CN111931896B

CN111931896B - Logistics list, preparation method thereof, logistics package and logistics goods

Info

Publication number: CN111931896B
Application number: CN202011115242.7A
Authority: CN
Inventors: 任磊; 颜力
Original assignee: Wuzhou Online E Commerce Beijing Co ltd
Current assignee: Wuzhou Online E Commerce Beijing Co ltd
Priority date: 2020-10-19
Filing date: 2020-10-19
Publication date: 2021-07-27
Anticipated expiration: 2040-10-19
Also published as: CN111931896A

Abstract

One or more embodiments of the present specification provide a logistics surface sheet, a method of manufacturing the same, a logistics package, and a logistics good, the logistics surface sheet including: the electronic tag comprises a surface paper layer, a first adhesive layer, a metal layer and an electronic tag, wherein the metal layer and the electronic tag are arranged between the surface paper layer and the first adhesive layer; the metal layer is provided with a through structure, and the through structure comprises a radio frequency window; the antenna in the electronic tag can be coupled with the metal layer and can receive and transmit electronic logistics information through radio frequency signals. The metal layer is added in the logistics surface sheet, the through structure comprising the radio frequency window is arranged on the metal layer, the electronic tag is arranged corresponding to the radio frequency window, and the antenna in the electronic tag is coupled with the metal layer, so that the metal layer is used as a radiating body of the antenna in the electronic tag to participate in the radiation of electromagnetic waves, the radio frequency signal receiving and sending performance of the electronic tag is enhanced, the radio frequency signal receiving and sending performance is not required to be enhanced by increasing the size of the electronic tag, and the requirement for the large size of the electronic tag is reduced.

Description

Logistics list, preparation method thereof, logistics package and logistics goods

Technical Field

The document relates to the technical field of the Internet of things, in particular to a logistics surface sheet, a preparation method of the logistics surface sheet, logistics packages and logistics goods.

Background

At present, with the rapid development of the internet of things technology, electronic tags are rapidly developed in the field of logistics. The electronic tag generally refers to a tag having Radio Frequency Identification (RFID) capability, and based on the electronic tag, target object information identified by the electronic tag can be identified by Radio Frequency signals and relevant data can be read and written. The application of the electronic tag in the field of express logistics can shorten the operation flow, increase the throughput of a distribution/distribution center, improve the speed and accuracy of checking operation, improve the transparency of management and enable information transmission to be faster and more accurate.

At present, the mode that provides of correlation technique with electronic tags uses in express delivery commodity circulation field is directly pasted electronic tags and paper face list together. As the logistics contained in the package in the field of express logistics are various, and contain a large amount of articles such as beverages, metal and the like which seriously affect the receiving and sending effects of the radio frequency signals of the electronic tags, the goods with metal packages and the like, the radio frequency signal receiving and sending performance of the electronic tags is extremely high. In order to improve the radio frequency performance of the electronic tag, a large-sized antenna has to be used, and the increase of the antenna size leads to the increase of the production cost.

Therefore, it is desirable to provide a technical solution capable of improving the radio frequency signal transceiving performance of the electronic tag with the small-sized antenna, so as to reduce the requirement for the large size of the electronic tag.

Disclosure of Invention

One or more embodiments of the present disclosure are to provide a logistics surface sheet, a method for manufacturing the same, a logistics package, and logistics goods, which can solve the technical problem that a large-size antenna electronic tag is required in the logistics field.

In order to solve the above technical problems, one or more embodiments of the present specification are implemented as follows:

in a first aspect, it is an object of one or more embodiments of the present specification to provide a logistic bill. This commodity circulation face list includes: the electronic tag comprises a surface paper layer, a first adhesive layer, a metal layer and an electronic tag, wherein the metal layer and the electronic tag are arranged between the surface paper layer and the first adhesive layer;

the metal layer is provided with a through structure, and the through structure comprises a radio frequency window;

the electronic tag is arranged corresponding to the radio frequency window, and the size of an antenna in the electronic tag is smaller than that of the metal layer;

the surface paper layer is used for printing visual logistics information of a target object;

the first adhesive layer is used for adhering the logistics surface sheet to the logistics information display position on the target object;

the electronic tag is used for storing and transceiving electronic logistics information of the target object, and the antenna in the electronic tag can be coupled with the metal layer and used for transceiving the electronic logistics information through a radio frequency signal.

In a second aspect, it is an object of one or more embodiments of the present specification to provide a method of preparing a logistic bills. The preparation method of the logistics surface sheet comprises the following steps:

providing a surface paper layer, wherein the surface paper layer is used for printing visual logistics information of a target object; and the number of the first and second groups,

providing a pre-prepared electronic tag, wherein the electronic tag is used for storing and transmitting and receiving electronic logistics information of the target object;

arranging a metal layer and the electronic tag on the basis of one surface of the surface paper layer to obtain a metallized composite layer, wherein the metal layer is provided with a through structure, the through structure comprises a radio frequency window, the electronic tag is arranged corresponding to the radio frequency window, the size of an antenna in the electronic tag is smaller than that of the metal layer, and the antenna in the electronic tag can be coupled with the metal layer and can receive and send the electronic logistics information through a radio frequency signal;

and forming a first adhesive layer for adhering the logistics surface sheet to a target object based on one surface of the metallized composite layer, which is deviated from the surface paper layer, so as to obtain the logistics surface sheet.

In a third aspect, an object of one or more embodiments of the present disclosure is to provide a logistics package. The logistics package is adhered with the logistics surface sheet as described in the first aspect.

In a fourth aspect, it is an object of one or more embodiments of the present specification to provide a logistics cargo. The surface of the logistics goods or the surface of the outer package thereof is adhered with the logistics surface sheet as described in the first aspect.

One or more embodiments of the present specification provide a logistics surface sheet, a method for preparing the same, a logistics package and a logistics goods, wherein the logistics surface sheet comprises: the electronic tag comprises a surface paper layer, a first adhesive layer, a metal layer and an electronic tag, wherein the metal layer and the electronic tag are arranged between the surface paper layer and the first adhesive layer; the metal layer is provided with a through structure, and the through structure comprises a radio frequency window; the antenna in the electronic tag can be coupled with the metal layer and can receive and transmit electronic logistics information through radio frequency signals. The metal layer is added in the logistics surface sheet, the through structure comprising the radio frequency window is arranged on the metal layer, the electronic tag is arranged corresponding to the radio frequency window, and the antenna in the electronic tag is coupled with the metal layer, so that the metal layer is used as a radiating body of the antenna in the electronic tag to participate in the radiation of electromagnetic waves, the radio frequency signal receiving and sending performance of the electronic tag is enhanced, the radio frequency signal receiving and sending performance is not required to be enhanced by increasing the size of the electronic tag, and the requirement for the large size of the electronic tag is reduced.

Drawings

In order to more clearly illustrate one or more embodiments or prior art solutions of the present specification, the drawings that are needed in the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in one or more of the specification, and that other drawings can be obtained by those skilled in the art without inventive exercise;

FIG. 1 is a schematic diagram of a first structural component of a flow sheet provided in one or more embodiments herein;

FIG. 2a is a schematic diagram illustrating a second structural configuration of a drop sheet provided in one or more embodiments of the present disclosure;

FIG. 2b is a schematic diagram illustrating a third structural configuration of a drop sheet provided in one or more embodiments of the present disclosure;

FIG. 2c is a schematic diagram illustrating a fourth structural configuration of a drop sheet provided in one or more embodiments of the present disclosure;

FIG. 3 is a schematic diagram illustrating a fifth structural configuration of a drop sheet provided in one or more embodiments of the present disclosure;

FIG. 4 is a schematic diagram illustrating a sixth structural configuration of a flow sheet provided in one or more embodiments herein;

FIG. 5 is a schematic diagram of a structure in which the flow surfaces are arranged in a single array according to one or more embodiments of the present disclosure;

FIG. 6 is a schematic flow diagram of a method for producing a flow sheet provided in one or more embodiments of the present disclosure;

fig. 7 is a schematic structural composition diagram of a metal layer provided with rf windows arranged in an array according to one or more embodiments of the present disclosure;

FIG. 8 is a schematic structural component view of a metallized thermal sensitive paper roll after being attached with an electronic label according to one or more embodiments of the present disclosure;

FIG. 9 is a schematic diagram of the structure of a logistics package provided in one or more embodiments of the present disclosure;

fig. 10 is a schematic structural composition diagram of a logistics cargo provided in one or more embodiments of the present disclosure.

Detailed Description

In order to make the technical solutions in one or more embodiments of the present disclosure better understood, the technical solutions in one or more embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in one or more embodiments of the present disclosure, and it is obvious that the described embodiments are only a part of one or more embodiments of the present disclosure, but not all embodiments. All other embodiments that can be derived by a person skilled in the art from the embodiments given in one or more of the present specification without inventive step shall fall within the scope of protection of this document.

It should be noted that one or more embodiments and features of the embodiments in the present description may be combined with each other without conflict. Reference will now be made in detail to one or more embodiments of the disclosure, examples of which are illustrated in the accompanying drawings.

One or more embodiments of the present disclosure provide a logistics surface sheet, a method for manufacturing the same, a logistics package, and logistics goods, in which a metal layer is added to the logistics surface sheet, a transparent structure including a radio frequency window is formed on the metal layer, an electronic tag is disposed corresponding to the radio frequency window, and an antenna in the electronic tag is coupled to the metal layer, so that the metal layer is used as a radiator of the antenna in the electronic tag to participate in radiation of electromagnetic waves, thereby enhancing the radio frequency signal transceiving performance of the electronic tag, and thus enhancing the radio frequency signal transceiving performance without increasing the size of the electronic tag, thereby reducing the requirement of the logistics surface sheet on the large size of the electronic tag.

Fig. 1 is a schematic diagram illustrating a first structural composition of a material flow sheet according to one or more embodiments of the present disclosure, where the material flow sheet includes: the electronic tag comprises a surface paper layer 101, a first adhesive layer 102, and a metal layer 103 and an electronic tag 104 which are arranged between the surface paper layer 101 and the first adhesive layer 102; the electronic tag 104 includes an antenna 1041 and a chip 1042; in practical implementation, the number of the chips 1042 included in the electronic tag 104 may be one or more.

Wherein, the metal layer 103 is provided with a transparent structure, and the transparent structure comprises a radio frequency window 1031; the radio frequency window 1031 is configured to reduce the influence degree of the metal layer 103 on the impedance matching of the electronic tag 104 in the logistics list from a certain value to another value, that is, the radio frequency window 1031 is configured to reduce the influence of the metal layer 103 on the impedance matching of the electronic tag 104 in the logistics list;

the electronic tag 104 is disposed corresponding to the rf window 1031, and the size of the antenna 1041 in the electronic tag 104 is smaller than the size of the metal layer 103; specifically, considering that an impedance matching network in the electronic tag 104 is shielded by the metal layer 103, which causes impedance mismatch of the electronic tag 104, and further affects the radio frequency performance of the electronic tag 104, on the basis, by opening the radio frequency window 1031 on the metal layer 103 and setting the electronic tag 104 corresponding to the radio frequency window 1031, the influence of the metal layer 103 on impedance matching of the electronic tag 104 can be reduced;

the surface paper layer 101 is used for printing visual logistics information of a target object;

the first adhesive layer 102 is used for adhering the logistics surface sheet to the logistics information display position on the target object;

the electronic tag 104 is configured to store and transmit electronic logistics information of a target object, and an antenna 1041 in the electronic tag 104 can be coupled to the metal layer 103 and transmit and receive the electronic logistics information through a radio frequency signal; specifically, the electronic tag 104 is coupled with the metal layer 103 through the rf window 1031, so that a part of current on the electronic tag 104 is coupled to the metal layer 103, and a current is formed on the surface of the metal layer 103, so that the metal layer 103 can participate in radiation of electromagnetic waves as a radiator of an antenna in the electronic tag 104, thereby greatly increasing the reading distance of the electronic tag 104.

The surface paper layer 101 can be made of thermal paper, so that the surface paper layer 101 can print visual logistics information of a target object in a thermal printing mode.

In addition, the first adhesive layer 102 may be implemented by using a hot melt adhesive or an adhesive film, for example, by fully coating the hot melt adhesive or the adhesive film in the preparation process of the logistics surface sheet, and the logistics surface sheet may be adhered to the logistics information display position of the target object by using the first adhesive layer 102.

The target object may include a logistics good or a logistics package, and the logistics information display position may be an outer surface of the logistics good, an outer surface of an outer package of the logistics good, or an outer surface of the logistics package, and the like, which is not limited in the embodiment of the present specification.

Since the flow sheet is bent during use, the metal layer 103 may be made of a metal with good ductility, such as aluminum, copper, or other metals or alloys, so as to ensure that the flow sheet still maintains intact performance after being bent for multiple times.

In addition, one of the functions of the metal layer 103 is to couple with the antenna 1041 of the electronic tag 104 through the rf window 1031, so as to couple part of the current on the electronic tag 104 to the metal layer 103, so as to form a current on the surface of the metal layer 103, so that the metal layer 103 can be used as a radiator of the antenna in the electronic tag 104 to participate in the radiation of electromagnetic waves, which is equivalent to increase the radio frequency signal radiation area of the antenna 1041 of the electronic tag 104, and thus can be coupled with the electronic tag 104 to improve the radio frequency performance of the electronic tag 104, so that the small-sized electronic tag 104 can also have stronger radio frequency performance without increasing the size of the electronic tag 104, and the requirement of the logistics field on the large-sized antenna 1041 of the electronic tag 104 is reduced.

In some exemplary applications, the size of the antenna 1041 of the electronic tag 104 can still achieve the same or even higher rf signal transceiving performance as that of the electronic tag 104 without adding the metal layer 103 after reducing the size by 90% by adding the metal layer 103, for example, in order to meet the demand of the logistics field in the prior art, the size of the antenna 1041 of the electronic tag 104 for identifying the logistics information is generally 70mm × 70mm, and after reducing the size of the antenna 1041 of the electronic tag 104 to 15mm × 20mm by adding the metal layer 103, the same or even higher rf signal transceiving performance as that of the electronic tag 104 with 70mm × 70mm can still be achieved.

In the above description, the radio frequency signal transceiving performance may include, but is not limited to, radio frequency signal transceiving sensitivity, a reading distance, and the like, and the embodiments of the present specification are not limited thereto.

It should be noted that, the electronic tag 104 provided in the embodiment of the present disclosure may be an RFID tag using a radio frequency identification RFID technology, and may also be a tag using other wireless communication technologies, and all of the electronic tags may be applied to the present disclosure to achieve the purpose of the embodiment of the present disclosure, and all of the electronic tags are within the protection scope of the present disclosure.

In one or more embodiments of the present disclosure, by adding the metal layer 103 in the logistics list, and forming a transparent structure including the radio frequency window 1031 on the metal layer 103, the electronic tag 104 is disposed corresponding to the radio frequency window 1031, and coupling the antenna 1041 in the electronic tag 104 with the metal layer 103, the metal layer 103 is used as a radiator of the antenna in the electronic tag to participate in radiation of electromagnetic waves, so as to enhance the radio frequency signal transceiving performance of the electronic tag 104, and thus, it is not necessary to enhance the radio frequency signal transceiving performance by increasing the size of the electronic tag 104, thereby reducing the requirement of the logistics list on the large size of the electronic tag 104.

In addition, the logistics list provided by the embodiment of the specification can be used for identifying visual logistics information so that logistics workers and recipients can check the logistics information conveniently, and can also be used for identifying electronic logistics information so that the electronic tag 104 identification device can read and write related electronic logistics information in a wireless communication mode, so that the effect of one-object dual-purpose is achieved, the logistics operation flow is favorably shortened, the throughput of a distribution/distribution center is increased, the checking operation speed and accuracy are improved, the management transparency is improved, and the information transmission is faster and more accurate.

Moreover, compared with the mode of respectively pasting the paper surface sheet and the electronic tag 104, the embodiment of the specification combines the paper surface sheet and the electronic tag 104 together, so that on one hand, the production cost can be reduced, and on the other hand, only one-time pasting operation is needed during use, so that the work efficiency of logistics workers can be effectively improved.

In addition, since the antenna 1041 generally needs to be designed into a specific shape, the processing requirements in the aspects of line width, space, and the like are high, and the antenna 1041 is generally processed and manufactured one by one, and the metal layer 103 only needs to be manufactured with a through structure, and the antenna 1041 can be manufactured in batch by die cutting and the like due to a simple structure, so that the processing cost of the antenna 1041 is much higher than that of the metal layer 103. Moreover, the larger the size of the antenna 1041 is, the longer the manufacturing cycle of the processes of die cutting, laser engraving, etching, etc. for manufacturing the antenna 1041 is, therefore, the larger the size of the antenna 1041 is, the longer the whole processing cycle thereof is, the lower the processing efficiency is, and when the antenna 1041 is combined with the chip 1042 of the electronic tag 104, the higher the bonding difficulty is, the lower the yield is, and these factors make the manufacturing cost of the large-size electronic tag 104 far higher than that of the small-size electronic tag 104. Through practical comparison, the cost of manufacturing the logistics surface sheet by combining the small-size electronic tag 104 and the metal layer 103 is far lower than the cost of manufacturing the logistics surface sheet by using the large-size electronic tag 104 in the embodiments of the present description, and therefore, the logistics surface sheet provided by the embodiments of the present description has lower cost.

Moreover, referring to the above description, since the manufacturing cycle of the small-sized electronic tag 104 is much shorter than that of the large-sized electronic tag 104, and the electronic tag 104 with a smaller size is adopted, the overall processing efficiency of the logistics list can be effectively improved, and therefore, the logistics list manufactured by adopting the small-sized electronic tag 104 in the present description also has the advantages of short processing cycle and small inventory pressure.

In addition, when the electronic tag 104 is manufactured by a chemical etching process, more chemical reagents are used, so that more chemical industrial wastewater is generated, and air is polluted, so that the larger the size of the electronic tag 104 is, the more serious the environmental pollution is, and the logistics list is manufactured by the electronic tag 104 with a small size, so that the problem of environmental pollution generated in the manufacturing process of the electronic tag 104 can be effectively reduced, namely, the logistics list provided by the embodiment of the specification also has the technical effect of reducing the environmental pollution.

It should be noted that, in the electronic tag 104, the size of the antenna 1041 is larger than the size of the chip 1042, therefore, in part of the description in this specification, the size of the electronic tag 104 may be understood as the size of the antenna 1041 of the electronic tag 104, and correspondingly, the size of the antenna 1041 of the electronic tag 104 may also be understood as the size of the electronic tag 104.

In addition, the above-mentioned large size and small size are relative concepts, and a person skilled in the art may flexibly set a size threshold according to actual requirements, and a size greater than the size threshold is referred to as a large size, and a size smaller than the size threshold is referred to as a small size. For example, in some exemplary applications, after the size of the antenna 1041 of the electronic tag 104 is reduced by 90% by adding the metal layer 103, the same or even higher rf signal transceiving performance as that of the electronic tag 104 without adding the metal layer 103 can still be obtained, for example, in order to meet the demand of the logistics field in the prior art, the size of the antenna 1041 of the electronic tag 104 for identifying logistics information is generally 70mm × 70mm (which can be regarded as a large size), and after the size of the antenna 1041 of the electronic tag 104 is reduced to 15mm × 20mm (which can be regarded as a small size), the same or even higher rf signal transceiving performance as that of the electronic tag 104 with 70mm × 70mm can still be obtained by adding the metal layer 103.

Based on the above exemplary description, the embodiments of the present disclosure may be modified in various more specific ways, and the following description is given by way of example with reference to the accompanying drawings.

For example, in some modified embodiments, please refer to fig. 1 for understanding, in fig. 1, the size of the rf window 1031 is smaller than that of the electronic tag 104; the surface paper layer 101, the metal layer 103, the electronic tag 104 and the first glue layer 102 are sequentially arranged along the normal direction of the logistics surface sheet;

a first surface of the face paper layer 101 for printing visual logistics information of a target object faces away from the electronic tag 104; the chip 1042 of the electronic tag 104 faces the second surface of the face paper layer 101.

In this embodiment, since the size of the rf window 1031 is smaller than that of the electronic tag 104, the electronic tag 104 can be attached to the metal layer 103 without being sunk into the rf window 1031. When the logistics surface sheet provided by the embodiment is manufactured, a manufacturing process may be that a plurality of through structures penetrating through a metal film substrate (for example, an aluminum foil coil) are formed on the metal film substrate by a die cutting process to obtain a metal layer 103, and then the metal layer 103 and a surface paper layer 101 substrate (for example, a thermal paper coil) are directly compounded; or, directly compounding a metal film substrate (such as an aluminum foil coil) and a surface paper layer 101 substrate (such as a thermal paper coil), and then forming a plurality of through structures penetrating through the metal film substrate by adopting a die cutting process;

then the electronic labels 104 are pasted one by one according to the positions of the radio frequency windows 1031 in the transparent structure, then the whole frame is glued and pasted with release paper, then a large number of logistics surface lists to be used can be manufactured in batch through a cutting process, the width of the metal film substrate and the surface paper layer 101 substrate may be 1 meter, 2 meters, 3 meters, etc., the length of the material flow surface sheet can be 10 meters, 20 meters, 50 meters and the like, the size of the finally formed material flow surface sheet can be 50mm by 50mm, 70mm by 70mm and the like, the size data are not limited by the embodiment of the specification, and thus, by the method, thousands of logistics surface sheets can be manufactured at one time, the production efficiency is very high, and the production cost is reduced along with high production efficiency, so the logistics surface sheet adopting the structure has the advantages of simple preparation process, high preparation efficiency and low cost.

The metal layer 103 may be obtained by forming a metal film on one surface of the face paper layer 101 by a plating process and forming a through structure on the metal film by a die cutting process; or the metal film can be obtained by directly adopting a composite process to stick a separately prepared metal film substrate to the face paper layer 101 through an adhesive layer and then adopting a die cutting process to form a transparent structure on the metal film; in addition, in some more detailed embodiments, on the basis of the above embodiment, on the basis of fig. 1, as shown in fig. 2a, the logistic sheet further includes: a second glue layer 105 and a third glue layer 106;

the metal layer 103 and the face paper layer 101 are bonded by a second adhesive layer 105; the electronic tag 104 and the metal layer 103 are bonded by a third adhesive layer 106;

the electronic tag 104 is disposed at a first designated position of the first adhesive layer 102, the rf window 1031 is disposed at a second designated position of the metal layer 103, and when the electronic tag 104 is bonded to the metal layer 103 through the third adhesive layer 106, an absolute value of a deviation between a center point of the first designated position and a center point of the second designated position is less than or equal to a first preset threshold value.

The second adhesive layer 105 and the third adhesive layer 106 can be realized by hot melt adhesive, adhesive film, etc., and the structure that the metal layer 103 and the surface paper layer 101, and the electronic tag 104 and the metal layer 103 are compounded by the adhesive layers has the advantages of simple preparation process and low cost.

In addition, a person skilled in the art may flexibly set a value of the first preset threshold according to an actual requirement, and an embodiment of the present specification is not limited thereto, and it should be noted that the smaller the deviation is, the more the electronic tag 104 and the rf window 1031 overlap with each other, the smaller the shielding of the metal layer 103 on the electronic tag 104 is, and the more the rf signal transceiving performance of the electronic tag 104 is improved. Therefore, by setting the first preset threshold and making the electronic tag 104 and the rf window 1031 conform to the constraint condition, it is possible to ensure that the rf signal transceiving performance of the electronic tag 104 has a high level.

On the basis of the above embodiments, in some more detailed embodiments, an absolute value of a difference between an area of the third adhesive layer 106 and an area of the electronic tag 104 is less than or equal to a second preset threshold.

A person skilled in the art may flexibly set a value of the second preset threshold according to an actual requirement, which is not limited in the embodiment of the present disclosure, and it should be noted that the smaller the difference is, the more the third adhesive layer 106 is used to adhere the electronic tag 104 and the metal layer 103, the less the third adhesive layer 106 is used to adhere the electronic tag 104, so that by setting the second preset threshold and making the third adhesive layer 106 meet the constraint condition, the usage amount of the third adhesive layer 106 may be saved to a greater extent, and the production cost of the logistics list may be further reduced.

In any of the embodiments described above in the present specification, as shown in fig. 2b, the logistics surface sheet may further include: a release paper 107;

the release paper 107 is bonded to a surface of the first adhesive layer 102 facing away from the face paper layer 101.

The release paper 107 may be release paper, silicone oil paper, or the like, and serves to protect the first adhesive layer 102 and facilitate transportation. The release paper 107 may be peeled off before use of the logistics sheet to which the release paper 107 is attached, or a desired logistics sheet may be peeled off from the release paper 107 for use of a plurality of logistics sheets in a roll.

Based on any implementation manner in this embodiment, in some modified implementations, on the basis of fig. 2b, as shown in fig. 2c, the transparent structure corresponding to each electronic tag 104 further includes: a plurality of vias 1032;

the through holes 1032 are used for reducing the influence degree of the metal layer 103 on the impedance matching of the electronic tags in other logistics surface sheets from a first value to a second value when the logistics surface sheet is adhered to a target object;

wherein the other logistics surface sheet is used for pasting to other objects except the target object.

For example, in practical applications, in links of receiving, sending, distributing, checking and the like of logistics goods, a plurality of logistics goods are stacked together, which may cause shielding between logistics surface lists, if a logistics surface list does not include the through hole 1032, a metal layer in one logistics surface list may shield an electronic tag in another logistics surface list, and a worker has to adjust the position of each logistics goods, and can read information in each electronic tag 104 by using the electronic tag 104 recognition device. In the embodiment, the shielding of the metal layer 103 in a certain logistics surface sheet on the impedance matching network of the electronic tags in other logistics surface sheets is reduced by arranging the plurality of through holes 1032 on the metal layer 103, so that the influence on the impedance matching of the electronic tags in other logistics surface sheets is reduced, the radio frequency performance of the electronic tags in other logistics surface sheets is further improved, for example, the reading distance of the electronic tags in other logistics surface sheets is increased, the position of each logistics cargo does not need to be adjusted, the electronic tag 104 identification equipment can be used for performing the reading and writing operation of electronic logistics information on the batched logistics cargos, and the automation degree and the working efficiency of links such as logistics cargo receiving, dispatching and inventory checking can be effectively improved.

In addition to the above embodiments, in some more detailed embodiments, if the absolute value of the difference between the size of the metal layer 103 and the size of the surface paper layer 101 is less than or equal to a third preset threshold;

when the other logistics surface sheet and the logistics surface sheet pasted on the target object have an overlapping area, the through holes 1032 can reduce the influence degree of the metal layer 103 on the impedance matching of the electronic tags in the other logistics surface sheet from a first value to a second value.

It is easy to understand that the larger the size of the metal layer 103 is, if the through hole 1032 is not provided, the more easily the electronic tags in other logistics lists are shielded, so that the impedance matching of the electronic tags in other logistics lists is negatively affected, therefore, by using the third preset threshold, in the case that the size of the metal layer 103 is large, the degree of the effect of the metal layer 103 on the impedance matching of the electronic tags in other logistics lists can be reduced from the first value to the second value by using the through hole 1032, that is, the effect on the impedance matching of the electronic tags in other logistics lists is reduced.

In addition to the embodiment corresponding to fig. 2c, in some modified embodiments, the through holes 1032 are distributed in the metal layer 103 in an array; the plurality of through holes 1032 are uniformly distributed around the rf window 1031.

Through the embodiment, the through holes 1032 can be uniformly distributed in the metal layer 103, so that shielding of electronic tags in other logistics lists is reduced, and negative effects on impedance matching of electronic tags in other logistics lists are reduced.

In some modified embodiments, in addition to fig. 2a, as shown in fig. 3, the size of the rf window 1031 is smaller than the size of the electronic tag 104; the surface paper layer 101, the electronic tag 104, the metal layer 103 and the first glue layer 102 are sequentially arranged along the normal direction of the logistics surface sheet;

the first surface of the face paper layer 101 for printing visual logistics information faces away from the electronic tag 104; the chip 1042 in the electronic tag 104 faces away from the second surface of the face paper layer 101.

This embodiment is a modification of the embodiment shown in fig. 1, and the positions of the electronic tag 104 and the metal layer 103 are changed compared to the embodiment shown in fig. 1, so that at least the purpose of improving the radio frequency signal transmission/reception performance of the small-sized electronic tag 104 in the examples of this specification can be achieved.

In another modified embodiment, in addition to fig. 2a, as shown in fig. 4, the size of the electronic tag 104 is smaller than or equal to the size of the rf window 1031;

the electronic tag 104 is embedded in the rf window 1031, and both the electronic tag 104 and the metal layer 103 are adhered to the surface paper layer 101; specifically, the electronic tag 104 and the metal layer 103 are bonded to the face paper layer 101 through a second adhesive layer 105.

This embodiment is also a modification of the embodiment shown in fig. 1, and compared with the embodiment shown in fig. 1, the positions of the electronic tag 104 and the metal layer 103 are changed, so that the electronic tag 104 and the metal layer 103 can be coplanar, and thus the third adhesive layer 106 can be omitted, and this physical distribution sheet can at least achieve the purpose of improving the radio frequency signal transmission and reception performance of the small-sized electronic tag 104 in the example of this specification. Moreover, since the electronic tag 104 is embedded in the rf window 1031, the surface of the logistics surface sheet can be more flat, and the overall thickness can be thinner.

In any of the above embodiments, the metal layer 103 may cover all of one surface of the surface paper layer 101, or may cover a part of one surface of the surface paper layer 101, as long as it can be coupled with the antenna 1041 of the electronic tag 104 to improve the radio frequency signal transceiving performance of the electronic tag 104, and the specific size is not limited in the examples herein. In some embodiments, the size of the metal layer 103 is the same as the size of the surface paper layer 101.

Considering that the larger the area of the metal layer 103 is, the greater the effect on improving the radio frequency signal transceiving performance of the electronic tag 104 is, in a case where the size of the metal layer 103 is the same as the size of the face paper layer 101, the effect of the metal layer 103 on improving the radio frequency signal transceiving performance of the electronic tag 104 is relatively high, and therefore, in the present embodiment, the logistics surface sheet has relatively high radio frequency signal transceiving performance.

In addition, referring to the schematic illustration of the embodiment shown in fig. 1, if a plurality of through-holes penetrating through a metal film substrate (e.g., an aluminum foil roll) are formed on the metal film substrate by a die-cutting process to obtain a metal layer 103, and then the metal layer 103 and a facial paper layer 101 substrate (e.g., a thermal paper roll) are directly laminated; or, directly compounding a metal film substrate (such as an aluminum foil coil) and a surface paper layer 101 substrate (such as a thermal paper coil), and then forming a plurality of through structures penetrating through the metal film substrate by adopting a die cutting process;

the electronic tags 104 are adhered to the transparent structure in a one-to-one correspondence mode according to the positions of the radio frequency windows 1031, then a large number of logistics surface lists to be used can be manufactured in a batch mode through a cutting process after the whole frame is glued and anti-sticking paper is adhered, and on one hand, the metal film base material can be compounded with the base material of the surface paper layer 101 without cutting, and the processing efficiency of the logistics surface lists can be effectively improved; on the other hand, the metal film substrate generates less metal waste in the use process, and can effectively reduce the pollution to the environment.

In specific implementation, the surface paper layer array provided with the metal layer 103 may be cut into a plurality of metallized surface paper layers, and then the electronic tag 104 is attached to the position of the radio frequency window 1031 on each metallized surface paper layer, so as to obtain the logistics surface list. Specifically, the logistics surface sheet attached to the target object is obtained by cutting the prepared surface paper layer array provided with the metal layer 103 to obtain a plurality of metallized surface paper layers, and attaching the electronic tag 104 to the radio frequency window 1031 on each metallized surface paper layer. The surface paper layer array provided with the metal layer 103 can be obtained by forming a metal film on one surface of a surface paper layer substrate by adopting a coating process and forming a transparent structure arranged in an array manner on the metal film by adopting a die cutting process; or the metal layer is adhered to one surface of the surface paper layer substrate by adopting a composite process, and the transparent structure arranged in an array manner is formed on the metal film by adopting a die cutting process.

In addition, on the basis of any of the above embodiments of the present description, the electronic tag 104 may be attached to each rf window 1031 on the surface paper array provided with the metal layer 103 to obtain a logistics surface single array, and then the logistics surface single array is cut into a plurality of logistics surface sheets, please refer to fig. 5, fig. 5 is a schematic structural diagram of the logistics surface sheets provided in one or more embodiments of the present description, which are arranged in an array, and as shown in fig. 5, the logistics surface sheet 10 attached to the target object is a separately used logistics surface sheet 10 obtained by cutting the prepared logistics surface single array;

a plurality of electronic tags 104 are arranged on the metal layer 103 in the logistics surface single array in an array manner; the radio frequency windows 1031 formed in the metal layer 103 correspond to the electronic tags 104 one to one.

The logistics surface single array can comprise a plurality of rolled logistics surface single 10 or a plurality of sheeted logistics surface single 10, and can be processed on the basis of a metal film substrate and a surface paper layer 101, and when the logistics surface single array is used, the needed logistics surface single 10 can be conveniently and directly taken off from the logistics surface single array for use, so that the logistics surface single 10 provided by the embodiment also has the advantages of high manufacturing efficiency and convenience in use.

In addition, the shape of the rf window 1031 may be square, rectangular, circular, T-shaped, or other shapes; the relative position of the rf window 1031 on the metal layer 103 may be at the center of the metal layer 103, or at the edge or other positions. Similarly, the through hole 1032 may be square, rectangular, circular, T-shaped, or other shapes. The shape of the through hole 1032 may be the same as or different from the shape of the rf window 1031. The above are exemplary modifications of the embodiments of the present disclosure, which can achieve the purpose of the embodiments of the present disclosure, and all of which are within the scope of the present disclosure.

The logistics surface sheet in one or more embodiments of the present specification, comprising: the electronic tag comprises a surface paper layer 101, a first adhesive layer 102, and a metal layer 103 and an electronic tag 104 which are arranged between the surface paper layer 101 and the first adhesive layer 102; wherein, the metal layer 103 is provided with a transparent structure, and the transparent structure comprises a radio frequency window 1031; the antenna 1041 in the electronic tag 104 can be coupled to the metal layer 103 and transmit and receive electronic logistics information through radio frequency signals. By adding the metal layer 103 in the logistics surface sheet and arranging the transparent structure including the radio frequency window 1031 on the metal layer 103, the electronic tag 104 is arranged corresponding to the radio frequency window 1031, and the antenna 1041 in the electronic tag 104 is coupled with the metal layer 103, so that the metal layer 103 is used as a radiator of the antenna in the electronic tag to participate in the radiation of electromagnetic waves, the radio frequency signal transceiving performance of the electronic tag 104 is enhanced, the radio frequency signal transceiving performance is not required to be enhanced by increasing the size of the electronic tag 104, and the requirement on the large size of the electronic tag 104 is reduced.

On the basis of the same technical concept, corresponding to the logistics list described in fig. 1 to 5, one or more embodiments of the present specification further provide a method for preparing the logistics list, fig. 6 is a schematic flow diagram of the method for preparing the logistics list provided in one or more embodiments of the present specification, the method in fig. 6 is used for preparing the logistics list described in fig. 1 to 5, and the following exemplary description of the method for preparing the logistics list can be understood by referring to the above exemplary description of the logistics list, and a part of the contents are not repeated and accordingly repeated, and the above exemplary description of the logistics list can also be understood by referring to the following exemplary description of the method for preparing the logistics list. As shown in fig. 6, the method comprises at least the following steps:

s602, providing a surface paper layer, wherein the surface paper layer is used for printing visual logistics information of a target object; and the number of the first and second groups,

s604, providing a pre-prepared electronic tag, wherein the electronic tag is used for storing and transmitting electronic logistics information of a target object;

s606, arranging a metal layer and the electronic tag on the basis of one surface of the surface paper layer to obtain a metallized composite layer, wherein the metal layer is provided with a transparent structure, and the transparent structure comprises a radio frequency window;

the electronic tag is arranged corresponding to the radio frequency window, the size of an antenna in the electronic tag is smaller than that of the metal layer, and the antenna in the electronic tag can be coupled with the metal layer and can receive and transmit the electronic logistics information through radio frequency signals;

and S608, forming a first adhesive layer for adhering the logistics surface sheet to a target object based on the surface of the metallized composite layer, which is deviated from the surface paper layer, so as to obtain the logistics surface sheet.

In one or more embodiments of the present disclosure, a metal layer is added to a logistics surface sheet, a transparent structure including a radio frequency window is formed on the metal layer, an electronic tag is disposed corresponding to the radio frequency window, and an antenna in the electronic tag is coupled to the metal layer, so that the metal layer is used as a radiator of the antenna in the electronic tag to participate in radiation of electromagnetic waves, and the radio frequency signal transceiving performance of the electronic tag is enhanced.

If the area of the surface paper layer is larger than or equal to the sum of the areas of the plurality of logistics surface sheets;

in a specific implementation, the surface paper layer array provided with the metal layer may be cut into a plurality of metallized surface paper layers, and then an electronic tag is attached to a radio frequency window on each metallized surface paper layer, so as to obtain a logistics surface list, where, correspondingly, in step S606, the metal layer and the electronic tag are arranged on the basis of one surface of the surface paper layer, and the method specifically includes:

arranging a metal layer with a plurality of transparent structures on the basis of one surface of the surface paper layer to obtain a surface paper layer array;

cutting the surface paper layer array to obtain a plurality of metallized surface paper layers;

and adhering the electronic tag to the radio frequency window on the metallized surface paper layer.

In a specific implementation, an electronic tag may be attached to each rf window position on the surface paper layer array on which the metal layer is disposed, and then the surface paper layer array is cut into a plurality of logistics lists, and correspondingly, in step S606, the metal layer and the electronic tag are disposed based on a surface of the surface paper layer, which specifically includes:

based on one surface of the surface paper layer, a metal layer provided with a plurality of transparent structures and a plurality of electronic tags arranged on the metal layer in an array manner are arranged, wherein radio frequency windows in the transparent structures correspond to the electronic tags one to one.

In one embodiment, a plurality of through structures penetrating through the metal film substrate (e.g., an aluminum foil coil) are formed on the metal film substrate (e.g., an aluminum foil coil) by a die cutting process to obtain a metal layer, and then the metal layer and the surface paper layer substrate (e.g., a heat-sensitive paper coil) are directly compounded; or, directly compounding a metal film substrate (such as an aluminum foil coiled material) and a surface paper layer substrate (such as a thermal paper coiled material), and then forming a plurality of through structures penetrating through the metal film substrate by adopting a die cutting process;

according to the position of the radio frequency window in the transparent structure, the electronic tags are pasted in a one-to-one correspondence mode, the pasted electronic tags are distributed in an array mode, after the whole frame of the electronic tags is glued and pasted with the release paper, a large number of logistics surface sheets to be used can be manufactured in a batch mode through a slitting process, thousands of logistics surface sheets can be manufactured once through the method, the production efficiency is very high, the production cost is reduced when the production efficiency is high, and therefore the logistics surface sheets are manufactured through the method.

In addition, the above embodiment can be modified, for example, a transparent structure is formed on the metal film substrate, then the metal film substrate is combined with the face paper substrate, then the electronic tag is adhered, then the whole adhesive is coated and the release paper is adhered, and then the cut process is performed to manufacture a large number of to-be-used logistics surface sheets in batch.

There are various embodiments of the above-mentioned metal layer and electronic tag, and the following description is exemplary.

In one embodiment, the step S606 of providing the metal layer and the electronic tag on the surface of the face paper layer specifically includes:

forming a metal layer covering at least a part of one surface of the face paper layer;

and taking the radio frequency window as an alignment reference, and adhering the electronic tag to one surface of the metal layer, which is far away from the surface paper layer, or embedding the electronic tag into the radio frequency window and adhering the electronic tag to the surface paper layer.

Through above-mentioned embodiment, can set up the metal level earlier, set up electronic tags again, like this, the metal level can directly compound with the surface paper layer, and the metal level of the large tracts of land of being convenient for to use is compound with the surface paper layer, helps improving the compound efficiency of metal level and surface paper layer, and then improves the preparation efficiency of whole commodity circulation list, and production efficiency height then manufacturing cost reduces thereupon, consequently, the commodity circulation list that adopts above-mentioned structure possesses the advantage that preparation simple process, preparation efficiency are high, with low costs.

In some more specific embodiments, the forming of the metal layer covering at least a part of one surface of the face paper layer includes:

forming a metal film on one surface of the face paper layer by adopting a film coating process;

and forming a transparent structure on the metal film by adopting a die cutting process to obtain the metal layer.

In the embodiment, the metal film can be formed on the surface paper layer in a film coating mode, and then the transparent structure is formed in a die cutting mode, so that the metal layer can be obtained. Because the coating process can coat a thin metal film, the manufacturing cost of the metal layer can be effectively saved through the embodiment, and the manufacturing cost of the whole logistics surface sheet is further reduced.

In another more specific embodiment, the forming of the metal layer covering at least a part of one surface of the face paper layer includes:

providing a pre-prepared metal layer; the transparent structure arranged on the metal layer can be obtained by adopting a die cutting process during the preparation of the metal layer, or can be formed on the metal layer by adopting the die cutting process after the metal layer is compounded with the surface paper layer;

and adhering the metal layer to one surface of the surface paper layer by adopting a composite process, wherein the metal layer covers at least one part of one surface of the surface paper layer.

In the embodiment, the metal layer with the transparent structure can be prepared in advance, and then the metal layer is directly adhered to the surface paper layer, so that the material flow surface sheet can be conveniently manufactured in batch, and the processing efficiency is higher.

The metal layer may cover at least a portion of one surface of the surface paper layer, specifically, a portion of the surface paper layer, or may cover all of the surface paper layer, as long as the metal layer can be coupled with an antenna of an electronic tag to improve the radio frequency signal transceiving performance of the electronic tag, and the embodiment of the present specification is not limited to a specific size thereof.

In addition, an electronic tag may be disposed first, and then a metal layer may be disposed, for example, in some embodiments, the step S606 is to dispose the metal layer and the electronic tag based on one surface of the face paper layer, and specifically includes:

adhering the electronic tag to one surface of the surface paper layer;

providing a pre-prepared metal layer;

and adhering the metal layer to one surface of the surface paper layer by adopting a mode of aligning the radio frequency window with the electronic tag.

Through this embodiment mode, at least the purpose of improving the radio frequency signal transmission and reception performance of the small-sized electronic tag in the embodiments of the present specification is also achieved.

On the basis of the foregoing embodiments, in some variations, before providing the metal layer prepared in advance, the method further includes:

providing a first metal film substrate;

and forming a transparent structure on the first metal film substrate by adopting a die cutting process to obtain a prefabricated metal layer.

By the embodiment, the first metal film substrate can be processed in advance to prepare the metal layer, and then the prepared metal layer is compounded with the surface paper layer or the surface paper layer adhered with the electronic tag, so that the effluent surface sheet can be prepared efficiently.

On the basis of any of the foregoing embodiments of the present specification, before providing the electronic tag prepared in advance at S604, the method may further include:

providing a second metal film substrate;

etching, die cutting or laser engraving the second metal film substrate to obtain an antenna of the electronic tag;

and combining the antenna of the electronic tag with a chip of the electronic tag to obtain the electronic tag.

The chip of the electronic tag can be directly purchased or used as a finished product, and the size of the antenna can be reduced by implementing the specification, so that the small-size antenna needs to be separately prepared. In the above aspect of the electronic tag in which the antenna of the electronic tag and the chip of the electronic tag are combined, the antenna of the electronic tag and the chip of the electronic tag may be bonded to each other to obtain the electronic tag.

According to the embodiment, the small-size electronic tag can be prepared in advance and then directly attached to the metal layer or the surface paper layer to prepare the logistics surface sheet, and the preparation difficulty of the logistics surface sheet can be effectively reduced and the preparation efficiency of the logistics surface sheet can be improved through the modes of preparation in advance, direct attachment and the like.

In addition, the transparent structure may not be limited to a radio frequency window, and for example, the transparent structure corresponding to each of the electronic tags may further include: a plurality of through holes;

the through holes are used for reducing the influence degree of the metal layer on the impedance matching of the electronic tags in other logistics surface sheets from a first value to a second value when the logistics surface sheet is pasted on the target object;

wherein the other logistics surface sheet is a logistics surface sheet for pasting on other objects except the target object.

For example, in practical applications, in links of receiving, dispatching, checking and the like of logistics goods, a plurality of logistics goods are stacked together, so that shielding occurs between logistics surface lists, if a logistics surface list does not include the through hole, a metal layer in one logistics surface list shields an electronic tag in another logistics surface list, and a worker has to adjust the position of each logistics goods to read information in each electronic tag by using the electronic tag identification device. In the embodiment, the plurality of through holes are formed in the metal layer, so that the shielding of the metal layer in one logistics surface list to the impedance matching networks of the electronic tags in other logistics surface lists is reduced, the influence on the impedance matching of the electronic tags in other logistics surface lists is reduced, the radio frequency performance of the electronic tags in other logistics surface lists is further improved, for example, the reading distance of the electronic tags in other logistics surface lists is increased, the position of each logistics cargo does not need to be adjusted, the electronic tag identification equipment can be used for performing the reading and writing operation of electronic logistics information on the batched logistics cargos, and the automation degree and the working efficiency of links such as receiving, sending, distributing and counting of the logistics cargos can be effectively improved.

On the basis of any of the above embodiments of the present specification, the method may further include:

and sticking anti-sticking paper based on the surface of the first glue layer deviating from the surface paper layer.

Wherein, above-mentioned release paper can adopt to realize from type paper, silicone oil paper etc. and its effect is the first glue film of protection on the one hand, and on the other hand is the transportation of being convenient for. The logistics surface sheet pasted with the release paper can be torn off before use, or a plurality of logistics surface sheets in a roll can be used by taking off the needed logistics surface sheet from the release paper.

By adjusting the thicknesses of at least the surface paper layer, the metal layer, the electronic tag and the first adhesive layer, the thickness of the logistics surface sheet can be controlled within a thickness range suitable for printing by a thermal printer, for example, in some exemplary applications, the prepared logistics surface sheet has a thickness of 0.15mm, and can be well suitable for printing by the thermal printer without modifying the existing thermal printer, so that the logistics surface sheet is convenient to popularize and apply.

In order to facilitate understanding of the above examples of the preparation method of the material flow sheet, the examples in this specification further provide some specific embodiments, and the following specific example description may be understood with reference to any one of the foregoing specific embodiments, and any one of the foregoing specific embodiments may also be understood with reference to the following example description, and some contents are not described again.

In the following description, although some terms are changed, they do not affect the expression of their meanings, and some terms are described in correspondence with terms in the foregoing description of the embodiments, and the correspondence expressed by the correspondence may include an equivalent relationship or a top-bottom relationship, and those skilled in the art can understand the correspondence in consideration of the actual situation.

In some specific embodiments, the above method for preparing a material flow sheet may comprise the following steps:

p911: coating a thermosensitive coating on the raw paper web to form a thermosensitive paper web (i.e., one of the face paper web substrates);

p912: performing die cutting and waste discharging (i.e., removing waste metal films) on a metal film coiled material (i.e., one of the metal film substrates, corresponding to the first metal film substrate) by using a flat-knife die cutting machine or a circular-knife die cutting machine to obtain a metal layer provided with radio frequency windows arranged in an array, as can be understood with reference to fig. 7, fig. 7 is a schematic structural composition diagram of the metal layer provided with the radio frequency windows arranged in an array according to one or more embodiments of the present specification; as shown in fig. 7, the metal film coil is subjected to die cutting and waste discharge by a flat-knife die cutting machine or a circular-knife die cutting machine to obtain a metal layer provided with radio frequency windows 1031 arranged in an array;

p913: compounding the thermal sensitive paper coiled material with the metal layer provided with the radio frequency windows arranged in an array through a hot melt adhesive or an adhesive film to process a metallized thermal sensitive paper coiled material, namely a metallized thermal sensitive paper coiled material;

p921: additionally providing a metal film substrate, and processing the antenna by an etching process or a laser engraving process;

p922: bonding a chip of the electronic tag on the antenna by using chip flip-chip packaging equipment to form a dry tag;

p923: brushing glue (hot melt glue) on the surface of the antenna or compounding an adhesive film on the surface of the antenna to obtain a dry label containing the adhesive layer;

p924: carrying out die cutting, slitting and waste discharge on the dry label containing the adhesive layer by a flat knife die cutting machine or a circular knife die cutting machine to obtain a subminiature electronic label;

p93: each subminiature electronic tag is compositely adhered to the positions of the radio frequency windows arranged in an array on the metallized heat-sensitive paper roll, please refer to fig. 8 for understanding, and fig. 8 is a schematic structural composition diagram of the metallized heat-sensitive paper roll after the electronic tag is adhered, according to one or more embodiments of the present disclosure; as shown in fig. 8, subminiature electronic tags 104 are respectively adhered to the positions of the radio frequency windows 1031 arranged in an array on the metallized thermosensitive paper roll;

p94: brushing glue (hot melt adhesive) on a metal layer of the metallized heat-sensitive paper coiled material or compounding the metal layer with an adhesive film;

p95: performing die cutting, slitting and waste discharging on the metallized heat-sensitive paper coiled material subjected to glue brushing or compound glue film through a flat-knife die cutting machine or a circular-knife die cutting machine to process uniformly-arranged logistics surface sheets, please refer to fig. 5 for understanding, wherein fig. 5 is a schematic structural composition diagram of the logistics surface sheets arranged in an array manner provided by one or more embodiments of the specification; in fig. 5, the metallized heat-sensitive paper roll material after being coated with glue or a composite glue film is subjected to die cutting, slitting and waste discharge by a flat-knife die-cutting machine or a circular-knife die-cutting machine, and a plurality of independently used logistics surface sheets 10 which are uniformly arranged are processed, wherein each logistics surface sheet 10 is provided with a radio frequency window 1031, and a subminiature electronic tag 104 is respectively adhered to each radio frequency window 1031;

p96: and rolling the uniformly distributed logistics surface sheets obtained by processing to obtain coiled logistics surface sheet arrays.

The material flow surface single preparation method in one or more embodiments of the specification comprises the following steps: providing a surface paper layer, wherein the surface paper layer is used for printing visual logistics information of a target object; providing a pre-prepared electronic tag, wherein the electronic tag is used for storing and transmitting and receiving electronic logistics information of the target object; arranging a metal layer and the electronic tag on the basis of one surface of the surface paper layer to obtain a metallized composite layer, wherein the metal layer is provided with a through structure, the through structure comprises a radio frequency window, the electronic tag is arranged corresponding to the radio frequency window, the size of an antenna in the electronic tag is smaller than that of the metal layer, and the antenna in the electronic tag can be coupled with the metal layer and can receive and transmit the electronic logistics information through a radio frequency signal; and forming a first adhesive layer for adhering the logistics surface sheet to a target object based on one surface of the metallized composite layer departing from the surface paper layer to obtain the logistics surface sheet. The metal layer is added in the logistics surface sheet, the through structure comprising the radio frequency window is arranged on the metal layer, the electronic tag is arranged corresponding to the radio frequency window, and the antenna in the electronic tag is coupled with the metal layer, so that the metal layer is used as a radiating body of the antenna in the electronic tag to participate in the radiation of electromagnetic waves, the radio frequency signal receiving and sending performance of the electronic tag is enhanced, the radio frequency signal receiving and sending performance is not required to be enhanced by increasing the size of the electronic tag, and the requirement for the large size of the electronic tag is reduced.

It should be noted that the embodiment in this specification and the previous embodiment in this specification are based on the same inventive concept, and therefore, specific implementation of this embodiment may refer to implementation of the aforementioned logistics list, and repeated details are not described herein.

On the basis of the same technical concept, corresponding to the logistics surface sheet described in fig. 1 to 5, one or more embodiments of the present disclosure further provide a logistics package, fig. 9 is a schematic structural composition diagram of the logistics package provided in one or more embodiments of the present disclosure, and as shown in fig. 9, the logistics surface sheet 10 described in fig. 1 to 5 is attached to the logistics package 20.

Wherein, above-mentioned commodity circulation face list 10 includes: the electronic tag comprises a surface paper layer, a first adhesive layer, a metal layer and an electronic tag, wherein the metal layer and the electronic tag are arranged between the surface paper layer and the first adhesive layer;

the metal layer is provided with a transparent structure, and the transparent structure comprises a radio frequency window;

the first adhesive layer is used for adhering the logistics surface sheet 10 to the logistics information display position on the target object;

the electronic tag is used for storing and transmitting and receiving electronic logistics information of a target object, and an antenna in the electronic tag can be coupled with the metal layer and transmits and receives the electronic logistics information through a radio frequency signal.

In the logistics package 20 of one or more embodiments of the present disclosure, the logistics surface sheet 10 disposed on the logistics package 20 includes: the electronic tag comprises a surface paper layer, a first adhesive layer, a metal layer and an electronic tag, wherein the metal layer and the electronic tag are arranged between the surface paper layer and the first adhesive layer; the metal layer is provided with a through structure, and the through structure comprises a radio frequency window; the antenna in the electronic tag can be coupled with the metal layer and can receive and transmit electronic logistics information through radio frequency signals. The metal layer is added in the logistics surface sheet, the through structure comprising the radio frequency window is arranged on the metal layer, the electronic tag is arranged corresponding to the radio frequency window, and the antenna in the electronic tag is coupled with the metal layer, so that the metal layer is used as a radiating body of the antenna in the electronic tag to participate in the radiation of electromagnetic waves, the radio frequency signal receiving and sending performance of the electronic tag is enhanced, the radio frequency signal receiving and sending performance is not required to be enhanced by increasing the size of the electronic tag, and the requirement for the large size of the electronic tag is reduced.

On the basis of the same technical concept, corresponding to the logistics surface sheet described in fig. 1 to 5, one or more embodiments of the present disclosure further provide a logistics good, and fig. 10 is a schematic structural composition diagram of the logistics good provided in one or more embodiments of the present disclosure, as shown in fig. 10, the logistics surface sheet 10 described in fig. 1 to 5 is attached to a surface of the logistics good 30 or a surface of an outer package 301 thereof.

Wherein, above-mentioned commodity circulation face list includes: the electronic tag comprises a surface paper layer, a first adhesive layer, a metal layer and an electronic tag, wherein the metal layer and the electronic tag are arranged between the surface paper layer and the first adhesive layer;

In one or more embodiments of the present specification, the logistics goods includes a logistics surface sheet disposed on the logistics goods, and the logistics surface sheet includes: the electronic tag comprises a surface paper layer, a first adhesive layer, a metal layer and an electronic tag, wherein the metal layer and the electronic tag are arranged between the surface paper layer and the first adhesive layer; the metal layer is provided with a through structure, and the through structure comprises a radio frequency window; the antenna in the electronic tag can be coupled with the metal layer and can receive and transmit electronic logistics information through radio frequency signals. The metal layer is added in the logistics surface sheet, the through structure comprising the radio frequency window is arranged on the metal layer, the electronic tag is arranged corresponding to the radio frequency window, and the antenna in the electronic tag is coupled with the metal layer, so that the metal layer is used as a radiating body of the antenna in the electronic tag to participate in the radiation of electromagnetic waves, the radio frequency signal receiving and sending performance of the electronic tag is enhanced, the radio frequency signal receiving and sending performance is not required to be enhanced by increasing the size of the electronic tag, and the requirement for the large size of the electronic tag is reduced.

The foregoing description has been directed to specific embodiments of this disclosure. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the embodiments and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing may also be possible or may be advantageous.

For convenience of description, the above devices are described as being divided into various units by function, and are described separately. Of course, the functionality of the various elements may be implemented in the same one or more software and/or hardware implementations of one or more of the present descriptions.

It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the system embodiment, since it is substantially similar to the method embodiment, the description is simple, and for the relevant points, reference may be made to the partial description of the method embodiment.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of one or more embodiments of the present specification, it is to be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like are used for indicating orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are usually placed when in use, and are used for convenience in describing one or more embodiments of the present specification and for simplicity in description, but do not indicate or imply that the device or element that is referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting one or more embodiments of the present specification. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

In the description of one or more embodiments of the present specification, it is further noted that the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and encompass, for example, fixed, removable, and integral connections unless expressly stated or limited otherwise; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in one or more embodiments of the present specification may be specifically understood by those of ordinary skill in the art.

Finally, it should be noted that: although the embodiments of one or more embodiments of the present specification have been described in detail with reference to the accompanying drawings for the purpose of illustrating the subject matter of one or more embodiments of the present specification, the embodiments of one or more embodiments of the present specification are not limited to the above-mentioned embodiments, the scope of the embodiments of one or more embodiments of the present specification is not limited thereto, and the above-mentioned embodiments are only illustrative and not restrictive, and although the embodiments of one or more embodiments of the present specification have been described in detail with reference to the above-mentioned embodiments, those skilled in the art will understand that: any person skilled in the art can modify or easily conceive the technical solutions described in the foregoing embodiments or make equivalent substitutions for some technical features within the technical scope disclosed in one or more embodiments of the present specification; such modifications, changes, or substitutions do not depart from the spirit and scope of the corresponding embodiments of the one or more embodiments of the present disclosure. Are intended to be covered by the scope of one or more embodiments of the present disclosure. Therefore, the scope of protection of one or more embodiments of the present specification shall be subject to the scope of protection of the claims.

Claims

1. A logistics sheet comprising: the electronic tag comprises a surface paper layer, a first adhesive layer, a metal layer and an electronic tag, wherein the metal layer and the electronic tag are arranged between the surface paper layer and the first adhesive layer;

the metal layer is provided with a through structure, and the through structure comprises a radio frequency window and a plurality of through holes;

the electronic tag is arranged corresponding to the radio frequency window so as to reduce the influence of the metal layer on the impedance matching of the electronic tag, and the size of an antenna in the electronic tag is smaller than that of the metal layer;

the through holes are used for reducing the influence degree of the metal layer on the impedance matching of the electronic tags in other logistics surface sheets when the logistics surface sheets are pasted on a target object;

the surface paper layer is used for printing visual logistics information of the target object;

2. The logistics surface sheet of claim 1, wherein the radio frequency window is smaller in size than the electronic tag; the surface paper layer, the metal layer, the electronic tag and the first adhesive layer are sequentially arranged along the normal direction of the logistics surface sheet;

the first surface, used for printing the visual logistics information, of the surface paper layer faces away from the electronic tag; the chip in the electronic tag faces the second surface of the face paper layer.

3. The logistics surface sheet of claim 2, wherein the logistics surface sheet further comprises: a second adhesive layer and a third adhesive layer;

the metal layer and the surface paper layer are bonded through the second adhesive layer; the electronic tag is adhered to the metal layer through the third adhesive layer;

the electronic tag is arranged at a first appointed position of the first adhesive layer, the radio frequency window is arranged at a second appointed position of the metal layer, and when the electronic tag is bonded with the metal layer through the third adhesive layer, the absolute value of the deviation between the central point of the first appointed position and the central point of the second appointed position is smaller than or equal to a first preset threshold value.

4. The logistics surface sheet of claim 3, wherein an absolute value of a difference between an area of the third glue layer and an area of the electronic label is less than or equal to a second preset threshold.

5. The logistics surface sheet of claim 1, wherein the plurality of through holes are configured to reduce the degree of influence of the metal layer on impedance matching of electronic tags in other logistics surface sheets from a first value to a second value when the logistics surface sheet is adhered to the target object;

wherein the other logistics surface sheet is an logistics surface sheet used for being pasted to other objects except the target object.

6. The logistics surface sheet of claim 5, wherein if the absolute value of the difference between the dimensions of the metal layer and the dimensions of the surface paper layer is less than or equal to a third preset threshold value;

when the other logistics surface sheet and the logistics surface sheet pasted on the target object have an overlapping area, the through holes can reduce the influence degree of the metal layer on the impedance matching of the electronic tags in the other logistics surface sheet from a first value to a second value.

7. The logistics surface sheet of claim 5, wherein the plurality of through holes are distributed in the metal layer in an array;

the through holes are evenly distributed around the radio frequency window.

8. The logistics surface sheet of claim 1, wherein the radio frequency window is smaller in size than the electronic tag; the surface paper layer, the electronic tag, the metal layer and the first adhesive layer are sequentially arranged along the normal direction of the logistics surface sheet;

the first surface of the surface paper layer, which is used for printing the visual logistics information, faces away from the electronic tag; and the chip in the electronic tag is back to the second surface of the face paper layer.

9. The logistics surface sheet of claim 1, wherein the electronic label has a size that is less than or equal to the size of the radio frequency window;

the electronic tag is embedded into the radio frequency window, and the electronic tag and the metal layer are both bonded with the surface paper layer.

10. The logistics surface sheet of claim 1, wherein the metal layer is the same size as the face paper layer.

11. The logistics surface sheet of claim 1, wherein the logistics surface sheet further comprises: release paper;

and the release paper is bonded with one surface of the first adhesive layer, which is deviated from the surface paper layer.

12. The logistics surface sheet of claim 1, wherein the logistics surface sheet adhered to the target object is a single-use logistics surface sheet obtained by cutting the prepared logistics surface sheet array;

a plurality of electronic tags are arranged on the metal layer in the logistics surface single array in an array manner; and the radio frequency windows arranged on the metal layer correspond to the electronic tags one to one.

13. The logistics surface sheet of claim 1, wherein the logistics surface sheet adhered to the target object is obtained by cutting a plurality of metallized surface paper layers from the prepared surface paper layer array provided with the metal layers, and adhering the electronic tag at the radio frequency window on the metallized surface paper layers.

14. A method for preparing a logistic bill, wherein the method comprises the following steps:

arranging a metal layer and the electronic tag on the basis of one surface of the surface paper layer to obtain a metallized composite layer, wherein the metal layer is provided with a through structure, the through structure comprises a radio frequency window and a plurality of through holes, the electronic tag and the radio frequency window are correspondingly arranged to reduce the influence of the metal layer on impedance matching of the electronic tag, the size of an antenna in the electronic tag is smaller than that of the metal layer, and the antenna in the electronic tag can be coupled with the metal layer and receive and send electronic logistics information through radio frequency signals; the through holes are used for reducing the influence degree of the metal layer on the impedance matching of the electronic tags in other logistics surface sheets when the logistics surface sheets are pasted on a target object;

15. The method of claim 14, wherein the area of the facestock layer is greater than or equal to the sum of the areas of the plurality of logistics sheets;

based on a surface of the surface paper layer, set up metal level and electronic tags, include:

based on one surface of the surface paper layer, a metal layer with a plurality of transparent structures and a plurality of electronic tags arranged on the metal layer in an array mode are arranged, wherein the radio frequency windows in the transparent structures correspond to the electronic tags one to one.

16. The method of claim 14, wherein the area of the facestock layer is greater than or equal to the sum of the areas of the plurality of logistics sheets;

17. The method of claim 14, wherein the providing the metal layer and the electronic tag based on a surface of the face paper layer comprises:

and with the radio frequency window as an alignment reference, the electronic tag is adhered to one surface of the metal layer, which deviates from the surface paper layer, or the electronic tag is embedded into the radio frequency window and adhered to the surface paper layer.

18. The method of claim 17, wherein said forming a metal layer covering at least a portion of a surface of said face paper layer comprises:

forming a metal film on one surface of the face paper layer by adopting a coating process;

19. The method of claim 17, wherein said forming a metal layer covering at least a portion of a surface of said face paper layer comprises:

providing a pre-prepared metal layer;

20. The method of claim 14, wherein the providing the metal layer and the electronic tag based on a surface of the face paper layer comprises:

adhering the electronic tag to one surface of the surface paper layer;

providing a pre-prepared metal layer;

and adhering the metal layer to one surface of the surface paper layer in a mode of aligning the radio frequency window with the electronic tag.

21. The method of claim 19 or 20, wherein prior to said providing a pre-fabricated metal layer, further comprising:

providing a first metal film substrate;

22. The method of claim 14, wherein prior to said providing a pre-prepared electronic label, further comprising:

providing a second metal film substrate;

23. The method of claim 14, wherein the plurality of vias are configured to reduce a degree of influence of the metal layer on impedance matching of electronic tags in other logistics sheets from a first value to a second value when the logistics sheet is affixed to the target object;

24. The method of claim 14, wherein the method further comprises:

25. A logistics package wherein a logistics sheet as claimed in any one of claims 1 to 13 is affixed to the logistics package.

26. A logistics good, wherein the logistics surface sheet as claimed in any one of claims 1 to 13 is adhered to the surface of the logistics good or the outer packaging surface of the logistics good.