JP3148168U - Wireless IC device - Google Patents

Wireless IC device Download PDF

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Publication number
JP3148168U
JP3148168U JP2008007398U JP2008007398U JP3148168U JP 3148168 U JP3148168 U JP 3148168U JP 2008007398 U JP2008007398 U JP 2008007398U JP 2008007398 U JP2008007398 U JP 2008007398U JP 3148168 U JP3148168 U JP 3148168U
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wireless ic
annular electrode
radiation plate
ic device
device according
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JP2008007398U
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加藤 登
登 加藤
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株式会社村田製作所
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Abstract

A wireless IC device that can reduce mounting accuracy of a wireless IC, improve radiation characteristics, and can also be used for communication at a short distance. A wireless IC chip, an annular electrode having a pair of end portions a and b, a feeder circuit board having a built-in feeder circuit, and a connecting portion that is the maximum current point of the annular electrode are connected. A wireless IC device comprising a radiation plate 15. The wireless IC chip 5 is coupled to a power feeding circuit, and the annular electrode 25 and the radiation plate are partially electromagnetically coupled. The radiation plate 15 is used for long-distance communication as a radiation plate for electric field, and the annular electrode 25 is used for short-range communication as a radiation plate for magnetic field. The power supply circuit board 10 may be omitted, and the wireless IC chip 5 may be coupled to the annular electrode 25 via a matching portion. [Selection] Figure 4

Description

  The present invention relates to a wireless IC device, and more particularly to a wireless IC device used in an RFID (Radio Frequency Identification) system.

  Conventionally, as an article management system, a reader / writer that generates an induction electromagnetic field and an IC chip (also referred to as an IC tag or a wireless IC chip) that stores predetermined information attached to an article or a container are communicated in a non-contact manner. RFID systems that transmit information have been developed. The IC chip can be communicated with a reader / writer by being connected to an antenna, that is, a radiation plate.

As a tag antenna for mounting an IC chip, one described in Patent Document 1 is conventionally known. The tag antenna includes a power feeding unit, a dipole antenna, and an inductance unit, and the power feeding unit is disposed at the center point of the dipole antenna. However, in this tag antenna, since the arrangement of the power feeding unit is limited to the center point of the dipole antenna, if the mounting accuracy of the IC chip arranged in the power feeding unit is lowered, the performance as a wireless tag is lowered. Had. In addition, since communication with a reader / writer is performed using only a dipole antenna that uses an electric field, it is not suitable for short-distance communication.
JP 2006-295879 A

  SUMMARY OF THE INVENTION An object of the present invention is to provide a wireless IC device that can reduce the mounting accuracy of a wireless IC, improve radiation characteristics, and can be used for short-distance communication.

The wireless IC device according to the first aspect of the present invention is
A wireless IC;
An annular electrode having at least a pair of ends;
A matching portion provided at a pair of ends of the annular electrode;
A dipole-shaped radiation plate connected to the current maximum point of the annular electrode;
With
The wireless IC is coupled to the matching unit,
The annular electrode and the radiation plate are electromagnetically coupled at least in part;
It is characterized by.

The wireless IC device according to the second aspect of the present invention is
A wireless IC;
An annular electrode having at least a pair of ends;
A power feeding circuit including a resonance circuit and / or a matching circuit including an inductance element and having a predetermined resonance frequency;
A dipole-shaped radiation plate connected to the current maximum point of the annular electrode;
With
The wireless IC is coupled with the power feeding circuit,
The annular electrode and the radiation plate are electromagnetically coupled at least in part;
It is characterized by.

  In the wireless IC device according to the first embodiment, since the wireless IC is coupled to the matching portion provided at the pair of ends of the annular electrode, the mounting accuracy of the wireless IC on the matching portion is not so strict. . Further, in the wireless IC device according to the second embodiment, since the wireless IC is coupled to the power feeding circuit, the mounting density of the wireless IC on the power feeding circuit is not so strict.

  In the wireless IC devices according to the first and second embodiments, the degree of coupling between the annular electrode and the dipole radiation plate is high, and the radiation characteristics are improved. The dipole-type radiation plate can communicate over a long distance using an electric field, and the annular electrode can communicate over a short distance using a magnetic field.

  In the wireless IC device according to the second embodiment, the frequency of a signal used for communication with the reader / writer is substantially determined by a power supply circuit including a resonance circuit and / or a matching circuit having a predetermined resonance frequency. . By designing this power supply circuit in accordance with the impedance of the wireless IC or radiation plate to be used, it is possible to cope with various impedances and to widen the frequency band in which impedance matching is possible. In addition, since the annular electrode is arranged so as to be coupled to the feed circuit and the dipole radiation plate, the loss of the signal transmitted from the annular electrode to the radiation plate can be reduced, and the signal radiation characteristics are improved. To do.

  Furthermore, if impedance matching is performed by a power feeding circuit, the annular electrode functioning as a magnetic field radiation plate can be designed relatively freely regardless of impedance matching, so that the area where magnetic flux intersects can be widened. As a result, it is possible to communicate with a reader / writer at a short distance with small energy.

  Further, like the wireless IC device according to the first embodiment, the power feeding circuit may be omitted, and the wireless IC may be coupled to the annular electrode via the matching unit, and the annular electrode may have a resonance circuit function.

  According to the present invention, the mounting accuracy of the wireless IC is relaxed, and a desired radiation characteristic can be obtained in a wide band by providing the annular electrode. In addition, the short-distance communication is possible by the annular electrode, and the short-distance and long-distance communication can be properly used by using together with the long-distance communication by the dipole type radiation plate. Since the annular electrode can take a wide area where the magnetic flux intersects regardless of impedance matching, communication with the reader / writer at a short distance is possible with small energy.

  Embodiments of a wireless IC device according to the present invention will be described below with reference to the accompanying drawings. In addition, in each figure, the same code | symbol is attached | subjected to a common component and part, and the overlapping description is abbreviate | omitted.

(Refer to the first embodiment, FIGS. 1 and 2)
1 and 2 show a wireless IC device 1A according to a first embodiment of the present invention. The wireless IC device 1A includes a wireless IC chip 5 that processes transmission / reception signals of a predetermined frequency, a radiation plate 15 formed on a base material 20 such as a PET film, and an annular electrode 25.

  The annular electrode 25 has a wide pair of end portions 26a and 26b, and the wireless IC chip 5 is mounted on the wide end portions 26a and 26b. The wireless IC chip 5 includes a clock circuit, a logic circuit, a memory circuit, and the like. Necessary information is stored, and a pair of input / output terminal electrodes and a pair of mounting terminal electrodes (not shown) are provided on the back surface. Then, the pair of input / output terminal electrodes are mounted on the pair of end portions 26a, 26b of the annular electrode 25 through the conductive bonding agent 6 as shown in FIG.

  The radiation plate 15 is disposed so as to extend on both sides of the annular electrode 25 and has a so-called dipole shape. A part of the annular electrode 25 is connected to the radiation plate 15 via the connection portion 27 so as to be electrically connected. The radiating plate 15 is formed by pasting and patterning a thin metal plate made of a conductive material such as an aluminum foil and a copper foil including the annular electrode 25 on the base material 20, or Al, Cu, Ag on the base material 20. It forms by apply | coating conductive pastes, such as, or patterning the film | membrane provided by the plating process.

  The annular electrode 25 has a predetermined length from the end portion 26a to the end portion 26b, has a predetermined resonance frequency corresponding to this electrical length, and also functions as a matching portion that matches the phase. Similarly, the radiation plate 15 has a predetermined resonance frequency corresponding to its electrical length. Further, the annular electrode 25 matches the impedance of the wireless IC chip 5 (usually 50Ω) and the impedance of the radiation plate 15 (space impedance 377Ω).

  Therefore, a transmission signal having a predetermined frequency transmitted from the wireless IC chip 5 is transmitted to the radiation plate 15 via the annular electrode 25, and a signal received by the radiation plate 15 has a predetermined frequency at the annular electrode 25. A signal is selected and supplied to the wireless IC chip 5. Therefore, in this wireless IC device 1A, the wireless IC chip 5 is operated by the signal received by the radiation plate 15, and the response signal from the wireless IC chip 5 is radiated from the radiation plate 15 to the outside.

  As described above, the annular electrode 25 and the radiation plate 15 are connected via the connection portion 27 so as to be electrically connected. More preferably, the point where the current flowing through the annular electrode 25 and the current flowing through the radiation plate 15 are maximized is defined as the connection portion. Since the current maximum point also maximizes the strength of the magnetic field generated by the current, the signal transmission efficiency is also maximized. As a result, the signal transmitted from the wireless IC chip 5 propagates through the annular electrode 25 and is directly transmitted to the radiation plate 15, and the connection between the two is further increased by setting the point where the currents of the two are maximum. The signal transmission efficiency can be improved. More specifically, the maximum current point in the annular electrode 25 is the central portion in the longitudinal direction, and the connecting portion 27 is provided in this central portion. The maximum point of current in the radiation plate 15 is the central portion in the longitudinal direction, and the connecting portion 27 is provided in this central portion.

  The degree of coupling between the annular electrode 25 and the radiation plate 15 in the connection portion 27 is affected by the width W and the interval L in the connection portion 27. As the width W and the interval L increase, the degree of coupling decreases.

  A part of the signal is emitted from the annular electrode 25 to the outside of the wireless IC device 1A as a magnetic field, and the signal is also emitted from the radiation plate 15 to the outside as an electric field. At this time, by designing the resonance frequency of the annular electrode 25 to be lower than the resonance frequency of the radiation plate 15, it is possible to broaden the radiation characteristics of the wireless IC device.

  Further, the three sides of the annular electrode 25 and the radiation plate 15 are close to each other, and secondary electromagnetic field coupling is generated in this proximity portion, thereby further strengthening the coupling between the annular electrode 25 and the radiation plate 15. In addition, it is possible to improve the radiation gain of the wireless IC device and further widen the radiation characteristics.

  The pair of end portions 26a and 26b of the annular electrode 25 are arranged at positions farthest from the connection portion 27 with the dipole-type radiation plate 15 in the first embodiment, but the end portions 26a and 26b. May be arranged close to the dipole radiation plate 15.

  Further, the annular electrode 25 may have various shapes such as an elliptical shape instead of a rectangular shape as in the first embodiment. This also applies to other embodiments described below.

  As described above, in the wireless IC device 1A, since the resonance frequency of the signal is set by the annular electrode 25, the wireless IC device 1A operates as it is even when the wireless IC device 1A is attached to various articles, and fluctuations in radiation characteristics are suppressed. Thus, it is not necessary to change the design of the radiation plate 15 or the like for each individual article. The frequency of the transmission signal radiated from the radiation plate 15 and the frequency of the reception signal supplied to the wireless IC chip 5 substantially correspond to the resonance frequency of the annular electrode 25. Since the frequency of the transmitted / received signal is determined in the annular electrode 25, the frequency characteristics change even if the wireless IC device 1A is rounded or sandwiched between dielectrics, for example, regardless of the shape, size, arrangement relationship, etc. of the radiation plate 15 Stable frequency characteristics can be obtained without doing so.

(Configuration of matching unit, see FIG. 3)
In the first embodiment, as shown in FIGS. 3A to 3D, the matching portion coupled to the wireless IC chip 5 is arranged in various configurations on the pair of end portions 26a and 26b of the annular electrode 25. be able to.

  FIG. 3A shows a line-shaped matching portion 38a connecting the end portions 26a and 26b formed as an annular line. FIG. 3B shows a line-shaped matching portion 38b connecting end portions 26a and 26b formed as a meandering line. FIG. 3C shows a configuration in which line-like matching portions 38c are formed as meandering lines at the end portions 26a and 26b, respectively. FIG. 3D shows a configuration in which line-shaped matching portions 38d are formed as spiral lines at the end portions 26a and 26b, respectively.

(Refer 2nd Example and FIGS. 4-8)
FIG. 4 shows a wireless IC device 1B according to a second embodiment of the present invention. The wireless IC device 1B includes an electromagnetic coupling module 2, a radiation plate 15 formed on a base material 20 such as a PET film, and an annular electrode 25. The electromagnetic coupling module 2 includes a wireless IC chip 5 that processes a transmission / reception signal having a predetermined frequency, and a power supply circuit board 10 on which the wireless IC chip 5 is mounted.

  4A shows the wireless IC device 1B in a state where the electromagnetic coupling module 2 is mounted, and FIG. 4B shows the radiation plate 15 and the annular electrode 25 in a state where the electromagnetic coupling module 2 is not mounted. Is shown. FIG. 4C shows a modification of the connection portion 27 between the radiation plate 15 and the annular electrode 25.

  The radiation plate 15 and the annular electrode 25 are basically the same as those in the first embodiment, and the electromagnetic coupling module 2 is mounted on the end portions 26 a and 26 b of the annular electrode 25.

  As shown in FIG. 5 as an equivalent circuit, the feeder circuit board 10 includes resonance elements L1 and L2 having inductance values different from each other and magnetically coupled in opposite phases to each other (indicated by a mutual inductance M). A power supply circuit 11 having a circuit / matching circuit (details will be described below with reference to FIG. 8) is provided.

  As shown in FIG. 6, in the wireless IC chip 5, input / output terminal electrodes are connected to power supply terminal electrodes 42a and 42b formed on the power supply circuit board 10, and mounting terminal electrodes are connected to mounting electrodes 43a and 43b via metal bumps or the like. Are electrically connected.

  The inductance elements L1 and L2 included in the power feeding circuit 11 are magnetically coupled in opposite phases to resonate at a frequency processed by the wireless IC chip 5, and are electromagnetically coupled to the end portions 26a and 26b of the annular electrode 25. The power feeding circuit 11 matches the impedance of the wireless IC chip 5 (usually 50Ω) and the impedance of the radiation plate 15 (space impedance 377Ω).

  Accordingly, the power feeding circuit 11 transmits a transmission signal having a predetermined frequency transmitted from the wireless IC chip 5 to the radiation plate 15 via the annular electrode 25, and receives the transmission signal via the annular electrode 25 via the annular electrode 25. A received signal having a predetermined frequency is selected from the obtained signals and supplied to the wireless IC chip 5. Therefore, in the wireless IC device 1B, the wireless IC chip 5 is operated by the signal received by the radiation plate 15, and the response signal from the wireless IC chip 5 is emitted from the radiation plate 15 to the outside.

  The annular electrode 25 has a predetermined length from the end 26a to the end 26b, and has a predetermined resonance frequency corresponding to this electrical length. Similarly, the radiation plate 15 has a predetermined resonance frequency corresponding to its electrical length. When the resonance frequency of the annular electrode 25 is f1, and the resonance frequency of the radiation plate 15 is f2, the design is made so that f1 is a resonance frequency lower than f2. That is, when the annular electrode 25 and the radiation plate 15 are viewed as a single unit, the electrical length of the annular electrode 25 is designed to be equal to or longer than the electrical length of the radiation plate 15. Furthermore, the annular electrode 25 and the radiation plate 15 are connected so as to be electrically connected via the connection portion 27. More preferably, the point where the current flowing through the annular electrode 25 and the current flowing through the radiation plate 15 are maximized is defined as the connection portion. As a result, the signal transmitted from the electromagnetic coupling module 2 propagates in the annular electrode 25 and is directly transmitted to the radiation plate 15, and the connection between the two is further increased by setting the point where the currents of the two are maximum. The signal transmission efficiency can be improved.

  A part of the signal is emitted from the annular electrode 25 to the outside of the wireless IC device 1B as a magnetic field, and the signal is also emitted from the radiation plate 15 to the outside as an electric field. At this time, by designing the resonance frequency f1 of the annular electrode 25 to be lower than the resonance frequency f2 of the radiation plate 15, the radiation characteristic as a wireless IC device can be widened. Thus, the annular electrode 25 has a function of transmitting a signal to the radiation plate and also has a function of radiating a part of the signal to the outside.

  FIG. 7 shows the frequency characteristics of the radiation gain of the wireless IC device 1B according to the second embodiment. As is clear from FIG. 7, the frequency band 1... Over a wide band of 100 MHz between the resonance frequency by the annular electrode 25 and the resonance frequency by the radiation plate 15 in a state where the annular electrode 25 and the radiation plate 15 are coupled. It can be seen that a high radiation gain of 5 dB or more is obtained. In addition, the marker 1 and the marker 2 in FIG. 7 have shown the use frequency of the upper limit and lower limit of RFID of a UHF band, respectively.

  Furthermore, when the frequency of the signal transmitted and received by the wireless IC device 1B is f0, the predetermined signal frequency f0 is set by setting f0 to be between the frequency f1 ′ of the marker 1 and the frequency f2 ′ of the marker 2. A sufficient radiation gain can be obtained. In addition, even if the frequencies f1 ′ and f2 ′ fluctuate slightly due to manufacturing variations of the annular electrode 25 and the radiation plate 15, the wireless IC device can be operated without any problem between the two frequencies f1 ′ and f2 ′. Reliability as a wireless IC device is improved.

  By the way, since the annular electrode 25 and the radiation plate 15 are connected via the connecting portion 27, the annular electrode 25 and the radiation plate 15 are combined, so that the resonance frequency f2 of the radiation plate 15 is higher than the design value of the single body. Also lower. For this reason, it is preferable to design the resonance frequency f1 of the annular electrode 25 alone so as to be lower than the resonance frequency f2 of the radiation plate 15. As a result, the wireless IC device 1B can have sufficient radiation characteristics within the bands of the frequencies f1 ′ and f2 ′. Further, it is preferable that the resonance frequency f1 of the annular electrode 25 alone is designed to be higher than the resonance frequency of the resonance circuit included in the power feeding circuit 11. As described above, when the annular electrode 25 is coupled to the radiation plate 15, the resonance frequency f1 of the annular electrode 25 is lowered. Therefore, by designing the resonance frequency f1 of the annular electrode 25 alone to be higher than the resonance frequency f0 of the resonance circuit, when the wireless IC device 1B is operating, that is, the annular electrode 25 and the radiation plate 15 Can be set within the bands of the frequencies f1 ′ and f2 ′, and stable communication can be performed with a high radiation gain. The resonance frequency f2 of the radiation plate 15 is preferably less than λ / 2 with respect to the signal wavelength λ.

  As described above, the wireless IC device 1B operates as it is even when the wireless IC device 1B is attached to various articles because the resonance frequency of the signal is set by the power supply circuit 11 provided on the power supply circuit board 10. The fluctuation of the radiation characteristic is suppressed, and it is not necessary to change the design of the radiation plate 15 or the like for each individual article. The frequency of the transmission signal radiated from the radiation plate 15 and the frequency of the reception signal supplied to the wireless IC chip 5 substantially correspond to the resonance frequency of the power feeding circuit 11 in the power feeding circuit board 10. Since the frequency of the transmission / reception signal is determined in the power supply circuit board 10, for example, the wireless IC device 1 </ b> B may be rounded or sandwiched by a dielectric regardless of the shape, size, arrangement relationship, etc. of the radiation plate 15 and the annular electrode 25. A stable frequency characteristic can be obtained without changing the frequency characteristic.

  The coupling degree between the annular electrode 25 and the radiation plate 15 in the connection portion 27 is affected by the width W and the interval L (see FIG. 4B) in the connection portion 27. As the width W and the interval L increase, the degree of coupling decreases.

  Moreover, the connection part 27 may be branched in two places, as shown in FIG.4 (C). In this case, the degree of coupling increases as the width W ′ increases, and the degree of coupling decreases as the interval L ′ increases.

  Here, the configuration of the feeder circuit board 10 will be described with reference to FIG. The feeder circuit board 10 is obtained by laminating, pressing and firing ceramic sheets 41a to 41h made of a dielectric or magnetic material. On the uppermost sheet 41a, power supply terminal electrodes 42a and 42b, mounting electrodes 43a and 43b, and via-hole conductors 44a, 44b, 45a and 45b are formed. In the second to eighth sheets 41b to 41h, wiring electrodes 46a and 46b constituting the inductance elements L1 and L2 are formed, and via hole conductors 47a, 47b, 48a and 48b are formed as necessary. ing.

  By laminating the above sheets 41a to 41h, the inductance element L1 in which the wiring electrode 46a is spirally connected by the via-hole conductor 47a is formed, and the inductance in which the wiring electrode 46b is spirally connected by the via-hole conductor 47b. Element L2 is formed. Further, a capacitance is formed between the wiring electrodes 46a and 46b.

  The end 46a-1 of the wiring electrode 46a on the sheet 41b is connected to the power supply terminal electrode 42a via the via hole conductor 45a, and the end 46a-2 of the wiring electrode 46a on the sheet 41h is connected via the via hole conductors 48a and 45b. Connected to the power supply terminal electrode 42b. The end 46b-1 of the wiring electrode 46b on the sheet 41b is connected to the power supply terminal electrode 42b via the via hole conductor 44b, and the end 46b-2 of the wiring electrode 46b on the sheet 41h is connected via the via hole conductors 48b and 44a. Connected to the power supply terminal electrode 42a.

  In the above power feeding circuit 11, since the inductance elements L1 and L2 are wound in opposite directions, the magnetic fields generated by the inductance elements L1 and L2 are canceled out. Since the magnetic field cancels out, it is necessary to lengthen the wiring electrodes 46a and 46b to some extent in order to obtain a desired inductance value. As a result, the Q value is lowered, so that the steepness of the resonance characteristics is lost, and the bandwidth is increased in the vicinity of the resonance frequency.

  The inductance elements L1 and L2 are formed at different positions on the left and right when the feeder circuit board 10 is seen through. The magnetic fields generated by the inductance elements L1 and L2 are opposite to each other. Thus, when the feeder circuit 11 is coupled to the end portions 26 a and 26 b of the annular electrode 25, a reverse current is excited in the end portions 26 a and 26 b, and signals are transmitted to and received from the radiation plate 15 by the annular electrode 25. can do.

(Refer to the third embodiment, FIG. 9)
FIG. 9 shows a wireless IC device 1C according to a third embodiment of the present invention. The wireless IC device 1C is the same as the second embodiment in that the wireless IC device 1C includes the electromagnetic coupling module 2, the annular electrode 25, and the radiation plate 15 each including the wireless IC chip 5 and the power feeding circuit board 10. The difference is that the end portions 16a and 16b of the radiation plate 15 are bent along the side of the annular electrode 25, and the end portions 16a and 16b are arranged so as to sandwich the annular electrode 25 from both sides in plan view. .

  In the third embodiment, the radio IC device 1C can be downsized by bending the end portions 16a and 16b of the radiation plate 15 toward the annular electrode 25 side. Furthermore, directivity in a predetermined direction can be improved by directing the end portions 16a and 16b of the radiation plate 15 in a predetermined direction. Further, since the bent portions including the end portions 16a and 16b are arranged close to the annular electrode 25, secondary electromagnetic coupling occurs, and the coupling between the annular electrode 25 and the radiation plate 15 is further strengthened. Therefore, it is possible to improve the radiation gain of the wireless IC device and further widen the radiation characteristics.

(Refer to the fourth embodiment, FIG. 10)
FIG. 10 shows a wireless IC device 1D according to the fourth embodiment of the present invention. In the wireless IC device 1D, the end portions of the radiation plate 15 are wide portions 17a and 17b. Other configurations are the same as those of the second and third embodiments, and the operational effects thereof are also the same as those of the second and third embodiments. In the first embodiment (see FIG. 1), both end portions of the radiation plate 15 are wide portions 17a and 17b.

(Refer to the fifth embodiment, FIG. 11)
FIG. 11 shows a wireless IC device 1E according to the fifth embodiment of the present invention. In this wireless IC device 1E, gaps 18a and 18b are formed in the wide portions 17a and 17b of the radiation plate 15. Other configurations are the same as those of the second and fourth embodiments, and the effects thereof are also the same as those of the second and fourth embodiments. In particular, in the fifth embodiment, by providing the wide portions 17a and 17b with the gaps 18a and 18b, the resonance frequency of the radiation plate 15 can be lowered, and the overall length of the radiation plate 15 can be shortened. Miniaturization can be achieved while improving the radiation characteristics of the wireless IC device.

(See the sixth embodiment, FIG. 12)
FIG. 12 shows a wireless IC device 1F according to a sixth embodiment of the present invention. This wireless IC device 1 </ b> F is formed by bending end portions 26 a and 26 b of the annular electrode 25 toward the inside of the annular electrode 25. Other configurations are the same as those of the second and fourth embodiments, and the effects thereof are also the same as those of the second and fourth embodiments. In particular, in the sixth embodiment, since the end portions 26a and 26b are arranged toward the inner side of the annular electrode 25, the capacitance is increased between the bent portion including the end portions 26a and 26b and the line portion of the annular electrode 25 adjacent thereto. appear. The resonance frequency of the annular electrode 25 can be designed by this capacity and the length of the annular electrode 25, the overall length of the annular electrode 25 can be shortened, and the radio IC device can be miniaturized. Moreover, the design freedom of the annular electrode 25 is improved.

(Other examples)
The wireless IC device according to the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the gist thereof.

  For example, the materials of the radiation plate and the base material shown in the above-described embodiment are merely examples, and any materials can be used as long as they have necessary characteristics. Further, processing other than metal bumps may be used to connect the wireless IC chip to the electrode.

  Further, the wireless IC may be manufactured as an element in the power supply circuit board. By forming the wireless IC part in the power supply circuit board, the parasitic component in the connection part between the wireless IC part and the power supply circuit can be eliminated, and the characteristics of the wireless IC device can be improved. In addition, the height of the wireless IC device can be reduced. Further, by changing the electrode shape and arrangement of the coupling portion with the annular electrode of the feeder circuit board, the coupling between the feeder circuit and the annular electrode can be limited to only an electric field or a magnetic field.

  In each of the embodiments, the annular electrode and the radiation plate are formed symmetrically. However, the annular electrode may be connected to or coupled to the radiation plate at different positions.

The top view which shows the radio | wireless IC device which is 1st Example. Sectional drawing which shows the principal part of the radio | wireless IC device which is 1st Example. The top view which shows various shapes of the alignment part in 1st Example. The top view which shows the radio | wireless IC device which is 2nd Example. The equivalent circuit diagram which shows the electric power feeding circuit of the radio | wireless IC device which is 2nd Example. The perspective view which shows the state which mounted the radio | wireless IC chip on the electric power feeding circuit board which comprises the radio | wireless IC device which is 2nd Example. The graph which shows the frequency characteristic of the radiation gain of the radio | wireless IC device which is 2nd Example. The top view which shows the laminated structure of the electric power feeding circuit board which comprises the radio | wireless IC device which is 2nd Example. The top view which shows the radio | wireless IC device which is 3rd Example. The top view which shows the radio | wireless IC device which is 4th Example. The top view which shows the radio | wireless IC device which is 5th Example. The top view which shows the radio | wireless IC device which is 6th Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1A-1F ... Wireless IC device 2 ... Electromagnetic coupling module 5 ... Wireless IC chip 10 ... Feed circuit board 11 ... Feed circuit 15 ... Radiation plate 16a, 16b ... End part 17a, 17b ... Wide part 18a, 18b ... Air gap 25 ... Ring Electrode 26a, 26b ... End 27 ... Connection part 38a-38d ... Matching part L1, L2 ... Inductance element

Claims (10)

  1. A wireless IC;
    An annular electrode having at least a pair of ends;
    A matching portion provided at a pair of ends of the annular electrode;
    A dipole radiation plate connected to the current maximum point of the annular electrode;
    With
    The wireless IC is coupled to the matching unit,
    The annular electrode and the radiation plate are electromagnetically coupled at least in part;
    A wireless IC device characterized by the above.
  2. A wireless IC;
    An annular electrode having at least a pair of ends;
    A power feeding circuit including a resonance circuit and / or a matching circuit including an inductance element and having a predetermined resonance frequency;
    A dipole-shaped radiation plate connected to the current maximum point of the annular electrode;
    With
    The wireless IC is coupled with the power feeding circuit,
    The annular electrode and the radiation plate are electromagnetically coupled at least in part;
    A wireless IC device characterized by the above.
  3. The power supply circuit is formed on a power supply circuit board composed of a multilayer substrate made of ceramic or resin,
    The wireless IC and the power supply circuit board constitute an electromagnetic coupling module;
    The wireless IC device according to claim 2.
  4.   4. The wireless IC device according to claim 1, wherein the annular electrode has a rectangular shape, and the radiation plate is connected to a central portion in a longitudinal direction of the annular electrode. 5.
  5.   The wireless IC device according to any one of claims 1 to 4, wherein a maximum current point of the annular electrode is connected to a maximum point of current generated in the radiation plate.
  6.   The wireless IC device according to any one of claims 1 to 5, wherein a maximum current point of the annular electrode is connected to a central portion in a longitudinal direction of the radiation plate.
  7.   The wireless IC device according to any one of claims 1 to 6, wherein the annular electrode has a rectangular shape, and is electromagnetically coupled to the radiation plate at three sides of the rectangular shape.
  8.   The wireless IC device according to any one of claims 1 to 7, wherein a wide portion wider than a line width of a central portion in a longitudinal direction of the radiation plate is provided at both ends of the radiation plate.
  9.   The wireless IC device according to any one of claims 1 to 8, wherein both end portions of the radiation plate are arranged so as to sandwich the annular electrode from both sides in a plan view.
  10.   The wireless IC device according to any one of claims 1 to 9, wherein the pair of end portions of the annular electrode are arranged toward the inside of the annular electrode.
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Cited By (58)

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