CN105787553B - Preparation method of RFID (radio frequency identification) label embedded in packaging base material in gold stamping mode - Google Patents
Preparation method of RFID (radio frequency identification) label embedded in packaging base material in gold stamping mode Download PDFInfo
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- CN105787553B CN105787553B CN201610150943.1A CN201610150943A CN105787553B CN 105787553 B CN105787553 B CN 105787553B CN 201610150943 A CN201610150943 A CN 201610150943A CN 105787553 B CN105787553 B CN 105787553B
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- rfid
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
Abstract
The invention provides an RFID (radio frequency identification) tag which is arranged in a packaging base material in a gold stamping mode, and the RFID tag at least comprises a PET (polyethylene terephthalate) substrate, an antenna metal layer and a chip, wherein a stripping layer and a composite adhesive layer are sequentially arranged above the PET substrate, the antenna metal layer is fixed above the composite adhesive layer, the chip is bonded on the antenna metal layer through a conductive adhesive, a pressure-sensitive adhesive layer or a hot-melt adhesive layer is arranged on the antenna metal layer, and release paper is arranged above the pressure-sensitive adhesive layer. The invention also provides a preparation and embedding process of the RFID tag. The label can be directly placed on the paper or film base material of the packaging box, the production efficiency of the original product is not affected, and meanwhile, the label also has tearing resistance (one-time tearing resistance) and is green and environment-friendly.
Description
Technical Field
The invention provides an RFID tag placed in a packaging base material in a gold stamping mode and a production process thereof, and belongs to the technical field of RFID electronic tag production processing and application processes.
Background
An rfid (radio Frequency identification) technology, which is also called a radio Frequency tag, a transponder, and a data carrier, is a wireless communication technology that can identify a specific target and read and write related data through radio signals. The basic components of the system comprise an RFID electronic tag, an RFID reader-writer and an antenna, wherein the antenna is a device for receiving or radiating the radio frequency signal power of a radio transceiver in the form of electromagnetic waves. The RFID working principle is as follows: after the tag enters the magnetic field, the tag receives a radio frequency signal sent by the reader, and sends out product information stored in the chip by virtue of energy obtained by the induction current; the information is read and decoded by the interpreter and then sent to the central information system for relevant data processing.
The prior RFID electronic tag has the following defects in use:
1. because the traditional RFID electronic tags are mostly self-adhesive labels, the RFID electronic tags are stuck to articles in a labeling mode when in use. Because the traditional RFID label has a thicker PET antenna substrate layer, the traditional RFID label has no tearing-off prevention capability, and is easy to be torn off again and then transferred to other articles, so that the basic purposes of the RFID label such as anti-counterfeiting and tracing are lost.
2. Meanwhile, the RFID label is required to be adhered to a packaging material when in use, so that a labeling link is required to be added in the printing or packaging process, and the production efficiency of the original product can be slowed down due to the slow labeling speed.
3. The glue used for labeling is usually solvent-based glue, has certain toxicity, and is difficult to pass VOCS detection.
Disclosure of Invention
The invention provides an RFID label which is placed in a packaging base material in a gold stamping mode, overcomes the defects in the prior art, can be directly placed on a paper or film base material of a packaging box, does not influence the production efficiency of the original product, and has tearing resistance (one-time tearing resistance) and environmental protection.
The technical scheme adopted for realizing the above purpose of the invention is as follows:
the utility model provides an use gilt mode to put into RFID label of packing substrate, includes PET base plate, antenna metal level and chip at least, the top of PET base plate set gradually peel ply and composite adhesive layer, the antenna metal level is fixed in composite adhesive layer's top, the chip passes through the conducting resin nation to be fixed in on the antenna metal level, is provided with one deck pressure sensitive adhesive layer or hot melt adhesive layer on the antenna metal level, pressure sensitive adhesive layer's top is provided with from type paper.
The invention also provides a process for preparing the RFID label and embedding the RFID label into a packaging base material, which comprises the following steps: (1) selecting a PET substrate, and arranging a stripping layer above the PET substrate;
(2) coating a composite adhesive layer on the stripping layer, forming an antenna metal layer on the composite adhesive layer, and then completing the manufacture of the tag antenna through an etching process; or directly printing the label antenna on the stripping layer by using conductive ink in a printing mode;
(3) bonding the chip to an antenna metal layer or a printed label antenna through ACP conductive adhesive by using inverted packaging equipment to obtain an inlay;
(4) coating a layer of pressure-sensitive adhesive or hot melt adhesive on the inlay through gluing or composite process treatment, wherein release paper is arranged above the pressure-sensitive adhesive layer;
(5) performing half-die cutting treatment on the edge position of the area, where the packaging base material needs to be placed, of the inlay, wherein the PET substrate cannot be cut while the peeling layer is cut by a die-cutting knife opening;
(6) for the RFID label coated with the pressure-sensitive adhesive, the pressure-sensitive adhesive layer is adhered and fixed on the packaging base material by adopting a labeling machine or a cold pressing mode, so that the RFID label is transferred onto the packaging base material, the embedding process is completed, and meanwhile, the PET substrate is subjected to waste discharge;
to the RFID label that has the hot melt adhesive, the hot stamping head of the gilding equipment that adopts to dodge the processing to the chip carries out the hot pressing with the region that need put into the packing substrate in the RFID label to on transferring the RFID label to the packing substrate, accomplish the process of putting into, waste discharge is carried out to the PET base plate simultaneously.
And (6) tearing off the release paper in advance for the RFID label coated with the pressure-sensitive adhesive.
In the step (6), the RFID label is detected before being placed in the packaging base material, and the damaged RFID label is subjected to skipping treatment when hot pressing, cold pressing or labeling is carried out; and detecting the label after the embedding operation is finished, and identifying the damaged label.
Compared with the prior art, the invention has the following advantages: 1. the hot-pressing and cold-pressing processes are process flows commonly used in the packaging and printing industry at present, and the hot-pressing and cold-pressing modes and equipment used in the packaging and printing industry at present are used in the application to simultaneously transfer the tag antenna and the chip to the corresponding position of the packaging box, so that the production links and equipment of the original packaging and printing enterprises can be omitted, the tag is directly placed on the paper and film base materials of the packaging box, and the tag has the tearing and tearing resistance. When the paper packaging substrate is torn, the antenna layer of the tag is also damaged, so that the tag cannot be read normally.
2. The label placing mode adopts a hot stamping process, which is a commonly used process flow in the packaging and printing industry at present, so that the label placing process can be conveniently embedded into the traditional packaging and printing link, and the traditional RFID label pasting mode is abandoned, so that the production efficiency of the original product cannot be influenced in the placing process of the label produced by using the process disclosed by the invention.
3. In the step of bonding the chip, the label adopts the traditional flip-chip bonding process without modifying equipment and process parameters. The antenna substrate used in the process can adopt the traditional aluminum etching process, so that the traditional antenna line can be produced and processed without re-plate making and designing. The label made by the process has no special requirements on paper base or film type packaging materials during transfer. Therefore, the adhesive can be widely applied to the packing boxes and trademarks of commodities such as cigarettes, wines, medicines and the like. Can also be transferred to any paper material to form the application of aspects like electronic checks, electronic certificates, electronic tickets and the like.
4. In the label manufacturing process, the bonded chip is processed in a half-die cutting mode, so that a reserved knife edge is formed on the stripping layer, and the PET substrate is not provided with a knife edge, so that the stripping layer is easily stripped from the PET substrate in the label placing process, and the chip and antenna transferring process is completed. After the paper packaging substrate is put in, the stripping layer covers the antenna and the chip, so that the antenna and the chip can be protected.
Drawings
FIG. 1 is a structural diagram of an RFID tag placed in a packaging substrate by hot stamping and hot stamping, according to the present invention;
in the figure: the antenna comprises a PET substrate 1, an antenna metal layer 2, a stripping layer 3, a composite adhesive layer 4, a chip 5, a conductive adhesive 6 and a hot melt adhesive 7.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings and specific embodiments, but the scope of the present invention is not limited to the following embodiments.
The structure that the RFID label of packing substrate was put into to use gilt mode to use the gilt mode that provides in this embodiment is shown in figure 1, includes PET base plate 1, antenna metal level 2 and chip 5 at least, the top of PET base plate be provided with peel ply and compound adhesive layer, the antenna metal level is fixed in the top of compound adhesive layer, the chip passes through the conducting resin and bonds on the antenna metal level, is provided with one deck pressure sensitive adhesive layer or hot melt adhesive layer on the antenna metal level, is the hot melt adhesive in this embodiment.
In the embodiment, the manufacturing process and the inserting process of the RFID tag suitable for cigarette carton packaging are taken as examples to describe the process flow of the tag.
The process uses a tag antenna substrate structure which is different from a common single-layer PET antenna substrate and has a double-layer substrate structure. The common PET substrate is formed by directly bonding an antenna metal layer on the PET substrate through a glue layer. The double-layer substrate is formed by adding a stripping layer between the antenna metal layer and the PET substrate layer, the stripping layer and the PET substrate have good stripping effect, and the stripping layer and the PET substrate can be separated by only small force.
The tag can realize better environmental adaptability by using a narrower T matching and a wider dipole arm antenna design, thereby realizing better reading distance under the condition of smaller distance from a metal background. The manufacturing of the antenna substrate is completed on the antenna metal layer by using the line type and using the traditional etching process. In this embodiment, the tag antenna may be printed directly on the release layer by printing using conductive ink.
And bonding the chip to an antenna metal layer or a printed label antenna through ACP conductive adhesive by using a flip-chip packaging device to obtain the inlay.
And coating a layer of pressure-sensitive adhesive or hot melt adhesive on the inlay through gluing or composite process treatment, wherein release paper is arranged above the pressure-sensitive adhesive layer. The structure shown in fig. 1, in this embodiment, a hot melt adhesive, is formed.
And carrying out half-die cutting treatment on the edge position of the area of the inlay required to be placed into the cigarette carton paper packaging box, wherein the PET substrate cannot be cut off while the stripping layer is cut off by a die-cutting knife opening. The peeling layer is easily peeled from the PET substrate in the process of putting the label, so that the chip and the antenna are transferred on the packaging material.
By means of the gold stamping equipment, the labels are placed in the designated area of the packaging base material through hot pressing or cold pressing positioning by using the hot stamping head of the gold stamping equipment for avoiding the chips, so that the labels are integrated, meanwhile, online reading and detection are carried out when the packaging base material moves to stacking, unqualified inking points are marked, and the subsequent procedures are convenient to remove.
The RFID label is detected before being placed into the packaging base material, and the damaged RFID label is skipped, so that the rejection rate is reduced.
Since the label substrate is half-cut during the production process, the antenna and chip can be easily transferred to the paper packaging substrate.
In the embodiment, after the RFID tag is arranged in the cigarette device, the information tracing, the anti-counterfeiting, the regional sale and the logistics management of the whole life cycle of the cigarette can be realized. Compared with the original bar code label, the method has the advantages of quick whole-box reading, box-opening-free reading, environmental protection and the like.
Claims (2)
1. A preparation method of an RFID label which is placed in a packaging base material in a gold stamping mode comprises at least a PET substrate, an antenna metal layer and a chip, wherein a stripping layer and a composite adhesive layer are sequentially arranged above the PET substrate, the antenna metal layer is fixed above the composite adhesive layer, the chip is bonded on the antenna metal layer through a conductive adhesive, and a hot melt adhesive layer is arranged on the antenna metal layer;
the preparation method is characterized by comprising the following steps: (1) selecting a PET substrate, and arranging a stripping layer above the PET substrate;
(2) coating a composite adhesive layer on the stripping layer, forming an antenna metal layer on the composite adhesive layer, and then completing the manufacture of the tag antenna through an etching process; or directly printing the label antenna on the stripping layer by using conductive ink in a printing mode;
(3) bonding the chip to an antenna metal layer or a printed label antenna through ACP conductive adhesive by using inverted packaging equipment to obtain an inlay;
(4) coating a layer of hot melt adhesive on the inlay through gluing or composite process treatment;
(5) performing half-die cutting treatment on the edge position of the area, where the packaging base material needs to be placed, of the inlay, wherein the PET substrate cannot be cut while the peeling layer is cut by a die-cutting knife opening;
(6) the hot stamping head of the hot stamping equipment for avoiding the chip carries out hot pressing on the area of the RFID label, which needs to be placed into the packaging base material, of the RFID label, so that the RFID label is transferred onto the packaging base material, the process of placing the RFID label into the packaging base material is completed, and the PET substrate is simultaneously subjected to waste discharge.
2. The method for preparing an RFID tag inserted into a packaging substrate in a gold stamping manner according to claim 1, wherein the method comprises the following steps: in the step (6), the RFID label is detected before being placed in the packaging base material, and the damaged RFID label is subjected to skipping treatment when hot pressing, cold pressing or labeling is carried out; and detecting the label after the embedding operation is finished, and identifying the damaged label.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610150943.1A CN105787553B (en) | 2016-03-16 | 2016-03-16 | Preparation method of RFID (radio frequency identification) label embedded in packaging base material in gold stamping mode |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610150943.1A CN105787553B (en) | 2016-03-16 | 2016-03-16 | Preparation method of RFID (radio frequency identification) label embedded in packaging base material in gold stamping mode |
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| CN105787553A CN105787553A (en) | 2016-07-20 |
| CN105787553B true CN105787553B (en) | 2020-05-05 |
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| CN201610150943.1A Active CN105787553B (en) | 2016-03-16 | 2016-03-16 | Preparation method of RFID (radio frequency identification) label embedded in packaging base material in gold stamping mode |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106515245A (en) * | 2016-11-17 | 2017-03-22 | 湖北华威科智能股份有限公司 | Transfer film having radio frequency identification function and manufacturing method thereof |
| CN107292378A (en) * | 2017-06-21 | 2017-10-24 | 上海博感电子科技有限公司 | A kind of manufacture method of anti-transfer electronic tag |
| SE541653C2 (en) | 2017-11-03 | 2019-11-19 | Stora Enso Oyj | Method for manufacturing an RFID tag and an RFID tag comprising an IC and an antenna |
| CN109016908A (en) * | 2018-06-07 | 2018-12-18 | 厦门芯标物联科技有限公司 | A kind of production method of anti-fake thermoprint label |
| CN108846467A (en) * | 2018-06-19 | 2018-11-20 | 孙涵 | The production method of thermoprint RFID electronic label |
| EP3846082A1 (en) | 2019-12-31 | 2021-07-07 | BGT Materials Limited | Heat transfer rfid tag for fabric and method of manufacturing the same |
| CN112381201B (en) * | 2020-11-23 | 2021-06-25 | 江苏科睿坦电子科技有限公司 | Manufacturing method of RFID antenna paper base based on recycled paper and RFID electronic tag |
| CN116526137B (en) * | 2023-06-28 | 2023-09-08 | 博感科技(江苏)有限公司 | Preparation method of metal antenna |
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| CN104063728A (en) * | 2014-06-20 | 2014-09-24 | 上海天臣防伪技术股份有限公司 | Radio frequency identification tag and manufacturing method thereof |
| CN105243417A (en) * | 2015-11-19 | 2016-01-13 | 山东泰宝防伪技术产品有限公司 | RFID printed antenna hot stamped electronic tag and manufacturing method thereof |
| CN105279549A (en) * | 2015-11-19 | 2016-01-27 | 山东泰宝防伪技术产品有限公司 | Gold-stamped RFID tag and preparation method thereof |
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- 2016-03-16 CN CN201610150943.1A patent/CN105787553B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104063728A (en) * | 2014-06-20 | 2014-09-24 | 上海天臣防伪技术股份有限公司 | Radio frequency identification tag and manufacturing method thereof |
| CN105243417A (en) * | 2015-11-19 | 2016-01-13 | 山东泰宝防伪技术产品有限公司 | RFID printed antenna hot stamped electronic tag and manufacturing method thereof |
| CN105279549A (en) * | 2015-11-19 | 2016-01-27 | 山东泰宝防伪技术产品有限公司 | Gold-stamped RFID tag and preparation method thereof |
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| CN105787553A (en) | 2016-07-20 |
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