CN212519541U - Can improve COB printed wiring board of going technology limit precision - Google Patents
Can improve COB printed wiring board of going technology limit precision Download PDFInfo
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- CN212519541U CN212519541U CN202021251688.8U CN202021251688U CN212519541U CN 212519541 U CN212519541 U CN 212519541U CN 202021251688 U CN202021251688 U CN 202021251688U CN 212519541 U CN212519541 U CN 212519541U
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Abstract
The utility model relates to a COB printed circuit board capable of improving the precision of a technological edge, wherein the edges of the COB printed circuit board close to four corners are provided with cutting marks; the cutting mark has a cutting blade lateral alignment reference line and a longitudinal alignment reference line. The utility model discloses a openly set up the cutting mark at COB printed wiring board, can carry out the high accuracy cutting to COB printed wiring board, get rid of the technology limit, improved accurate poor in the operation process, easy eccentric problem to promote production efficiency, improved semi-manufactured goods qualification rate, reduced the production loss.
Description
Technical Field
The utility model belongs to the technical field of printed circuit board processing, in particular to can improve COB printed circuit board who removes technology limit precision.
Background
With the development of indoor small-space LED display technology, the pace of realizing smaller pixel point space is accelerated, and further more precise requirements are provided for each process link of the LED.
COB packaging means that a chip and related components are directly attached to a printed circuit board, the chip and the related components are electrically connected through PCB wiring in a metal wire bonding or welding mode, related electrodes are led out through the PCB wiring, and the chip and the related components are covered with resin for protection.
The existing COB packaging technology for removing the process and the inspection technology become difficult problems in the existing market, the precision performance is poor, and the process size deviation of a semi-finished product of a display screen is often caused by misoperation, so that the display problems of eccentricity, display image offset and the like are caused. Therefore, the problems of long production time, low qualification rate, high defective rate of semi-finished products and the like are caused.
Disclosure of Invention
The to-be-solved technical problem of the utility model is to provide a can improve COB printed circuit board who removes technology limit precision to solve prior art and remove that technology limit method production is ageing long, the qualification rate is low, the high scheduling problem of semi-manufactured goods rate.
In order to solve the technical problem, the COB printed circuit board capable of improving the precision of the technological edge removal is characterized in that cutting marks are arranged at the edges, close to four corners, of the COB printed circuit board; the cutting mark has a cutting blade lateral alignment reference line and a longitudinal alignment reference line.
The cutting marks at the edges of the COB printed circuit board close to the four corners form centrosymmetric patterns.
The cutting mark is an L-shaped mark; the inner side edge lines of the transverse marks of the four L-shaped marks are used as transverse alignment reference lines of the cutting knife; the inner side edge line of the longitudinal mark is used as a longitudinal alignment reference line of the cutting knife.
The COB printed circuit board has first and second transverse MARK points on the back surface thereof corresponding to positions on the inner side of the transverse alignment datum, and first and second longitudinal MARK points corresponding to positions on the inner side of the longitudinal alignment datum.
The cutting marks comprise an A rectangular mark, a B rectangular mark and a C rectangular mark which are parallel to two opposite sides; the opposite transverse edges of the rectangle mark A and the rectangle mark C are respectively used as the inner edge and the outer edge of the cutting knife which are transversely aligned to the datum line; the opposite longitudinal sides of the rectangle mark A and the rectangle mark B are respectively used as the inner side and the outer side of the longitudinal alignment datum line of the cutting knife; the distance between the opposite transverse sides of the A rectangular mark and the C rectangular mark and the distance t between the opposite longitudinal sides of the A rectangular mark and the B rectangular mark are equal to the thickness of the cutting knife.
The cutting mark comprises a transverse marking line and a longitudinal marking line; the width of the transverse marking line and the width of the longitudinal marking line are equal to the thickness of the cutting knife; the inner side edge line and the outer side edge line of the transverse marking line are used as the inner side edge and the outer side edge of the transverse alignment datum line of the cutting knife, and the inner side edge line and the outer side edge line of the longitudinal marking line are used as the inner side edge and the outer side edge of the longitudinal alignment datum line of the cutting knife.
The COB printed circuit board has first and second transverse MARK points on the back corresponding to the inner side of the transverse alignment datum line, and first and second longitudinal MARK points corresponding to the inner side of the longitudinal alignment datum line.
The beneficial effects of the utility model reside in that: the COB printed circuit board openly has set up the cutting mark, through setting up the cutting mark, can carry out the high accuracy cutting to COB printed circuit board, gets rid of the technology limit, has improved accurate difference in the operation process, easy eccentric problem to promote production efficiency, improved semi-manufactured goods qualification rate, reduced the production loss.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Fig. 1 is a schematic front view of a COB printed wiring board according to embodiment 1 of the present invention.
Fig. 2 is a schematic front view of a COB printed wiring board according to embodiment 2 of the present invention.
Fig. 3 is a schematic front view of a COB printed wiring board according to embodiment 3 of the present invention.
Fig. 4 is a schematic diagram of the back of the COB printed wiring board of the present invention.
11 in the figure, transverse marks are marked; 12. longitudinal marking; 21 first transverse MARK point; 22. a first longitudinal MARK point; 23. a second longitudinal MARK point; 24. a second transverse MARK point; a rectangle mark; b rectangle mark; c rectangle mark; 41. marking lines transversely; 42. a longitudinal marking line; 51. transversely aligning the datum line; 52. longitudinally aligning the datum line; and 6, cutting the COB printed circuit board to form the outer frame.
Detailed Description
In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. When the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
Example 1
As shown in fig. 1, the COB printed circuit board capable of improving the precision of the process edge has cutting marks near the four corners; the cutting mark is an L-shaped mark; the L-shaped mark can be an Organic Solderability Preservative (OSP) film on the upper surface of the COB printed circuit board or a plating layer printed on the upper surface of the COB printed circuit board by gold immersion, silver dissolution and other processes; the inner side edge lines of the transverse marks 11 of the four L-shaped marks are used as transverse alignment reference lines 51 of the cutting knife; the inside edge line of the longitudinal mark 12 serves as a longitudinal cutter alignment reference line 52; cutting marks at the edges of the COB printed circuit board close to the four corners to form a centrosymmetric pattern; the COB printed wiring board has first and second transverse MARK points 21, 24 on the back side thereof corresponding to positions inside the transverse alignment reference line 51, and first and second longitudinal MARK points 22, 23 corresponding to positions inside the longitudinal alignment reference line 52.
During processing, the COB printed circuit board is firstly embedded on a tooling die with the right side facing upwards, then the COB printed circuit board embedded with the tooling die is placed on a cutting device, and after the edge of a cutting knife is aligned with a transverse alignment datum line 51, the COB printed circuit board is cut to remove a transverse process edge; after the edge of the cutting knife is aligned with the longitudinal alignment datum line 52, the COB printed circuit board is cut to remove the longitudinal process edge.
Example 2
As shown in fig. 2, the COB printed circuit board capable of improving the precision of the process edge has cutting marks near the four corners; the cutting marks comprise an A rectangular mark 31, a B rectangular mark 32 and a C rectangular mark 33 which are parallel to two opposite sides; the three rectangular marks can be an organic solderability preservative film (OSP) manufactured on the upper surface of the COB printed circuit board, or a plating layer printed on the upper surface of the COB printed circuit board through gold immersion, silver dissolving and other processes; the opposite transverse sides of the A rectangular mark 31 and the C rectangular mark 33 are respectively used as the inner side and the outer side of the transverse alignment datum line 51 of the cutting knife; the opposite longitudinal sides of the A rectangular mark 31 and the B rectangular mark 32 are respectively used as the inner side and the outer side of the longitudinal alignment reference line 52 of the cutting knife; the distance t between the opposite lateral sides of the a rectangular mark 31 and the C rectangular mark 33, and the distance t between the opposite longitudinal sides of the a rectangular mark 31 and the B rectangular mark 32 are equal to the thickness of the cutting knife; cutting marks at the edges of the COB printed circuit board close to the four corners to form a centrosymmetric pattern; the COB board has first and second transverse MARK points 21 and 24 on the back side thereof corresponding to positions inside the inner edge of the transverse alignment reference line 51, and first and second longitudinal MARK points 22 and 23 corresponding to positions inside the inner edge of the longitudinal alignment reference line 52.
Example 3
As shown in fig. 3, the COB printed circuit board capable of improving the precision of the process edge has cutting marks near the four corners; the cutting mark includes a transverse mark line 41 and a longitudinal mark line 42; the width of the transverse marking lines 41 and the longitudinal marking lines 42 is equal to the thickness of the cutting knife; the transverse mark lines 41 and the longitudinal mark lines 42 may be Organic Solderability Preservative (OSP) films on the upper surface of the COB printed circuit board, or plating layers printed on the upper surface of the COB printed circuit board by gold immersion, silver deposition and other processes; the inside edge line and the outside edge line of the transverse marking line 41 serve as the inside edge and the outside edge of the cutter transverse alignment reference line 51, and the inside edge line and the outside edge line of the longitudinal marking line 42 serve as the inside edge and the outside edge of the cutter longitudinal alignment reference line 52; cutting marks at the edges of the COB printed circuit board close to the four corners to form a centrosymmetric pattern; the COB board has first and second transverse MARK points 21 and 24 on the back side thereof corresponding to positions inside the inner edge of the transverse alignment reference line 51, and first and second longitudinal MARK points 22 and 23 corresponding to positions inside the inner edge of the longitudinal alignment reference line 52.
During processing, the COB printed circuit board is firstly embedded on a tooling die with the front side facing upwards, then the COB printed circuit board embedded with the tooling die is placed on a cutting device, and the two side edges of a cutting knife are respectively aligned with the inner side edge line and the outer side edge line of the transverse marking line 41, and then the COB printed circuit board is cut to remove the transverse process edge; and after the edges of the cutting knife are respectively aligned with the inner side edge line and the outer side edge line of the longitudinal mark line 42, cutting the COB printed circuit board to remove the longitudinal process edge.
As shown in fig. 2, after the transverse and longitudinal process edges are cut and removed, the COB printed wiring board can be placed under a microscope with the back side facing upward, and the first and second longitudinal MARK points 22 and 23 are observed according to the first and second transverse MARK points 21 and 24 on the back side of the COB printed wiring board to see whether the eccentricity problem exists; if the first and second transverse MARK points 21 and 24 and the first and second longitudinal MARK points 22 and 23 are precisely located at the edge of the COB printed wiring board, there is no eccentricity problem.
Wherein the first and second transverse MARK points 21 and 24 and the first and second longitudinal MARK points 22 and 23 may be circular, square, or other shapes.
Claims (7)
1.A COB printed circuit board capable of improving the precision of process edge removal is characterized in that cutting marks are arranged at the edges, close to four corners, of the COB printed circuit board; the cutting mark has a cutting burr lateral alignment reference line (51) and a longitudinal alignment reference line (52).
2. The COB printed circuit board capable of improving the precision of the process edge removal according to claim 1, wherein the cutting marks near the four corner edges of the COB printed circuit board form a centrosymmetric pattern.
3. The COB printed wiring board of claim 1 or 2, which can improve the edge deletion precision, characterized in that the cutting marks are L-shaped marks; the inner side edge lines of the transverse marks (11) of the four L-shaped marks are used as transverse alignment reference lines (51) of the cutting knife; the inside edge line of the longitudinal mark (12) serves as a longitudinal cutting blade alignment reference line (52).
4. The COB printed wiring board capable of improving the edge deletion accuracy according to claim 3, wherein the COB printed wiring board has first and second transverse MARK points (21), (24) on the back surface thereof at positions corresponding to the inner sides of the transverse alignment fiducial lines (51), and first and second longitudinal MARK points (22), (23) at positions corresponding to the inner sides of the longitudinal alignment fiducial lines (52).
5. The COB printed wiring board of claim 1, characterized in that the cutting marks include a rectangular mark a (31), a rectangular mark B (32), and a rectangular mark C (33) parallel to each other; the opposite transverse sides of the A rectangular mark (31) and the C rectangular mark (33) are respectively used as the inner side and the outer side of the transverse alignment datum line (51) of the cutting knife; the opposite longitudinal sides of the A rectangular mark (31) and the B rectangular mark (32) are respectively used as the inner side and the outer side of the longitudinal alignment datum line (52) of the cutting knife; the distance between the opposite transverse sides of the A rectangular mark (31) and the C rectangular mark (33) and the distance between the opposite longitudinal sides of the A rectangular mark (31) and the B rectangular mark (32) are equal to the thickness of the cutting knife.
6. The COB printed wiring board of claim 1, characterized in that the cutting marks comprise transverse marking lines (41) and longitudinal marking lines (42); the width of the transverse marking line (41) and the longitudinal marking line (42) is equal to the thickness of the cutting knife; the inner and outer edge lines of the transverse marking line (41) serve as the inner and outer edges of the cutter transverse alignment reference line (51), and the inner and outer edge lines of the longitudinal marking line (42) serve as the inner and outer edges of the cutter longitudinal alignment reference line (52).
7. COB printed circuit board with improved edge deletion according to claim 5 or 6, characterized in that the COB printed circuit board has first and second transverse MARK points (21), (24) on its back corresponding to the positions inside the inner edge of the transverse alignment datum (51) and first and second longitudinal MARK points (22), (23) corresponding to the positions inside the inner edge of the longitudinal alignment datum (52).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021251688.8U CN212519541U (en) | 2020-06-30 | 2020-06-30 | Can improve COB printed wiring board of going technology limit precision |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021251688.8U CN212519541U (en) | 2020-06-30 | 2020-06-30 | Can improve COB printed wiring board of going technology limit precision |
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| CN212519541U true CN212519541U (en) | 2021-02-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113438817A (en) * | 2021-07-01 | 2021-09-24 | 湖南维胜科技电路板有限公司 | PCB processing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113438817A (en) * | 2021-07-01 | 2021-09-24 | 湖南维胜科技电路板有限公司 | PCB processing method |
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