JP2018092482A - Ic module, medium mounted with ic module and method for manufacturing ic module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC module at low manufacturing costs, and with a high degree of freedom in design, a medium mounted with the IC module, and a method for manufacturing the IC module.SOLUTION: An IC module is provided with: a module base material 33; an IC chip 34 provided on a first surface of the module base material 33, and in which a first terminal and a second terminal are formed; a connection coil 31 provided on the first surface; and a pad 60 provided on the first surface and inside the connection coil 31, in which the first terminal 34b and the pad 60 are connected with each other by a first conductive wire 41, the pad 60 and a first end 39 of the connection coil 31 are connected with each other by a second conductive wire 42, a second end 40 of the connection coil 31 and the second terminal 34c are connected with each other by a third conductive wire 43, the first conductive wire 41, and the third conductive wire 43 are provided on a first surface side, and the second conductive wire crosses the connection coil 31 in three-dimension on the first surface side.SELECTED DRAWING: Figure 5

Description

  The present invention relates to an IC module capable of contact communication and non-contact communication, a medium on which the IC module is mounted, and a method for manufacturing the IC module.

  An IC module equipped with an IC chip having a contact communication function and a non-contact communication function has been used for various applications because the communication mode can be selectively used according to the user's application. This IC module is used as a dual IC card by being attached to a card body capable of power supply and communication by electromagnetic coupling (electromagnetic coupling, transformer coupling, etc.) with the IC module.

  In a dual IC card, for example, contact communication is used in applications that require certainty and safety, such as exchange of a large amount of data such as credits and communication of settlement work. On the other hand, authentication is the main communication content such as entrance / exit gate management, and contactless communication is used in applications where the amount of communication data is small.

  By electrically connecting the IC module and the card body by electromagnetic coupling, it is possible to suppress the unstable electrical connection between the IC module and the card body. This is because when the IC module and the card body are directly connected by a conductive connecting member such as solder, the connecting member may be damaged when the dual IC card is bent.

As such dual IC cards in which the IC module and the card body are electrically connected by electromagnetic coupling as described above, for example, those described in Patent Documents 1 and 2 are known.
The IC module for the dual IC card has a contact communication terminal (contact terminal portion) formed on the front surface and a connection coil for non-contact communication formed on the back surface.

In the IC module, a closed circuit is configured by a connection coil, an IC chip, and the like for electromagnetic coupling with the card body. The connection coil is formed in a spiral shape for electromagnetic coupling with the card body. In order to constitute the above closed circuit, it is necessary to connect both ends of the connection coil to an IC chip disposed on the base of the IC module. Here, in order to connect both ends of the connection coil to the IC chip, it is necessary to use a through hole, a bridge circuit, or the like.
Patent Document 3 describes an IC module in which both ends of a connection coil are connected to an IC chip using wire bonding or the like through a punching hole.

International Publication No. 99/26195 International Publication No. 96/35190 International Publication No. 2014/208532

However, in the connection method using punching holes, it is necessary to perform punching hole processing on the substrate of the IC module and to form a bridge circuit on the surface opposite to the surface on which the IC chip is mounted. This complicates the IC module manufacturing process and increases the IC module manufacturing cost.
Further, in the connection method using the punching hole, the portion where the punching hole can be formed is restricted by the IC card standard or the like, so that there is a certain restriction on the design of the connection coil or the like.

  The present invention has been made in view of such problems, and can be easily and inexpensively manufactured without punching hole processing for forming a closed circuit for non-contact communication on the base material of an IC module. It is another object of the present invention to provide an IC module having a higher degree of design freedom such as a connection coil, a medium on which the IC module is mounted, and a method for manufacturing the IC module.

In order to solve the above problems, the present invention proposes the following means.
The IC module of the present invention has a sheet-like module base material and both a contact-type transmission function and a non-contact-type transmission function provided on the first surface of the module base. An IC chip on which a terminal and a second terminal are formed; a connection coil as a non-contact transmission mechanism formed in a spiral shape around the IC chip on the first surface of the module base; and the module base A first surface of the material, provided on the inner side of the connection coil, a conductive pad, a contact terminal portion provided on the second surface of the module substrate, which is a contact-type transmission element, The first terminal of the IC chip and the pad are connected by a first conductive line, the pad and the first end of the connection coil are connected by a second conductive line, and the connection coil The second end of the IC and in front of the IC chip The second terminal is connected by a third conductive wire, and the first conductive wire and the third conductive wire are provided on the first surface side of the module substrate, and the second terminal The conductive wire three-dimensionally intersects with the connection coil on the first surface side of the module substrate.

In the IC module, it is more preferable that the second conductive wire is connected by wire bonding.
In the IC module, it is more preferable that one or both of the first conductive line and the third conductive line are connected by wire bonding.

The IC module preferably further includes a resin sealing portion that covers the IC chip, the pad, the first conductive wire, and the third conductive wire.
Furthermore, in the above IC module, it is more preferable to include a resin sealing portion that covers the IC chip, the pad, the first conductive line, the second conductive line, and the third conductive line.

  A medium on which the IC module of the present invention is mounted performs non-contact communication between the above-described IC module, a coupling coil for electromagnetically coupling with the connection coil of the IC module, and a non-contact type external device. For this purpose, an antenna substrate having an antenna coil connected to the coupling coil and a main body in which a concave portion for accommodating the antenna substrate and accommodating the IC module is formed.

  In the method for manufacturing an IC module of the present invention, the connection coil is formed in a spiral shape on the first surface of the sheet-like module base material, and the first surface of the module base material and the inside of the connection coil, A conductive pad is formed, a contact terminal portion that is a contact-type transmission element is formed on the second surface of the module substrate, the first surface of the module substrate, and the inside of the connection coil An IC chip having both a contact-type transmission function and a non-contact-type transmission function and having a first terminal and a second terminal formed thereon, and the first terminal and the pad of the IC chip On the first surface side of the module substrate, and the pad and the first end of the connection coil are connected to each other on the first surface side of the module substrate. , So that it intersects with the connecting coil Connected by a second conductive wire, and the second end of the connection coil and the second terminal of the IC chip are connected by a third conductive wire on the first surface side of the module substrate. To do.

In the IC module manufacturing method, it is more preferable that the IC chip, the pad, the first conductive wire, and the third conductive wire are covered with a resin sealing portion.
Furthermore, in the above IC module manufacturing method, it is more preferable to cover the IC chip, the pad, the first conductive wire, the second conductive wire, and the third conductive wire with a resin sealing portion. .

  According to the present invention, the manufacturing cost of an IC module can be reduced, and the degree of freedom in designing connection coils and the like can be increased.

It is sectional drawing of the side which shows typically the dual IC card of one Embodiment of this invention. It is the top view which permeate | transmitted a part of card body of the dual IC card. It is a top view of the IC module of one embodiment of the present invention. It is sectional drawing of the IC module. It is a bottom view of the IC module. It is sectional drawing of the side surface in the IC module of the modification of one Embodiment of this invention. It is a bottom view of the IC module of the modification of one Embodiment of this invention. It is sectional drawing of the side surface in the IC module of the modification of one Embodiment of this invention. It is a bottom view of the IC module of the modification of one Embodiment of this invention. It is sectional drawing of the side surface in the IC module of the modification of one Embodiment of this invention. It is a bottom view of the IC module of the modification of one Embodiment of this invention. It is sectional drawing explaining the manufacturing method of the IC module of one Embodiment of this invention. It is sectional drawing explaining the manufacturing method of the IC module. It is sectional drawing explaining the manufacturing method of the IC module. It is an equivalent circuit diagram for demonstrating the principle of the dual IC card.

Hereinafter, an embodiment of an IC module, a medium on which the IC module is mounted, and a manufacturing method of the IC module according to the present invention will be described with reference to FIGS.
As shown in FIGS. 1 and 2, the dual IC card 1 that is a medium on which the IC module 30 according to the present embodiment is mounted has the antenna substrate 12 and the antenna substrate 12 accommodated therein, and the recess 11 is formed. A plate-shaped card body 10 (main body) and an IC module 30 accommodated in the recess 11 are provided.
FIG. 1 is a cross-sectional view schematically showing the dual IC card 1, in which the number of turns of an antenna 13 described later is simplified. In FIG. 2, the antenna 13 and the capacitive element 14 in the card body 10 are shown, and only the outer shape of the antenna substrate 12 is shown.

    The antenna substrate 12 includes an antenna 13 and a capacitive element 14 that is electrically connected to the antenna 13.

The antenna substrate 12 is formed using an insulating and durable material such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN).
The antenna substrate 12 is formed in a rectangular shape having a long side 12e and a short side 12c, and the thickness of the antenna substrate 12 is, for example, 15 to 50 μm (micrometer).
On the short side 12c side of the antenna substrate 12, an accommodation hole 12g penetrating in the thickness direction D of the antenna substrate 12 is formed. The housing hole 12g is formed in a rectangular shape having sides parallel to the long side 12e and the short side 12c of the antenna substrate 12 when viewed in the thickness direction D.

    The antenna 13 is a coupling coil 18 that is electromagnetically coupled to a connection coil 31 of the IC module 30 described later, and a coupling coil 18 for non-contact communication with a non-contact type external device (not shown) such as a reader / writer. A main coil 19 (antenna coil) connected to the. As shown in FIG. 2, the coupling coil 18 is a coil disposed in the coupling coil region R1 in which the accommodation hole 12g is provided, and the main coil 19 is a main coil adjacent to the coupling coil region R1. The coil is disposed in the region R2. On the long side 12e side of the antenna substrate 12, an embossed region R3 in which embossing can be formed is set based on an IC card standard (X 6302-1: 2005 (ISO / IEC 7811-1: 2002)).

As shown in FIGS. 1 and 2, the capacitive element 14 includes an electrode plate 14a provided on the first surface 12a on the antenna substrate 12 on the side close to the opening side of the recess, and the opposite side to the first surface 12a. And the electrode plate 14b provided on the second surface 12b. The electrode plate 14a and the electrode plate 14b are disposed so as to face each other with the antenna substrate 12 interposed therebetween.
The electrode plate 14 a is connected to the end of the strand 19 a disposed on the innermost side of the main coil 19.
A connection wiring 21 provided on the second surface 12b is connected to the electrode plate 14b. The connection wiring 21 extends to a portion of the second surface 12b of the antenna substrate 12 that faces the terminal portion 20, and a terminal portion (not shown) is provided in the extended portion. The terminal portion 20 of the coupling coil 18 and the terminal portion of the connection wiring 21 are electrically connected by a known crimping process or the like. The capacitive element 14 is connected in series between the coupling coil 18 and the main coil 19.
The antenna 13, the capacitive element 14, and the connection wiring 21 can be formed, for example, by performing etching of a resist coating method by general gravure printing on the antenna substrate 12 on a copper foil or an aluminum foil.

    The card substrate 15 is made of an insulating material such as a polyester material such as amorphous polyester, a vinyl chloride material such as PVC (polyvinyl chloride), a polycarbonate material, or PET-G (polyethylene terephthalate copolymer). Is formed in a rectangular shape in plan view.

The card body 10 is formed by sandwiching the antenna substrate 12 between the card base 15 and performing integration such as laminating or bonding by hot pressure, and then punching into the shape of the card body 10. A laminate of a plurality of base materials can be used as the card base material 15.
In the following description, the surface of the card body 10 on the first surface 12a side of the antenna substrate 12 is referred to as a card body surface 10a, and the surface opposite to the card body surface 10a is referred to as a card body back surface 10b.

  The recess 11 is formed by milling the card substrate 15. The concave portion 11 includes a first accommodating portion 24 formed on the card body surface 10 a and a second accommodating portion 25 having a smaller diameter than the first accommodating portion 24 formed on the bottom surface of the first accommodating portion 24. Have. An opening 11a of the first housing portion 24 is formed in the card body surface 10a.

    As shown in FIGS. 3 to 5, the IC module 30 includes a sheet-like module base 33, an IC chip 34 provided on the first surface 33 a of the module base 33, a pad 60, a connection coil 31, A plurality of contact terminals (contact terminal portions) 35 provided on the second surface 33 b of the module base 33 are provided.

    The module substrate 33 is formed of an insulating material such as glass epoxy or PET in a rectangular shape in plan view. The thickness of the module base material 33 is 50-200 micrometers, for example.

As the IC chip 34, a known structure having a contact communication function and a non-contact communication function can be used. The IC chip 34 is bonded to the module substrate 33 with a die attach adhesive.
In the IC chip 34, a first terminal 34b, a second terminal 34c, and a plurality of connection terminals 34d are formed on the outer surface of the chip body 34a.

The connection coil 31 is formed in a spiral shape on the first surface 33 a of the module substrate 33 so as to surround the IC chip 34. In the present embodiment, the connection coil 31 is wound around the IC chip 34 three times. The end of the strand arranged on the outermost side of the connection coil 31 (first end) and the end of the strand arranged on the innermost side (second end) are more than the width of the strand. A first terminal portion 39 and a second terminal portion 40 having a wide diameter are also provided.
The connection coil 31 is formed by patterning a copper foil or an aluminum foil by etching, and the thickness is, for example, 5 to 50 μm.
The connection coil 31 constitutes a non-contact terminal portion by electromagnetic coupling with the coupling coil 18 of the card body 10.

The plurality of contact terminals 35 are formed in a predetermined pattern by laminating, for example, a copper foil on the second surface 33 b of the module base material 33.
The plurality of contact terminals 35 are electrically insulated from each other. A portion of the copper foil exposed to the outside may be provided with a nickel layer having a thickness of 0.5 to 3 μm by plating, and a gold layer having a thickness of 0.01 to 0.3 μm is further plated on the nickel film. It may be provided.
Each contact terminal 35 is for making contact with a contact-type external device such as an automatic teller machine. The contact terminal 35 is connected to an element (not shown) or the like built in the chip body 34 a of the IC chip 34.
A plurality of contact terminals may be formed on the second surface 33b of the module substrate 33 with a lead frame having a thickness of 50 to 200 μm, and a connection coil may be formed on the first surface 33a of the module substrate 33 with a copper wire. .

  The pad 60 is formed on the first surface 33 a of the module base material 33 and on the inner side of the connection coil 31. The pad 60 is a terminal portion having electrical conductivity formed by patterning a copper foil or an aluminum foil by etching like the connection coil 31, and has a thickness of 5 to 50 μm, for example.

The first terminal 34 b of the IC chip 34 and the pad 60 are connected by wire bonding using a first wire (first conductive line) 41. The pad 60 and the first terminal portion 39 of the connection coil 31 are connected by wire bonding using a second wire (second conductive wire) 42. The second terminal portion 40 of the connection coil 31 and the second terminal 34 c of the IC chip 34 are connected by wire bonding using a third wire (third conductive wire) 43.
Instead of connection by wire bonding of the first wire 41 or the third wire 43, connection by pattern wiring formed on the first surface 33a of the module base 33 may be performed. That is, it is only necessary to be connected on the first surface 33 a side of the module base material 33.
The second wire 42 jumps over the connection coil 31 on the first surface 33 a side of the module base 33 and connects the pad 60 and the first terminal portion 39 of the connection coil 31. The second wire 42 three-dimensionally intersects with the connection coil 31 on the first surface 33 a side of the module base material 33.
Instead of connection by wire bonding of the second wire 42, connection by the following wiring pattern may be performed. An insulating layer is formed on the connection coil 31, and a wiring pattern is formed on the connection coil 31 so as to three-dimensionally intersect with the connection coil 31, and the pad 60 and the first terminal portion 39 of the connection coil 31 are connected by the wiring pattern. To do. Connection with lower probability of occurrence of disconnection is possible.

    The connection terminal 34d of the IC chip 34 and the contact terminal 35 are connected by wire bonding with a connection wire 44 inserted through the punching hole 33e.

  The wires 41, 42, 43 and the connection wire 44 are made of gold or copper and have an outer diameter of, for example, 10 to 40 μm.

Thus, the IC chip 34, the connection coil 31, the pad 60, and the wires 41, 42, and 43 constitute a closed circuit for non-contact communication. The first terminal 34 b of the IC chip 34 and the pad 60, and the pad 60 and the connection coil 31 are connected by wire bonding using wires 41, 42, and 43.
In order to configure the above closed circuit, it is not necessary to form a through hole in the module base material 33, and the manufacturing cost of the IC module 30 can be reduced.
Further, the first terminal portion 39 of the connection coil 31 and the first terminal 34 b of the IC chip 34 are connected via the pad 60 instead of directly. Therefore, the degree of freedom in the layout design of the wires 41 and 42 used for this connection can be increased.
Here, if at least the second wire 42 is connected by wire bonding, the degree of freedom in the layout design of the pad 60, the first wire 41, and the second wire 42 can be increased.

6 and 7, in addition to the components of the IC module 30, the IC chip 34, the pad 60, the first wire 41, the third wire 43, and the connection wire 44 are provided. You may provide the resin sealing part 51 to cover. In FIG. 7, the resin sealing part 51 is permeate | transmitted and the outer peripheral line of the resin sealing part 51 is shown with the dashed-two dotted line. The resin sealing portion 51 can be formed of, for example, a known epoxy resin.
By providing the resin sealing part 51 in the IC module 30 </ b> A, the IC chip 34 can be protected, and disconnection of the wires 41 and 43 can be prevented.

  Further, as in the IC module 30B shown in FIGS. 8 and 9, the resin sealing portion 51 </ b> B that is enlarged to cover the second wire 42 and the first terminal portion 39 of the connection coil 31 is formed. May be. The second wire 42 can be protected together.

Further, like the IC module 30C shown in FIGS. 10 and 11, in order to arrange the first terminal portion 39 of the connection coil 31 on the inner side, a part of the connection coil 31 is curved toward the IC chip 34 side. You may comprise so that the 2nd wire 42 connected with the 1st terminal part 39 of the connection coil 31 may be covered with the resin sealing part 51. FIG. In this case, all of the wires 41, 42 and 43 are covered with the resin sealing portion 51.
By configuring the IC module 30C in this way, it is possible to more suitably prevent the wires 41, 42, and 43 from being disconnected.
The resin sealing portion 51 is preferably smaller in size as long as it can cover the IC chip 34 and the wires 41, 42, and 43 and has a certain strength. It is not necessary to form the resin sealing portion 51 large until the resin sealing portion 51 covers the entire connection coil 31.

When the resin sealing part 51 covers the wires 41, 42 and the like, the wires 41, 42 may be disconnected.
The first terminal portion 39 of the connection coil 31 and the first terminal 34b of the IC chip 34 are connected via the pad 60, not directly. Compared to the case where the first terminal portion 39 of the connection coil 31 and the first terminal 34b of the IC chip 34 are directly wire-bonded with a single wire, the pad 60 is connected to the first terminal portion of the connection coil 31. 39 and the first terminal 34 b of the IC chip 34, the length of the wire used for connection can be shortened, and the probability of occurrence of disconnection can be reduced in the process of covering with the resin sealing portion 51.

  Normally, different IC chips are selected for each type of IC card, and the dimensions of IC chip terminals and the like differ for each type of IC chip. When changing to a different type of IC chip, the connection with the connection coil 31 is basically redesigned. When the IC chip and the connection coil 31 are connected via the pad 60, there is no need to change the design regarding the connection between the connection coil 31 and the pad 60 even in such a case, and the connection from the pad 60 to a different IC chip is re-established. Just design.

Next, a method for manufacturing the IC module 30 for manufacturing the IC module 30 configured as described above will be described.
First, as shown in FIG. 12, the connection coil 31, the first terminal portion 39, the second terminal portion 40, and the pad 60 are formed on the first surface 33 a of the module substrate 33. The connection coil 31 and the pad 60 are formed by performing a known etching on the copper foil attached to the first surface 33a of the module base 33 to form a certain pattern on the copper foil.
The connection coil 31 is formed in a spiral shape around the position where the IC chip 34 is attached.
The pad 60 is formed inside the connection coil 31.
A punching hole 33e (not shown) is formed by a known punch or the like in a portion of the module substrate 33 where the connection coil 31 is not formed. In addition, after forming the punching hole 33e in the module base material 33, the connection coil 31 may be formed in the module base material 33.

    As shown in FIG. 13, a plurality of contact terminals 35 are formed on the second surface 33 b of the module substrate 33. The contact terminal 35 is formed by performing a known etching on the copper foil attached to the second surface 33b of the module substrate 33 to form a certain pattern on the copper foil.

  Next, as shown in FIG. 14, the IC chip 34 is attached to the inside of the connection coil 31 on the first surface 33 a of the module base 33. A known die attach adhesive can be suitably used for attaching the IC chip 34.

Subsequently, as shown in FIGS. 4 and 5, the connection coil 31, the IC chip 34, the pad 60, and the plurality of contact terminals 35 are connected by wire bonding using wires 41, 42, and 43. Specifically, the first terminal 34b of the IC chip 34 and the pad 60 are connected by the first wire 41 on the first surface side of the module substrate. The pad 60 and the first terminal portion 39 of the connection coil 31 are connected by the second wire 42 so as to form a three-dimensional intersection with the connection coil on the first surface side of the module substrate. The second terminal portion 40 of the connection coil 31 and the second terminal 34c of the IC chip 34 are connected by a third wire 43 on the first surface side of the module base material.
Instead of connection by wire bonding of the first wire 41 and the third wire 43, connection by pattern wiring formed on the first surface 33a of the module base 33 may be performed.
The connection terminal 34d of the IC chip 34 and the contact terminal 35 are connected by wire bonding with a connection wire 44 inserted through the punching hole 33e.
The IC module 30 is manufactured through the above steps.

For example, the antenna 13 and the capacitive element 14 are formed on the antenna substrate 12 by etching using a general gravure printing resist coating method. The antenna substrate 12, the antenna 13, and the capacitive element 14 are sandwiched between a pair of card base materials 15, and the pair of card base materials 15 are integrated with each other by lamination or adhesive by heat pressure. After that, it is punched into individual card shapes.
The recess 11 is formed on the card substrate 15 by milling. As shown in FIG. 1, when the IC module 30 is accommodated in the recess 11 of the card body 10 and the card body 10 and the IC module 30 are joined with an adhesive such as a hot melt sheet (not shown), the dual IC card 1 is Complete.

  When manufacturing the above-described IC module 30B, the IC chip 34 and the wires 41, 42, and 43 are resin-sealed using a mold or potting (not shown), and the IC chip 34 and the wires 41, 42, and 43 are attached. The resin sealing part 51 to cover is formed.

Next, the operation of the dual IC card 1 configured as described above will be described. FIG. 15 is an equivalent circuit diagram for explaining the principle of the dual IC card 1.
A high frequency magnetic field is induced in the transmission / reception coil D12 by a high frequency signal (not shown) generated by the transmission / reception circuit D11 of the reader / writer (non-contact type external device) D10. This high frequency magnetic field is radiated to space as magnetic energy.

At this time, when the dual IC card 1 is positioned in the high frequency magnetic field, a current flows through the parallel resonant circuit formed by the antenna 13 and the capacitive element 14 of the dual IC card 1 due to the high frequency magnetic field.
A signal received by the resonance circuit of the main coil 19 and the capacitive element 14 is transmitted to the coupling coil 18. Thereafter, a signal is transmitted to the IC chip 34 by electromagnetic coupling between the coupling coil 18 and the connection coil 31.

    Although not shown, when the dual IC card 1 performs power supply and communication with a contact type external device such as an automatic teller machine, a terminal provided on the automatic teller machine is connected to the dual IC card. Contact the contact terminal 35 of the card 1. Then, power supply and communication are performed between the control unit of the automatic teller machine and the IC chip 34.

As described above, according to the IC module 30 and the manufacturing method of the IC module 30 of the present embodiment, the wire through the through hole or the punching hole is formed by the IC chip 34, the connection coil 31, and the wires 41, 42, and 43. A closed circuit for non-contact communication is configured without using bonding. Therefore, it is not necessary to perform through-hole processing or punching hole processing on the module base 33 in order to form this closed circuit, and the IC module 30 can be manufactured easily and inexpensively.
Further, since the first terminal portion 39 of the connection coil 31 and the first terminal 34b of the IC chip 34 are connected not directly but via the pad 60, the arrangement of the wires 41 and 42 used for this connection is arranged. The degree of design freedom can be increased.

By covering the IC chip 34, the pad 60, and the wires 41, 42, and 43 with the resin sealing portion 51, it is possible to protect the IC chip 34 and prevent the wires 41, 42, and 43 from being disconnected.
By arranging the pad 60 in the intermediate portion between the first terminal portion 39 of the connection coil 31 and the first terminal 34b of the IC chip 34, the length of each wire used for connection can be shortened. In covering processing, the probability of occurrence of disconnection can be reduced.

    According to the medium on which the present IC module is mounted, for example, the dual IC card 1, the IC module 30 can be manufactured easily and inexpensively, so that the entire dual IC card 1 accommodating the IC module 30 can be manufactured easily and inexpensively. Can do.

Although one embodiment of the present invention has been described in detail with reference to the drawings, the specific configuration is not limited to this embodiment, and modifications and combinations of configurations within the scope not departing from the gist of the present invention are also possible. included.
For example, in the above embodiment, the main coil 19 and the connection coil 31 are wound three times, and the coupling coil 18 is wound five times. However, the number of times that the coils 18, 19, and 31 are wound is not limited to this, and the coils 18, 19, and 31 need only be wound once or more.
The number of the contact terminals 35 included in the contact terminal portion may be one instead of a plurality.
In the embodiment, the IC module 30 is provided in the dual IC card 1. However, what is provided with the IC module 30 is not limited thereto, and may be provided in a medium such as a booklet such as an inlet or a passport. When the IC module 30 is provided on the back cover of the booklet, a recess is formed at the center of the back cover, a coupling coil is provided around the recess, and a main coil is provided at the edge of the back cover.

1 Dual IC card 10 Card body (main body)
11 Concave portion 13 Antenna 18 Coil for coupling 19 Main coil (antenna coil)
30, 30A, 30B IC module 31 connection coil 33 module base 33a first surface 33b second surface 33e punching hole 34 IC chip 34b first terminal 34c second terminal 35 contact terminal (contact terminal portion)
39 1st terminal part (1st edge part)
40 Second terminal (second end)
41 First wire (first conductive wire)
42 Second wire (second conductive wire)
43 Third wire (third conductive wire)
44 Connection wire (auxiliary conductive wire)
51 Resin sealing part 60 Pad D Thickness direction D10 Reader / writer

Claims (9)

A sheet-like module substrate;
An IC chip provided with a function of both a contact-type transmission function and a non-contact-type transmission function provided on the first surface of the module base material, wherein the first terminal and the second terminal are formed;
A connection coil that is a non-contact transmission mechanism formed in a spiral shape around the IC chip on the first surface of the module substrate;
A first surface of the module substrate and a pad having electrical conductivity provided on the inner side of the connection coil;
A contact terminal portion, which is a contact-type transmission element, provided on the second surface of the module substrate;
With
The first terminal of the IC chip and the pad are connected by a first conductive line,
The pad and the first end of the connection coil are connected by a second conductive wire,
The second end of the connection coil and the second terminal of the IC chip are connected by a third conductive wire,
The first conductive wire and the third conductive wire are provided on the first surface side of the module substrate,
The second conductive wire is three-dimensionally crossed with the connection coil on the first surface side of the module substrate.
IC module. The second conductive wire is connected by wire bonding,
The IC module according to claim 1. One or both of the first conductive line and the third conductive line are connected by wire bonding,
The IC module according to claim 2. A resin sealing portion covering the IC chip, the pad, the first conductive wire, and the third conductive wire;
The IC module according to claim 1. A resin sealing portion covering the IC chip, the pad, the first conductive line, the second conductive line, and the third conductive line;
The IC module according to claim 1. An IC module according to claim 1;
A coupling coil for electromagnetically coupling with the connection coil of the IC module, and an antenna substrate having an antenna coil connected to the coupling coil for performing non-contact communication with a non-contact type external device;
A main body that accommodates the antenna substrate and has a recess that accommodates the IC module;
A medium equipped with an IC module comprising A connection coil is formed in a spiral shape on the first surface of the sheet-like module substrate,
On the first surface of the module substrate and on the inside of the connection coil, a conductive pad is formed,
On the second surface of the module substrate, a contact terminal portion that is a contact-type transmission element is formed,
A first terminal and a second terminal are formed on the first surface of the module substrate and on the inner side of the connection coil, having both a contact-type transmission function and a non-contact-type transmission function. Install IC chip,
The first terminal of the IC chip and the pad are connected by a first conductive wire on the first surface side of the module substrate,
The pad and the first end of the connection coil are connected by a second conductive line so as to three-dimensionally intersect the connection coil on the first surface side of the module base material,
The second end of the connection coil and the second terminal of the IC chip are connected by a third conductive wire on the first surface side of the module substrate.
IC module manufacturing method.     The method for manufacturing an IC module according to claim 7, wherein the IC chip, the pad, the first conductive line, and the third conductive line are covered with a resin sealing portion.   The method of manufacturing an IC module according to claim 7, wherein the IC chip, the pad, the first conductive line, the second conductive line, and the third conductive line are covered with a resin sealing portion.

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