CN202632328U - Frangible anti-fake RFID etching electronic label - Google Patents
Frangible anti-fake RFID etching electronic label Download PDFInfo
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- CN202632328U CN202632328U CN 201220011544 CN201220011544U CN202632328U CN 202632328 U CN202632328 U CN 202632328U CN 201220011544 CN201220011544 CN 201220011544 CN 201220011544 U CN201220011544 U CN 201220011544U CN 202632328 U CN202632328 U CN 202632328U
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- frangible
- etching
- electronic tag
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Abstract
Disclosed is a frangible anti-fake RFID etching electronic label, comprising bearing base material, a first adhesive layer, an etching layer, an RFID chip, a second adhesive layer, and a frangible paper layer, wherein the first adhesive layer is located between the bearing base material and the etching layer; the etching layer is made of copper foil or aluminium foil via etching technology; the bearing base material, the first adhesive layer, the etching layer, and the RFID chip form a core material assembly; the frangible paper layer is glued to the etching layer via the second adhesive layer; and the stickiness of the second adhesive layer is greater than that of the first adhesive layer. The electronic label of the utility model features great damaging degree while being torn out and high performance.
Description
Technical field
The utility model relates to the RFID of Internet-of-things field; Relate to a kind of frangible false proof RFID etching electronic tag in particular; It is applicable to that various needs are false proof, the RFID application scenario of tamper, becomes especially that expensive goods such as vehicle management, drinks, medicine, cosmetics are traced to the source and false proof ideal is selected.
Background technology
Common frangible label is to be lining with frangible printing material, and the back side scribbles extraordinary seccotine stick, and its lining fracture strength is far below the tackifier adhesive power; When after frangible label is sticked base material, uncovering, the random fracture of material shows that the packing of product was opened, and can't restore again.But common frangible label mainly is to be made up of the bar code that prints, and its information storage amount seldom and needs scanner to read one by one.
The RFID label has that volume is little, capacity is big, the life-span is long and characteristics such as reusable, and it can support fast reading and writing, non-visual recognition, move identification, multiple goal identification, location and long-term follow manages; The RFID technology combines with technology such as internet, communications, can realize item tracking and information sharing in the global range.In recent years, along with the development of technology such as large scale integrated circuit, network service and information security, the RFID technology has got into the commercial applications stage.Because have characteristics such as high-speed mobile object identification, multiple goal identification and contactless identification, the RFID technology demonstrates huge development potentiality and application space, is considered to one of the most rising infotech of 21 century.
At present along with country more and more payes attention to property safety, food security, drug safety etc., frangible false proof RFID electronic tag trace to the source with false proof above more and more important, replace common frangible label in growing field.
But there is following defective at least the frangible false proof RFID label on the market in it:
One, the common technical scheme that adopts of existing frangible false proof RFID label; Be with electrically conductive ink or metallic particles through serigraphy at the fragile paper material and above the PET base material; Form printing RFID antenna; But because the printed antenna precision is low, the conductive materials resistive impedance is inconsistent, so can't process high-quality RFID electronic tag all the time, the scope of application is narrow;
Two, existing frangible antifalsification label often only is that part is damaged this label, promptly be not fundamentally to damage this label, thereby it is not enough to have damaged condition, and then has the shortcoming of antifalsification difference.
In view of this, the inventor has this case to produce to the above-mentioned defective further investigation of existing frangible false proof RFID electronic tag then.
The utility model content
The purpose of the utility model is to provide a kind of frangible false proof RFID etching electronic tag, has the defective of antifalsification difference inadequately with the damaged condition when tearing to pieces of electronic tag in the solution prior art.
In order to reach above-mentioned purpose, the solution of the utility model is:
A kind of frangible false proof RFID etching electronic tag wherein, comprising: supporting substrate, first glue-line, etch layer, RFID chip, second glue-line and frangible ply of paper; This first glue-line is between supporting substrate and etch layer; This etch layer is that Copper Foil or aluminium foil are through etch process and moulding; This supporting substrate, first glue-line, etch layer and RFID chip constitute the core material assembly; This frangible ply of paper is bonded on the etch layer through second glue-line, and the viscosity of this second glue-line is better than the viscosity of first glue-line.
Further, on this etch layer the etching accuracy tolerance of circuit ± 0.02mm and/or circuit end points minimum spacing≤0.12mm.
Further, this supporting substrate is selected from PI film or PET film.
Further, this second glue-line is selected from one or more of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue.
Further, this first glue-line is selected from one or more of polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, acrylate pressure sensitive adhesive, silica gel.
After adopting said structure, a kind of frangible false proof RFID etching electronic tag that the utility model relates to, it has following beneficial effect at least:
One, because this etch layer one side is bonding with supporting substrate (when the etching electronic tag comes into operation, then being substituted by marker) through first glue-line, opposite side passes through second glue-line and bonding with fragile paper; In addition based on the viscosity of second glue-line greater than first glue-line, so illegally tear when taking off electronic tag as people, this frangible ply of paper can be torn together with etch layer and taken off, and promptly lets etch layer be badly deformed, and makes that so whole electronic tag is damaged fully;
Two,, thereby guaranteed the implementation condition of etch process because it has adopted supporting substrate, first glue-line and aluminium foil or Copper Foil in making forming process; Simultaneously owing to having adopted the mode that forms photosensitive type compound substance and exposure to realize line transitions; Then again through etched technology, the so feasible etching accuracy tolerance that is formed on circuit on the etch layer on the supporting substrate and first glue-line ± 0.02mm and/or circuit end points minimum spacing≤0.12mm.Make thus that the circuit precision improves greatly on the utility model, thereby improved the overall performance of whole etching electronic tag.
Description of drawings
The cut-open view of a kind of frangible false proof RFID etching electronic tag that Fig. 1 relates to for the utility model;
The synoptic diagram of a kind of specific embodiment of etching antenna in a kind of frangible false proof RFID etching electronic tag that Fig. 2 relates to for the utility model.
Among the figure:
Etching electronic tag 100
Supporting substrate 1 first glue-line 2
Etch layer 3 second glue-lines 4
Frangible ply of paper 5.
Embodiment
In order further to explain the technical scheme of the utility model, come the utility model is set forth in detail through specific embodiment below.
As shown in Figure 1; A kind of frangible false proof RFID etching electronic tag 100 that the utility model relates to; Comprise supporting substrate 1, first glue-line 2, etch layer 3, RFID chip (not shown), second glue-line 4 and frangible ply of paper 5; This first glue-line 2 is between supporting substrate 1 and etch layer 3, and is concrete, and this first glue-line 2 is selected from from one or more of polyethers modified epoxy resin glue, acrylic acid modified epoxy resin glue, acrylate pressure sensitive adhesive, silica gel; Thereby play the effect that supporting substrate 1 and etch layer 3 are bonded together on the one hand, also play letting etch layer and different surface object can realize good cohesive action on the other hand.
This etch layer 3 for aluminium foil or Copper Foil through the etch process moulding, and on this etch layer 3 circuit the etching accuracy tolerance ± 0.02mm and/or circuit end points minimum spacing≤0.12mm.Preferably, this supporting substrate 1 can be selected from PI film or PET film.As shown in Figure 2, it is the synoptic diagram of 3 one kinds of embodiment of etch layer in this etching electronic tag 100.
This supporting substrate 1, first glue-line 2, etch layer 3 constitute the core material assembly with the RFID chip, and this frangible ply of paper 5 is bonded on the etch layer 3 through second glue-line 4, and the viscosity of this second glue-line 4 is better than the viscosity of first glue-line 2.Preferably, 4 of this second glue-lines can be selected from one or more of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue.
Thus, because these etch layer 3 one sides are bonding with supporting substrate 1 (when etching electronic tag 100 comes into operation, then being substituted by marker) through first glue-line 2, opposite side passes through second glue-line 4 and bonding with fragile paper; In addition based on the viscosity of second glue-line 4 greater than first glue-line 2, so illegally tear when taking off electronic tag as people, this frangible ply of paper 5 can be torn together with etch layer 3 and taken off, and promptly lets etch layer 3 be badly deformed, and makes that so whole electronic tag is damaged fully;
In order to let a kind of frangible false proof RFID etching electronic tag 100 that the utility model relates to can be open by fully, the utility model also provides its manufacturing process, below earlier its first preferable embodiment is set forth in detail:
Embodiment one:
This manufacturing process comprises the steps:
1., to select thickness be the aluminium foil of 9～38um, and is coated with above that behind first glue-line that to be that the supporting substrate of 12～200um carries out compound with thickness, and forms composite base material;
2., on the aluminium foil of composite base material, form the photosensitive type compound substance; In the present embodiment, this photosensitive type composite material by adopting photosensitive type dry film material, it can also be substituted by photosensitive type wet film material or photosensitive type dielectric ink material certainly;
3., need process film egative film by etched antenna pattern, adopt exposure method, above wire portion line transitions to photosensitive type compound substance;
4., will make public that composite base material good and that post the photosensitive type compound substance develops, etching and stripping, so form the etching accuracy tolerance ± 0.02mm and/or end points minimum spacing≤0.12mm etching antenna.Preferably, etching solution is 30%～35% the hydrochloric acid and the water mixed liquid of oxydol in this etching step, and wherein the volume ratio of hydrochloric acid and oxydol is 3:1, thereby provides safeguard for preferable etching precision;
5., etching antenna and RFID chipset are fitted together, and process the core material assembly, i.e. INLAY; Preferably, this etching antenna adopts the mode of upside-down mounting welding to link to each other with the RFID chip;
6., get the frangible ply of paper that thickness is 30～100um, and on its one side coating second glue-line; Etching antenna on the surface at second glue-line place on the frangible ply of paper and the core material assembly is belonged to surface recombination and forms frangible false proof RFID etching electronic tag.
Need to prove that in the present embodiment, this supporting substrate can be selected from PI film or PET film; This second glue-line then can be selected one or more of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue for use, thereby guarantees to have enough cohesive strengths.
Embodiment two:
In the present embodiment, the step of itself and first embodiment is basic identical, and its difference is aluminium foil is substituted with Copper Foil.
Embodiment three:
In the present embodiment; It can adopt whole schemes of first embodiment and second embodiment; But it is in order to reach the purpose of enhancing productivity, and 3. 2. it all improve with abovementioned steps abovementioned steps, concrete; Moulding between the 2. middle photosensitive type compound substance of this step and aluminium foil or the Copper Foil adopts volume to volume to fit, and the 3. middle exposure of this step then is to adopt the volume to volume exposure machine to make public.
By on can know that the manufacturing process of a kind of frangible false proof RFID etching electronic tag that the utility model relates to because it has adopted supporting substrate, first glue-line and aluminium foil or Copper Foil in making forming process, thereby has been guaranteed the implementation condition of etch process; Simultaneously owing to having adopted the mode that forms photosensitive type compound substance and exposure to realize line transitions; Then again through etched technology, the so feasible etching accuracy tolerance that is formed on circuit on the etch layer on the supporting substrate and first glue-line ± 0.02mm and/or circuit end points minimum spacing≤0.12mm.Thus the utility model compared with prior art, it also has the circuit precision and improves greatly, and has improved the overall performance of whole etching electronic tag.
Product form of the foregoing description and graphic and non-limiting the utility model and style, the those of ordinary skill of any affiliated technical field all should be regarded as not breaking away from the patent category of the utility model to its suitable variation or modification of doing.
Claims (5)
1. a frangible false proof RFID etching electronic tag is characterized in that, comprising: supporting substrate, first glue-line, etch layer, RFID chip, second glue-line and frangible ply of paper; This first glue-line is between supporting substrate and etch layer; This etch layer is that Copper Foil or aluminium foil are through etch process and moulding; This supporting substrate, first glue-line, etch layer and RFID chip constitute the core material assembly; This frangible ply of paper is bonded on the etch layer through second glue-line, and the viscosity of this second glue-line is better than the viscosity of first glue-line.
2. a kind of frangible false proof RFID etching electronic tag as claimed in claim 1 is characterized in that, on this etch layer the etching accuracy tolerance of circuit ± 0.02mm and/or circuit end points minimum spacing≤0.12mm.
3. a kind of frangible false proof RFID etching electronic tag as claimed in claim 1 is characterized in that this supporting substrate is selected from PI film or PET film.
4. a kind of frangible false proof RFID etching electronic tag as claimed in claim 1; It is characterized in that this second glue-line is selected from a kind of of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue.
5. a kind of frangible false proof RFID etching electronic tag as claimed in claim 1 is characterized in that, this first glue-line is selected from a kind of of polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, acrylate pressure sensitive adhesive, silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220011544 CN202632328U (en) | 2012-01-12 | 2012-01-12 | Frangible anti-fake RFID etching electronic label |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220011544 CN202632328U (en) | 2012-01-12 | 2012-01-12 | Frangible anti-fake RFID etching electronic label |
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| Publication Number | Publication Date |
|---|---|
| CN202632328U true CN202632328U (en) | 2012-12-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220011544 Expired - Lifetime CN202632328U (en) | 2012-01-12 | 2012-01-12 | Frangible anti-fake RFID etching electronic label |
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| CN (1) | CN202632328U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102955976A (en) * | 2012-01-12 | 2013-03-06 | 厦门英诺尔电子科技股份有限公司 | Fragile anti-fake RFID (Radio Frequency Identification) etched electronic tag and manufacturing process thereof |
| CN103034900A (en) * | 2013-01-16 | 2013-04-10 | 厦门英诺尔信息科技有限公司 | High-frequency fragile anti-counterfeiting anti-transfer RFID (Radio Frequency Identification) electronic tag and manufacturing method thereof |
-
2012
- 2012-01-12 CN CN 201220011544 patent/CN202632328U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102955976A (en) * | 2012-01-12 | 2013-03-06 | 厦门英诺尔电子科技股份有限公司 | Fragile anti-fake RFID (Radio Frequency Identification) etched electronic tag and manufacturing process thereof |
| CN102955976B (en) * | 2012-01-12 | 2016-06-15 | 厦门英诺尔电子科技股份有限公司 | A kind of frangible false proof RFID etches electronic tag and manufacturing process thereof |
| CN103034900A (en) * | 2013-01-16 | 2013-04-10 | 厦门英诺尔信息科技有限公司 | High-frequency fragile anti-counterfeiting anti-transfer RFID (Radio Frequency Identification) electronic tag and manufacturing method thereof |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121226 |