JP2001256457A - Semiconductor device, its manufacture and ic card communication system - Google Patents

Semiconductor device, its manufacture and ic card communication system

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Publication number
JP2001256457A
JP2001256457A JP2000068288A JP2000068288A JP2001256457A JP 2001256457 A JP2001256457 A JP 2001256457A JP 2000068288 A JP2000068288 A JP 2000068288A JP 2000068288 A JP2000068288 A JP 2000068288A JP 2001256457 A JP2001256457 A JP 2001256457A
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Prior art keywords
insulating substrate
antenna coil
metal foil
coil
formed
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Abandoned
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JP2000068288A
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Japanese (ja)
Inventor
Tetsuya Yokoi
哲哉 横井
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Toshiba Corp
株式会社東芝
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Priority to JP2000068288A priority Critical patent/JP2001256457A/en
Publication of JP2001256457A publication Critical patent/JP2001256457A/en
Application status is Abandoned legal-status Critical

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00011Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06Polymers
    • H01L2924/078Adhesive characteristics other than chemical
    • H01L2924/0781Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811Extrinsic, i.e. with electrical conductive fillers

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact IC card whose manufacturing process is simplified and whose conductive resistance can be made small, an RFID device (radio frequency identification) used for a TAG for physical distribution, etc., and its manufacturing method. SOLUTION: An antenna coil 16 that is formed on an insulation substrate 10 and is for performing radio communication is formed by performing press punching of metal foil such as Cu, Al, Au, Ag, into a coil shape by a sharp blade made of metal etc. The manufacturing process is simplified because a coil pattern is not formed by an etching process but by press working by the sharp blade. The conductor intervals of the antenna coil can be made narrow as 0.1 to 0.2 mm, which is remarkably narrower than in the conventional practice. As a result, the conductive resistance can be made small and a radio characteristic can be improved because a coil conductor width can inevitably be large.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、半導体素子をチップとして使用する非接触ICカ−ド、物流用TAG等に使用される半導体装置、例えば、RFID(Radio Freq BACKGROUND OF THE INVENTION The present invention provides non-contact IC card using the semiconductor device as a chip - de, semiconductor devices used in logistics for TAG, etc., for example, RFID (Radio Freq
uency Identification)装置に関するものであり、とくにRFID装置に形成されたアンテナコイルの構造及び製造方法に関するものである。 uency Identification) relates apparatus, and more particularly to a structure and a manufacturing method of the antenna coil formed on the RFID device.

【0002】 [0002]

【従来の技術】図10は、従来の半導体装置、例えば、 BACKGROUND OF THE INVENTION FIG. 10, the conventional semiconductor device, for example,
RFID装置の平面図及び断面図である。 It is a plan view and a cross-sectional view of the RFID device. RFID装置の基材となる矩形の絶縁基板1は、ポリイミド樹脂やエポキシ樹脂などの合成樹脂から構成されている。 Insulating substrate 1 of a rectangular which is a substrate of the RFID device is made of synthetic resin such as polyimide resin or epoxy resin. 絶縁基板1は、横約5.5cm、縦約8.5cm程度のカード状になっている。 Insulating substrate 1 is lying about 5.5cm, length of about 8.5cm about a card. 絶縁基板1主面には銅又はアルミニウムなどからなるアンテナコイル2が主面中央部分に接着剤3により接着されている。 The insulating substrate 1 the main surface antenna coil 2 made of copper or aluminum is bonded by an adhesive 3 to the main surface central portion. 半導体素子が形成されたシリコン半導体などのチップ4は、アンテナコイル2の外部の適宜の位置に形成されている。 Chip 4 such as a silicon semiconductor on which semiconductor elements are formed is formed on the outside of the appropriate position of the antenna coil 2. チップ4は、アンテナコイル2の一端及び他端に形成されたチップ接続端子の上にNCP(Non Conductive Paste)や異方性導電性接着剤などの接着剤により絶縁基板1に接続されている。 Chip 4 is connected to the insulating substrate 1 by an adhesive such as NCP (Non Conductive Paste) or an anisotropic conductive adhesive onto the chip connecting terminal formed on one end and the other end of the antenna coil 2.
アンテナコイル2の両端に形成されたチップ接続端子′ Chip connection terminals formed at both ends of the antenna coil 2 '
は、近接してチップ4に接続されているので他端及びその近傍のコイル導体は、同じ導体をまたいで一端に近接されなければならない。 The coil conductor of the other end and its vicinity because they are connected to the chip 4 in proximity must be close to one end across the same conductor. したがって、その互いの接触を避けるために、裏面導体(図示しない)に接続される。 Therefore, in order to avoid contact of the other, it is connected to the back conductor (not shown).
裏面導体は、絶縁基板1に形成された2つの貫通孔(図示しない)に埋め込まれた接続配線により、他端及びその近傍のコイル導体とその他の部分のコイル導体とを電気的に接続している。 Back conductor is the embedded connection wires to the two through holes formed in the insulating substrate 1 (not shown) and the other end and the coil conductors of the coil conductor and the other portions in the vicinity thereof electrically connected there.

【0003】アンテナコイルを形成するには、アルミニウム箔、銅箔などの金属箔をエッチングして形成するか、スパッタリングやAgペーストなどの導電ペーストを絶縁基板に塗布して形成する方法を採用している。 [0003] To form the antenna coil, aluminum foil, or a metal foil such as a copper foil formed by etching, a conductive paste such as sputtering or Ag paste is adopted a method of forming by coating the insulating substrate there. 情報伝達が非接触となる非接触ICカ−ドにおいてはリ− Non-contact IC card communication is out of contact - in the drill -
ダライタ−との通信距離を延ばす手段の一つにアンテナコイルの電気抵抗を少なくすることが挙げられる。 Daraita - a means to extend the communication distance between the and the like reducing the electrical resistance of the antenna coil. 導体の電気抵抗は、その断面積に反比例するのでRFID装置のアンテナコイル部は、コイル導体の線幅を太く、厚さを厚くする必要がある。 The electrical resistance of the conductor, the antenna coil of the RFID device is inversely proportional to its cross sectional area, thicker the line width of the coil conductor, it is necessary to increase the thickness. RFID装置に使用されるアンテナコイルは、一般的に銅線などを何重にも巻き付けて形成するコイル型とベースフィルム基板上にAgペースト等を印刷又は金属箔をエッチングして形成するフィルム型とがある。 Antenna coil used in the RFID device includes a generally film type print or a metal foil of Ag paste or the like to a copper wire many layers also formed by winding the coil and the base film on a substrate formed by etching there is.

【0004】図11を参照して、従来のRFID装置のアンテナコイルの製造方法を説明する。 [0004] With reference to FIG. 11, a method for manufacturing an antenna coil of a conventional RFID system. ベースとなるP P, which serves as a base
ET(ポリエチレンテレフタレート)フィルムやポリイミドフィルムなどの絶縁基板1にCuやAlなどの金属箔6を接着剤3を用いて貼り付ける。 ET and the metal foil 6 such as (polyethylene terephthalate) film on an insulating substrate 1, such as, polyimide films Cu and Al with an adhesive 3 paste. この上にアンテナコイルパターンを形成するために配線を残す部分に耐エッチング性のレジスト7をスクリーン印刷などにより塗布する。 The etching resistance of the resist 7 is coated by screen printing on portions to leave wires to form the antenna coil pattern on this. その後、金属箔をエッチングするための塩化第二鉄などの薬品に浸すことによりアンテナコイルに必要な渦巻き状のアンテナコイル2のパターンが形成される。 Thereafter, spiral pattern of the antenna coil 2 necessary antenna coil is formed by immersion in chemicals, such as ferric chloride for etching a metal foil.

【0005】 [0005]

【発明が解決しようとする課題】金属箔をエッチングするための薬品に浸すことによりアンテナコイルに必要な渦巻き状のパターンを形成するときの問題は、パターン印刷や薬品によるエッチング工程を用いることにある。 Problem when forming a spiral pattern required in the antenna coil by immersing the metal foil [0005] medicines for etching is the use of the etching process by pattern printing or chemicals .
すなわち、工程数が多くなるので製造コストが高くなる。 That is, the production cost is high because the number of processes increases. また、アンテナコイルのコイル導体間は、エッチングにより除去するので小さくしようとしてもエッチングによる限度があり、0.3〜0.4mm程度以下にすることは非常に困難である。 Further, between the coil conductor of the antenna coil, even there is a limit due to the etching trying small so removed by etching, it is very difficult to below about 0.3 to 0.4 mm. その結果、コイル導体の幅を大きくすることができず、コイル導体の幅が狭いので導通抵抗が大きくなるので、エネルギーロスが大きく、無線特性(通信距離)を悪化させる。 As a result, it is impossible to increase the width of the coil conductors, since conduction resistance because narrow coil conductors is increased, energy loss is large, deteriorating the radio characteristic (communication distance). 本発明は、このような事情によりなされたものであり、製造工程が簡略化され、且つ導通抵抗を小さくすることができる非接触IC The present invention has been made by such circumstances, the non-contact IC capable of manufacturing process can be simplified, and to reduce the conduction resistance
カード、物流用TAG等に使用される半導体装置、例えば、RFID装置(無線周波数識別)及びその製造方法を提供する。 Cards, semiconductor devices used in logistics for TAG, etc., for example, to provide RFID device (radio frequency identification) and its manufacturing method.

【0006】 [0006]

【課題を解決するための手段】本発明の半導体装置は、 The semiconductor device of the present invention According to an aspect of the
非接触ICカード、物流用TAG等に使用されるRFI Contactless IC card, RFI that is used for distribution TAG etc.
D装置(無線周波数識別)に設けられている無線通信を行うためのアンテナコイルをCu、Al、Au、Agなどの金属箔を、金属などによって作られた鋭い刃によってコイル状にプレス打ち抜きによって形成することを特徴としている。 D apparatus (radio frequency identification) antenna coil for wireless communication is provided on Cu, Al, Au, a metal foil such as Ag, formed by punching into a coil by a sharp blade made by a metal It is characterized in that. コイルパターンをエッチング工程で形成しないで鋭い刃によりプレス加工により形成するので製造工程が簡略化される。 Manufacturing process is simplified because the coil pattern is formed by pressing a sharp blade without forming the etching process. またアンテナコイルの導体間隔を0.1〜0.2mmと従来より著しく狭くすることができる。 Also it is possible to significantly narrower than 0.1~0.2mm the conventional conductor spacing of the antenna coil. その結果、本発明で形成されたアンテナコイルのコイル導体間は、同じ形状の金属箔をエッチングにより加工されるアンテナコイルのコイル導体間より狭くできるので、本発明のコイル導体幅は、必然的に大きくすることができる。 As a result, among the coil conductors of the antenna coil formed in the present invention, since the metal foil having the same shape can be made narrower than between the coil conductor of the antenna coil, which is processed by etching, the coil conductor width of the present invention, inevitably it can be increased. したがって、その導通抵抗を小さくして無線特性を改善することが可能になる。 Therefore, it is possible to improve the radio characteristics by reducing the conduction resistance.

【0007】すなわち、本発明の半導体装置は、絶縁基板と、前記絶縁基板に搭載された半導体チップと、前記絶縁基板に形成され、前記半導体チップに電流を供給するアンテナコイルとを備え、前記アンテナコイルは、先端の鋭い刃によりコイル状に押し切り加工された金属箔からなることを特徴としている。 Namely, the semiconductor device of the present invention includes an insulating substrate, a semiconductor chip mounted on the insulating substrate, wherein formed on the insulating substrate, and an antenna coil for supplying a current to said semiconductor chip, said antenna coil is characterized in that it consists of machining metal foil press-cutting in a coil shape by sharp edges of the tip. また、本発明の半導体装置は、絶縁基板と、前記絶縁基板に搭載された半導体チップと、前記絶縁基板に形成され、前記半導体チップに電流を供給するアンテナコイルとを備え、前記アンテナコイルは、ループ状に形成された金属箔の所定の箇所を先端の鋭い刃により押し切り分離加工された形状を有することを特徴としている。 Further, the semiconductor device of the present invention includes an insulating substrate, a semiconductor chip mounted on the insulating substrate, is formed on the insulating substrate, and an antenna coil for supplying a current to said semiconductor chip, said antenna coil, It is characterized by having a predetermined a portion press-cutting by sharp edges of the tip separation machined shape of the metal foil formed in a loop shape. 前記絶縁基板の前記アンテナコイル及び半導体チップが形成された面は、絶縁保護膜により被覆保護されているようにしても良い。 Wherein the antenna coil and the semiconductor chip is formed a surface of the insulating substrate, it may be covered protected by an insulating protective film.

【0008】本発明の半導体装置の製造方法は、絶縁基板に金属箔を接着する工程と、前記金属箔を先端の鋭い刃によりコイル状に押し切る工程と、前記コイル状に押し切られた金属箔の中央部を除去して外部から電流を取り入れる受電用アンテナコイルを形成する工程と、前記絶縁基板に半導体チップを取り付ける工程とを備えたことを特徴としている。 [0008] The method of manufacturing a semiconductor device of the present invention includes the steps of bonding a metal foil to an insulating substrate, a step of Oshikiru the metal foil in a coil shape by sharp edges of the tip, of the metal foil pressed all the way into the coil forming a power receiving antenna coil introducing current from outside to remove the central portion is characterized by comprising the steps of: mounting a semiconductor chip on the insulating substrate. また、本発明の半導体装置の製造方法は、絶縁基板に金属箔を接着する工程と、前記金属箔の中央部分を除去してループ状にする工程と、前記金属箔の前記ループの所定の箇所を先端の鋭い刃により押し切って一巻きの外部から電流を取り入れる受電用アンテナコイルを形成する工程と、前記絶縁基板に半導体チップを取り付ける工程とを備えたことを特徴としている。 A method of manufacturing a semiconductor device of the present invention includes the steps of bonding a metal foil to an insulating substrate, a step of the loop by removing the central portion of the metal foil, a predetermined portion of the loop of the metal foil It is characterized by comprising a step of forming a power receiving antenna coil incorporating current from one turn of the outside Oshiki' by sharp edges of the tip, and a step of mounting a semiconductor chip on the insulating substrate. 前記金属箔をコイル状に押し切る工程において、前記金属箔を支持する前記絶縁基板には前記鋭い刃が入り込まないかもしくは部分的に入り込むようにしても良い。 Wherein the metal foil in the step of Oshikiru coiled, on the insulating substrate which supports the metal foil may be enters do or partially the sharp blade does not enter. 前記金属箔をコイル状に押し切る工程において、前記金属箔を支持する前記絶縁基板には前記鋭い刃が入り込んでこの絶縁基板を切断するようにしても良い。 In the step of Oshikiru the metal foil into a coil, on the insulating substrate which supports the metal foil may be cutting the insulating substrate enters said sharp blade. 本発明のICカ−ド通信システムは、非接触ICカ−ドと、 IC card of the present invention - de communication system, the non-contact IC card - and de,
リーダライタとを具備し、前記非接触ICカ−ドとして上記RFID装置を用い、前記非接触ICカードがアンテナコイルを介して電磁誘導により前記リーダライタと信号の授受を行うことを特徴としている。 ; And a reader-writer, the contactless IC card - using the RFID device as de, the contactless IC card is characterized in that for exchanging the reader writer and the signal by electromagnetic induction via the antenna coil.

【0009】 [0009]

【発明の実施の形態】以下、図面を参照して発明の実施の形態を説明する。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an embodiment of the invention with reference to the drawings. まず、図1乃至図6を参照して第1 First, first with reference to FIGS
の実施例を説明する。 Describing the embodiments. 図1は、絶縁基板上に形成されたアンテナコイルの斜視図及びA−A′線に沿う部分の断面図、図2は、アンテナコイルの斜視図、図3は、この金属箔を加工する金型の斜視図及び断面図及び加工時の金型と絶縁基板の断面図、図4は、絶縁基板にチップを搭載したRFID装置の斜視図、図5は、金属箔を加工する金型を取り付けたプレス機の断面図、図6は、加工時の金型と絶縁基板の状態を説明する断面図である。 Figure 1 is a cross-sectional view of a portion along a perspective view of the antenna coil formed on the insulating substrate and the line A-A ', FIG. 2 is a perspective view of the antenna coil, Fig. 3, processing the metal foil gold -type perspective view and a cross-sectional view and a cross-sectional view of a mold with the insulating substrate during processing, and FIG. 4 is a perspective view of the RFID device equipped with the chip on the insulating substrate, Fig. 5, mounting a die for processing the metal foil sectional view of a press machine, FIG. 6 is a cross-sectional view for explaining a state of the mold with the insulating substrate during processing.

【0010】図1において、ベースになる絶縁基板10 [0010] In FIG. 1, the insulating substrate 10 made of a base
は、厚さ25〜100μm程度のPETフィルム、エポキシ樹脂フィルム、塩化ビニールフィルムもしくはポリイミドフィルムから構成されている。 Is, PET film having a thickness of about 25 to 100 m, an epoxy resin film, and a vinyl chloride film or a polyimide film. 絶縁基板10は、 Insulating substrate 10,
横約5.5cm、縦約8.5cm程度のカード状になっている。 Side about 5.5cm, which is in the vertical about 8.5cm about-shaped card. 絶縁基板10主面には銅又はアルミニウムなどからなるアンテナコイル16が主面周辺部分に接着剤1 Adhesive first antenna coil 16 made of copper or aluminum on the insulating substrate 10 major surface to major surface peripheral portion
3により接着されている。 They are bonded by three. 接着剤13は、厚さ2〜3μ Adhesive 13, the thickness 2~3μ
m程度である。 It is about m. アンテナコイル16は、厚さが10〜3 The antenna coil 16, the thickness of 10-3
0μm程度である。 It is about 0μm. アンテナコイル16の一端に平行に補助導体19が形成されている。 Parallel to the auxiliary conductor 19 to one end of the antenna coil 16 is formed. 補助導体を含めてアンテナコイル16を構成するコイル導体間の間隔は、0. Spacing between coil conductors constituting the antenna coil 16 including the auxiliary conductor, 0.
1〜0.2mm程度と従来のコイル導体間隔の0.3〜 0.3 of 1~0.2mm about the conventional coil conductor spacing
0.4mmより狭くなっている。 It is narrower than 0.4mm.

【0011】アンテナコイルを形成するには、従来アルミニウム箔、銅箔などの金属箔をエッチングして形成するか、スパッタリングやAgペーストなどの導電ペーストを絶縁基板に塗布して形成する方法を採用している。 [0011] To form the antenna coil is conventionally aluminum foil, or a metal foil such as a copper foil formed by etching, a conductive paste such as sputtering or Ag paste is adopted a method of forming by coating the insulating substrate ing.
また、情報伝達が非接触となる非接触ICカ−ドにおいてはリ−ダライタ−との通信距離を延ばす手段の一つにアンテナコイルの電気抵抗を少なくすることが挙げられる。 The non-contact IC card communication is out of contact - in the drill - Daraita - a means of extending the communication distance between the and the like reducing the electrical resistance of the antenna coil. そして、コイル導体の電気抵抗は、その断面積に反比例するので、RFID装置のアンテナコイルは、コイル導体の線幅を太く、そして厚くする必要がある。 The electric resistance of the coil conductor is inversely proportional to its cross sectional area, the antenna coil of the RFID device, thick line width of the coil conductors, and it is necessary to increase. 本発明では、アルミニウム箔、銅箔、銀箔、金箔などの金属箔を絶縁基板に貼り付けて加工することは従来技術と変わらないものの、金属箔を先端の鋭い刃によりコイル状に押し切り加工することによりアンテナコイル16を得ることを特徴としている。 In the present invention, an aluminum foil, copper foil, silver foil, although it is not different from the prior art for processing paste the metal foil such as gold foil to the insulating substrate, to be processed push-cutting in a coil shape by sharp edges of the tip of the metal foil It is characterized by obtaining the antenna coil 16 by.

【0012】次に、図2及び図3を参照してRFID装置に形成されたアンテナコイルの製造方法を説明する。 [0012] Next, with reference to FIGS. 2 and 3 to illustrate a method of manufacturing an antenna coil formed on the RFID device.
まず、厚さ38〜100μmのPETフィルムなどからなる絶縁基板10にエポキシ樹脂などの厚さ2〜3μm First, the thickness of the epoxy resin to the insulating substrate 10 made of PET film having a thickness of 38~100Myuemu 2 to 3 [mu] m
の接着剤13によりAlなどの金属箔12を貼り付ける(図2(a)、(b))。 Of the adhesive 13 pasting metal foil 12, such as Al (FIG. 2 (a), (b)). 次に、この絶縁基板10の金属箔12が貼り付けられた面から図3(a)、(b)に示すような金属製の鋭い刃111を渦巻き状に組み込んだ金型11によりこの絶縁基板10の表面をプレスすると、表面上の金属箔12は、刃の当たった所が切断される。 Next, the insulating substrate by FIG. 3 (a), a mold 11 that incorporates a metallic sharp edge 111 as shown in (b) in a spiral shape from the insulating surface metal foil 12 is adhered to the substrate 10 When the 10 surface of the press, a metal foil 12 on the surface, where it hits the blades is cut. 金型11には渦巻き状の溝が形成され、この中に鋭い刃11が埋め込まれている。 The mold 11 is formed a spiral groove, a sharp edge 11 in this is embedded. 刃111の露出している部分は、5mm程度である。 The exposed portion of the blade 111 is about 5 mm. 通常、渦巻きは、3〜5巻き程度である。 Usually, spiral is about 3-5 turns. この切断により、金属箔12からコイル状の帯状体が形成され、これがアンテナコイル16として用いられる(図2(c))。 This cleavage coiled strip of metal foil 12 is formed, which is used as an antenna coil 16 (FIG. 2 (c)).

【0013】次に、図5を参照して、この金属箔を切断する金型11を取り付けたプレス機を説明する。 [0013] Next, with reference to FIG. 5, illustrating the mounting and press the mold 11 for cutting the metal foil. プレス機は、上型と下型からなり、下型には金属箔12を接着剤13により貼り付けた絶縁基板10が位置決め固定されている。 Press consists upper and lower molds, pasted insulating substrate 10 by an adhesive 13 to the metal foil 12 is positioned and fixed to the lower die. 下型表面にはラバー材などの緩衝層が形成されており鋭い刃が下型を損傷しないように構成されている。 A sharp blade buffer layer is formed of such rubber material is configured so as not to damage the lower mold on the lower mold surface. また、下型表面にはスペーサが取り付けられており、刃の下降位置を制御するようになっている。 Further, the lower die surface and the spacer is attached, so as to control the lowered position of the blade. 上型には鋭い刃111を取り付けた金型11が装着されている。 Mold 11 is mounted, fitted with a sharp blade 111 in the upper die. 上型が鋭い刃11と共に下降し、この刃が金属箔1 Lowered upper die with a sharp blade 11, the blade metal foil 1
2、接着剤13及び絶縁基板10まで達している(図3 2, and it reaches the adhesive 13 and the insulating substrate 10 (FIG. 3
(c)参照)。 (C) reference). この実施例では鋭い刃111は、絶縁基板10の裏面にまで達しているので、絶縁保護膜を被覆保護するまでは不安定な状態にあり、取扱いが難しい。 Sharp blade 111 in this embodiment, since reach the back surface of the insulating substrate 10, until covering the insulating protective film in an unstable state, is difficult to handle.
そこで、本発明は、鋭い刃による切断の仕方を変えて鋭い刃の下降を絶縁基板の途中で止めるようにする方法も可能である(図6参照)。 Accordingly, the present invention may be a method of lowering the sharp blade by changing the way of cutting with a sharp blade to stop in the middle of the insulating substrate (see FIG. 6). 例えば、図5に示すように、 For example, as shown in FIG. 5,
上型及び下型の間にスペーサを挿入して金型11の下降を所定の位置で食い止めるのである。 By inserting a spacer between the upper and lower molds it is to stop the descent of the die 11 at a predetermined position. 絶縁基板が完全に切断されないので、後処理後における絶縁基板の取扱いが容易になる。 The insulating substrate is not completely cut, facilitates handling of the insulating substrate after post-processing.

【0014】次に、絶縁基板10のコイル状の帯状体に囲まれた中央部分をプレス金型などにより打ち抜いて、 [0014] Next, a coiled central portion surrounded by the strip of insulating substrate 10 by punching by a press die,
この中央部分に残っていた金属箔を除去する。 To remove the metal foil it was left in the central part. この打ち抜きにより形成された中央部の穴は、電磁誘導に必要な磁界の通路であり、これによりアンテナ回路が形成される。 Hole in the central portion formed by the punching is magnetic path required for the electromagnetic induction, thereby the antenna circuit is formed. 打ち抜き時に補助導体19となる帯状体を打ち残しておく(図1参照)。 Leave out the strip serving as an auxiliary conductor 19 during punching (see Fig. 1). 前記渦巻き状に形成された鋭い刃には、例えば、トムソン刃などが用いられる。 The sharp edge formed at the spiral, for example, Thomson blade may be used. 次に、図4を参照して、上記の方法で得られたアンテナコイルを有する絶縁基板に形成されたRFID装置を説明する。 Next, referring to FIG. 4, illustrating a RFID device formed on an insulating substrate having an antenna coil obtained by the above method.
図に示すように、絶縁基板10には複数のアンテナコイルが形成されている。 As shown, a plurality of antenna coils are formed on the insulating substrate 10. 各アンテナコイルにそれぞれメモリや論理回路が形成されたチップを搭載し、PETフィルムなどの200〜300μm厚程度の絶縁保護膜(図示しない)を施してから絶縁基板を切断してアンテナコイルを個別に分離する。 Each equipped with a chip memory and logic circuits are formed on the antenna coil, the antenna coil by cutting the insulated substrate after subjected to 200~300μm thickness of about insulating protective film (not shown) such as a PET film separately To separate.

【0015】半導体素子が形成されたシリコン半導体などのチップ14は、アンテナコイル16の内側の適宜の位置に搭載されている。 The chip 14, such as a silicon semiconductor element is formed the semiconductor is mounted to an appropriate position inside the antenna coil 16. チップ14は、アンテナコイル16の一端及び他端に形成されたチップ接続端子の上に異方性導電性接着剤などの接着剤により絶縁基板10に接続されている。 Chip 14 is connected to the insulating substrate 10 by an adhesive such as an anisotropic conductive adhesive onto the chip connecting terminal formed on one end and the other end of the antenna coil 16. アンテナコイル16の両端に形成された接続端子は、近接してチップ14に接続される必要があるので、アンテナコイルの一端は、直接チップ14に接続され、他端及びその近傍のコイル導体は、同じ導体を越えて前記一端に近接されなければならない。 Connection terminals formed at both ends of the antenna coil 16, it is necessary to be connected close to the tip 14, one end of the antenna coil is connected directly to the chip 14, the other end and the coil conductor in the vicinity thereof, the It must be close to the one end beyond the same conductor. その互いの接触を避けるために、前記他端は、アルミニウムによるかしめ18により裏面導体17に接続されて前記一端と近接配置される補助導体19に接続される。 To avoid contact of the other, the other end is connected to the auxiliary conductor 19 by caulking 18 of aluminum is connected to the back conductor 17 is arranged close to the end. 補助導体19は、コイル導体の一端と並行に配置され、チップ14は、両者にまたがって接合されている。 Auxiliary conductors 19 are arranged in parallel with one end of the coil conductor, chip 14 is bonded across both.

【0016】以上のように、同じ形状・同じ大きさの金属箔からアンテナコイルを形成する場合、押し切り切断により形成する方が、エッチングにより形成するより、 [0016] As described above, than the case of forming the antenna coil from the metal foil of the same shape and the same size, better be formed by press-cutting cutting, formed by etching,
金属箔を除去する量が少ない(アンテナコイルを構成するコイル導体間の間隔を0.1〜0.2mm程度と従来より狭くすることができる)ので、その分コイル導体の断面積を広くすることができ、その結果導通抵抗を低く抑えることができる。 The amount of removing the metal foil is less (the distance between the coil conductors constituting the antenna coil can be narrower than conventional about 0.1 to 0.2 mm), possible to widen the sectional area of ​​the correspondingly coil conductor can be, it is possible to suppress the resulting conduction resistance. また、アンテナコイルをエッチング処理により形成する方式に比較して製造工程を大幅に削減できるので、工程が簡略化し、且つ製造コストを低減することができる。 Since it significantly reduced compared to the manufacturing process of a method in which forming the antenna coil by etching, it is possible to simplifying the process and reducing the manufacturing cost.

【0017】次に、図7及び図8を参照して第2の実施例を説明する。 Next, a second embodiment will be described with reference to FIGS. 図7は、アンテナコイルを形成した絶縁基板にチップを搭載したRFID装置の斜視図、図8 Figure 7 is a perspective view of the RFID device equipped with a chip on an insulating substrate formed with an antenna coil, Fig. 8
は、このRFID装置の製造工程を説明する斜視図である。 Is a perspective view for explaining a manufacturing process of the RFID device. 図7に示すように、絶縁基板には複数のアンテナコイルが形成されている。 As shown in FIG. 7, a plurality of antenna coils on the insulating substrate is formed. 各アンテナコイルにそれぞれメモリや論理回路が形成されたチップを搭載し、PETフィルムなどの200〜300μm厚程度の絶縁保護膜(図示しない)を施してから絶縁基板を切断してアンテナコイルを個別に分離する。 Each equipped with a chip memory and logic circuits are formed on the antenna coil, the antenna coil by cutting the insulated substrate after subjected to 200~300μm thickness of about insulating protective film (not shown) such as a PET film separately To separate. 半導体素子が形成されたシリコン半導体などのチップ24は、アンテナコイル26 Chip 24 such as a silicon semiconductor on which semiconductor elements are formed, the antenna coil 26
上に搭載されている。 It is mounted on the top. チップ24は、アンテナコイル2 Chip 24, antenna coil 2
6の一端及び他端に形成された接続端子の上に異方性導電性接着剤などの接着剤により絶縁基板20に接続されている。 It is connected to the insulating substrate 20 by an adhesive such as an anisotropic conductive adhesive over the 6 one end and connecting terminals formed on the other end of the. アンテナコイル26の両端に形成された接続端子(図示しない)は、近接して配置されているので、チップ24は、一端及び他端ににまたがって接合されている。 Both ends formed connection terminals of the antenna coil 26 (not shown), so that closely spaced, the chip 24 is bonded across the one end and the other end.

【0018】以上のように、同じ形状・同じ大きさの金属箔からアンテナコイルを形成する場合、押し切り切断により形成する方が、エッチングにより形成するより、 [0018] As described above, than the case of forming the antenna coil from the metal foil of the same shape and the same size, better be formed by press-cutting cutting, formed by etching,
金属箔を除去する量が少ないので、その分コイル導体の断面積を広くすることができ、その結果導通抵抗を低く抑えることができる。 The amount of removing the metal foil is small, it is possible to widen the sectional area of ​​that amount coil conductor, it is possible to suppress the resulting conduction resistance. また、アンテナコイルをエッチング処理により形成する方式に比較して製造工程を大幅に削減できるので、工程が簡略化し、且つ製造コストを低減することができる。 Since it significantly reduced compared to the manufacturing process of a method in which forming the antenna coil by etching, it is possible to simplifying the process and reducing the manufacturing cost. また、この実施例では第1の実施例より単純な形状の鋭い刃を用いることができるので切断工程が容易になる。 Further, the cutting process is facilitated since in this embodiment it is possible to use a sharp blade of a simple shape than the first embodiment.

【0019】次に、図8を参照してRFID装置に形成されたアンテナコイルの製造方法を説明する。 [0019] Next, a method for manufacturing an antenna coil formed on the RFID device with reference to FIG. まず、厚さ38〜100μmのPETフィルムなどからなる絶縁基板20にエポキシ樹脂などの厚さ2〜3μmの接着剤によりアルミニウムなどの金属箔22を貼り付ける(図8(a))。 First, paste metal foil 22 such as aluminum with an adhesive thickness 2~3μm such as epoxy resin to the insulating substrate 20 made of a PET film having a thickness of 38~100Myuemu (FIG 8 (a)). 次に、この絶縁基板20の金属箔22が貼り付けられた面から金属製の鋭い刃を組み込んだ金型によりこの絶縁基板20の表面をプレスする。 Then, a metal foil 22 is affixed mold incorporating metal sharp blade from the surface of the insulating substrate 20 to press the surface of the insulating substrate 20. この金型は、図5に示すプレス機に組み込んでプレス処理される。 The mold is pressing incorporated into a press machine shown in FIG. この表面上の金属箔22は、刃の当たった所が切断される。 Metal foil 22 on the surface, where it hits the blades is cut. 金型には直線状の溝が形成され、この中に鋭い刃が埋め込まれている。 Linear groove is formed in the mold is embedded sharp blade therein. 刃の露出している部分は、5m The exposed portion of the blade, 5m
m程度である(図8(b))。 It is about m (Figure 8 (b)). 次に、絶縁基板20の中央部分をプレス金型などにより打ち抜いて、この中央部分に残っていた金属箔を除去する。 Next, the central portion of the insulating substrate 20 by punching by a press die, removing the metal foil remaining in the central portion. この打ち抜きにより形成された中央部の穴は、電磁誘導に必要な磁界の通路であり、これによりアンテナコイル26が形成される。 Hole in the central portion formed by the punching is magnetic path required for the electromagnetic induction, thereby the antenna coil 26 is formed.
周辺部分のアンテナコイル26は、1巻きであり、鋭い刃により切断される箇所がある。 The antenna coil 26 of the peripheral portion is one turn, there is a portion to be cut by a sharp blade. この切断部分がコイル導体の一端及び他端である。 The cutting portion is one end and the other end of the coil conductor. これら両端は、互いに対向している(図8(c))。 These ends are opposed to each other (FIG. 8 (c)).

【0020】次に、図9を参照してICカ−ド通信システムを説明する。 Next, with reference to FIG. 9 IC Ca - describing de communication system. 図9に示すようにこの通信システムは、非接触ICカ−ドがそのアンテナコイルを介して電磁誘導によりリーダライタと信号の授受を行うことに特徴がある。 The communication system as shown in FIG. 9, the non-contact IC card - De is characterized in that the transmitting and receiving interrogator signal by electromagnetic induction via the antenna coil. リーダライタのアンテナコイルに交流電圧を発生させ、絶縁基板20をカードとするICカ−ドをリーダライタに所定の距離(D)だけ近付けると、磁場の変化によりICカ−ドのアンテナコイルに起電力が発生する(チップ24内部の変換回路により交流電圧はデジタル信号、定電圧に変換される)。 The antenna coil of the reader-writer generates an AC voltage, IC mosquito the insulating substrate 20 with the card - the closer the de reader writer by a predetermined distance (D), IC mosquitoes by a change in magnetic field - caused to de antenna coil power is generated (AC voltage by a chip 24 internal converter is converted digital signal, the constant voltage). この様な非接触IC Such non-contact IC
カ−ドは、従来磁気カードであったテレフォンカードに用いてデータ改ざん防止を図ったり、定期券に用いて定期入れなどのケースに入れたままで改札を通ることができるなどの使い勝手が向上する。 Ca - de is or attempted data tampering prevention using the conventional magnetic card and was the telephone card, usability such as can pass through the ticket gate while in its case, such as pass holder with the commuter pass is improved. 以上、前述の実施例では、アンテナコイル表面を絶縁保護膜で被覆するように構成されているが、本発明では、例えば、物流用TAG Above, in the illustrated embodiment, it is configured so as to cover the antenna coil surface with an insulating protective film, in the invention, for example, TAG for logistics
などのように保護膜を施さない場合もある。 It may not subjected to the protective film, such as.

【0021】 [0021]

【発明の効果】アンテナコイルをエッチング処理により形成する方式に比較して製造工程を大幅に削減できるので、工程が簡略化し、且つ製造コストを低減することができる。 Since the antenna coil according to the present invention can be greatly reduced compared to the manufacturing process of a method in which a formed by etching, it is possible to simplifying the process and reducing the manufacturing cost. また、同じ形状・同じ大きさの金属箔からアンテナコイルを形成する場合、押し切り切断により形成する方が、エッチングにより形成するより、金属箔を除去する量が少ないので、その分コイル導体の断面積を広くすることができ、その結果、導通抵抗を低く抑えることができる。 In the case of forming an antenna coil of a metal foil of the same shape and the same size, it is formed by press-cutting cutting, rather than formed by etching, since a small amount of removing the metal foil, the cross-sectional area of ​​that amount coil conductor it can be widened. As a result, it is possible to reduce the conduction resistance. したがって、アンテナコイルの導通抵抗を低くして通信距離を延ばすことができるなど無線通信特性を向上させることができる。 Therefore, it is possible to improve the wireless communication characteristics such as can be extended communication distance by reducing the conduction resistance of the antenna coil.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の絶縁基板上に形成されたアンテナコイルの斜視図及びA−A′線に沿う部分の断面図。 Sectional view of a portion along a perspective view and a line A-A 'of the antenna coil formed on an insulating substrate of the present invention; FIG.

【図2】本発明のRFID装置に用いるアンテナコイルの斜視図。 Perspective view of the antenna coil used in the RFID system of the present invention; FIG.

【図3】本発明の金属箔を加工する金型の斜視図及び断面図及び加工時の金型と絶縁基板の断面図。 Figure 3 is a perspective view and a cross-sectional view and a cross-sectional view of a mold with the insulating substrate during processing of the die for processing the metal foil of the present invention.

【図4】本発明の絶縁基板にチップを搭載したRFID [4] RFID equipped with a chip on the insulating substrate of the present invention
装置の斜視図。 Perspective view of the apparatus.

【図5】本発明の金属箔を加工する金型を取り付けたプレス機の断面図。 FIG. 5 is a cross-sectional view of a press fitted with a die for processing the metal foil of the present invention.

【図6】本発明の加工時の金型と絶縁基板の状態を説明する断面図である。 6 is a cross-sectional view for explaining a state of the mold with the insulating substrate during processing of the present invention.

【図7】本発明のアンテナコイルを形成した絶縁基板にチップを搭載したRFID装置の斜視図 Figure 7 is a perspective view of a RFID device equipped with the chip antenna coil formed an insulating substrate of the present invention

【図8】本発明のRFID装置の製造工程を説明する斜視図。 8 is a perspective view illustrating a process of producing the RFID device of the present invention.

【図9】本発明のICカ−ド通信システムの概略断面図。 De schematic cross-sectional view of the communication system - 9 IC card of the present invention.

【図10】従来のRFID装置の平面図。 Figure 10 is a plan view of a conventional RFID system.

【図11】従来のRFID装置のアンテナコイルの製造工程断面図。 [11] manufacturing process sectional views of an antenna coil of a conventional RFID system.

【符号の説明】 DESCRIPTION OF SYMBOLS

1、10、20・・・絶縁基板、 2、16、26・・ 1, 10, 20 ... insulating substrate, 2,16,26 ...
・アンテナコイル、3、13・・・接着剤、 4、1 Antenna coil, 3,13 ... adhesive, 4,1
4、24・・・チップ、6、12・・・金属箔、 7 4, 24 ... chip, 6, 12 ... metal foil, 7
・・・レジスト、 11・・・金型、17・・・裏面導体、 18・・・かしめ、 19・・・補助導体、111・・・鋭い刃。 ... resist, 11 ... die, 17 ... back conductor, 18 ... crimping, 19 ... auxiliary conductor, 111 ... sharp blade.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl. 7識別記号 FI テーマコート゛(参考) H01Q 1/38 G01S 13/74 7/00 G06K 19/00 H // G01S 13/74 K Fターム(参考) 5B035 BA03 BB09 BC00 CA01 CA23 5B058 CA17 5J046 AA10 AA12 AA19 AB11 AB13 TA04 5J070 AF01 AK01 AK40 BC23 BC35 BC40 ────────────────────────────────────────────────── ─── of the front page continued (51) Int.Cl. 7 identification mark FI theme Court Bu (reference) H01Q 1/38 G01S 13/74 7/00 G06K 19/00 H // G01S 13/74 K F -term (reference ) 5B035 BA03 BB09 BC00 CA01 CA23 5B058 CA17 5J046 AA10 AA12 AA19 AB11 AB13 TA04 5J070 AF01 AK01 AK40 BC23 BC35 BC40

Claims (8)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 絶縁基板と、前記絶縁基板に搭載された半導体チップと、前記絶縁基板に形成され、前記半導体チップに電流を供給するアンテナコイルとを備え、前記アンテナコイルは、コイル状に押加工された金属箔からなることを特徴とする半導体装置。 And 1. A insulating substrate, a semiconductor chip mounted on the insulating substrate, is formed on the insulating substrate, and an antenna coil for supplying a current to said semiconductor chip, said antenna coil, push the coiled a semiconductor device, comprising the processed metal foil.
  2. 【請求項2】 絶縁基板と、前記絶縁基板に搭載された半導体チップと、前記絶縁基板に形成され、前記半導体チップに電流を供給するアンテナコイルとを備え、前記アンテナコイルは、ループ状に形成された金属箔の所定の箇所を押し切り分離加工された形状を有することを特徴とする半導体装置。 2. A insulating substrate, a semiconductor chip mounted on the insulating substrate, is formed on the insulating substrate, and an antenna coil for supplying a current to said semiconductor chip, said antenna coil is formed in a loop shape wherein a has a separation process shape press cutting a predetermined portion of the metal foils.
  3. 【請求項3】 前記絶縁基板の前記アンテナコイル及び半導体チップが形成された面は、絶縁保護膜により被覆保護されていることを特徴とする請求項1又は請求項2 Wherein the said antenna coil and the surface of the semiconductor chip is formed of an insulating substrate, according to claim 1 or claim 2, characterized in that it is covered and protected by the insulating protective film
    に記載の半導体装置。 The semiconductor device according to.
  4. 【請求項4】 絶縁基板に金属箔を接着する工程と、 前記金属箔を先端の鋭い刃によりコイル状に押し切る工程と、 前記コイル状に押し切られた金属箔の中央部を除去して外部から電流を取り入れる受電用アンテナコイルを形成する工程と、 前記絶縁基板に半導体チップを取り付ける工程とを備えたことを特徴とする半導体装置の製造方法。 4. A process of bonding a metal foil to an insulating substrate, a step of Oshikiru the metal foil in a coil shape by sharp edges of the tip, from the outside by removing the central portion of the metal foil pressed all the way into the coil the method of manufacturing a semiconductor device comprising the steps of forming a power receiving antenna coil incorporating current, further comprising the step of attaching the semiconductor chip on the insulating substrate.
  5. 【請求項5】 絶縁基板に金属箔を接着する工程と、 前記金属箔の中央部分を除去してループ状にする工程と、 前記金属箔の前記ループの所定の箇所を先端の鋭い刃により押し切って一巻きの外部から電流を取り入れる受電用アンテナコイルを形成する工程と、 前記絶縁基板に半導体チップを取り付ける工程とを備えたことを特徴とする半導体装置の製造方法。 5. A process for bonding a metal foil to an insulating substrate, a step of the loop by removing the central portion of the metal foil, Oshiki' by the sharp edges of the tip of the predetermined portion of the loop of the metal foil the method of manufacturing a semiconductor device characterized by comprising a step of forming a power receiving antenna coil incorporating current from a roll of the external, and a step of mounting a semiconductor chip on the insulating substrate Te.
  6. 【請求項6】 前記金属箔をコイル状に押し切る工程は、前記金属箔を支持する前記絶縁基板に前記鋭い刃が入り込まないかもしくは部分的に入り込むことを特徴とする請求項4又は請求項5に記載の半導体装置の製造方法。 6. A process Oshikiru the metal foil into a coil shape, claim 4 or claim 5, characterized in that penetrate the metal foil with said insulating or or partially the sharp blade does not enter a substrate supporting the the method of manufacturing a semiconductor device according to.
  7. 【請求項7】 前記金属箔をコイル状に押し切る工程は、前記金属箔を支持する前記絶縁基板に前記鋭い刃が入り込んでこの絶縁基板を切断することを特徴とする請求項4又は請求項5に記載の半導体装置の製造方法。 7. A process Oshikiru the metal foil into a coil shape, claim 4 or claim 5, characterized in that cutting the insulating substrate wherein enters a sharp edge on the insulating substrate for supporting the metallic foil the method of manufacturing a semiconductor device according to.
  8. 【請求項8】 非接触ICカ−ドと、リーダライタとを具備し、前記非接触ICカ−ドは、請求項1乃至請求項3のいづれかに記載された半導体装置を用い、前記非接触ICカードは、アンテナコイルを介して電磁誘導により前記リーダライタと信号の授受を行うことを特徴とするICカ−ド通信システム。 8. The non-contact IC card - equipped and de, the reader-writer, the contactless IC card - de uses a semiconductor device according to either of claims 1 to 3, wherein the non-contact IC card, IC Ca and performing exchange of the reader writer and the signal by electromagnetic induction via the antenna coil - de communication system.
JP2000068288A 2000-03-13 2000-03-13 Semiconductor device, its manufacture and ic card communication system Abandoned JP2001256457A (en)

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