CN107766913A - A kind of RFID manufacturing process and RFID - Google Patents
A kind of RFID manufacturing process and RFID Download PDFInfo
- Publication number
- CN107766913A CN107766913A CN201711283041.6A CN201711283041A CN107766913A CN 107766913 A CN107766913 A CN 107766913A CN 201711283041 A CN201711283041 A CN 201711283041A CN 107766913 A CN107766913 A CN 107766913A
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- rfid
- circuit coil
- side circuit
- compound
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 150000001875 compounds Chemical class 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 238000005520 cutting process Methods 0.000 claims abstract description 29
- 238000012545 processing Methods 0.000 claims abstract description 12
- 238000012856 packing Methods 0.000 claims abstract description 7
- 239000003292 glue Substances 0.000 claims description 58
- 229920000297 Rayon Polymers 0.000 claims description 49
- 239000007800 oxidant agent Substances 0.000 claims description 49
- 230000001590 oxidative effect Effects 0.000 claims description 49
- 230000004888 barrier function Effects 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 14
- 238000009413 insulation Methods 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 239000012943 hotmelt Substances 0.000 claims 2
- 238000010073 coating (rubber) Methods 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 22
- 230000008569 process Effects 0.000 abstract description 11
- 238000005516 engineering process Methods 0.000 abstract description 7
- 239000002253 acid Substances 0.000 abstract description 3
- 238000010923 batch production Methods 0.000 abstract description 3
- 238000003486 chemical etching Methods 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract description 3
- 238000007493 shaping process Methods 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 abstract description 3
- 239000002351 wastewater Substances 0.000 abstract description 3
- 238000007757 hot melt coating Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000005030 aluminium foil Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000009967 tasteless effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The present invention relates to electronic label technology field, discloses a kind of RFID manufacturing process and RFID, and the manufacturing process comprises the following steps：S100, make front-side circuit coil and reverse side circuit coil；S200, the front-side circuit coil and reverse side circuit coil be compounded to form RFID circuit coil；S300, in a side packing intelligent chip of the RFID circuit coil and compound with art paper, opposite side and release paper substrates are compound；RFID is made in S400, shape by die-cutting；The RFID is made up of process above.RFID manufacturing process and RFID provided by the invention, using die-cutting machine shape by die-cutting, shape by die-cutting is a kind of Physical Processing technique, compared to traditional chemical etching process, process without spent acid, without salkali waste, without ink, without waste water and non-exhaust emission, it is environmentally friendly, economize on resources；And shape by die-cutting technique is simple, machining accuracy is high, shaping is rapid, yield is high, it is adapted to batch production.
Description
Technical field
The present invention relates to electronic label technology field, more particularly to a kind of RFID manufacturing process and RFID electronics
Label.
Background technology
Radio frequency identification (RFID, Radio Frequency Identification) technology, is a kind of communication technology,
Specific objective can be identified by radio signals and reads and writes related data, without establishing machine between identifying system and specific objective
Tool or optical contact.Compared with traditional label technique, have identification accuracy is high, identification distance flexibly, information storage it is big,
The advantages such as read or write speed is fast, reusable and contamination resistance and durability are strong, therefore be increasingly taken seriously and extensive
Use.
But in the prior art, the etching technique in the traditional processing technology of electronic tag is faced with the problem of many new,
Such as：Environmental pollution, complex process, material are harmful etc..From the point of view of the angle of environmental protection and the long term growth of enterprise, if
It is that this area needs to solve to count the simple RFID manufacturing process of a kind of pollution-free and technique and RFID
Technical problem.
The content of the invention
It is existing to solve it is an object of the invention to provide a kind of RFID manufacturing process and RFID
In technology the problem of RFID manufacturing process pollution environment, complex process and influence health.
To use following technical scheme up to this purpose, the present invention：
A kind of RFID manufacturing process, comprises the following steps：
S100, make front-side circuit coil and reverse side circuit coil；
S200, the front-side circuit coil and reverse side circuit coil be compounded to form RFID circuit coil；
S300, in a side packing intelligent chip of the RFID circuit coil and compound with art paper, opposite side with it is release
Paper substrates are compound；
RFID is made in S400, shape by die-cutting.
As optimal technical scheme, also include between step S200 and step S300：
S201, front-side circuit coil and reverse side circuit coil to the RFID circuit coil carry out communication and form loop.
As optimal technical scheme, opposite side by the RFID circuit coil and release paper substrates in step S300
Also include before compound：The opposite side of the RFID circuit coil and coil carrying substrate layer is compound.
As optimal technical scheme, step S100 includes：
S101, the side to coiled material carry out insulation processing and form insulating barrier；
S102, the first viscose glue oxidant layer is applied on the insulating barrier；
S103, the coiled material opposite side apply the second viscose glue oxidant layer and in the second viscose glue oxidant layer it is compound release
Ply of paper；
S104, shape by die-cutting；
S105, the front-side circuit coil is made using the S101-S104, is made of the S101-S104 described
Reverse side circuit coil.
As optimal technical scheme, also include between step S201 and step S300：
S202, peel off the off-style paper layer.
As optimal technical scheme, step S101 carries out insulation processing using dry compound machine to the side of coiled material.
As optimal technical scheme, step S102 applies first viscose glue using dry compound machine on the insulating barrier
Oxidant layer.
As optimal technical scheme, step S103 is compound release in the second viscose glue oxidant layer using hot melt coating machine
Ply of paper.
As optimal technical scheme, step S200 uses dry compound machine by the front-side circuit coil and reverse side circuit line
Circle is compounded to form RFID circuit coil.
As optimal technical scheme, the RFID circuit coil encapsulation there is into intelligence using hot melt coating machine in step S300
The side of energy chip and art paper are compound, and opposite side and release paper substrates are compound.
A kind of RFID, including art paper, the 4th viscose glue oxidant layer, intelligent chip, conductive glue, front-side circuit line
Circle, insulating barrier, reverse side circuit coil, the 3rd viscose glue oxidant layer, coil carrying substrate layer, the 5th viscose glue oxidant layer and release paper gasket
Bottom, wherein, the first viscose glue oxidant layer is coated with the insulating barrier, the front-side circuit coil passes through with the reverse side circuit coil
The first viscose glue oxidant layer is compound, and the intelligent chip is encapsulated on the front-side circuit coil by conductive glue, is packaged with
The front-side circuit coil of the intelligent chip is bonded on the art paper by the 4th viscose glue oxidant layer, the reverse side
Circuit coil is bonded on the coil carrying substrate layer by the 3rd viscose glue oxidant layer, and the coil carrying substrate layer passes through
The 5th viscose glue oxidant layer is bonded in the release paper substrates；The front-side circuit coil, reverse side circuit coil and final
RFID finished product passes through die-cutting machine shape by die-cutting.
Beneficial effects of the present invention：
RFID manufacturing process and RFID provided by the invention, using die-cutting machine shape by die-cutting, mould
The type of being cut into is a kind of Physical Processing technique, compared to traditional chemical etching process, process without spent acid, without salkali waste, oil-free
Ink, without waste water and non-exhaust emission, it is environmentally friendly, economize on resources；And shape by die-cutting technique is simple, machining accuracy is high, shaping is fast
Speed, yield are high, are adapted to batch production.
Brief description of the drawings
Fig. 1 is the flow chart of RFID manufacturing process provided by the invention；
Fig. 2 is the decomposing schematic representation of RFID provided by the invention；
Fig. 3 is that RFID provided by the invention tears art paper and the structural representation of release paper substrates off.
In figure：
1- art papers；The viscose glue oxidant layer of 2- the 4th；3- intelligent chips；4- conductive glues；5- front-side circuit coils；6- insulate
Layer；7- reverse side circuit coils；The viscose glue oxidant layer of 8- the 3rd；9- coil carrying substrate layers；The viscose glue oxidant layer of 10- the 5th；The release paper gaskets of 11-
Bottom；12- tie points.
Embodiment
Below in conjunction with the accompanying drawings technical scheme is further illustrated with embodiment.It is understood that this place
The specific embodiment of description is used only for explaining the present invention, rather than limitation of the invention.It also should be noted that in order to
It is easy to describe, part related to the present invention is illustrate only in accompanying drawing and not all.
As shown in Figure 1-Figure 3, present embodiment discloses a kind of RFID manufacturing process, comprise the following steps：
S100, make front-side circuit coil 5 and reverse side circuit coil 7；
S200, front-side circuit coil 5 and reverse side circuit coil 7 be compounded to form RFID circuit coil；
S300, the side packing intelligent chip 3 in RFID circuit coil and, opposite side and release liners compound with art paper 1
Substrate 11 is compound；
RFID is made in S400, shape by die-cutting.
Wherein, step S100 includes：
S101, the side to coiled material carry out insulation processing and form insulating barrier 6；
S102, the first viscose glue oxidant layer is applied on insulating barrier 6；
S103, in the opposite side of coiled material apply the second viscose glue oxidant layer and the compound release liners in the second viscose glue oxidant layer
Layer；
S104, shape by die-cutting；
S105, front-side circuit coil 5 is made using step S101-S104, reverse side circuit is made using step S101-S104
Coil 7.
Specifically, step S101 carries out insulation processing using dry compound machine to the side of coiled material, and technological parameter is：Temperature
80 DEG C -100 DEG C, 10-20 ms/min of speed.
Specifically, step S102 applies the first viscose glue oxidant layer using dry compound machine on insulating barrier 6, and technological parameter is：
150 DEG C -200 DEG C of temperature, 10-20 ms/min of speed.
Specifically, step S103 uses hot melt coating machine compound off-style paper layer, technological parameter in the second viscose glue oxidant layer
For：120 DEG C -180 DEG C of temperature, 10-30 ms/min of speed.
Specifically, step S104 uses die-cutting machine by the above-mentioned coiled material physics shape by die-cutting after S101-S103 is handled.
Further, front-side circuit coil 5 is made using step S101-S104, similarly, using step S101-
Reverse side circuit coil 7 is made in S104.After front-side circuit coil 5 and reverse side circuit coil 7 is made, by the He of front-side circuit coil 5
One side of the reverse side circuit coil 7 away from off-style paper layer snaps together, and is bonded in one by the first viscose glue oxidant layer of buckling surface
Rise, be compounded to form RFID circuit coil, now the front-side circuit coil 5 in RFID circuit coil and reverse side circuit coil 7 are because buckleing
The presence of insulating barrier 6 in conjunction face, and be not implemented and conduct.
Specifically, front-side circuit coil 5 and reverse side circuit coil 7 are compounded to form by step S200 using dry compound machine
RFID circuit coil, technological parameter are：120 DEG C -180 DEG C of temperature, 4-10 ms/min of speed.
To realize connecting for the front-side circuit coil 5 in RFID circuit coil and reverse side circuit coil 7, step S200 and step
Also include between rapid S300：Step S201, the front-side circuit coil 5 to RFID circuit coil and reverse side circuit coil 7 carry out ditch
It is logical to form loop.
Specifically, insertion is processed on the predeterminated position of RFID circuit coil by die-cutting machine referring to Fig. 3, step S201
Front-side circuit coil 5 is connected to form loop by the tie point 12 of RFID circuit coil, tie point 12 with reverse side circuit coil 7.
Due to being by front-side circuit when front-side circuit coil 5 and reverse side circuit coil 7 are compounded to form RFID circuit coil
The one side of coil 5 and reverse side circuit coil 7 away from off-style paper layer snaps together, therefore front-side circuit coil 5 and reverse side circuit
The non-buckling surface of coil 7, that is, coated with the second viscose glue oxidant layer and be compounded with off-style paper layer one side towards outside, entering
, it is necessary to the off-style paper layer of front-side circuit coil 5 and reverse side circuit coil 7 be stripped down, after being before row next step S300
Continuous step is prepared, namely is also included between step S201 and step S300：Step S202, off-style paper layer is peeled off.
After off-style paper layer stripping, by before RFID circuit coil and the release compound working procedure of paper substrates 11 in step S300
Also include：RFID circuit coil is compound by the 3rd viscose glue oxidant layer 8 and coil carrying substrate layer 9.The coil carrying substrate layer 9
Setting add the optical property and weatherability of RFID, further obstruct ultraviolet, further increase RFID electricity
The service life of subtab.Coil carrying substrate layer 9 can be PET polyester films, but be not limited to this.
In the present embodiment, the process of the side packing intelligent chip 3 in step S300 in RFID circuit coil includes：Use
High-precision chip encapsulating device spot printing conductive glue 4 in the specified location of RFID circuit coil, then fills out intelligent chip 3
Mounted in the surface of conductive glue 4, intelligent chip 3 is set to be tied up with RFID circuit coil the solidification of conductive glue 4 finally by heat pressing process
It is fixed firm.
It should be noted that there is the side packing intelligence of front-side circuit coil 5 in RFID circuit coil in the present embodiment
Chip 3 and compound art paper 1, in the compound release paper substrates 11 in the side with reverse side circuit coil 7, but it is not limited to the knot
Structure, opposite setting can also be carried out according to being actually needed.
In the present embodiment, RFID circuit coil encapsulation there is into intelligent chip 3 using hot melt coating machine in step S300
Side is compound by the 4th viscose glue oxidant layer 2 and art paper 1, and the opposite side for being compounded with coil carrying substrate layer 9 passes through the 5th viscose glue
Oxidant layer 10 and release paper substrates 11 are compound, and its technological parameter is：120 DEG C -180 DEG C of temperature, 6-15 ms/min of speed.
Specifically, the coiled material for having completed above-mentioned Overall Steps is carried out by shape by die-cutting, system using die-cutting machine in step S400
Into final RFID finished product.
RFID provided by the invention, its front-side circuit coil 5, reverse side circuit coil 7, tie point 12 and final
RFID finished product by die-cutting machine shape by die-cutting, shape by die-cutting is a kind of Physical Processing technique, compared to tradition
Chemical etching process, process without spent acid, without salkali waste, without ink, without waste water and non-exhaust emission, it is environmentally friendly, save
Resource；And shape by die-cutting technique is simple, machining accuracy is high, shaping is rapid, yield is high, it is adapted to batch production.
The present embodiment additionally provides a kind of RFID, as shown in Fig. 2-Fig. 3, the RFID system more than
Technique is made to be made.Referring to Fig. 2, the RFID includes art paper 1, the 4th viscose glue oxidant layer 2, intelligent chip 3, conductive glue
4th, front-side circuit coil 5, insulating barrier 6, reverse side circuit coil 7, the 3rd viscose glue oxidant layer 8, coil carrying substrate layer 9, the 5th viscose glue
Oxidant layer 10 and release paper substrates 11.
Wherein, the material used in front-side circuit coil 5 and reverse side circuit coil 7 can be aluminium foil, copper foil or silver paste, this
Embodiment is preferably aluminium foil.
Wherein, release paper substrates 11 play a part of protecting the 5th viscose glue oxidant layer 10.In actual use, it is only necessary to will be from
Type paper substrates 11 are removed from the 5th viscose glue oxidant layer 10, you can label is pasted on article, completes the stickup of label.
Off-style paper layer and release paper substrates 11 in the present embodiment use glaxin release paper, glaxin release paper paper
Surface is smooth, matter is close, smooth and bright, heat-resisting water-tolerant, is not easy to cause change in size, the degree of packing and die-cutting performance after making moist
It is excellent, it is particularly suitable for cross cutting processing, and paper can be made very thin, meet the processing request of electronic tag.
In the present embodiment, the first viscose glue oxidant layer, the second viscose glue oxidant layer, the 3rd viscose glue oxidant layer 8, the 4th viscose glue oxidant layer 2 with
And the 5th viscose glue oxidant layer 10 use PUR because PUR is a kind of adhesive of plasticity, in certain temperature model
Its physical state changes and changed with temperature in enclosing, and chemical characteristic is constant, and its is nonpoisonous and tasteless, belongs to environmental-protecting chemical product.Cause
Itself it is solid state, therefore is easy to pack, transport and store, and simple production process have that bonding strength is big, speed is fast
The advantages that.
The RFID that the present embodiment provides has environmentally friendly advantage because employing above-mentioned manufacture craft.
Obviously, the above embodiment of the present invention is just for the sake of clearly illustrating example of the present invention, and it is pair to be not
The restriction of embodiments of the present invention.For those of ordinary skill in the field, may be used also on the basis of the above description
To make other changes in different forms.There is no necessity and possibility to exhaust all the enbodiments.It is all this
All any modification, equivalent and improvement made within the spirit and principle of invention etc., should be included in the claims in the present invention
Protection domain within.
Claims (11)
1. a kind of RFID manufacturing process, it is characterised in that comprise the following steps：
S100, make front-side circuit coil (5) and reverse side circuit coil (7)；
S200, the front-side circuit coil (5) and reverse side circuit coil (7) be compounded to form RFID circuit coil；
S300, in a side packing intelligent chip (3) of the RFID circuit coil and compound with art paper (1), opposite side with from
Type paper substrates (11) are compound；
RFID is made in S400, shape by die-cutting.
2. RFID manufacturing process according to claim 1, it is characterised in that step S200 and step S300 it
Between also include：
S201, front-side circuit coil (5) and reverse side circuit coil (7) to the RFID circuit coil link up and formed back
Road.
3. RFID manufacturing process according to claim 2, it is characterised in that step S100 includes：
S101, the side to coiled material carry out insulation processing and form insulating barrier (6)；
S102, the first viscose glue oxidant layer is applied on the insulating barrier (6)；
S103, in the opposite side of the coiled material apply the second viscose glue oxidant layer and the compound release liners in the second viscose glue oxidant layer
Layer；
S104, shape by die-cutting；
S105, the front-side circuit coil (5) is made using the S101-S104, is made of the S101-S104 described anti-
Face circuit coil (7).
4. RFID manufacturing process according to claim 3, it is characterised in that step S201 and step S300 it
Between also include：
S202, peel off the off-style paper layer.
5. RFID manufacturing process according to claim 1, it is characterised in that described in the general in step S300
Also include before the opposite side of RFID circuit coil and release paper substrates (11) are compound：By the opposite side of the RFID circuit coil
It is compound with coil carrying substrate layer (9).
6. RFID manufacturing process according to claim 3, it is characterised in that step S101 is compound using dry type
Machine carries out insulation processing to the side of coiled material.
7. RFID manufacturing process according to claim 3, it is characterised in that step S102 is compound using dry type
Machine applies the first viscose glue oxidant layer on the insulating barrier (6).
8. RFID manufacturing process according to claim 3, it is characterised in that step S103 uses hot-melt
Cloth machine compound off-style paper layer in the second viscose glue oxidant layer.
9. RFID manufacturing process according to claim 1, it is characterised in that step S200 is compound using dry type
The front-side circuit coil (5) and reverse side circuit coil (7) are compounded to form RFID circuit coil by machine.
10. RFID manufacturing process according to claim 1, it is characterised in that using hot melt in step S300
Rubber coating has the RFID circuit coil encapsulation that the side of intelligent chip (3) and art paper (1) are compound, opposite side with it is release
Paper substrates (11) are compound.
A kind of 11. RFID, it is characterised in that including art paper (1), the 4th viscose glue oxidant layer (2), intelligent chip (3),
Conductive glue (4), front-side circuit coil (5), insulating barrier (6), reverse side circuit coil (7), the 3rd viscose glue oxidant layer (8), coil are held
Substrate layer (9), the 5th viscose glue oxidant layer (10) and release paper substrates (11) are carried, wherein, first is coated with the insulating barrier (6)
Viscose glue oxidant layer, the front-side circuit coil (5) and the reverse side circuit coil (7) compound, the institute by the first viscose glue oxidant layer
State intelligent chip (3) to be encapsulated on the front-side circuit coil (5) by conductive glue (4), be packaged with the intelligent chip (3)
The front-side circuit coil (5) be bonded in by the 4th viscose glue oxidant layer (2) on the art paper (1), reverse side electricity
Map (7) is bonded on the coil carrying substrate layer (9) by the 3rd viscose glue oxidant layer (8), the coil carrying base
Material layer (9) is bonded on the release paper substrates (11) by the 5th viscose glue oxidant layer (10)；The front-side circuit coil
(5), reverse side circuit coil (7) and final RFID finished product pass through die-cutting machine shape by die-cutting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711283041.6A CN107766913A (en) | 2017-12-07 | 2017-12-07 | A kind of RFID manufacturing process and RFID |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711283041.6A CN107766913A (en) | 2017-12-07 | 2017-12-07 | A kind of RFID manufacturing process and RFID |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107766913A true CN107766913A (en) | 2018-03-06 |
Family
ID=61277708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711283041.6A Pending CN107766913A (en) | 2017-12-07 | 2017-12-07 | A kind of RFID manufacturing process and RFID |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107766913A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112766448A (en) * | 2021-01-19 | 2021-05-07 | 佳源科技股份有限公司 | RFID electronic tag with long service life |
| CN115648344A (en) * | 2022-12-28 | 2023-01-31 | 成都普什信息自动化有限公司 | Die cutting method and system for RFID label structure |
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