CN102339411A - Method for manufacturing ultrahigh-frequency radio frequency identification (RFID) tag - Google Patents
Method for manufacturing ultrahigh-frequency radio frequency identification (RFID) tag Download PDFInfo
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- CN102339411A CN102339411A CN2011103167953A CN201110316795A CN102339411A CN 102339411 A CN102339411 A CN 102339411A CN 2011103167953 A CN2011103167953 A CN 2011103167953A CN 201110316795 A CN201110316795 A CN 201110316795A CN 102339411 A CN102339411 A CN 102339411A
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Abstract
The invention discloses a method for manufacturing an ultrahigh-frequency radio frequency identification (RFID) tag. The method comprises the following steps of: cutting an ultrahigh-frequency RFID antenna on a multilayer structural material by using a knife die; inversely encapsulating an ultrahigh-frequency RFID chip in the terminal of the ultrahigh-frequency antenna or encapsulating the ultrahigh-frequency RFID chip into a chip module and assembling the chip module to the terminal of the ultrahigh-frequency RFID antenna by sticking or riveting to form an inlay; sticking a piece of printing face paper for marking tag information to the inlay; and cutting the inlay stuck with the printing face paper. Compared with an etching method, the method has the advantages that: because the ultrahigh-frequency RFID antenna is cut by adopting a knife die forming method, massive acid and alkali chemicals are not used, and environmental pollution is avoided. By simplifying the manufacturing process, the manufacturing cost of the ultrahigh-frequency RFID antenna is reduced, so that the manufacturing cost of the ultrahigh-frequency RFID tag is reduced, and the ultrahigh-frequency RFID tag can be widely applied.
Description
Technical field
The present invention relates to REID (RFID) field, particularly, relate to the manufacturing approach of ultra-high frequency RFID label.
Background technology
At present, REID (RFID) had obtained fast development in recent years as an important application of technology of Internet of things.With respect to other Articla management systems, like bar code system, RF identification (RFID) has the advantage of not replacing: the first, can discern unspecific Individual Items, for need not as bar code, discerning one type of article; The second, adopt wireless radio-frequency, can contactlessly read; Three, can read a plurality of article simultaneously, and be widely used in fields such as logistics, storage, accurately obtain Item Information fast, to realize efficient quick management and scheduling to article.The RFID label is indispensable important component part as the transponder in the rfid system.RFID is pasted on usually and is identified article surface, comprises antenna and chip two parts.The function of RFID label antenna is to receive the electromagnetic wave that the rfid interrogator antenna is launched; With order in this signal and data-switching is that electric signal is transferred to the RFID label chip, reflects the item information data on the label chip that has activated to the rfid interrogator antenna with form of electromagnetic wave through the backscattering method again.
The frequency range that hyper band (UHF) RF identification is meant radio frequency signal work is at hyper band; The hyper band of various countries' definition is different; Like 840MHz～845MHz (China), 920MHz～925MHz (China), 866MHz～869MHz (Europe), 902MHz～928MHz (U.S.), 952MHz～954MHz (Japan) etc., the 860MHz that stipulates in the ISO/IEC 18000-6 international standard～960MHz frequency range has contained the hyper band of principal market use in the world.Ultrahigh frequency (UHF) passive RFID tags is owing to its frequency of operation height, read-write distance, need not advantage such as externally fed; Be more suitable for Product Information Management in single grade; An important directions that has become at present RFID research and used; And ultrahigh frequency (UHF) RF identification market will become the mainstream development direction in RFID field also in fast development at following ultrahigh frequency.
But existing UHF RFID (super high frequency radio frequency recognition technology) label antenna manufacturing process has limited UHF label large-scale application, mainly is that the label cost is higher relatively.The main flow manufacturing approach of UHF RFID label antenna is an etching method at present; The production procedure of this method comprises the steps: 1) flexible polyester covers copper (aluminium) plate substrate: adopt the special-purpose synthetic resin gum (epoxy glue, acrylate glue) of soft board that Copper Foil (aluminium foil) and polyester film are pressed together; After solidifying behind the high temperature, form, its electrical property, heat-resisting quantity, corrosion resistance are stronger.2) paste sensitization sense film/seal photosensitive-ink: the metal covering that one deck light-sensitive surface is sticked on base material through the mode of roll extrusion; Or stamp one deck sensitization wet film at the metal covering of base material, through the use of dry back.3) exposure: through automatic continuous exposure machine, the contraposition exposure is transferred to the circuit diagram property on the film on the light-sensitive surface automatically.4) video picture: unexposed place is rinsed out, show the wiring diagram that is covered by light-sensitive surface.5) etching: exposed metal is etched away it with acid soup.6) move back film: the light-sensitive surface with protection circuit removes at last, exposes metallic circuit.UHF RFID label antenna adopt antenna that etching method makes high, the long service life of precision, but manufacturing cost is higher.Simultaneously because etching antenna has used multiple soda acid chemical substance in manufacturing process; Can produce certain waste water; Environment is polluted, then need adopt advanced plant of water disposal that waste water is handled, further strengthened the cost of manufacture of UHF RFID label antenna.
In sum, in realizing process of the present invention, the inventor finds to exist at least in the prior art following defective:
⑴ operation is many, and manufacturing cost is higher;
⑵ the waste water that produces in the manufacture process can cause certain pollution to environment.
Summary of the invention
The objective of the invention is to,, propose a kind of manufacturing approach of ultra-high frequency RFID label,, have environmental protection, advantage that cost of manufacture is low again to realize promptly having the advantage that degree of accuracy is high, the life-span is long of the label that etching method makes to the problems referred to above.
For realizing above-mentioned purpose, the technical scheme that the present invention adopts is:
The manufacturing approach of ultra-high frequency RFID label may further comprise the steps:
Cut out the ultrahigh frequency RFID antenna with cutting die at the sandwich patrix;
With the ultrahigh frequency radio frequency identification chip flip-chip packaged on the terminal of above-mentioned ultra-high frequency antenna; Flip-chip packaged is meant the one side with the chip belt salient point; Towards antenna terminal, salient point is crimped on forms electrical connection on the terminal, or ultrahigh frequency radio frequency identification chip is packaged into the chip module earlier; Utilize the chip module bonding again or rivet to be assembled on the terminal of above-mentioned ultrahigh frequency RFID antenna, form inlay (Inlay);
The printing facial tissue of indicating label information is pasted on the above-mentioned inlay;
The above-mentioned inlay of printing facial tissue that is pasted with is cut.
According to a preferred embodiment of the invention, said ultrahigh frequency RFID antenna is a flat plane antenna.
According to a preferred embodiment of the invention, said flat plane antenna is dipole antenna, folded doublet, folded dipole antenna, fractal antenna, slot antenna.
According to a preferred embodiment of the invention, said cutting die is etching cutting die, timber shuttering, offset plate mould, five metals mould or as the laser instrument of cross cutting instrument.
According to a preferred embodiment of the invention, said sandwich draws metal foil layer, non-drying glue layer and release layer to form by wheat;
Said wheat draws metal foil layer to be positioned at the top layer of sandwich, and thickness is not more than 60 μ m;
Said non-drying glue layer is medium tenacity or low intensive adhesive sticker, is positioned at the below that wheat is drawn the metal foil layer position, and coating thickness is not more than 15 μ m;
Said release layer is positioned at the bottom of sandwich, and thickness is not less than 30 μ m.
According to a preferred embodiment of the invention, said wheat draws metal foil layer to be made up of conductive layer, adhesive-layer and enhancement Layer;
Said conductive layer thickness is 10～25 μ m, and the resistance of conduction side is not more than 50m Ω;
Said enhancement Layer is the colorless and transparent film material, and thickness is not more than 20 μ m;
Said adhesive-layer is a structural adhesive, and conductive layer and enhancement Layer are bonded together, and its thickness is not more than 10 μ m.
According to a preferred embodiment of the invention, said release layer is white silicon paper, paperboard, polychloroethylene film (PVC), polyethylene terephthalate film (PET), polypropylene screen (PP).
According to a preferred embodiment of the invention, said conductive layer is Copper Foil or aluminium foil, and the material that said enhancement Layer adopts is polychloroethylene film (PVC), polyethylene terephthalate film (PET), polypropylene screen (PP), acrylonitril membrane (ABS).
According to a preferred embodiment of the invention, the said cutting die that uses passes through as hemisection at the die-cutting process that the sandwich patrix cuts out the ultrahigh frequency RFID antenna: promptly the die-cutting rule cross cutting passes through wheat and draws metal foil layer, terminates in non-drying glue layer, and release layer keeps fully.
According to a preferred embodiment of the invention, said bonding, the adhesives of use is the conductive material with certain viscosity.
Technical scheme of the present invention adopts cutting die method of forming cross cutting to go out the ultrahigh frequency RFID antenna, compares with etching method, does not re-use a large amount of soda acid chemical substances, has avoided the pollution to environment.And the simplification of manufacture craft has reduced ultrahigh frequency RFID antenna making cost, thereby has reduced the cost of manufacture of ultra-high frequency RFID label, thereby ultra-high frequency RFID label can be used on a large scale.
Other features and advantages of the present invention will be set forth in instructions subsequently, and, partly from instructions, become obvious, perhaps understand through embodiment of the present invention.The object of the invention can be realized through the structure that in the instructions of being write, claims and accompanying drawing, is particularly pointed out and obtained with other advantages.
Through accompanying drawing and embodiment, technical scheme of the present invention is done further detailed description below.
Description of drawings
Accompanying drawing is used to provide further understanding of the present invention, and constitutes the part of instructions, is used to explain the present invention with embodiments of the invention, is not construed as limiting the invention.In the accompanying drawings:
Fig. 1 is the manufacturing approach craft process flow diagram of the described ultra-high frequency RFID label of the embodiment of the invention;
Fig. 2 is the structural representation of the said sandwich of the embodiment of the invention;
Fig. 3 is the structural representation of the sandwich of the said process of embodiment of the invention cutting die cross cutting.
In conjunction with accompanying drawing, Reference numeral is following in the embodiment of the invention:
The 1-conductive layer; The 2-adhesive-layer; The 3-enhancement Layer; The 4-non-drying glue layer; The 5-release layer.
Embodiment
Below in conjunction with accompanying drawing the preferred embodiments of the present invention are described, should be appreciated that preferred embodiment described herein only is used for explanation and explains the present invention, and be not used in qualification the present invention.
The invention provides the manufacturing approach of ultra-high frequency RFID label, may further comprise the steps:
Cut out the ultrahigh frequency RFID antenna with cutting die at the sandwich patrix;
With the ultrahigh frequency radio frequency identification chip flip-chip packaged on the terminal of above-mentioned ultra-high frequency antenna; Flip-chip packaged is meant the one side with the chip belt salient point; Towards antenna terminal, salient point is crimped on forms electrical connection on the terminal, or ultrahigh frequency radio frequency identification chip is packaged into the chip module earlier; Utilize the chip module bonding again or rivet to be assembled on the terminal of above-mentioned ultrahigh frequency RFID antenna, form inlay (Inlay);
The printing facial tissue of indicating label information is pasted on the above-mentioned inlay;
The above-mentioned inlay of printing facial tissue that is pasted with is cut.
Embodiment one:
Like Fig. 1, shown in Figure 2, on sandwich, go out the ultrahigh frequency RFID antenna with the cutting die cross cutting.Sandwich draws metal foil layer, non-drying glue layer and release layer to form by wheat, and wheat draws metal foil layer can be divided into three layers of conductive layer, adhesive-layer and enhancement Layers again, and its thickness is not more than 60 μ m.Release layer is a bottom, non-drying glue layer be positioned at release layer above, wheat draw metal foil layer be positioned at non-drying glue layer above, and conductive layer is positioned at the top that wheat is drawn metal foil layer, adhesive-layer bonds together conductive layer and conductive layer.Non-drying glue layer is medium tenacity or low intensive adhesive sticker, is positioned at the below that wheat is drawn the metal foil layer position, and coating thickness is not more than 15 μ m, and release layer is white silicon paper, paperboard, PVC, PET, PP, is positioned at the bottom of sandwich, and thickness is not less than 30 μ m.Conductive layer is Copper Foil or aluminium foil, and thickness is 10～25 μ m, and the resistance of conduction side is not more than 50m Ω.The material that enhancement Layer adopts is PET, PVC, PP, ABS, is the colorless and transparent film material, and thickness is not more than 20 μ m.Adhesive-layer is a structural adhesive, and conductive layer and enhancement Layer are bonded together, and its thickness is not more than 10 μ m.With mechanical cutting die with sandwich according to antenna pattern, carry out half and pass through cross cutting, promptly cut wheat and draw metal foil layer, terminate in non-drying glue layer, release layer keeps fully, with the waste material eliminating, is the ultrahigh frequency RFID antenna then.The antenna that this working method is produced is a flat plane antenna, i.e. dipole antenna, folded doublet, folded dipole antenna, fractal antenna, slot antenna etc.Use NCA, ACA, silver slurry etc. to have the conductive material of certain viscosity then; The UHF RF identification chip is bonded on the ultrahigh frequency RFID antenna; The printing facial tissue of indicating label information then pastes on the ultrahigh frequency RFID antenna that the RFID RF identification chip is housed, and will be pasted with the ultrahigh frequency RFID antenna of printing facial tissue at last and cut into the web-like that diameter is not less than 70mm.
Embodiment two:
The also available employing of mechanical cutting die among the embodiment one has the replacing of laser instrument of middle low power lasing light emitter; When using laser die cutting; Can carry out hemisection to the sandwich that draws metal foil layer, non-drying glue layer and release layer to form by wheat and pass through, promptly use cut, cut wheat through laser focusing and adjusting laser power and draw metal foil layer; Terminate in non-drying glue layer, release layer keeps fully; Also can cut entirely, promptly use laser to cut and wear whole retes; Can also local hemisection pass through, promptly carry out hemisection and pass through in the position of selecting.
In sum, technical scheme of the present invention adopts cutting die method of forming cross cutting to go out the ultrahigh frequency RFID antenna, compares with etching method, does not re-use a large amount of soda acid chemical substances, has avoided the pollution to environment.And the simplification of manufacture craft has reduced ultrahigh frequency RFID antenna making cost, thereby has reduced the cost of manufacture of ultra-high frequency RFID label, thereby makes the large-scale application of ultra-high frequency RFID label have feasibility.
What should explain at last is: the above is merely the preferred embodiments of the present invention; Be not limited to the present invention; Although the present invention has been carried out detailed explanation with reference to previous embodiment; For a person skilled in the art, it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, and perhaps part technical characterictic wherein is equal to replacement.All within spirit of the present invention and principle, any modification of being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. the manufacturing approach of ultra-high frequency RFID label is characterized in that, may further comprise the steps:
Cut out the ultrahigh frequency RFID antenna with cutting die at the sandwich patrix;
The ultrahigh frequency radio frequency identification chip flip-chip packaged is packaged into the chip module earlier on the terminal of above-mentioned ultra-high frequency antenna or with ultrahigh frequency radio frequency identification chip; Utilize the chip module bonding again or rivet to be assembled on the terminal of above-mentioned ultrahigh frequency RFID antenna, form inlay;
The printing facial tissue of indicating label information is pasted on the above-mentioned inlay;
The above-mentioned inlay of printing facial tissue that is pasted with is cut.
2. the manufacturing approach of ultra-high frequency RFID label according to claim 1 is characterized in that, said ultrahigh frequency RFID antenna is a flat plane antenna.
3. the manufacturing approach of ultra-high frequency RFID label according to claim 2 is characterized in that, said flat plane antenna is dipole antenna, folded doublet, folded dipole antenna, fractal antenna, slot antenna.
4. the manufacturing approach of ultra-high frequency RFID label according to claim 1 is characterized in that, said cutting die is etching cutting die, timber shuttering, offset plate mould, five metals mould or as the laser instrument of cross cutting instrument.
5. the manufacturing approach of ultra-high frequency RFID label according to claim 1 is characterized in that, said sandwich draws metal foil layer, non-drying glue layer and release layer to form by wheat;
Said wheat draws metal foil layer to be positioned at the top layer of sandwich, and thickness is not more than 60 μ m;
Said non-drying glue layer is medium tenacity or low intensive adhesive sticker, is positioned at the below that wheat is drawn the metal foil layer position, and coating thickness is not more than 15 μ m;
Said release layer is positioned at the bottom of sandwich, and thickness is not less than 30 μ m.
6. the manufacturing approach of ultra-high frequency RFID label according to claim 1 is characterized in that, said wheat draws metal foil layer to be made up of conductive layer, adhesive-layer and enhancement Layer;
Said conductive layer thickness is 10～25 μ m, and the resistance of conduction side is not more than 50m Ω;
Said enhancement Layer is the colorless and transparent film material, and thickness is not more than 20 μ m;
Said adhesive-layer is a structural adhesive, and conductive layer and enhancement Layer are bonded together, and its thickness is not more than 10 μ m.
7. the manufacturing approach of ultra-high frequency RFID label according to claim 5 is characterized in that, said release layer is white silicon paper, paperboard, polychloroethylene film (PVC), polyethylene terephthalate film (PET), polypropylene screen (PP).
8. the manufacturing approach of ultra-high frequency RFID label according to claim 6; It is characterized in that; Said conductive layer is Copper Foil or aluminium foil, and the material that said enhancement Layer adopts is polychloroethylene film (PVC), polyethylene terephthalate film (PET), polypropylene screen (PP), acrylonitril membrane (ABS).
9. according to the manufacturing approach of claim 1 or 5 described ultra-high frequency RFID labels; It is characterized in that; The said cutting die that uses passes through as hemisection at the die-cutting process that the sandwich patrix cuts out the ultrahigh frequency RFID antenna: promptly the die-cutting rule cross cutting passes through wheat and draws metal foil layer; Terminate in non-drying glue layer, release layer keeps fully.
10. the manufacturing approach of ultra-high frequency RFID label according to claim 1 is characterized in that, and is said bonding, and the adhesives of use is the conductive material with certain viscosity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2011103167953A CN102339411A (en) | 2011-10-18 | 2011-10-18 | Method for manufacturing ultrahigh-frequency radio frequency identification (RFID) tag |
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| CN2011103167953A CN102339411A (en) | 2011-10-18 | 2011-10-18 | Method for manufacturing ultrahigh-frequency radio frequency identification (RFID) tag |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102693447A (en) * | 2012-06-04 | 2012-09-26 | 东莞植富商标印制有限公司 | Manufacturing method for ultrahigh-frequency electronic tag and ultrahigh-frequency electronic tag |
| CN104226641A (en) * | 2014-08-19 | 2014-12-24 | 诺瓦特伦（杭州）电子有限公司 | Radio frequency tag acid and alkaline washing equipment |
| WO2017219233A1 (en) * | 2016-06-21 | 2017-12-28 | 3M Innovative Properties Company | Self-supporting antenna |
| CN108177391A (en) * | 2017-12-27 | 2018-06-19 | 苏州工业园区高泰电子有限公司 | A kind of production method of folding tag |
| CN109255422A (en) * | 2018-11-21 | 2019-01-22 | 永道无线射频标签(扬州)有限公司 | A kind of production technology of RFID tag |
| CN109801869A (en) * | 2019-01-18 | 2019-05-24 | 广州明森科技股份有限公司 | A kind of efficient radio frequency identification tag package Processes and apparatus |
| CN110110832A (en) * | 2019-06-18 | 2019-08-09 | 金旭 | A kind of moisture transducer RFID label tag and its application system |
| CN111222617A (en) * | 2019-12-30 | 2020-06-02 | 深圳深汕特别合作区昌茂粘胶新材料有限公司 | Ultrahigh frequency RFID electronic tag and preparation method thereof |
| CN111816998A (en) * | 2020-06-15 | 2020-10-23 | 上海优比科电子科技有限公司 | Forming method of high-frequency/ultrahigh-frequency die-cut antenna |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102693447A (en) * | 2012-06-04 | 2012-09-26 | 东莞植富商标印制有限公司 | Manufacturing method for ultrahigh-frequency electronic tag and ultrahigh-frequency electronic tag |
| CN104226641A (en) * | 2014-08-19 | 2014-12-24 | 诺瓦特伦（杭州）电子有限公司 | Radio frequency tag acid and alkaline washing equipment |
| CN109314312B (en) * | 2016-06-21 | 2022-07-08 | 3M创新有限公司 | Self-supporting antenna |
| WO2017219233A1 (en) * | 2016-06-21 | 2017-12-28 | 3M Innovative Properties Company | Self-supporting antenna |
| CN109314312A (en) * | 2016-06-21 | 2019-02-05 | 3M创新有限公司 | Self-supporting antenna |
| US11695195B2 (en) * | 2016-06-21 | 2023-07-04 | 3M Innovative Properties Company | Self-supporting antenna |
| US20190334223A1 (en) * | 2016-06-21 | 2019-10-31 | 3M Innovative Properties Company | Self-supporting antenna |
| CN108177391A (en) * | 2017-12-27 | 2018-06-19 | 苏州工业园区高泰电子有限公司 | A kind of production method of folding tag |
| CN109255422A (en) * | 2018-11-21 | 2019-01-22 | 永道无线射频标签(扬州)有限公司 | A kind of production technology of RFID tag |
| CN109801869A (en) * | 2019-01-18 | 2019-05-24 | 广州明森科技股份有限公司 | A kind of efficient radio frequency identification tag package Processes and apparatus |
| CN109801869B (en) * | 2019-01-18 | 2020-10-09 | 广州明森科技股份有限公司 | Efficient electronic tag packaging process and device |
| CN110110832A (en) * | 2019-06-18 | 2019-08-09 | 金旭 | A kind of moisture transducer RFID label tag and its application system |
| CN111222617A (en) * | 2019-12-30 | 2020-06-02 | 深圳深汕特别合作区昌茂粘胶新材料有限公司 | Ultrahigh frequency RFID electronic tag and preparation method thereof |
| CN111222617B (en) * | 2019-12-30 | 2023-09-19 | 深圳深汕特别合作区昌茂粘胶新材料有限公司 | Ultrahigh-frequency RFID electronic tag and preparation method thereof |
| CN111816998A (en) * | 2020-06-15 | 2020-10-23 | 上海优比科电子科技有限公司 | Forming method of high-frequency/ultrahigh-frequency die-cut antenna |
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