KR100852128B1 - Combicard and method for manufacturing therefor - Google Patents

Combicard and method for manufacturing therefor Download PDF

Info

Publication number
KR100852128B1
KR100852128B1 KR1020080003831A KR20080003831A KR100852128B1 KR 100852128 B1 KR100852128 B1 KR 100852128B1 KR 1020080003831 A KR1020080003831 A KR 1020080003831A KR 20080003831 A KR20080003831 A KR 20080003831A KR 100852128 B1 KR100852128 B1 KR 100852128B1
Authority
KR
South Korea
Prior art keywords
cob
card
pad
attached
terminal
Prior art date
Application number
KR1020080003831A
Other languages
Korean (ko)
Inventor
남기성
Original Assignee
주식회사 하이스마텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 하이스마텍 filed Critical 주식회사 하이스마텍
Priority to KR1020080003831A priority Critical patent/KR100852128B1/en
Application granted granted Critical
Publication of KR100852128B1 publication Critical patent/KR100852128B1/en

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/0773—Physical layout of the record carrier the record carrier comprising means to protect itself against external heat sources
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

A combi card and a manufacturing method thereof are provided to prevent deformation and progressive failure, which are caused by distortion or a temperature change, of a COB(Chip On Board), and minimize bad contact with an interval secured from elasticity of conductive silicone by coating the conductive silicone on a lower terminal and an antenna contact terminal, and coating adhesive to a face adhering a card main body and the COB. A COB(100) includes a rectangular pad(110), a chip(120) attached to the lower center of the pad, a lower terminal(130) separated from the chip on a lower part of the pad, and an external terminal(140) having a sill with the pad while being attached to the upper center of the pad. A card main body(200) forms a receiving part(30) for receiving the COB and an antenna contact terminal(220) electrically connected to the lower terminal. A reinforcement sheet(300) is attached on the card main body and exposes the external terminal through an external terminal hole(40). The COB is attached to the receiving part by conductive silicone(10) coated between the lower terminal and the antenna contact point, and adhesive(20) coated to a lower side of the receiving part.

Description

콤비카드 및 그 제작방법{COMBICARD AND METHOD FOR MANUFACTURING THEREFOR}COMBICARD AND METHOD FOR MANUFACTURING THEREFOR}

본 발명은 콤비카드에 관한 것으로서, 더욱 상세하게는 카드의 뒤틀림이나 온도변화에 의한 COB(Chip On Board) 변형 및 진행성 불량을 방지하며, 카드본체와 COB와의 이탈을 차단하는 기술에 관한 것이다.The present invention relates to a combination card, and more particularly, to a technology that prevents chip on board (COB) deformation and progression failure due to card distortion or temperature change, and blocks the departure of the card body and COB.

콤비카드란, 중앙처리장치를 내장한 스마트카드의 하나로, 접촉식 카드와 비접촉식 카드 기능을 통합하여 하나의 카드에 서로 공유하는 복수개의 메모리가 존재하는 카드이다.Combi card is a smart card with a built-in central processing unit, which is a card that integrates a contact card and a contactless card function and has a plurality of memories shared with each other on one card.

이러한 콤비카드는 많은 양의 정보를 기록할 수 있어 금융ㆍ교통ㆍ신분증명ㆍ통신 등 다양한 분야에 걸쳐 사용되고 있고, 안정성과 보안성이 우수해 위ㆍ변조가 어려운 장점이 있어 가장 진보된 스마트카드로 분류되어 많은 연구개발이 이루어지고 있으며, 본 출원인이 출원한 제2007-0077151호 '콤비카드 제조방법 및 이에 사용되는 디스펜싱 장치'외에 다수 개시된 상태이다.This combination card can record a large amount of information and is used in various fields such as finance, transportation, identity verification, communication, etc., and it is the most advanced smart card because it has the advantage of being difficult to forge and alter because of its excellent stability and security. Many researches and developments have been carried out, and a number of states other than 2007-0077151 filed by the present applicant, 'combi card manufacturing method and a dispensing apparatus used therein' are disclosed.

상기 제2007-0077151호의 제조방법은, 첨부도면 도 1에 도시된 바와 같이, COB단자에 도전성 실리콘을 디스펜싱한 후 건조시키는 제1 공정과, 제1 공정에 의 해 디스펜싱된 도전성 실리콘을 수용하기 위하여 제2 시트에 천공작업을 통해 한 쌍의 수용홀을 형성하는 제2 공정과, 카드본체를 구성하는 제3 공정과, COB를 내장하기 위하여 제3 공정에서 제조된 카드본체에 밀링 작업을 통하여 삽입홈을 형성하는 제4 공정과, 삽입홈에 COB를 삽입한 후 COB단자와 안테나 코일의 접점부가 전기적으로 연결되도록 COB와 카드본체를 압착하는 제5 공정으로 진행된다.As shown in FIG. 1, the manufacturing method of 2007-0077151 includes a first step of dispensing conductive silicon in a COB terminal and drying the same, and the conductive silicon dispensed by the first step. In order to do this, a second process of forming a pair of receiving holes through a drilling operation on the second sheet, a third process constituting the card body, and a milling operation on the card body manufactured in the third process to embed the COB The fourth step of forming the insertion groove through the through, and after inserting the COB into the insertion groove proceeds to the fifth step of pressing the COB and the card body to electrically connect the contact portion of the COB terminal and the antenna coil.

상기 출원특허의 주요특징은, COB 단자에 화학적 수단인 도전성 실리콘을 사전에 디스펜싱하는 제1 공정에 있다. 그러나, 이는 공정상의 편의를 도모하고자 한 것뿐이며, 상기와 같이 제작된 콤비카드는 1~2년경과 후, 변형 뒤틀림과, 급격한 온도변화에 기인한 물성변화 등에 취약한 구조이기 때문에 진행성 불량을 해소할 수 없다.The main feature of the said patent application is the 1st process of previously dispensing the conductive silicon which is chemical means to a COB terminal. However, this is only intended for the convenience of the process, and the combination card manufactured as described above is vulnerable to deformation distortion and physical property change caused by rapid temperature change after one or two years, thereby eliminating progression defects. Can't.

또한, 도전성 실리콘의 성능변화에 따른 접착력 약화로 인해 COB의 들뜸 현상을 초래하여 접촉 불량에 의한 수명단축이 불가피하며, 이로 인해 카드본체와 COB가 이탈되는 구조적인 문제점이 있다.In addition, due to the weakening of the adhesion force due to the change in the performance of the conductive silicon, the rise of the COB is inevitable, shortening the lifespan due to poor contact, which causes a structural problem that the card body and COB is separated.

본 발명은 콤비카드 및 그 제작방법에 관한 것으로서, 하부단자 및 안테나 접점에 도전성 실리콘을 도포함과 아울러 카드본체와 COB의 접합면에 접착제를 도포하여 카드의 뒤틀림이나 온도변화에 따른 COB의 변형 및 진행성 불량을 방지하며, 도전성 실리콘의 탄성에 의한 이격거리 확보에 따라 접촉 불량을 최소화 하고자 한다.The present invention relates to a combination card and a method of manufacturing the same, including conductive silicon at the lower terminals and antenna contacts, and applying an adhesive to the joint surface of the card body and the COB to deform and modify the COB according to the card distortion and temperature change. To prevent progressive defects and minimize contact defects by securing the separation distance due to the elasticity of the conductive silicon.

또한, 카드본체 상부에, 패드와 외부단자 간에 형성된 단차를 에두르는 보강시트를 부착함으로써, 카드본체와 COB와의 이탈을 방지한다.In addition, by attaching a reinforcing sheet covering the step formed between the pad and the external terminal on the upper portion of the card body, the separation between the card body and the COB is prevented.

이러한 기술적 과제를 달성하기 위한 본 발명의 콤비카드는, 사각형상의 패드(110)와, 패드의 하부 중앙에 부착된 칩(120)과, 패드의 하부에 칩과 소정거리 이격되어 형성된 하부단자(130), 및 패드의 상부 중앙에 부착되되 패드와 단차(S)를 갖는 외부단자(140)를 포함하는 COB(100); COB가 안착되는 안착부(30)를 형성하며, 하부단자(130)와 전기적으로 접속되는 안테나 접점(220)을 포함하는 카드본체(200); 및 외부단자 수용홀(40)을 통해 외부단자가 노출되도록 카드본체 상부에 부착된 보강시트(300); 를 포함한다.Combi card of the present invention for achieving the technical problem, the rectangular pad 110, the chip 120 attached to the lower center of the pad, and the lower terminal 130 formed to be spaced apart from the chip in the lower portion of the pad A COB 100 attached to the upper center of the pad and including an external terminal 140 having a step S with the pad; A card body 200 which forms a seating part 30 on which the COB is seated, and includes an antenna contact 220 electrically connected to the lower terminal 130; And a reinforcing sheet 300 attached to the upper part of the card body to expose the external terminal through the external terminal accommodating hole 40. It includes.

또한 본 발명에 따른 콤비카드 제작방법은, 하부단자(130)에 도전성실리콘(10)을 도포하고, 안테나 접점(220)에 도전성실리콘(10)을 도포함과 아울러 안착부(30) 저면에 소정양의 접착제(20)를 도포하는 제1 과정; 및 COB(100)가 안착 부(30)에 수용되어 하부단자(130)와 안테나 접점(220)에 도포된 도전성실리콘(10)이 서로 맞닿고, 칩(120)과 안착부(30)에 도포된 접착제(20)가 맞닿도록 카드본체(200)에 부착되는 제2 과정; 으로 이루어진다.In addition, the manufacturing method of the combination card according to the present invention, the conductive silicon 10 is applied to the lower terminal 130, the conductive silicon 10 is included in the antenna contact 220, and the small portion on the bottom of the seating portion 30 A first process of applying a positive adhesive 20; And the COB 100 is accommodated in the seating unit 30, and the conductive silicon 10 applied to the lower terminal 130 and the antenna contact 220 abut each other, and is applied to the chip 120 and the seating unit 30. A second process attached to the card main body 200 such that the adhesive 20 is in contact with the adhesive 20; Is done.

바람직하게는 상기 제2 과정 이후, 보강시트(300)가 패드(110)와 단차(S)를 갖는 외부단자(140)를 에두르도록 상기 카드본체(200) 상부에 부착되는 제3 과정; 을 더 포함한다.Preferably, after the second process, a third process in which the reinforcing sheet 300 is attached to the upper portion of the card body 200 so as to surround the external terminal 140 having a step S with the pad 110; It includes more.

상기와 같은 본 발명에 따르면, 하부단자 및 안테나 접점에 도전성실리콘을 도포함과 아울러 카드본체와 COB의 접합면에 접착제를 도포함으로써, 카드의 뒤틀림이나 온도변화에 따른 COB의 변형 및 진행성 불량을 방지하며, 도전성실리콘의 탄성에 의한 이격거리 확보에 따라 접촉 불량을 최소화 한다.According to the present invention as described above, by applying conductive adhesive to the card body and the COB bonding surface, including the conductive silicon on the lower terminal and the antenna contact, to prevent the deformation and progression of the COB due to card distortion or temperature change The contact distance is minimized by securing the separation distance due to the elasticity of the conductive silicon.

또한, 카드본체 상부에, 패드와 외부단자 간에 형성된 단차를 에두르는 보강시트를 부착함으로써, 카드본체와 COB와의 이탈을 방지한다.In addition, by attaching a reinforcing sheet covering the step formed between the pad and the external terminal on the upper portion of the card body, the separation between the card body and the COB is prevented.

본 발명의 구체적인 특징 및 이점들은 첨부도면에 의거한 다음의 상세한 설명으로 더욱 명백해질 것이다. 이에 앞서, 본 명세서 및 청구범위에 사용된 용어나 단어는 발명자가 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야 할 것이다. 또한, 본 발명에 관련된 공지 기능 및 그 구성에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판 단되는 경우에는, 그 구체적인 설명을 생략하였음에 유의해야 할 것이다.Specific features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings. Prior to this, the terms or words used in the present specification and claims are defined in the technical spirit of the present invention on the basis of the principle that the inventor can appropriately define the concept of the term in order to explain his invention in the best way. It should be interpreted to mean meanings and concepts. In addition, when it is determined that the detailed description of the known function and the configuration related to the present invention may unnecessarily obscure the subject matter of the present invention, it should be noted that the detailed description is omitted.

도 2를 참조하면, 본 발명의 콤비카드(C)는, COB(100), 카드본체(200) 및 보강시트(300)를 포함한다.Referring to FIG. 2, the combination card C of the present invention includes a COB 100, a card main body 200, and a reinforcing sheet 300.

구체적으로 COB(100)는 첨부도면 도 3에 도시된 바와 같이, 패드(110)와, 패드 하부에 중앙에 부착된 칩(120)과, 패드 하부에 칩과 소정거리 이격되어 형성된 하부단자(130)와, 패드 상부 중앙에 부착된 외부단자(140)로 구성된다. 여기서, 패드(110)의 넓이는 외부단자(140)보다 크다. 따라서, 첨부도면 도 3에 도시된 바와 같이, 패드(110)와 외부단자(140) 간에는 단차(S)가 형성되며, 외부단자의 외측에는 연성(軟性)의 도전성실리콘(10)이 도포된다.Specifically, as shown in FIG. 3, the COB 100 includes a pad 110, a chip 120 attached to the center at a lower part of the pad, and a lower terminal 130 formed to be spaced apart from the chip by a predetermined distance under the pad. ), And an external terminal 140 attached to the center of the pad upper portion. Here, the width of the pad 110 is larger than the external terminal 140. Accordingly, as shown in FIG. 3, a step S is formed between the pad 110 and the external terminal 140, and flexible conductive silicon 10 is coated on the outside of the external terminal.

도 4는 COB(100), 카드본체(200) 및 보강시트(300)의 결합관계를 도시한 사시도이고, 도 5는 COB(100), 카드본체(200) 및 보강시트(300)간의 단면을 도시한 도면이다.4 is a perspective view showing a coupling relationship between the COB 100, the card body 200 and the reinforcing sheet 300, Figure 5 is a cross-sectional view between the COB 100, card body 200 and the reinforcing sheet 300 The figure is shown.

첨부도면 도 4 및 도5를 참조하여 살피면, 카드본체(200)는 직방형 형상으로 COB(100)를 수용ㆍ안착하는 안착부(30)를 형성하고, 하부에는 결제에 사용되는 마그네틱 바가 형성되며, 안테나 코일(210) 및 안테나 접점(220)을 포함한다.4 and 5, the card main body 200 has a rectangular shape and forms a seating portion 30 for accommodating and seating the COB 100, and a magnetic bar used for settlement is formed at the bottom thereof. , An antenna coil 210 and an antenna contact 220.

안테나 코일(210)은 본체 외주연 내측을 에두르도록 금속막 에칭(etching) 패턴을 형성하고, 안테나 접점(220)은 상기 하부단자(130) 전기적으로 접속되며, 안테나 코일(210)과 연결되어 하부단자(130)와 전기적으로 접속되도록 한 쌍을 이룬다.The antenna coil 210 forms a metal film etching pattern to surround the inner circumference of the main body, and the antenna contact 220 is electrically connected to the lower terminal 130 and is connected to the antenna coil 210. It forms a pair to be electrically connected to the lower terminal 130.

이때 안착부(30) 저면에는 소정양의 접착제(20)(예를 들어, 순간접착제 또는 양면테이프 등)가 도포되고, 안테나 접점(220) 외측에는 도전성실리콘(10)이 도포된다.At this time, a predetermined amount of adhesive 20 (for example, instant adhesive or double-sided tape, etc.) is applied to the bottom of the seating part 30, and conductive silicon 10 is applied to the outside of the antenna contact 220.

보강시트(300)는 외부단자 수용홀(40)를 통해 외부단자(140)가 노출됨과 아울러 카드본체 상부에 형성된 단차(S)를 에두르도록 카드본체(200) 상부에 부착되어 COB(100)와 카드본체(200)의 이탈을 방지한다.The reinforcement sheet 300 is attached to the upper portion of the card body 200 so that the outer terminal 140 is exposed through the outer terminal accommodating hole 40 and the step S formed on the upper portion of the card body is surrounded by the COB 100. And to prevent the departure of the card body 200.

이하, 본 발명에 따른 콤비카드 제작방법을 설명한다. 첨부도면 도 6은 본 발명에 따른 콤비카드 제작방법을 도시한 순서도이고, 도 7은 본 발명의 콤비카드 제작방법에 따른 COB(100)와 카드본체(200) 및 보강시트(300)간의 결합방법을 도시한 단면도이며, 도 8은 본 발명의 콤비카드 제작방법에 따라 결합된 콤비카드(C)를 도시한 단면도이다.Hereinafter, a combination card manufacturing method according to the present invention will be described. 6 is a flowchart illustrating a combination card manufacturing method according to the present invention, Figure 7 is a combination method between the COB 100 and the card body 200 and the reinforcing sheet 300 according to the combination card manufacturing method of the present invention. 8 is a cross-sectional view showing a combination card (C) coupled according to the combination card manufacturing method of the present invention.

첨부도면 도 6 내지 도 8을 참조하여 살피면, 먼저 하부단자(130)에 도전성실리콘(10)을 도포하고(S110), 안테나 접점(220)에 도전성실리콘(10)을 도포함과 아울러 안착부(30) 저면에 소정양의 접착제(20)를 도포한다(S120).6 to 8, the conductive silicon 10 is first coated on the lower terminal 130 (S110), and the conductive silicon 10 is coated on the antenna contact 220 and the seating part ( 30) A predetermined amount of adhesive 20 is applied to the bottom surface (S120).

이어서 COB(100)가 안착부(30)에 안착되어 하부단자(130)와 안테나 접점(220)에 도포된 도전성실리콘(10)이 서로 맞닿고, 칩(120)과 안착부(30) 저면에 도포된 접착제(20)가 맞닿도록 카드본체(200)에 부착된다(S130).Subsequently, the COB 100 is seated on the seating part 30 so that the lower terminal 130 and the conductive silicon 10 applied to the antenna contact 220 abut each other, and the chip 120 and the bottom of the seating part 30 are lowered. The applied adhesive 20 is attached to the card body 200 to abut (S130).

그리고 보강시트(300)가 패드(110)와 단차(S)를 갖는 외부단자(140)를 에두름과 아울러 COB(100)와 카드본체(200)가 서로 이탈되지 않도록 카드본체(200) 상부에 부착된다(S140).In addition, the reinforcing sheet 300 surrounds the pad 110 and the external terminal 140 having the step S, and the COB 100 and the card main body 200 are not separated from each other on the upper part of the card main body 200. It is attached (S140).

이상으로 본 발명의 기술적 사상을 예시하기 위한 바람직한 실시예와 관련하여 설명하고 도시하였지만, 본 발명은 이와 같이 도시되고 설명된 그대로의 구성 및 작용에만 국한되는 것이 아니며, 기술적 사상의 범주를 일탈함이 없이 본 발명에 대해 다수의 변경 및 수정이 가능함을 당업자들은 잘 이해할 수 있을 것이다. 따라서 그러한 모든 적절한 변경 및 수정과 균등 물들도 본 발명의 범위에 속하는 것으로 간주되어야 할 것이다. As described above and described with reference to a preferred embodiment for illustrating the technical idea of the present invention, the present invention is not limited to the configuration and operation as shown and described as described above, it is a deviation from the scope of the technical idea It will be understood by those skilled in the art that many modifications and variations can be made to the invention without departing from the scope of the invention. Accordingly, all such suitable changes, modifications, and equivalents should be considered to be within the scope of the present invention.

도 1은 종래의 콤비카드 제작방법을 도시한 개념도,1 is a conceptual diagram showing a conventional combination card manufacturing method,

도 2는 본 발명에 따른 콤비카드를 도시한 사시도,Figure 2 is a perspective view of the combination card according to the present invention,

도 3은 본 발명에 따른 COB와 A-A`의 단면을 도시한 시시도,3 is a view showing a cross-section of COB and A-A` according to the present invention,

도 4는 본 발명에 따른 COB와, 카드본체 및 보강시트간의 결합관계를 도시한 사시도,4 is a perspective view illustrating a coupling relationship between a COB, a card body, and a reinforcing sheet according to the present invention;

도 5는 본 발명에 따른 콤비카드의 단면을 도시한 도면,5 is a view showing a cross section of the combination card according to the present invention;

도 6은 본 발명에 따른 콤비카드 제작방법을 도시한 순서도,6 is a flow chart showing a combination card manufacturing method according to the present invention,

도 7은 본 발명의 콤비카드 제작방법에 따른 COB와 카본체 및 보강시트간의 결합방법을 도시한 단면도,Figure 7 is a cross-sectional view showing a coupling method between the COB and the carbon body and reinforcing sheet according to the combination card manufacturing method of the present invention,

도 8은 본 발명의 콤비카드 제작방법에 따라 결합된 콤비카드를 도시한 단면도.8 is a cross-sectional view showing a combination card according to the combination card manufacturing method of the present invention.

** 도면의 주요 부분에 대한 부호의 설명 ** ** Description of symbols for the main parts of the drawing **

100: COB 110: 패드100: COB 110: pad

120: 칩 130: 하부단자120: chip 130: lower terminal

140: 외부단자 200: 카드본체140: external terminal 200: card body

210: 안테나 코일 220: 안테나 접점210: antenna coil 220: antenna contact

300: 보강시트 10: 도전성실리콘300: reinforcing sheet 10: conductive silicon

20: 접착제 30: 안착부20: adhesive 30: seating portion

40: 외부단자 수용홀40: External terminal accommodating hole

Claims (4)

사각형상의 패드(110)와, 상기 패드의 하부 중앙에 부착된 칩(120)과, 상기 패드의 하부에 상기 칩과 소정거리 이격되어 형성된 하부단자(130), 및 상기 패드의 상부 중앙에 부착되되 패드와 단차(S)를 갖는 외부단자(140)를 포함하는 COB(100); A rectangular pad 110, a chip 120 attached to the lower center of the pad, a lower terminal 130 formed spaced apart from the chip at a lower portion of the pad, and attached to the upper center of the pad. A COB 100 including an external terminal 140 having a pad and a step S; 상기 COB가 안착되는 안착부(30)를 형성하며, 상기 하부단자(130)와 전기적으로 접속되는 안테나 접점(220)을 포함하는 카드본체(200); 및A card main body (200) forming a seating portion (30) on which the COB is seated and including an antenna contact (220) electrically connected to the lower terminal (130); And 외부단자 수용홀(40)을 통해 상기 외부단자가 노출되도록 상기 카드본체(200) 상부에 부착된 보강시트(300); 를 포함하되,A reinforcing sheet 300 attached to an upper portion of the card main body 200 to expose the external terminal through an external terminal accommodating hole 40; Including but not limited to: 상기 하부단자(130)와 상기 카드본체(200)의 안테나 접점(220)에 도포된 도전성실리콘(10), 및 상기 안착부(30)의 저면에 도포된 접착제(20)에 의해, 상기 COB(100)가 상기 안착부(30)와 부착되는 것을 특징으로 하는 콤비카드.By the conductive silicon 10 applied to the lower terminal 130 and the antenna contact 220 of the card body 200, and the adhesive 20 applied to the bottom surface of the seating portion 30, the COB ( Combi card, characterized in that 100 is attached to the seating portion (30). 삭제delete 콤비카드 제작방법에 있어서,In the combination card manufacturing method, 하부단자(130)에 도전성실리콘(10)을 도포하고, 안테나 접점(220)에 도전성실리콘(10)을 도포함과 아울러 안착부(30) 저면에 소정양의 접착제(20)를 도포하는 제1 과정;The first coating the conductive silicon 10 to the lower terminal 130, the conductive silicon 10 to the antenna contact 220, and a predetermined amount of adhesive 20 to the bottom surface of the seating portion 30 process; COB(100)가 상기 안착부(30)에 수용되어 상기 하부단자(130)와 상기 안테나 접점(220)에 도포된 도전성실리콘(10)이 서로 맞닿고, 칩(120)과 상기 안착부(30)에 도포된 접착제(20)가 맞닿도록 카드본체(200)에 부착되는 제2 과정; 및The COB 100 is accommodated in the seating unit 30 so that the lower terminal 130 and the conductive silicon 10 applied to the antenna contact 220 abut each other, and the chip 120 and the seating unit 30 are in contact with each other. A second process attached to the card main body 200 so that the adhesive 20 applied to the abutment abuts; And 보강시트(300)가 패드(110)와 단차(S)를 갖는 외부단자(140)를 에두르도록 상기 카드본체(200) 상부에 부착되는 제3 과정; 을 포함하는 것을 특징으로 하는 콤비카드 제작방법.A third process in which the reinforcing sheet 300 is attached to the upper portion of the card main body 200 so as to surround the external terminal 140 having a step S with the pad 110; Combi card production method comprising a. 삭제delete
KR1020080003831A 2008-01-14 2008-01-14 Combicard and method for manufacturing therefor KR100852128B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080003831A KR100852128B1 (en) 2008-01-14 2008-01-14 Combicard and method for manufacturing therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080003831A KR100852128B1 (en) 2008-01-14 2008-01-14 Combicard and method for manufacturing therefor

Publications (1)

Publication Number Publication Date
KR100852128B1 true KR100852128B1 (en) 2008-08-13

Family

ID=39881729

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080003831A KR100852128B1 (en) 2008-01-14 2008-01-14 Combicard and method for manufacturing therefor

Country Status (1)

Country Link
KR (1) KR100852128B1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11213119A (en) 1998-01-23 1999-08-06 Toppan Printing Co Ltd Composite type ic card
JPH11282996A (en) * 1998-03-27 1999-10-15 Toppan Printing Co Ltd Composite type ic card and fixing method for module therefor
KR20040079501A (en) * 2003-03-07 2004-09-16 한국조폐공사 Combi card and method for making the same
KR20050119538A (en) * 2004-06-16 2005-12-21 한국조폐공사 A prefabricated combi-card and method for making the same
KR20050119539A (en) * 2004-06-16 2005-12-21 한국조폐공사 A prefabricated combi-card and method for making the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11213119A (en) 1998-01-23 1999-08-06 Toppan Printing Co Ltd Composite type ic card
JPH11282996A (en) * 1998-03-27 1999-10-15 Toppan Printing Co Ltd Composite type ic card and fixing method for module therefor
KR20040079501A (en) * 2003-03-07 2004-09-16 한국조폐공사 Combi card and method for making the same
KR20050119538A (en) * 2004-06-16 2005-12-21 한국조폐공사 A prefabricated combi-card and method for making the same
KR20050119539A (en) * 2004-06-16 2005-12-21 한국조폐공사 A prefabricated combi-card and method for making the same

Similar Documents

Publication Publication Date Title
RU2412483C2 (en) Electronic module having double communication interface, particularly for smart cards with microchip
US8317108B2 (en) Chip card with dual communication interface
US7337978B2 (en) Dual interface IC card
CN103392272B (en) There is the electric connector of embedded shell
US20090230197A1 (en) Method and apparatus for a contactless smartcard incorporating a mechanical switch
JP2008009881A (en) Rfid tag and manufacturing method thereof
US20180053030A1 (en) Fingerprint module, method for fabricating the same, and mobile terminal having the same
CN108701248B (en) Circuit layer of integrated circuit card
US20160125284A1 (en) Method for making an anti-crack electronic device
KR100852128B1 (en) Combicard and method for manufacturing therefor
JP6108641B2 (en) Method for manufacturing a smart card body for receiving a semiconductor chip and suitable smart card body
JPH0216233B2 (en)
KR20060073819A (en) Method of manufacturing rfid tag
CN108964689A (en) Kato disk and the tray-type card connector for having used the Kato disk
JP3138751U (en) Card connector
KR20220131270A (en) Systems and methods for manufacturing and assembling packaged electronic modules
CN101317186A (en) A method of producing a transponder and a transponder
TW201448368A (en) Dual card type socket and assembly method thereof
KR20110041623A (en) Combicard and method for manufacturing the same
JP2003006589A (en) Non-contact communication recording medium and manufacturing method therefor
JP5560841B2 (en) Non-contact IC built-in paper and IC booklet or IC card
JP6451298B2 (en) Dual interface IC card and IC module used for the IC card
CN107912065B (en) Smart card blank with at least one interface for contactless transmission of information
US7694888B2 (en) Method for producing a chip card contact zone
KR100999539B1 (en) printed circuit board having a electro device and manufacturing method thereof

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20120601

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20130807

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20140807

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20150807

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20160805

Year of fee payment: 9

FPAY Annual fee payment

Payment date: 20170807

Year of fee payment: 10