CN214815518U - Die bonding jig - Google Patents

Abstract

The utility model relates to a solid brilliant technical field of semiconductor, in particular to solid brilliant tool, this solid brilliant tool is used for assisting solid brilliant equipment to fix a position the welding point on the base plate, solid brilliant tool includes the marking plate at least, this marking plate further includes at least a set of identification portion that matches with the base plate, this identification portion is through the method of diagonal angle location, the welding point in the identification region of a set of identification point sign, and solid brilliant equipment can clearly and definitely discern this identification portion, solid brilliant equipment can more accurately fix a position the position of welding point according to the position of identification portion, the accumulative total tolerance has been reduced greatly, thereby it can both be more accurate to carry out the solder paste printing at the welding point or place components and parts at the welding point. The utility model provides a solid brilliant tool has effectively solved current solid brilliant in-process, and the problem that solid brilliant equipment butt welding point's location is not accurate enough to solid brilliant yields has been improved.

Description

Die bonding jig

[ technical field ] A method for producing a semiconductor device

The utility model relates to a solid brilliant technical field of semiconductor, in particular to solid brilliant tool.

[ background of the invention ]

With the development of electronic devices, various semiconductor manufacturing links are also optimized continuously, and the degree of automation of die bonding, which is an indispensable link in the semiconductor manufacturing process, is increasing day by day.

However, in the existing die bonding process, the color of the substrate is usually black or close to black, the color of the soldering point before the solder paste is printed is usually black or close to black, the color after the solder paste is printed is usually gray, and the color of the soldering point and the color of the substrate are not different greatly all the time, so that when the soldering point is positioned, the die bonding equipment is difficult to distinguish the position of the soldering point, the position printed by the solder paste is inaccurate or the problem that components can not be accurately placed on the solder paste easily occurs, and the die bonding yield is reduced.

[ Utility model ] content

For solving solid brilliant equipment butt welding point location and leading to the technical problem that solid brilliant yields is low inadequately accurately, the utility model provides a solid brilliant tool.

The utility model provides a solid crystal jig, solid crystal jig is used for assisting solid crystal equipment to position the welding point on the base plate, solid crystal jig includes the marking plate at least, be equipped with at least a set of identification portion and set up an opening that matches with the base plate on the marking plate, the marking plate will the base plate be fixed in solid crystal region that solid crystal equipment corresponds through the opening; the opening and the identification part define at least one identification area, one group of identification parts correspondingly identify welding points in one identification area, and the die bonding equipment positions the welding points in the corresponding identification area by identifying the identification parts during die bonding.

Preferably, the mark part further comprises a first mark part and a second mark part, wherein the first mark part and the second mark part in each group of mark parts are diagonally arranged corresponding to the mark area.

Preferably, at least two groups of identification parts are arranged on the identification plate, and the first identification part and the second identification part are respectively arranged on two opposite sides of the identification plate.

Preferably, the distance between two adjacent first identifiers is equal, and the distance between two adjacent second identifiers is equal.

Preferably, the distance between two adjacent first identification members is 25 mm-35 mm.

Preferably, the opening and the identification portion define at least two identification areas, and any two of the identification areas do not overlap.

Preferably, the color of the mark part is different from the color of the substrate and the color of the welding point.

Preferably, the die bonding jig further comprises a supporting plate, wherein the supporting plate is provided with a containing groove, the substrate is arranged in the containing groove when the die bonding jig is used, and the mark plate is covered on a notch of the containing groove.

Preferably, the thickness of the substrate is equal to the sum of the depth of the accommodating groove and the thickness of the identification plate.

Preferably, the identification area is a rectangular area.

Compared with the prior art, the utility model provides a pair of solid brilliant tool has following advantage:

1. the utility model provides a solid crystal jig for the welding point on supplementary solid crystal equipment fixes a position on the base plate, gu the crystal jig includes the marking plate at least, is equipped with at least a set of identification portion and sets up an opening that matches with the base plate on the marking plate, the marking plate is fixed in the solid crystal region that solid crystal equipment corresponds through the opening with the base plate; the opening and the identification part define at least one identification area, a group of identification parts correspond to welding points in the identification area, the die bonder is used for positioning and corresponding to the welding points in the identification area through identifying a group of identification parts during die bonding, in the existing die bonding process, the color of the substrate and the color of the welding points are usually the same or similar, therefore, the die bonder is difficult to accurately identify the positions of the welding points, thereby causing positioning deviation, the identification parts corresponding to the positions of the welding points are arranged, the positioning of the die bonder on the welding points is more accurate, and the die bonding yield is improved.

2. The utility model provides an among the solid brilliant tool, a set of identification portion further includes first identification piece and second identification piece, and wherein, first identification piece and second identification piece are the diagonal angle setting in corresponding the identification region in every group identification portion, and the mode through diagonal angle location is distinguished to the bonding point region, and this identification mode is simply easily operated and the identification region is clear and definite for solid brilliant equipment can discern the position of welding point fast.

3. In the die bonding jig provided by the utility model, at least two groups of identification parts are arranged on the identification plate, the first identification part and the second identification part are respectively arranged at two opposite sides of the identification plate, in the manufacturing process of parts, a certain error always exists in the actual size after completion due to the influence of factors such as processing or measurement, the size variation in an allowable range is a tolerance, in the die bonding process, a certain tolerance exists in the positioning of each welding point due to the influence of the positioning or moving error of die bonding equipment, the positioning tolerance of a single welding point does not influence a finished product, however, when a large number of welding points are arranged on a substrate, the positioning tolerance of each welding point is accumulated to generate an accumulated tolerance which is usually far larger than the tolerance of the single welding point, the accumulated tolerance is too large to cause product scrapping, the die bonding yield is greatly reduced, the design divides the welding points into a plurality of areas for identification, the identification parts corresponding to the surface identification areas serve as positioning references in each surface identification area, namely, when a new identification area is identified, the die bonder performs positioning correction once by using the identification parts in the area as the references, so that the accumulated tolerance of the whole substrate is reduced to the accumulated tolerance of one identification area, the accumulated tolerance of the positioning welding points of the die bonder can be effectively reduced by arranging a plurality of groups of identification parts, the accuracy of the die bonder in positioning the welding points is further improved, and the die bonder yield is further improved.

4. The utility model provides an among the solid brilliant tool, the distance between two adjacent first identification pieces equals, and the distance between two adjacent second identification pieces equals, is about to all welding points evenly divided into a plurality of sign regions, and accumulated tolerance has further been reduced to this design for solid brilliant equipment is more accurate to the location of welding point.

5. The utility model provides an among the solid brilliant tool, distance between arbitrary two adjacent first identification pieces is 25mm ~ 35mm, the distance between two first identification pieces is too big easily to lead to solid brilliant equipment's accumulative total tolerance too big and reduce the positioning accuracy, distance undersize between two first identification pieces then can make identification portion quantity too much, gu brilliant equipment needs the number of times increase of identification portion, thereby the work efficiency of solid brilliant equipment has been reduced, this interval scope can guarantee that accumulative total tolerance is less, make the identification portion operation number of times of solid brilliant equipment can not be too much simultaneously, the degree of accuracy and the efficiency nature that the welding point was located can be guaranteed simultaneously in this design.

6. The utility model provides an among the solid brilliant tool, the opening defines two at least sign regions with identification portion, and two arbitrary sign regions do not overlap, and this design has avoided the welding point to be caused solid brilliant equipment location chaotic problem by repeated sign, has further guaranteed that this solid brilliant tool can pinpoint the welding point.

7. The utility model provides an among the solid brilliant tool, the colour of identification portion all is different with the colour of base plate and welding point to guaranteed solid brilliant equipment and can discern the identification point more easily, further improved the efficiency and the degree of accuracy of solid brilliant equipment location welding point, thereby further improved the efficiency of solid brilliant process and the yields of solid brilliant work.

8. The utility model provides an among the solid brilliant tool, solid brilliant tool further includes the layer board, the storage tank has been seted up to the layer board, the storage tank is arranged in to the base plate during use, the notch of storage tank is located to the sign board lid, the material of part base plate is flexible or fragile, the layer board can play the effect of support and protection to this type of base plate, avoided the flexible substrate to remove and the positioning deviation problem that leads to, avoided the fragile base plate to receive the problem of pressure damage at solid brilliant in-process simultaneously, thereby further improved solid brilliant yields.

9. The utility model provides an among the solid brilliant tool, the thickness of base plate equals the degree of depth and the thickness sum of sign board of storage tank, even the upper surface of base plate flushes with the upper surface of sign board when using, this design makes solid brilliant equipment more accurate to the location of tin cream to improved the follow-up degree of accuracy of placing electronic components on tin cream, further improved solid brilliant in-process components and parts welded degree of accuracy and fastness, thereby further improved solid brilliant yields.

10. The utility model provides an among the solid brilliant tool, the sign region is the rectangle region, set up the sign region into the rectangle region, make solid brilliant equipment to the regional discernment of sign simple quick more, thereby the efficiency of discernment and location has been improved, the efficiency of solid brilliant has been improved, simultaneously because the welding area on the most base plate is the rectangle, set up the sign region into the simple clear and complete of division that can make whole welding area region of rectangle, thereby the efficiency and the degree of accuracy of solid brilliant equipment discernment and location have further been improved, thereby solid brilliant yields have further been improved.

[ description of the drawings ]

Fig. 1 is a schematic perspective view of a die bonding jig according to a first embodiment of the present invention.

Fig. 2 is a schematic top view of a die bonding jig according to a first embodiment of the present invention.

Fig. 3 is a first schematic view illustrating a matching between a mark plate and a substrate of a die bonding fixture according to a first embodiment of the present invention.

Fig. 4 is a second schematic view illustrating the matching between the marking plate and the substrate of the die bonding jig according to the first embodiment of the present invention.

Fig. 5 is a third schematic view illustrating the matching between the marking plate and the substrate of the die bonding jig according to the first embodiment of the present invention.

Fig. 6 is a fourth schematic view illustrating the matching between the marking plate and the substrate of the die bonding jig according to the first embodiment of the present invention.

Fig. 7 is an exploded schematic view of a die bonder according to a second embodiment of the present invention.

Fig. 8 is a schematic diagram of a die bonding jig according to a second embodiment of the present invention.

The attached drawings indicate the following:

1. a die bonding jig; 2. a die bonding jig; 3. a substrate;

11. a marking plate; 21. a marking plate; 22. a support plate; 31. a welding point;

111. a marking part; 112. an opening; 211. a marking part; 212. an opening; 221. a containing groove;

1111. a first identification member; 1112. a second identification member; 2111. a first identification member; 2112. a second identification member.

[ detailed description ] embodiments

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Please refer to fig. 1 and fig. 2, a die bonding jig 1 according to a first embodiment of the present invention is used for assisting die bonding equipment in positioning a solder joint 31 on a substrate 3, the die bonding jig 1 at least includes an identification plate 11, the identification plate 11 is provided with at least one set of identification portions 111 and is provided with an opening 112 matching with the substrate 3, the identification plate 11 fixes the substrate 3 in a die bonding area corresponding to the die bonding equipment through the opening 112, the opening 112 and the identification portions 111 define at least one identification area, the set of identification portions 111 corresponds to the solder joint 31 in the identification area, the die bonding equipment positions the solder joint 31 in the corresponding identification area by identifying the set of identification portions 111 during die bonding, in the existing die bonding process, the colors of the substrate 3 and the solder joint 31 are generally the same or similar, so that the die bonding equipment is difficult to accurately identify the position of the solder joint 31, thereby causing a positioning deviation, by arranging the identification part 111 corresponding to the position of the welding point 31, the positioning of the welding point 31 by the die bonding equipment is more accurate, and the die bonding yield is improved.

Specifically, the color and/or shape of the identification portion 111 are different from other positions of the identification plate 11, so that the identification portion 111 can be recognized by the die bonding device, in the embodiment of the present invention, the color and/or shape of the identification portion 111 is not limited as long as the requirement of being recognized by the die bonding device is met.

Specifically, the colour of identification portion 111 all is different with base plate 3 and welding point 31's colour to guaranteed solid brilliant equipment and can discern the identification point more easily, further improved solid brilliant equipment location welding point 31 efficiency nature and the degree of accuracy, thereby further improved the efficiency nature of solid brilliant process and the yields of solid brilliant work, specifically in the embodiment of the utility model provides an in, identification portion 111's colour is the gold.

Optionally, the shape of the mark portion 111 is circular, rectangular, diamond, triangular, star-shaped or hexagonal, and specifically, in the embodiment of the present invention, the shape of the mark portion 111 is circular with a diameter of 0.5 mm.

Furthermore, at least two identification areas are defined by the opening 112 and the identification part 111, and any two identification areas are not overlapped, so that the problem that the welding point 31 is identified repeatedly to cause disordered positioning of the die bonding equipment is avoided, and the die bonding jig 1 is further ensured to be capable of accurately positioning the welding point 31.

Specifically, each group of identification parts 111 further includes a first identification member 1111 and a second identification member 1112, wherein the first identification member 1111 and the second identification member 1112 in each group of identification parts 111 are diagonally arranged corresponding to the identification area, and the area of the welding point 31 is identified by a diagonal positioning manner, which is simple and easy to operate and has a definite identification area, so that the die bonder can quickly identify the position of the welding point 31.

Furthermore, at least two groups of identification parts 111 are arranged on the identification plate 11, and the first identification part 1111 and the second identification part 1112 are respectively arranged on two opposite sides of the identification plate 11.

It should be understood that, in the manufacturing process of the component, due to the influence of factors such as processing or measurement, there is always a certain error in the actual size after completion, the size variation within the allowable range is the tolerance, in the die bonding process, due to the influence of the positioning or moving error of the die bonding equipment, there is a certain tolerance in the positioning of each welding point 31, the positioning tolerance of a single welding point 31 does not affect the finished product, however, when there are a large number of welding points 31 on the substrate 3, the positioning tolerance of each welding point 31 will be accumulated to generate an accumulated tolerance, the accumulated tolerance is usually much larger than the tolerance of a single welding point 31, and the product will be scrapped due to the excessively large accumulated tolerance, so the die bonding yield is greatly reduced.

Referring to fig. 3-6, when the opening 112 and the mark 111 only define a mark area, the die bonding apparatus only uses the mark 111 corresponding to the mark area as a positioning reference, and the cumulative tolerance of the finished product is the cumulative value of the tolerances of all the solder joints 31 in the mark area. When the opening 112 and the identification portion 111 only define at least two groups of identification areas, the welding point 31 is divided into a plurality of areas for identification, and each identification area uses the identification portion 111 corresponding to the area as a positioning reference, that is, when a new identification area is identified, the die bonder performs positioning correction once by using the identification portion 111 of the area as a reference, so that the accumulated tolerance of the whole substrate 3 is reduced to the accumulated tolerance of one identification area, the arrangement of the plurality of groups of identification portions 111 can effectively reduce the accumulated tolerance of the die bonder for positioning the welding point 31, the positioning accuracy of the die bonder for positioning the welding point 31 is further improved, and the die bonding yield is further improved.

For example, when the opening 112 and the mark portion 111 only define a mark area a (as shown in fig. 3 a), the die bonder performs positioning and tin brushing or electronic component placing operations on all the soldering points 31 in the mark area a only by using the mark portion 111 corresponding to the mark area a as a positioning reference, and the cumulative tolerance of the finished product is the cumulative value of the tolerances of all the soldering points 31 in the mark area a; when the opening 112 and the mark 111 only define three mark areas, the soldering point 31 is divided into a mark area a (as shown in a in fig. 4), a mark area b (as shown in b in fig. 5) and a mark area c (as shown in c in fig. 6), the die bonder firstly uses the mark 111 corresponding to the mark area a as a positioning reference to position the soldering point 31 in the mark area a and perform the operations of brushing tin or placing electronic components, when the operations in the mark area a are completed, the die bonder further uses the mark 111 corresponding to the mark area b as a positioning reference to position and operate the soldering point 31 in the mark area b, and then uses the mark 111 corresponding to the mark area c as a positioning reference to position and operate the soldering point 31 in the mark area c, that is, before the soldering point 31 in each mark area is sequentially positioned, the die bonder performs positioning correction once using the mark 111 corresponding to the mark area as a positioning reference, the accumulated tolerance of the finished product is the accumulated value of the tolerances of all welding points 31 in one identification area on the substrate 3, thereby effectively reducing the accumulated tolerance, enabling the positioning of the welding points 31 by the die bonding equipment to be more accurate and further improving the yield of die bonding.

Further, the distance between two adjacent first identifiers 1111 is equal, and the distance between two adjacent second identifiers 1112 is equal, that is, all the welding points 31 are evenly divided into a plurality of identification areas, and this design further reduces the accumulated tolerance, so that the positioning of the welding points 31 by the die bonder is more accurate.

The embodiment of the present invention provides an in, the quantity of the identification region that opening 112 and identification portion 111 defined is not restricted, as long as can be for solid crystal equipment discernment can, specifically in the embodiment of the utility model provides an, according to the quantity of welding point 31 and the size of welding region on the base plate 3, opening 112 and identification portion 111 define 5 ~ 10 identification regions.

Optionally, the distance between two arbitrary adjacent first identifiers 1111 is 25mm ~ 35mm, specifically, in the embodiment of the utility model provides an, the distance between two adjacent first identifiers 1111 is 25mm, 28mm, 30mm, 32mm or 35mm, the too big accumulative tolerance that easily leads to solid brilliant equipment of distance between two first identifiers 1111 reduces the positioning accuracy, the too little distance between two first identifiers 1111 then can make identification portion 111 too much in quantity, gu brilliant equipment needs the number of times increase of identification portion 111, thereby the work efficiency of solid brilliant equipment has been reduced, accumulative tolerance can be guaranteed to this interval scope less, make the operation number of identification portion 111 of solid brilliant equipment can not be too much simultaneously, the degree of accuracy and the efficiency nature of welding point 31 location can be guaranteed simultaneously in this design.

Optionally, the regional shape of sign can be rectangle, rhombus, triangle-shaped, trapezoidal or other polygons etc, as long as satisfy the regional shape of sign can for the solid brilliant equipment shape that can discern of sign can, specifically, in the embodiment of the utility model provides an, the regional rectangle region that is of sign, set up the regional rectangle region of sign into, make solid brilliant equipment to the regional discernment of sign simple quick more, thereby the efficiency of discernment and location has been improved, the efficiency of solid brilliant is improved, simultaneously because the welding area on most base plate 3 is the rectangle, set up the regional division that can make whole welding area into the rectangle of sign simple clear and complete, thereby the efficiency and the degree of accuracy of solid brilliant equipment discernment and location have further been improved, thereby the solid brilliant yields has further been improved.

It can be understood that, when the die bonding jig 1 is used for positioning the welding point 31 on the substrate 3, the identification part 111 and the opening 112 are matched to define at least one identification area, and when the die bonding equipment is used, the die bonding equipment positions the welding point 31 by identifying the identification part 111, so that the positioning accuracy of the die bonding equipment on the welding point 31 is improved; furthermore, the mark portions 111 and the openings 112 cooperate to define a plurality of mark areas, the die bonder firstly uses the first group of mark portions 111 as a positioning reference, and then positions the soldering points 31 in the mark areas, and performs operations such as tin brushing or electronic component placement on the soldering points 31, when the die bonder finishes the operations of the soldering areas corresponding to the first group of mark portions 111, the die bonder then uses the second group of mark portions 111 as a positioning reference to perform the operations of the next mark area, that is, each mark area has one group of mark portions 111 as a positioning reference, thereby reducing the accumulated tolerance of the substrate 3, and further improving the efficiency of the die bonder process and the yield of the die bonder.

Referring to fig. 7, a die bonding jig 2 according to a second embodiment of the present invention includes an identification plate 21, the identification plate 21 further includes an identification portion 211 and an opening 212 matching with the substrate 3, each of the identification portions 211 further includes a first identification component 2111 and a second identification component 2112, and the difference between the second embodiment and the first embodiment is only that: the die bonding jig 2 further comprises a supporting plate 22, the supporting plate 22 is provided with a containing groove 221, the substrate 3 is placed in the containing groove 221 in use, the mark plate 21 covers the notch of the containing groove 221, part of the substrate 3 is flexible or brittle, the supporting plate 22 can support and protect the substrate 3, the problem of positioning deviation caused by movement of the flexible substrate 3 is avoided, meanwhile, the problem that the brittle substrate 3 is damaged by pressure in the die bonding process is avoided, and the die bonding yield is further improved.

Furthermore, the marking plate 21 is fixedly arranged on the supporting plate 22, the substrate 3 is arranged in the opening 212, the design ensures that the position of the substrate 3 cannot move, and the problem that the welding point 31 is inaccurately positioned due to the movement of the position of the substrate 3 is avoided, so that the accuracy of positioning the welding point 31 of the die bonding equipment and the die bonding yield are further improved.

Further, the thickness of base plate 3 equals the depth of storage tank 221 and the thickness sum of sign board 21, even the upper surface of base plate 3 flushes with the upper surface of sign board 21 when using, this design makes solid brilliant equipment more accurate to the location of tin cream to follow-up accuracy of placing electronic components on the tin cream has been improved, solid brilliant in-process components and parts welded degree of accuracy and fastness have further been improved, thereby the solid brilliant yields have further been improved.

Optionally, layer board 22 and sign board 21 integrated into one piece or the components of a whole that can function independently setting, specifically, in the embodiment of the utility model provides an, layer board 22 and sign board 21 components of a whole that can function independently setting.

Optionally, the thickness of signboard 21 is 0.15mm ~ 1.05mm, specifically, in the embodiment of the utility model provides an, the thickness of signboard 21 is 0.2mm, 0.5mm, 0.7mm, 0.9mm or 1mm, tolerance ± 0.05 mm.

Referring to fig. 8, further, the outer contour of the marking plate 21 and the outer contour of the supporting plate 22 are both rectangular, the length L (shown as L in fig. 8) of the marking plate 21 is smaller than the length L (shown as L in fig. 8) of the supporting plate 22, and the width W (shown as W in fig. 8) of the marking plate 21 is smaller than the width W (shown as W in fig. 8) of the supporting plate 22, so that the design ensures that the supporting plate 22 can firmly support the marking plate 21, and further prevents the problem of inaccurate positioning of the welding point 31 caused by the position movement of the marking plate 21, thereby improving the die bonding yield.

Optionally, length L of sign board 21 is 4.5mm ~ 10.5mm less than length L of layer board 22, and width W of sign board 21 is 4.5mm ~ 10.5mm less than length W of layer board 22, and the roughness error is less than or equal to 0.05mm, specifically, in the embodiment of the utility model provides an in length L of sign board 21 is 5mm, 8mm or 10mm less than length L of layer board 22, and width W of sign board 21 is 5mm, 8mm or 10mm less than length W of layer board 22.

It can be understood that, the material of sign board 21 and layer board 22 is not limited, as long as can fixed baseplate 3 and set up sign portion 211 can, specifically, in the embodiment of the utility model provides an in, the material of sign board 21 and layer board 22 is aviation aluminum product 7 series aluminum alloy ex-trusions.

Compared with the prior art, the utility model provides a pair of solid brilliant tool has following advantage:

1. the utility model provides a solid crystal jig for the welding point on supplementary solid crystal equipment fixes a position on the base plate, gu the crystal jig includes the marking plate at least, is equipped with at least a set of identification portion and sets up an opening that matches with the base plate on the marking plate, the marking plate is fixed in the solid crystal region that solid crystal equipment corresponds through the opening with the base plate; the opening and the identification part define at least one identification area, a group of identification parts correspond to welding points in the identification area, the die bonder is used for positioning and corresponding to the welding points in the identification area through identifying a group of identification parts during die bonding, in the existing die bonding process, the color of the substrate and the color of the welding points are usually the same or similar, therefore, the die bonder is difficult to accurately identify the positions of the welding points, thereby causing positioning deviation, the identification parts corresponding to the positions of the welding points are arranged, the positioning of the die bonder on the welding points is more accurate, and the die bonding yield is improved.

2. The utility model provides an among the solid brilliant tool, a set of identification portion further includes first identification piece and second identification piece, and wherein, first identification piece and second identification piece are the diagonal angle setting in corresponding the identification region in every group identification portion, and the mode through diagonal angle location is distinguished to the bonding point region, and this identification mode is simply easily operated and the identification region is clear and definite for solid brilliant equipment can discern the position of welding point fast.

3. In the die bonding jig provided by the utility model, at least two groups of identification parts are arranged on the identification plate, the first identification part and the second identification part are respectively arranged at two opposite sides of the identification plate, in the manufacturing process of parts, a certain error always exists in the actual size after completion due to the influence of factors such as processing or measurement, the size variation in an allowable range is a tolerance, in the die bonding process, a certain tolerance exists in the positioning of each welding point due to the influence of the positioning or moving error of die bonding equipment, the positioning tolerance of a single welding point does not influence a finished product, however, when a large number of welding points are arranged on a substrate, the positioning tolerance of each welding point is accumulated to generate an accumulated tolerance which is usually far larger than the tolerance of the single welding point, the accumulated tolerance is too large to cause product scrapping, the die bonding yield is greatly reduced, the design divides the welding points into a plurality of areas for identification, the identification parts corresponding to the surface identification areas serve as positioning references in each surface identification area, namely, when a new identification area is identified, the die bonder performs positioning correction once by using the identification parts in the area as the references, so that the accumulated tolerance of the whole substrate is reduced to the accumulated tolerance of one identification area, the accumulated tolerance of the positioning welding points of the die bonder can be effectively reduced by arranging a plurality of groups of identification parts, the accuracy of the die bonder in positioning the welding points is further improved, and the die bonder yield is further improved.

4. The utility model provides an among the solid brilliant tool, the distance between two adjacent first identification pieces equals, and the distance between two adjacent second identification pieces equals, is about to all welding points evenly divided into a plurality of sign regions, and accumulated tolerance has further been reduced to this design for solid brilliant equipment is more accurate to the location of welding point.

5. The utility model provides an among the solid brilliant tool, distance between arbitrary two adjacent first identification pieces is 25mm ~ 35mm, the distance between two first identification pieces is too big easily to lead to solid brilliant equipment's accumulative total tolerance too big and reduce the positioning accuracy, distance undersize between two first identification pieces then can make identification portion quantity too much, gu brilliant equipment needs the number of times increase of identification portion, thereby the work efficiency of solid brilliant equipment has been reduced, this interval scope can guarantee that accumulative total tolerance is less, make the identification portion operation number of times of solid brilliant equipment can not be too much simultaneously, the degree of accuracy and the efficiency nature that the welding point was located can be guaranteed simultaneously in this design.

6. The utility model provides an among the solid brilliant tool, the opening defines two at least sign regions with identification portion, and two arbitrary sign regions do not overlap, and this design has avoided the welding point to be caused solid brilliant equipment location chaotic problem by repeated sign, has further guaranteed that this solid brilliant tool can pinpoint the welding point.

7. The utility model provides an among the solid brilliant tool, the colour of identification portion all is different with the colour of base plate and welding point to guaranteed solid brilliant equipment and can discern the identification point more easily, further improved the efficiency and the degree of accuracy of solid brilliant equipment location welding point, thereby further improved the efficiency of solid brilliant process and the yields of solid brilliant work.

8. The utility model provides an among the solid brilliant tool, solid brilliant tool further includes the layer board, the storage tank has been seted up to the layer board, the storage tank is arranged in to the base plate during use, the notch of storage tank is located to the sign board lid, the material of part base plate is flexible or fragile, the layer board can play the effect of support and protection to this type of base plate, avoided the flexible substrate to remove and the positioning deviation problem that leads to, avoided the fragile base plate to receive the problem of pressure damage at solid brilliant in-process simultaneously, thereby further improved solid brilliant yields.

9. The utility model provides an among the solid brilliant tool, the thickness of base plate equals the degree of depth and the thickness sum of sign board of storage tank, even the upper surface of base plate flushes with the upper surface of sign board when using, this design makes solid brilliant equipment more accurate to the location of tin cream to improved the follow-up degree of accuracy of placing electronic components on tin cream, further improved solid brilliant in-process components and parts welded degree of accuracy and fastness, thereby further improved solid brilliant yields.

10. The utility model provides an among the solid brilliant tool, the sign region is the rectangle region, set up the sign region into the rectangle region, make solid brilliant equipment to the regional discernment of sign simple quick more, thereby the efficiency of discernment and location has been improved, the efficiency of solid brilliant has been improved, simultaneously because the welding area on the most base plate is the rectangle, set up the sign region into the simple clear and complete of division that can make whole welding area region of rectangle, thereby the efficiency and the degree of accuracy of solid brilliant equipment discernment and location have further been improved, thereby solid brilliant yields have further been improved.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, and improvements made within the principle of the present invention should be included within the protection scope of the present invention.

Claims (10)

1. A die bonding jig is characterized in that: the die bonding jig is used for assisting die bonding equipment in positioning welding points on a substrate and at least comprises an identification plate, the identification plate is provided with at least one group of identification parts and an opening matched with the substrate, and the identification plate fixes the substrate in a die bonding area corresponding to the die bonding equipment through the opening;

the opening and the identification part define at least one identification area, one group of identification parts correspondingly identify welding points in one identification area, and the die bonding equipment positions the welding points in the corresponding identification area by identifying the identification parts during die bonding.

2. The die bonding jig of claim 1, wherein: the identification part further comprises a first identification piece and a second identification piece, wherein the first identification piece and the second identification piece in each group of identification parts are diagonally arranged corresponding to the identification area.

3. The die bonding jig of claim 2, wherein: the identification plate is provided with at least two groups of identification parts, and the first identification part and the second identification part are respectively arranged on two opposite sides of the identification plate.

4. The die bonding jig of claim 3, wherein: the distance between two adjacent first identification pieces is equal, and the distance between two adjacent second identification pieces is equal.

5. The die bonding jig of claim 4, wherein: the distance between two adjacent first identification parts is 25-35 mm.

6. The die bonding jig of claim 1, wherein: the opening and the identification part define at least two identification areas, and any two identification areas are not overlapped.

7. The die bonding jig of claim 1, wherein: the color of the identification part is different from the color of the substrate and the color of the welding point.

8. The die bonding jig of claim 1, wherein: the die bonding jig further comprises a supporting plate, wherein the supporting plate is provided with a containing groove, the substrate is arranged in the containing groove when the die bonding jig is used, and the mark plate is covered on a notch of the containing groove.

9. The die bonding jig of claim 8, wherein: the thickness of the substrate is equal to the sum of the depth of the accommodating groove and the thickness of the identification plate.

10. The die bonding jig of claim 1, wherein: the identification area is a rectangular area.

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