CN102945503A - Fragile high-frequency RFID electronic label and manufacturing technology of electronic label - Google Patents
Fragile high-frequency RFID electronic label and manufacturing technology of electronic label Download PDFInfo
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- CN102945503A CN102945503A CN 201210007960 CN201210007960A CN102945503A CN 102945503 A CN102945503 A CN 102945503A CN 201210007960 CN201210007960 CN 201210007960 CN 201210007960 A CN201210007960 A CN 201210007960A CN 102945503 A CN102945503 A CN 102945503A
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Abstract
The invention discloses a fragile high-frequency RFID (radio frequency identification) electronic label and a manufacturing technology of the electronic label. The electronic label comprises an RFID chip, a bearing substrate, as well as first glue layers, etching layers, second glue layers and fragile paper layers that are arranged on the upper side and lower side of the bearing substrate in a laminating manner sequentially, wherein every etching layer is formed by etching copper foil or aluminum foil; the bearing substrate, the RIFD chip, the two first glue layers and the two etching layers together form a core material component; stamping holes are formed on the bearing substrate and the two first glue layers; the two etching layers are connected with each other by a jumper wire penetrating through the stamping holes on the bearing substrate and the two first glue layers; the fragile paper layers are bonded on the corresponding etching layers by the corresponding second glue layers; and the viscosity of the second glue layers is better than that of the first glue layers. The electronic label has the characteristics that the damage degree is high when the electronic label is torn off, and the electronic label is high in performance.
Description
Technical field
The present invention relates to the RFID of Internet-of-things field, relate in particular the frangible electronic tag of a kind of high-frequency RF ID and manufacturing process thereof, it is applicable to, and various needs are false proof, the RFID application scenario of tamper, especially become the high-grade products such as vehicle management, drinks, medicine, cosmetics and trace to the source and false proof ideal chose.
Background technology
Common frangible label is take frangible printing material as fabric, and the back side scribbles extraordinary Strong Adhesive, and its fabric fracture strength is far below the tackifier adhesive power; When uncovering after frangible label is sticked base material, the random fracture of material shows that the packing of product was opened, and can't restore again.But common frangible label mainly is to be made of the bar code that prints, and its information storage amount seldom and needs scanner to read one by one.
The RFID label has that volume is little, capacity is large, the life-span is long and the characteristics such as reusable, and it can support fast reading and writing, non-visual recognition, mobile identification, multiple goal identification, location and long-term follow to manage; The RFID technology combines with technology such as internet, communications, can realize item tracking and information sharing in the global range.In recent years, along with the development of the technology such as large scale integrated circuit, network service and information security, the RFID technology has entered the commercial applications stage.Because have the characteristics such as high-speed mobile object identification, multiple goal identification and contactless identification, the RFID technology demonstrates huge development potentiality and application space, is considered to one of the most rising infotech of 21 century.
At present along with country more and more payes attention to property safety, food security, drug safety etc., frangible security RFID electronic tag trace to the source with false proof above more and more important, replace common frangible label in increasing field.
But there is following defective at least the frangible false proof RFID label on the market in it:
One, the common technical scheme that adopts of existing frangible false proof RFID label, be with electrically conductive ink or metallic particles by serigraphy at the fragile paper material and above the PET base material, form printing RFID antenna, but because the printed antenna precision is low, the conductive materials resistive impedance is inconsistent, so can't make all the time high-quality RFID electronic tag, the scope of application is narrow;
Two, existing frangible antifalsification label often only is that part is damaged this label, namely be not fundamentally to damage this label, thereby it is inadequate to have damaged condition, and then has the poor shortcoming of antifalsification.
In view of this, the inventor has this case to produce for the defects further investigation of existing frangible security RFID electronic tag then.
Summary of the invention
The first purpose of the present invention is to provide the frangible electronic tag of a kind of high-frequency RF ID, and frangible electronic tag damaged condition when tearing to pieces has the poor defective of antifalsification not in the prior art to solve.
In order to reach above-mentioned purpose, solution of the present invention is:
The frangible electronic tag of a kind of high-frequency RF ID, wherein, comprise RFID chip, supporting substrate and both sides all are cascading about supporting substrate the first glue-line, etch layer, the second glue-line and frangible ply of paper, this each etch layer is Copper Foil or aluminium foil through etch process and moulding, this supporting substrate, RFID chip, two first glue-lines and two etch layers consist of the core material assembly together, all be formed with punching hole on this supporting substrate and two first glue-lines, be connected with each other by the wire jumper that connects punching hole on supporting substrate and two first glue-lines between this two etch layer; This each frangible ply of paper all is bonded on the corresponding etch layer by corresponding the second glue-line, and the viscosity of this second glue-line is better than the viscosity of the first glue-line.
Further, on this each etch layer the etching accuracy tolerance of circuit ± 0.02mm and/or circuit end points minimum spacing≤0.12mm.
Further, this supporting substrate is selected from PI film or PET film.
Further, this second glue-line is selected from one or more of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue; This first glue-line is selected from one or more of polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, acrylate pressure sensitive adhesive, silica gel.
The second purpose of the present invention is to provide a kind of high-frequency RF ID manufacturing process of frangible electronic tag, wherein, comprises the steps:
1., select supporting substrate, and descend both sides all to be coated with behind the first glue-line respectively thereon and carry out compoundly with aluminium foil or Copper Foil, and form two-sided composite base material;
2., on the two sides of two-sided composite base material, all form the photosensitive type compound substance;
3., will need etched antenna pattern to make film egative film, adopt double-faced exposure method, with the wire portion line transitions to the photosensitive type compound substance;
4., will expose that two-sided composite base material good and that post the photosensitive type compound substance develops, etching and stripping, so form the etching accuracy tolerance ± 0.02mm and/or end points minimum spacing≤0.12mm etching antenna;
5., two-sided etching antenna that above-mentioned etching is good, add drop stamping in the position that needs wire jumper and form punching hole, so that be interconnected between the circuit on two sides;
6., above-mentioned two-sided etching antenna and RFID chipset are fitted together, and make the core material assembly;
7., get frangible ply of paper, and be better than the second glue-line of the first glue-line in its one side coating viscosity; With etching antenna place surface recombination on the surface at the second glue-line place on the frangible ply of paper and the core material assembly and form the frangible electronic tag of high-frequency RF ID.
Further, the thickness of this aluminium foil or Copper Foil is selected 9～38um, and the thickness of this supporting substrate then is chosen as 12～200um, and this frangible ply of paper then is chosen as 30～100um.
Further, this photosensitive type compound substance is photosensitive type dry film material, photosensitive type wet film material or photosensitive type dielectric ink material.
Further, this supporting substrate is selected from PI film or PET film.
Further, this second glue-line is selected from one or more of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue.
Further, this step 2. in set-up mode between photosensitive type compound substance and aluminium foil or the Copper Foil adopt volume to volume to fit, this step 3. in exposure then be that employing volume to volume exposure machine carries out double-sided exposure.
Further, etching solution is 30%～35% hydrochloric acid and the water mixed liquid of hydrogen peroxide in this step etching step 4., and wherein the volume ratio of hydrochloric acid and hydrogen peroxide is 3:1.
After adopting said structure, the frangible electronic tag of a kind of high-frequency RF ID and the manufacturing process thereof that the present invention relates to, it has following beneficial effect at least:
One, because the etch layer of these both sides is all bonding with fragile paper by the second glue-line, based on the viscosity of the second glue-line greater than the first glue-line, so when the illegal tear-off electronic tag of people, this frangible ply of paper meeting and etch layer are together by tear-off, namely allow etch layer be badly deformed, so so that whole electronic tag damaged fully, thereby improve the antifalsification of whole frangible electronic tag;
Two, because it has adopted supporting substrate, the first glue-line and aluminium foil or Copper Foil in making forming process, thereby guaranteed the implementation condition of etch process; Simultaneously owing to the mode that has adopted applying photosensitive type compound substance and exposure realizes line transitions, then again by etched technique, the like this so that etching accuracy tolerance that is formed on circuit on the etch layer on supporting substrate and the first glue-line ± 0.02mm and/or circuit end points minimum spacing≤0.12mm.Make thus that the circuit precision improves greatly in the present invention, thereby improved the overall performance of whole etching electronic tag.
Description of drawings
Fig. 1 is the cut-open view of the frangible electronic tag of a kind of high-frequency RF ID that the present invention relates to;
Fig. 2 is the synoptic diagram of a kind of specific embodiment of etching antenna in the frangible electronic tag of a kind of high-frequency RF ID that the present invention relates to.
Among the figure:
Supporting substrate 1 first glue-line 2
Frangible ply of paper 5 wire jumpers 6.
Embodiment
In order further to explain technical scheme of the present invention, the present invention will be described in detail below by specific embodiment.
As shown in Figure 1, the frangible electronic tag 100 of a kind of high-frequency RF ID that the present invention relates to, comprise supporting substrate 1, RFID chip, the first glue-line 2, etch layer 3, the second glue-line 4 and frangible ply of paper 5, the up and down both sides of this supporting substrate 1 are symmetry shape, and equal stacked the first glue-line 2, etch layer 3, the second glue-line 4 and frangible ply of papers 5 of being provided with from the inside to the outside successively.This first glue-line 2 is between supporting substrate 1 and etch layer 3, concrete, this first glue-line 2 is selected from one or more of polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, acrylate pressure sensitive adhesive, silica gel, thereby play on the one hand the effect that supporting substrate 1 and etch layer 3 are bonded together, also play on the other hand making etch layer realize good cohesive action from different surperficial objects.
This etch layer 3 for aluminium foil or Copper Foil through the etch process moulding, and on this etch layer 3 circuit the etching accuracy tolerance ± 0.02mm and/or circuit end points minimum spacing≤0.12mm.Preferably, this supporting substrate 1 can be selected from PI film or PET film.As shown in Figure 2, it is the synoptic diagram of 3 one kinds of embodiment of etch layer in this etching electronic tag 100.
This supporting substrate 1, two first glue-lines 2, two etch layers 3 consist of the core material assembly with the RFID chip, all be formed with the punching hole (not shown) on this supporting substrate 1 and two first glue-lines 2, the wire jumper 6(by connecting punching hole on supporting substrate 1 and two first glue-lines 2 between this two etch layer 3 is as shown in Figure 2) be connected with each other.
This each frangible ply of paper 5 is bonded on the corresponding etch layer 3 by corresponding the second glue-line 4, and the viscosity of this second glue-line 4 is better than the viscosity of the first glue-line 2.Preferably, 4 of this second glue-lines can be selected from one or more of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue.
Thus, bonding with fragile paper because this etch layer 3 passes through the second glue-line 4; In addition based on the viscosity of the second glue-line 4 greater than the first glue-line 2, so when the illegal tear-off of people electronic tag 100, these frangible ply of paper 5 meetings and etch layer 3 are together by tear-off, namely allow etch layer 3 be badly deformed, so so that whole electronic tag 100 damaged fully, like this then improved the antifalsification of whole electronic tag 100.
In order to allow the frangible electronic tag of a kind of high-frequency RF ID that the present invention relates to can be by fully open, the present invention also provides its manufacturing process, and the below is described in detail its first better embodiment first:
Embodiment one:
This manufacturing process comprises the steps:
1., to select thickness be the supporting substrate of 12～200um, and descends both sides to be coated with all behind the first glue-line respectively that to be that the aluminium foil of 9～38um carries out compound with thickness thereon, and forms two-sided composite base material, i.e. two-sided clad aluminum foil;
2., on two aluminium foils of two-sided composite base material, all form the photosensitive type compound substance; In the present embodiment, this photosensitive type composite material by adopting photosensitive type dry film material, it can also be substituted by photosensitive type wet film material or photosensitive type dielectric ink material certainly, during certain photosensitive type dielectric ink material, is the mode moulding of adopting silk-screen;
3., will need etched antenna pattern to make film egative film, adopt double-faced exposure method, with the wire portion line transitions to the photosensitive type compound substance;
4., will expose that two-sided composite base material good and that post the photosensitive type compound substance develops, etching and stripping, so form the etching accuracy tolerance ± 0.02mm and/or end points minimum spacing≤0.12mm etching antenna.Preferably, etching solution is 30%～35% hydrochloric acid and the water mixed liquid of hydrogen peroxide in this etching step, and wherein the volume ratio of hydrochloric acid and hydrogen peroxide is 3:1, thereby provides safeguard for better etching precision;
5., two-sided etching antenna that above-mentioned etching is good, add drop stamping in the position that needs wire jumper 6 and form punching hole, and the mode by wire jumper 6 is so that can be interconnected between the circuit on two sides;
6., above-mentioned two-sided etching antenna and RFID chipset are fitted together, and make the core material assembly, i.e. INLAY; Preferably, this two-sided etching antenna adopts the mode of face-down bonding to link to each other with the RFID chip;
7., get the frangible ply of paper that thickness is 30～100um, and be better than the second glue-line of the first glue-line in its one side coating viscosity; With etching antenna place surface recombination on the surface at the second glue-line place on the frangible ply of paper and the core material assembly and form the frangible electronic tag of high-frequency RF ID.
Need to prove that in the present embodiment, this supporting substrate can be selected from PI film or PET film; This second glue-line then can be selected one or more of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue, thereby guarantees to have enough cohesive strengths
Embodiment two:
In the present embodiment, the step of itself and the first embodiment is basic identical, and its difference is aluminium foil is substituted with Copper Foil.
Embodiment three:
In the present embodiment, it can adopt whole schemes of the first embodiment and the second embodiment, but it is in order to reach the purpose of enhancing productivity, 3. 2. it all improve with abovementioned steps abovementioned steps, concrete, this step 2. in set-up mode between photosensitive type compound substance and aluminium foil or the Copper Foil adopt volume to volume to fit, this step 3. in exposure then be that employing volume to volume exposure machine carries out double-sided exposure.
As from the foregoing, the manufacturing process of the frangible electronic tag of a kind of high-frequency RF ID that the present invention relates to, it has adopted supporting substrate, the first glue-line and aluminium foil or Copper Foil owing to it on the one hand in making forming process, thereby has guaranteed the implementation condition of etch process.
In addition, owing to the mode that has adopted applying photosensitive type compound substance and exposure realizes line transitions, then again by etched technique, the like this so that etching accuracy tolerance that is formed on circuit on the etch layer 3 on supporting substrate and the first glue-line ± 0.02mm and/or circuit end points minimum spacing≤0.12mm.Thus, the present invention compared with prior art, the present invention can improve the circuit precision greatly, and has improved the overall performance of whole electronic tag 100.
Above-described embodiment and graphic and non-limiting product form of the present invention and style, any person of an ordinary skill in the technical field all should be considered as not breaking away from patent category of the present invention to its suitable variation or modification of doing.
Claims (10)
1. frangible electronic tag of high-frequency RF ID, it is characterized in that, comprise the RFID chip, supporting substrate and the first glue-line that both sides all are cascading about supporting substrate, etch layer, the second glue-line and frangible ply of paper, this each etch layer is Copper Foil or aluminium foil through etch process and moulding, this supporting substrate, the RFID chip, two first glue-lines and two etch layers consist of the core material assembly together, all be formed with punching hole on this supporting substrate and two first glue-lines, be connected with each other by the wire jumper that connects punching hole on supporting substrate and two first glue-lines between this two etch layer; This each frangible ply of paper all is bonded on the corresponding etch layer by corresponding the second glue-line, and the viscosity of this second glue-line is better than the viscosity of the first glue-line.
2. the frangible electronic tag of a kind of high-frequency RF ID as claimed in claim 1 is characterized in that, on this each etch layer the etching accuracy tolerance of circuit ± 0.02mm and/or circuit end points minimum spacing≤0.12mm.
3. the frangible electronic tag of a kind of high-frequency RF ID as claimed in claim 1 is characterized in that, this supporting substrate is selected from PI film or PET film; This second glue-line is selected from one or more of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue; This first glue-line is selected from one or more of polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, acrylate pressure sensitive adhesive, silica gel.
4. the manufacturing process of the frangible electronic tag of high-frequency RF ID is characterized in that, comprises the steps:
1., select supporting substrate, and descend both sides all to be coated with behind the first glue-line respectively thereon and carry out compoundly with aluminium foil or Copper Foil, and form two-sided composite base material;
2., on the two sides of two-sided composite base material, all form the photosensitive type compound substance;
3., will need etched antenna pattern to make film egative film, adopt double-faced exposure method, with the wire portion line transitions to the photosensitive type compound substance;
4., will expose that two-sided composite base material good and that post the photosensitive type compound substance develops, etching and stripping, so form the etching accuracy tolerance ± 0.02mm and/or end points minimum spacing≤0.12mm etching antenna;
5., two-sided etching antenna that above-mentioned etching is good, add drop stamping in the position that needs wire jumper and form punching hole, so that be interconnected between the circuit on two sides;
6., above-mentioned two-sided etching antenna and RFID chipset are fitted together, and make the core material assembly;
7., get frangible ply of paper, and be better than the second glue-line of the first glue-line in its one side coating viscosity; With etching antenna place surface recombination on the surface at the second glue-line place on the frangible ply of paper and the core material assembly and form the frangible electronic tag of high-frequency RF ID.
5. manufacturing process as claimed in claim 4 is characterized in that, the thickness of this aluminium foil or Copper Foil is selected 9～38um, and the thickness of this supporting substrate then is chosen as 12～200um, and this frangible ply of paper then is chosen as 30～100um.
6. manufacturing process as claimed in claim 4 is characterized in that, this photosensitive type compound substance is photosensitive type dry film material, photosensitive type wet film material or photosensitive type dielectric ink material.
7. manufacturing process as claimed in claim 4 is characterized in that, this supporting substrate is selected from PI film or PET film.
8. manufacturing process as claimed in claim 4 is characterized in that, this second glue-line is selected from one or more of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue; This first glue-line is selected from one or more of polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, acrylate pressure sensitive adhesive, silica gel.
9. manufacturing process as claimed in claim 4 is characterized in that, this step 2. in set-up mode between photosensitive type compound substance and aluminium foil or the Copper Foil adopt volume to volume to fit, this step 3. in exposure then be that employing volume to volume exposure machine carries out double-sided exposure.
10. manufacturing process as claimed in claim 4 is characterized in that, etching solution is 30%～35% hydrochloric acid and the water mixed liquid of hydrogen peroxide in this step etching step 4., and wherein the volume ratio of hydrochloric acid and hydrogen peroxide is 3:1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210007960 CN102945503A (en) | 2012-01-12 | 2012-01-12 | Fragile high-frequency RFID electronic label and manufacturing technology of electronic label |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210007960 CN102945503A (en) | 2012-01-12 | 2012-01-12 | Fragile high-frequency RFID electronic label and manufacturing technology of electronic label |
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| CN102945503A true CN102945503A (en) | 2013-02-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201210007960 Pending CN102945503A (en) | 2012-01-12 | 2012-01-12 | Fragile high-frequency RFID electronic label and manufacturing technology of electronic label |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104268620A (en) * | 2014-10-30 | 2015-01-07 | 上海优比科包装材料有限公司 | Double-side transferable electronic tag and production method thereof |
| CN104323738A (en) * | 2014-10-20 | 2015-02-04 | 谭映林 | Splash-proof buffer structure |
| CN104766119A (en) * | 2015-04-14 | 2015-07-08 | 上海优比科电子科技有限公司 | RFID transfer prevention structure, manufacturing method thereof and RFID |
-
2012
- 2012-01-12 CN CN 201210007960 patent/CN102945503A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104323738A (en) * | 2014-10-20 | 2015-02-04 | 谭映林 | Splash-proof buffer structure |
| CN104268620A (en) * | 2014-10-30 | 2015-01-07 | 上海优比科包装材料有限公司 | Double-side transferable electronic tag and production method thereof |
| CN104766119A (en) * | 2015-04-14 | 2015-07-08 | 上海优比科电子科技有限公司 | RFID transfer prevention structure, manufacturing method thereof and RFID |
| CN104766119B (en) * | 2015-04-14 | 2018-11-16 | 上海优比科电子科技有限公司 | A kind of anti-transfer organization of electronic tag and its manufacturing method and electronic tag |
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Application publication date: 20130227 |