CN202523097U

CN202523097U - Washable flexible electronic label

Info

Publication number: CN202523097U
Application number: CN201220010719XU
Authority: CN
Inventors: 李金华
Original assignee: XIAMEN INNOV ELECTRONIC TECHNOLOGY Co Ltd
Current assignee: XIAMEN INNOV ELECTRONIC TECHNOLOGY Co Ltd
Priority date: 2012-01-11
Filing date: 2012-01-11
Publication date: 2012-11-07
Anticipated expiration: 2022-01-11

Abstract

The utility model relates to a washable flexible electronic label, which comprises an RFID chip, a bearing substrate, an etching layer, a first adhesive layer, a release paper, a second adhesive layer, a PET polyester film and a resin printing ink layer. The etching layer is molded by copper foil or aluminum foil through an etching process. The RFID chip, the bearing substrate and the etching layer together make up a core material assembly. The bearing substrate is further connected with the release paper via the first adhesive layer, and the RFID chip is successively connected with the PET polyester film and the resin printing ink layer via the second adhesive layer. The electronic label provided by the utility model has the characteristics of high temperature resistance, washing resistance, and acid and alkali resistance.

Description

A kind of water-fast flexible electronic label of washing

Technical field

The utility model relates to the RFID of Internet-of-things field, relates to a kind of water-fast flexible electronic label of washing in particular.

Background technology

Electronic tag is claimed RFID tag and RF tag again, mainly is made up of the extensive integrated circuit chip and the dual-mode antenna that have cognizance code, is mainly passive type at present, and the electric energy during use is taken from the radio wave energy that dual-mode antenna receives; This electronic tag specifically is that and radio frequency identification read-write equipment and corresponding information service system is realized intercommunication mutually, such as the networking of advancing to deposit pin system etc.This electronic tag and traditional bar code (Barcode) technology compare each other, and that electronic tag has is long than multicapacity, communication distance as holding, be difficult to duplicate, environmental change is had higher suffertibility and can read advantage such as a plurality of labels simultaneously.

Electronic Tag Structure consists essentially of radio frequency chip, antenna and encapsulating material, and wherein packing forms and encapsulating material are the factors of decision electronic tag range of application and performance performance most critical.Current; The flexible electronic label of common packing forms generally all is to adopt to encapsulate like materials such as papery, PET, silica gel, ABS engineering plastics, PVC, PPS plastics and flax; Be that it is unable to cope with like strong acid such as high temperature, laundry, highly basic rugged surroundings, thereby have the narrow defective of applicable surface.

In view of this, the inventor has this case to produce to the above-mentioned defective further investigation of existing electronic tag then.

The utility model content

The purpose of the utility model is to provide a kind of water-fast flexible electronic label of washing, can't the cope with bad environment to solve in the prior art electronic tag, thus have the narrow defective of applicable surface.

In order to reach above-mentioned purpose, the solution of the utility model is:

A kind of water-fast flexible electronic label of washing; Wherein, Comprise RFID chip, supporting substrate, etch layer, first glue-line, release liners, second glue-line, PET mylar and resin ink lay; This etch layer is that Copper Foil or aluminium foil are through etch process and moulding; This RFID chip, supporting substrate and etch layer constitute the core material assembly together, and this supporting substrate also is connected with release liners through first glue-line, and this RFID chip then links to each other with PET mylar and resin ink lay through second glue-line successively.

What further, this first glue-line adopted is pressure sensitive adhesive; This second glue-line is selected from one or more in modified resin, polyacrylate, inferior gram glue or the silica gel; This supporting substrate is selected from PI film or PET film.

After adopting said structure, a kind of water-fast flexible electronic label and the manufacturing process thereof of washing that the utility model relates to because it has adopted supporting substrate, glue-line and aluminium foil or Copper Foil in making forming process, thereby guaranteed the implementation condition of etch process; Simultaneously owing to having adopted the mode that forms photosensitive type compound substance and exposure to realize line transitions; Then again through etched technology, the so feasible etching accuracy tolerance that is formed on circuit on the etch layer on supporting substrate and the glue-line ± 0.02mm and/or circuit end points minimum spacing≤0.12mm; Moreover the utility model is also through being provided with second glue-line, PET mylar and resin ink lay, thereby makes and the utlity model has high temperature resistant, anti-washing by rubbing with the hands and the characteristics of resistance to acids and bases.

Description of drawings

A kind of water-fast cut-open view of washing the flexible electronic label that Fig. 1 relates to for the utility model.

Among the figure:

Electronic tag 100 core material assemblies 1

RFID chip 11 supporting substrates 12

Etch layer 13 first glue-lines 2

Release liners 3 second glue-lines 4

PET mylar 5 resin ink laies 6.

Embodiment

In order further to explain the technical scheme of the utility model, come the utility model is set forth in detail through specific embodiment below.

A kind of water-fast flexible electronic label 100 of washing as shown in Figure 1, that the utility model relates to comprises RFID chip 11, supporting substrate 12, etch layer 13, first glue-line 2, release liners 3, second glue-line 4, PET mylar 5 and resin ink lay 6; More specifically, also on supporting substrate 12, be coated with one deck glue before this supporting substrate 12 combines with etch layer 13, thereby play the effect that both are bonded together.

This etch layer 13 for Copper Foil or aluminium foil through the etch process moulding; This RFID chip 11, supporting substrate 12 and etch layer 13 constitute core material assembly 1 together; This supporting substrate 12 also is connected with release liners 3 through first glue-

line

2, and 11 of this RFID chips pass through second glue-line 4 and link to each other successively with PET mylar 5 and resin ink lay 6.What more specifically, this first glue-line 2 adopted is pressure sensitive adhesive; This second glue-line 4 is selected from one or more in modified resin, polyacrylate, inferior gram glue or the silica gel; 12 of this supporting substrates are selected from PI film or PET film.

Can be open for the water-fast flexible electronic label 100 of washing that lets the utility model relate to by fully, the utility model also provides a kind of water-fast manufacturing process of washing flexible electronic label 100, sets forth in detail with its preferred embodiment below.

Embodiment one:

This manufacturing process comprises the steps:

1., to select thickness be the aluminium foil of 9～38um, and is coated with above that behind the glue-line that to be that the supporting substrate 12 of 12～200um carries out compound with thickness, and forms composite base material; Concrete, this glue-line can be selected one or more of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue for use;

2., form the photosensitive type compound substance at the aluminium foil of composite base material or above the Copper Foil; This photosensitive type composite material by adopting photosensitive type dry film material, it can also be substituted by photosensitive type wet film material or photosensitive type dielectric ink material certainly;

3., need process film egative film by etched antenna pattern, adopt exposure method, above wire portion line transitions to photosensitive type compound substance, form etching antenna;

4., RFID chip 11 is fixed on above the etching antenna and forms core material assembly 1; Specifically it is to carry out through the mode of a glue and binding;

5., on core material assembly 1, coat second glue-line 4, and on compound on second glue-line 4 PET mylar 5;

6., on PET mylar 5, form one deck resin ink lay 6 in coating;

7., supporting substrate on electronic tag 100 materials of above-mentioned coated resin ink lay 6 12 one side is coated with first glue-line 2, and the compound release liners 3 that goes up.

Need to prove that in the present embodiment, this supporting substrate 12 can be selected from PI film or PET film; What this first glue-line 2 adopted is pressure sensitive adhesive; This second glue-line 4 is selected from one or more in modified resin, polyacrylate, inferior gram glue or the silica gel.

Embodiment two:

The step of the present embodiment and first embodiment is basic identical, and its difference is to adopt Copper Foil to substitute the aluminium foil among first embodiment.

Embodiment three:

In the present embodiment; It can adopt whole schemes of first embodiment and second embodiment; But it is in order to reach the purpose of enhancing productivity, and 3. 2. it all improve with abovementioned steps abovementioned steps, concrete; Formation between the 2. middle photosensitive type compound substance of this step and aluminium foil or the Copper Foil adopts volume to volume to fit, and the 3. middle exposure of this step then is to adopt the volume to volume exposure machine to make public.

In sum, a kind of water-fast flexible electronic label 100 and the manufacturing process thereof of washing that the utility model relates to because it has adopted supporting substrate 12, glue-line and aluminium foil or Copper Foil in making forming process, thereby guaranteed the implementation condition of etch process; Simultaneously owing to having adopted the mode that forms photosensitive type compound substance and exposure to realize line transitions; Then again through etched technology, so make the etching accuracy tolerance that is formed on circuit on the etch layer 13 on supporting substrate 12 and the glue-line ± 0.02mm and/or circuit end points minimum spacing≤0.12mm; Moreover the utility model is also through being provided with second glue-line 4, PET mylar 5 and resin ink lay 6; Thereby make and the utlity model has high temperature resistant, anti-washing by rubbing with the hands and the characteristics of resistance to acids and bases; Concrete its can anti-50-160 ℃ high temperature, and ability is washed by rubbing with the hands more than 300 times.

Product form of the foregoing description and graphic and non-limiting the utility model and style, the those of ordinary skill of any affiliated technical field all should be regarded as not breaking away from the patent category of the utility model to its suitable variation or modification of doing.

Claims

1. water-fast flexible electronic label of washing; It is characterized in that; Comprise RFID chip, supporting substrate, etch layer, first glue-line, release liners, second glue-line, PET mylar and resin ink lay; This etch layer is that Copper Foil or aluminium foil are through etch process and moulding; This RFID chip, supporting substrate and etch layer constitute the core material assembly together, and this supporting substrate also is connected with release liners through first glue-line, and this RFID chip then links to each other with PET mylar and resin ink lay through second glue-line successively.

2. a kind of water-fast flexible electronic label of washing as claimed in claim 1 is characterized in that, what this first glue-line adopted is pressure sensitive adhesive; This second glue-line is selected from a kind of in modified resin, polyacrylate, inferior gram glue or the silica gel; This supporting substrate is selected from PI film or PET film.