JP2000182017A - Ic card used as contacing/noncontacting type and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card in which connection strength of an antenna coil is enhanced and of which the manufacturing process is simplified and its manufacturing method. SOLUTION: A contacting/noncontacting type shared IC card 10 is provided with an external device connection terminal 112, the antenna coil 13 embedded inside a card base and an antenna coil connection terminal 14, a contacting surface of a recessed part 18 for mounting an IC module formed on the card base 12 with the IC module is cut so that the antenna coil connection terminal 114 is exposed, connection of the antenna coil connection terminal 114 on the IC module side to be mounted by being engaged in the recessed part from the outside of the base with an antenna coil connection terminal on the base side and adhesion with an IC module contacting surface are performed by using only conductive adhesive materials or by using the conductive adhesive materials and insulated adhesive material in combination.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC card which performs communication by electromagnetic induction using a coil and a contact type IC card which performs communication through a connection terminal by a single IC chip. The present invention relates to a card (hereinafter, also referred to as a “combi card”) and a method for manufacturing the card. Therefore, although it is mainly applicable to the above-mentioned shared card, it is a non-contact type IC card having a mounting substrate instead of a form in which an IC chip is embedded in the card, and an IC module in a mounting recess on the card surface. The present invention is also applicable to a non-contact type IC card which is used alone by being connected to an antenna coil inside the card.

[0002]

2. Description of the Related Art IC cards are classified into a contact type IC card which performs data communication through a connection terminal and a non-contact type IC card which performs communication by electromagnetic induction through a coil. A non-contact type IC card for payment is used for gate access control of a transportation system or the like. In recent years, ICs having both the functions of a contact IC card and the functions of a non-contact IC card in one IC chip
Chips (hereinafter also referred to as “combi chips”) have been developed. Conventionally, in manufacturing a combination card using the combination chip, a method 1 (FIG. 8) of laminating an IC-mounted substrate on which a coil and a connection terminal are integrated with a base material such as vinyl chloride to form a card, A card board with an antenna coil and coil connection terminals embedded is manufactured. The IC mounting portion of the board is shaved by NC processing and the coil connection terminals are exposed, and the IC chip mounting board (COT, CO
A method 2 (FIG. 9) of connecting the connection terminal provided in B) to the connection terminal of the coil to form a card is used.

[0003] The above conventional method will be described in more detail. FIG. 8 is a view for explaining a conventional method of manufacturing a contact-type non-contact type shared IC card (method 1), and FIG. 9 is another method of manufacturing a conventional contact-type non-contact type shared IC card (method 2). FIG. In the case of Method 1, first, as shown in FIG.
An IC module-mounted board 521 on which an IC module 51, an antenna coil 53 and an antenna coil connection terminal 54 are integrated is prepared, and the board is divided into a core sheet 522 in which an IC mounting opening 58 is formed, and a core sheet 522. Are laminated with the oversheets 523 and 524 for protecting them, and are formed into the integrated card base 52 by applying pressure and heating with a press machine with or without an adhesive (FIG. 8).
(B)). In this case, the antenna coil 53 is formed so as to form a loop on the substrate 521 by photoetching or screen printing with a conductive ink, and
The connection with the module 51 is also made in advance. Further, the external device connection terminal 512 is exposed from an opening 59 formed in advance in the oversheet 523 so that data communication with the external device can be performed. FIG. 8B is a cross-sectional view of the completed card, and FIG. 8C is a plan view of the same. The external connection device connection terminal 512 appears on the card surface, but the antenna coil 53 does not appear on the card surface.

In the case of the method 2, as shown in FIG. 9A, first, an antenna coil 63 and an antenna coil connection terminal 64 are connected.
Is prepared, the oversheets 623 and 624 are laminated on the center core sheet 621, and are manufactured on an integrated card substrate with or without an adhesive (FIG. 9B). Thereafter, the concave portion 68 in which the IC module 61 is to be loaded is cut by counterboring, NC processing, or the like to expose the antenna coil connection terminal 64 in the card base (FIG. 9C). Next, the connection terminals 614 provided on the IC chip mounting board and the antenna coil connection terminals 64 on the base side are connected with a conductive adhesive such as solder, and an insulating adhesive is applied to the bonding area other than the connection terminal portions. And then IC
The module 61 is loaded, connected, and bonded to produce a combination card (FIG. 9D). FIG. 9E is a plan view of the completed card. The external device connection terminals 612 appear on the card surface, but the antenna coil 63 does not appear on the card surface.

However, in the case of the above-mentioned method 1, since the IC is mounted and then formed into a card by a hot press, there is a problem that the IC is likely to malfunction due to a physical load applied during card processing. In addition, IC
Even if a defect such as card appearance other than the function of
There is a problem in that the defect causes waste including the IC, and an extra cost is generated for the cost. In the case of the above method 2, it is necessary to bond the IC chip mounting board to the card and to connect the antenna coil connection terminal, and separately apply an insulating material for bonding and a conductive material for connection. And the bonding area and the connection area on the IC side and the base side need to be exactly the same, so that there arises a problem that it is necessary to improve the positional accuracy of the coil connection terminal position in the card. I was

Conventionally, the bonding between the card and the IC chip mounting board has been performed by using an insulating adhesive having a high adhesive strength to both the card base material and the material of the IC chip mounting board. If the materials are different, it is necessary to select an adhesive with excellent adhesive strength for each type of card base material, and when making cards with different card materials on the same manufacturing machine,
It was necessary to replace the adhesive for each card material. Also, when the material of the IC chip mounting substrate is different, it is necessary to select an adhesive according to the material of each substrate, and an appropriate adhesive may not be found depending on the material.

[0007]

Therefore, in the present invention,
In a combination card mainly having both functions of a contact type and a non-contact type IC card, an IC card having excellent physical strength is realized by using an optimal adhesive material by increasing an antenna coil connection terminal size. It is another object of the present invention to simplify the manufacturing process irrespective of the material of the card base or the material of the IC mounting substrate.

[0008]

The first aspect of the gist of the contact-type non-contact type shared IC card of the present invention for solving the above-mentioned problems.
Is a contact type non-contact type shared IC card having an external device connection terminal, an antenna coil embedded inside the card base, and an antenna coil connection terminal. The surface is cut so that the antenna coil connection terminals are exposed, and the connection between the IC module-side antenna coil connection terminals and the base-side antenna coil connection terminals that are fitted and mounted in the recesses from the outside of the base and the connection of the IC module. A contact-type non-contact type common IC card characterized in that adhesion to a contact surface is performed using only a conductive adhesive material. Since the contact-type non-contact type IC card is used, the physical strength is excellent irrespective of the material of the card base or the material of the IC mounting substrate, and an IC card which ensures connection of the connection terminals can be obtained.

A second aspect of the present invention for solving the above-mentioned problems is a contact type having an external device connection terminal, an antenna coil embedded inside the card base, and an antenna coil connection terminal. Type non-contact type common IC
In the card, the contact surface of the IC module mounting recess formed on the card base with the IC module is cut so that the antenna coil connection terminal is exposed, and the IC is fitted into the recess from outside the base and mounted. The connection and adhesion between the module-side antenna coil connection terminal and the substrate-side antenna coil connection terminal are made of a conductive adhesive material and an insulating adhesive material applied only to the IC module-side antenna coil connection terminal or the substrate-side antenna coil connection terminal. And a contact-type non-contact type shared IC card. Since the contact-type non-contact type IC card is used, the physical strength is excellent irrespective of the material of the card base or the material of the IC mounting substrate, and an IC card which ensures connection of the connection terminals can be obtained.

A first aspect of a method of manufacturing a contact-type non-contact type shared IC card according to the present invention for solving the above-mentioned problems is as follows: an external device connection terminal, an antenna coil embedded inside a card base, and an antenna coil connection terminal. Wherein the antenna coil connection terminal and the IC module side antenna coil connection terminal are connected by fitting and mounting the IC module in the IC module mounting concave portion. In the manufacturing method, a step of forming an antenna coil and an antenna coil connection terminal on a core sheet, a step of laminating an oversheet on the core sheet to form an integrated card base, and an IC of the card base
A step of cutting the concave portion for mounting the IC module so that both connection terminals of the antenna coil are exposed in the module mounting portion; and a step of further cutting between both connection terminals of the antenna coil so that the mold resin portion of the IC module can be embedded. A step of providing a conductive adhesive material layer and mounting an IC module so that the two connection terminals are not connected to the base-side antenna coil connection terminal or the IC module-side antenna coil connection terminal. A method for producing a contact-type non-contact type shared IC card, comprising:
It is in. Because of this manufacturing method, terminal connection and IC
The module can be bonded to the substrate using only a conductive adhesive material, and the manufacturing process can be simplified.

A second aspect of the method of manufacturing a contactless non-contact type shared IC card according to the present invention for solving the above-mentioned problems is an external device connection terminal, an antenna coil embedded inside the card base, and an antenna coil connection terminal. Wherein the antenna coil connection terminal and the IC module side antenna coil connection terminal are connected by fitting and mounting the IC module in the IC module mounting concave portion. In the manufacturing method, a step of forming an antenna coil and an antenna coil connection terminal on a core sheet, a step of laminating an oversheet on the core sheet to form an integrated card base, and an IC of the card base
A step of cutting the concave portion for mounting the IC module so that both connection terminals of the antenna coil are exposed in the module mounting portion; and a step of further cutting between both connection terminals of the antenna coil so that the mold resin portion of the IC module can be embedded. The step of providing a conductive adhesive material layer and an insulating adhesive material layer only on the base-side antenna coil connection terminal or the IC module-side antenna coil connection terminal;
And a step of mounting a module.
With this manufacturing method, connection and adhesion can be performed using only a conductive adhesive material and an insulative adhesive material on the terminal substrate for connecting the terminals and bonding the IC module to the substrate, thereby simplifying the manufacturing process. I can do it.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the IC card of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing one embodiment of a contact type non-contact type shared IC card of the present invention. FIG. 2 is a partial cross-sectional view along the line AA in FIG. An example in which the combination card 10 is composed of three layers of base material is shown. In the plan view of FIG. 1, the external device connection terminal 112 is provided on the card surface because it is a combination card, but the terminal pattern shape and the like are omitted. A chain line displayed around the card indicates that the antenna coil 13 exists inside the card.

The antenna coil connection terminal 14 is formed so as to face an IC module mounting portion for connecting both ends of the antenna coil to the IC module. In the combination card of the present invention, in order to secure the conductivity and the adhesive strength of the antenna coil connection terminal 14, it is preferable that the combination card be formed in a larger area than the normal antenna coil connection terminal.
In order to secure a sufficient strength, it is preferable that the total area (A) of the antenna coil connection terminals in the concave portion for mounting the IC module is 3 mm ² or more. Accordingly, the IC-side antenna coil connection terminal 114 connected to the antenna coil is also preferably formed in a large area, and the total area (a) of the antenna coil connection terminals of the IC module is preferably 3 mm ² or more. 3
to the mm ² or more, the area is 3 mm ² or less is because if a sufficient bonding strength can not be obtained in any case occur.

As shown in FIG. 2, in this embodiment, the card base 12 of the combination card 10 includes a core sheet 121 and oversheets 123 and 124. However, the base material of the card is not limited to three layers. Absent. In the present embodiment, the concave portion 18 of the module mounting portion is formed at a depth of two steps, the first concave portion is at a depth where the antenna coil 13 is exposed, and the second concave portion is a mold resin 115 of the IC module.
Is formed to a depth that allows it to be embedded. However, the shape of the concave portion of the module mounting portion is not limited to two steps, and a different concave shape or a groove in the outer peripheral portion may be provided. The depth of the first concave portion is substantially equal to the thickness of the IC module mounting substrate 112 or the like or the thickness of the oversheet 123.

External connection device connection terminal 112 of IC module
A connection terminal 114 for connecting to an antenna coil is formed on the lower surface of the antenna coil, and is connected to the base-side antenna coil connection terminal 14 via a conductive adhesive 19. In a conventional combination card, a small-area IC module-side connection terminal and a base-side antenna coil connection terminal are connected with a conductive adhesive, and the other parts around the terminal are used with a normal non-conductive adhesive. IC
The method of fixing the module required complicated steps and high precision. However, in the first embodiment of the combination card of the present invention, since the antenna coil connection terminal was made large in area, conductive bonding was performed. There is an advantage that the IC module can be fixed and conduction can be ensured even if only the agent is used. In the second embodiment of the combination card of the present invention, the connection IC module substrate is bonded to the terminals by using both the conductive adhesive and the insulating adhesive. Therefore, connection and bonding can be performed only at the portions where the connection terminals are in contact.

FIG. 3 is a diagram showing an example of an IC module using a combination chip and an IC module mounting recess. FIG. 3A is a diagram illustrating the front surface of the substrate of the IC module external device connection terminal, FIG. 3B is a diagram illustrating the back surface of the IC module substrate, and FIG. 3C is a cross-sectional view of the IC module. . FIG. 3 (D) shows the I when the recess is formed in the card base.
It is a figure which shows the concave surface for C module installation. FIG.
As shown in (A), eight terminals C1 to C8 are usually formed on the surface of the external connection terminal 112 based on the ISO standard. However, the number of terminals is not limited to eight. If it is a module, it does not have to have a terminal pattern. The external device connection terminal is usually shown in FIG.
, And are arranged such that the long sides of the card and the terminals are parallel to each other as shown in FIG.

As shown in FIG. 3B, C for connecting the antenna is used.
9 and C10 terminals are connected to the I
It is connected to the C-side antenna coil connection terminal 114.
If there are C1 to C8 terminals, they are similarly connected to the terminal plate on the substrate front side by wire bonding, through holes, etc., but the details are omitted in FIG. After bonding, IC chip 111, bonding wire 1
Thirteen portions are covered and protected by the mold resin 115. In the IC module used in the present invention, the total area (a) of the antenna coil connection terminals of the IC module is large, and is preferably 3 mm ² or more. Incidentally, in FIG. 3 (B), IC antenna coil connection terminal area (a) is a total area of the left side of the terminal area a ₁ and the left terminal area a _2.

The terminal board of such an IC module is
Affixing copper foil on both sides of an insulating substrate such as polyimide or glass epoxy, using a process such as etching on the substrate, drawing external device contact terminals on the front surface, and drawing wiring such as coil connection terminals on the back surface. Thereafter, plating of nickel, copper, gold or the like is performed. The IC chip is mounted on this substrate, and the connection between the IC chip and the connection wiring provided in the substrate is performed using gold wires or the like. Further, the periphery of the IC chip is sealed using an epoxy resin or the like.

According to the connection terminal of the IC module, I
Similarly, the area (A) of the antenna coil connection terminal in the concave portion for mounting the C module needs to be large, and is preferably 3 mm ² or more. Note that FIG.
In (D), the card base antenna coil connection terminal area (A) is the area left terminal A ₁ and right terminal area A ₂
And the total area.

The shape of the antenna coil connection terminal 14 in the recess for mounting the IC module is preferably a rectangular shape whose long side is parallel to the short side of the card. This is because the IC card is easily subjected to bending stress in the long side direction, and the connection is less likely to receive stress when connected in parallel with the short side, and the IC card is more likely to be destroyed. It is preferable that the metal material of the terminal connected to the antenna coil of the IC module and the metal material of the connection terminal of the antenna coil be the same. This is because if the same material is used, the range of selection of the conductive adhesive material is widened, and a material that can be strongly bonded can be used. In general, a material obtained by plating a copper material with nickel under plating and gold plating is preferably used.

FIG. 4 is a diagram showing another example of an IC module using a combination chip and a concave portion for mounting the IC module. FIG. 4A is a diagram showing a back surface of the module substrate, and FIG.
(B) is a cross-sectional view of the IC module. FIG.
(C) is a diagram showing the surface of the concave portion for mounting the IC module when the concave portion is formed in the card base. As shown in FIG. 4A, the terminals C9 and C10 for antenna connection are connected to the IC-side connection terminals 114 by bonding wires 113. After bonding, the IC chip 111 and the bonding wire are covered and protected by the mold resin 115. In the case of this example, the antenna coil connection terminal area (a = a ₁ + a ₂ ) of the IC module can be formed very large.

Similarly, the antenna coil connection terminal area (A = A ₁ + A ₂ ) in the IC module mounting concave portion can be formed very large as well (FIG. 4).
(C)). Coating region of the conductive adhesive 19 need not be the entire area, Fig. 4 3 mm ² as above be limited to a part of the area portion on the antenna coil connection terminals as (C)
As long as this is the case, no problem occurs.

Preferably, the physical strength can be further increased by applying an insulating adhesive to a region other than the conductive adhesive application region on the IC module connection terminal or the antenna coil connection terminal. Conductive adhesive 1
The application area 9 is made 3 by applying an insulating adhesive.
There is no problem even if it is less than mm ² .

Next, a method for manufacturing the combination card of the present invention will be described. FIG. 5 is a diagram illustrating a manufacturing process of a contact-type non-contact type shared IC card. Although the manufacturing method of the present invention is basically based on the aforementioned conventional method 2,
The method of forming the antenna coil connection terminal and the method of mounting the IC module have a feature not found in the conventional method. First, FIG.
As shown in (A), a core sheet 121 made of vinyl chloride, polyethylene terephthalate (PET), or the like is prepared in which the layout of the antenna coil 13 and the antenna coil connection terminals 14 are drawn by photoetching or printing with conductive ink or the like. For card base material, vinyl chloride resin or PET
In addition, various materials can be adopted, and examples thereof include polypropylene resin, polycarbonate resin, acrylic resin, polystyrene resin, ABS resin, polyamide resin, and polyacetal resin.

The above process is the same as the above-mentioned conventional method 2 except that the antenna coil connection terminal 14 is formed in a large area. Next, overseat 1
23 and 124 are laminated to form an integrated card base (FIG. 5B). After that, the first concave portion 181 to which the IC module 11 is to be mounted is cut by counterboring, NC processing, or the like to expose the surface of the connection terminal 14 in the card (FIG. 5).
(C)). It is preferable to expose the surface so that the terminal surface is not cut as much as possible. Further, the second concave portion 18 has a depth enough to embed the 115 parts of the mold resin of the IC module.
2 is cut (FIG. 5D).

Next, the chip-side antenna coil connection terminals 114 provided on the IC chip mounting board and the base-side coil connection terminals 14 are connected with a conductive adhesive such as solder. For this, a conductive adhesive such as cream solder or silver paste is applied as a connection agent on the antenna coil connection terminal. The application area is divided into at least two areas so as not to cause a short circuit. Further, an insulating adhesive sheet may be attached to a portion other than the conductive adhesive application region on the connection terminal. After the application of the conductive adhesive, the IC chip mounting substrate is mounted, and a heat pressure (for example, 180 ° C., 20 seconds) is applied to bond the IC chip mounting substrate to the card base and connect the antenna coil. This is because, in the case of cream solder or the like, if it is heated to 180 ° C. or more, it becomes molten and connected and becomes conductive.

As the conductive adhesive, cream solder and silver paste can be used as described above, and a conductive adhesive sheet, an anisotropic conductive sheet, an anisotropic conductive paste, a foil-like metal solder, and the like can be used. Can be used. The application of the adhesive may be performed on the connection terminal on the card base side or on the connection terminal on the IC module side. Various kinds of adhesives and adhesive sheets such as thermosetting and thermoplastic can be used as the insulating adhesive.

FIGS. 6 and 7 are enlarged cross-sectional views of the IC module embedded portion. As shown in FIG. 6, the first recess 181 is cut so that the antenna coil connection terminal 14 is exposed on the surface. In this cutting, the base material thickness calculated in advance by NC processing or the like is cut from the card surface. Second recess 18
2 is cut to a depth where the mold resin 115 of the IC module 11 can be embedded. Next, a conductive adhesive 19 is applied on the antenna coil connection terminals 14, and then the IC module is mounted and heated and pressed. As a result, as shown in FIG. 7, the antenna coil connection terminal 114 on the IC side and the antenna coil connection terminal 14 on the card base are connected via the conductive adhesive 19 to achieve conduction, and the IC module is connected to the card base. Can be fixed.

In the first embodiment of the manufacturing method of the present invention,
Because the area of the antenna coil connection terminal is large, there is no need to apply and bond an insulating adhesive material to the area other than the connection terminal part. Sufficient adhesive strength and conductivity are secured with only the conductive adhesive material it can. Similarly, since the area of the antenna coil connection terminal is large, the tolerance for positional deviation in the step of shaving the substrate mounting portion with the connection terminal by NC processing or the step of mounting the IC module substrate with the terminal is expanded, and the IC chip mounting is performed. The effect of reducing the defect rate when the substrate is mounted on the card is obtained.

Further, in the first embodiment of the manufacturing method of the present invention, when the above-mentioned means is used, the area of the connection terminal area becomes large at the contact portion with the card in the recess of the IC module, Since the area to which the base substrate of the module is bonded is reduced, the connection and bonding can be performed using the same material regardless of the material type of the base substrate for the IC chip mounting substrate and the material type of the card base material. More preferably, the material of the antenna and the antenna coil connection terminal provided in the card and the connection terminal provided in the IC chip mounting board are made of the same material, so that the optimum adhesive is always selected and used without being changed. can do.

In a second embodiment of the manufacturing method of the present invention,
Since the area of the antenna coil connection terminal is formed large, it becomes possible to apply an insulating adhesive material to portions other than the conductive adhesive material application region on the connection terminal, and it is possible to further increase the physical strength. Become.

Further, in the second embodiment of the manufacturing method of the present invention, when the above-mentioned means is used, the area of the connection terminal area becomes large at the contact portion with the card in the mounting recess of the IC module, Because the area to which the base substrate of the IC module adheres is reduced, connection and adhesion are performed using the same connection material and adhesive material regardless of the material type of the base substrate for the IC chip mounting substrate and the material type of the card base material. Is also possible. More preferably, the material of the antenna coil connection terminal provided in the card and the material of the connection terminal provided in the IC chip mounting board are always of the same type, so that the optimum adhesive material is always selected even if the manufacturing item changes. Can be used without modification.

[0033]

EXAMPLES Examples of the combination card of the present invention and comparative examples will be described below. (Example 1) As a core sheet 121 of a card base material, a white hard vinyl chloride sheet having a thickness of
An antenna coil 13 and an antenna coil connection terminal 14 were formed using a substrate on which a thick copper foil was laminated by using a photoetching technique. For this core sheet, thickness 1
80 μm white rigid vinyl chloride sheets 123 and 124
Were laminated on and under the core sheet 121 to produce a card base having the antenna coil embedded therein by heat fusion. The antenna coil 13 has a line width of 1 mm.
It was formed so as to be wound substantially four times around the outer periphery of the card base. The size of the antenna coil connection terminal 14 is shown in FIG.
As shown in (D), one of them is 2.0 mm × 3.0 mm
, And the long side is arranged in parallel with the short side of the combination card. After forming the antenna coil connection terminal, the surface was plated with nickel and gold.

Next, the first concave portion 181 was cut into the IC module mounting portion of the card base having the coil embedded therein by NC processing to a depth at which the gold-plated surfaces of both antenna coils appeared. At this stage, the size of the first concave portion is 11 mm ×
13 mm and a depth of 180 μm. Subsequently, the distance between both antenna coil connection terminals is approximately 8.5 m.
The second concave portion 181 was cut to have a size of mx 8.5 mm and a depth of 600 µm so that the mold resin of the IC module could be sufficiently embedded.

On the other hand, a glass epoxy substrate (size 1)
(1 mm × 13 mm), copper foil is stuck on both sides, photo-etching treatment is performed to form external device connection terminals on the front surface, and an antenna coil connection terminal on one side is 2.0 mm.
It was formed so as to have a size of mm × 3.0 mm. After applying nickel and gold plating to the terminal part, mounting the combination chip on the board, connecting to each external device connection terminal via wire bonding and through holes, and performing wire bonding with the antenna coil connection terminal using gold wire went. Further, the periphery of the IC chip was sealed with epoxy resin. The area of the sealed part is 8.2 mm x 8.2 mm
It was about.

A conductive adhesive made of cream solder (manufactured by Nihon Solder Co., Ltd.) is applied to the antenna coil connection terminal portions A ₁ and A ₂ of the card substrate, and after mounting the IC module, it is heated to 180 ° C. for 20 seconds. Pressed to complete the combination card.

Example 2 A combination card was manufactured using the same base material, the same IC module, and the same conductive adhesive as in Example 1. However, the size of the antenna coil connection terminal 14 of the card base was such that one size was 35 mm ² as shown in FIG. . Also, the size of the antenna coil connection terminal on the IC module side is 35 m as shown in FIG.
m ² . On this one antenna coil connection terminal, cream solder (manufactured by Nippon Solder Co., Ltd.) is applied to an area of 2.0 mm ² , and a thermosetting insulating adhesive sheet (manufactured by Toa Gosei Chemical Co., Ltd.) is applied to the rest. ) Was attached and an IC module was mounted in the same manner as in Example 1. The IC module used was the same as that in Example 1 except that connection terminals having the above-mentioned area were formed.

The following tests were performed on the combination cards manufactured in Example 1 and Example 2. (1) Bending in the long side direction of the card Bending is performed 250 times at a rate of 30 cm per minute in the front and back directions at a deflection of 2 cm. (2) Bending in the short side direction of the card Bending is performed 250 times in the front and back directions at a rate of 30 cm per minute each with a deflection of 1 cm. As a result, in the combination cards of the first and second embodiments, no dropout of the IC module burying portion and no poor connection of the antenna coil occurred.

[0039]

According to the first embodiment of the IC card of the present invention, the antenna coil connection terminal is made large in area, and the connection and the bonding of the IC module are performed using only a conductive adhesive. An IC card having excellent strength can be obtained. According to the first embodiment of the method for manufacturing an IC card of the present invention, it is possible to simplify the manufacturing process and perform stable coil terminal connection using only the conductive adhesive. In addition, by using the same kind of material for the antenna coil connection terminal provided in the card and the connection terminal provided for the IC chip mounting board, the optimum adhesive is always obtained regardless of the material of the IC chip mounting board or the card base material. Can be selected and used.

Further, in the second embodiment of the IC card of the present invention, the antenna coil connection terminal is made large in area, and a conductive adhesive and an insulating adhesive are applied only on the connection terminal, thereby further increasing the physical strength. IC card excellent in the above. According to the second embodiment of the method of manufacturing an IC card of the present invention, the material of the antenna coil connection terminal provided in the card and the material of the connection terminal provided in the IC chip mounting substrate are made the same, so that the IC chip is mounted. Regardless of the material of the substrate or the material of the card substrate, it is possible to always select and use the optimal adhesive of both the conductive adhesive and the insulating adhesive.

[Brief description of the drawings]

FIG. 1 shows a contact-type non-contact type shared IC card 1 of the present invention.
It is a figure showing an embodiment.

FIG. 2 is a diagram showing a partial cross section of a contact type non-contact type shared IC card.

FIG. 3 is a diagram showing an example of an IC module using a combination chip and an IC module mounting recess.

FIG. 4 is a diagram showing another example of an IC module using a combination chip and an IC module mounting recess.

FIG. 5 is a diagram illustrating a manufacturing process of a contact-type non-contact type shared IC card.

FIG. 6 is an enlarged sectional view of an IC module embedded portion.

FIG. 7 is an enlarged sectional view of an IC module embedded portion.

FIG. 8 is a diagram illustrating a method for manufacturing a conventional contact-type non-contact type shared IC card.

FIG. 9 is a diagram illustrating another method of manufacturing a conventional contact-type non-contact type shared IC card.

[Explanation of symbols]

 Reference Signs List 10 IC card 11 IC module 12 Card base 13 Antenna coil 14 Antenna coil connection terminal 18 IC module mounting recess 19 Conductive adhesive 52, 62 Card base 53, 63 Antenna coil 54, 64 Antenna coil connection terminal 58 IC module mounting Opening 68 IC module mounting recess 111 IC chip 112 External device connection terminal 113 Bonding wire 114 IC side antenna coil connection terminal

Claims (10)

[Claims] A contactless non-contact type IC card having an external device connection terminal, an antenna coil embedded in an inside of a card base, and an antenna coil connection terminal, the IC module having an IC module mounting recess formed in the card base. The contact surface with the antenna coil connection terminal is cut so that the antenna coil connection terminal is exposed, and the connection between the IC module side antenna coil connection terminal and the substrate side antenna coil connection terminal fitted and mounted in the recess from outside of the base is performed. Contact type non-contact type common IC characterized in that the bonding to the contact surface of the IC module is performed using only a conductive adhesive material.
card. 2. A contact type non-contact type common IC card having an external device connection terminal, an antenna coil embedded in a card base, and an antenna coil connection terminal, wherein the IC module has an IC module mounting recess formed in the card base. The contact surface with the antenna coil connection terminal is cut so that the antenna coil connection terminal is exposed, and the connection between the IC module side antenna coil connection terminal and the substrate side antenna coil connection terminal fitted and mounted in the recess from outside of the base is performed. Adhesion is I
A contact-type non-contact type common IC card characterized by using a conductive adhesive material and an insulating adhesive material applied only on the C-module-side antenna coil connection terminal or the substrate-side antenna coil connection terminal. 3. The contactless non-contact type shared IC card according to claim 1, wherein said conductive adhesive material is cream solder. 4. The contactless non-contact type shared IC card according to claim 1, wherein said conductive adhesive material is a silver paste. 5. The contactless noncontact common IC card according to claim 1, wherein said conductive adhesive material is an anisotropic conductive sheet or an anisotropic conductive paste. 6. The contact-type and non-contact type common use according to claim 1, wherein the metal material of the antenna coil connection terminal on the IC module side and the metal material of the antenna coil connection terminal on the base side are made of the same material. IC card. 7. The card according to claim 1, wherein the shape of the antenna coil connection terminal in the recess for mounting the IC module is substantially rectangular, and a long side thereof is parallel to a short side of the card base. 3. The contactless non-contact type shared IC card according to claim 2. 8. An external device connection terminal, an antenna coil embedded inside the card base, and an antenna coil connection terminal, wherein the antenna coil connection terminal and the IC module side antenna coil connection terminal connect the IC module to the IC module. A method for manufacturing a contact-type and non-contact type common IC card which is connected by being fitted to and fitted into a mounting concave portion, comprising: forming an antenna coil and an antenna coil connection terminal on a core sheet; Forming an integrated card base by laminating the antenna coil; cutting a recess for mounting the IC module so that both connection terminals of the antenna coil are exposed in the IC module mounting portion of the card base; Further cutting between both connection terminals
Forming the mold resin portion of the C module to a depth at which it can be embedded; and providing a conductive adhesive material layer on the base-side antenna coil connection terminal or the IC module-side antenna coil connection terminal so that both connection terminals are not connected to each other. A method of manufacturing a contact-type non-contact type shared IC card, comprising: mounting an IC module. 9. An external device connection terminal, an antenna coil embedded inside the card base, and an antenna coil connection terminal, wherein the antenna coil connection terminal and the IC module side antenna coil connection terminal connect the IC module to the IC module. A method for manufacturing a contact-type and non-contact type common IC card which is connected by being fitted to and fitted into a mounting concave portion, comprising: forming an antenna coil and an antenna coil connection terminal on a core sheet; Forming an integrated card base by laminating the antenna coil; cutting a recess for mounting the IC module so that both connection terminals of the antenna coil are exposed in the IC module mounting portion of the card base; Further cutting between both connection terminals
A step of increasing the depth of the molding resin portion of the C module so that it can be embedded; and providing an electrically conductive adhesive material layer and an insulative adhesive material layer only on the base-side antenna coil connection terminal or the IC module-side antenna coil connection terminal to form an IC module. A method for manufacturing a contact-type non-contact type shared IC card, comprising: mounting. 10. A contact-type and non-contact type common use according to claim 8, wherein the metal material of the antenna coil connection terminal on the IC module side and the metal material of the antenna coil connection terminal on the base side are made of the same material. A method for manufacturing an IC card.