CN102938088A - Washable flexible electronic label and manufacturing process thereof - Google Patents
Washable flexible electronic label and manufacturing process thereof Download PDFInfo
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- CN102938088A CN102938088A CN2012100859139A CN201210085913A CN102938088A CN 102938088 A CN102938088 A CN 102938088A CN 2012100859139 A CN2012100859139 A CN 2012100859139A CN 201210085913 A CN201210085913 A CN 201210085913A CN 102938088 A CN102938088 A CN 102938088A
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Abstract
The invention relates to a washable flexible electronic label and a manufacturing process thereof. The washable flexible electronic label comprises a radio frequency identification (RFID) chip, a bearing substrate, an etching layer, a first adhesive layer, release paper, a second adhesive layer, a polyethylene terephthalate (PET) film and a resin ink layer, the etching layer is formed by subjecting a copper foil or an aluminum foil to etching processing, the RFID chip, the bearing substrate and the etching layer form a core material component, the bearing substrate is connected with the release paper through the first adhesive layer, and the RFID chip is sequentially connected with the PET film and the resin ink layer through the second adhesive layer. The manufacturing process includes the steps of exposing to form an etching antenna, forming the core material component, compositing the PET film and coating the resin ink layer. Accordingly, the electronic label has the advantage of being resistant to high temperature, scrubbing and acid and alkali.
Description
Technical field
The present invention relates to the RFID of Internet-of-things field, relate in particular a kind of water-fastness flexible electronic label and manufacturing process thereof.
Background technology
Electronic tag claims again RFID tag and radio-frequency (RF) tag, mainly is made of the large-scale integrated circuit chip and the dual-mode antenna that have cognizance code, is mainly at present passive type, and the electric energy during use is taken from the radio wave energy that dual-mode antenna receives; This electronic tag is specifically realized mutually intercommunication with radio frequency identification read-write equipment and corresponding information service system, such as the networking of advancing to deposit pin system etc.This electronic tag and traditional bar code (Barcode) technology compare mutually, and that electronic tag has is long than multicapacity, communication distance as holding, be difficult to copy, environmental change is had higher suffertibility and can read simultaneously the advantage such as a plurality of labels.
Electronic Tag Structure consists essentially of radio frequency chip, antenna and encapsulating material, and wherein packing forms and encapsulating material are the factors that determines electronic tag range of application and performance performance most critical.Current, the flexible electronic label of common packing forms generally all is to adopt to encapsulate such as materials such as papery, PET, silica gel, ABS engineering plastics, PVC, PPS plastics and flax, be that it is unable to cope with such as the strong acid such as high temperature, laundry, highly basic rugged surroundings, thereby have the narrow defective of applicable surface.
In view of this, the inventor has this case to produce for the defects further investigation of existing electronic tag then.
Summary of the invention
The first purpose of the present invention is to provide a kind of water-fastness flexible electronic label, can't the cope with bad environment to solve in the prior art electronic tag, thus have the narrow defective of applicable surface.
In order to reach above-mentioned purpose, solution of the present invention is:
A kind of water-fastness flexible electronic label, wherein, comprise RFID chip, supporting substrate, etch layer, the first glue-line, release liners, the second glue-line, PET mylar and resin ink lay, this etch layer is that Copper Foil or aluminium foil are through etch process and moulding, this RFID chip, supporting substrate and etch layer consist of the core material assembly together, this supporting substrate also is connected with release liners by the first glue-line, and this RFID chip then links to each other with PET mylar and resin ink lay successively by the second glue-line.
What further, this first glue-line adopted is pressure sensitive adhesive; This second glue-line is selected from one or more in modified resin, polyacrylate, inferior gram glue or the silica gel; This supporting substrate is selected from PI film or PET film.
The second purpose of the present invention is to provide a kind of manufacturing process of water-fastness flexible electronic label, wherein, comprises the steps:
1., select aluminium foil or Copper Foil, and carry out compoundly with supporting substrate behind the coated glue layer thereon, and form composite base material;
2., form the photosensitive type compound substance at the aluminium foil of composite base material or above the Copper Foil;
3., will need etched antenna pattern to make film egative film, adopt exposure method, the wire portion line transitions to the photosensitive type compound substance, is formed etching antenna;
4., the RFID chip is fixed on above the etching antenna and forms the core material assembly;
5., coat the second glue-line at the core material assembly, PET mylar and on compound on the second glue-line;
6., on the PET mylar, form one deck resin ink lay in coating;
7., to supporting substrate coated on one side the first glue-line on the electronic tag material of above-mentioned coated resin ink lay, and compound upper release liners.
Further, this photosensitive type compound substance is photosensitive type dry film material, photosensitive type wet film material or photosensitive type dielectric ink material.
Further, this supporting substrate is selected from PI film or PET film.
Further, the glue-line between this Copper Foil or aluminium foil and the supporting substrate is selected one or more of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue.
Further, this step 2. in formation between photosensitive type compound substance and aluminium foil or the Copper Foil adopt volume to volume to fit, this step 3. in exposure then be that employing volume to volume exposure machine exposes.
Further, the thickness of this aluminium foil or Copper Foil is selected 9～38um, and the thickness of this supporting substrate then is chosen as 12～200um.
What further, this first glue-line adopted is pressure sensitive adhesive.
Further, this second glue-line is selected from one or more in modified resin, polyacrylate, inferior gram glue or the silica gel.
After adopting said structure, a kind of water-fastness flexible electronic label and the manufacturing process thereof that the present invention relates to because it has adopted supporting substrate, glue-line and aluminium foil or Copper Foil in making forming process, thereby have been guaranteed the implementation condition of etch process; Simultaneously owing to having adopted the mode that forms photosensitive type compound substance and exposure to realize line transitions, then again by etched technique, the like this so that etching accuracy tolerance that is formed on circuit on the etch layer on supporting substrate and the glue-line ± 0.02mm and/or circuit end points minimum spacing≤0.12mm; Moreover the present invention is also by arranging the second glue-line, PET mylar and resin ink lay, thereby so that the present invention has high temperature resistant, anti-washing by rubbing with the hands and the characteristics of resistance to acids and bases.
Description of drawings
Fig. 1 is the cut-open view of a kind of water-fastness flexible electronic label that the present invention relates to.
Among the figure:
PET mylar 5 resin ink laies 6.
Embodiment
In order further to explain technical scheme of the present invention, the present invention will be described in detail below by specific embodiment.
As shown in Figure 1, a kind of water-fastness flexible electronic label 100 that the present invention relates to comprises RFID chip 11, supporting substrate 12, etch layer 13, the first glue-line 2, release liners 3, the second glue-line 4, PET mylar 5 and resin ink lay 6; More specifically, this supporting substrate 12 also is coated with one deck glue at supporting substrate 12 before with etch layer 13 combinations, thereby plays the effect that both are bonded together.
This etch layer 13 for Copper Foil or aluminium foil through the etch process moulding, this RFID chip 11, supporting substrate 12 and etch layer 13 consist of core material assembly 1 together, this supporting substrate 12 also is connected with release liners 3 by the first glue- line 2, and 11 of this RFID chips pass through the second glue-line 4 and link to each other successively with PET mylar 5 and resin ink lay 6.What more specifically, this first glue-line 2 adopted is pressure sensitive adhesive; This second glue-line 4 is selected from one or more in modified resin, polyacrylate, inferior gram glue or the silica gel; 12 of this supporting substrates are selected from PI film or PET film.
In order to allow the water-fastness flexible electronic label 100 that the present invention relates to can be by fully open, the present invention also provides a kind of manufacturing process of water-fastness flexible electronic label 100, and the below is described in detail with its preferred embodiment.
Embodiment one:
This manufacturing process comprises the steps:
1., to select thickness be the aluminium foil of 9～38um, and to be that the supporting substrate 12 of 12～200um carries out compound with thickness behind the coated glue layer thereon, and form composite base material; Concrete, this glue-line can be selected one or more of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue;
2., form the photosensitive type compound substance at the aluminium foil of composite base material or above the Copper Foil; This photosensitive type composite material by adopting photosensitive type dry film material, it can also be substituted by photosensitive type wet film material or photosensitive type dielectric ink material certainly;
3., will need etched antenna pattern to make film egative film, adopt exposure method, the wire portion line transitions to the photosensitive type compound substance, is formed etching antenna;
4., RFID chip 11 is fixed on above the etching antenna and forms core material assembly 1; Specifically it is to be undertaken by the mode of a glue and binding;
5., coat the second glue-line 4 at core material assembly 1, PET mylar 5 and on compound on the second glue-line 4;
6., on PET mylar 5, form one deck resin ink lay 6 in coating;
7., to supporting substrate 12 coated on one sides the first glue-line 2 on electronic tag 100 materials of above-mentioned coated resin ink lay 6, and compound upper release liners 3.
Need to prove that in the present embodiment, this supporting substrate 12 can be selected from PI film or PET film; What this first glue-line 2 adopted is pressure sensitive adhesive; This second glue-line 4 is selected from one or more in modified resin, polyacrylate, inferior gram glue or the silica gel.
Embodiment two:
The step of present embodiment and the first embodiment is basic identical, and its difference is to adopt Copper Foil to substitute aluminium foil among the first embodiment.
Embodiment three:
In the present embodiment, it can adopt whole schemes of the first embodiment and the second embodiment, but it is in order to reach the purpose of enhancing productivity, 3. 2. it all improve with abovementioned steps abovementioned steps, concrete, this step 2. in formation between photosensitive type compound substance and aluminium foil or the Copper Foil adopt volume to volume to fit, this step 3. in exposure then be that employing volume to volume exposure machine exposes.
In sum, a kind of water-fastness flexible electronic label 100 and the manufacturing process thereof that the present invention relates to because it has adopted supporting substrate 12, glue-line and aluminium foil or Copper Foil in making forming process, thereby have been guaranteed the implementation condition of etch process; Simultaneously owing to having adopted the mode that forms photosensitive type compound substance and exposure to realize line transitions, then again by etched technique, the like this so that etching accuracy tolerance that is formed on circuit on the etch layer 13 on supporting substrate 12 and the glue-line ± 0.02mm and/or circuit end points minimum spacing≤0.12mm; Moreover the present invention is also by arranging the second glue-line 4, PET mylar 5 and resin ink lay 6, thereby so that the present invention has high temperature resistant, anti-washing by rubbing with the hands and the characteristics of resistance to acids and bases, specifically it can anti-50-160 ℃ high temperature, and ability is washed by rubbing with the hands more than 300 times.
Above-described embodiment and graphic and non-limiting product form of the present invention and style, any person of an ordinary skill in the technical field all should be considered as not breaking away from patent category of the present invention to its suitable variation or modification of doing.
Claims (10)
1. water-fastness flexible electronic label, it is characterized in that, comprise RFID chip, supporting substrate, etch layer, the first glue-line, release liners, the second glue-line, PET mylar and resin ink lay, this etch layer is that Copper Foil or aluminium foil are through etch process and moulding, this RFID chip, supporting substrate and etch layer consist of the core material assembly together, this supporting substrate also is connected with release liners by the first glue-line, and this RFID chip then links to each other with PET mylar and resin ink lay successively by the second glue-line.
2. a kind of water-fastness flexible electronic label as claimed in claim 1 is characterized in that, what this first glue-line adopted is pressure sensitive adhesive; This second glue-line is selected from one or more in modified resin, polyacrylate, inferior gram glue or the silica gel; This supporting substrate is selected from PI film or PET film.
3. the manufacturing process of a water-fastness flexible electronic label is characterized in that, comprises the steps:
1., select aluminium foil or Copper Foil, and carry out compoundly with supporting substrate behind the coated glue layer thereon, and form composite base material;
2., form the photosensitive type compound substance at the aluminium foil of composite base material or above the Copper Foil;
3., will need etched antenna pattern to make film egative film, adopt exposure method, the wire portion line transitions to the photosensitive type compound substance, is formed etching antenna;
4., the RFID chip is fixed on above the etching antenna and forms the core material assembly;
5., coat the second glue-line at the core material assembly, PET mylar and on compound on the second glue-line;
6., on the PET mylar, be coated with again formation one deck resin ink lay;
7., to supporting substrate coated on one side the first glue-line on the electronic tag material of above-mentioned coated resin ink lay, and compound upper release liners.
4. manufacturing process as claimed in claim 3 is characterized in that, this photosensitive type compound substance is photosensitive type dry film material, photosensitive type wet film material or photosensitive type dielectric ink material.
5. manufacturing process as claimed in claim 3 is characterized in that, this supporting substrate is selected from PI film or PET film.
6. manufacturing process as claimed in claim 3, it is characterized in that the glue-line between this Copper Foil or aluminium foil and the supporting substrate is selected one or more of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue.
7. manufacturing process as claimed in claim 3 is characterized in that, this step 2. in formation between photosensitive type compound substance and aluminium foil or the Copper Foil adopt volume to volume to fit, this step 3. in exposure then be that employing volume to volume exposure machine exposes.
8. manufacturing process as claimed in claim 3 is characterized in that, the thickness of this aluminium foil or Copper Foil is selected 9～38um, and the thickness of this supporting substrate then is chosen as 12～200um.
9. manufacturing process as claimed in claim 3 is characterized in that, what this first glue-line adopted is pressure sensitive adhesive.
10. manufacturing process as claimed in claim 3 is characterized in that, this second glue-line is selected from one or more in modified resin, polyacrylate, inferior gram glue or the silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100859139A CN102938088A (en) | 2012-03-28 | 2012-03-28 | Washable flexible electronic label and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100859139A CN102938088A (en) | 2012-03-28 | 2012-03-28 | Washable flexible electronic label and manufacturing process thereof |
Publications (1)
| Publication Number | Publication Date |
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| CN102938088A true CN102938088A (en) | 2013-02-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100859139A Pending CN102938088A (en) | 2012-03-28 | 2012-03-28 | Washable flexible electronic label and manufacturing process thereof |
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| CN (1) | CN102938088A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107220688A (en) * | 2017-05-22 | 2017-09-29 | 永道无线射频标签(扬州)有限公司 | Flexible water-washing label and its manufacture craft |
| CN107451649A (en) * | 2017-08-02 | 2017-12-08 | 辽宁弗佰克高新材料有限公司 | Electronic tag and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1316081A (en) * | 1999-06-29 | 2001-10-03 | 索尼化学株式会社 | IC card |
| CN101140634A (en) * | 2007-10-26 | 2008-03-12 | 上海中京电子标签集成技术有限公司 | RFID wash clothes label and antenna matching property design method thereof |
| WO2008132287A1 (en) * | 2007-04-26 | 2008-11-06 | Confidex Oy | Rfid tag |
| CN101837668A (en) * | 2010-03-20 | 2010-09-22 | 厦门市英诺尔电子科技有限公司 | Electrostatic prevention temperature-resistant marking material and manufacturing method thereof |
| CN202523097U (en) * | 2012-01-11 | 2012-11-07 | 厦门英诺尔电子科技股份有限公司 | Washable flexible electronic label |
-
2012
- 2012-03-28 CN CN2012100859139A patent/CN102938088A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1316081A (en) * | 1999-06-29 | 2001-10-03 | 索尼化学株式会社 | IC card |
| WO2008132287A1 (en) * | 2007-04-26 | 2008-11-06 | Confidex Oy | Rfid tag |
| CN101140634A (en) * | 2007-10-26 | 2008-03-12 | 上海中京电子标签集成技术有限公司 | RFID wash clothes label and antenna matching property design method thereof |
| CN101837668A (en) * | 2010-03-20 | 2010-09-22 | 厦门市英诺尔电子科技有限公司 | Electrostatic prevention temperature-resistant marking material and manufacturing method thereof |
| CN202523097U (en) * | 2012-01-11 | 2012-11-07 | 厦门英诺尔电子科技股份有限公司 | Washable flexible electronic label |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107220688A (en) * | 2017-05-22 | 2017-09-29 | 永道无线射频标签(扬州)有限公司 | Flexible water-washing label and its manufacture craft |
| CN107220688B (en) * | 2017-05-22 | 2021-05-07 | 永道射频技术股份有限公司 | Flexible water washing label and manufacturing process thereof |
| CN107451649A (en) * | 2017-08-02 | 2017-12-08 | 辽宁弗佰克高新材料有限公司 | Electronic tag and preparation method thereof |
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| PB01 | Publication | ||
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Application publication date: 20130220 |