JPH08324166A - Module for ic card and the card - Google Patents

Abstract

PURPOSE: To enhance the bending resistance and to improve the reliability by mounting a reinforcing member. CONSTITUTION: The module for an IC card comprises an IC chip connected from its terminal face to a board via a connecting member and resin-sealed, and a reinforcing member 11 having higher rigidity than those of the chip 2 and the board 1 and disposed on the different surface from the terminal 3 face of the chip. The IC card using the module for the IC card is provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to I having a substantially thin plate shape.
The present invention relates to a C card module and an IC card, and more particularly to an IC card module and an IC card that can improve bending resistance by attaching a reinforcing member.

[0002]

2. Description of the Related Art In recent years, along with the development of economic activities, development of an IC card having a storage capacity extremely higher than that of a magnetic card and an advanced security function and a module for this IC card have been advanced.

FIG. 11 is a sectional view showing the structure of this type of IC card module. In this IC card module, an IC chip 2 is mounted on a substrate 1 with a terminal 3 facing upward, the terminal 3 and the substrate 1 are connected via a bonding wire 4, and the IC chip 2 is a substrate. It is sealed with the insulating resin 5 including the connection part with 1.

Further, such an IC card module constitutes an IC card by mounting the IC chip 2 in a plastic card of vinyl chloride type or the like in which a recess is formed so as to be embedded therein.

The IC card has a total thickness of 0.76 mm defined by ISO, JIS, etc., and is put in the owner's wallet or the like and carried in a pocket or the like for personal identification processing or accounting processing of the owner. At that time, it is taken out of the wallet and used.

[0006]

However, in the IC card and the IC card module as described above, the IC
When the IC card is bent while the owner is seated while carrying the card, stress is applied to the IC card module, resulting in cracking of the IC chip 2, disconnection of the bonding wire 4, or bonding wire 4. There is a problem that a failure such as disconnection of a contact with the IC chip 2 or the substrate 1 occurs.

Further, there is a problem that the reliability of the IC card is lowered due to the occurrence of the failure due to such bending. The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an IC card module and an IC card that can improve bending resistance and reliability by attaching a reinforcing member.

[0008]

According to a first aspect of the present invention, there is provided an IC card module in which an IC chip is connected to a substrate from a terminal surface of the IC chip through a connecting member, and the IC chip is resin-sealed. In at least the IC
The IC card module has a rigidity higher than that of the chip and the substrate, and includes a reinforcing member arranged on a surface different from the terminal surface of the IC chip.

The invention according to claim 2 is the IC card module according to claim 1, wherein the terminal surface is arranged to face the substrate and the connecting member is a metal bump. is there.

Further, the invention according to claim 3 is the IC card module according to claim 1 or 2, wherein both the reinforcing member and the IC chip are resin-sealed. Is.

According to a fourth aspect of the invention, in the IC card module according to the second aspect, at least the IC among the reinforcing member and the IC chip is used.
This is an IC card module in which the side surface of the chip is resin-sealed.

Further, the invention corresponding to claim 5 is the IC card module according to any one of claims 1 to 4, wherein the reinforcing member and the IC chip are mutually bonded via an adhesive. It is a fixed IC card module.

According to a sixth aspect of the invention, in an IC card module in which an IC chip is connected to a substrate from a terminal surface of the IC chip via a connecting member, and the IC chip is resin-sealed, at least the IC card module is provided. An IC card module having a rigidity higher than the rigidity of an IC chip and the substrate and including a reinforcing member fixed on the surface of the resin sealing.

Further, the invention according to claim 7 is the IC card module according to claim 6, wherein the reinforcing member has an area larger than the area of the IC chip. The invention according to claim 8 is an IC using the IC card module according to any one of claims 1 to 7.
It's a card.

[0015]

Therefore, the invention according to claim 1 has the rigidity higher than the rigidity of at least the IC chip and the substrate and is arranged on the surface different from the terminal surface of the IC chip by taking the above-mentioned means. Since the reinforcing member is provided, the bending resistance can be improved and the reliability can be improved by attaching the reinforcing member.

Further, in the invention corresponding to claim 2, since the terminal surface corresponding to claim 1 is arranged to face the substrate and the connecting member is a metal bump, in addition to the function corresponding to claim 1, wire bonding is performed. The thickness of the IC card module can be reduced as compared with the system.

Furthermore, in the invention corresponding to claim 3, since both the reinforcing member and the IC chip corresponding to claim 1 or claim 2 are resin-sealed, the invention according to claim 1 or claim 2 is provided.
It is possible to achieve the same action as the action corresponding to.

Further, in the invention according to claim 4, at least the side surface portion of the IC chip among the reinforcing member and the IC chip according to claim 2 is resin-sealed, so that the same operation as that of claim 2 is achieved. In addition, the thickness of the IC card module can be reduced due to the absence of resin on the reinforcing member.

Further, in the invention according to claim 5, the reinforcing member and the IC chip according to any one of claims 1 to 4 are fixed to each other with an adhesive agent. In addition to the same operation as in any one of claims 1 to 4, it can be easily and surely created.

The invention according to claim 6 has at least a rigidity higher than the rigidity of the IC chip and the substrate and includes the reinforcing member fixed on the resin-sealed surface. By mounting, it is possible to improve bending resistance and reliability.

Further, in the invention according to claim 7, since the reinforcing member according to claim 6 has a larger area than the area of the IC chip, in addition to the same function as that of claim 6, the bonding is performed. Even in the case of the wire type IC card module, the bending resistance can be increased even to the connection portion by the bonding wire, and the reliability can be further improved.

The invention according to claim 8 is an IC card using the IC card module according to any one of claims 1 to 7, and therefore, the invention according to claim 1 to claim 7 The same action as the action corresponding to either can be achieved.

[0023]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an I according to a first embodiment of the present invention.
1 is a cross-sectional view showing the configuration of a C card module, and FIG.
The same parts as 1 are assigned the same reference numerals and detailed explanations thereof will be omitted, and only different parts will be described here.

That is, the IC card module of the present embodiment is intended to improve the bending resistance and the reliability as compared with the conventional module. Specifically, as shown in FIG.
A reinforcing member 11 is provided between the IC chip 2 and the substrate 1.

Here, the reinforcing member 11 is at least IC.
It has a rigidity higher than that of the chip 2 and the substrate 1, and, for example, a stainless material, a ceramic material, or the like can be used, and the IC chip 2 is mounted on a surface different from the terminal 3 surface in advance. It is mounted on the substrate 1.

In the IC card module, when the substrate 1, the reinforcing member 11 and the IC card 2 are attached to each other in this way, the terminals 3 of the IC card 2 and the substrate 1 are connected via the bonding wires 4 as described above. Then, the IC chip 2 including the connecting portion with the substrate 1 is resin-sealed (molded) to be formed.

On the other hand, the IC card is formed by mounting the IC card module so that the IC chip 2 is embedded in the recessed plastic card, as described above.

Next, the operation of such an IC card module and IC card will be described. Now, assume that the IC card can be bent. However, in the IC card module, since the reinforcing member 11 having high rigidity is provided between the IC chip 2 and the substrate 1, the periphery of the IC chip 2 is not bent and no stress is generated. Therefore, even if the IC card is bent, unlike the conventional case, the IC chip 2 is not cracked and the bonding wire 4 is not broken.
Needless to say, the contact does not come off.

As described above, according to the first embodiment, the reinforcing member having a rigidity at least higher than that of the IC chip 2 and the substrate 1 and arranged on a surface different from the surface of the terminal 3 of the IC chip 2. 11 is provided, it is possible to improve bending resistance and reliability by attaching the reinforcing member.

Next, an IC card module and an IC card according to the second embodiment of the present invention will be described. FIG. 2 is a cross-sectional view showing the configuration of this IC card module. The same parts as those in FIG. 1 are designated by the same reference numerals and detailed description thereof will be omitted, and only different parts will be described here.

That is, the IC card module of this embodiment is similar to the first embodiment in that the reinforcing member enhances the bending resistance to improve the reliability. Specifically, FIG. As shown, instead of the bonding wire 4, a metal bump 12 is provided on the surface of the terminal 3 of the IC chip 2, and the surface of the terminal 3 is disposed so as to face the substrate 1, and the substrate 1 and the IC chip 2 are interposed via the metal bump 12. It is configured to connect with.

Therefore, in the same manner as described above, even if the IC card is to be bent, in the IC card module, the reinforcing member 11 having high rigidity is attached to the IC chip 2, so that the periphery of the IC chip 2 is not bent, No stress is generated. Therefore, even if the IC card is bent, unlike the conventional case, the IC card module does not suffer any failure such as cracking, disconnection, and contact loss.

Further, since the metal bumps 12 are used in place of the bonding wires 4, the thickness of the IC card module should be made thinner than that of the first embodiment because there is no curved portion of the wires 4. You can

As described above, according to the second embodiment, I
Since the terminal 3 surface of the C chip 2 is arranged so as to face the substrate 1 and connects the IC chip 2 and the substrate 1 via the metal bumps 12, in addition to the effects of the first embodiment, compared to the wire bonding method. It is possible to reduce the thickness of the IC card module.

Next, an IC card module and an IC card according to the third embodiment of the present invention will be described. FIG. 3 is a cross-sectional view showing the configuration of this IC card module. The same parts as those in FIG. 2 are designated by the same reference numerals and detailed description thereof will be omitted, and only different parts will be described here.

That is, the IC card module of this embodiment uses the metal bumps 12 as in the second embodiment. Specifically, as shown in FIG.
The reinforcing member 11 is exposed by molding the side surface of the C-chip 2 and the periphery of the connecting portion. The reinforcing member 11 is fixed to the IC chip 2 with an adhesive.

Therefore, as described above, since the reinforcing member 11 having high rigidity is attached to the IC chip 2, I
Even if the C card is bent, the periphery of the IC chip 2 is not bent, and any failure such as cracking, disconnection, contact loss, etc. does not occur.

Further, since the reinforcing member 11 is exposed without molding the resin 5 on the reinforcing member 11, as compared with the second embodiment, the amount of the resin 5 on the reinforcing member 11 is smaller than that of the second embodiment. The thickness of the card module can be reduced.

As described above, according to the third embodiment, of the reinforcing member 11 and the IC chip 2, the side surface portion of the IC chip 2 is resin-sealed, so that in addition to the effect of the second embodiment. The thickness of the IC card module can be reduced because the resin 5 is not present on the reinforcing member 11.

Further, since the reinforcing member 11 and the IC chip 2 are fixed to each other through the adhesive, they can be easily and surely manufactured. Next, an IC card module and an IC card according to a fourth embodiment of the present invention will be described. FIG. 4 is a cross-sectional view showing the configuration of this IC card module. The same parts as those in FIG. 3 are designated by the same reference numerals, detailed description thereof will be omitted, and only different parts will be described here.

That is, in the IC card module of this embodiment, the resin 5 is molded around the side surface portion and the connection portion of the IC chip 2 as in the third embodiment.
The reinforcing member 11 is exposed, and specifically, FIG.
As shown in FIG.
Is molded.

Therefore, as described above, since the reinforcing member 11 having high rigidity is attached to the IC chip 2, I
Even if the C card is bent, the periphery of the IC chip 2 is not bent, and any failure such as cracking, disconnection, contact loss, etc. does not occur.

Further, since the upper portion of the reinforcing member 11 is exposed without molding the resin 5 on the upper portion of the reinforcing member 11, the thickness of the IC card module is reduced as in the third embodiment. be able to.

As described above, according to the fourth embodiment, since the side surface portions of both the reinforcing member 11 and the IC chip 2 are resin-sealed, the same effect as that of the third embodiment can be obtained. it can.

Next, an IC card module and an IC card according to the fifth embodiment of the present invention will be described. FIG. 5 is a cross-sectional view showing the configuration of this IC card module. The same parts as those in FIG. 3 are designated by the same reference numerals and detailed description thereof will be omitted, and only different parts will be described here.

That is, in the IC card module according to the present embodiment, the IC chip 2 with the resin sealing is used as in the third embodiment.
The reinforcement member 1 is applied to the side surface and the periphery of the connection portion of the
1 is exposed. Specifically, as shown in FIG. 5, instead of resin molding by molding, resin sealing by pouring is performed.

Therefore, as described above, since the reinforcing member 11 having high rigidity is attached to the IC chip 2, I
Even if the C card is bent, the periphery of the IC chip 2 is not bent, and any failure such as cracking, disconnection, contact loss, etc. does not occur.

Further, since the reinforcing member 11 is exposed without molding the resin 5 on the reinforcing member 11, it is possible to reduce the thickness of the IC card module as in the third embodiment.

As described above, according to the fifth embodiment, instead of the resin sealing by the molding of the third embodiment,
Since this is a modified example of resin sealing by pouring,
The same effect as that of the third embodiment can be obtained.

Next, an IC card module and an IC card according to a sixth embodiment of the present invention will be described. FIG. 6 is a cross-sectional view showing the configuration of this IC card module. The same parts as those in FIG. 4 are designated by the same reference numerals, detailed description thereof will be omitted, and only different parts will be described here.

That is, in the IC card module of this embodiment, the resin-encapsulated reinforcing member 11 is used as in the fourth embodiment.
And the side surface of the IC chip 2 and the periphery of the connection portion, and the upper portion of the reinforcing member 11 is exposed.
Specifically, as shown in FIG. 6, instead of resin molding by molding, resin molding by pouring is performed.

Therefore, as described above, since the reinforcing member 11 having high rigidity is attached to the IC chip 2, I
Even if the C card is bent, the periphery of the IC chip 2 is not bent, and any failure such as cracking, disconnection, contact loss, etc. does not occur.

Further, since the reinforcing member 11 is exposed without molding the resin 5 on the reinforcing member 11, the thickness of the IC card module can be reduced similarly to the fourth embodiment.

As described above, according to the sixth embodiment, instead of the resin sealing by the molding of the fourth embodiment,
Since this is a modified example of resin sealing by pouring,
The same effect as that of the fourth embodiment can be obtained.

Next, an IC card module and an IC card according to the seventh embodiment of the present invention will be described. FIG. 7 is a cross-sectional view showing the configuration of the IC card module. The same parts as those in FIG. 11 are designated by the same reference numerals and detailed description thereof will be omitted, and only different parts will be described here.

That is, the IC card module of the present embodiment is intended to improve the bending resistance and the reliability as compared with the conventional module. Specifically, as shown in FIG.
The reinforcing member 13 is fixed on the molded resin 5.

The reinforcing member 13 has an area larger than the area of the IC chip 2, and more specifically, the reinforcing member 13 has an area larger than the area including the connecting portion by the bonding wire 4 in order to protect the connecting portion. It is preferable from the viewpoint. As the material, as described above, a stainless material or a ceramic material can be appropriately used. Also, as the fixing method,
An adhesive is used as described above.

As a result, in the same manner as described above, even if the IC card is to be bent, in the IC card module, since the reinforcing member 13 having high rigidity is attached on the resin 5, the periphery of the IC chip 2 is not bent. , No stress is generated. Therefore, even if the IC card is bent, any failure such as cracking, disconnection, contact loss, etc. does not occur in the IC card module.

As described above, according to the seventh embodiment, the reinforcing member 13 which has a rigidity at least higher than the rigidity of the IC chip 2 and the substrate 1 and is fixed on the surface of the resin 5 sealing.
By including the reinforcing member, it is possible to improve bending resistance and reliability.

According to this embodiment, the reinforcing member 13 is I
Since the area is larger than the area of the C chip 2, even in the bonding wire type IC card module, the bending resistance can be increased even to the connection portion by the bonding wire 4, and the reliability is further improved. You can

Next, an IC card module and an IC card according to the eighth embodiment of the present invention will be described. FIG. 8 is a cross-sectional view showing the configuration of this IC card module. The same parts as those in FIG. 7 are designated by the same reference numerals, detailed description thereof will be omitted, and only different parts will be described here.

That is, the IC card module of the present embodiment is intended to improve the bending resistance and reliability as in the seventh embodiment. Specifically, as shown in FIG. , The metal bumps 12 are replaced by I instead of the bonding wires 4.
It is provided on the surface of the terminal 3 of the C chip 2, and the surface of the terminal 3 is disposed so as to face the substrate 1, and is connected to the substrate 1 via the metal bumps 12.
It is configured to connect to the C chip 2.

Therefore, as described above, even if the IC card is to be bent, in the IC card module, since the reinforcing member 13 having high rigidity is attached on the resin 5, the periphery of the IC chip 2 is not bent, No stress is generated. Therefore, even if the IC card is bent, any failure such as cracking, disconnection, contact loss, etc. does not occur in the IC card module.

Further, since the metal bumps 12 are used in place of the bonding wires 4, the thickness of the IC card module should be reduced as compared with that of the seventh embodiment by the amount of the curved line of the wires 4. You can

As described above, according to the eighth embodiment, the bump bonding method is used in place of the wire bonding method of the seventh embodiment. Therefore, in addition to the effects of the seventh embodiment, The thickness of the IC card module can be made thinner than that in the above embodiment.

Next, an IC card module and an IC card according to the ninth embodiment of the present invention will be described. FIG. 9 is a cross-sectional view showing the configuration of the IC card module. The same parts as those in FIG. 2 are designated by the same reference numerals, detailed description thereof will be omitted, and only different parts will be described here.

That is, the IC card module of this embodiment is a bump type module having the reinforcing member 11 fixed to the IC chip 2 as in the second embodiment. Molded resin 3 as shown
The second reinforcing member 13 is fixed on the top.

The second reinforcing member 13 has an area larger than that of the IC chip 2 as in the case of the seventh and eighth embodiments, and the material thereof can be a stainless material or a ceramic material as appropriate. ing. An adhesive is used as the fixing method.

As a result, even if the IC card is to be bent, the second reinforcing member 13 having high rigidity is mounted on the resin 3 in the same manner as described above, so that the IC chip 2 is surrounded by the IC chip 2. Does not bend and does not generate stress. Therefore, even if the IC card is bent,
The IC card module does not suffer any failure such as cracking, disconnection, or contact loss.

Further, as compared with the second embodiment, since the reinforcing member 13 is further fixed, the bending resistance can be further enhanced. As described above, according to the ninth embodiment, the reinforcing member 13 is further provided on the resin 3 of the second embodiment.
In addition to the effect of the second embodiment, the bending resistance can be further enhanced since the above is fixed.

Next, an IC according to the tenth embodiment of the present invention.
The card module and the IC card will be described.
FIG. 10 is a cross-sectional view showing the configuration of the IC card module. The same parts as those in FIG. 4 are designated by the same reference numerals, and the detailed description thereof will be omitted.

That is, the IC card module of this embodiment is a bump type module having a reinforcing member fixed to the IC chip 2 as in the case of the fourth embodiment, and is specifically shown in FIG. As described above, the second reinforcing member 13 is fixed to the (first) reinforcing member 11 and the resin 3 around it.

The second reinforcing member 13 has an area larger than that of the IC chip 2 as in the case of the seventh and eighth embodiments, and a stainless material or a ceramic material can be appropriately used as the material thereof. ing. An adhesive is used as the fixing method.

As a result, in the same manner as described above, even if the IC card is to be bent, in the IC card module, the first and second reinforcing members having high rigidity are mounted on the IC chip 2 and the like. The periphery of the IC chip 2 is not bent and no stress is generated. Therefore, even if the IC card is bent, the IC card module is cracked,
No failure such as disconnection or contact loss occurs.

Further, since the reinforcing member 13 is further fixed as compared with that of the fourth embodiment, the bending resistance can be further enhanced. As described above, according to the tenth embodiment, the reinforcing member 1 is further provided on the resin 3 of the fourth embodiment.
Since 3 is fixed, in addition to the effect of the fourth embodiment,
The bending resistance can be further enhanced. In addition, the present invention can be modified in various ways without departing from the scope of the invention.

[0076]

As described above, according to the first aspect of the present invention, a reinforcing member having a rigidity higher than that of at least the IC chip and the substrate and arranged on a surface different from the terminal surface of the IC chip is provided. Since it is equipped with a reinforcing member, it is possible to improve bending resistance and improve reliability.
A card module can be provided.

According to the invention of claim 2, claim 1
Since the terminal surface of (1) is arranged to face the substrate and the connecting member is a metal bump, it is possible to provide an IC card module having a thickness smaller than that of the wire bonding method in addition to the effect of the first aspect.

Further, according to the invention of claim 3, since both the reinforcing member and the IC chip of claim 1 or 2 are resin-sealed, the same effect as that of claim 1 or 2 can be obtained. An IC card module capable of playing can be provided.

According to the invention of claim 4, claim 2
Of the reinforcing member and the IC chip, at least the side surface of the IC chip is resin-sealed. Therefore, in addition to the effect of claim 2, the thickness of the IC card can be reduced by the amount of resin on the reinforcing member. Modules can be provided.

Further, according to the invention of claim 5, since the reinforcing member according to any one of claims 1 to 4 and the IC chip are fixed to each other with an adhesive, In addition to the effect similar to that of any one of 4, it can be created easily and surely.

Further, according to the invention of claim 6, the rigidity is at least higher than the rigidity of the IC chip and the substrate,
Since the reinforcing member fixed on the resin-sealed surface is provided, it is possible to provide the IC card module which can improve the bending resistance and the reliability by attaching the reinforcing member.

Further, according to the invention of claim 7, since the reinforcing member of claim 6 has a larger area than the area of the IC chip, in addition to the effect of claim 6, a bonding wire type IC card module is provided. Even if there is, it is possible to provide a module for an IC card which can improve the bending resistance even to the connection portion by the bonding wire and further improve the reliability.

According to the invention of claim 8, claim 1
Since the IC card uses the IC card module according to any one of claims 1 to 7, it is possible to provide an IC card that can achieve the same effect as that according to any one of claims 1 to 7.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing the configuration of an IC card module according to a first embodiment of the present invention,

FIG. 2 is a sectional view showing a configuration of an IC card module according to a second embodiment of the present invention,

FIG. 3 is a sectional view showing a configuration of an IC card module according to a third embodiment of the present invention,

FIG. 4 is a sectional view showing a configuration of an IC card module according to a fourth embodiment of the present invention,

FIG. 5 is a sectional view showing a configuration of an IC card module according to a fifth embodiment of the present invention,

FIG. 6 is a sectional view showing a configuration of an IC card module according to a sixth embodiment of the present invention,

FIG. 7 is a sectional view showing a configuration of an IC card module according to a seventh embodiment of the present invention,

FIG. 8 is a sectional view showing the structure of an IC card module according to an eighth embodiment of the present invention,

FIG. 9 is a sectional view showing a configuration of an IC card module according to a ninth embodiment of the present invention,

FIG. 10 is a sectional view showing a configuration of an IC card module according to a tenth embodiment of the present invention,

FIG. 11 is a sectional view showing a configuration of a conventional IC card module.

[Explanation of symbols]

1 ... Substrate, 2 ... IC chip, 3 ... Terminal, 4 ... Bonding wire, 5 ... Insulating resin, 11, 13 ... Reinforcing member, 1
2 ... Metal bump.

Claims (8)

[Claims] 1. An IC card module in which an IC chip is connected to a substrate from a terminal surface of the IC chip through a connecting member, and the IC chip is resin-sealed, at least in terms of rigidity of the IC chip and the substrate. An IC card module having a high rigidity and comprising a reinforcing member arranged on a surface different from the terminal surface of the IC chip. 2. The IC card module according to claim 1, wherein the terminal surface is arranged to face the substrate, and the connecting member is a metal bump. 3. The IC card module according to claim 1 or 2, wherein both the reinforcing member and the IC chip are resin-sealed. 4. The IC card module according to claim 2, wherein, of the reinforcing member and the IC chip, at least a side surface portion of the IC chip is resin-sealed. . 5. The IC card module according to claim 1, wherein the reinforcing member and the IC chip are fixed to each other with an adhesive agent. IC card module. 6. An IC card module in which an IC chip is connected to a substrate from a terminal surface of the IC chip via a connecting member, and the IC chip is resin-sealed, at least in terms of rigidity of the IC chip and the substrate. An IC card module having a high rigidity and comprising a reinforcing member fixed on the resin-sealed surface. 7. The IC card module according to claim 6, wherein the reinforcing member has an area larger than the area of the IC chip. 8. An IC card using the IC card module according to any one of claims 1 to 7.