip according to a first embodiment of the present invention. FIG. 2 is an equivalent circuit diagram of the RFIC module 10 in the printed wiring board 100 with an RFIC chip of the first embodiment.
　図１においては、ＲＦＩＣチップ１を備えるＲＦＩＣモジュール１０がグランド電極３上に搭載されることを示している。図１に示す物品の具体例であるプリント配線基板１００においては、グランド電極３が金属物でありアンテナとなる。 FIG. 1 shows that the RFIC module 10 including the RFIC chip 1 is mounted on the ground electrode 3. In the printed wiring board 100 which is a specific example of the article shown in FIG. 1, the ground electrode 3 is a metal and serves as an antenna.
　ＲＦＩＣモジュール１０は、ＵＨＦ帯を通信周波数（キャリア周波数）として無線通信（送受信）するＲＦＩＤデバイスであり、ＲＦＩＤ信号を処理するＲＦＩＣチップ１と、コイル導体４（図２参照）を有する給電回路基板２と、を備える。給電回路基板２は、誘電体で形成された複数のシートを積層して構成されており、各シート上には導体パターンが形成されている。各シートに形成された導体パターンは各シートを貫通するビアホール導体により接続され、それにより、給電回路基板２の内部にインダクタ素子となるコイル導体４が形成されている。コイル導体４の一端および他端は、ＲＦＩＣチップ１に設けられた第１の入出力端子１ａおよび第２の入出力端子１ｂのそれぞれに接続されている。 The RFIC module 10 is an RFID device for performing wireless communication (transmission and reception) with the UHF band as a communication frequency (carrier frequency), and a feeding circuit board 2 having an RFIC chip 1 for processing RFID signals and a coil conductor 4 (see FIG. 2). And. The feeder circuit board 2 is configured by laminating a plurality of sheets formed of dielectrics, and a conductor pattern is formed on each sheet. The conductor patterns formed on the respective sheets are connected by via hole conductors penetrating the respective sheets, whereby a coil conductor 4 to be an inductor element is formed inside the feeder circuit board 2. One end and the other end of the coil conductor 4 are connected to the first input / output terminal 1a and the second input / output terminal 1b provided in the RFIC chip 1, respectively.
　実施の形態１のＲＦＩＣチップ付きプリント配線基板１００の構成においては、ＲＦＩＣモジュール１０がグランド電極３の金属面（表面）３ａにおける縁部に設けられている。ＲＦＩＣモジュール１０が設けられたグランド電極３の縁部にはスリット部３ｂ、およびこのスリット部３ｂに繋がる開口部３ｃが形成されている。ＲＦＩＣモジュール１０は、グランド電極３のスリット部３ｂおよび開口部３ｃを覆うように配設されている。 In the configuration of the printed wiring board 100 with the RFIC chip of the first embodiment, the RFIC module 10 is provided at the edge of the metal surface (surface) 3 a of the ground electrode 3. A slit 3 b and an opening 3 c connected to the slit 3 b are formed at the edge of the ground electrode 3 provided with the RFIC module 10. The RFIC module 10 is disposed to cover the slit 3 b and the opening 3 c of the ground electrode 3.
　なお、実施の形態１の構成において、グランド電極３のスリット部３ｂおよび開口部３ｃの開口部分は、ＲＦＩＣモジュール１０の給電回路基板２に形成されたインダクタ素子であるコイル導体４により生じる磁界（磁束）が通る構成であれば良く、開口部分に磁界が通過する材料が充填された構成でもよい。本明細書においては、グランド電極３のスリット部３ｂおよび開口部３ｃ、並びに磁界が通過する材料が充填された領域が、非金属部であり「磁束通過部」として定義する。 In the configuration of the first embodiment, the magnetic field (magnetic flux) generated by the coil conductor 4 which is an inductor element formed on the feeder circuit substrate 2 of the RFIC module 10 in the slit 3b and the opening 3c of the ground electrode 3 The configuration may be such that the opening portion is filled with a material through which the magnetic field passes. In the present specification, the slit portion 3 b and the opening 3 c of the ground electrode 3 and the region filled with the material through which the magnetic field passes are non-metal portions and are defined as “magnetic flux passing portions”.
　図２のＲＦＩＣモジュール１０の等価回路図に示すように、給電回路基板２のコイル導体４における中間の一点においてグランド電極３に直流的に接続（ＤＣ接続）されている。グランド電極３に直流的に接続されるコイル導体４の一点（接続点）は、コイル導体４の中間の点（一端と他端とを除くこれらの間の点）である。好ましくは、このコイル導体４の中間の一点は、コイル導体の一端および他端よりも、コイル導体４における電流最大点である該コイル導体４の電気長の中点に近いことが好ましい。さらに好ましくは、このコイル導体４の中間の一点は、コイル導体４における電流最大点である該コイル導体４の電気長の中点が好ましい。このように、コイル導体４の電気長の中点とグランド電極３とを直流的に接続することにより、電力伝達効率は最大となる。 As shown in the equivalent circuit diagram of the RFIC module 10 of FIG. 2, a direct current connection (DC connection) is made to the ground electrode 3 at one point in the middle of the coil conductor 4 of the feed circuit board 2. One point (connection point) of the coil conductor 4 connected to the ground electrode 3 in a direct current manner is a middle point of the coil conductor 4 (a point between these except for one end and the other end). Preferably, the middle one point of the coil conductor 4 is closer to the middle point of the electrical length of the coil conductor 4 which is the current maximum point in the coil conductor 4 than the one end and the other end of the coil conductor. More preferably, the middle point of the coil conductor 4 is preferably the middle point of the electrical length of the coil conductor 4 which is the maximum current point in the coil conductor 4. Thus, by connecting the middle point of the electrical length of the coil conductor 4 to the ground electrode 3 in a direct current manner, the power transfer efficiency is maximized.
　なお、本明細書において直流的な接続状態とは、静電容量を介する接続や、電磁界結合による接続を含まず、実際に直流が流れることが可能な接続状態をいう。単に電気的に接続状態とは、直流的に接続しているだけでなく静電容量を介して接続している場合や、電磁界結合により接続している場合を含む。 Note that, in the present specification, the direct-current connection state refers to a connection state in which direct current can actually flow without connection via electrostatic capacitance or connection by electromagnetic field coupling. The term “electrically connected state” includes not only direct current connection but also connection via electrostatic capacitance, and connection by electromagnetic field coupling.
　また、グランド電極３においてコイル導体４に対して直流的に接続（ＤＣ接続）される位置としては、グランド電極３の縁近傍における一点が好ましい。これは、高周波電流がグランド電極３における縁近傍の表面に沿って流れる性質を有するためである。即ち、グランド電極３における縁近傍とは、ＲＦＩＣモジュール１０によるアンテナとして機能するグランド電極３において、実質的に高周波電流が流れる領域となる。 Further, as a position where the ground electrode 3 is connected to the coil conductor 4 in a direct current manner (DC connection), one point near the edge of the ground electrode 3 is preferable. This is because the high frequency current has the property of flowing along the surface near the edge of the ground electrode 3. That is, in the vicinity of the edge of the ground electrode 3, in the ground electrode 3 functioning as an antenna by the RFIC module 10, a region in which a high frequency current substantially flows is provided.
　図３Ａは実施の形態１におけるＲＦＩＣモジュール１０の構成を示す分解斜視図）であって、図３Ｂは給電回路基板２におけるコイル導体４などの構成を模式的に示す斜視図である。図３Ａに示すＲＦＩＣモジュール１０において、給電回路基板２に搭載されたＲＦＩＣチップ１は、シリコンなどの半導体を素材とする半導体基板に各種の素子を内蔵した構造を有する。ＲＦＩＣチップ１には、クロック回路、ロジック回路、メモリ回路などを含み、必要な情報が記録されて、裏面（図３Ａにおける給電回路基板２に対向する面）に設けられた第１の入出力端子１ａおよび第２の入出力端子１ｂにより各種情報を示す信号が入出される構成である。 FIG. 3A is an exploded perspective view showing the configuration of the RFIC module 10 in the first embodiment, and FIG. 3B is a perspective view schematically showing the configuration of the coil conductor 4 and the like in the feed circuit board 2. In the RFIC module 10 shown in FIG. 3A, the RFIC chip 1 mounted on the feeder circuit substrate 2 has a structure in which various elements are incorporated in a semiconductor substrate made of a semiconductor such as silicon. The RFIC chip 1 includes a clock circuit, a logic circuit, a memory circuit, etc., and necessary information is recorded, and a first input / output terminal provided on the back surface (the surface facing the feeding circuit board 2 in FIG. 3A) Signals indicating various information are input and output by 1a and the second input / output terminal 1b.
　ＲＦＩＣチップ１が搭載される給電回路基板２は、誘電体材料で形成された複数のシートを積層、圧着、焼成して形成されている。給電回路基板２を構成する各シートには所定の電極パターンおよびビアホール導体が形成されており、給電回路基板２は、表面電極８ａ、８ｂ、インダクタ素子となるコイル導体４、および裏面電極９ａ、９ｂ、９ｃ、９ｄを備える。 The feeder circuit board 2 on which the RFIC chip 1 is mounted is formed by laminating, pressing, and firing a plurality of sheets formed of dielectric materials. A predetermined electrode pattern and a via hole conductor are formed on each sheet constituting the feeder circuit board 2, and the feeder circuit board 2 includes the front electrodes 8a and 8b, the coil conductor 4 serving as an inductor element, and the back electrodes 9a and 9b. , 9c, 9d.
　図３Ａに示すように、給電回路基板２の上面（ＲＦＩＣチップ１に対向する面）には一対の表面電極８ａ、８ｂが設けられており、前述のＲＦＩＣチップ１における一対の第１の入出力端子１ａおよび第２の入出力端子１ｂが直流的に接続（ＤＣ接続）される構成である。 As shown in FIG. 3A, a pair of front surface electrodes 8a and 8b are provided on the upper surface (a surface facing the RFIC chip 1) of the feeding circuit substrate 2, and the pair of first input / output of the RFIC chip 1 described above. The terminal 1a and the second input / output terminal 1b are connected in a direct current manner (DC connection).
　図３Ｂに示すように、多層構造の給電回路基板２の内部に、コイル導体４が形成されている。コイル導体４は、各層に形成された第１ループ電極４ａ、第２ループ電極４ｂおよび第３ループ電極４ｃ、そしてこれらに接続するビアホール導体６ａ、６ｂ、６ｃ、６ｄによって構成されたインダクタ素子である。コイル導体４の一端（ビアホール導体６ａの端）が一方の表面電極８ａに接続され、他端（ビアホール導体６ｄの端）が他方の表面電極８ｂに接続されている。コイル導体４を構成するループ電極４ａ、４ｂ、４ｃのそれぞれは、平面視で略四角の枠体形状であって、略四角のループ面を有する。ここで言う「ループ面」は、ループ電極自体とループ電極に実質的に囲まれた開口（ループ開口）とを含む平面を言う。 As shown to FIG. 3B, the coil conductor 4 is formed in the inside of the feeder circuit board 2 of multilayer structure. The coil conductor 4 is an inductor element constituted by the first loop electrode 4a, the second loop electrode 4b and the third loop electrode 4c formed in each layer, and the via hole conductors 6a, 6b, 6c, 6d connected to these. . One end (end of the via hole conductor 6a) of the coil conductor 4 is connected to one surface electrode 8a, and the other end (end of the via hole conductor 6d) is connected to the other surface electrode 8b. Each of the loop electrodes 4a, 4b and 4c constituting the coil conductor 4 has a substantially square frame shape in a plan view, and has a substantially square loop surface. The term "loop surface" as used herein refers to a plane that includes the loop electrode itself and an opening (loop opening) substantially surrounded by the loop electrode.
　なお、本明細書において、平面視とは図３Ｂに示した多層構造の給電回路基板２における層面に直交する方向における上方向から見た場合をいう。従って、各ループ電極４ａ、４ｂ、４ｃのループ形状は、平面視で略四角の枠体形状であり、それぞれのループ面が平面視で重なる構成である。 In addition, in this specification, a planar view means the case where it sees from the upper direction in the direction orthogonal to the layer surface in the feeder circuit board 2 of the multilayer structure shown to FIG. 3B. Therefore, the loop shape of each of the loop electrodes 4a, 4b, and 4c is a substantially square frame shape in plan view, and the loop surfaces of the loop electrodes overlap in plan view.
　実施の形態１における給電回路基板２において、表面電極８ａ、８ｂと、ループ電極４ａ、４ｂ、４ｃと、ビアホール導体６ａ、６ｂ、６ｃ、６ｄは、第１表面電極８ａから、第１ビアホール導体６ａ、第１ループ電極４ａ、第２ビアホール導体６ｂ、第２ループ電極４ｂ、第３ビアホール導体６ｃ、第３ループ電極４ｃ、第４ビアホール導体６ｄ、そして第２表面電極８ｂの順に接続されている。このように構成されたインダクタ素子となるコイル導体４が、１対の表面電極８ａ、８ｂに対して接続されている。 In feed circuit substrate 2 in the first embodiment, surface electrodes 8a and 8b, loop electrodes 4a, 4b and 4c, and via hole conductors 6a, 6b, 6c and 6d are connected to first via hole conductor 6a from first surface electrode 8a. The first loop electrode 4a, the second via hole conductor 6b, the second loop electrode 4b, the third via hole conductor 6c, the third loop electrode 4c, the fourth via hole conductor 6d, and the second surface electrode 8b are connected in this order. The coil conductor 4 serving as an inductor element configured as described above is connected to the pair of surface electrodes 8a and 8b.
　給電回路基板２の下面（裏面）には４つの裏面電極９ａ、９ｂ、９ｃ、９ｄが設けられている。裏面電極９ａ、９ｂ、９ｃ、９ｄは、平面視が四角形である給電回路基板２の四隅にそれぞれが独立して形成されている。裏面電極９ａ、９ｂ、９ｃ、９ｄは、平面視が四角の枠体形状のコイル導体４の四隅の直下の領域に配設されており、その形状は略直角に折れ曲がったＬ字形状を有している。実施の形態１における裏面電極９ａ、９ｂ、９ｃ、９ｄのそれぞれは、給電回路基板２の裏面の中心点を基準とする点対称に配置されている。このため、ＲＦＩＣモジュール１０をプリント配線基板のグランド電極３に実装するとき、グランド電極３に対するＲＦＩＣモジュール１０の向き（方向）に関する位置規制を緩和することができる。 Four back surface electrodes 9a, 9b, 9c, and 9d are provided on the lower surface (back surface) of the feed circuit substrate 2. The back surface electrodes 9a, 9b, 9c and 9d are formed independently at four corners of the feeder circuit board 2 which is a square in plan view. The back surface electrodes 9a, 9b, 9c, 9d are disposed in regions immediately below the four corners of the coil conductor 4 having a square frame shape in a plan view, and the shape has an L-shape bent substantially at a right angle ing. Each of back surface electrodes 9a, 9b, 9c, and 9d in the first embodiment is arranged symmetrically with respect to the center point of the back surface of feed circuit board 2. For this reason, when the RFIC module 10 is mounted on the ground electrode 3 of the printed wiring board, it is possible to ease the positional restriction on the direction (direction) of the RFIC module 10 with respect to the ground electrode 3.
　なお、実施の形態１においては、４つの裏面電極（９ａ、９ｂ、９ｃ、９ｄ）を設けた構成で説明したが、コイル導体４に直流的に接続される裏面電極（９ａ）は１つであるため、残りの３つの裏面電極（９ｂ、９ｃ、９ｄ）はダミー電極である。従って、実施の形態１の構成においては、少なくとも１つの裏面電極（９ａ）が設けられていればよい。 In the first embodiment, four back surface electrodes (9a, 9b, 9c, 9d) are provided. However, only one back surface electrode (9a) is connected to coil conductor 4 in a direct current manner. Because of this, the remaining three back electrodes (9b, 9c, 9d) are dummy electrodes. Therefore, in the configuration of the first embodiment, at least one back electrode (9a) may be provided.
　図３Ｂに示すように、第１裏面電極９ａのみが、コイル導体４における中間の位置となる第２ループ電極４ｂに対して、層間を貫通するビアホール導体である接続線５を介して直流的に接続されている。具体的には、第１裏面電極９ａは、コイル導体４における電気長の略中点の位置に対して電気的に直流的に接続されている。 As shown in FIG. 3B, with respect to the second loop electrode 4b in which only the first back surface electrode 9a is at an intermediate position in the coil conductor 4, in a direct current manner via the connection line 5 which is a via hole conductor penetrating the interlayer. It is connected. Specifically, the first back surface electrode 9 a is electrically connected to the position of the substantially middle point of the electrical length in the coil conductor 4 in a direct current manner.
　図４Ａ～図４Ｃは、ＲＦＩＣモジュール１０が搭載されるプリント配線基板１００のグランド電極３と、ＲＦＩＣモジュール１０との位置関係を示す図である。図４ＡはＲＦＩＣモジュール１０が搭載されるグランド電極３におけるスリット部３ｂおよび開口部３ｃを示している。図４Ｂは、ＲＦＩＣモジュール１０におけるコイル導体４と裏面電極９ａ～９ｄとの位置関係を示し、図４Ｃは、グランド電極３にＲＦＩＣモジュール１０が搭載された状態を示している。図４Ｂおよび図４Ｃにおいては、ＲＦＩＣモジュール１０における給電回路基板２のコイル導体４と裏面電極９ａ～９ｄとを示しており、ＲＦＩＣチップ１の図示を省略している。 FIGS. 4A to 4C are diagrams showing the positional relationship between the ground electrode 3 of the printed wiring board 100 on which the RFIC module 10 is mounted and the RFIC module 10. FIG. 4A shows the slit 3 b and the opening 3 c in the ground electrode 3 on which the RFIC module 10 is mounted. FIG. 4B shows the positional relationship between the coil conductor 4 and the back surface electrodes 9a to 9d in the RFIC module 10. FIG. 4C shows a state in which the RFIC module 10 is mounted on the ground electrode 3. In FIG. 4B and FIG. 4C, the coil conductor 4 and the back surface electrodes 9a to 9d of the feeding circuit substrate 2 in the RFIC module 10 are shown, and the illustration of the RFIC chip 1 is omitted.
　図４Ａに示すように、物品の金属面であるグランド電極３における金属面３ａのＲＦＩＣモジュール１０が搭載される位置には、スリット部３ｂおよび開口部３ｃが形成されている。スリット部３ｂは、グランド電極３の縁から内側に延びる隙間であり、その隙間の内側の先端部分に開口部３ｃが形成されている。開口部３ｃは、給電回路基板２のコイル導体４の内側に配設される形状であり、励起されたコイル導体４により生じた磁界（磁束）が通る位置に形成されている。即ち、グランド電極３におけるスリット部３ｂおよび開口部３ｃが非金属部である磁束通過部である。 As shown to FIG. 4A, the slit part 3b and the opening part 3c are formed in the position where the RFIC module 10 of the metal surface 3a in the ground electrode 3 which is a metal surface of articles | goods is mounted. The slit portion 3 b is a gap extending inward from the edge of the ground electrode 3, and an opening 3 c is formed at a tip portion inside the gap. The opening 3 c has a shape disposed inside the coil conductor 4 of the feed circuit board 2, and is formed at a position through which a magnetic field (magnetic flux) generated by the excited coil conductor 4 passes. That is, the slit portion 3 b and the opening 3 c in the ground electrode 3 are magnetic flux passing portions which are non-metal portions.
　また、グランド電極３の金属面３ａにはレジストパターン７が形成されており、給電回路基板２の裏面電極９ａ～９ｄに対向する位置のみにレジスト膜が除去されたレジスト開口７ａ、７ｂ、７ｃ、７ｄが形成されている。即ち、給電回路基板２の裏面電極９ａ～９ｄがレジスト開口７ａ、７ｂ、７ｃ、７ｄを通じてグランド電極３に確実に互いに直流的に接続される。 In addition, a resist pattern 7 is formed on the metal surface 3a of the ground electrode 3, and the resist openings 7a, 7b, 7c are removed only at positions facing the back surface electrodes 9a to 9d of the feed circuit substrate 2. 7d is formed. That is, the back surface electrodes 9a to 9d of the feeder circuit board 2 are connected to the ground electrode 3 in a direct current manner reliably through the resist openings 7a, 7b, 7c, 7d.
　図４Ｃに示すように、ＲＦＩＣモジュール１０は、その縁部分がグランド電極３の縁に接するように配設されており、グランド電極３のスリット部３ｂおよび開口部３ｃがＲＦＩＣモジュール１０の給電回路基板２により略覆われている。即ち、給電回路基板２のコイル導体４のループ面と平面視で重なる領域において、励起されたコイル導体４により生じる磁界（磁束）が通る磁束通過部（３ｂ、３ｃ）が配設されている。 As shown in FIG. 4C, the RFIC module 10 is disposed such that the edge portion thereof is in contact with the edge of the ground electrode 3, and the slit portion 3 b and the opening 3 c of the ground electrode 3 are feed circuit boards of the RFIC module 10. It is almost covered by 2. That is, a magnetic flux passing portion (3b, 3c) through which a magnetic field (magnetic flux) generated by the excited coil conductor 4 passes is disposed in a region overlapping the loop surface of the coil conductor 4 of the feed circuit board 2 in plan view.
　また、グランド電極３の金属面３ａに形成されたレジスト開口７ａ、７ｂ、７ｃ、７ｄは、給電回路基板２のコイル導体４の平面視で直下に配設された裏面電極９ａ～９ｄに確実に位置決めされた状態である。従って、コイル導体４の内側に配置された磁束通過部である開口部３ｃをコイル導体４により生じた磁界（磁束）が通り抜ける。なお、グランド電極３の金属面３ａにおいては、開口部３ｃの縁がスリット部３ｂにより分断されているため、開口部３ｃを周回するループ電流の発生が抑制されている。 Further, the resist openings 7a, 7b, 7c, 7d formed in the metal surface 3a of the ground electrode 3 are surely provided to the back surface electrodes 9a to 9d disposed immediately below the coil conductor 4 of the feed circuit board 2 in plan view. It is in the state of being positioned. Therefore, the magnetic field (magnetic flux) generated by the coil conductor 4 passes through the opening 3 c which is a magnetic flux passing portion disposed inside the coil conductor 4. In the metal surface 3a of the ground electrode 3, since the edge of the opening 3c is divided by the slit 3b, the generation of the loop current around the opening 3c is suppressed.
　実施の形態１の構成においては、グランド電極３に形成されたスリット部３ｂおよび開口部３ｃの磁束通過部を開口部分として説明したが、前述のように磁束通過部は磁界（磁束）が通り抜ける構成であればよく、磁束通過部（スリット部３ｂおよび開口部３ｃ）を磁界（磁束）が通過する材料（例えば、樹脂材料）で構成してもよい。 In the configuration of the first embodiment, the magnetic flux passing portion of the slit portion 3b and the opening 3c formed in the ground electrode 3 is described as the opening portion, but as described above, the magnetic flux passing portion has a configuration in which the magnetic field (magnetic flux) passes through. The magnetic flux passing portion (slit portion 3b and the opening 3c) may be made of a material (for example, a resin material) through which a magnetic field (magnetic flux) passes.
　実施の形態１の構成においては、ＲＦＩＣモジュール１０の給電回路基板２における第１裏面電極９ａがコイル導体４の中間にある第２ループ電極４ｂの一点において接続線５を介して接続されている。第１裏面電極９ａは、１つのレジスト開口（第１レジスト開口７ａ）を通じて露出するグランド電極３の金属面３ａに、導電性ペーストを介して直流的に接続されている。 In the configuration of the first embodiment, the first back surface electrode 9 a of the feeder circuit substrate 2 of the RFIC module 10 is connected through the connection line 5 at one point of the second loop electrode 4 b located in the middle of the coil conductor 4. The first back surface electrode 9a is connected to the metal surface 3a of the ground electrode 3 exposed through one resist opening (first resist opening 7a) in a direct current manner via a conductive paste.
　実施の形態１のプリント配線基板１００においては、ＲＦＩＣモジュール１０の給電回路基板２におけるコイル導体４の中点がグランド電極３におけるコイル導体４の直下に位置する一点で、第１裏面電極９ａを介して、直流的に接続されている。ここで言う、グランド電極３におけるコイル導体の直下の位置は、コイル導体のループ電極の直下およびループ開口の直下を意味する。即ち、給電回路基板２におけるコイル導体４の中点は、グランド電極３の縁近傍の領域において直流的に接続されている。ここで、グランド電極３の縁近傍の領域とは、ＲＦＩＣモジュール１０がグランド電極３の縁部分に搭載された状態において、グランド電極３においてＲＦＩＣモジュールが配設されるモジュール配設面領域、若しくはグランド電極３の縁からモジュール配設面領域までの領域をいう。 In the printed wiring board 100 according to the first embodiment, the middle point of the coil conductor 4 in the feeder circuit board 2 of the RFIC module 10 is located directly below the coil conductor 4 in the ground electrode 3 via the first back electrode 9a. Are connected in a DC manner. Here, the position directly below the coil conductor in the ground electrode 3 means immediately below the loop electrode of the coil conductor and immediately below the loop opening. That is, the middle point of the coil conductor 4 in the feed circuit board 2 is connected in a direct current manner in a region near the edge of the ground electrode 3. Here, the area in the vicinity of the edge of the ground electrode 3 means the module mounting surface area in which the RFIC module is disposed in the ground electrode 3 or the ground in the state where the RFIC module 10 is mounted on the edge portion of the ground electrode 3 This refers to the area from the edge of the electrode 3 to the module mounting surface area.
　上記のように、実施の形態１のプリント配線基板１００においては、給電回路基板２のコイル導体４の略中点がグランド電極３の縁近傍の一カ所で直流的に接続されているため、励起したコイル導体４からの高周波電流がグランド電極３の縁部に沿って流れて、当該グランド電極３が送信アンテナとして機能する。また、逆に受信アンテナとして機能するグランド電極３ではその縁部に高周波電流が流れることにより、ＲＦＩＣモジュール１０において受信可能な構成となる。 As described above, in the printed wiring board 100 of the first embodiment, since approximately the midpoint of the coil conductor 4 of the feeding circuit board 2 is connected in a direct current manner at one place near the edge of the ground electrode 3 The high frequency current from the coil conductor 4 flows along the edge of the ground electrode 3, and the ground electrode 3 functions as a transmitting antenna. On the contrary, in the ground electrode 3 which functions as a receiving antenna, the RFIC module 10 can receive signals by the high frequency current flowing through the edge thereof.
　なお、実施の形態１における給電回路基板２のコイル導体４は、１つのコイル状部を備え、そのコイル中心軸が縦方向（図３Ｂにおける上下方向）に配設されている。しかし、本発明の実施の形態に係るコイル導体は、このような構成に限定されるものではない。 The coil conductor 4 of the feeder circuit board 2 in the first embodiment includes one coil-shaped portion, and the central axis of the coil is disposed in the vertical direction (vertical direction in FIG. 3B). However, the coil conductor according to the embodiment of the present invention is not limited to such a configuration.
　図５は、給電回路基板（２０）におけるコイル導体（４０）の変形例を示す模式図である。図５に示す変形例においては、給電回路基板２０のコイル導体４０は、２つのコイル状部４Ａ、４Ｂから構成されている。２つのコイル状部４Ａ、４Ｂは、並設され、電気的に直列に接続されている。また、２つのコイル状部４Ａ、４Ｂのコイル中心軸は、互いに平行であって、縦方向に延在している。このように構成したコイル導体４０においては、２つのコイル状部４Ａ、４Ｂが互いに直列接続する直列接続位置が、裏面電極９ａに対して接続線５を介して直流的に接続される、すなわちコイル導体４０の中点と裏面電極９ａとが接続される。 FIG. 5: is a schematic diagram which shows the modification of the coil conductor (40) in a feed circuit board (20). In the modification shown in FIG. 5, the coil conductor 40 of the feed circuit board 20 is composed of two coiled parts 4A and 4B. The two coiled parts 4A, 4B are juxtaposed and electrically connected in series. The coil central axes of the two coiled parts 4A and 4B are parallel to each other and extend in the longitudinal direction. In the coil conductor 40 configured in this manner, the series connection position where the two coil-shaped portions 4A and 4B are connected in series with each other is DC-connected to the back surface electrode 9a via the connection wire 5, that is, the coil The middle point of the conductor 40 and the back electrode 9a are connected.
　コイル導体において、図５に示すように２つのコイル状部４Ａ、４Ｂを並設することに代わって、それぞれのコイル中心軸が重なるように一方のコイル状部の内部に他方のコイル状部を配置してもよい。すなわち、本発明の構成において、給電回路基板（２、２０）におけるコイル導体（４、４０）の構成としては、積層構造の給電回路基板（２、２０）において、コイル導体（４、４０）の電気長の略中点と裏面電極（９ａ）とを接続線（５）を介して直流的に接続できる構成であればよい。 In the coil conductor, instead of juxtaposing the two coiled parts 4A and 4B as shown in FIG. 5, the other coiled part is formed in one coiled part so that the respective coil central axes overlap. It may be arranged. That is, in the configuration of the present invention, as the configuration of the coil conductor (4, 40) in the feed circuit substrate (2, 20), the coil conductor (4, 40) in the feed circuit substrate (2, 20) of the laminated structure It is sufficient if it has a configuration in which the substantially midpoint of the electrical length and the back surface electrode (9a) can be connected in a direct current manner via the connection line (5).
　上記のように構成された実施の形態１のＲＦＩＣチップ付きプリント配線基板１００においては、ＲＦＩＣモジュール１０の給電回路基板２のコイル導体の略中点（より好ましくは電気長の中点）をアンテナ（放射板）となるグランド電極３の特定の位置（一点）で直流的に接続（ＤＣ接続）する構成である。このため、実施の形態１のプリント配線基板１００は、取付けの自由度および電力伝達効率が高い構成となり、更に小型化、軽量化、および低コスト化を達成することができる構成となる。 In the printed wiring board 100 with the RFIC chip of Embodiment 1 configured as described above, the approximate midpoint of the coil conductor (more preferably, the midpoint of the electrical length) of the coil conductor of the feeding circuit board 2 of the RFIC module 10 is used as an antenna. Direct current connection (DC connection) is made at a specific position (one point) of the ground electrode 3 to be the radiation plate). For this reason, the printed wiring board 100 according to the first embodiment is configured to have a high degree of freedom of attachment and a high power transfer efficiency, and can be configured to be further reduced in size, weight and cost.
　《実施の形態２》
　以下、本発明に係る実施の形態２のＲＦＩＣチップ付き物品であるプリント配線基板について説明する。実施の形態２のプリント配線基板に関しては、実施の形態１のプリント配線基板１００との相違点を中心に説明する。なお、実施の形態２の説明において、前述の実施の形態１と同様の構成、作用および機能を有する要素には同じ参照符号を付し、重複する記載を避けるため説明を省略する場合がある。 Second Embodiment
Hereinafter, the printed wiring board which is an article with an RFIC chip of Embodiment 2 concerning the present invention is explained. The printed wiring board of the second embodiment will be described focusing on differences from the printed wiring board 100 of the first embodiment. In the description of the second embodiment, elements having the same configurations, operations and functions as the first embodiment described above are denoted by the same reference numerals, and the description may be omitted to avoid redundant description.
　実施の形態２のＲＦＩＣチップ付きプリント配線基板において、実施の形態１のプリント配線基板１００との相違点は、プリント配線基板のグランド電極（３Ａ）に対するＲＦＩＣチップ１を備えるＲＦＩＣモジュール（１０Ａ）の配設位置である。なお、実施の形態２におけるＲＦＩＣモジュール（１０Ａ）は、実施の形態１におけるＲＦＩＣモジュール１０と実質的に同じ構成であるが、給電回路基板（１２）の裏面に形成された裏面電極（１９Ａ）が１つであり、その形状が四角形形状（略正方形形状）である点で異なっている。実施の形態２のプリント配線基板は、実施の形態１の構成と同様に、グランド電極（３Ａ）をアンテナとしたＲＦＩＣモジュール（１０Ａ）によりＵＨＦ帯の通信周波数（キャリア周波数）を有する高周波信号で無線通信するよう構成されており、広い周波数帯域で無線通信可能に構成されている。 The difference between the printed wiring board with the RFIC chip of the second embodiment and the printed wiring board 100 of the first embodiment is that the RFIC module (10A) including the RFIC chip 1 with respect to the ground electrode (3A) of the printed wiring board. It is a setting position. Although the RFIC module (10A) in the second embodiment has substantially the same configuration as the RFIC module 10 in the first embodiment, the back electrode (19A) formed on the back surface of the feeder circuit board (12) is It is different in that it is one and its shape is quadrangular (substantially square). As in the configuration of the first embodiment, the printed wiring board of the second embodiment is a radio frequency signal having a communication frequency (carrier frequency) in the UHF band by the RFIC module (10A) using the ground electrode (3A) as an antenna. It is configured to communicate, and configured to be capable of wireless communication in a wide frequency band.
　図６は、実施の形態２のＲＦＩＣチップ付きプリント配線基板における一部を拡大し、グランド電極３Ａに搭載されるＲＦＩＣモジュール１０Ａの搭載位置を示す斜視図である。実施の形態２の構成においては、実施の形態１の構成と同様に、物品がプリント配線基板であり、物品における金属物がグランド電極３Ａである。図６に示すように、平板状のグランド電極３Ａの金属面３Ａａの縁上にＲＦＩＣモジュール１０Ａが搭載される構成である。 FIG. 6 is a perspective view showing a mounting position of an RFIC module 10A mounted on the ground electrode 3A by enlarging a part of the printed wiring board with the RFIC chip of the second embodiment. In the configuration of the second embodiment, as in the configuration of the first embodiment, the article is a printed wiring board, and the metal in the article is the ground electrode 3A. As shown in FIG. 6, the RFIC module 10A is mounted on the edge of the metal surface 3Aa of the flat ground electrode 3A.
　図７は、ＲＦＩＣモジュール１０Ａがグランド電極３Ａの金属面３Ａａの縁上に搭載された状態を示す平面図である。図７においては、ＲＦＩＣモジュール１０Ａにおける給電回路基板１２のコイル導体４と裏面電極１９Ａとを示し、ＲＦＩＣチップ１の図示は省略している。図７に示すように、給電回路基板１２のコイル導体４がグランド電極３Ａの縁から突出するように配設されている。言い換えると、給電回路基板１２のコイル導体４の一部分がグランド電極３Ａ上に配置されており、コイル導体４の残りの部分がグランド電極３Ａから外れた位置に配置されている。従って、励起したコイル導体４により生じる磁界（磁束）は、グランド電極３Ａの金属面３Ａａから外れた領域を通り抜ける構成である。即ち、コイル導体４のループ面が平面視で金属面３Ａａの縁と重なるように配置され、コイル導体４のループ面の一部が平面視で磁束通過部と重なる構成となっている。 FIG. 7 is a plan view showing a state in which the RFIC module 10A is mounted on the edge of the metal surface 3Aa of the ground electrode 3A. In FIG. 7, the coil conductor 4 and the back surface electrode 19A of the feeder circuit substrate 12 in the RFIC module 10A are shown, and the illustration of the RFIC chip 1 is omitted. As shown in FIG. 7, the coil conductor 4 of the feed circuit board 12 is disposed so as to protrude from the edge of the ground electrode 3A. In other words, a part of the coil conductor 4 of the feed circuit board 12 is disposed on the ground electrode 3A, and the remaining part of the coil conductor 4 is disposed at a position deviated from the ground electrode 3A. Therefore, the magnetic field (magnetic flux) generated by the excited coil conductor 4 passes through the region out of the metal surface 3Aa of the ground electrode 3A. That is, the loop surface of the coil conductor 4 is disposed so as to overlap the edge of the metal surface 3Aa in plan view, and a part of the loop surface of the coil conductor 4 overlaps the magnetic flux passing portion in plan view.
　なお、グランド電極３Ａから外れた位置に配置されたコイル導体４の残りの部分は、グランド電極３Ａから突設された構成でもよいが、磁界（磁束）が通り抜ける材料（例えば樹脂材料）をグランド電極３Ａと同一平面となるように設けて、コイル導体４の残りの部分を磁界（磁束）が通り抜ける材料で構成された部材で支持する構成でもよい。また、給電回路基板１２の裏面に形成された裏面電極としては、前述の実施の形態１の構成のように給電回路基板１２の裏面の四隅に設ける構成でもよい。ここでは、励起したコイル導体４による磁界（磁束）が通り抜ける部分が非金属部である磁束通過部となる。 The remaining portion of the coil conductor 4 disposed at a position deviated from the ground electrode 3A may be configured to protrude from the ground electrode 3A, but a material (for example, a resin material) through which a magnetic field (magnetic flux) passes The remaining portion of the coil conductor 4 may be supported by a member made of a material through which a magnetic field (magnetic flux) passes, provided so as to be flush with 3A. The back surface electrode formed on the back surface of feed circuit board 12 may be provided at the four corners of the back surface of feed circuit board 12 as in the configuration of the first embodiment described above. Here, the portion through which the magnetic field (magnetic flux) of the excited coil conductor 4 passes is the magnetic flux passing portion which is a nonmetal portion.
　上記のように、実施の形態２のＲＦＩＣチップ付きプリント配線基板においては、給電回路基板１２のコイル導体４の略中点（より好ましくは電気長の中点）がグランド電極３Ａの縁近傍に直流的に接続されている。このため、励起したコイル導体４からの高周波電流は、グランド電極３Ａの縁部に沿って流れて、当該グランド電極３Ａが送信アンテナとして機能する。また、逆に受信アンテナとして機能するグランド電極３Ａでは、その金属面３Ａａの縁部に高周波電流が流れることにより、ＲＦＩＣモジュール１０Ａにおいて受信可能な構成となる。 As described above, in the printed wiring board with the RFIC chip of the second embodiment, the approximate midpoint of the coil conductor 4 of the feed circuit board 12 (more preferably, the midpoint of the electrical length) is DC near the edge of the ground electrode 3A. Connected. For this reason, the high frequency current from the excited coil conductor 4 flows along the edge of the ground electrode 3A, and the ground electrode 3A functions as a transmission antenna. On the contrary, in the ground electrode 3A functioning as a receiving antenna, the RFIC module 10A can receive signals by the high frequency current flowing through the edge of the metal surface 3Aa.
　なお、実施の形態２における給電回路基板１２のコイル導体４の構成においても、前述の図５に示したように併設した２つのコイル状部を直列接続して、その直列接続点と裏面電極９Ａとを接続線５により直流的に接続する構成でもよい。 Also in the configuration of coil conductor 4 of feed circuit substrate 12 in the second embodiment, two coil-shaped portions juxtaposed as shown in FIG. 5 described above are connected in series, and the serial connection point and back surface electrode 9A May be connected in a direct current manner by the connection line 5.
　上記のように構成された実施の形態２のＲＦＩＣチップ付きプリント配線基板においては、ＲＦＩＣモジュール１０Ａの給電回路基板２のコイル導体４の略中点（より好ましくは電気長の中点）をアンテナ（放射板）となるグランド電極３Ａの縁近傍の一カ所で直流的に接続（ＤＣ接続）する構成である。このため、実施の形態２のプリント配線基板は、取付けの自由度および電力伝達効率が高い構成となり、更に小型化、軽量化、および低コスト化を達成することができる構成となる。 In the printed wiring board with the RFIC chip of the second embodiment configured as described above, the approximate midpoint (more preferably, the midpoint of the electrical length) of the coil conductor 4 of the feeding circuit board 2 of the RFIC module 10A is used as an antenna It is a structure connected in a direct-current manner (DC connection) at one place near the edge of the ground electrode 3A to be a radiation plate). For this reason, the printed wiring board of the second embodiment has a configuration with high degree of freedom of attachment and power transfer efficiency, and can achieve further downsizing, weight reduction and cost reduction.
　《実施の形態３》
　以下、本発明に係る実施の形態３のＲＦＩＣチップ付き物品であるプリント配線基板について説明する。実施の形態３のプリント配線基板に関しては、実施の形態１および実施の形態２のプリント配線基板との相違点を中心に説明する。なお、実施の形態３の説明において、前述の実施の形態１と同様の構成、作用および機能を有する要素には同じ参照符号を付し、重複する記載を避けるため説明を省略する場合がある。 Third Embodiment
Hereinafter, a printed wiring board which is an article with an RFIC chip of the third embodiment according to the present invention will be described. The printed wiring board of the third embodiment will be described focusing on differences from the printed wiring boards of the first embodiment and the second embodiment. In the description of the third embodiment, elements having the same configurations, operations, and functions as the first embodiment described above are denoted by the same reference numerals, and the description may be omitted to avoid redundant description.
　実施の形態３のＲＦＩＣチップ付きプリント配線基板において、実施の形態１のプリント配線基板との相違点は、プリント配線基板のグランド電極（３Ｂ）の形状と、グランド電極（３Ｂ）に対するＲＦＩＣチップ１を備えるＲＦＩＣモジュール（１０Ａ）の配設位置である。実施の形態３におけるＲＦＩＣモジュール（１０Ａ）は、実施の形態２におけるＲＦＩＣモジュール１０Ａと実質的に同じ構成である。実施の形態３のプリント配線基板は、実施の形態１および実施の形態２の構成と同様に、グランド電極（３Ｂ）をアンテナとしたＲＦＩＣモジュール（１０Ａ）によりＵＨＦ帯の通信周波数（キャリア周波数）を有する高周波信号で無線通信するよう構成されており、広い周波数帯域で無線通信可能に構成されている。 The printed wiring board with RFIC chip of the third embodiment differs from the printed wiring board of the first embodiment in the shape of the ground electrode (3B) of the printed wiring board and the RFIC chip 1 corresponding to the ground electrode (3B). It is an arrangement position of the RFIC module (10A) provided. The RFIC module (10A) in the third embodiment has substantially the same configuration as the RFIC module 10A in the second embodiment. The printed wiring board of the third embodiment has the communication frequency (carrier frequency) in the UHF band by the RFIC module (10A) using the ground electrode (3B) as an antenna, as in the configurations of the first embodiment and the second embodiment. It is configured to perform wireless communication with a high frequency signal that it has, and is configured to enable wireless communication in a wide frequency band.
　図８は、実施の形態３のＲＦＩＣチップ付きプリント配線基板における一部を拡大し、グランド電極３Ｂに搭載されるＲＦＩＣモジュール１０Ａの搭載位置を示す斜視図である。実施の形態３の構成においては、物品がプリント配線基板であり、物品における金属物がグランド電極３Ｂである。図８に示すように、平板状のグランド電極３Ｂの金属面３Ｂａの縁上にＲＦＩＣモジュール１０Ａが搭載される構成である。 FIG. 8 is a perspective view showing a mounting position of an RFIC module 10A mounted on a ground electrode 3B by enlarging a part of the printed wiring board with an RFIC chip of the third embodiment. In the configuration of the third embodiment, the article is a printed wiring board, and the metal in the article is the ground electrode 3B. As shown in FIG. 8, the RFIC module 10A is mounted on the edge of the metal surface 3Ba of the flat ground electrode 3B.
　実施の形態３のＲＦＩＣチップ付きプリント配線基板において、ＲＦＩＣモジュール１０Ａが搭載されるグランド電極３Ｂの金属面３Ｂａには磁束通過部としてのスリット部３Ｂｂが形成されている。スリット部３Ｂｂは、グランド電極３Ｂの縁から内側に延びる隙間形状を有しており、そのスリット部３Ｂｂを跨ぐようにＲＦＩＣモジュール１０Ａが搭載される。 In the printed wiring board with the RFIC chip of the third embodiment, a slit portion 3Bb as a magnetic flux passing portion is formed on the metal surface 3Ba of the ground electrode 3B on which the RFIC module 10A is mounted. The slit portion 3Bb has a gap shape extending inward from the edge of the ground electrode 3B, and the RFIC module 10A is mounted so as to straddle the slit portion 3Bb.
　図９は、ＲＦＩＣモジュール１０Ａがグランド電極３Ｂの金属面３Ｂａの縁上に搭載された状態を示す平面図である。図９においては、ＲＦＩＣモジュール１０Ａにおける給電回路基板１２のコイル導体４と裏面電極１９Ａとを示し、ＲＦＩＣチップ１の図示は省略している。図９に示すように、給電回路基板１２のコイル導体４がグランド電極３Ｂの縁から突出するように配設されている。言い換えると、給電回路基板１２のコイル導体４の一部分がグランド電極３Ｂ上に配置されており、コイル導体４の残りの部分がグランド電極３Ｂから外れた位置に配置されている。従って、励起したコイル導体４により生じる磁界（磁束）がグランド電極３Ｂの金属面３Ｂａから外れた領域を通り抜ける構成である。即ち、コイル導体４のループ面が平面視で金属面３Ｂａの縁と重なるように配置され、コイル導体４のループ面の一部が平面視で磁束通過部と重なる構成となる。 FIG. 9 is a plan view showing a state in which the RFIC module 10A is mounted on the edge of the metal surface 3Ba of the ground electrode 3B. In FIG. 9, the coil conductor 4 and the back surface electrode 19A of the feeder circuit substrate 12 in the RFIC module 10A are shown, and the illustration of the RFIC chip 1 is omitted. As shown in FIG. 9, the coil conductor 4 of the feed circuit board 12 is disposed so as to protrude from the edge of the ground electrode 3B. In other words, a part of the coil conductor 4 of the feeding circuit board 12 is disposed on the ground electrode 3B, and the remaining part of the coil conductor 4 is disposed at a position deviated from the ground electrode 3B. Therefore, the magnetic field (magnetic flux) generated by the excited coil conductor 4 passes through the region out of the metal surface 3Ba of the ground electrode 3B. That is, the loop surface of the coil conductor 4 is disposed so as to overlap the edge of the metal surface 3Ba in plan view, and a part of the loop surface of the coil conductor 4 overlaps the magnetic flux passing portion in plan view.
　また、実施の形態３の構成においては、グランド電極３Ｂの金属面３Ｂａに形成されたスリット部３Ｂｂを跨ぐようにＲＦＩＣモジュール１０Ａの給電回路基板１２が配置されている。即ち、グランド電極３Ｂの縁から延設されたスリット部３Ｂｂにおける縁部を含むスリットの一部が給電回路基板１２のコイル導体４と平面視で交差する構成となっている。従って、グランド電極３Ｂの縁から延設されたスリット部３Ｂｂの先端部分（内側部分）の領域は、ＲＦＩＣモジュール１０Ａのモジュール配設面領域から外れた領域である。 Further, in the configuration of the third embodiment, the feeder circuit board 12 of the RFIC module 10A is disposed so as to straddle the slit portion 3Bb formed on the metal surface 3Ba of the ground electrode 3B. That is, a part of the slit including the edge portion of the slit portion 3Bb extended from the edge of the ground electrode 3B intersects with the coil conductor 4 of the feed circuit substrate 12 in a plan view. Therefore, the region of the tip portion (inner portion) of the slit portion 3Bb extended from the edge of the ground electrode 3B is a region out of the module mounting surface region of the RFIC module 10A.
　さらに、実施の形態３の構成において、給電回路基板１２のコイル導体４の略中点に接続線５および裏面電極１９Ａを介して直流的に接続される接続点は、グランド電極３Ｂにおいてスリット部３Ｂｂで分けられた片側の領域の縁近傍である。即ち、コイル導体４の略中点は、グランド電極３Ｂにおける縁近傍であるモジュール配設面領域において接続線５および裏面電極１９Ａを介して直流的に接続される構成である。 Furthermore, in the configuration of the third embodiment, the connection point connected in a direct current manner to the approximate midpoint of coil conductor 4 of feed circuit board 12 via connection line 5 and back surface electrode 19A is slit portion 3Bb at ground electrode 3B. It is near the edge of the area of one side divided by. That is, the substantially middle point of the coil conductor 4 is connected in a direct current manner via the connection line 5 and the back surface electrode 19A in the module mounting surface area near the edge of the ground electrode 3B.
　上記のように構成された実施の形態３の構成においては、給電回路基板１２における励起したコイル導体４により生じる磁界（磁束）がグランド電極３Ｂの金属面３Ｂａから平面視で外れた領域を通り抜ける構成を有すると共に、グランド電極３ＢにおけるＲＦＩＣモジュール１０Ａのモジュール配設面領域にスリット部３Ｂｂが形成されているため、モジュール配設面領域において電力伝達効率を劣化させる電流の流れを抑制する構成となる。 In the configuration of the third embodiment configured as described above, the magnetic field (magnetic flux) generated by the excited coil conductor 4 in the feed circuit board 12 passes through the region out of the metal surface 3Ba of the ground electrode 3B in plan view. Since the slit portion 3Bb is formed in the module mounting surface area of the RFIC module 10A in the ground electrode 3B, the flow of current that degrades the power transfer efficiency in the module mounting surface area is suppressed.
　上記のように、実施の形態３のＲＦＩＣチップ付きプリント配線基板においては、給電回路基板１２のコイル導体４の略中点がグランド電極３Ｂの縁の近傍に直流的に接続され、グランド電極３Ｂにスリット部３Ｂｂを設けた構成を有している。このため、励起したコイル導体４からの高周波電流は、グランド電極３Ｂの縁部に沿って流れて、当該グランド電極３Ｂが送信アンテナとして機能する。また、逆に受信アンテナとして機能するグランド電極３Ｂでは、その金属面３Ｂａの縁部に高周波電流が流れることにより、ＲＦＩＣモジュール１０Ａにおいて受信可能な構成となる。 As described above, in the printed wiring board with the RFIC chip of the third embodiment, the substantially middle point of the coil conductor 4 of the feeding circuit board 12 is DC connected near the edge of the ground electrode 3B and is connected to the ground electrode 3B. It has the structure which provided slit part 3Bb. Therefore, the high frequency current from the excited coil conductor 4 flows along the edge of the ground electrode 3B, and the ground electrode 3B functions as a transmitting antenna. On the contrary, in the ground electrode 3B functioning as a receiving antenna, the RFIC module 10A can receive signals by the high frequency current flowing through the edge portion of the metal surface 3Ba.
　上記のように構成された実施の形態３のＲＦＩＣチップ付き物品であるプリント配線基板においては、ＲＦＩＣモジュール１０Ａの給電回路基板１２のコイル導体４の略中点（より好ましくは電気長の中点）をアンテナ（放射板）となるグランド電極３Ｂの縁近傍の一カ所で直流的に接続（ＤＣ接続）する構成である。このため、実施の形態３のプリント配線基板は、取付けの自由度が高く、更に高い電力伝達効率を有する構成となり、小型化、軽量化、および低コスト化を達成することができる構成となる。 In the printed wiring board which is the article with the RFIC chip of the third embodiment configured as described above, substantially the middle point of the coil conductor 4 of the feeding circuit board 12 of the RFIC module 10A (more preferably, middle point of electrical length) Are connected in a direct current manner (DC connection) at one place near the edge of the ground electrode 3B to be an antenna (radiation plate). For this reason, the printed wiring board of the third embodiment has a high degree of freedom of attachment, and has a configuration with higher power transfer efficiency, and can achieve downsizing, weight reduction, and cost reduction.
　《応用例》
　前述の実施の形態１～３においては、ＲＦＩＣチップ付き物品としてプリント配線基板を用いて、金属物をグランド電極として説明したが、本発明のＲＦＩＣチップ付き物品としては金属物をアンテナとして利用することができる各種物品に適用することが可能である。 << Example of application >>
In the first to third embodiments described above, a metal is described as a ground electrode using a printed wiring board as an article with an RFIC chip, but a metal is used as an antenna as an article with an RFIC chip of the present invention. It is possible to apply to various articles which can
　図１０は、本発明のＲＦＩＣチップ付き物品の応用例の一例を示しており、物品として鋼製の小物である金属製外科手術用具である鉗子１００に用いた具体例である。図１０に示すように、鉗子１００における指孔が形成されたハンドルの一方には、ＲＦＩＣモジュール１０１が搭載される取付面１００ａが設けられている。鉗子１００に設けた金属面となる取付面１００ａは、平面視が平板な円形であり、その一部にスリット部１００ｂが形成されている。 FIG. 10 shows an example of application of the article with an RFIC chip according to the present invention, which is an example used for the forceps 100 which is a metallic surgical tool which is a small accessory made of steel as the article. As shown in FIG. 10, a mounting surface 100a on which the RFIC module 101 is mounted is provided on one of the handles of the forceps 100 in which finger holes are formed. The mounting surface 100a which becomes a metal surface provided in the insulator 100 is flat-plate circular [planar view], and the slit part 100b is formed in the part.
　図１０では、鉗子１００の一部を示しており、鉗子１００にＲＦＩＣモジュール１０１が搭載された状態を示す平面図である。また、図１０は、鉗子１００の取付面１００ａに平面視が円形のＲＦＩＣモジュール１０１が搭載された状態を示している。図１０において、破線の丸印ＰはＲＦＩＣモジュール１０１に設けられているコイル導体１０２の中点が取付面１００ａに対して直流的に接続されていることを示している。コイル導体１０２の中点が直流的に接続される取付面１００ａの取付位置は、平面視におけるコイル導体１０２のモジュール配設面領域の直下であり、取付面１００ａの外縁近傍であり、スリット部１００ｂの近傍の位置である。 FIG. 10 shows a part of the forceps 100 and is a plan view showing a state in which the RFIC module 101 is mounted on the forceps 100. Further, FIG. 10 shows a state in which the RFIC module 101 having a circular plan view is mounted on the mounting surface 100 a of the forceps 100. In FIG. 10, a dotted circle P indicates that the middle point of the coil conductor 102 provided in the RFIC module 101 is connected to the mounting surface 100a in a direct current manner. The mounting position of the mounting surface 100a to which the middle point of the coil conductor 102 is connected in a direct current manner is directly below the module mounting surface area of the coil conductor 102 in plan view and near the outer edge of the mounting surface 100a. Position of the
　ＲＦＩＣモジュール１０１におけるコイル導体１０２は、磁束通過部であるスリット部１００ｂと平面視で交差するように配置されている。その結果、励起されたコイル導体１０２により生じる磁界（磁束）がスリット部１００ｂを通り抜ける構成となる。 The coil conductor 102 in the RFIC module 101 is disposed to intersect the slit portion 100 b which is a magnetic flux passing portion in plan view. As a result, the magnetic field (magnetic flux) generated by the excited coil conductor 102 passes through the slit portion 100 b.
　なお、図１０に示す鉗子１００においては、円形の取付面１００ａに対して、取付面１００ａより直径が小さい円形のＲＦＩＣモジュール１０１を同心円的に搭載する構成であるが、前述の実施の形態１～３において説明した構成でも対応可能である。即ち、実施の形態１において説明したように、スリット部（３ｂ）に加えて開口部（３ｃ）を形成して、その開口部を平面視で取り囲むようにコイル導体（１０２）を配設する構成（図１参照）でもよい。また、実施の形態２において説明したように、取付面（１００ａ）の一部が金属面となる構成として、励起したコイル導体（１０２）において生じる磁界（磁束）が取付面（１００ａ）を通り抜ける構成（図７参照）でもよい。更に、実施の形態３において説明したように、取付面（１００ａ）の一部を金属面で構成し、その金属面にスリット部（３Ｂｂ）を設けた構成（図９参照）でもよい。 In the forceps 100 shown in FIG. 10, a circular RFIC module 101 having a diameter smaller than that of the mounting surface 100a is concentrically mounted on the circular mounting surface 100a. The configuration described in 3 is also applicable. That is, as described in the first embodiment, in addition to the slit portion (3b), the opening portion (3c) is formed, and the coil conductor (102) is disposed to surround the opening portion in plan view. (See FIG. 1). Further, as described in the second embodiment, as a configuration in which a part of the mounting surface (100a) is a metal surface, a magnetic field (magnetic flux) generated in the excited coil conductor (102) passes through the mounting surface (100a) (See FIG. 7). Furthermore, as described in the third embodiment, a part of the attachment surface (100a) may be formed of a metal surface, and a slit portion (3Bb) may be provided on the metal surface (see FIG. 9).
　以上、上述の実施の形態１～３を挙げて本発明を説明したが、本発明はこれらの実施の形態に限定されない。 The present invention has been described above by citing the above-described first to third embodiments, but the present invention is not limited to these embodiments.
　例えば、プリント配線基板におけるグランド電極に形成され、ＲＦＩＣモジュールのコイル導体から発生した磁束が通過する磁束通過部は、上述の実施の形態１～３における磁束通過部以外の形態も可能である。 For example, the magnetic flux passing portion formed on the ground electrode in the printed wiring board and through which the magnetic flux generated from the coil conductor of the RFIC module passes may be in a form other than the magnetic flux passing portion in the first to third embodiments described above.
　《実施の形態４》
　図１１は、実施の形態４のＲＦＩＣチップ付きプリント配線基板における一部を拡大し、グランド電極に搭載されるＲＦＩＣモジュールの搭載位置を示す斜視図である。図１２は、グランド電極にＲＦＩＣモジュールが搭載された状態を示す図である。図１３は、ＲＦＩＣモジュールの給電回路基板におけるコイル導体などの構成を模式的に示す斜視図である。 Fourth Embodiment
FIG. 11 is an enlarged perspective view of a part of the printed wiring board with an RFIC chip of the fourth embodiment and a mounting position of the RFIC module mounted on the ground electrode. FIG. 12 is a diagram showing the RFIC module mounted on the ground electrode. FIG. 13 is a perspective view schematically showing the configuration of a coil conductor and the like on the feed circuit board of the RFIC module.
　図１１に示すように、プリント配線基板におけるグランド電極３Ｃは、磁束通過部として、グランド電極３Ｃの端面３Ｃｂから内側に向かって窪み、平面視でＶ字形状の切欠き部３Ｃｃを備える。また、グランド電極３Ｃには、切欠き部３Ｃｃに沿って設けられたＬ字形状のレジスト開口１７が形成されている。 As shown in FIG. 11, the ground electrode 3C in the printed wiring board is recessed inwardly from an end face 3Cb of the ground electrode 3C as a magnetic flux passing portion, and has a V-shaped notch 3Cc in plan view. Further, an L-shaped resist opening 17 provided along the notch 3Cc is formed in the ground electrode 3C.
　図１２に示すように、ＲＦＩＣモジュール１０Ｂは、一部が切欠き部３Ｃｃを覆うようにグランド電極３Ｃの金属面３Ｃａ（金属面３Ｃａ上のレジストパターン）に搭載されている。 As shown in FIG. 12, the RFIC module 10B is mounted on the metal surface 3Ca (a resist pattern on the metal surface 3Ca) of the ground electrode 3C so that a part of the RFIC module 10B covers the notch 3Cc.
　図１３に示すように、ＲＦＩＣモジュール１０Ｂの給電回路基板２２は、上述の実施の形態１～３と異なる裏面電極２９を備える。具体的には、給電回路基板２２は、大きさが異なる２つのＬ字形状の裏面電極２９ａ、２９ｂを備える。裏面電極２９ａは、裏面電極２９ｂに比べて大きいサイズを備え、コイル導体４の略中点に接続線５を介して接続されている。小さい方の裏面電極２９ｂは、ダミー電極である。また、裏面電極２９ａ、２９ｂは、平面視で、給電回路基板２２の対角方向に対向している。 As shown in FIG. 13, the feeder circuit board 22 of the RFIC module 10B is provided with a back electrode 29 different from the above-described first to third embodiments. Specifically, the feeder circuit board 22 includes two L-shaped back surface electrodes 29a and 29b having different sizes. The back surface electrode 29 a has a size larger than that of the back surface electrode 29 b, and is connected to a substantially middle point of the coil conductor 4 via the connection line 5. The smaller back electrode 29b is a dummy electrode. The back surface electrodes 29a and 29b face each other in the diagonal direction of the feed circuit board 22 in plan view.
　給電回路基板２２の裏面電極２９ａが、レジスト開口１７を通じて露出するグランド電極３Ｃの金属面３Ｃａに、導電ペーストを介して直流的に接続される。 The back surface electrode 29a of the feeding circuit substrate 22 is connected to the metal surface 3Ca of the ground electrode 3C exposed through the resist opening 17 in a direct current manner via a conductive paste.
　なお、このようなＲＦＩＣモジュール１０Ｂは、Ｖ次状の切欠き部３Ｃｃを備えるグランド電極３Ｃと異なるグランド電極にも搭載可能である。 Such an RFIC module 10B can also be mounted on a ground electrode different from the ground electrode 3C provided with the V-shaped notch 3Cc.
　図１４は、実施の形態４の変形例のＲＦＩＣチップ付きプリント配線基板における一部を拡大して示す斜視図である。図１５は、グランド電極にＲＦＩＣモジュールが搭載された状態を示す図である。 FIG. 14 is an enlarged perspective view showing a part of a printed wiring board with an RFIC chip of a modification of the fourth embodiment. FIG. 15 is a diagram showing the RFIC module mounted on the ground electrode.
　図１４および図１５に示すように、プリント配線基板のグランド電極３Ｄは、上述の実施の形態１のグランド電極３と同様に、スリット部３Ｄｂと開口部３Ｄｃとを備える。開口部３Ｄｃを挟んで対向するように、大きさが異なる２つのＬ字形状のレジスト開口２７ａ、２７ｂが形成されている。大きい方のレジスト開口２７ａを通じて露出するグランド電極３Ｄの金属面３Ｄａに、ＲＦＩＣモジュール１０Ｂの給電回路基板２２の裏面電極２９ａが導電ペーストを介して直流的に接続される。 As shown in FIGS. 14 and 15, the ground electrode 3D of the printed wiring board is provided with a slit portion 3Db and an opening 3Dc in the same manner as the ground electrode 3 of the first embodiment described above. Two L-shaped resist openings 27a and 27b having different sizes are formed to face each other with the opening 3Dc interposed therebetween. The back surface electrode 29a of the feeder circuit board 22 of the RFIC module 10B is connected to the metal surface 3Da of the ground electrode 3D exposed through the larger resist opening 27a in a direct current manner via the conductive paste.
　また、上述の実施の形態１～３の場合、ＲＦＩＣモジュールの給電回路基板のコイル導体に接続されている１つの裏面電極は、１つのレジスト開口を通じて露出するグランド電極の金属面に直流的に接続されている、すなわち一点でグランド電極に接続されている。しかしながら、本発明の実施の形態はこれに限らない。 Further, in the case of Embodiments 1 to 3 described above, one back surface electrode connected to the coil conductor of the feeding circuit substrate of the RFIC module is DC connected to the metal surface of the ground electrode exposed through one resist opening Being connected to the ground electrode at one point. However, the embodiment of the present invention is not limited to this.
　《実施の形態５》
　図１６は、実施の形態５のＲＦＩＣチップ付きプリント配線基板における一部を拡大し、グランド電極に搭載されるＲＦＩＣモジュールの搭載位置を示す斜視図である。 Fifth Embodiment
FIG. 16 is a perspective view showing a mounting position of an RFIC module mounted on a ground electrode by enlarging a part of a printed wiring board with an RFIC chip of the fifth embodiment.
　図１６に示すように、実施の形態５のＲＦＩＣチップ付きプリント配線基板において、ＲＦＩＣモジュールは、上述の実施の形態４のＲＦＩＣモジュール１０Ｂであって、グランド電極は、上述の実施の形態１のグランド電極３である。 As shown in FIG. 16, in the printed wiring board with an RFIC chip of the fifth embodiment, the RFIC module is the RFIC module 10B of the fourth embodiment described above, and the ground electrode is the ground of the first embodiment described above. It is an electrode 3.
　実施の形態５に場合、ＲＦＩＣモジュール１０Ｂの給電回路基板２２の大きい方の裏面電極２９ａ（図１３参照）は、３つのレジスト開口７ａ、７ｃ、および７ｄを通じて露出するグランド電極３の金属面３ａに直流的に接続される。すなわち、裏面電極２９ａは、コイル導体４に対しては一点で接続し、グランド電極３に対しては３点で接続される。 In the case of the fifth embodiment, the larger back electrode 29a (see FIG. 13) of the feeding circuit substrate 22 of the RFIC module 10B is formed on the metal surface 3a of the ground electrode 3 exposed through the three resist openings 7a, 7c and 7d. It is connected in direct current. That is, the back surface electrode 29 a is connected to the coil conductor 4 at one point, and is connected to the ground electrode 3 at three points.
　グランド電極３に対して多点で裏面電極２９ａが接続されるため、一点で接続する場合に比べて、グランド電極３と裏面電極２９ａとの間をより確実に大きな電流が流れることができる。一点で接続する場合、製造上のバラツキによってその接触抵抗が大きくなると、グランド電極３と裏面電極２９ａとの間を流れる電流が減少する。すなわち、接触抵抗のバラツキが大きくなると、電流のバラツキも大きくなる。 Since the back surface electrode 29a is connected to the ground electrode 3 at multiple points, a larger current can flow more reliably between the ground electrode 3 and the back surface electrode 29a as compared with the case where the connection is made at one point. When connecting at one point, if the contact resistance is increased due to manufacturing variations, the current flowing between the ground electrode 3 and the back electrode 29a decreases. That is, as the variation in contact resistance increases, the variation in current also increases.
　これに対して、実施の形態５の場合、グランド電極３と裏面電極２９ａとが多点で接続するため、いくつかの点での接触抵抗が大きくなっても、残りの点を介して電流は流れることができる。そのため、いくつか点での接触抵抗のバラツキが大きくなっても、グランド電極３と裏面電極２９ａとの間を流れる電流のバラツキは小さい。 On the other hand, in the case of the fifth embodiment, since the ground electrode 3 and the back surface electrode 29a are connected at many points, even if the contact resistance at some points is increased, the current is not changed through the remaining points. It can flow. Therefore, even if the variation in the contact resistance at some points becomes large, the variation in the current flowing between the ground electrode 3 and the back surface electrode 29a is small.
　なお、実施の形態５の変形例を図１７に示す。 A modification of the fifth embodiment is shown in FIG.
　図１７は、実施の形態５の変形例のＲＦＩＣチップ付きプリント配線基板における一部を拡大して示す斜視図である。 FIG. 17 is a perspective view showing a part of the printed circuit board with an RFIC chip of the modification of the fifth embodiment in an enlarged manner.
　図１７に示すように、実施の形態５の変形例のＲＦＩＣチップ付きプリント配線基板において、グランド電極３Ｅは、図１１に示す実施の形態４のグランド電極３Ｃと同様に、Ｖ字形状の切欠き部３Ｅｃを備える。グランド電極３Ｅには、切欠き部３Ｅｃに沿って設けられた３つのレジスト開口２７ａ、２７ｂ、および２７ｃが形成されている。レジスト開口２７ａは、Ｖ字形状の切欠き部３Ｅｃの頂点近傍に設けられている。残りのレジスト開口２７ｂ、２７ｃは、切欠き部３Ｅｃの端面３Ｅｂとの間に設けられている。 As shown in FIG. 17, in the printed wiring board with the RFIC chip of the modification of the fifth embodiment, the ground electrode 3E has a V-shaped notch, like the ground electrode 3C of the fourth embodiment shown in FIG. A unit 3Ec is provided. The ground electrode 3E is formed with three resist openings 27a, 27b and 27c provided along the notch 3Ec. The resist opening 27a is provided in the vicinity of the top of the V-shaped notch 3Ec. The remaining resist openings 27b and 27c are provided between the end face 3Eb of the notch 3Ec.
　ＲＦＩＣモジュール１０Ｂの給電回路基板２２の大きい方の裏面電極２９ａ（図１３参照）は、３つのレジスト開口２７ａ、２７ｂ、および２７ｃを通じて露出するグランド電極３Ｅの金属面３Ｅａに直流的に接続される。すなわち、裏面電極２９ａは、コイル導体４に対しては一点で接続し、グランド電極３Ｅに対しては３点で接続される。 The larger back electrode 29a (see FIG. 13) of the feeder circuit substrate 22 of the RFIC module 10B is connected in a direct current manner to the metal surface 3Ea of the ground electrode 3E exposed through the three resist openings 27a, 27b and 27c. That is, the back surface electrode 29a is connected to the coil conductor 4 at one point, and is connected to the ground electrode 3E at three points.
　さらに、上述の実施の形態１～３の場合、ＲＦＩＣモジュールの給電回路基板のコイル導体は、その略中点で（好ましくは電気長の中点）、裏面電極を介してグランド電極に直流的に接続されている。しかしながら、本発明の実施の形態はこれに限らない。 Furthermore, in the case of Embodiments 1 to 3 described above, the coil conductor of the feed circuit substrate of the RFIC module is DC-connected to the ground electrode through the back surface electrode at its substantially middle point (preferably the middle point of the electrical length). It is connected. However, the embodiment of the present invention is not limited to this.
　《実施の形態６》
　図１８は、実施の形態６における、ＲＦＩＣモジュールの給電回路基板におけるコイル導体などの構成を模式的に示す斜視図である。 Embodiment 6
FIG. 18 is a perspective view schematically showing a configuration of a coil conductor and the like on a feeder circuit board of the RFIC module according to the sixth embodiment.
　図１８に示すように、実施の形態６のＲＦＩＣモジュールの給電回路基板３２において、コイル導体１４は、第１ループ電極１４ａ、第２ループ電極１４ｂ、第３のループ電極１４ｃ、およびこれらに接続するビアホール導体１６ａ、１６ｂ、１６ｃ、１６ｄによって構成されている。裏面電極２９ａは、最も裏面電極側に位置する第３のループ電極１４ｃに接続線１５を介して接続されている。すなわち、裏面電極２９ａは、コイル導体１４の一端（表面電極８ａに接続するビアホール導体１６ａの端）と他端（表面電極８ｂに接続するビアホール導体１６ｄの端）との中間の一点に接続されている。 As shown in FIG. 18, in the feeder circuit substrate 32 of the RFIC module of the sixth embodiment, the coil conductor 14 is connected to the first loop electrode 14a, the second loop electrode 14b, the third loop electrode 14c, and these. The via hole conductors 16a, 16b, 16c and 16d are formed. The back surface electrode 29 a is connected to the third loop electrode 14 c located closest to the back surface electrode via the connection line 15. That is, the back surface electrode 29a is connected to one point intermediate between one end of the coil conductor 14 (the end of the via hole conductor 16a connected to the surface electrode 8a) and the other end (the end of the via hole conductor 16d connected to the surface electrode 8b) There is.
　このようにコイル導体１４の中点（好ましくは電気長の中点）以外の点（接続点）に裏面電極２９ａが接続される場合、その接続点は、電力伝達効率を考慮すると、コイル導体１４の一端および他端それぞれから電気長の四分の一以上の距離だけ離れた位置、すなわち電気長の中点近くの位置に設けられるのが好ましい。 When the back electrode 29a is connected to a point (connection point) other than the middle point (preferably the middle point of the electrical length) of the coil conductor 14 in this manner, the connection point corresponds to the coil conductor 14 in consideration of the power transfer efficiency. Preferably, they are provided at a distance of one-quarter or more of the electrical length from each of the one end and the other end, that is, at a position near the midpoint of the electrical length.
　さらにまた、上述の実施の形態１～３の場合、ＲＦＩＣモジュールの給電回路基板おいて、コイル導体の一点と裏面電極の一点とが、１つの接続線によって接続されている。しかしながら、本発明の実施の形態はこれに限らない。 Furthermore, in the case of Embodiments 1 to 3 described above, in the feeder circuit substrate of the RFIC module, one point of the coil conductor and one point of the back surface electrode are connected by one connection line. However, the embodiment of the present invention is not limited to this.
　《実施の形態７》
　図１９は、実施の形態７における、ＲＦＩＣモジュールの給電回路基板におけるコイル導体などの構成を模式的に示す斜視図である。 Seventh Embodiment
FIG. 19 is a perspective view schematically showing a configuration of a coil conductor and the like on a feeder circuit board of the RFIC module according to the seventh embodiment.
　図１９に示すように、実施の形態７のＲＦＩＣモジュールの給電回路基板４２において、コイル導体１４の第３ループ電極１４ｃが、複数の接続線２５ａ、２５ｂ、２５ｃを介して裏面電極３９ａに接続されている。すなわち、コイル導体１４上の複数の点と裏面電極３９ａ上の複数の点とが、複数の接続線２５ａ、２５ｂ、２５ｃによって接続されている。 As shown in FIG. 19, in the feeding circuit board 42 of the RFIC module of the seventh embodiment, the third loop electrode 14c of the coil conductor 14 is connected to the back surface electrode 39a via the plurality of connecting lines 25a, 25b, 25c. ing. That is, the plurality of points on the coil conductor 14 and the plurality of points on the back surface electrode 39a are connected by the plurality of connection lines 25a, 25b, 25c.
　このようにコイル導体１４が複数の点（接続点）で裏面電極３９ａに接続される場合、それらの接続点は、電力伝達効率を考慮すると、コイル導体１４の一端および他端それぞれから電気長の四分の一以上の距離だけ離れた位置、すなわち電気長の中点近くの位置に設けられるのが好ましい。 Thus, when the coil conductor 14 is connected to the back surface electrode 39a at a plurality of points (connection points), the connection points have electrical lengths from one end and the other end of the coil conductor 14 in consideration of the power transfer efficiency. It is preferably provided at a distance of a quarter or more, that is, at a position near the midpoint of the electrical length.
　コイル導体１４が複数の点で裏面電極に接続されることにより、一点で接続される場合に比べて、コイル導体１４と裏面電極３９ａとの間を多くの電流が流れる。これにより、グランド電極をアンテナとして使用するＲＦＩＣモジュールは、より長い通信距離を得ることができる。 Since the coil conductor 14 is connected to the back surface electrode at a plurality of points, more current flows between the coil conductor 14 and the back surface electrode 39a as compared to the case where they are connected at one point. Thus, the RFIC module using the ground electrode as an antenna can obtain a longer communication distance.
　なお、実施の形態７の変形例を図２０に示す。 A modification of the seventh embodiment is shown in FIG.
　図２０は、実施の形態７の変形例における、ＲＦＩＣモジュールの給電回路基板におけるコイル導体などの構成を模式的に示す斜視図である。なお、図５に示す上述の実施の形態１の変形例でもある。 FIG. 20 is a perspective view schematically showing a configuration of a coil conductor and the like on a feeder circuit board of the RFIC module according to a modification of the seventh embodiment. This is also a modification of the above-described first embodiment shown in FIG.
　図２０に示すように、実施の形態７の変形例のＲＦＩＣモジュールの給電回路基板５２において、コイル導体２４は、２つのコイル状部２４Ａ、２４Ｂから構成されている。２つのコイル状部４Ａ、４Ｂは、並設され、電気的に直列に接続されている。また、２つのコイル状部４Ａ、４Ｂのコイル中心軸は、互いに平行であって、縦方向に延在している。 As shown in FIG. 20, in the feeder circuit board 52 of the RFIC module according to the modification of the seventh embodiment, the coil conductor 24 is composed of two coiled portions 24A and 24B. The two coiled parts 4A, 4B are juxtaposed and electrically connected in series. The coil central axes of the two coiled parts 4A and 4B are parallel to each other and extend in the longitudinal direction.
　一方のコイル状部２４Ａは３つのループ電極２４Ａａ、２４Ａｂ、２４Ａｃを備え、同様に、他方のコイル状部２４Ｂも３つのループ電極２４Ｂａ、２４Ｂｂ、２４Ｂｃを備える。一方のコイル状部２４Ａのループ電極２４Ａｃと他方のコイル状部２４Ｂのループ電極２４Ｂｃは、互いに接続され、１つの導体パターンとして形成されている。 One coiled portion 24A comprises three loop electrodes 24Aa, 24Ab, 24Ac, and similarly, the other coiled portion 24B also comprises three loop electrodes 24Ba, 24Bb, 24Bc. The loop electrode 24Ac of one coiled portion 24A and the loop electrode 24Bc of the other coiled portion 24B are connected to each other and formed as a single conductor pattern.
　この場合、一方のコイル状部２４Ａのループ電極２４Ａｃと他方のコイル状部２４Ｂのループ電極２４Ｂｃの接続点が、接続線３５ａを介して、ブラケット形状の裏面電極４９の中点に接続される。なお、ループ電極２４Ａｃとループ電極２４Ｂｃの接続点は、コイル導体の中点である。また、一方のコイル状部２４Ａのループ電極２４Ａｃが、接続線３５ｂを介して、裏面電極４９の一端に接続される。そして、他方のコイル状部２４Ｂのループ電極２４Ｂｃが、接続線３５ｃを介して、裏面電極４９の他端に接続される。 In this case, the connection point between the loop electrode 24Ac of one coiled portion 24A and the loop electrode 24Bc of the other coiled portion 24B is connected to the middle point of the bracket-shaped back surface electrode 49 via the connection line 35a. The connection point between the loop electrode 24Ac and the loop electrode 24Bc is the middle point of the coil conductor. Further, the loop electrode 24Ac of one of the coiled portions 24A is connected to one end of the back surface electrode 49 via the connection wire 35b. Then, the loop electrode 24Bc of the other coiled portion 24B is connected to the other end of the back surface electrode 49 via the connection wire 35c.
　図２１は、実施の形態７の変形例のＲＦＩＣチップ付きプリント配線基板における一部を拡大して示す斜視図である。 FIG. 21 is a perspective view showing a part of the printed wiring board with an RFIC chip of the modification of the seventh embodiment in an enlarged manner.
　図２１に示すように、ブラケット形状の裏面電極４９は、ブラケット形状のレジスト開口３７を通じて露出するグランド電極３Ｆの金属面３Ｆａに直流的に接続される。レジスト開口３７は、開口部３Ｆｃを部分的に囲むように形成されている。 As shown in FIG. 21, the bracket-shaped back surface electrode 49 is connected in a direct current manner to the metal surface 3Fa of the ground electrode 3F exposed through the bracket-shaped resist opening 37. The resist opening 37 is formed so as to partially surround the opening 3Fc.
　加えて、上述の実施の形態１～３の場合、それに加えて上述の実施の形態４～７の場合、ＲＦＩＣモジュールの給電回路基板のコイル導体は、１つの裏面電極を介して、グランド電極に直流的に接続されている。しかしながら、本発明の実施の形態はこれに限らない。 In addition, in the case of Embodiments 1 to 3 above, and in the case of Embodiments 4 to 7 above, in addition to that, the coil conductor of the feed circuit substrate of the RFIC module is connected to the ground electrode through one back surface electrode. It is connected in direct current. However, the embodiment of the present invention is not limited to this.
　《実施の形態８》
　図２２は、実施の形態８における、ＲＦＩＣモジュールの給電回路基板におけるコイル導体などの構成を模式的に示す斜視図である。 Embodiment 8
FIG. 22 is a perspective view schematically showing a configuration of a coil conductor and the like on a feeder circuit board of the RFIC module according to the eighth embodiment.
　図２２に示すように、実施の形態８のＲＦＩＣモジュールの給電回路基板６２において、コイル導体１４のループ電極１４ｃは、接続線４５ａを介して裏面電極５９ａに接続されるとともに、接続線４５ｂを介して裏面電極５９ｂに接続される。すなわち、コイル導体１４の複数の点（接続点）それぞれが、異なる裏面電極５９ａ、５９ｂに接続される。 As shown in FIG. 22, in the feeding circuit board 62 of the RFIC module of the eighth embodiment, the loop electrode 14c of the coil conductor 14 is connected to the back surface electrode 59a via the connecting wire 45a and via the connecting wire 45b. Is connected to the back electrode 59b. That is, each of the plurality of points (connection points) of the coil conductor 14 is connected to different back surface electrodes 59a and 59b.
　このようにコイル導体１４が複数の点（接続点）それぞれで異なる裏面電極５９ａ、５９ｂに接続される場合、それらの接続点は、電力伝達効率を考慮すると、コイル導体１４の一端および他端それぞれから電気長の四分の一以上の距離だけ離れた位置、すなわち中点近くの位置に設けられるのが好ましい。 Thus, when the coil conductor 14 is connected to different back surface electrodes 59a and 59b at a plurality of points (connection points) respectively, those connection points are one end and the other end of the coil conductor 14 in consideration of the power transfer efficiency. It is preferable to be provided at a position separated by a distance equal to or more than a quarter of the electrical length, ie, a position near the midpoint.
　図２３は、実施の形態８のＲＦＩＣチップ付きプリント配線基板における一部を拡大して示す斜視図である。 FIG. 23 is a perspective view showing a part of the printed wiring board with an RFIC chip of the eighth embodiment in an enlarged manner.
　図２３に示すように、一方の裏面電極５９ａは、一方のレジスト開口４７ａを通じて露出するグランド電極３Ｇの金属面３Ｇａに直流的に接続する。他方の裏面電極５９ｂは、他方のレジスト開口４７ｂを通じて露出する金属面３Ｇａに直流的に接続する。レジスト開口４７ａ、４７ｂは、開口部３Ｇｃを挟んで対向するように形成されている。 As shown in FIG. 23, one back electrode 59a is connected to metal surface 3Ga of ground electrode 3G exposed through one resist opening 47a in a direct current manner. The other back surface electrode 59b is connected in a direct current manner to the metal surface 3Ga exposed through the other resist opening 47b. The resist openings 47a and 47b are formed to face each other across the opening 3Gc.
　上述の実施の形態４～８およびそれらの変形例に係るプリント配線基板も、上述の実施の形態１～３に係るプリント配線基板と同様に、取付けの自由度および電力伝達効率が高い構成となり、更に小型化、軽量化、および低コスト化を達成することができる構成となる。 Similarly to the printed wiring boards according to the above-described first to third embodiments, the printed wiring boards according to the above-described fourth to eighth embodiments and their variations are also configured to have high degree of freedom of installation and power transfer efficiency. Further, the configuration can be achieved to achieve miniaturization, weight reduction and cost reduction.
　上記のように本発明のＲＦＩＣチップ付き物品としては、各実施の形態において説明したように、例えばプリント配線基板、金属製工具などの金属面をアンテナとして利用することが可能な各種物品において簡単な構成でＲＦＩＤシステムを構築することが可能となる。 As described above, the RFIC chip-attached article of the present invention is simple in various articles which can use a metal surface such as a printed wiring board or a metal tool as an antenna as described in each embodiment. It is possible to construct an RFID system with the configuration.
　以上のように、本発明のＲＦＩＣチップ付き物品においては、ＲＦＩＣモジュールの給電回路基板のコイル導体の中間の少なくとも一点をアンテナ（放射板）となるグランド電極の少なくとも一カ所で直流的に接続（ＤＣ接続）する構成であるため、物品に対する取付けの自由度が高く、簡単な構成で高い電力伝達効率を有する通信機器となり、小型化、軽量化、および低コスト化を達成することができる構成となる。 As described above, in the article with an RFIC chip of the present invention, at least one point in the middle of the coil conductor of the feed circuit substrate of the RFIC module is DC connected (DC) at at least one place of the ground electrode serving as the antenna (radiation plate) Because of the configuration to be connected, the communication device has a high degree of freedom of attachment to an article, a simple configuration and high power transfer efficiency, and can achieve miniaturization, weight reduction, and cost reduction. .
　本発明をある程度の詳細さをもって各実施の形態において説明したが、これらの実施の形態の開示内容は構成の細部において変化してしかるべきものであり、各実施の形態における要素の組合せや順序の変化は請求された本発明の範囲および思想を逸脱することなく実現し得るものである。 Although the present invention has been described in the embodiments with a certain degree of detail, the disclosed contents of these embodiments should be changed in the details of the configuration, and the combination and order of the elements in the embodiments can be appropriately changed. Changes can be made without departing from the scope and spirit of the claimed invention.
　本発明は、ＲＦＩＣチップ付き物品としては金属面を有する各種物品に適用することができるため、ＲＦＩＤシステムを利用した物品管理システムの拡充などにおいて有用な構成となる。 The present invention can be applied to a variety of articles having a metal surface as an article with an RFIC chip, and therefore, the configuration is useful in expanding an article management system using an RFID system.
　　１　ＲＦＩＣチップ
　　２　給電回路基板
　　３　グランド電極（金属物）
　　３ａ　金属面
　　３ｂ　スリット部（磁束通過部）
　　３ｃ　開口部（磁束通過部）
　　３ｄ　レジスト開口
　　４　コイル導体（インダクタ素子）
　　４ａ　第１ループ電極
　　４ｂ　第２ループ電極
　　４ｃ　第３ループ電極
　　５　接続線
　　６　ビア導体
　　７　レジストパターン
　　７ａ　第１レジスト開口
　　７ｂ　第２レジスト開口
　　７ｃ　第３レジスト開口
　　７ｄ　第４レジスト開口
　　８　表面電極
　　８ａ　第１表面電極
　　８ｂ　第２表面電極
　　９　裏面電極
　　９ａ　第１裏面電極
　　９ｂ　第２裏面電極
　　９ｃ　第３裏面電極
　　９ｄ　第４裏面電極
　１０　ＲＦＩＣモジュール
１００　物品（プリント配線基板、鉗子）
１０１　ＲＦＩＣモジュール
１０２　コイル導体 1 RFIC chip 2 Feed circuit board 3 Ground electrode (metal)
3a Metal surface 3b Slit portion (flux passing portion)
3c opening (magnetic flux passing part)
3d resist opening 4 coil conductor (inductor element)
4a 1st loop electrode 4b 2nd loop electrode 4c 3rd loop electrode 5 connecting wire 6 via conductor 7 resist pattern 7a 1st resist opening 7b 2nd resist opening 7c 3rd resist opening 7d 4th resist opening 8 front surface electrode 8a 1st Surface electrode 8b Second surface electrode 9 Back surface electrode 9a First back surface electrode 9b Second back surface electrode 9c Third back surface electrode 9d Fourth back surface electrode 10 RFIC module 100 Article (printed wiring board, insulator)
101 RFIC module 102 coil conductor

Claims (10)

  1. 　金属面を有する物品と、
    　前記金属面に対向するループ面を有するコイル導体と、
    　前記コイル導体の一端および他端にそれぞれ接続された第１および第２の入出力端子を有するＲＦＩＣチップと、を備え
    　前記コイル導体の中間の一点と前記金属面の縁近傍の一点とが直流的に接続し、前記コイル導体のループ面と平面視で重なる領域に前記コイル導体による磁束が通る磁束通過部が配設されたＲＦＩＣチップ付き物品。
    An article having a metal surface;
    A coil conductor having a loop surface facing the metal surface;
    An RFIC chip having first and second input / output terminals respectively connected to one end and the other end of the coil conductor; and one point in the middle of the coil conductor and one point near the edge of the metal surface are DC An article with an RFIC chip, wherein a magnetic flux passing portion through which a magnetic flux from the coil conductor passes is disposed in a region overlapping with a loop surface of the coil conductor in a plan view.
  2. 　前記金属面に電気的に直接接続される前記コイル導体の中間の一点が、前記コイル導体における電気長の略中点の位置である、請求項１に記載のＲＦＩＣチップ付き物品。
    The RFIC chip attached article according to claim 1, wherein one point in the middle of the coil conductor electrically connected directly to the metal surface is a position of a substantially midpoint of an electrical length in the coil conductor.
  3. 　前記コイル導体に電気的に直接接続される前記金属面の一点が、平面視で前記コイル導体の直下に位置する、請求項１または２に記載のＲＦＩＣチップ付き物品。
    The RFIC chip attached article according to claim 1, wherein one point of the metal surface electrically connected directly to the coil conductor is located directly below the coil conductor in plan view.
  4. 　前記磁束通過部が前記金属面に形成され、
    　前記コイル導体のループ面の一部が平面視で前記磁束通過部と重なるように構成された、請求項１から３のいずれか一項に記載のＲＦＩＣチップ付き物品。
    The magnetic flux passing portion is formed on the metal surface,
    The RFIC chip attached article according to any one of claims 1 to 3, wherein a part of a loop surface of the coil conductor is configured to overlap the magnetic flux passing portion in plan view.
  5. 　前記コイル導体のループ面が平面視で前記金属面の縁と重なるように構成された、請求項１から３のいずれか一項に記載のＲＦＩＣチップ付き物品。
    The RFIC chip attached article according to any one of claims 1 to 3, wherein a loop surface of the coil conductor is configured to overlap an edge of the metal surface in plan view.
  6. 　前記磁束通過部が開口で構成された、請求項１から５のいずれか一項に記載のＲＦＩＣチップ付き物品。
    The article with an RFIC chip according to any one of claims 1 to 5, wherein the magnetic flux passing portion is constituted by an opening.
  7. 　前記磁束通過部は磁束が通過する材料で構成された、請求項１から５のいずれか一項に記載のＲＦＩＣチップ付き物品。
    The article with an RFIC chip according to any one of claims 1 to 5, wherein the magnetic flux passage part is made of a material through which magnetic flux passes.
  8. 　前記コイル導体が、前記コイル導体の中間の一点を含む複数の点で、前記金属面の縁近傍の一点を含む前記金属面の縁近傍における複数の点に直流的に接続されている、請求項１から７のいずれか一項に記載のＲＦＩＣチップ付き物品。
    The coil conductor is galvanically connected at a plurality of points including one middle point of the coil conductor to a plurality of points near the edge of the metal surface including one point near the edge of the metal surface. An article with an RFIC chip according to any one of 1 to 7.
  9. 　前記コイル導体と前記ＲＦＩＣチップとがＲＦＩＣモジュールとしてモジュール化され、
    　前記ＲＦＩＣモジュールが、前記コイル導体と前記金属面との間に介在し、前記コイル導体と前記金属面とを直流的に接続する電極を備える、請求項１から８のいずれか一項に記載のＲＦＩＣチップ付き物品。
    The coil conductor and the RFIC chip are modularized as an RFIC module,
    9. The RFIC module according to any one of claims 1 to 8, further comprising: an electrode interposed between the coil conductor and the metal surface and connecting the coil conductor and the metal surface in a DC manner. Article with RFIC chip.
  10. 　前記金属面をアンテナとして、ＵＨＦ帯を通信周波数とするよう構成された、請求項１から９のいずれか一項に記載のＲＦＩＣチップ付き物品。 The RFIC chip attached article according to any one of claims 1 to 9, wherein the metal surface is an antenna and the UHF band is a communication frequency.
PCT/JP2018/024848 2017-06-30 2018-06-29 Rfic chip-equipped product WO2019004439A1 (en)

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