JP2021018516A - Ic module, dual ic card and method for manufacturing ic module - Google Patents

Abstract

To provide an IC module without exceeding the thickness limitation of an IC module storage part formed in a dual IC card base material, and a method for manufacturing the same.SOLUTION: In a dual IC card IC module allowing communication, a recessed part for storing an IC module is formed in a part of a card base material, and electric power is supplied through the connection coil 31 of the IC module by a combination coil formed around the recessed part. The connection coil is spirally formed along a peripheral portion of the base material of the IC module; an IC chip 34 is mounted in the inside of the connection coil; and the thickness of a sealing resin part 2 for protecting the IC chip, through holes for connecting rear surface side electrodes formed around the IC chip and the IC chip by wire bonding and wires thereof and the thickness of a sealing resin part 3 for protecting the outer terminal part of the connection coil, the through holes and the wires are equal to or less than the depth of the recessed part.SELECTED DRAWING: Figure 1

Description

The present invention relates to a method for manufacturing an IC module, a dual IC card, and an IC module capable of contact type communication and non-contact type communication.

An IC module equipped with an IC chip having a contact type communication function and a non-contact type communication function is used for various purposes because the communication function can be properly used according to the user's application. For example, an IC module equipped with an IC chip having such a function is attached to a card body and used as a dual IC card. The IC module and the card body are electrically connected by electromagnetic coupling (transformer coupling), and power supply and communication are possible. This is because if the IC module and the card body are directly connected by a conductive connecting member such as solder, the connecting member may be damaged when the dual IC card is bent.

A terminal (contact terminal portion) for a contact interface with an external device is formed on the front surface of the IC module for a dual IC card, and a connection coil for electromagnetic coupling is formed on the back surface.

A recess is formed in the card body made of a plate-shaped card base material by milling, and an IC module is housed therein. The IC module housing portion of the card base material is composed of an inner portion and an outer portion having different depths, and the inner portion is deeper. By deepening only the inside instead of deepening the entire depth to insert the resin-sealed part of the IC module, the outer IC module housing part has a depth that does not affect the position of the coupling coil. It may be milled. By doing so, it is possible to secure a sufficient number of turns of the coupling coil provided in the antenna inside the card base material for electromagnetic coupling with the connection coil of the IC module. If the number of turns of the coupling coil is insufficient, sufficient signal transmission cannot be performed due to insufficient electromagnetic coupling.

A card base for moving from the outermost end of the connection coil formed on the back surface of the IC module by bridging the connection point connected to the end to a position adjacent to the IC chip on the surface of the card base material. Through-hole plating is applied to the material, and a bridge (bridging wiring is formed and connected) is formed on the surface. The contact terminals on the front surface of the IC module base material and the IC chips on the back surface are connected by punching hole wire bonding. Punching hole wire bonding is to form a through hole in the IC module base material in contact with the back surface of the contact terminal on the front surface, and wire bond the two with a conductive wire through (inserting) the through hole.

Further, in the base material of the IC module that is not subjected to the through-hole plating process, through holes are formed at both ends of the bridging wiring provided for bridging the outermost end of the connecting coil, and the terminal of the IC chip is formed. It is possible to connect between the bridging wiring and between the connecting coil and the bridging wiring by a conductive wire through which a through hole is inserted. In this way, the connection is completed by wire bonding without performing through-hole plating. Therefore, it is possible to manufacture an IC module easily and inexpensively.

A configuration example of the dual IC card and the IC module will be described in more detail with reference to the drawings.
As shown in FIGS. 12 and 13, the dual IC card 1 includes a plate-shaped card body 10 in which a recess 11 is formed, and an IC module 30 housed in the recess 11.
Note that FIG. 13 is a cross-sectional view schematically showing the dual IC card 1, and the number of turns of the antenna 13 described later is simplified. In FIG. 12, the antenna 13 and the capacitive element 14 in the card body 10 are shown, and only the outer shape thereof is shown through the substrate 12.

The card body 10 includes a substrate 12, an antenna 13 provided on the first surface 12a of the recess 11 of the substrate 12 on the opening 11a side, a capacitive element 14 electrically connected to the antenna 13, and the substrate 12. It has a pair of card base materials 15 laminated with the antenna 13 and the capacitive element 14 interposed therebetween.
The substrate 12 is formed in a rectangular shape in a plan view using a material having an insulating property such as PET (polyethylene terephthalate) or polyethylene naphthalate (PEN) (see FIG. 12). Each card base material 15 is also formed in a rectangular shape in a plan view.
An accommodating hole 12d penetrating in the thickness direction D of the substrate 12 is formed on the short side 12c side of the substrate 12, that is, the short side side of the card base material 15. The accommodating hole 12d is formed in a rectangular shape having a side parallel to the short side and the long side of the substrate 12 in a plan view. The thickness of the substrate 12 is, for example, 15 to 50 μm (micrometer).

The antenna 13 is coupled to perform non-contact communication with a coupling coil 18 for electromagnetic coupling with the connection coil 31 described later of the IC module 30 and a non-contact external device (not shown) such as a reader / writer. It has a main coil 19 connected to the coil 18. The coupling coil 18 is a coil arranged in the region R1 in FIG. 12, and the main coil 19 is a coil arranged in the region R2 adjacent to the region R1. On the long side 12e side of the substrate 12 with respect to the accommodating hole 12d, that is, the long side side of the card base material 15, an embossed region R3 on which embossing can be formed is an IC card standard (X6302-1: 2005 (ISO / IEC 7811-) It is set based on 1: 2002)).

In this example, the coupling coil 18 is formed in a spiral shape and is wound around the accommodating hole 12d five times. The width of the wiring 18a constituting the coupling coil 18 in the embossed region R3 is wider than the width of the wiring 18b other than the embossed region R3. At the end of the wiring 18b arranged on the innermost side of the coupling coil 18, a terminal portion 20 having a width wider than that of the wiring 18b and formed in a substantially circular shape is provided. The terminal portion 20 is formed on the first surface 12a.
The main coil 19 is formed in a spiral shape and is wound three times in the region R2. The width of the wiring 19a constituting the main coil 19 in the embossed region R3 is wider than the width of the wiring 19b other than the embossed region R3. By widening the width of the wiring 19a and the width of the wiring 18a described above, it is possible to prevent the wirings 18a and 19a from being disconnected when the embossing is formed in the embossed region R3.
The end of the wiring 18a arranged on the outermost side of the coupling coil 18 is connected to the end of the wiring 19a arranged on the outermost side of the main coil 19.

As shown in FIGS. 12 and 13, the capacitive element 14 comprises an electrode plate 14a provided on the first surface 12a of the substrate 12 and an electrode plate 14b provided on the second surface 12b of the substrate 12. Have. The electrode plates 14a and 14b are arranged so as to face each other with the substrate 12 interposed therebetween.
The electrode plate 14a is connected to the end of the wiring 19b arranged on the innermost side of the main coil 19.
The connection wiring 21 provided on the second surface 12b is connected to the electrode plate 14b. The connection wiring 21 extends to a portion of the second surface 12b of the substrate 12 facing the terminal portion 20, and a terminal portion (not shown) is provided in the extended portion. The terminal portion 20 of the coupling coil 18 and the terminal portion of the connection wiring 21 are electrically connected by a known crimping process or the like. The capacitive element 14 is connected in series between the coupling coil 18 and the main coil 19.

The card base material 15 has insulation and durability such as polyester-based material such as amorphous polyester, vinyl chloride-based material such as PVC (polyvinyl chloride), polycarbonate-based material, and PET-G (polyethylene terephthalate copolymer). It is made of a material having.
As shown in FIG. 13, the recess 11 described above is formed in the card base material 15. The recess 11 has a first accommodating portion 24 formed on the side surface of the card base material 15 and a second accommodating portion 25 having a diameter smaller than that of the first accommodating portion 24 formed on the bottom surface of the first accommodating portion 24. And have. The opening on the side surface side of the card base material 15 of the first accommodating portion 24 is the above-mentioned opening 11a.

Next, an example of the IC module will be described.
As shown in FIGS. 10 and 11, the IC module 30 includes a sheet-shaped module base material 33, an IC chip 34 and a connection coil 31 provided on the first surface 33a of the module base material 33, and a module base material. A plurality of contact terminals (also referred to as contact terminal portions) 35 and bridges (also referred to as bridging wiring) 36 provided on the second surface 33b of 33 are provided.
The module base material 33 is made of the same material as the substrate 12, and is formed in a rectangular shape in a plan view. The module base material 33 has a first through hole (hereinafter, the through hole is also referred to as a through hole) 33c and a second through hole that are separated from each other at positions that overlap both ends of the bridge 36 in the thickness direction D. A hole (also referred to as a second through hole) 33d is formed. The thickness direction of the module base material 33 coincides with the thickness direction D of the substrate 12 described above. In addition to the through holes 33c and 33d, through holes (auxiliary through holes) 33e are formed in the module base material 33 (see FIG. 10). The thickness of the module base material 33 is, for example, 50 to 200 μm.
As the IC chip 34, a known configuration having a contact type communication function and a non-contact type communication function can be used. The IC chip 34 has a first terminal 34b, a second terminal 34c, and a plurality of connection terminals 34d formed on the outer surface of the chip main body 34a.

The connecting coil 31 is formed in a spiral shape. The connection coil 31 is wound around the IC chip 34 and the through holes 33c and 33e, for example, three times. The second through hole 33d is formed on the outside of the connecting coil 31. The outermost end of the wiring (first end) and the innermost end of the wiring (second end) of the connection coil 31 are formed wider than the wiring. The terminal portions 39 and 40 are provided, respectively. The connection coil 31 is formed by patterning a copper foil or an aluminum foil by etching. The thickness of the connecting coil 31 is, for example, 5 to 50 μm. The connection coil 31 constitutes a non-contact terminal portion by electromagnetic coupling with the coupling coil 18 of the card body 10 (see FIG. 11).

As shown in FIG. 10, the plurality of contact terminals 35 and the bridge 36 are formed in a predetermined pattern by laminating, for example, a copper foil on the second surface 33b of the module base material 33. The bridge 36 is formed so as to straddle the connecting coil 31 when viewed in the thickness direction D. Although FIG. 10 shows an example of being formed in an L shape, it is not necessary to limit the shape to an L shape.
The plurality of contact terminals 35 and the bridge 36 are electrically isolated from each other. A nickel layer having a thickness of 0.5 to 3 μm may be provided by plating on the portion of the copper foil exposed to the outside, and a gold layer having a thickness of 0.01 to 0.3 μm may be further plated on the nickel film. It may be provided.
Each contact terminal 35 is for contacting a contact-type external device such as an automated teller machine. The contact terminal 35 is connected to an element (not shown) built in the chip main body 34a of the IC chip 34.
A plurality of contact terminals may be formed on the second surface 33b of the module base material 33 with a lead frame having a thickness of 50 to 200 μm, and a connecting coil may be formed on the first surface 33a of the module base material 33 with a copper wire. ..

As illustrated in FIG. 10, the first terminal 34b of the IC chip 34 and the bridge 36 are connected by a first wire (first conductive wire) 41 through which the first through hole 33c is inserted. The bridge 36 and the terminal portion 39 of the connection coil 31 are connected by a second wire (second conductive wire) 42 through which the second through hole 33d is inserted without plating the second through hole. There is. The terminal portion 40 of the connection coil 31 and the second terminal 34c of the IC chip 34 are connected by a third wire (third conductive wire) 43.
Further, the connection terminal 34d of the IC chip 34 and the contact terminal 35 are connected by a connection wire (auxiliary conductive wire) 44 through which the through hole 33e is inserted. The wires 41, 42, 43 and the connecting wire 44 are made of gold or copper and have an outer diameter of, for example, 10-40 μm.
In this way, the IC chip 34, the connecting coil 31, the bridge 36, and the wires 41, 42, 43, 44 constitute a closed circuit.
The first terminal 34b of the IC chip 34 and the bridge 36, and the bridge 36 and the connecting coil 31 are connected by punching hole wire bonding using wires 41 and 42. The connection terminal 34d and the contact terminal 35 of the IC chip 34 are also connected by punching hole wire bonding using the connection wire 44. The connection coil 31 and the second terminal 34c of the IC chip 34 are connected by wire bonding using the third wire 43. By providing the resin sealing portion that covers the IC chip 34, the first wire 41, the third wire 43, and the connecting wire 44, the IC chip 34 can be protected and the wires 41 and 43 can be prevented from being broken. .. The resin sealing portion can be formed of, for example, a known epoxy resin or the like.

In such an IC module 30, in order to protect the IC chip 34 and prevent disconnection, the innermost end of the connection coil 31 is between the IC chip 34 and the contact terminal 35 and the connection terminal 34d of the IC chip. Between the terminal portion 40 and the second terminal 34c of the IC chip 34, between the first terminal 34b of the IC chip 34 and the bridging wiring 36, and between the terminal portion 39 and the bridging wiring 36 at the outermost end of the connecting coil 31. It is preferable to cover the conductive wires 41, 42, 43, 44 connecting the above with a resin sealing portion.

However, the IC chip 34, the terminal portion 40 at the innermost end of the connection coil 31, the terminal 34c of the IC chip, the contact terminal 35-the connection terminal 34d of the IC chip, and the first terminal 34b of the IC chip 34-bridge. When trying to seal the wire bonding portion with the conductive wires 41, 42, 43, 44 connecting the wiring 36 and the terminal portion 39 at the outermost end of the connecting coil 31 and the bridging wiring 36, respectively, the IC There is a problem that the thickness of the entire module 30 increases and the dual IC card base material 15 cannot fit in the recess 11 (see FIG. 13) which is the IC module housing portion (see FIG. 9).

Further, in an IC module that is not subjected to through-hole plating, there is a conductive wire 42 that connects between the terminal portion 39 at the outermost end of the connection coil 31 and the bridging wiring 36, and the IC chip 34 and the most of the connection coil 31. Between the terminal portion 39 at the outer end and the bridging wiring 36, between the first terminal 34b of the IC chip 34 and the bridging wiring 36, and between the terminal portion 40 at the innermost end of the connecting coil 31-the second of the IC chip 34. In order to seal all the wire bonding portions between the terminals 34c with resin, it is necessary to seal the connection coil 31, that is, the end of the IC module 30 with resin. The conductive wire 42 between the terminal portion 39 and the bridging wiring 36 at the outermost end of the connection coil 31 is the IC module accommodating portion (recess 11 or the first accommodating portion 24 and the second accommodating portion 24) of the dual IC card base material 15. Since the portion 25) is arranged on the bottom surface of the first accommodating portion 24 having a shallow depth, if the IC module 30 is sealed with resin from the center to the end, the height limit will be exceeded. , The IC module 30 may not fit (see FIGS. 9 and 13).

As a countermeasure, if the number of turns of the coupling coil 18 (see FIG. 12) in the antenna 13 inside the dual IC card base material is reduced, the IC module accommodating portion (recess 11 or the first accommodating portion 24 and the second accommodating portion 24) can be accommodated. The overall depth of the portion 25) can be increased, and even if the IC module 30 is sealed with resin from the center to the end, the IC module accommodating portion (recess 11 or the first accommodating portion 24 and the second) of the dual IC card base material can be deepened. Although it can be accommodated in the accommodating portion 25), it cannot be sufficiently electromagnetically coupled with the coupling coil 18 of the card body 10.

Further, as illustrated in FIG. 14, the position of the through hole (through hole) 33d between the terminal portion 39 at the outermost end of the connecting coil 31 and the bridging wiring 36 (not shown), that is, the position of the conductive wire to be connected is set. If a part of the connecting coil 31 is curved toward the IC chip 34 in order to arrange it inside the inner circumference of the connecting coil 31, all the wire bonding portions are sealed with resin as illustrated in FIG. Even though it can be accommodated in the IC module accommodating portion (recess 11 or the first accommodating portion 24 and the second accommodating portion 25) of the dual IC card base material, it is necessary to reduce the number of turns of the connecting coil 31 due to the curvature. Therefore, the number of turns of the connecting coil 31 is limited.

Japanese Patent No. 6090006

In view of the above circumstances, it is an object of the present invention to provide an IC module and a method for manufacturing the same, which does not exceed the thickness limit of the IC module accommodating portion having a height limit.

As a means for solving the above problems, the invention according to claim 1 of the present invention comprises a sheet-like base material and a sheet-like base material.
An IC chip that has a contact-type communication function and a non-contact-type communication function, has a first terminal and a second terminal formed therein, and is provided on the first surface of a base material.
A resin sealing portion provided on the first surface of the base material so as to cover the IC chip,
A connection coil provided on the first surface of the base material and formed in a spiral shape,
A contact terminal portion provided on the second surface of the base material for contacting a contact type external device,
It is provided with a bridging wiring provided on the second surface of the base material so as to be located in the inner region of the resin sealing portion when viewed in the thickness direction of the base material, and electrically insulated from the contact terminal portion. Ori
The connection coil is
The terminal located on the outermost side of the connecting coil,
The terminal located on the innermost side of the connecting coil,
When viewed in the thickness direction of the base material, the terminal portion located on the outermost side is formed in a spiral shape surrounding the IC chip so as to be located in the inner region of the resin sealing portion, and the terminal portion located on the outermost side and the terminal portion most It has a conductor wiring that connects to the terminal part located inside,
The base material is formed with a first through hole and a second through hole that are separated from each other at positions overlapping the bridging wiring when viewed in the thickness direction of the base material.
The first terminal of the IC chip and the bridging wiring are connected by a first conductive wire through which the first through hole is inserted.
The bridging wiring and the terminal portion located on the outermost side of the connecting coil are connected by a second conductive wire through which a second through hole is inserted.
The terminal located on the innermost side of the connection coil and the second terminal of the IC chip are connected by a third conductive wire.
Of the resin sealing part
The conductive wire and wire bonding part that connects the IC chip, between the innermost terminal of the connecting coil and the terminal of the IC chip, and between the terminal of the IC chip and the bridging wiring are the outermost terminals of the connecting coil. The IC module is characterized in that the height is higher than that of the conductive wire and the wire bonding portion connecting the portion and the bridging wiring.

Further, the invention according to claim 2 includes a sheet-shaped base material and a sheet-like base material.
An IC chip that has a contact-type communication function and a non-contact-type communication function, has a first terminal and a second terminal formed therein, and is provided on the first surface of a base material.
A resin sealing portion provided on the first surface of the base material so as to cover the IC chip,
A connection coil provided on the first surface of the base material and formed in a spiral shape,
A contact terminal portion provided on the second surface of the base material for contacting a contact type external device,
It is provided with a bridging wiring provided on the second surface of the base material so as to be located in the inner region of the resin sealing portion when viewed in the thickness direction of the base material, and electrically insulated from the contact terminal portion. Ori
The connection coil is
The terminal located on the outermost side of the connecting coil,
The terminal located on the innermost side of the connecting coil,
A part is curved toward the IC chip so that the terminal portion located on the outermost side is located in the inner region of the resin sealing portion when viewed in the thickness direction of the base material, and a spiral shape surrounding the IC chip. It has a conductor wiring that connects the terminal part located on the outermost side and the terminal part located on the innermost side.
The base material is formed with a first through hole and a second through hole that are separated from each other at positions overlapping the bridging wiring when viewed in the thickness direction of the base material.
The first terminal of the IC chip and the bridging wiring are connected by a first conductive wire through which the first through hole is inserted.
The bridging wiring and the terminal portion located on the outermost side of the connecting coil are connected by a second conductive wire through which a second through hole is inserted.
The terminal located on the innermost side of the connection coil and the second terminal of the IC chip are connected by a third conductive wire.
Of the resin sealing part
The conductive wire and wire bonding part that connects the IC chip, between the innermost terminal of the connecting coil and the terminal of the IC chip, and between the terminal of the IC chip and the bridging wiring are the outermost terminals of the connecting coil. The IC module is characterized in that the height is higher than that of the conductive wire and the wire bonding portion connecting the portion and the bridging wiring.

The invention according to claim 3 includes the IC module according to claim 1 and the invention.
An antenna having a coupling coil for electromagnetic coupling with the connection coil of the IC module and a main coil connected to the coupling coil for non-contact communication with a non-contact type external device is provided. It is a dual IC card characterized by including a plate-shaped card body having a recess formed for accommodating an IC module.

The invention according to claim 4 is arranged at the outer peripheral end of the spiral conductor wiring and the conductor wiring surrounding the area where the IC chip having the contact type communication function and the non-contact type communication function is arranged. A step of forming a connection coil on the first surface of a sheet-shaped base material, which has a terminal portion and a first terminal portion arranged at a position closer to the IC chip than the outermost periphery of the conductor wiring.
The process of forming the first through hole and the second through hole separated from each other in the base material,
On the second surface of the base material, a contact terminal portion for contacting a contact type external device and a bridging wiring electrically insulated from the contact terminal portion are provided on the first surface in the thickness direction of the base material. The process of forming the bridging wiring so that it overlaps the through hole and the second through hole,
The process of attaching the IC chip to the first surface of the base material,
The process of connecting the first terminal of the IC chip and the bridging wiring by the first conductive wire through which the first through hole is inserted.
The process of connecting the bridging wiring and the first terminal of the connection coil with a second conductive wire through which a second through hole is inserted, and
A process of connecting the inner peripheral end of the wiring of the connection coil and the second terminal of the IC chip with a third conductive wire,
In a method for manufacturing an IC module, which comprises a step of covering an IC chip, a first conductive wire, a second conductive wire, and a third conductive wire with a resin sealing portion.
The step of covering the IC chip, the first conductive wire, the second conductive wire, and the third conductive wire with the resin sealing portion is
A recess inside the dual IC card in the conductive wire and wire bonding part that connects the IC chip and the innermost terminal of the connection coil and the terminal of the IC chip, and between the terminal of the IC chip and the bridging wiring, respectively. The process of forming the resin sealing part with a thickness less than or equal to the depth of
A process of forming a resin sealing part with a thickness equal to or less than the depth of the outer recess of the dual IC card in the conductive wire and wire bonding part connecting between the outermost terminal part of the connection coil and the bridging wiring, and This is a method for manufacturing an IC module, which is characterized by the above.

According to the IC module of the present invention, the conductive wire and the wire bonding portion connecting between the outermost terminal portion of the connecting coil and the bridging wiring have a depth of a recess (first accommodating portion) on the outer side of the dual IC card. A resin sealing portion having a thickness not exceeding the above is formed. Further, in the conductive wire and wire bonding portion connecting the innermost terminal portion of the connecting coil and the IC chip, and between the terminal of the IC chip and the bridging wiring, respectively, the recess inside the dual IC card (second). A resin sealing portion is formed with a thickness equal to or less than the depth of the accommodating portion). Also, between the contact terminal and the IC chip, a resin sealing portion having the same thickness as the resin sealing portion between the innermost terminal portion of the connecting coil and the IC chip, and between the terminal of the IC chip and the bridging wiring. May be formed. Therefore, the thickness limit of the IC module accommodating portion formed on the dual IC card base material is not exceeded. Further, since the through-hole plating process is not required, the process time can be shortened and the manufacturing cost can be reduced.

According to the dual IC card of the present invention, all the wire bonding portions and the conductive wires (wires) can be resin-sealed without requiring a through-hole plating process. Therefore, it is possible to provide a highly reliable dual IC card at low cost.

According to the method for manufacturing an IC module of the present invention, the IC module of the present invention can be provided.

The cross-sectional explanatory view which illustrated the aspect of the resin sealing part in the IC module of this invention. The upper surface explanatory view which illustrated the aspect of the resin sealing part in the IC module of this invention. The upper surface explanatory view which illustrated the aspect of the resin sealing part in the IC module of this invention. The cross-sectional explanatory view which illustrated the aspect of the resin sealing part in the IC module of this invention. The upper surface explanatory view which illustrated the aspect of the resin sealing part in the IC module of this invention. The cross-sectional explanatory view which illustrated the aspect of the resin sealing part in the IC module of this invention. The upper surface explanatory view which illustrated the aspect of the resin sealing part in the IC module of this invention. The upper surface explanatory view which illustrated the aspect of the resin sealing part in the IC module of this invention. The cross-sectional explanatory view which illustrated the aspect of the resin sealing part in the conventional IC module. Explanatory view of the upper surface which illustrates the mode excluding the sealing resin part of the conventional IC module. An explanatory cross-sectional view illustrating an embodiment of a conventional IC module excluding a sealing resin portion. Top explanatory view which illustrates the aspect of a dual IC card. An explanatory cross-sectional view illustrating an aspect of a dual IC card. Top explanatory view which illustrates the aspect of a dual IC card.

<IC module>
The IC module of the present invention will be described.
The IC module of the present invention is an IC module used in an IC module accommodating portion having a height limitation.

The IC module of the present invention has a sheet-shaped base material, a contact type communication function and a non-contact type communication function, and a first terminal and a second terminal are formed and provided on the first surface of the base material. The IC chip, the resin sealing portion provided on the first surface of the base material so as to cover the IC chip, the connection coil provided on the first surface of the base material and formed spirally, and the base. A contact terminal portion provided on the second surface of the material for contacting with a contact type external device, and a second base material so as to be located in the inner region of the resin sealing portion when viewed in the thickness direction of the base material. It is provided with a bridging wiring provided on the surface and electrically isolated from the contact terminal portion.
As the module base material, a sheet-like material having a thickness of about 110 μm made of a material such as glass epoxy can be preferably used.

As for the connection coil, the terminal portion located on the outermost side of the connection coil, the terminal portion located on the innermost side of the connection coil, and the terminal portion located on the outermost side in the thickness direction of the base material are the resin sealing portions. It is formed in a spiral shape surrounding the IC chip so as to be located in the inner region of the IC chip, and has a conductor wiring connecting the outermost terminal portion and the innermost terminal portion. The connection coil can be patterned by etching a copper foil or an aluminum foil via an etching resist pattern. The thickness of the connecting coil can be, for example, 5 μm to 50 μm.
Further, the base material is formed with a first through hole and a second through hole separated from each other at positions overlapping the bridging wiring when viewed in the thickness direction of the base material. The diameter of the through hole (also referred to as a through hole) can be, for example, 300 μm to 500 μm.
Further, the first terminal of the IC chip and the bridging wiring are connected by a first conductive wire through which the first through hole is inserted.
Further, the bridging wiring and the terminal portion located on the outermost side of the connecting coil are connected by a second conductive wire through which the second through hole is inserted.
Further, the terminal portion located on the innermost side of the connecting coil and the second terminal of the IC chip are connected by a third conductive wire.
As these conductive wires, a bonding wire made of gold or copper and having a diameter of about 10 μm to 40 μm can be used.

The resin sealing part is a conductive wire and a wire bonding part that connects the IC chip, the innermost terminal part of the connecting coil and the terminal of the IC chip, and the terminal of the IC chip and the bridging wiring, respectively. It has a thickness less than or equal to the depth of the second housing. This is equivalent to the thickness of the sealing resin portion used in the IC module using the through-hole plating process.
Further, the conductive wire and the wire bonding portion connecting between the outermost terminal portion of the connecting coil and the bridging wiring are characterized in that they have a thickness equal to or less than the depth of the first accommodating portion.

Further, the connecting coil of the IC module of the present invention is located at the outermost terminal portion of the connecting coil, the innermost terminal portion of the connecting coil, and the outermost terminal portion when viewed in the thickness direction of the base material. A part of the terminal part is curved toward the IC chip so that the terminal part to be formed is located in the inner region of the resin sealing part, and is formed in a spiral shape surrounding the IC chip. It may also have a conductor wiring for connecting to a terminal portion located at.

Next, the IC module of the present invention will be described with reference to FIGS. 10 and 11.
The IC module 30 includes a sheet-shaped module base material (base material) 33, an IC chip 34 and a connection coil 31 provided on the first surface 33a of the module base material 33, and a second surface of the module base material 33. It is provided with a plurality of contact terminals (contact terminal portions) 35 and bridges (bridge wiring) 36 provided in 33b. The module base material 33 is made of the same material as the substrate 12, and is formed in a rectangular shape in a plan view. The module base material 33 has a first through hole (first through hole) 33c and a second through hole (second through hole) 33d separated from each other at positions overlapping the bridge 36 in the thickness direction D. Is formed. The thickness direction of the module base material 33 coincides with the thickness direction D of the substrate 12 described above. In addition to the through holes 33c and 33d, through holes (auxiliary through holes) 33e are formed in the module base material 33. The thickness of the module base material 33 is, for example, 50 to 200 μm. As the IC chip 34, a known configuration having a contact type communication function and a non-contact type communication function can be used. The IC chip 34 has a first terminal 34b, a second terminal 34c, and a plurality of connection terminals 34d formed on the outer surface of the chip main body 34a.

The connecting coil 31 is formed in a spiral shape. The connection coil 31 is wound around the IC chip 34 and the through holes 33c and 33e, for example, three times. The second through hole 33d is formed on the outside of the connecting coil 31. The outermost end of the wiring (first end) and the innermost end of the wiring (second end) of the connection coil 31 are formed wider than the wiring. The terminal portions 39 and 40 are provided, respectively. The connection coil 31 is formed by patterning a copper foil or an aluminum foil by etching. The thickness of the connecting coil 31 is, for example, 5 to 50 μm. The connection coil 31 constitutes a non-contact terminal portion by electromagnetic coupling with the coupling coil 18 of the card body 10.

The plurality of contact terminals 35 and the bridge 36 are formed in a predetermined pattern by laminating, for example, copper foil on the second surface 33b of the module base material 33. The bridge 36 is formed in an L shape so as to straddle the connecting coil 31 in the thickness direction D, but it is not necessary to limit the bridge 36 to this (see FIG. 10). The plurality of contact terminals 35 and the bridge 36 are electrically isolated from each other. A nickel layer having a thickness of 0.5 to 3 μm may be provided by plating on the portion of the copper foil exposed to the outside, and a gold layer having a thickness of 0.01 to 0.3 μm may be further plated on the nickel film. It may be provided. Each contact terminal 35 is for contacting a contact-type external device such as an automated teller machine. The contact terminal 35 is connected to an element (not shown) built in the chip main body 34a of the IC chip 34. A plurality of contact terminals may be formed on the second surface 33b of the module base material 33 with a lead frame having a thickness of 50 to 200 μm, and a connecting coil may be formed on the first surface 33a of the module base material 33 with a copper wire. ..

The first terminal 34b of the IC chip 34 and the bridge 36 are connected by a first wire (first conductive wire) 41 through which the first through hole 33c is inserted. The bridge 36 and the terminal portion 39 of the connection coil 31 are connected by a second wire (second conductive wire) 42 through which the second through hole 33d is inserted. The terminal portion 40 of the connection coil 31 and the second terminal 34c of the IC chip 34 are connected by a third wire (third conductive wire) 43. In this example, the connection terminal 34d of the IC chip 34 and the contact terminal 35 are connected by a connection wire (auxiliary conductive wire) 44 through which the through hole 33e is inserted. The wires 41, 42, 43 and the connecting wire 44 are made of gold or copper and have an outer diameter of, for example, 10-40 μm. In this way, the IC chip 34, the connecting coil 31, the bridge 36, and the wires 41, 42, 43, 44 constitute a closed circuit. The first terminal 34b of the IC chip 34 and the bridge 36, and the bridge 36 and the connecting coil 31 are connected by punching hole wire bonding using wires 41 and 42. The connection terminal 34d and the contact terminal 35 of the IC chip 34 are also connected by punching hole wire bonding using the connection wire 44. The connection coil 31 and the second terminal 34c of the IC chip 34 are connected by wire bonding using the third wire 43.

Next, the mode of the sealing resin portion in the IC module of the present invention will be described with reference to FIGS. 1 to 8.
FIG. 1 is a cross-sectional view illustrating aspects of the resin sealing portions 2 and 3 in the IC module of the present invention.
Between the IC chip 34, the innermost terminal of the connecting coil and the terminal of the IC chip, and I
The resin sealing portion 2 that seals the conductive wire connecting the terminal of the C chip and the bridging wiring, respectively, and the wire bonding portion have a thickness equal to or less than the depth of the second accommodating portion 25 (see FIG. 13). I have. Here, the thickness of the resin sealing portion 2 refers to the total thickness of the resin sealing portion including the contact terminal 35, the module base material 33 (see FIG. 11), and the resin of the resin sealing portion. .. The same applies to other resin sealing parts.
On the other hand, the resin sealing portion 3 of the conductive wire and the wire bonding portion connecting between the outermost terminal portion of the connecting coil 31 and the bridging wiring has a thickness equal to or less than the depth of the first accommodating portion 24. ..
The resin sealing portion 3 and the resin sealing portion 2 are formed so as to be separated from each other.
Further, between the contact terminal 35 and the IC chip, the resin sealing portion 2 between the innermost terminal portion 40 of the connection coil 31 and the terminal 34c of the IC chip, and between the terminal 34b of the IC chip and the bridging wiring 36. It has the same thickness as (see FIG. 10).
As described above, the thickness of the resin sealing portion is set to be equal to or less than the depth of the first accommodating portion 24 in the peripheral portion of the IC module, and the thickness of the second accommodating portion 25 is set in the inside other than the peripheral portion. By setting the thickness to be less than or equal to the depth, the IC module can be accommodated in the recess 11 of the dual IC card 1 (see FIG. 13). As a result, the surface of the contact terminal 35 of the IC module and the surface of the card base material 15 of the dual IC card are substantially flush with each other.

FIG. 2 is a top view illustrating a case where the position of the outermost terminal portion 39 of the connecting coil is located at the center portion of one side of the IC module 30 (see FIG. 10). Since the terminal portion 39 located on the outermost side is located in the center of the side of the IC module, the resin formed in the portion so as not to protrude outward from the outermost wiring of the connection coil 31. A part of the connecting coil 31 is curved toward the IC chip 34 so as to be located in the inner region of the sealing portion 3, and is spirally formed so as to surround the IC chip 34. Along with this, a through hole (also referred to as a through hole) for electrically connecting to a bridging wire (also referred to as a bridge) 36 formed on a surface opposite (surface) to the surface on which the connecting coil 31 is formed. 33d are formed adjacent to each other along the direction in which the connecting coil 31 extends. Further, a through hole 33e is formed which connects the contact terminal formed on the surface and the terminal of the IC chip by wire bonding.
As illustrated in FIG. 1, the resin sealing portion 3 is formed thinner than the resin sealing portion 2.

FIG. 3 is a top view illustrating the case where the position of the outermost terminal portion 39 of the connecting coil is located at the corner portion of the IC module 30 (see FIG. 10). In this case, it is not necessary to change the shape of the connecting coil 31 wound in a spiral shape. The position of the through hole that connects the bridging line 36 and the terminal portion 39 by wire bonding is arranged at a position adjacent to the terminal portion 39. Along with this, the terminal portion 39, the through holes adjacent to the terminal portion 39, and the resin sealing portion 3-1 for resin-sealing the conductive wire (wire) connecting them by wire bonding are moving.
As illustrated in FIG. 1, the resin sealing portion 3-1 is formed thinner than the resin sealing portion 2.

FIG. 4 shows the same case except that the forms of the resin sealing portions 3 and 3-2 are different from those of FIG. 2. In FIG. 2, the resin sealing portion 2 and the resin sealing portion 3 are formed so as to be separated from each other, but in FIG. 4, the resin sealing portion 2 and the resin sealing portion 3-2 are formed in contact with each other. Has been done. Similarly, in FIG. 3, the resin sealing portion 2 and the resin sealing portion 3-1 may be formed in contact with each other.
As illustrated in FIG. 4, the resin sealing portion 3-2 is formed thinner than the resin sealing portion 2.

FIG. 5 shows an example of a top view of FIG.

FIG. 6 illustrates a cross-sectional view of the sealing resin portion 2-1 formed by integrally forming the resin sealing portion 2 and the resin sealing portion 3-2 in FIG.

FIG. 7 illustrates a top view of FIG.

FIG. 8 illustrates a top view of the sealing resin portion 2-2 formed by integrally forming the sealing resin portion 2 and the sealing resin portion 3-1 in FIG.

As shown in FIGS. 1 to 5 and 10, between the IC chip 34 and the innermost terminal 40 of the connecting coil 31 and the terminal 34c of the IC chip, and between the terminal 34b of the IC chip and the bridging wiring 36. The resin sealing portion 2 that seals the conductive wire 41 and the conductive wire 43 and their wire bonding portions, which connect the two, respectively, has a thickness equal to or less than the depth of the second accommodating portion 25 (see FIG. 13). I have.
Further, as shown in FIGS. 6 to 8 and 10, the IC chip 34, the innermost terminal portion 40 of the connecting coil 31 and the terminal 34c of the IC chip, and the terminal 34b of the IC chip and the bridging wiring 36 The resin sealing portions 2-1, 2-2, and 2-3 that seal the conductive wire 41 and the conductive wire 43, and their wire bonding portions, which connect between the two, are the second accommodating portions 25 ( It has a thickness equal to or less than the depth (see FIG. 13).
Further, as shown in FIGS. 1, 2 and 10, the conductive wire 42 connecting between the outermost terminal portion 39 (see FIG. 10) of the connecting coil 31 and the bridging wiring 36 and the resin sealing of the wire bonding portion. The stop portion 3 has a thickness equal to or less than the depth of the first accommodating portion 24 (see FIG. 13).
Further, as shown in FIGS. 3 and 10, the conductive wire 42 connecting between the outermost terminal portion 39 (see FIG. 10) of the connecting coil 31 and the bridging wiring 36 and the resin sealing portion 3 of the wire bonding portion. -1 has a thickness equal to or less than the depth of the first accommodating portion 24 (see FIG. 13).
Further, as shown in FIGS. 4, 5 and 10, the conductive wire 42 connecting between the outermost terminal portion 39 (see FIG. 10) of the connecting coil 31 and the bridging wiring 36 and the resin sealing of the wire bonding portion. The stop portion 3-2 has a thickness equal to or less than the depth of the first accommodating portion 24 (see FIG. 13).
Further, FIG. 6 shows an example of a cross-sectional view taken along the AA'cutting line of the IC module illustrated in FIGS. 7 and 8. The resin sealing portion 2 and the resin sealing portion 3-2 illustrated in FIGS. 4 and 5 were in contact with each other, but in FIGS. 7 and 8, the fusion further progressed and the integrated resin sealing was integrated. It is a stop 2-1. The integrated resin sealing portion 2-1 includes a resin sealing portion 2-2 and a resin sealing portion 2-3.
The resin sealing portion 2-2 connects the IC chip 34, between the innermost terminal portion 40 of the connecting coil 31 and the terminal 34c of the IC chip, and between the terminal 34b of the IC chip and the bridging wiring 36, respectively. The conductive wire 41, the conductive wire 43, and their wire bonding portions are sealed, and the thickness thereof is equal to or less than the depth of the second accommodating portion 25 (see FIG. 13).
Further, the resin sealing portion 2-3 seals the conductive wire 42 and the wire bonding portion connecting between the outermost terminal portion 39 (see FIG. 10) of the connecting coil 31 and the bridging wiring 36, and has a thickness thereof. Has a thickness equal to or less than the depth of the first accommodating portion 24 (see FIG. 13).

Further, the connection coil 31 of the IC module of the present invention is viewed in the thickness direction D of the base material, the terminal portion 39 located on the outermost side of the connection coil 31, the terminal portion 40 located on the innermost side of the connection coil 31. A part of the terminal portion 39 is curved toward the IC chip so that the terminal portion 39 located on the outermost side is located in the inner region of the resin sealing portions 3, 3-2, and is formed in a spiral shape surrounding the IC chip. It may also have a conductor wiring that connects the terminal portion 39 located on the outermost side and the terminal portion 40 located on the innermost side.

1 to 8 illustrate the form of the sealing resin portion in the IC module used in the dual IC card of the present invention, particularly the thickness of the sealing resin portion.
In the IC module of the present invention, the thickness of the resin sealing portion in which the IC chip, the through holes in the peripheral portion thereof, the conductive wire, and the wire bonding portion are sealed with a sealing resin is set to a dual IC card base material. The case where the thickness is made smaller than the thickness that can be accommodated in the second accommodating portion, which is a recess provided in the above, is illustrated. Similarly, the thickness of the resin sealing portion of the conductive wire and the wire bonding portion connecting between the outermost terminal portion of the connecting coil and the bridging wiring is set to the depth of the first accommodating portion 24 which is shallower than the second accommodating portion. The case where the thickness is less than or equal to that of the wire is illustrated.
By doing so, the IC module can be accommodated in the accommodating portion of the IC module, which is a recess provided in the card base material of the dual IC card.

<Manufacturing method of IC module>
Next, the method of manufacturing the IC module of the present invention will be described with reference to FIGS. 10 and 11.
The method for manufacturing the IC module of the present invention is
The spiral conductor wiring surrounding the area where the IC chip 34 having the contact type communication function and the non-contact type communication function is arranged, and the terminal portion (outermost terminal portion 39) arranged at the outer peripheral end of the conductor wiring. ), And a step of forming a connection coil 31 having a first terminal portion 40 arranged at a position closer to the IC chip 34 than the outermost periphery of the conductor wiring on the first surface 33a of the sheet-shaped base material 33. , The step of forming the first through hole 33c and the second through hole 33d separated from each other in the base material 33, and the contact terminal portion for contacting the second surface 33b of the base material 33 with the contact type external device. The bridging wire 36, which is electrically insulated from the 35 and the contact terminal portion 35, is arranged so that the bridging wire 36 overlaps the first through hole 33c and the second through hole 33d when viewed in the thickness direction of the base material 33. The step of attaching the IC chip 34 to the first surface 33a of the base material 33, and the step of inserting the first through hole 33c through the first terminal 34b of the IC chip 34 and the bridging wiring 36. The step of connecting with one conductive wire 41 and the step of connecting the bridging wiring 36 and the first terminal portion 39 of the connecting coil 31 with the second conductive wire 42 through which the second through hole 33d is inserted are connected. The step of connecting the inner peripheral side end (second terminal portion 40) in the wiring of the coil 31 and the second terminal 34c of the IC chip by the third conductive wire 43, and the IC chip 34, the first An IC module comprising a step of covering the conductive wire 41, the second conductive wire 42, and the third conductive wire 43 with resin sealing portions 2, 2-1 and 2-2 (see FIGS. 1 to 8). The manufacturing method is characterized by having the following features.

The step of covering the IC chip 34, the first conductive wire 41, the second conductive wire 42, and the third conductive wire 43 with the resin sealing portions 2, 2-1 and 2-2 is
Conductive wires 41, 43 and wires that connect the IC chip 34, between the innermost terminal 40 of the connection coil 31 and the terminal 34c of the IC chip 34, and between the terminal 34b of the IC chip 34 and the bridging wiring 36, respectively. A step of forming resin sealing portions 2, 2-1 and 2-2 in the bonding portion with a thickness equal to or less than the depth of the recess (second accommodating portion 25) inside the dual IC card 1 (see FIG. 13). ),
The conductive wire 42 and the wire bonding portion connecting between the outermost terminal portion 39 of the connection coil 31 and the bridging wiring 36 have a depth equal to or less than the depth of the outer recess (first accommodating portion 24) of the dual IC card 1. The process of forming the resin sealing portions 3, 3-1 and 3-2 by thickness, and
Also between the contact terminal 35 and the terminal of the IC chip 34, a resin seal is provided between the innermost terminal portion 40 of the connection coil 31 and the terminal 34c of the IC chip 34, and between the terminal 34b of the IC chip 34 and the bridging wiring 36. It includes a step of forming a resin sealing portion having the same thickness as the stopper portions 2, 2-1 and 2-2.

<Dual IC card>
Next, the dual IC card of the present invention will be described with reference to FIGS. 12 and 13.
The dual IC card of the present invention is used for coupling to perform non-contact communication between the IC module of the present invention, a coupling coil 18 for electromagnetic coupling with the connection coil 31 of the IC module, and a non-contact type external device. It is characterized by including an antenna 13 having a main coil 19 connected to the coil 18, and a plate-shaped card body 10 having a recess 11 for accommodating the IC module 30.

The recess 11 is formed on one surface of the card base material 15 and seals through holes 33c and 33e and conductive wires 41 and 43 formed in the chip body 34a of the IC chip 34 of the IC module 30 and its periphery. IC module including the resin sealing part inside the connection coil 31 of the resin sealing part 2 (FIGS. 1 to 5) and the resin sealing parts 2-1 and 2-2 (FIGS. 6 to 8). Is formed so that the total thickness of the second housing portion 25 is equal to or less than the depth of the second accommodating portion 25.

Further, the resin sealing portion 3, 3-1 in which the first terminal portion (outermost terminal portion) 39 of the IC module 30, the second through hole 33d, and the second conductive wire 42 are sealed with a sealing resin. The total thickness of the IC module including 3-2 is formed so as to be equal to or less than the depth of the first accommodating portion 24.

1 Dual IC card 2, 2-1, 2-2, 2-3 Resin sealing part 3, 3-1, 3-2 Resin sealing part 4 Resin sealing part 10 Card body 11 Recess 11a Opening 12 Substrate 12a No. One surface 12b Second surface 12c (of the substrate) Short side 12d Accommodating hole 12e (of the substrate) Long side 13 Antenna 14 Capacitive elements 14a, 14b (of the capacitive element) Electrode plate 15 Card base material 18 Coupling coil 18a Wiring of coupling coil 18b Wiring other than coupling coil 19 Main coil 19a Wiring of main coil 19b Wiring of main coil 20 (formed in a substantially circular shape) Terminal 21 (provided on the second surface 12b) Connection wiring 24 First accommodating portion 25 Second accommodating portion 30 IC module 31 Connection coil 33 Module base material (base material)
33a First surface 33b Second surface 33c First through hole (first through hole)
33d Second through hole (second through hole)
33e Through hole (auxiliary through hole)
34 IC chip 34a Chip body 34b (IC chip) first terminal (first terminal part)
34c (IC chip) second terminal (second terminal part)
34d (IC chip) connection terminal (connection terminal)
35 Contact terminal (contact terminal part)
36 bridge (bridging wiring)
39 (outermost terminal part of connecting coil) (first terminal part)
40 (Innermost connection coil) Terminal (second terminal)
41 First wire (first conductive wire)
42 Second wire (second conductive wire)
43 Third wire (third conductive wire)
44 Connection wire (auxiliary conductive wire)
D Substrate thickness direction R1 (place the IC module and coupling coil) Region R2 (adjacent to region R1) Region R3 (embossable) region

Claims (4)

Sheet-shaped base material and
An IC chip that has a contact-type communication function and a non-contact-type communication function, has a first terminal and a second terminal formed therein, and is provided on the first surface of a base material.
A resin sealing portion provided on the first surface of the base material so as to cover the IC chip,
A connection coil provided on the first surface of the base material and formed in a spiral shape,
A contact terminal portion provided on the second surface of the base material for contacting a contact type external device,
It is provided with a bridging wiring provided on the second surface of the base material so as to be located in the inner region of the resin sealing portion when viewed in the thickness direction of the base material, and electrically insulated from the contact terminal portion. Ori
The connection coil is
The terminal located on the outermost side of the connecting coil,
The terminal located on the innermost side of the connecting coil,
When viewed in the thickness direction of the base material, the terminal portion located on the outermost side is formed in a spiral shape surrounding the IC chip so as to be located in the inner region of the resin sealing portion, and the terminal portion located on the outermost side and the terminal portion most It has a conductor wiring that connects to the terminal part located inside,
The base material is formed with a first through hole and a second through hole that are separated from each other at positions overlapping the bridging wiring when viewed in the thickness direction of the base material.
The first terminal of the IC chip and the bridging wiring are connected by a first conductive wire through which the first through hole is inserted.
The bridging wiring and the terminal portion located on the outermost side of the connecting coil are connected by a second conductive wire through which a second through hole is inserted.
The terminal located on the innermost side of the connection coil and the second terminal of the IC chip are connected by a third conductive wire.
Of the resin sealing part
The conductive wire and wire bonding part that connects the IC chip, between the innermost terminal of the connecting coil and the terminal of the IC chip, and between the terminal of the IC chip and the bridging wiring are the outermost terminals of the connecting coil. An IC module characterized in that the height is higher than that of the conductive wire and the wire bonding portion connecting the portion and the bridging wiring. Sheet-shaped base material and
An IC chip that has a contact-type communication function and a non-contact-type communication function, has a first terminal and a second terminal formed therein, and is provided on the first surface of a base material.
A resin sealing portion provided on the first surface of the base material so as to cover the IC chip,
A connection coil provided on the first surface of the base material and formed in a spiral shape,
A contact terminal portion provided on the second surface of the base material for contacting a contact type external device,
It is provided with a bridging wiring provided on the second surface of the base material so as to be located in the inner region of the resin sealing portion when viewed in the thickness direction of the base material, and electrically insulated from the contact terminal portion. Ori
The connection coil is
The terminal located on the outermost side of the connecting coil,
The terminal located on the innermost side of the connecting coil,
A part is curved toward the IC chip so that the terminal portion located on the outermost side is located in the inner region of the resin sealing portion when viewed in the thickness direction of the base material, and a spiral shape surrounding the IC chip. It has a conductor wiring that connects the terminal part located on the outermost side and the terminal part located on the innermost side.
The base material is formed with a first through hole and a second through hole that are separated from each other at positions overlapping the bridging wiring when viewed in the thickness direction of the base material.
The first terminal of the IC chip and the bridging wiring are connected by a first conductive wire through which the first through hole is inserted.
The bridging wiring and the terminal portion located on the outermost side of the connecting coil are connected by a second conductive wire through which a second through hole is inserted.
The terminal located on the innermost side of the connection coil and the second terminal of the IC chip are connected by a third conductive wire.
Of the resin sealing part
The conductive wire and wire bonding part that connects the IC chip, between the innermost terminal of the connecting coil and the terminal of the IC chip, and between the terminal of the IC chip and the bridging wiring are the outermost terminals of the connecting coil. An IC module characterized in that the height is higher than that of the conductive wire and the wire bonding portion connecting the portion and the bridging wiring. The IC module according to claim 1 and
An antenna having a coupling coil for electromagnetic coupling with the connection coil of the IC module and a main coil connected to the coupling coil for non-contact communication with a non-contact type external device is provided. A dual IC card characterized by having a plate-shaped card body having a recess for accommodating an IC module. From the outermost circumference of the conductor wiring, along with the spiral conductor wiring surrounding the area where the IC chip having the contact type communication function and the non-contact type communication function is arranged and the terminal portion arranged at the outer peripheral end of the conductor wiring. The process of forming a connecting coil having a first terminal portion arranged at a position close to the IC chip on the first surface of the sheet-shaped base material, and
The process of forming the first through hole and the second through hole separated from each other in the base material,
On the second surface of the base material, a contact terminal portion for contacting a contact type external device and a bridging wiring electrically insulated from the contact terminal portion are provided on the first surface in the thickness direction of the base material. The process of forming the bridging wiring so that it overlaps the through hole and the second through hole,
The process of attaching the IC chip to the first surface of the base material,
The process of connecting the first terminal of the IC chip and the bridging wiring by the first conductive wire through which the first through hole is inserted.
The process of connecting the bridging wiring and the first terminal of the connection coil with a second conductive wire through which a second through hole is inserted, and
A process of connecting the inner peripheral end of the wiring of the connection coil and the second terminal of the IC chip with a third conductive wire,
In a method for manufacturing an IC module, which comprises a step of covering an IC chip, a first conductive wire, a second conductive wire, and a third conductive wire with a resin sealing portion.
The step of covering the IC chip, the first conductive wire, the second conductive wire, and the third conductive wire with the resin sealing portion is
A recess inside the dual IC card in the conductive wire and wire bonding part that connects the IC chip and the innermost terminal of the connection coil and the terminal of the IC chip, and between the terminal of the IC chip and the bridging wiring, respectively. The process of forming the resin sealing part with a thickness less than or equal to the depth of
A process of forming a resin sealing part with a thickness equal to or less than the depth of the outer recess of the dual IC card in the conductive wire and wire bonding part connecting between the outermost terminal part of the connection coil and the bridging wiring, and A method for manufacturing an IC module, which comprises.