JPH11195101A - Ic module and ic card mounting the module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the separation of a molding part from an external connecting terminal substrate and the disconnection of a wire etc., by providing the molding part obtained by covering the electrical connection part of each terminal and an IC chip provided on the external connecting terminal substrate with a molding resin in the whole area of the rear surface side of the external connecting terminal substrate. SOLUTION: At an IC module, each terminal and an IC chip 5 provided on an external connecting terminal substrate 8 of the IC module are electrically connected. The IC chip 5 and its connection part are covered with a molding resin such as an insulator like a BT resin, an epoxy resin or the like. At nearly the whole area of the rear surface side of the substrate 8, the flange part of the substrate 8 except a module part formed in a projecting shape by molding the chip 5 is shielded by the molding resin facing obliquely downward from the both edge parts of the substrate 8 to form the molding part 4 which is made in the shape of an inverse trapezoid and whose the bottom part is partially made flat.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an IC card for an IC card.
Structure of C module and IC mounted with IC module
The present invention relates to a card, and more particularly to a structure for embedding an IC module in a card base material.

[0002]

2. Description of the Related Art In recent years, as a card-shaped personal information recording medium, many cards called IC cards having an IC module provided with an integrated circuit such as a microprocessor and a memory have been developed. In the integrated circuit of this IC module, personal ID information (secret information) is electrically recorded from a general information recording medium, and the IC card is also used in hardware or software.
Information can be protected outside the card and inside the IC card.

For example, a typical structure of an IC module for a conventional IC card and a typical structure of the IC card are shown in FIG.
FIG. 3 is a plan view of the IC module as viewed from the front terminal surface of the external connection terminal board.
Each terminal 2a, 2b, 2c electrically connected to the chip 5,
2d, 2e, 2f, 2g, and 2h are provided. The central portion (indicated by a dotted line) shows the molded portion 4 in which the IC chip 5 and the bonding wires 6 formed on the back surface are sealed with resin. Further, FIG.
1 shows a cross-sectional view taken along line FF of the IC module and a cross-section of an IC card substrate on which the IC module is mounted. In the IC module 1, a wiring pattern 7 provided on the back surface of an external connection terminal board 8 has terminals 2a to 2h. The wiring pattern 7 and the IC chip 5 are connected by a through hole 3 and connected to each other by a bonding wire 6, and the periphery thereof is surrounded by a molding resin such as BT resin, epoxy resin, or the like.
There is a mold portion 4 covered with an insulating synthetic resin such as a silicon-based resin or a phenol-based resin, and the entire mold portion is formed in a downwardly convex shape. Also, the exposed brim portions 9, 9 of the unmolded connection terminal substrate 8 on the outer periphery of the mold portion 4 are bonded to the upper portion of the buried hole 21 having a step formed at a predetermined position of the card base material 20 by the adhesive 12. The IC card is fixed.

That is, in a conventional IC module,
Each terminal on the external connection terminal board of the IC module and I
The C chip was connected by a bonding wire, and the chip and the IC chip were completely covered with an insulator such as BT resin, including the bonding wire. In addition, in the conventional IC card, alignment is performed using a step of a mold portion on the back surface of the module and a flange portion 9 on the outer periphery thereof and a buried hole provided in the card base material, and the brim portion is bonded to the card base material. It was what I was doing.

Therefore, in the conventional IC module for an IC card, when the IC card is physically bent,
There is also a problem that the influence is exerted on the IC module to a certain extent, and a force is applied such that the wire expands or contracts inside the mold, and the wire is easily cut. Also,
Since the wire is completely covered with an insulator such as BT resin, including the bonding wires, when bending stress is applied to the vicinity of the module burying hole in the card base, pressure is transmitted directly to the flange of the external connection terminal board of the module, and the IC module Is peeled off from the card base material, the mold portion is peeled off from the external connection terminal substrate, the wire is broken, and the like, and the device does not function as an IC card.

[0006]

That is, the conventional IC
The physical destruction of a module is typically destruction of an IC chip, cutting of a bonding wire, and peeling of a mold part. The problem to be solved by the present invention is the structure of an IC module that can prevent the peeling of the molded portion from the external connection terminal substrate and the breaking of the wire, and the problem that the IC module, which is a trouble of the IC card, is removed from the card base material. An object of the present invention is to provide a structure for embedding an IC module capable of preventing peeling.

[0007]

Means for Solving the Problems To achieve the above object, the invention of claim 1 electrically connects each terminal provided on an external connection terminal board of an IC module to an IC chip,
In the IC module for an IC card constituted by covering the IC chip and its connection portion with a mold resin, the mold portion covered with the mold resin is provided on the entire rear surface side of the external connection terminal substrate. I
It is a C module.

According to a second aspect of the present invention, the shape of the mold portion is formed in a positioning structure such as a depression, a projection or a step for setting a position required for embedding in a card base material. 2. The IC according to claim 1, wherein
Module.

According to a third aspect of the present invention, there is provided an IC card in which an IC module is mounted on a card base made of an insulating synthetic resin such as polyvinyl chloride. A buried hole for mounting the IC module is formed at the position of, and an island-shaped convex portion is provided at the center of the bottom of the buried hole, and the convex portion and the bottom surface of the mold portion of the IC module are fixed with an adhesive. An IC card characterized in that:

According to a fourth aspect of the present invention, the buried hole of the card base has an alignment structure such as a depression, a projection, or a step for setting the position of the IC module. An IC card according to item 3.

According to a fifth aspect of the present invention, an island-shaped convex portion provided in the buried hole of the card base is provided with a concave portion having a bank portion around the island, and the connection terminal substrate is provided in the concave portion. 4. The IC card according to claim 3, wherein the bottom surface and the side surfaces of the mold part of the IC module are fixed with an adhesive so as to cover the side surfaces of the mold part formed in the vertical direction in the center of the back surface. is there.

The invention according to claim 6 is characterized in that the peripheral portion of the island-shaped convex portion provided in the buried hole of the card base is provided with a slope such as a step shape, a slope shape or the like. An IC card according to any one of claims 3 to 5.

According to a seventh aspect of the present invention, in the IC card according to any one of the fourth, fifth, and sixth aspects, the IC module is the IC module according to the first or second aspect. An IC card characterized by the following.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An IC module according to the present invention
Each terminal provided on the external connection terminal board of the module is electrically connected to the IC chip, and the IC chip and the connection portion are insulated with a molding resin such as BT resin, epoxy resin, silicon resin, phenol resin, or the like. In an IC module for an IC card constituted by covering with a body,
Almost the entire back surface side (including the IC chip and the bonding wires) of the external connection terminal substrate is covered with a molding resin to form a molded portion, so that the brim portion 9 of the module is formed.
The connection terminal substrate and the mold portion are separated by applying a bending stress applied to the portion of the conventional IC module shown in FIG. 21 where the mold portion is not applied to the portion where the mold portion is not applied. This is an IC module for an IC card having a feature of reducing a force to be applied.

An embodiment of the IC module of the present invention will be described in more detail with reference to the drawings. FIGS. 1 to 8 are views showing the configuration of an IC module according to the present invention, and the entire back surface of the external connection terminal board 8 is covered with an insulating material such as BT resin so as to cover the IC chip 5 and the bonding wires 6. It is constituted by a mold part 4 covered with a body.

FIG. 1 is an explanatory cross-sectional view of an IC module according to an embodiment of the present invention. On the back side of an external connection terminal board 8, except for a module section 4 formed by molding an IC chip 5 into a convex shape. Flange 9 of connection terminal board 8
In addition, the IC module 1 is formed by molding a molding resin 4 which is sealed diagonally downward from both edges of the connection terminal substrate 8 of the IC module 1 and has an inverted trapezoidal shape and a part of the bottom part having a flat surface. is there.

FIG. 2 shows an IC according to another embodiment of the present invention.
In the cross-sectional explanatory view of the module, the entire back surface of the external connection terminal substrate 8 is resin-sealed from both edges of the connection terminal substrate 8 of the IC module to a substantially uniform thickness, and the mold portion 4 having a flat bottom surface is formed. It is an IC module provided.

FIG. 3 shows an IC according to another embodiment of the present invention.
In the cross-sectional explanatory view of the module, the connection terminal board of the IC module 1 is provided on the back surface side of the external connection terminal board 8 on the brim portion 9 of the connection terminal board 8 other than the molded portion formed by molding the IC chip 5 into a convex shape. 8 is molded in a substantially arc shape from both edges of the molded part 4 and a part of the bottom part is a flat surface.
This is an IC module formed with.

FIG. 4 shows an IC according to another embodiment of the present invention.
In the cross-sectional explanatory view of the module, in addition to the mold portion 4 shown in FIG. 1 described above, resin molding is applied to both side end surfaces of the connection terminal substrate 8 to form an inverted trapezoidal shape and a part of the bottom portion having a flat surface. 4 is an IC module in which No. 4 is formed.

FIG. 5 shows an IC according to another embodiment of the present invention.
In the cross-sectional explanatory view of the module, the terminal plate 2 on the front surface is extended outward by a predetermined dimension from the connection terminal substrate 8, resin-sealed to the back surface side of the extended terminal plate 2, and a part of the bottom is made flat. This is an IC module having a molded part 4 formed thereon.
On the contrary, although not shown, the outer periphery of the connecting terminal base 8 may be made slightly smaller, so that the molded portion 4 may be formed so as to cover the exposed terminal plate 2 surface.

FIG. 6 shows an IC according to another embodiment of the present invention.
FIG. 4 is a cross-sectional explanatory view of the module. In order to perform positioning required for mounting the IC module 1 in the buried hole of the card base material, the resin is obliquely downward from both edges of the connection terminal board 8 of the IC module 1. This is an IC module having a mold section 4 in which a depression 13a as an alignment structure 13 is formed below an inclined surface of a sealed mold section 4.

FIG. 7 shows an IC according to another embodiment of the present invention.
Mold section 4 shown in FIG.
Similarly to the above, an IC module in which a step 13b is formed as a positioning structure 13 at the lower end of the mold portion 4 on the inclined surfaces on both sides, and the mold portion 4 having a convex bottom and a flat surface is provided.

FIG. 8 shows an IC according to another embodiment of the present invention.
FIG. 3 is an explanatory cross-sectional view of the module, showing an IC module having a mold part 4 in which a plurality of protrusions 13 c as alignment structures 13 are formed on a flat bottom surface of the mold part 4.

Next, an IC card mounted with the above-mentioned IC module according to the present invention is an IC card in which the IC module is embedded in a card base made of an insulating synthetic resin such as polyvinyl chloride. At a predetermined position on the card base material, a buried hole for mounting the IC module is formed, and a convex portion which is one step higher than the island-shaped bottom is formed at the center of the bottom of the buried hole. By bonding the molded portion to the island-shaped convex portion provided in the buried hole, the bottom surface, which is a flat surface in the substantially central portion, is bonded to the module portion even when bending stress is applied to the IC card. An IC card characterized in that the influence is reduced.

Further, an embodiment of the IC card of the present invention will be described in detail with reference to the drawings. That is, FIGS.
Is an IC mounted with the above-described IC module according to the present invention.
FIG. 2 is an explanatory diagram showing a configuration of a card, showing a structure of an IC module burying hole 11 and a configuration of an IC card in which an IC module 1 is buried in the burying hole.

First, FIG. 9 shows a card base 20 in which an IC module is embedded.
The hole 21 is formed at a predetermined position by counterbore processing, and shows the hole 21 formed on the surface of the card base material. (B) is an enlarged view of the buried hole 21 portion, and (C) is a cross-sectional view of the above-mentioned FF, and shows a bottom surface 22 of the buried hole 21 and an island-shaped convex portion one step higher than the bottom surface. 23 shows the card base material 20 formed on the substrate 23. In addition,
The buried hole 21 is not limited to the counterbore processing,
The card substrate 20 having the buried holes 21 at predetermined positions can be produced by injection molding.

FIG. 10 shows a conventional IC module having a mold section 4 inserted into an embedded hole 21 of the card base 20.
This is an IC card in which the bottom surface of the mold portion 4 on the back surface side of the IC module and the surface of the island-shaped convex portion 23 in the embedded hole 21 are fixed with the adhesive 12.

FIG. 11 shows a structure in which an IC module in which the mold portion according to claim 1 is provided on the entire rear surface side of the external connection terminal substrate is embedded. Mold section 4 having a flat bottom surface of an IC module (IC module in FIG. 1) in which both sides of mold section 4 are formed to be inclined.
And an IC card in which the surface of the island-shaped convex portion 23 in the burying hole 21 of the card base material 20 is fixed with the adhesive 12.

FIG. 12 shows an alignment for embedding the IC module on the bottom surface 22 of the embedding hole 21 formed in the card base material 20 and on the side slightly separated from the island-shaped projection 23. FIG. 13 shows an IC module (IC module shown in FIG. 6) in which a plurality of protrusions 24a are formed, and FIG. It is fixed to the island-shaped convex portion 23 by the adhesive 12 in accordance with the protruding portion 24a in the buried hole 21. Note that the protrusion 24a is an IC
This is for embedding the module. It should be formed as small and thin as possible so as not to affect the module due to the strong bending stress on the IC card, and it may be molded closer to the bonding part. The protrusion 24a may be broken when a bending stress is applied.

FIG. 14 is a plan view showing the bottom surface 22 of the buried hole 21 formed in the card base material 20 and the island-shaped convex portion 23.
Are provided with two projections 24b for positioning the IC module on the diagonal line. FIG. 15 is a cross-sectional view taken along the line F-F in FIG.
b, 13b (IC shown in FIG. 7)
The module) was fitted to the protrusion 24b in the burying hole 21 and fixed to the island-like convex portion 23 in the burying hole 21 with the adhesive 12 to obtain an IC card.

FIG. 16 is a plan view in which a plurality of recesses 24c for positioning a module to be embedded are formed on the surface of an island-shaped convex portion 23 provided in an embedding hole 21 of a card base material 20. FIG. 17 is a cross-sectional view taken along the line FF of FIG. 17 and shows an IC module in which a protrusion 13c for positioning is provided on the bottom surface of the mold part 4 in the buried hole 21 provided with the recess 24c (see FIG. 8). An IC card was obtained by aligning the IC module) with the depression 24c in the embedding hole and fixing the IC module on the island-shaped protrusion 23 with the adhesive 12. This IC card has a structure in which the depressions 24c of the alignment structure are arranged in a triangular shape so that the upper and lower sides of the IC module can be distinguished. Also, the depression 2 in this alignment structure
The concavities and convexities of 4c may be set in reverse.

FIG. 18 is a plan view showing an IC module having a conventional mold part 4 (IC module shown in FIG. 21).
FIG. 1 shows a substrate structure in which a concave portion 25 is formed in that portion instead of a convex portion for fixing the module) to the embedded hole 21 of the card substrate 20 with the adhesive 12.
The C-module includes a concave portion 25 opened so as to fix the side surface of the mold portion 4 on the back side of the C module, and a bank portion 26 surrounding the concave portion 25. FIG. 19 (A) is a cross-sectional view taken along the line FF of FIG. 18, in which the adhesive 1 is attached to the recess 25 formed on the bottom surface in the burying hole 21 of the card base 20.
2, the IC module is fixed. At this time, the bonding surface is fixed to the side surface of the mold part 4 of the IC module with an adhesive, whereby an area of the bonding area is secured, and the effect of the line cross-section bonding is obtained.
Further, an IC card having improved adhesion to the IC module can be obtained. That is, FIG. 19 (B) is an enlarged view of the line cross-section bonding portion G in the upper figure, and the hatched portion becomes the line cross-section bonding portion, which increases the strength against vertical pulling.

FIGS. 22A and 22B show the bottom surface of the mold portion on the back side of the IC module having the conventional mold portion 4 described with reference to FIG. 10 and the surface of the island-like convex portion in the buried hole. Is fixed with an adhesive, the peripheral edges H and I of the convex portion are made to be larger toward the surface of the convex portion in a step-like or slope-like manner.

Although FIGS. 11 to 17 illustrate the case where the molded portion embeds the IC module provided on the entire back surface of the external / external connection terminal board, a conventional IC module may be used. 10, 19, and 22.
In the figure, a case where a conventional IC module is embedded is illustrated, but an IC module in which the mold portion according to claim 1 is provided on the entire back surface of the external external connection terminal substrate may be illustrated. It is not limited to one.

[0035]

The IC module and the IC card of the present invention have the above-described structure and have the following effects. That is, according to the present invention, by forming a molded portion covered with an insulator such as BT resin also on the brim portion of the connection terminal substrate in the conventional IC module, the strength against the bending stress applied to the connection terminal substrate is formed. Can be provided. In addition, since the bonding portion between the IC module and the card base is an island-shaped convex surface at the center of the buried hole, the bending stress applied to the card is:
Absorbed by the moat-shaped bottom part around the convex part of the buried hole, the effect on the module is reduced, and I
C cards can be provided.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a cross section of an IC module according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a cross section of an IC module according to another embodiment of the present invention.

FIG. 3 is an explanatory diagram showing a cross section of an IC module according to another embodiment of the present invention.

FIG. 4 is an explanatory diagram showing a cross section of an IC module according to another embodiment of the present invention.

FIG. 5 is an explanatory diagram showing a cross section of an IC module according to another embodiment of the present invention.

FIG. 6 is an explanatory diagram showing a cross section of an IC module according to another embodiment of the present invention.

FIG. 7 is an explanatory diagram showing a cross section of an IC module according to another embodiment of the present invention.

FIG. 8 is an explanatory diagram showing a cross section of an IC module according to another embodiment of the present invention.

FIG. 9 shows a card base material according to an embodiment of the present invention, wherein (A) shows a card base material having a buried hole formed therein,
(B) is an enlarged view of the buried hole, and (C) is an FF cross-sectional view.

FIG. 10 is an explanatory view showing a cross section of an IC card on which the IC module according to one embodiment of the present invention is mounted.

FIG. 11 is an explanatory view showing a cross section of an IC card on which the IC module according to another embodiment of the present invention is mounted.

FIG. 12 is an explanatory view showing a plane of a card base according to another embodiment of the present invention.

FIG. 13 is an explanatory diagram showing a cross section of an IC card in which an IC module is mounted on the card base.

FIG. 14 is an explanatory view showing a plane of a card base according to another embodiment of the present invention.

FIG. 15 is an explanatory diagram showing a cross section of an IC card in which an IC module is mounted on the card base.

FIG. 16 is an explanatory view showing a card base according to another embodiment of the present invention in a plane view.

FIG. 17 is an explanatory diagram showing a cross section of an IC card in which an IC module is mounted on the card base.

FIG. 18 is an explanatory view showing a plane of a card substrate according to another embodiment of the present invention.

19 is a cross-sectional view taken along line FF of FIG.
FIG. 3A shows an C card, FIG. 3A shows an IC card in which an IC module is mounted on the substrate, and FIG. 3B is an enlarged view showing a line cross-section adhesive portion.

FIG. 20 is a plan view of the external connection terminal board of the conventional IC module viewed from the front terminal surface.

FIG. 21 is a cross-sectional view of the IC module of FIG. 20 taken along line FF;
It is sectional drawing of the IC card base material which mounts this module.

FIG. 22 is a diagram illustrating a cross section of an IC card on which a conventional IC module according to another embodiment of the present invention is mounted, wherein FIG.
(B) is a figure which shows that the peripheral part I was made step-like.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... IC module 2 (2a-2h) ... Each terminal 3 ... Through hole 4 ... Mold part 5 ... IC chip 6 ... Bonding wire 7 ... Wiring pattern 8 ... Terminal board for external connection 9 ... Flange part of terminal board 12 ... Adhesion Agent 13 ... Positioning structure of mold portion 13a ... Depression 13b ... Step 13c ... Protrusion 20 ... Card base material 21 ... Buried hole 22 ... Bottom surface of buried hole 23 ... Island-shaped convex portion 24 ... Module provided in buried hole Alignment structure 24a ... recess 24b ... protrusion 24c ... step 25 ... recess 26 ... bank around the recess G ... line cross-section adhesive H, I ... the periphery of the protrusion

Claims (7)

[Claims] 1. An IC for an IC card comprising: electrically connecting each terminal provided on an external connection terminal board of an IC module to an IC chip; and covering the IC chip and its connection portion with a mold resin. An IC module, wherein a mold portion covered with a mold resin is provided on the entire rear surface side of the external connection terminal substrate. 2. The molding device according to claim 1, wherein the shape of the mold portion is formed in a positioning structure such as a depression, a projection or a step for setting a position required for embedding in the card base material. 3. The IC module according to claim 1. 3. An IC card in which an IC module is mounted on a card base made of an insulating synthetic resin such as polyvinyl chloride, wherein the IC module is mounted at a predetermined position on the card base. I is characterized in that a buried hole is formed, an island-shaped protrusion is provided at the center of the bottom of the buried hole, and the protrusion is fixed to the bottom of the mold part of the IC module via an adhesive.
C card. 4. The IC according to claim 3, wherein the buried hole of the card base has an alignment structure such as a depression, a projection or a step for setting the position of the IC module.
card. 5. An island-shaped projection provided in a buried hole of the card base material is provided with a recess having a bank portion around the periphery thereof, and the recess is provided in a substantially vertical direction at a center portion of the back surface of the connection terminal substrate. 4. The IC card according to claim 3, wherein the bottom surface and the side surface of the mold portion of the IC module are fixed with an adhesive so as to cover the side surface of the mold portion formed in the IC card. 6. The method according to claim 3, wherein the peripheral portion of the island-shaped convex portion provided in the buried hole of the card base has a slope such as a step shape, a slope shape, or the like. Item 2. The IC card according to item 1. 7. The IC card according to claim 4, wherein the IC module is the IC module according to claim 1 or 2.
card.