CN103246918A - Easy-tearing, anti-fake, and ultrahigh frequency paper-base RFID label and manufacturing method thereof - Google Patents
Easy-tearing, anti-fake, and ultrahigh frequency paper-base RFID label and manufacturing method thereof Download PDFInfo
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Abstract
The invention discloses an easy-tearing, anti-fake, and ultrahigh frequency paper-base RFID label and a manufacturing method thereof. The RFID label provided by the invention comprises a destructible layer (1), an electric chip layer (3), an antenna circuit layer (4), a film base material layer (6), a paper base supporting layer (8), and a backing paper layer (10), wherein one side of the electric chip layer (3) is adhered to the inner side surface of the destructible layer (1), the other side of the electric chip layer (3) is compounded with one side of the antenna circuit layer (4); one side of the film base material layer (6) is adhered to the other side of the antenna circuit layer (4); one side of the paper base supporting layer (8) is adhered to the other side of the film base material layer (6); and the backing paper layer (10) is adhered to the other side of the paper base support layer (8). The RFID label provided by the invention has the following technical effects: the reading performance of the label is excellent; the technique stability is improved; the qualification rate of the finished product is high; and the cost is low. Therefore, the label is suitable for large scale industrialization manufacturing.
Description
Technical field
The invention belongs to Internet of Things electronic label technology field, also belong to field of anti-counterfeit technology, be specifically related to a kind of paper substrate and easily tear false proof ultra-high frequency RFID label and manufacture method thereof.
Background technology
REID is used radio frequency identification signal object is identified.REID is a kind of technology of built-in radio chip, can store a series of information in the chip.Usually, rfid system is made up of these three major parts of electronic tag, read write line and data management system.
Electronic tag is made up of antenna and RFID chip, and each chip contains unique identification code, is used for representing the object that electronic tag is accompanying.Being obtained by decals printing behind the RFID antenna packaged chip of RFID label.The RFID antenna mainly contains following several manufacture method at present:
One, wire winding: adopt the copper coil coiling.Shortcoming is the cost height, and speed of production is slow.Ultra-high frequency antenna seldom adopts this technology.
Two, Wiring technique: require the material can the ultrasonic probe hot melt.
Three, silk-screen printing technique: adopt conductive silver paste to print at screen process press usually.Shortcoming is that cost height and conductivity are limited; Advantage is to base material selectivity height.
Four, copper plating process: shortcoming is to have pollution and production line production capacity to have relatively high expectations, and the amount of having only great talent has cost advantage.
Five, die-cutting process: shortcoming is that cross cutting machinery is easy to wear, and the product precision is lower.This technology still is in development at present.
Six, etch process: this technology maturation, etching antenna circuit precision height is flexible good; stable performance is present main flow technology, but; because it is " subtraction " manufacturing process, thus there is the cost control problem, and relate to the environmental protection recovery problem that spent acid is handled.
In many practical applications of RFID technology fields such as () for example drinks are traced to the source, tobacco checking, ticket anti-pseudo, electrical equipment are false proof, require the RFID label to have disposable characteristics, it is destroyed namely to require RFID label one to tear, and can not be transferred repeated use.
The actual RFID label that easily tears that uses mainly contains two types at present, the first kind such as China Patent No. 201220361570.X disclose the frangible etching antenna of a kind of RFID, encapsulation RFID chip, the antenna that will paste chip again shifts and is compound on the fragile self-adhesive paper, makes the RFID label.But, this antenna manufacture difficulty height, qualification rate is low, and antenna transfers on the fragile paper that difficulty is very big, and alignment precision is low, rejection rate height, and waste discharge automatically, manufacturing cost is high.Another kind is printed silver slurry antenna on fragile paper, and packaged chip is made the RFID label then.This method is because the chemical property of printing silver slurry antenna is poor, and label reading performance is low, and manufacturing cost is high, has limited its application.
Summary of the invention
Existing easily tear false proof RFID label and have problems such as manufacturing cost height, unstable properties, rejection rate height for solving, the present invention relates to a kind of paper substrate and easily tear false proof ultra-high frequency RFID label and manufacture method thereof.
The present invention takes following technical scheme: a kind of paper substrate easily tears false proof ultra-high frequency RFID label, destructible layer (1), electronic chip layer (3), antenna circuit layer (4), film substrate layer (6), paper substrate supporting layer (8), ground paper layer (10), the one side of the bonding electronic chip layer of the inner surface of destructible layer (1) (3), the one side of the another side combined antenna circuit layer (4) of electronic chip layer (3), the one side of the another side adhering film substrate layer (6) of antenna circuit layer (4), the one side of the bonding paper substrate supporting layer of the another side of film substrate layer (6) (8), the bonding ground paper layer of another side (10) of paper substrate supporting layer (8).
The thickness of plastic film substrate is between 12 μ m～25 μ m.Plastic sheeting moistened surface tension force is 40～55mN/m after the corona treatment.The structure of version line metal pressure roller is that surface engraving has woven design type or patterns such as cruciate flower type or serrate, and version line resolution is 40～120 orders/inch, and the version line degree of depth is 40～90 μ m.The rolling pressure of metal pressure roller and film is 2～7MPa, and speed is 15～50m/min.Prepared plastic sheeting longitudinal tensile strength is not less than 90MPa, and any direction can free-handly be torn.
The another side of antenna circuit layer (4) is by the one side of composite dry process adhesive phase (5) adhering film substrate layer (6), the composite dry process adhesive phase is high temperature resistant (heatproof＞160 ℃) two-component polyurethane adhesive, gluing thickness is 1～6 μ m, glue spreader resolution is 100～200 orders/inch, the mesh degree of depth is 20～40 μ m, and host: hardening agent: solvent=10:1:6～10:1:25, drying tunnel temperature are 40 ℃～100 ℃, curing time is 2～5 days, and curing temperature is 35 ℃～70 ℃.
Paper substrates adopts the good paper of tearability, for example LWC, super inferior paper, newsprint etc., and the thickness of described paper substrates is 40～150 μ m.
The destructible layer adopts the material of can moulding but destroying easily to make, the macromolecular material of (but being not limited to) fragile paper, wafer, thin layer art paper, destructible etc. for example, and described destructible layer thickness is 100～400 μ m.
(annotate: high frequency is different with the principle of work of ultrahigh frequency, and the working frequency range of high frequency adopts the inductive coupling mode to obtain energy work at 3～30MHz.The working frequency range of ultrahigh frequency obtains energy work at 300MHz～3GHz by the electromagnetic coupled mode.）
Paper substrate of the present invention easily tears the manufacture method of false proof ultra-high frequency RFID label, its with thin layer high-temperature resistance plastice film after intensity reduce to be handled, one side is compound with aluminium foil, another side is compound by bonding agent and release film, release film is peeled off after the etching through printing, antenna and paper substrates is compound, packaged chip then, compound with the figuratum destructible layer of printing and ground paper layer again, obtain easily to tear false proof ultra-high frequency RFID label.The concrete steps of this manufacturing process are as follows:
(1) the film substrate layer is carried out intensity and reduce processing;
Thin layer high-temperature resistance plastice film surface coating diglycol is the synthetic polyester of raw material, and corona treatment, reduces the surface strength of plastic sheeting, uses version line metal pressure roller that plastic sheeting is carried out roll extrusion then and handles, and reduces the tearability of plastic sheeting.The prepared plastic sheeting of easily tearing must have enough longitudinal tensile strength on the one hand, can satisfy the compound stretching requirement of film and aluminium foil, must have good tearability on the other hand, can satisfy free-hand this film of tearing of all directions.
(2) film substrate layer and the aluminium foil after will handling is compound; Can adopt composite dry process to make composite membrane.
(3) by bonding agent that another side and the release film supporting layer of the plastic film substrate layer of compound aluminium foil is bonding, make the clad aluminum foil that has the release film supporting layer;
Bonding agent can use two-component polyurethane adhesive, hot melt adhesive, seccotine or epoxy glue etc.
(4) adopt antiacid etching alkali solubility printing ink at aluminium foil surface printed antenna pattern;
(5) use the acid solution etching to have the aluminium foil of antenna pattern, acid solution can be hydrochloric acid, also can be liquor ferri trichloridi, phosphoric acid, nitric acid etc.Remove the printing ink of aluminium foil surface again with alkaline solution, alkaline solution can be sodium hydroxide solution, sodium carbonate liquor, solution of potassium carbonate etc.Then, washing dry rolling again;
(6) the release film supporting layer is peeled off, by bonding agent that antenna and paper substrates is compound again;
(7) use electronic tag packaging machine packaged chip, namely in the outside surface packaging electronic chip layer of antenna circuit layer, make paper substrate and easily tear the dried Inlay of etching RFID;
(8) paper substrate easily tear etching RFID do Inlay by the RFID label machine at paper substrate back side inkjet printing, make paper substrate and easily tear ultra-high frequency RFID label; Perhaps, the compound destructible layer of the outside surface of electronic chip layer, the compound ground paper layer of the outside surface of paper substrates, make after the cross cutting waste discharge and have the ultra-high frequency RFID label that easily tears security feature that (can using RFID label packaging machine that paper substrate is easily torn etching RFID, to do Inlay compound with the figuratum adhesive sticker destructible layer 1 of printing, compound with the ground paper layer 10 that scribbles adhesive sticker then, after the cross cutting waste discharge, make have the ultra-high frequency RFID label that easily tears security feature).
Preferably, the thickness requirement of plastic film substrate is between 12 μ m～25 μ m.Plastic sheeting moistened surface tension force is 40～55mN/m after the corona treatment.The structure of version line metal pressure roller is that surface engraving has woven design type or patterns such as cruciate flower type or serrate, and version line resolution is 40～120 orders/inch, and the version line degree of depth is 40～90 μ m.The rolling pressure of metal pressure roller and film is 2～7MPa, and speed is 15～50m/min.Prepared plastic sheeting longitudinal tensile strength is not less than 90MPa, and any direction can free-handly be torn.
Preferably, the composite dry process adhesive phase is high temperature resistant (heatproof＞160 ℃) two-component polyurethane adhesive, gluing thickness is 1～6 μ m, glue spreader resolution is 100～200 orders/inch, the mesh degree of depth is 20～40 μ m, and host: hardening agent: solvent=10:1:6～10:1:25, drying tunnel temperature are 40 ℃～100 ℃, curing time is 2～5 days, and curing temperature is 35 ℃～70 ℃.
Preferably, the release film supporting layer adopts the deflection height, the film that pulling strengrth is high, and for example release PET film, release OPP film, release PE film etc., and off-type force is gentlier for well, and described release film supporting layer 10 thickness are 30～75 μ m.
Preferably, paper substrates adopts the good paper of tearability, for example LWC, super inferior paper, newsprint etc., and the thickness of described paper substrates is 40～150 μ m.
Preferably, the destructible layer adopts the material of can moulding but destroying easily to make, the macromolecular material of (but being not limited to) fragile paper, wafer, thin layer art paper, destructible etc. for example, and described destructible layer thickness is 100～400 μ m.
The common thickness of aluminium foil is between 9～55 μ m.The volumetric concentration of etching solution is preferably between 5%～40%.Etching speed is preferably between 1～15m/min.
Manufacture method of the present invention is at first carried out intensity to the antenna film substrate and is reduced processing, make label antenna obtain good tearability, compound with paper substrates then, easily tear antifalsification label with compound the making of destructible layer again, easily tear RFID label technology of preparing and compare with existing, owing to increase one deck low-intensity film lining base, its technology stability improves, and product qualified rate significantly improves, and label reading performance is good, cost further reduces, and is fit to large-scale industrialized production.RFID easily tears antenna and paper substrates is compound can be made into white label by packaged chip, can obtain the ultra-high frequency RFID label that paper substrate easily tears security feature at paper substrate back side ink-jet print pattern, further simplify the process route that the present invention proposes, be beneficial in clothes drop, commercial product label, postal service the application of falling ticket, production automation Management label, selling inventory management label, shipping label and sample label.
Paper substrate of the present invention easily tears false proof ultra-high frequency RFID label and has following technique effect: label reading performance is good, and technology stability improves, the product qualified rate height, and cost is low, is fit to large-scale industrialized production.
Description of drawings
Fig. 1 is the structural representation that a kind of preferred paper substrate easily tears false proof ultra-high frequency RFID label.
Fig. 2 is the manufacturing process route map that paper substrate easily tears false proof ultra-high frequency RFID label.
Fig. 3 a is that plastic film substrate intensity reduces the used metal pressure roller of embossed version line synoptic diagram in the processing.
Fig. 3 b is the I portion enlarged drawing of Fig. 3 a.
Each operation synoptic diagram of false proof ultra-high frequency RFID label manufacturing process is easily torn in Fig. 4～9th, paper substrate.
Among the figure: 1-destructible layer, 2-first non-drying glue layer, 3-electronic chip layer, 4-antenna circuit layer, 5-composite dry process adhesive phase, 6-antenna film substrate layer, the 7-adhesive phase, 8-paper substrate supporting layer, 9-second non-drying glue layer, 10-ground paper layer, 11-release film supporting layer, 12-band release film lining base easily tear etching RFID label antenna, 13-aluminium foil, 14-paper substrate easily tear etching RFID label antenna, it is the proprietary word of RFID industry that the 15-paper substrate easily tears the dried Inlay(Inlay of etching RFID, just be called behind the RFID antenna pasting chip and do Inlay, with the compound Inlay that wets that just is called of facial tissue and the base stock that scribbles hot melt adhesive, printed patterns just can be called label on facial tissue more again).
Embodiment
Further specify technical scheme of the present invention below in conjunction with accompanying drawing and by preferred embodiment.
Consult shown in Figure 1, the present embodiment paper substrate easily tears false proof ultra-high frequency RFID label, destructible layer 1, first non-drying glue layer 2, electronic chip layer 3, antenna circuit layer 4, composite dry process adhesive phase 5, film substrate layer 6, adhesive phase 7, paper substrate supporting layer 8, second non-drying glue layer 9, ground paper layer 10, the inner surface of destructible layer 1 is by the one side of first non-drying glue layer, 2 bonding electronic chip layers 3, the one side of the another side combined antenna circuit layer 4 of electronic chip layer 3, the another side of antenna circuit layer 4 is by the one side of composite dry process adhesive phase 5 adhering film substrate layers 6, the another side of film substrate layer 6 is by the one side of adhesive phase 7 bonding paper substrate supporting layers 8, and the another side of paper substrate supporting layer 8 is by second non-drying glue layer, 9 bonding ground paper layers 10.
The thickness of plastic film substrate 6 is between 12 μ m～25 μ m.Plastic sheeting moistened surface tension force is 40～55mN/m after the corona treatment.The structure of version line metal pressure roller is that surface engraving has woven design type or patterns such as cruciate flower type or serrate, and version line resolution is 40～120 orders/inch, and the version line degree of depth is 40～90 μ m.The rolling pressure of metal pressure roller and film is 2～7MPa, and speed is 15～50m/min.Prepared plastic sheeting longitudinal tensile strength is not less than 90MPa, and any direction can free-handly be torn.
Composite dry process adhesive phase 5 is high temperature resistant (heatproof＞160 ℃) two-component polyurethane adhesive, gluing thickness is 1～6 μ m, glue spreader resolution is 100～200 orders/inch, the mesh degree of depth is 20～40 μ m, host: hardening agent: solvent=10:1:6～10:1:25(volume ratio), drying tunnel temperature is 40 ℃～100 ℃, and the curing time is 2～5 days, and curing temperature is 35 ℃～70 ℃.
Paper substrates adopts the good paper of tearability, for example LWC, super inferior paper, newsprint etc., and the thickness of described paper substrates is 40～150 μ m.
Consult shown in Fig. 2～9, the manufacturing process that a kind of preferred paper substrate easily tears false proof ultra-high frequency RFID label is as follows:
(1) be the synthetic polyester of raw material at 18 μ m PET film surfaces coating diglycol, wetting tension reaches 45mN/m through the corona treatment rear surface, using woven design stencilling line metal pressure roller that plastic sheeting is carried out roll extrusion then handles, version line resolution is 80 orders/inch, the version line degree of depth is 80 μ m, shown in Fig. 3 a, 3b.The rolling pressure of metal pressure roller and film is 5MPa, and speed is 20m/min, reduces the tearability of plastic sheeting, and prepared plastic sheeting longitudinal tensile strength is 125MPa.
(2) it is compound that the PET film substrate after will handling and 10 μ m aluminium foils adopt composite dry process, glue spreader resolution is 100～200 orders/inch, the mesh degree of depth is 20～40 μ m, adhesive therefor is high temperature resistant (180 ℃) two-component polyurethane adhesive, host: hardening agent: solvent=10:1:10(volume ratio), in the present embodiment, host is that ADCOTE502S, hardening agent are that Catalyst F, solvent are ethyl acetate; Drying tunnel temperature is for being followed successively by 50 ℃, and 70 ℃, 90 ℃.Curing time is 3 days, and curing temperature is 50 ℃, as shown in Figure 4.
(3) bonding agent 7 adopts hot melt adhesives, and the release PET of the another side of the plastic film substrate of compound aluminium foil and 50 μ m is bonding, makes the clad aluminum foil that has the release film supporting layer, as shown in Figure 5.
(3) use antiacid etching alkali solubility printing ink at composite membrane aluminium foil surface printed antenna pattern, as shown in Figure 6.
(4) the hydrochloric acid solution etching of use 25% has the clad aluminum foil of antenna pattern, removes the printing ink of aluminium foil surface then with 6% sodium hydroxide solution usefulness, rolling behind washing and drying, as shown in Figure 6.
(5) the release film supporting layer is peeled off, antenna bonding agent aspect and LWC is compound, and the thickness of used LWC is 50 μ m, as shown in Figure 7.
(6) use electronic tag packaging machine packaged chip, as shown in Figure 8.
(7) use RFID label packaging machine that PET release film supporting layer is peeled off, the RFID antenna be printed with pattern and have 300 μ m fragile paper of adhesive sticker compound, compound with the silicone oil base stock that scribbles adhesive sticker then, after the cross cutting waste discharge, make and have the ultra-high frequency RFID label that easily tears security feature, as shown in Figure 9.
During use, the silicone oil base stock is taken off, the RFID label is attached on the commodity and gets final product.
The related electronic tag packaging machine of the present invention, RFID label packaging machine etc. all can adopt prior art.
More than the preferred embodiments of the present invention are had been described in detail, for those of ordinary skill in the art, according to thought provided by the invention, the part that on embodiment, can change, and these changes also should be considered as protection scope of the present invention.
Claims (10)
1. a paper substrate easily tears false proof ultra-high frequency RFID label, it is characterized in that comprising destructible layer (1), electronic chip layer (3), antenna circuit layer (4), film substrate layer (6), paper substrate supporting layer (8), ground paper layer (10), the one side of the bonding electronic chip layer of the inner surface of destructible layer (1) (3), the one side of the another side combined antenna circuit layer (4) of electronic chip layer (3), the one side of the another side adhering film substrate layer (6) of antenna circuit layer (4), the one side of the bonding paper substrate supporting layer of the another side of film substrate layer (6) (8), the bonding ground paper layer of another side (10) of paper substrate supporting layer (8).
2. paper substrate as claimed in claim 1 easily tears false proof ultra-high frequency RFID label, it is characterized in that: the thickness of plastic film substrate layer is between 12 μ m～25 μ m.
3. paper substrate as claimed in claim 1 easily tears false proof ultra-high frequency RFID label, it is characterized in that: the paper substrate supporting layer adopts LWC, super inferior paper or newsprint.
4. easily tear false proof ultra-high frequency RFID label as claim 1 or 3 described paper substrates, it is characterized in that: the thickness of paper substrate supporting layer is 40～150 μ m.
5. paper substrate as claimed in claim 1 easily tears false proof ultra-high frequency RFID label, it is characterized in that: the destructible layer adopts the macromolecular material of fragile paper, wafer, thin layer art paper or destructible; And/or the thickness of destructible layer is 100～400 μ m.
6. manufacture method that the described paper substrate of claim 1-5 easily tears false proof ultra-high frequency RFID label, its concrete steps are as follows:
(1) the film substrate layer is carried out intensity and reduce processing;
(2) film substrate layer and the aluminium foil after will handling is compound;
(3) by bonding agent that another side and the release film supporting layer of the plastic film substrate layer of compound aluminium foil is bonding, make the clad aluminum foil that has the release film supporting layer;
(4) adopt antiacid etching alkali solubility printing ink at aluminium foil surface printed antenna pattern;
(5) etching of use acid solution has the aluminium foil of antenna pattern, removes the printing ink of aluminium foil surface again with alkaline solution, then, and washing dry rolling again;
(6) the release film supporting layer is peeled off, by bonding agent that antenna and paper substrates is compound again;
(7) use electronic tag packaging machine packaged chip, namely in the outside surface packaging electronic chip layer of antenna circuit layer, make paper substrate and easily tear the dried Inlay of etching RFID;
(8) paper substrate easily tear etching RFID do Inlay by the RFID label machine at paper substrate back side inkjet printing, make paper substrate and easily tear ultra-high frequency RFID label; Perhaps, the compound destructible layer of the outside surface of electronic chip layer, the compound ground paper layer of the outside surface of paper substrates is made after the cross cutting waste discharge and is had the ultra-high frequency RFID label that easily tears security feature.
7. the manufacture method of easily tearing false proof ultra-high frequency RFID label as paper substrate as described in the claim 6, it is characterized in that: in (1) step, film substrate layer coating diglycol is the synthetic polyester of raw material, and corona treatment, uses version line metal pressure roller that the film substrate layer is carried out roll extrusion then and handles.
8. the manufacture method of easily tearing false proof ultra-high frequency RFID label as paper substrate as described in the claim 7, it is characterized in that: corona treatment rear film substrate layer moistened surface tension force is 40～55mN/m.
9. the manufacture method of easily tearing false proof ultra-high frequency RFID label as paper substrate as described in the claim 6, it is characterized in that: in (3) step, bonding agent is selected two-component polyurethane adhesive, hot melt adhesive, seccotine or epoxy glue etc. for use.
10. the manufacture method of easily tearing false proof ultra-high frequency RFID label as paper substrate as described in claim 6 or 9, it is characterized in that: the release film supporting layer adopts release PET film, release OPP film or release PE film; And/or the thickness of release film supporting layer is 30～75 μ m.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000251046A (en) * | 1999-03-01 | 2000-09-14 | Hitachi Maxell Ltd | Noncontact ic tag |
| CN102017298A (en) * | 2008-05-09 | 2011-04-13 | 东洋铝株式会社 | Antenna circuit configuring body for IC card/tag, and IC card |
| CN201965650U (en) * | 2011-02-17 | 2011-09-07 | 陵嘉防伪技术（上海）有限公司 | Intelligent electronic seal |
| CN202362817U (en) * | 2011-10-11 | 2012-08-01 | 浙江钧普科技股份有限公司 | Electronic tag ensured to be destroyed as soon as being torn |
| CN102915461A (en) * | 2012-08-07 | 2013-02-06 | 厦门英诺尔电子科技股份有限公司 | High-frequency fragile radio frequency identification devices (RFID) electronic tag with anti-shifting function and method for producing tag |
-
2013
- 2013-05-09 CN CN201310173518.0A patent/CN103246918B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000251046A (en) * | 1999-03-01 | 2000-09-14 | Hitachi Maxell Ltd | Noncontact ic tag |
| CN102017298A (en) * | 2008-05-09 | 2011-04-13 | 东洋铝株式会社 | Antenna circuit configuring body for IC card/tag, and IC card |
| CN201965650U (en) * | 2011-02-17 | 2011-09-07 | 陵嘉防伪技术（上海）有限公司 | Intelligent electronic seal |
| CN202362817U (en) * | 2011-10-11 | 2012-08-01 | 浙江钧普科技股份有限公司 | Electronic tag ensured to be destroyed as soon as being torn |
| CN102915461A (en) * | 2012-08-07 | 2013-02-06 | 厦门英诺尔电子科技股份有限公司 | High-frequency fragile radio frequency identification devices (RFID) electronic tag with anti-shifting function and method for producing tag |
Non-Patent Citations (1)
| Title |
|---|
| 刘彩凤等: "RFID标签天线的制造方案", 《包装世界》 * |
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| CN107766913A (en) * | 2017-12-07 | 2018-03-06 | 上海优比科物联网技术有限公司 | A kind of RFID manufacturing process and RFID |
| CN108764429A (en) * | 2018-03-07 | 2018-11-06 | 厦门信达光电物联科技研究院有限公司 | A kind of RFID electronic label and preparation method thereof of frangible anti-transfer |
| CN108177392A (en) * | 2018-03-20 | 2018-06-19 | 湖州市湖芯物联网科技有限公司 | A kind of multi-functional card continuously acting production lines and technique |
| CN110414653A (en) * | 2018-04-28 | 2019-11-05 | 华瑞墨石丹阳有限公司 | A kind of RFID label tag and its processing method and graphene antenna |
| CN110414653B (en) * | 2018-04-28 | 2024-02-02 | 华瑞墨石丹阳有限公司 | RFID tag, processing method thereof and graphene antenna |
| CN110619809A (en) * | 2019-09-30 | 2019-12-27 | 上海西文服饰有限公司 | Anti-fake tag for clothing goods |
| CN111370845B (en) * | 2020-04-10 | 2024-02-27 | 江苏科睿坦电子科技有限公司 | Novel double-frequency fragile RFID tag antenna and production method thereof |
| CN112170145A (en) * | 2020-10-28 | 2021-01-05 | 浙江道明新材料有限公司 | Aluminum-based anti-counterfeiting release film |
| CN112170145B (en) * | 2020-10-28 | 2024-04-02 | 浙江道明新材料有限公司 | Aluminium base anti-fake release film |
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