CN115648344B - Die cutting method and system for RFID label structure - Google Patents
Die cutting method and system for RFID label structure Download PDFInfo
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- CN115648344B CN115648344B CN202211687645.8A CN202211687645A CN115648344B CN 115648344 B CN115648344 B CN 115648344B CN 202211687645 A CN202211687645 A CN 202211687645A CN 115648344 B CN115648344 B CN 115648344B
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Abstract
The invention discloses a die cutting method and a die cutting system of an RFID (radio frequency identification) label structure, which relate to the technical field of RFID label anti-counterfeiting, and on one hand, the offset caused by system errors is determined by analyzing the motion parameters of a main cutting mechanism based on the design parameters of a die cutting machine, and on the other hand, the die cutting pressure error is analyzed based on the characteristic data of the process of testing die cutting according with materials and combining with the actual test die cutting; the relative position of the positioned composite material and the die cutting tool and the die cutting pressure are compensated in advance, so that the die cutting precision is improved; different analysis methods are used for calculating the displacement offset and the pressure error, one analysis method is based on system components and motion characteristic analysis, and the other analysis method is based on actual test die cutting process analysis, so that the bias error caused by one analysis method can be reduced.
Description
Technical Field
The invention relates to the technical field of RFID anti-counterfeiting, in particular to a die cutting method and a die cutting system for an RFID label structure.
Background
Currently, the RFID technology is applied to the anti-counterfeit industry, and usually, a single RFID tag is adhered to the surface of an outer package of a commodity to realize one-to-one binding of RFID data and the commodity, a merchant writes specified data into the chip of the tag before leaving a factory, and a consumer reads the data in the chip of the tag through a mobile phone NFC or other reader-writer after purchasing the commodity, and then interacts with server data to judge the authenticity of the commodity.
The die-cutting machine can be used for processing without stopping for a long time, the upper die-cutting and the lower die-cutting are repeatedly moved at high frequency, the self-locking energy of the pressure adjusting mechanism is limited, and the pressure adjusting mechanism can be unconsciously displaced under the influence of frequent movement, so that the die-cutting pressure is changed to influence the die-cutting precision; for scenes that the precision requirement of RFID labels is high or the thickness of workpieces is not uniform, difficulty is brought to properly grasping die-cutting pressure in die-cutting operation, relative slippage phenomenon easily occurs, and die-cutting precision is affected.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the die-cutting machine can be used for processing without stopping for a long time, the upper die-cutting and the lower die-cutting are repeatedly moved at high frequency, the self-locking energy of the pressure adjusting mechanism is limited, and the pressure adjusting mechanism can be unconsciously displaced under the influence of frequent movement, so that the die-cutting pressure is changed to influence the die-cutting precision; for scenes such as RFID labels with higher precision requirements or uneven workpiece thickness, difficulty is brought to proper control of die cutting pressure and positioning in die cutting operation; the invention aims to provide a die cutting method and a die cutting system of an RFID label structure, on one hand, the movement parameters of a main cutting mechanism are analyzed based on the design parameters of a die cutting machine to determine the displacement offset caused by system errors, and on the other hand, the die cutting pressure error is analyzed based on the characteristic data of the process of testing die cutting by conforming materials and combining with the actual test die cutting; and the relative position of the positioned composite material and the die cutting tool and the die cutting pressure are compensated in advance, so that the die cutting precision is improved.
The invention is realized by the following technical scheme:
the scheme provides a die cutting method of an RFID label structure, which comprises the following steps:
the method comprises the following steps: compounding the component layers of the RFID label structure to obtain a composite material;
step two: acquiring design parameters of a die-cutting machine, testing die-cutting the composite material after the composite material is tested, and acquiring characteristic data of the testing die-cutting process;
step three: calculating the offset of the main cutting mechanism according to the design parameters and the characteristic data, and calculating the die cutting pressure error according to the characteristic data;
step four: and compensating the relative position of the positioned composite material and the die cutting tool by considering the offset of the main cutting mechanism, compensating the die cutting pressure by considering the error amount of the die cutting pressure, and starting the die cutting machine to perform die cutting on the composite material.
The working principle of the scheme is as follows: in the actual die cutting process, the die cutting machine can often perform processing without stopping for a long time, the upper die cutting and the lower die cutting are repeatedly moved at high frequency, the self-locking energy of the pressure adjusting mechanism is limited, and displacement can be unconsciously generated under the influence of frequent movement to cause die cutting pressure change; because the RFID label structure in the scheme is added with the barrier layer, the whole thickness of the RFID label structure is uneven, difficulty is brought to proper control of die-cutting pressure in die-cutting operation, relative slippage between a die-cutting tool and the RFID label structure is further aggravated by combining the material of the RFID label structure and system errors, and actual cutting errors are further caused; finally, the label formed by die cutting is kept on the adhesive layer base paper. The actual cutting error is difficult to meet the requirement of the die cutting precision of the electronic tag on the superposition of the systematic error; according to the die cutting method of the RFID tag structure, on one hand, the motion parameters of the main cutting mechanism are analyzed based on the design parameters of the die cutting machine to determine the displacement offset caused by the system error, and on the other hand, the die cutting pressure error is analyzed based on the material conforming to the requirements and the characteristic data of the actual test die cutting process; and the relative position of the positioned composite material and the die cutting tool and the die cutting pressure are compensated in advance, so that the die cutting precision is improved.
According to the scheme, different analysis methods are used for calculating the displacement offset and the pressure error, one analysis method is based on system component and motion characteristic analysis, and the other analysis method is based on actual test die cutting process analysis, so that the bias error caused by one analysis method can be reduced.
The further optimization scheme is that the composition layers of the RFID label structure comprise: surface label layer, barrier layer, inlay layer and adhesive layer
The inlay layer is pasted on the anti-counterfeiting object through the adhesive layer, the surface label layer is overlapped and pasted on the inlay layer surface, and the blocking layer is arranged between the surface label layer and the inlay layer to enable part of the surface label layer to be pasted with the inlay layer.
In order to solve the problem that the existing RFID label can be completely recovered by a counterfeiter, the scheme prevents recovering the RFID label structure and provides a structural scheme which can lead to the failure of the RFID function when the label is uncovered:
RFID label structure is paper base mark layer + inlay layer + two-sided glue film usually, wherein because the inlay layer is the chip and the antenna of RFID label, the material is the paper base usually, PET or PI material, and these materials belong to breakable material, it is damaged very easily, under the condition on no face mark layer, when solitary inlay layer + two-sided glue film is pasted on anti-fake article, can't take off inlay layer is complete, but after inlay layer surface covers the upper face mark, bond together through the glue film between the material, the intensity has been superposed, inlay layer can be taken off by whole complete when leading to taking off the mark. However, the surface label layer can not be omitted as a protective layer of the inlay layer and a complete uncovering piece, so that on the premise of keeping the surface label layer, a technical idea of 'enabling the surface label layer and the inlay layer not to be completely attached but only partially attached' is provided, so that in the process of uncovering the RFID label, the inlay layer of the area A to which the surface label layer and the inlay layer are attached is pulled by the surface label layer to be separated from the anti-counterfeiting object, the inlay layer of the area B to which the surface label layer and the inlay layer are not attached cannot be pulled in the same direction as the inlay layer of the area A, and the inlay layer of the area B cannot be pulled in multiple directions by the inlay layer of the area A due to the fact that the inlay layer of the area A is uncovered, the inlay layer of the area B is damaged and broken, and the function of the RFID cannot be recovered, and the RFID function cannot be recovered. The material of the preferred barrier layer is selected from interleaving paper.
The further optimization scheme is that the area of the barrier layer is 1/3 of that of the inlay layer, and the maximum width position of the barrier layer is superposed with the maximum width position of the inlay layer.
The RFID label structure is a round or rectangular RFID label structure, the scheme is suitable for the common label structure, for the rectangular RFID label structure, the length of the barrier layer is equal to that of the inlay layer, and the width of the barrier layer is smaller than that of the inlay layer; for a circular RFID label structure, the length of the blocking layer is equal to the diameter of the inlay layer, and the inlay layer in a partial area is guaranteed to be damaged and cannot be recovered.
Preferably, the geometric center of the blocking layer coincides with the geometric center of the inlay layer, and for a rectangular RFID tag structure, the center line of the shorter side of the blocking layer overlaps with the center line of the shorter side of the inlay layer, and in general, the geometric center of the inlay layer is a chip, and the antenna is distributed around the chip, so that the blocking layer covers the chip to ensure that the antenna of the inlay layer is damaged when the RFID tag is uncovered.
The further optimization scheme is that the die cutting tool is a unimodal cutting die; and for the position of the cutting surface with the barrier layer, the oblique angle surface of the die cutting tool faces one side of the RFID label structure, and the vertical surface of the die cutting tool faces one side of the waste outside the RFID label structure.
Due to the fact that the blocking layer is added to the RFID label structure, the whole thickness of the RFID label structure is uneven, and the adhesive on the adhesive layer is extruded and accumulated around the trimming edges or adhered to the die cutting tool in the cutting process, the finished RFID label structure is easily adhered to each other when being collected; when the die cutting tool cuts after the excessive adhesive accumulation, the die cutting tool and the surface label layer of the RFID label structure can slide relatively, and further cutting errors are caused. This scheme is through unimodal cutting die cutting RFID label structure, and cross cutting cutter bevel face is towards RFID label structure one side, and the viscose is extruded evenly to be filled in cross cutting cutter's oblique angle space during the cutting, and the viscose deposit has certain space to make the area on cutting in-process face mark layer enlarge and is enough to cover the viscose deposit, has avoided the viscose deposit to spill over the phenomenon of adhesion cutter or label.
For a rectangular RFID label structure, the corresponding die cutting tools on the longer two sides of the rectangular RFID label structure can be a die cutting tool with a vertical surface facing one side of the RFID label structure and an inclined surface facing one side of the waste outside the RFID label structure; because its shorter both sides are for having the position of barrier layer, consequently correspond the cross cutting cutter and be bevel face towards RFID label structure one side, vertical face towards the outer waste material one side of RFID label structure to avoid the phenomenon that the viscose deposit overflows to appear on shorter both sides.
For a round RFID label structure, the cost problems of die-cutting tool die sinking and the like are considered, the oblique angle surface of the die-cutting tool directly faces one side of the RFID label structure, and the vertical surface of the die-cutting tool faces one side of waste materials outside the RFID label structure to be cut.
The further optimization scheme is that the first step comprises the following processes:
after the group of the surface mark layers, the multiple groups of the barrier layers and the group of the inlay layers are aligned, feeding together to complete the first compounding of the surface mark layers, the barrier layers and the inlay layers;
and stripping the base belt of the inlay layer of the first composite material, and feeding the stripped base belt and the adhesive layer together to complete second composite to obtain the composite material.
The further optimization scheme is that the design parameters of the die-cutting machine comprise: the motion stroke S of the movable platform, the horizontal distance C from the axis of the crank to the farthest position of the hinge of the movable platform, the eccentricity E of the axis of the crank, the length ratio B of the crank, the production speed V, the allowable deviation delta R of the radius of the crank, the allowable deviation delta L of the length of a connecting rod and the allowable deviation delta E of the eccentricity;
the further optimization scheme is that the calculation process of the main cutting mechanism offset comprises the following steps:
s1, calculating a crank radius R and a connecting rod length L based on design parameters of a die-cutting machine;
s2, taking random variables x and y as a first size coefficient and a second size coefficient of the crank radius R, the connecting rod length L and the eccentricity E, wherein the random variables x and y areWherein x = R/L; y = E/L; calculating the standard deviation F of the first size factor x And standard deviation F of second size factor y ：
S3, calculating displacement standard deviation F of the sliding block based on S1-S2 z And displacement deviation delta S, taking the displacement deviation delta S of the sliding block as the offset of the main cutting mechanism;
slider displacement deviation Δ S =3F z
Where A is the angle of rotation of the crank.
When calculating the standard deviation by a probabilistic method, taking known design parameters and the calculated crank radius R and connecting rod length L as the average values thereof; the method comprises the steps of analyzing and solving the motion parameter deviation and standard deviation of a main cutting mechanism by a binary random variable analysis method and a probability statistical method on the basis of design parameters, determining the random change condition of the size of a component of a double-toggle-rod mechanism by calculation, analyzing the motion change condition of the main cutting mechanism (sliding block), analyzing the offset of the main cutting mechanism (sliding block) by considering influence factors such as component allowable errors, kinematic pair fit clearance and the like, and performing advanced compensation on the relative position of a positioned composite material and a die cutting tool so as to improve the die cutting precision.
According to a further optimization scheme, the test die cutting process comprises the following steps:
t1, assembling n groups of composite materials A on a movable platform of a die-cutting machine, assembling pressure-sensitive paper on a fixed platform of the die-cutting machine, carrying out die-cutting with a limited size, and collecting the colors of pressure-sensitive paper when 70-80% of the tangent lines of the composite materials A can be punched through to obtain a group of die-cutting pressure data; the method comprises the steps of arranging a pressure-sensitive paper tool on a movable platform of a die-cutting machine, placing a standard block on a fixed platform of the die-cutting machine for die cutting with a limited size, and collecting pressure-sensitive paper color when 70-80% of a tangent line of a composite material 1 can be punched through to obtain a group of die-cutting pressure data; averaging the two groups of die cutting pressure data to obtain a first die cutting pressure; the material of the composite material A is consistent with that of the part of the composite material containing the barrier layer;
t2, arranging n groups of composite materials B on a movable platform of a die cutting machine, arranging pressure sensing paper on a fixed platform of the die cutting machine, carrying out die cutting with a limited size, and collecting the color of the pressure sensing paper when all composite material B cutting lines can be punched through to obtain a group of die cutting pressure data; the method comprises the following steps of (1) mounting pressure-sensitive paper on a movable platform of a die-cutting machine, placing a standard block on a fixed platform of the die-cutting machine for die cutting with a limited size, and collecting pressure-sensitive paper colors when all composite material B tangents can be punched through to obtain two groups of die-cutting pressure data; averaging the two groups of die cutting pressure data to obtain second die cutting pressure; the material of the composite material A is consistent with that of the part of the composite material containing the barrier layer;
t3, n groups of composite materials are mounted on a movable platform of a die cutting machine, pressure sensing paper is mounted on a fixed platform of the die cutting machine for die cutting with a limited size, pressure sensing paper colors when all composite material cutting lines can be punched through are collected, and a group of die cutting pressure data is obtained; the method comprises the steps that pressure-sensitive paper is mounted on a movable platform of a die-cutting machine, a standard block is placed on a fixed platform of the die-cutting machine for die cutting with a limited size, pressure-sensitive paper colors when all composite material cutting lines can be punched through are collected, and a group of die-cutting pressure data is obtained; averaging the two groups of die cutting pressure data to obtain a third die cutting pressure;
and T4, calculating a testing die cutting pressure based on the first die cutting pressure, the second die cutting pressure and the third die cutting pressure, and subtracting the testing die cutting pressure from the theoretical die cutting pressure to obtain a die cutting pressure error.
The die cutting pressure error value measured by using the sensing pressure is large, in order to reduce errors, on one hand, a plurality of groups of composite materials are respectively assembled on a movable platform and a fixed platform of a die cutting machine to carry out grouping test and average values of two groups of die cutting pressure data, on the other hand, the composite materials, the materials of the parts, containing the barrier layer, of the composite materials and the materials of the parts, not containing the barrier layer, of the composite materials are respectively carried out grouping test, and the average values are obtained, so that the bias errors can be reduced, and more accurate die cutting pressure values can be obtained.
The scheme also provides a die cutting system of the RFID label structure, which is used for realizing the die cutting method of the RFID label structure; the method comprises the following steps: the device comprises a compound station, a die cutting station, an acquisition module, a calculation module and an adjustment module;
the compounding station is used for compounding the surface mark layer, the barrier layer, the inlay layer and the adhesive layer to obtain a composite material;
the calculation module is used for acquiring design parameters of the die-cutting machine, testing die-cutting based on the composite material and collecting characteristic data of the testing die-cutting process;
the die cutting station is used for carrying out die cutting or test die cutting on the composite material;
the calculation module is used for calculating the offset of the main cutting mechanism according to the design parameters and the characteristic data and calculating the die cutting pressure error according to the characteristic data;
the adjusting module is used for compensating the relative position of the positioned composite material and the die cutting tool in consideration of the offset of the main cutting mechanism, adjusting theoretical die cutting pressure in consideration of die cutting pressure error, and starting the die cutting machine to perform die cutting on the composite material.
The further optimization scheme is that the compound station comprises a first compound station and a second compound station;
synchronously feeding a group of surface mark layers, a plurality of groups of barrier layers and a group of inlay layers to a first compounding station, and finishing the first compounding of the surface mark layers, the barrier layers and the inlay layers after the first compounding station is aligned;
synchronously feeding the first composite material and the group of adhesive layers to a second composite station, and stripping the inlay layer bottom belt at the second composite station to complete second composite to obtain a composite material;
the composite material is collected in groups after die cutting at a die cutting station.
Compared with the prior art, the invention has the following advantages and beneficial effects:
according to the die cutting method and system of the RFID tag structure, on one hand, the offset caused by system errors is determined by analyzing the motion parameters of the main cutting mechanism based on the design parameters of the die cutting machine, and on the other hand, the die cutting pressure error is analyzed based on the characteristic data of the material-conforming test die cutting process and the actual test die cutting process; and the relative position of the positioned composite material and the die cutting tool and the die cutting pressure are compensated in advance, so that the die cutting precision is improved. According to the scheme, different analysis methods are used for calculating the displacement offset and the pressure error, one analysis method is based on system component and motion characteristic analysis, and the other analysis method is based on actual test die cutting process analysis, so that the bias error caused by one analysis method can be reduced.
Drawings
In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and that for those skilled in the art, other related drawings can be obtained from these drawings without inventive effort. In the drawings:
FIG. 1 is a schematic flow diagram of a method for die cutting an RFID label structure.
FIG. 2 is a schematic diagram of an RFID tag structure;
FIG. 3 is a schematic diagram of a process for tearing off an RFID label;
FIG. 4 is a schematic cross-sectional view of a die cutter and RFID tag construction;
FIG. 5 is a schematic view of a double toggle lever mechanism of the die cutting machine;
fig. 6 is a schematic view of a portion of a die cutting system for RFID label construction.
Reference numbers and corresponding part names in the figures:
1-surface label layer, 2-barrier layer, 3-inlay layer, 31-area A, 32-area B, 4-adhesive layer, 5-surface label layer waste discharge, 6-surface label layer feeding, 7-lining paper layer feeding, 8-inlay layer feeding, 9-inlay layer waste discharge, 10-adhesive layer waste discharge, 11-adhesive layer feeding, 12-first compounding station, 13-second compounding station, 14-die cutting station, 15-die cutting waste discharge, 16-composite material, 17-movable platform, 18-fixed platform, 19-anti-counterfeiting object, 20-die cutting tool, 21-filling space, 22-sliding block, 23-toggle rod, 24-crank and 25-connecting rod.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.
Example 1
In the actual die cutting process, the die cutting machine is usually processed without stopping for a long time, the upper die cutting and the lower die cutting are repeatedly moved at high frequency, the self-locking energy of the pressure adjusting mechanism is limited, and the pressure adjusting mechanism can be unconsciously displaced under the influence of frequent movement to cause die cutting pressure change; the barrier layer is added to the RFID label structure in the scheme, the whole thickness of the RFID label structure is uneven, difficulty is brought to proper control of die cutting pressure in die cutting operation, relative slippage between a die cutting tool and the RFID label structure is further aggravated by combining the material quality of the RFID label structure and system errors, and actual cutting errors are further caused; finally, the label formed by die cutting is remained on the adhesive layer base paper. The actual cutting error is difficult to meet the requirement of the die cutting precision of the electronic tag on the superposition of the systematic error; to this end, this embodiment provides a die-cutting method of RFID tag structure, as shown in fig. 1, the method includes the following steps:
first, as shown in fig. 2 to 3, the constituent layers of the RFID tag structure in this embodiment include: the adhesive comprises a surface mark layer 1, a barrier layer 2, an inlay layer 3 and an adhesive layer 4;
RFID label structure is paper base mark layer + inlay layer + double-sided adhesive layer usually, wherein because the inlay layer is the chip and the antenna of RFID label, the material is the paper base usually, PET or PI material, and these materials belong to breakable material, it is damaged very easily, under the condition on no face mark layer, when solitary inlay layer + double-sided adhesive layer is pasted on anti-fake article, can't take off inlay layer is complete, but after inlay layer surface covers the upper face mark, bond together through the glue film between the material, the intensity has been superposed, inlay layer can be taken off by whole complete when leading to taking off the mark. However, the surface label layer is used as a protective layer of the inlay layer and a complete uncovering piece can not be omitted, on the premise of keeping the surface label layer, the invention provides a technical idea of 'not completely attaching the surface label layer and the inlay layer, but only partially attaching' so that in the process of uncovering the RFID label, the inlay layer of the attaching area A31 of the surface label layer 1 and the inlay layer 3 is pulled by the surface label layer to be separated from the anti-counterfeiting object, the inlay layer of the non-attaching area B32 of the surface label layer 1 and the inlay layer 3 can not be pulled in the same direction as the inlay layer of the area A31, and the inlay layer of the area B32 is uncovered, but the inlay layer of the area B32 can be pulled in multiple directions by the inlay layer of the area A31 to be damaged and broken, thereby damaging the antenna on the inlay layer 3, causing the failure of the RFID function, and being unable to be recovered. Slip paper is selected as the material of the preferred barrier layer.
The area of the barrier layer 2 is 1/3 of the area of the inlay layer 3, and the maximum width position of the barrier layer 2 coincides with the maximum width position of the inlay layer 3.
The RFID label structure is a round or rectangular RFID label structure, the scheme is just suitable for the common label structure, for the rectangular RFID label structure, the length of the barrier layer is equal to that of the inlay layer, and the width of the barrier layer is smaller than that of the inlay layer; for a circular RFID label structure, the length of the blocking layer is equal to the diameter of the inlay layer, and the inlay layer in a partial area is guaranteed to be damaged and cannot be recovered.
Preferably, the geometric center of the blocking layer coincides with the geometric center of the inlay layer, and for a rectangular RFID tag structure, the center line of the shorter side of the blocking layer overlaps with the center line of the shorter side of the inlay layer, and in general, the geometric center of the inlay layer is a chip, and the antenna is distributed around the chip, so that the blocking layer covers the chip to ensure that the antenna of the inlay layer is damaged when the RFID tag is uncovered.
The method comprises the following steps: compounding the component layers of the RFID label structure to obtain a composite material; the method specifically comprises the following steps:
after the group of surface mark layers, the multiple groups of barrier layers and the group of inlay layers are aligned, feeding together to complete the first compounding of the surface mark layers, the barrier layers and the inlay layers;
and stripping the base belt of the inlay layer of the first composite material, and feeding the stripped base belt and the adhesive layer together to complete second composite to obtain the composite material.
Step two: acquiring design parameters of a die-cutting machine, testing die-cutting the composite material after the composite material is tested, and acquiring characteristic data of the testing die-cutting process; the design parameters of the die cutting machine comprise: the motion stroke S of the movable platform, the horizontal distance C from the axis of the crank to the farthest position of the hinge of the movable platform, the eccentricity E of the axis of the crank, the length ratio B of the crank, the production speed V, the allowable deviation delta R of the radius of the crank, the allowable deviation delta L of the length of a connecting rod and the allowable deviation delta E of the eccentricity;
as shown in the schematic diagram of the double-toggle-rod mechanism of the die-cutting machine in fig. 5, the movable platform 17 of the die-cutting machine, the fixed platform 18 of the die-cutting machine is contacted and pressed to complete the die-cutting work, the fixed platform 18 of the die-cutting machine is fixed, the movable platform 17 is driven by the double-toggle-rod mechanism to move up and down, and the double-toggle-rod mechanism comprises: the crank 24 and the toggle rods 23 and the connecting rods 25 on both sides are connected by hinges, so that the movable platform connected with the double-toggle rod mechanism does not perform straight-up and straight-down reciprocating motion, but performs a circular motion in a left-right swinging and up-down fluctuating mode. The main cutting mechanism of the die cutting process is the opposite (namely vertical) movement between the platforms. During the die cutting process by the upward movement of the movable platform, the horizontal displacement movement is also existed (though not very large); on the other hand, the movable platform generally has a certain amount of inclination. When the movable platform applies pressure to the knife plate at a certain angle, the contact sequence difference (deformation caused by the knife strip is not considered temporarily) is generated certainly, one end of the movable platform is contacted with the knife plate firstly, the other end of the movable platform is contacted with the knife plate secondly, after the movable platform is contacted with the knife plate, the mass center of the movable platform moves horizontally, the contacted end is displaced and dislocated, and the platform drives the piece to be die-cut to slide transversely. Then, if the end contacted first is in the right position, the end contacted later is necessarily deviated from the theoretical right position, so that the die cutting error is necessarily caused, and the error is determined by the motion characteristic of the die cutting system and belongs to the system error. Due to the fact that the blocking layer is added to the RFID label structure, the whole thickness of the RFID label structure is uneven, and the relative slippage phenomenon between the die cutting tool and the RFID label structure can be further caused by combining the material and system errors of the RFID label structure, so that the cutting error is further caused; in the embodiment, the motion parameters of the crank sliding block are analyzed based on the design parameters of the die cutting machine, the random change condition of the size of the member of the double-toggle-rod mechanism is calculated and determined through a probability method, the motion change condition of the main cutting mechanism is analyzed, the offset of the main cutting mechanism is analyzed by considering the influence factors such as member allowable error, kinematic pair fit clearance and the like, the relative position of the positioned composite material and the die cutting tool is compensated in advance, and the die cutting precision is improved.
Step three: calculating the offset of the main cutting mechanism according to the design parameters and the characteristic data, and calculating the die cutting pressure error according to the characteristic data;
the calculation process of the main cutting mechanism offset comprises the following steps:
s1, calculating a crank radius R and a connecting rod length L based on design parameters of a die-cutting machine;
s2, taking random variables x and y as a first size coefficient and a second size coefficient of a crank radius R, a connecting rod length L and an eccentricity E, wherein x = R/L; y = E/L; calculating the standard deviation F of the first size factor x And standard deviation F of second size factor y ：
S3, calculating displacement standard deviation F of the sliding block based on S1-S2 z And a displacement deviation delta S, wherein the displacement deviation delta S of the slide block is used as the offset of the main cutting mechanism;
slider displacement deviation Δ S =3F z
Where A is the angle of rotation of the crank.
The test die cutting process includes:
t1, assembling n groups of composite materials A on a movable platform of a die-cutting machine, assembling pressure-sensitive paper on a fixed platform of the die-cutting machine, carrying out die-cutting with a limited size, and collecting the colors of pressure-sensitive paper when 70-80% of the tangent lines of the composite materials A can be punched through to obtain a group of die-cutting pressure data; the method comprises the steps of arranging a pressure-sensitive paper tool on a movable platform of a die-cutting machine, placing a standard block on a fixed platform of the die-cutting machine for die cutting with a limited size, and collecting the color of pressure-sensitive paper when 70-80% of a tangent line of a composite material A can be punched through to obtain a group of die-cutting pressure data; averaging the two groups of die cutting pressure data to obtain a first die cutting pressure; the material of the composite material A is consistent with that of the part of the composite material containing the barrier layer;
t2, arranging n groups of composite materials B on a movable platform of a die cutting machine, arranging pressure sensing paper on a fixed platform of the die cutting machine, carrying out die cutting with a limited size, and collecting the color of the pressure sensing paper when all composite material B cutting lines can be punched through to obtain a group of die cutting pressure data; the method comprises the following steps of (1) mounting pressure-sensitive paper on a movable platform of a die-cutting machine, placing a standard block on a fixed platform of the die-cutting machine for die cutting with a limited size, and collecting pressure-sensitive paper colors when all composite material B tangents can be punched through to obtain two groups of die-cutting pressure data; averaging the two groups of die cutting pressure data to obtain second die cutting pressure; the material of the composite material A is consistent with that of the part of the composite material containing the barrier layer;
t3, assembling n groups of composite materials on a movable platform of a die cutting machine, assembling pressure sensing paper on a fixed platform of the die cutting machine for die cutting with a limited size, and collecting the colors of the pressure sensing paper when all composite material tangent lines can be punched through to obtain a group of die cutting pressure data; the method comprises the steps that pressure-sensitive paper is mounted on a movable platform of a die-cutting machine, a standard block is placed on a fixed platform of the die-cutting machine for die cutting with a limited size, pressure-sensitive paper colors when all composite material cutting lines can be punched through are collected, and a group of die-cutting pressure data is obtained; averaging the two groups of die cutting pressure data to obtain a third die cutting pressure;
and T4, calculating a testing die cutting pressure based on the first die cutting pressure, the second die cutting pressure and the third die cutting pressure, and subtracting the testing die cutting pressure from the theoretical die cutting pressure to obtain a die cutting pressure error amount.
Step four: and compensating the relative position of the positioned composite material and a die cutting tool by considering the offset of the main cutting mechanism, compensating the die cutting pressure by considering the error of the die cutting pressure, and starting the die cutting machine to perform die cutting on the composite material.
As shown in fig. 4, the die cutting tool is a unimodal cutting die; and for the position of the cutting surface with the blocking layer, the oblique angle surface of the die cutting tool faces one side of the RFID label structure, and the vertical surface of the die cutting tool faces one side of the waste outside the RFID label structure.
Because the blocking layer is added to the RFID label structure, the whole thickness of the RFID label structure is uneven, and the viscose on the adhesive layer is extruded and accumulated around the trimming edges or is stuck on the die cutting cutter in the cutting process, so that the finished RFID label structures are easily adhered to each other when being collected; when the die cutting tool cuts after excessive adhesive deposits, the die cutting tool and the surface label layer of the RFID label structure can slide relatively, and further cutting errors are caused. This scheme is through unimodal cutting die cutting RFID label structure, and 20 bevel face of cross cutting cutter are towards RFID label structure one side, and the viscose is extruded evenly to be filled in cross cutting cutter's oblique angle space during the cutting, and the viscose deposit has certain filling space 21 to make the area on cutting process in the face mark layer enlarge and be enough to cover the viscose deposit, has avoided the viscose deposit to spill over the phenomenon of adhesion cutter or label.
For a rectangular RFID label structure, the corresponding die cutting tools on the longer two sides of the rectangular RFID label structure can be a die cutting tool with a vertical surface facing one side of the RFID label structure and an inclined surface facing one side of the waste outside the RFID label structure; because its shorter both sides are for having the position of barrier layer, consequently correspond cutting tool 20 for the bevel face towards RFID label structure one side, vertical face towards the outer waste material one side of RFID label structure to avoid the phenomenon that the viscose deposit overflows to appear on shorter both sides.
For a round RFID label structure, the cost problems of die cutting tool die sinking and the like are considered, the oblique angle face of the die cutting tool directly faces one side of the RFID label structure, and the vertical face of the die cutting tool cuts one side of waste materials outside the RFID label structure.
In the die cutting system of the RFID tag structure provided by this embodiment, on one hand, the motion parameters of the main cutting mechanism are analyzed based on the design parameters of the die cutting machine to determine the displacement offset caused by the system error, and on the other hand, the die cutting pressure error is analyzed based on the feature data of the material-conforming test die cutting process and the actual test die cutting process; and the relative position of the positioned composite material and the die cutting tool and the die cutting pressure are compensated in advance, so that the die cutting precision is improved.
Example 2
The embodiment provides a die cutting system of an RFID tag structure, which is used for implementing the die cutting method of the RFID tag structure described in the previous embodiment; the method comprises the following steps: a composite station, a die cutting station 14, an acquisition module, a calculation module and an adjustment module;
the compounding station is used for compounding the surface mark layer, the barrier layer, the inlay layer and the adhesive layer to obtain a composite material;
the calculation module is used for acquiring design parameters of the die cutting machine, testing die cutting based on the composite material and collecting characteristic data of the testing die cutting process;
the die-cutting station 14 is used for performing die-cutting or test die-cutting on the composite material;
the calculation module is used for calculating the offset of the main cutting mechanism according to the design parameters and the characteristic data and calculating the die cutting pressure error according to the characteristic data;
the adjusting module is used for compensating the relative position of the positioned composite material and the die cutting tool in consideration of the offset of the main cutting mechanism, adjusting theoretical die cutting pressure in consideration of die cutting pressure error, and starting the die cutting machine to perform die cutting on the composite material.
As shown in fig. 6, the compounding stations include a first compounding station 12 and a second compounding station 13;
synchronously feeding a group of surface label layer feeding materials 6, three groups of liner paper layer feeding materials 7 and a group of inlay layer feeding materials 8 to a first compounding station 12, and finishing the first compounding of the surface label layer, the barrier layer and the inlay layer after the first compounding station 12 is aligned; the label layer waste discharge 5 and the inlay layer waste discharge 9 are completed before entering the first compound station 12.
Synchronously feeding the first composite material and the group of adhesive layers to a second composite station 13, and stripping an inlay layer bottom belt at the second composite station 13 to complete second composite to obtain a composite material; the adhesive layer waste 10 is completed before entering the second compounding station 13.
The composite materials are collected in groups after being subjected to die cutting at a die cutting station 14, wherein the collecting rings of two adjacent groups of composite materials 16 are arranged in a staggered mode in a high-low mode and are collected at different angles respectively, the collecting rings at the high position can share one rotating shaft, and the collecting rings at the low position can share one rotating shaft so as to save energy consumption.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (5)
1. A method of die cutting an RFID label structure comprising the steps of:
the method comprises the following steps: compounding the component layers of the RFID label structure to obtain a composite material;
the RFID tag structure includes component layers: the adhesive comprises a surface mark layer (1), a barrier layer (2), an inlay layer (3) and an adhesive layer (4); the inlay layer (3) is adhered to the anti-counterfeiting object through the adhesive layer (4), the surface label layer (1) is overlapped and adhered to the surface of the inlay layer (3), and the blocking layer (2) is arranged between the surface label layer (1) and the inlay layer (3) to prevent part of the surface label layer (1) and the inlay layer (3) from being adhered;
the first step comprises the following processes:
after the group of surface mark layers, the multiple groups of barrier layers and the group of inlay layers are aligned, feeding together to complete the first compounding of the surface mark layers, the barrier layers and the inlay layers;
stripping the inlay layer bottom tape subjected to the first composite discharging, and then feeding the inlay layer bottom tape together with the adhesive layer to complete second composite to obtain a composite material;
step two: acquiring design parameters of a die cutting machine, performing test die cutting based on the composite material and collecting characteristic data of the test die cutting process;
the design parameters of the die cutting machine comprise: the motion stroke S of the movable platform, the horizontal distance C from the axle center of the crank to the farthest position of the hinge of the movable platform, the eccentricity E of the axle center of the crank, the length ratio B of the crank, the production speed V, the allowable deviation delta R of the radius of the crank, the allowable deviation delta L of the length of a connecting rod and the allowable deviation delta E of the eccentricity;
step three: calculating the offset of the main cutting mechanism according to the design parameters and the characteristic data, and calculating the die cutting pressure error according to the characteristic data;
the calculation process of the main cutting mechanism offset comprises the following steps:
s1, calculating a crank radius R and a connecting rod length L based on design parameters of a die-cutting machine:
wherein: s is the movement stroke of the movable platform; c is the horizontal distance from the axis of the crank to the farthest position of the hinge of the movable platform; e is the eccentricity of the axis of the crank; b is the length ratio of the crank;
s2, taking random variables x and y as a first size coefficient and a second size coefficient of a crank radius R, a connecting rod length L and an eccentricity E, wherein x = R/L; y = E/L; calculating the standard deviation F of the first size factor x And standard deviation F of second size factor y ：
Wherein: Δ R is crank radius tolerance; Δ L is the link length tolerance; Δ E is an eccentricity tolerance;
s3, calculating the standard deviation F of the displacement of the sliding block based on the S1-S2 z And a displacement deviation delta S, wherein the displacement deviation delta S of the slide block is used as the offset of the main cutting mechanism;
slider displacement deviation Δ S =3F z
Wherein A is the rotation angle of the crank;
step four: compensating the relative position of the positioned composite material and a die cutting tool by considering the offset of the main cutting mechanism, adjusting theoretical die cutting pressure by considering die cutting pressure error, and starting a die cutting machine to perform die cutting on the composite material;
the die cutting tool is a single-peak cutting die; and for the position of the cutting surface with the blocking layer, the oblique angle surface of the die cutting tool faces one side of the RFID label structure, and the vertical surface of the die cutting tool faces one side of the waste outside the RFID label structure.
2. The die-cutting method of an RFID label structure according to claim 1, wherein the area of the barrier layer (2) is 1/3 of the area of the inlay layer (3), and the maximum width position of the barrier layer (2) coincides with the maximum width position of the inlay layer (3).
3. The method of claim 1, wherein the test die-cutting process comprises:
t1, arranging n groups of composite materials A on a movable platform of a die cutting machine, arranging pressure-sensitive paper on a fixed platform of the die cutting machine, carrying out die cutting with a limited size, and collecting 70-80% of pressure-sensitive paper colors when the composite materials A are cut to be punched through to obtain a group of die cutting pressure data; the method comprises the steps of arranging a pressure-sensitive paper tool on a movable platform of a die-cutting machine, placing a standard block on a fixed platform of the die-cutting machine for die cutting with a limited size, and collecting pressure-sensitive paper color when 70-80% of a tangent line of a composite material 1 can be punched through to obtain a group of die-cutting pressure data; averaging the two groups of die cutting pressure data to obtain a first die cutting pressure; the material of the composite material A is consistent with that of the part of the composite material containing the barrier layer;
t2, arranging n groups of composite materials B on a movable platform of a die cutting machine, arranging pressure sensing paper on a fixed platform of the die cutting machine, carrying out die cutting with a limited size, and collecting the color of the pressure sensing paper when all composite material B cutting lines can be punched through to obtain a group of die cutting pressure data; the pressure sensing paper is mounted on a movable platform of a die cutting machine, a standard block is placed on a fixed platform of the die cutting machine for die cutting with a limited size, and the pressure sensing paper color when all composite material B tangent lines can be punched through is acquired to obtain two groups of die cutting pressure data; averaging the two groups of die cutting pressure data to obtain second die cutting pressure; the material of the composite material A is consistent with that of the part of the composite material containing the barrier layer;
t3, n groups of composite materials are mounted on a movable platform of a die cutting machine, pressure sensing paper is mounted on a fixed platform of the die cutting machine for die cutting with a limited size, pressure sensing paper colors when all composite material cutting lines can be punched through are collected, and a group of die cutting pressure data is obtained; the method comprises the steps that pressure-sensitive paper is mounted on a movable platform of a die-cutting machine, a standard block is placed on a fixed platform of the die-cutting machine for die cutting with a limited size, pressure-sensitive paper colors when all composite material cutting lines can be punched through are collected, and a group of die-cutting pressure data is obtained; averaging the two groups of die cutting pressure data to obtain a third die cutting pressure;
and T4, calculating a testing die cutting pressure based on the first die cutting pressure, the second die cutting pressure and the third die cutting pressure, and subtracting the testing die cutting pressure from the theoretical die cutting pressure to obtain a die cutting pressure error amount.
4. A die cutting system for RFID label structures, for implementing the die cutting method for RFID label structures of any of claims 1-3; the method comprises the following steps: a composite station, a die cutting station (14), an acquisition module, a calculation module and an adjustment module;
the compounding station is used for compounding the surface mark layer, the barrier layer, the inlay layer and the adhesive layer to obtain a composite material;
the calculation module is used for acquiring design parameters of the die cutting machine, testing die cutting based on the composite material and collecting characteristic data of the testing die cutting process;
the die cutting station is used for carrying out die cutting or test die cutting on the composite material;
the calculation module is used for calculating the offset of the main cutting mechanism according to the design parameters and the characteristic data and calculating the die cutting pressure error according to the characteristic data;
the adjusting module is used for compensating the relative position of the positioned composite material and the die cutting tool in consideration of the offset of the main cutting mechanism, adjusting theoretical die cutting pressure in consideration of die cutting pressure error, and starting the die cutting machine to perform die cutting on the composite material.
5. The system of claim 4, wherein the compounding station comprises a first compounding station (12) and a second compounding station (13);
synchronously feeding a group of surface mark layers, a plurality of groups of barrier layers and a group of inlay layers to a first compound station (12), and finishing the first compound of the surface mark layers, the barrier layers and the inlay layers after the first compound station (12) is aligned;
synchronously feeding the first composite material and the group of adhesive layers to a second composite station (13), and stripping the inlay layer bottom tape at the second composite station (13) to complete second composite to obtain a composite material;
the composite material is collected in groups after being die cut at a die cutting station (14).
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| CN116963395B (en) * | 2023-07-20 | 2024-02-06 | 嘉丰盛精密电子科技(孝感)有限公司 | Method for preparing flexible circuit board for circular knife die cutting |
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