KR101100476B1

KR101100476B1 - Rf antenna embeded inlay and method for fabricating thereof

Info

Publication number: KR101100476B1
Application number: KR1020100061651A
Authority: KR
Inventors: 나경록
Original assignee: 나경록
Priority date: 2010-06-29
Filing date: 2010-06-29
Publication date: 2011-12-29

Abstract

PURPOSE: A radio frequency antenna embedded inlay and a manufacturing method thereof are provided to rapidly manufacture a card by forming a radio frequency antenna with printing technique using a metal board. CONSTITUTION: A peeling layer(110) is formed on a metal board(100). A desired pattern is screen-printed on the peeling layer using a conductivity conducting material. An insulation part is formed in a fixed space among a plurality of pattern circuit parts. A jump wire(400) is formed in order to electrically connect a plurality of pattern circuit parts. A conductive plate is formed in the fixed space among a plurality of pattern circuit parts. A core film layer is bonded in the upper side of the peeling layer in which a plurality of pattern circuit parts is formed. The core film layer is separated from the metal board and a plurality of pattern circuit parts is transferred to the core film layer.

Description

RF antenna embedded inlay and method for fabricating

The present invention relates to an RF antenna embedded inlay and a manufacturing method thereof, and more particularly, to an RF antenna embedded inlay that can be easily manufactured through a printing process using a metal substrate, bonding and transferring of a core film, and a manufacturing method thereof. It is about.

Smart cards equipped with IC chips with microprocessors, operating systems, security modules, and memory are being used in a variety of fields, ranging from post-paid high-pass cards to transportation cards and bank cards.

Such smart cards can be divided into contact cards and contactless cards according to the method of reading the data of the IC chip. On the other hand, the combined card supports both the functions of a contact card and a contactless card. There are a Combi card and a Hybrid card.

Various smart cards basically consist of RF antennas and IC chips in the form of plastic cards. Inlays used in smart cards incorporate the circuit pattern of the RF antenna.

For example, the 13.56 MHz circuit pattern may be manufactured in the form of a copper coil to induce electrical energy by external electromagnetic waves or to radiate a signal to be transmitted from an IC chip to the outside. Therefore, in the manufacture of the RF antenna embedded inlay, the manufacturing process of the circuit pattern and the formation of the conducting portion, which is the circuit connection portion of the IC chip, play an important part.

Conventionally, in order to manufacture an inlay circuit pattern of a built-in RF antenna, the coil is wound several times directly on a substrate to be inserted and fixed in a core film layer, or an antenna circuit pattern for etching is formed on a substrate in which the core film and copper foil are integrated. Manufacturing process has been performed.

However, the method of integrating the copper coil directly on the substrate requires the difficulty of mass production in manufacturing and expensive equipment, and the process of joining a copper plate or a lead plate as a medium for electrically connecting the coil to the IC chip. there was.

In addition, in the case of using copper foil etching, it is difficult to manufacture inlays in which the intervals of the circuit patterns are precisely maintained, and thus, a short phenomenon occurs in which the intervals of the final inlay circuit patterns change or overlap each other.

In particular, according to the prior art, a separate additional process for implementing the connection portion of the IC chip of the circuit pattern, that is, the conductive portion is required, and there is a problem in that mass productivity is lowered during inlay manufacturing.

In addition, PVC film or PET film, which is generally used as a core film of a smart card, is weak to heat, so that a large-area substrate film shrinks and deforms when the printed ink or paste is sufficiently cured after implementing an antenna circuit directly on the film. There was this.

Accordingly, there is a need for a method of manufacturing an RF antenna embedded inlay having a precise structure in a simpler process.

An object of the present invention is to provide an RF antenna-embedded inlay manufacturing method capable of preventing the substrate film from being deformed by using a metal substrate to which a printing method with excellent mass productivity is applied.

In addition, since the present invention uses a metal substrate having a release layer formed thereon, the antenna pattern can be cured on the metal substrate without deformation and shrinkage of the antenna circuit after printing the antenna pattern, and the bonding and curing processes of the conductive plate can be stably performed. It is an object of the present invention to provide a method for manufacturing an embedded RF antenna inlay.

In addition, an object of the present invention is to provide an RF antenna-embedded inlay manufacturing method capable of preventing a short phenomenon in which the intervals of the inlay circuit patterns change or overlap each other by precisely maintaining the intervals of the circuit patterns.

According to an embodiment of the present invention, a method of manufacturing an embedded RF antenna inlay for manufacturing a smart card, comprising: forming a release layer on a metal substrate; Forming a plurality of pattern circuits by screen printing a predetermined pattern with a conductive conductive material on a release layer formed on a metal substrate; Forming an insulating part in a predetermined space among the plurality of pattern circuit parts; Forming a jump line on the insulator to electrically connect the plurality of pattern circuits disconnected by the insulator; Forming a conductive plate in a predetermined space among the plurality of pattern circuit units; Bonding a core film layer on the release layer on which the plurality of pattern circuit parts are formed; And separating the core film layer from the metal substrate to transfer the plurality of pattern circuits to the core film layer.

In this case, the plurality of pattern circuit parts include a first pattern circuit part wound along an edge of the peeling layer surface and a second pattern circuit part formed inside the first pattern circuit part on the peeling layer surface. The first external pad and the first conductive plate base may be formed at both ends of the first pattern circuit part, respectively, and the second external pad and the second conductive plate base may be formed at both ends of the second pattern circuit part.

In this case, the first conductive plate base and the second conductive plate base are preferably formed with a first conductive plate and a second conductive plate, respectively.

In this case, it is preferable that the insulation portion is formed in a space between the first external pad and the second external pad, and the jump line passes through the insulation portion to electrically connect the first external pad and the second external pad.

In addition, the present invention comprises the steps of adhesively forming the plurality of pattern circuit portion transferred to the coverlay layer; Exposing at least a portion of the first conductive plate and the second conductive plate by milling a portion of the coverlay layer; Disposing an RFID IC chip electrically connected to the first conductive plate and the second conductive plate, respectively, in the milled region of the coverlay layer.

At this time, the release layer is preferably formed of a hot melt liquid.

In addition, the present invention is a core film layer; A first pattern circuit part wound along an edge of the core film layer surface; A second pattern circuit part formed inside the first pattern circuit part on the surface of the core film layer; A first conductive plate formed at one end of the first pattern circuit portion; A first external pad formed at the other end of the first pattern circuit portion; A second conductive plate formed at one end of the second pattern circuit portion; A second external pad formed at the other end of the second pattern circuit portion; An insulation part formed in a space between the first external pad and the second external pad; And a jump line formed on the insulation to electrically connect between the first external pad and the second external pad.

In addition, the present invention is preferably a 13.56MHz smart card, characterized in that using the RF antenna built-in inlay.

According to the present invention, it is possible to conveniently and quickly produce a built-in inlay and a card including the same by forming a RF antenna by a printing method using a metal substrate and transferred to a core film.

In particular, by forming the release layer on the surface of the metal substrate, the printed antenna circuit portion and the inlay integral such as the conductive plate, the insulation portion and the jump line can be transferred to the core film layer.

Therefore, the indirect printing method of the RF antenna circuit can increase productivity and solve the heat deformation problem of the core film due to curing.

1 is a plan view illustrating an antenna pattern configuration on a peeling layer of a metal substrate for manufacturing an RF antenna embedded inlay according to an embodiment of the present invention;
2A is a cross-sectional view illustrating an antenna pattern configuration on a peeling layer of a metal substrate for manufacturing an RF antenna embedded inlay according to an embodiment of the present invention;
2B is a diagram in which a plurality of pattern circuits are printed on a metal substrate peeling layer;
3 to 5 are plan and cross-sectional views illustrating a step of manufacturing an RF antenna pattern circuit unit by printing a conductive material on the metal substrate peeling layer;
6 is a plan view showing an RF antenna circuit pattern portion;
7 and 8 are a plan view and a cross-sectional view showing the step of forming the insulating portion in the space between the plurality of pattern circuit portion;
9 and 10 are plan and cross-sectional views illustrating a step of forming a jump line connecting a plurality of pattern circuit units;
11 and 12 are plan views and cross-sectional views illustrating a step of forming a conductive plate of a plurality of pattern circuits;
13 and 14 are cross-sectional views illustrating a step of attaching and coalescing a core film on an RF antenna circuit pattern top;
15 and 16 are cross-sectional views illustrating a step in which an RF antenna circuit pattern is transferred to a core film separated from a metal substrate;
17 is a cross-sectional view showing a step of forming a coverlay layer on an RF antenna circuit pattern;
18 and 19 are plan views showing the step of attaching the RFID IC chip.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In addition, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art, the following examples may be modified in various other forms, the scope of the present invention Is not limited to the following examples.

1 and 2A are views showing the configuration of a metal substrate used in the RF antenna manufacturing method according to an embodiment of the present invention.

1 and 2A, a release layer 110 is formed on a surface of the metal substrate 100.

Metal substrate 100 can be used in various ways, for example, the surface is smooth like a mirror and the thickness can be used SUS substrate in the range of 0.5 ~ 2㎜. In contrast, the metal substrate 100 may be made of a material such as a copper plate, a brass plate, etc., which has a smooth surface and withstands heat and pressure.

In the present invention, the release layer 110 is an adhesive of a polymer coated with an adhesive liquid formed on the surface of the metal substrate 100, and the release layer 110 is dried by coating a thin liquid hot melt adhesive solution on the metal substrate 100. Can be used. The aqueous adhesive liquid of the liquid hot melt component may form the release layer 110 on the metal substrate 100 uniformly and thinly using a spray method or a screen mesh.

At this time, the release layer 110 is required to uniformly coat the surface of the metal substrate 100 uniformly. In this embodiment, the coating thickness of the release layer 110 was formed to a thickness of 10 ~ 30㎛ range. As the coating surface of the release layer 110 is uniform, uniformity of the printed pattern may be secured.

In addition, in order to separate the release layer 110 from the metal substrate 100 after the transfer, a property of not having adhesion with a metal at a high temperature (130 ° C. or more) is very important. When the liquid hot melt liquid is applied in an aqueous series, the drying time is shortened and the working environment is also good.

A plurality of pattern circuits are formed on the release layer 110 formed on the metal substrate 100 by screen printing a predetermined pattern with a conductive conductive material.

As shown in FIGS. 1 and 2A, the plurality of pattern circuit parts may be wound along the edges of the surface of the peeling layer 110, and the first pattern circuit part may be formed on the surface of the first pattern circuit part 120 and the peeling layer 110. And a second pattern circuit part 130 formed inside the 120. In this case, the first pattern circuit part 120 means a screen printed part on the release layer 110 of the metal substrate, and the second pattern circuit part 130 is a screen printed part on the release layer 110 of the metal substrate. Means.

3 and 4, a first external pad 122 and a first conductive plate base 121 are formed at both ends of the first pattern circuit unit 120, respectively, and both ends of the second pattern circuit unit 130. The second outer pad 132 and the second conducting plate base 131 are formed in each.

2B shows a state in which a plurality of RF antenna circuits are screen printed on a release layer of a metal substrate.

At this time, the metal substrate 100 serves as a kind of frame, that is, a planar mold for printing a plurality of circuit patterns of the RF antenna. That is, a conductive material is printed on the first pattern circuit part 120 and the second pattern circuit part 130, and is manufactured in a shape corresponding to a circuit pattern mounted on a conventional RF antenna. That is, by using the screen printing method on the metal substrate, it is possible to efficiently produce a plurality of circuit patterns.

The print job is preferably made of a conductive material using a screen pattern mask. The conductive material uses a metal paste made of a metal such as copper. Specifically, in the case of silver paste, a plurality of antenna circuit patterns can be easily formed by screen mesh printing. As for hardening temperature, 100 to 130 degreeC, and drying time are 5 minutes-about 30 minutes are preferable. The thickness of the printed circuit is preferably about 20 to 60 µm, but can be determined by measuring the electrical resistance of the entire circuit. In the case of a three-wound antenna circuit made of copper coils according to the prior art, the resistance value is 2.0 to 2.5 kΩ.

4 and 5 are cross-sectional views illustrating a state in which printing and drying of the antenna circuit formed on the release layer on the metal substrate are completed.

4 is a cross-sectional view illustrating a cross section taken along a line C-D of the metal substrate 100 of FIG. 3, and FIG. 5 is a cross-sectional view illustrating a cross section taken along an E-F line of the metal substrate 100 of FIG. 3. The overall schematic diagram of the unit antenna circuit has the form shown in FIG.

As shown in FIGS. 4 to 6, the first pattern circuit part 120 is formed to be wound along the edge of the metal substrate peeling layer 110, and the second pattern circuit part 130 is the first pattern circuit part 120. The inner side of the first pattern circuit unit 120 may have a predetermined distance from the first pattern circuit unit 120.

As shown in FIG. 7, an insulating part is formed in a predetermined space among the plurality of pattern circuit parts.

As shown in FIG. 7, the first pattern circuit unit between the first external pad 122 and the second external pad 132 to form a jump line between the first external pad 122 and the second external pad 132. A portion of the 120 is coated with the insulation 300.

FIG. 8 illustrates a cross section of the insulating part 300 formed between the first external pad 122 and the second external pad 132. The insulating part 300 may be generally made of an electrical insulating material and may proceed to a printing process using a screen mask to coat the plurality of insulating parts. In the present invention, a liquid hot melt liquid used for forming the release layer was used.

As shown in FIG. 9, a jump line 400 is formed on the insulating part 300 to electrically connect a plurality of pattern circuit parts cut by the insulating part 300.

As shown in FIG. 9, after the insulating part 300 is printed, a part of the first pattern circuit part 120 between the first external pad 122 and the second external pad 132 is insulated from each other. Implement the electrical jump line 400 across. The first external pad 122 and the second external pad 132 are electrically connected by the jump line 400 to complete the loop shape of the entire RF antenna. The material commonly used for implementing the jump line may use the same conductive material used for printing the first pattern circuit unit 120 and the second pattern circuit unit 130 or may use a copper wire.

The printing method uses a screen mask to simultaneously implement a plurality of jump lines as in the insulation 300.

10 is a cross-sectional view after the jump line 400 is formed. As shown in FIG. 10, the region of the jump line 400 is convex in the region between the first outer pad 122 and the second outer pad 132 due to the multilayer structure of the insulation unit 300 and the jump line 400. There may be a phenomenon. At this time, if the overall thickness is managed to 80㎛ or less does not matter at all in the final smart structure.

As illustrated in FIG. 11, a conductive plate is formed in a predetermined space among the plurality of pattern circuit units. In order to form a final smart card inlay, the conductive plate 500 is formed on the first conductive plate base 121 and the second conductive plate base 131, respectively. 12 illustrates a cross-sectional structure in which the first conductive plate 500 and the second conductive plate 500 are bonded to each other. The material of the conductive plate is copper or lead plate with a thickness of 30 ~ 60㎛ range. The bonding method is bonded with a glue type conductive adhesive.

In this process, a plurality of RF antenna patterns are completed on the release layer 110 of the metal substrate 100.

Next, as shown in FIG. 13, the core film layer 600 is bonded to the release layer 110 on the metal substrate 100.

As shown in FIG. 13, the core film 600 includes an adhesive layer 610. Referring to the bonding process to be combined in detail, first, an adhesive is coated on the surface of the separately provided core film 600 to form an adhesive layer 210. Core film is PVC film or PET film is used and the film thickness is used in the range of 100 ~ 150㎛. The adhesive material may be coated by using the same liquid hot melt adhesive liquid used to form the release layer and printing by screen mesh on one surface of the core film.

Accordingly, the core film layer 600 and the metal substrate 100 are bonded to each other so that the formed adhesive layer 610 faces the surface of the release layer 110.

Specifically, in the bonding process, the polyester-based hot melt liquid of the core film 600 is combined with the release layer 110 according to a heating and pressing process, wherein the RF antenna circuit portion, the insulation portion, the jump line, and the conduction plate are formed on the release layer. The integral body of the back is transferred to the adhesive layer 610 of the core film.

The core film 600 may be made of various materials such as paper, metal, rubber, etc., in addition to a plastic material commonly used for an RFID tag or a card, that is, PVC or PET film.

Meanwhile, the bonding process of the core film 600 may be performed through a hot press facility. As a condition of the hot press process, the temperature is generally preferably in the range of 130 to 150 ° C. The pressure and time to be applied can be determined as the working conditions according to the type of core film, the thickness of the circuit portion, the material and the like. Since the material of the core film used is a polymer film, it is necessary to cool and separate slowly enough to separate the metal substrate and the core film after bonding. Rapid separation can shrink the transferred core film and deform the RF antenna circuit.

In FIG. 13, the first outer pad 122 and the second pad in a state of being bonded to the metal substrate to bond the core film 600 and the release layer 110 on the metal substrate 100 by the adhesive layer 610 are illustrated. 132 shows a cross-sectional view of the region. FIG. 14 illustrates a first conductive plate 500 and a second conductive plate coupled to the metal substrate to bond the core film 600 and the release layer 110 on the metal substrate 100 by the adhesive layer 610. 500) shows a cross-sectional view of the region.

As shown in FIG. 15, after the release layer 110 of the metal substrate 100 is bonded to the adhesive layer 610 of the core film 600, the core film 600 is moved to the metal substrate after a predetermined time elapses. Separate from (100).

In this process, the pattern circuit portions formed on the surface of the release layer 110 are transferred onto the core film layer 600.

FIG. 15 is a cross-sectional view of a configuration on the core film layer 600 which transfers the areas of the first outer pad 122 and the second outer pad 132. FIG. 16 is a view showing a cross section of the configuration on the core film layer 600 which transfers the areas of the first conductive plate and the second conductive plate 500.

The circuit pattern manufactured in this manner may be a circuit pattern used for an 13.56 MHz RF antenna tag, and the final RFID antenna manufactured according to this may be an inlay for a 13.56 MHz smart card.

In general, as shown in FIG. 17, a smart card inlay is formed with a plurality of RF antenna pattern circuit parts formed on the core film layer 600 and then a coverlay film 700 covering the pattern circuit parts is incorporated. It is preferable that the coverlay film 700 of the inlay is made of the same material and thickness as the core film 600 according to the quality and size of the appearance of the card. The adhesive used in the coalescing process of the coverlay film 700 uses the same liquid hot melt liquid as the release layer 110 and the adhesive 610 of the core film. The coalescence method is carried out in a hot press facility, and the same conditions as the transfer conditions of the core film.

Since the core film 600 and the coverlay film 700 correspond to the inlay appearance of the RF antenna, each material may be made of a material that does not cause a problem in a subsequent process of the smart card. Generally, PVC film is used for a general combination card, and PET film is used for a high pass card.

In addition, the core film 600 and the coverlay film 700 is integrated with the overlay film 800 on each outer layer using an adhesive in the card process. The type of adhesive may be the same as the adhesive layer 610 described above, or may use a different adhesive.

In the card manufacturing process, as shown in FIG. 18, an exposed portion 710 is formed in one region of the coverlay film 700 and the overlay film 800 of the inlay. The exposed portion 710 is formed through a milling process to an appropriate size and position so that at least a portion of each of the first conductive plate and the second conductive plate 500 embedded in the inlay can be exposed.

Next, as illustrated in FIG. 19, the smart card IC chip is disposed in the exposed part 710.

The RFID chip is electrically connected to each of the first conductive plate and the second conductive plate 500 exposed through the exposed part 710. Thus, the production of the smart card is completed.

On the other hand, after the IC chip is disposed, the surface treatment such as coating the transparent film may be performed.

Through this, the RF antenna is formed by a printing method using a metal substrate, and a built-in inlay transferred to a core film and a card including the same can be manufactured quickly and conveniently.

While the above has been shown and described with respect to preferred embodiments of the invention, the invention is not limited to the specific embodiments described above, it is usually in the technical field to which the invention belongs without departing from the spirit of the invention claimed in the claims. Various modifications can be made by those skilled in the art, and these modifications should not be individually understood from the technical spirit or the prospect of the present invention.

100: metal substrate
110: release layer
120: first pattern circuit portion
130: second pattern circuit portion
300: insulation
400: jump line
500: conduction plate
600: core film
700: coverlay film
800: overlay film

Claims

In the method for manufacturing an RF antenna embedded inlay for manufacturing a smart card,
Forming a release layer on the metal substrate;
Forming a plurality of pattern circuits by screen printing a predetermined pattern with a conductive conductive material on a release layer formed on a metal substrate;
Forming an insulating part in a predetermined space among the plurality of pattern circuit parts;
Forming a jump line on the insulator to electrically connect the plurality of pattern circuits disconnected by the insulator;
Forming a conductive plate in a predetermined space among the plurality of pattern circuit units;
Bonding a core film layer on the release layer on which the plurality of pattern circuit parts are formed;
Separating the core film layer from the metal substrate and transferring the plurality of pattern circuits to the core film layer;
RF antenna embedded inlay manufacturing method comprising a.

The method of claim 1,
The plurality of pattern circuits,
A first pattern circuit part wound along an edge of the release layer surface and a second pattern circuit part formed inside the first pattern circuit part on the release layer surface;
RF antennas, wherein first and second conductive pad bases are formed at both ends of the first pattern circuit part, respectively, and second and second conductive pad bases are formed at both ends of the second pattern circuit part. Embedded Inlay Manufacturing Method.

The method of claim 2,
The first conductive plate base and the second conductive plate base is an RF antenna embedded inlay manufacturing method, characterized in that the first conductive plate and the second conductive plate are formed respectively.

The method of claim 3,
The insulation part is formed in a space between the first external pad and the second external pad, the jump line passes through the insulation to electrically connect the first external pad and the second external pad, RFID antenna embedded type Inlay manufacturing method.

The method according to claim 3 or 4,
Adhesively forming the plurality of transferred pattern circuit parts as a coverlay layer;
Exposing at least a portion of the first conductive plate and the second conductive plate by milling a portion of the coverlay layer;
Disposing an RFID IC chip in the milled area of the coverlay layer, the RFID IC chip being electrically connected to the first conductive plate and the second conductive plate, respectively;
RF antenna embedded inlay manufacturing method characterized in that it further comprises.

5. The method according to any one of claims 1 to 4,
The release layer is RF antenna embedded inlay manufacturing method, characterized in that formed by hot melt liquid.

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