JPH11282996A - Composite type ic card and fixing method for module therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a composite type IC card for applying force to a linear etching pattern and hardly applying the force to an IC chip part inversely by improving the structure of an IC module, widening an area to be adhered around a connection terminal part, hardly causing peel-off of connection terminals from each other and providing the linear etching pattern. SOLUTION: In this composite type IC card for burying holes 21 and 22, a shallow burying hole 21 for the substrate of a module connection terminal 18 exposing the surface of a coil terminal 17 and a deep burying hole 22 for burying a resin mold part 15 coating an IC chip 15a are successively provided. For the IC module, a terminal substrate 10 provided with an external connection terminal on a substrate surface and the module connection terminal 18 on a back side and a chip substrate composed by mounting the IC chip 15a are successively provided through a cut part. Then, the terminal substrate 10 is loaded on the shallow burying hole 21, the chip substrate is loaded on the deep burying hole 22, the connection terminals are connected to each other and the IC module is fixed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite IC card having both a contact type and a contact type external communication means.

[0002]

2. Description of the Related Art Conventionally, an IC card includes a contact type IC card which directly communicates with the outside of a terminal or the like through an external connection terminal, and a non-contact type IC which has no external terminal and communicates by radio waves using an antenna coil. Card and is known,
Each has its advantages and disadvantages. For example, a non-contact type IC card is easy for hardware maintenance.
Alternatively, it has the advantage of being resistant to static electricity, but may be stolen without knowing the information. On the other hand, although the contact type IC card has good security, there is a problem that maintenance of hardware is difficult because communication contacts are required.

[0003] At present, there has been proposed a composite IC card in which the above-mentioned non-contact type IC card and the contact type IC card are combined to realize the non-contact function and the contact function with one chip. In other words, by combining the ease of use of contactless type with the security of contact type, it is suitable for, for example, fee payment operation and billing in bank ticket systems, bank transactions, various identity confirmation operations, etc., and realizes convenient applications It is an IC card for the purpose of doing.

For example, as shown in FIG. 9, module connection terminals for connection with coil connection terminals are provided at two places on the back side of an IC module substrate, and an antenna coil 14 having a non-contact coil connection terminal is mounted. At a predetermined position of the card substrate 20, a buried hole 32 for mounting the IC module 30 is provided by counterboring or the like, and at the same time, the surface of the coil connection terminal is exposed at the bottom of the buried hole. By mounting the IC module in the buried hole and electrically connecting the module connection terminal and the coil connection terminal at the same time, a composite IC card can be obtained.

[0005]

However, in this case, the resin mold portion 33 on the back surface side of the IC module substrate is used.
Since the connection terminals are provided in the peripheral portion of the IC chip protected by the above, that is, the so-called brim portion, the bonding area for fixing the IC module 30 cannot be sufficiently taken.
In addition, since the bottom surface of the resin mold portion 33 that protects the IC chip so that the IC module does not sink into the buried hole 32 when pressed from above is also bonded by the non-conductive adhesive 38, the card is bent. When stress is applied,
There has been a problem that a connection failure such as a connection portion between connection terminals connected by the conductive adhesives 37, 37 is easily peeled off. Furthermore, if the card is bent when the brim part is strongly bonded, the IC on the back of the module
There has been a problem that a force is applied to the chip portion and the IC chip is cracked or peeled off.

Accordingly, the present invention has been made to solve the above-mentioned problem, and the structure of an IC module has been improved to increase the area to be bonded around a connection terminal portion, thereby causing peeling of the connection terminals. In addition, it is difficult to bend the long side of the card, and by providing a recess (cut) between the IC chip and the connection terminal and a linear etching pattern, a force is first applied to that. And conversely I
An object of the present invention is to provide a composite IC card in which a force is hardly applied to a C chip portion.

[0007]

In order to solve the above-mentioned problems, the present invention embeds an antenna coil having a coil connection terminal in a card base material, and forms an embedding hole at a predetermined position on the card base material surface. , An IC module mounted in the buried hole and connected to a coil and a module connection terminal.
In the card, the IC module is provided with a terminal board provided with external connection terminals on the surface of the module substrate and module connection terminals on the back side, and a chip substrate on which an IC chip is mounted via a cutout portion, The buried hole continuously connects a shallow buried hole exposing the coil connection terminal surface and a deeply formed buried hole, a terminal board is provided in the shallow buried hole, and a terminal board is provided in the deeply formed buried hole. A chip substrate is mounted, the coil connection terminal and the module connection terminal are connected with a conductive adhesive, and the back surface of the terminal substrate and the bottom of the resin mold portion are fixed to the bottom of the buried hole with a non-conductive adhesive. To provide a composite IC card.

Further, the IC chip and the module connection terminal are connected to the external connection terminal via a through-hole by a wiring pattern provided on the back surface of the module substrate. Module connection terminals are provided in parallel with the wiring pattern and in the vertical or horizontal direction with respect to the terminal board.

Further, a groove is provided on a surface of the terminal substrate and the chip substrate and on a boundary between the external connection terminal and the cutout portion. Further, the module substrate is made of a thin glass epoxy resin plate.

Further, in this method of fixing an IC module, a two-component curable adhesive is applied to the bottom surface of the deeply formed buried hole and, at the same time, heat is applied to a part or the whole of the back surface of the terminal board excluding the IC module connection terminal part. It is characterized in that an adhesive film is attached, a chip substrate is mounted in a buried hole in which the terminal substrate of the IC module is formed shallow, and a chip substrate is mounted in a buried hole which is formed deep, and the terminal substrate portion is subjected to high-frequency heat fusion.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION In a composite IC card according to the present invention, an antenna coil having a coil connection terminal is embedded in a card base material, an embedding hole is provided in a predetermined position on the surface of the card base material, A composite IC card in which an IC module is mounted and connection terminals are connected to each other. The IC module includes an IC chip mounted with a terminal board having external connection terminals on the surface of the module board and module connection terminals on the back side. And a chip substrate formed continuously through cutouts. On the other hand, the buried hole is formed shallow by forming a shallow buried hole exposing the surface of the coil terminal and a deeply formed buried hole for embedding the resin mold portion covering the IC chip. The terminal board is mounted in the buried hole, and the chip substrate is mounted in the buried hole formed deep, the connection terminals are connected to each other with a conductive adhesive, and the terminal substrate and the bottom of the resin mold portion are bonded with a nonconductive adhesive. It is characterized by being fixed to the bottom of the buried hole. As a method of fixing the IC module to the buried hole, first,
A thermal adhesive film is attached to a part or the whole of the back surface of the terminal board except for the IC module connection terminal part, and the chip substrate is mounted in the buried hole in which the terminal board of the IC module is formed shallowly and in the buried hole formed deeply. The module can be firmly fixed by high-frequency heat fusion of the terminal board portion.

Hereinafter, embodiments will be described in detail with reference to the drawings. 1A and 1B schematically show an IC module according to an embodiment of the present invention. FIG. 1A is an explanatory diagram of the IC module viewed from the front side, and FIG. 1B is an explanatory diagram of the IC module viewed from the back side. It is. FIG. 2 is an explanatory view of a buried hole provided in a card base material in which an antenna coil is buried in one embodiment of the present invention. FIG. 3 is an explanatory view showing a composite IC card in which an IC module is mounted in a buried hole of the card base material. First, an example of an IC module used in the composite IC card according to the present invention is shown in FIG.
A terminal board 10 provided with module connection terminals 18 and 18 on the back side in a vertical direction relative to the board;
The chip substrate 12 in which a is protected by the resin mold portion 15 is provided continuously through cutouts k and k. The size of the chip substrate 12 in this case is not limited, but is smaller than the area of the terminal substrate 10. (Small) formed. Also, the terminal board 10
External connection terminals 11a are provided on the surface of the chip substrate 12 with copper foil or the like and gold-plated. However, the surface of the chip substrate 12 may or may not be provided with a layer of gold-plated copper foil or the like. Is not done.

Further, between the cut portion k and the cut portion k,
In addition, the groove m is provided on the boundary surface between the terminal substrate 10 and the chip substrate 12, so that the portion is easily bent. For example, external stress can be released to a place where the influence is least. Note that, as described above, the copper foil and the gold plating layer are also straightened so as to bend more easily.

Although not shown, the external connection terminal and the module connection terminal are connected through a through hole by a wiring pattern formed by etching a copper foil or the like, and the module connection terminal is connected to an IC chip.

Next, as shown in FIG. 2, a module embedding hole is formed at a predetermined position (a region where the coil connection terminals are embedded) of the card base 20 in which the antenna coil 14 having the coil connection terminals 17 and 17 is embedded. It is provided by processing or the like. The buried hole for mounting the IC module according to the present invention includes a shallow buried hole 21 for mounting the module connection terminal board 10 exposing the surfaces of the coil connection terminals 17 and 17, and a resin mold for protecting the IC chip. Deeply formed buried hole 22 for burying the portion 15
And are formed by boring.

That is, as shown in FIGS. 2 and 3, the buried hole 2 in which the terminal board 10 of the IC module is formed shallowly.
First, the chip substrate 12 is mounted in the deeply formed buried hole 22. Then, the connection terminals 18 of the module and the coil connection terminals 17 exposed in the buried holes are connected with a conductive adhesive 25, and the back side of the terminal substrate 10 and the bottom surface of the resin mold portion 15 are fixed with a non-conductive adhesive 27. Doing complex IC
The card was obtained.

Further, although not shown, the method of fixing the IC module to the buried hole is as follows.
A two-component curable adhesive, for example, a two-component curable urethane-based adhesive or a two-component curable epoxy-based adhesive, is applied to the bottom surface of the terminal substrate 10 and the rear surface of the terminal board 10 excluding the module connection terminals 18 and 18. After attaching a thermal adhesive film, for example, a vinyl chloride film or a polypropylene film to a part or the whole surface, the terminal board 1 of this IC module is attached.
0 is buried in the buried hole 21 formed shallowly,
A chip substrate 12 is mounted on 2 and the terminal substrate 10 is thermally fused by high frequency, and the chip substrate 12 is fixed to the bottom surface of the resin mold portion 15 and the bottom surface of the buried hole 22 with a two-liquid curing adhesive. , The IC module can be strongly fixed.

Therefore, there is no conductivity other than the two terminal portions on the back side of the terminal board, for example, an epoxy-based or urethane-based two-component curable adhesive, or, as described above, the non-conductive portion except for the terminal portions. By fixing the IC module with an adhesive, as shown in FIG. 7, a coil is passed between two module connection terminals, and a coil can be easily formed with a single-sided coil sheet. That is, since the IC chip is usually located between the two terminals, the buried hole at that portion must be dug deeper, and as a result, the coil sheet uses a substrate formed on both sides, or as shown in FIG. The jumper structure had to be used somewhere.

Hereinafter, the present invention will be described in detail with reference to specific examples.

<Embodiment 1> An embodiment 1 will be described with reference to FIGS. A chip substrate 12 on which a resin mold portion 15 for protecting the IC chip 15a is formed, external connection terminals on the surface of the substrate, and module connection terminals 18 on the back surface;
The terminal board 10 provided in the lateral direction toward the board is provided continuously through cutouts k, k. The size of the chip substrate 12 in this case is not limited, but is formed smaller (smaller) than the area of the terminal substrate 10. Also, the terminal board 10
External connection terminals on which copper foil or the like is applied and plated with gold are provided on the surface. On the surface of the chip substrate 12, a layer on which gold is plated with copper foil or the like is provided. Further, the notch k
Between the terminal board 10 and the chip board 1
By providing a groove m at the surface boundary with the surface 2, it is easy to bend at that portion, and external stress can be released to a place where the influence is least.

As shown in FIG. 4 when the IC module is viewed from the back side, the external connection terminal and the module connection terminal are connected through a through hole 13 by a wiring pattern 19 in which copper foil or the like is etched. 1
8 and 18 are connected to the IC chip 15a. next,
As shown in FIG. 5, a module embedding hole is provided at a predetermined position (coil connection terminal area) of the card base material 20 in which the antenna coil 14 having the coil connection terminals 17 and 17 is embedded by boring or the like. This buried hole is a shallow buried hole 21 for mounting the module connection terminal board 10 exposing the surfaces of the coil connection terminals 17 and 17.
And a deeply formed buried hole 22 that embeds the resin mold portion 15 covering the IC chip, and is formed by boring. The buried hole 21 is formed deeply in the shallow buried hole 21 of the terminal board 10 of the IC module. The chip substrate 12 is mounted on 22. At this time, a vinyl chloride film is adhered to the entire surface of the terminal substrate 10 except for the connection terminals 18 on the back side, and a urethane-based two-liquid curing type of a non-conductive adhesive 27 is applied to the terminal substrate 10 and the bottom surface of the resin mold portion 15. At the same time that the adhesive is applied and fixed, the connection terminals 17 and 18 are connected to each other with a conductive adhesive 25, and the terminal substrate is thermally fused from the surface of the terminal substrate 10 by high frequency to obtain a composite type shown in FIG. I got an IC card.

[0022]

As described above, according to the present invention, a composite IC card having a coil connection portion which is strong against bending can be obtained. In addition, by providing a groove between the cut portion of the terminal board and the chip board which are continuously provided, and at the boundary between the terminal board and the chip board, it is easy to bend at that portion, so that the When a bending force is applied, this stress can be released to the least affected portion of the module. Furthermore, by removing the copper foil and the gold plating layer in a straight line, the module substrate is more easily bent. In addition, various excellent effects can be obtained, such as passing a coil between two module connection terminals and easily forming a coil with a single-sided coil sheet.

[Brief description of the drawings]

FIGS. 1A and 1B schematically show an IC module according to an embodiment of the present invention, wherein FIG. 1A is an explanatory diagram of the IC module viewed from the front side, and FIG. It is.

FIG. 2 is an explanatory diagram of a buried hole provided in a card base material in which an antenna coil is buried in one embodiment of the present invention.

FIG. 3 is an explanatory view showing a composite IC card in which an IC module is mounted in a burial hole of the card base material.

FIG. 4 is a schematic explanatory view of an IC module according to another embodiment of the present invention as viewed from the back surface side.

FIG. 5 is an explanatory diagram of a buried hole in a card base material in which an antenna coil is buried in another embodiment of the present invention.

FIG. 6 is a schematic explanatory view of a composite IC card according to another embodiment of the present invention.

FIG. 7 is an explanatory diagram of a coil sheet according to the composite IC card of the present invention.

FIG. 8 is an explanatory diagram of a coil sheet according to a conventional composite IC card.

FIG. 9 is an explanatory diagram showing an example of a conventional composite IC card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Terminal board 11 ... Module board 12 ... Coil board 13 ... Through hole 14 ... Antenna coil 15 ... Resin molded part which covered IC chip 15a ... IC chip 17 ... Coil connection terminal 18 ... Module connection terminal 19 ... Wiring pattern 20 ... Card base material 21: shallow buried hole 22: deeply formed buried hole k: notch m: groove

Claims (6)

[Claims] An antenna coil having a coil connection terminal is embedded in a card base material, an embedded hole is provided at a predetermined position on the surface of the card base material, an IC module is mounted in the embedded hole, and a coil and a module connection terminal are provided. In a combined IC card, the IC module is formed by cutting a terminal board having an external connection terminal on the front surface of the module substrate and a module connection terminal on the back surface, and a chip substrate on which an IC chip is mounted. The buried hole is formed by connecting a shallow buried hole exposing the coil connection terminal surface and a deeply formed buried hole, and the terminal board is provided in the shallow buried hole. A chip substrate is mounted in the deeply formed buried hole, the coil connection terminal and the module connection terminal are connected with a conductive adhesive, and the back surface of the terminal substrate and the bottom surface of the resin mold portion are non-conductive. Composite IC card, characterized in that fixed to the inlay cavity by Chakuzai. 2. The composite according to claim 1, wherein the IC chip and the module connection terminal are connected to the external connection terminal via a through-hole by a wiring pattern provided on the back surface of the module substrate. Type IC card. 3. The device according to claim 1, wherein a plurality of the module connection terminals are provided between the wiring pattern and the terminal board in the vertical or horizontal direction.
Or the composite IC card according to 2. 4. The groove according to claim 1, wherein a groove is provided on a surface of the terminal substrate and the chip substrate and on a boundary between the external connection terminal and the cutout. The composite IC card according to the above. 5. The composite IC card according to claim 1, wherein said module substrate is made of a thin glass epoxy resin plate. 6. A terminal for connecting a coil connection terminal and a module connection terminal with a conductive adhesive, and a back surface of a terminal substrate and a bottom surface of a resin mold portion are fixed to a bottom surface of a buried hole with a non-conductive adhesive. Item 2. In the composite IC card according to Item 1, a two-part curable adhesive is applied to the bottom surface of the deeply formed buried hole, and at the same time, a heat bonding film is applied to a part or the entire back surface of the terminal board excluding the IC module connection terminal part. A chip substrate is mounted in a buried hole where the terminal board of the IC module is formed shallowly, and a chip substrate is mounted in the buried hole formed deeply, and the terminal board portion is subjected to high-frequency heat fusion. Method.